JP4746437B2 - Core, cylindrical substrate processing method, electrophotographic photosensitive member, and image forming apparatus - Google Patents

Core, cylindrical substrate processing method, electrophotographic photosensitive member, and image forming apparatus Download PDF

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JP4746437B2
JP4746437B2 JP2006034988A JP2006034988A JP4746437B2 JP 4746437 B2 JP4746437 B2 JP 4746437B2 JP 2006034988 A JP2006034988 A JP 2006034988A JP 2006034988 A JP2006034988 A JP 2006034988A JP 4746437 B2 JP4746437 B2 JP 4746437B2
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cylindrical
cylindrical substrate
substrate
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修治 笠井
健一 斉藤
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Ricoh Co Ltd
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Description

本発明は、円筒状基体の加工に際して使用される中子に関し、詳しくは円筒状基体の外周面を切削加工する際にその内部に挿入て切削加工の高精度化を補助すると共に、切削加工時のびびり振動等を低減することができる中子、円筒状基体の加工方法、電子写真感光体び画像形成装置に関する。 The present invention relates to a child in used during processing of the cylindrical substrate, particularly, as well as assist the accuracy of cutting is inserted into its interior when cutting the outer peripheral surface of the cylindrical substrate, core capable of reducing the chatter vibration or the like during cutting, a method of machining a circular cylindrical substrate, an electrophotographic photoreceptorbeauty picture image forming apparatus.

複写機・プリンター・FAX等の電子写真装置に用いられる電子写真感光体は、電子写真感光体用円筒状基体と、該円筒状基体上に形成された感光層とからなり、この電子写真感光体にフランジを装着してから電子写真装置に組み込むのが一般的である。   An electrophotographic photosensitive member used in an electrophotographic apparatus such as a copying machine, a printer, or a fax machine includes a cylindrical substrate for an electrophotographic photosensitive member and a photosensitive layer formed on the cylindrical substrate. In general, a flange is attached to an electrophotographic apparatus.

最近、電子写真装置はフルカラー化しており、印字速度の高速化を図る上でYMCK各色の感光体を縦方向に並べた、いわゆる4連タンデム型といった電子写真装置が増えており、特にフルカラーにおいては多色画像の色ずれ、更には高解像度、高彩度化が大きな問題となっている。この色ずれ、更には高解像度、高彩度化を最小限にするために寸法精度の高い電子写真感光体が要求されてきている。   Recently, the electrophotographic apparatus has become full-color, and in order to increase the printing speed, an electrophotographic apparatus such as a so-called quadruple tandem type in which YMCK photoconductors are arranged in the vertical direction is increasing. Color misregistration of multicolor images, and further, high resolution and high saturation are major problems. In order to minimize the color misregistration, high resolution, and high saturation, an electrophotographic photosensitive member having high dimensional accuracy has been required.

電子写真感光体は前述したように、円筒状基体とフランジを備えており、電子写真感光体の高精度化のために構成部品である円筒状基体の高精度化が必要とされてきている。   As described above, the electrophotographic photoreceptor is provided with the cylindrical base and the flange, and the precision of the cylindrical base, which is a component, has been required to improve the precision of the electrophotographic photoreceptor.

従来技術では、高精度の円筒状基体を製造する方法として、円筒状基体表面を切削加工する前に特殊な装置を使用して真円度等を矯正する方法が提案されている(例えば、特許文献1参照)。しかしこれでは円筒状基体を矯正する工程が増加し、コストアップにつながる。また、切削加工時に発生するびびり振動等の対策にはなっていないため、高精度の円筒状基体が得られないという不具合が生じる。   In the prior art, as a method of manufacturing a highly accurate cylindrical substrate, a method of correcting roundness or the like using a special apparatus before cutting the surface of the cylindrical substrate has been proposed (for example, a patent) Reference 1). However, this increases the process of correcting the cylindrical substrate, leading to an increase in cost. In addition, since it is not a countermeasure against chatter vibration or the like that occurs during cutting, there is a problem that a highly accurate cylindrical substrate cannot be obtained.

切削加工前の円筒状基体に高精度部を作成し、高精度部を保持し切削加工することで高精度な円筒状基体を製造する方法として、切削加工前に円筒状基体端部の内面にインロー加工を施した後に、円筒状基体をあら切削し、インロー部を保持し円筒状基体の表面を仕上げ切削加工する製造方法が提案されている(例えば、特許文献2参照)。   As a method of manufacturing a high-precision cylindrical base by creating a high-precision part on a cylindrical base before cutting, and holding and cutting the high-precision part, the inner surface of the end of the cylindrical base before cutting is used. There has been proposed a manufacturing method in which after the inlay process is performed, the cylindrical base is cut, the inlay portion is held, and the surface of the cylindrical base is finished and cut (see, for example, Patent Document 2).

また、円筒状基体にインロー加工を行う際、円筒状基体内部に保持部材を挿入し、円筒状基体の外径基準でインロー加工を行うことで高精度の電子写真感光体用基体が提供できる製造方法が提案されている(例えば、特許文献3参照)。   In addition, when performing an inlay process on a cylindrical substrate, a holding member is inserted into the cylindrical substrate, and an inlay process is performed on the basis of the outer diameter of the cylindrical substrate so that a high-precision electrophotographic photoreceptor substrate can be provided. A method has been proposed (see, for example, Patent Document 3).

これら従来の製造方法では円筒状基体の表面切削加工前にインロー加工を施すための工程及び特殊な装置が必要となり円筒状基体のコストが高くなるという不具合が生じる。   In these conventional manufacturing methods, a process and a special apparatus for performing inlay processing before the surface cutting of the cylindrical substrate are necessary, and the cost of the cylindrical substrate increases.

また、切削加工前に円筒状基体の前処理をしないで高精度の円筒状基体を製造する方法が提案されている。詳しくは、切削加工時に円筒状基体内部に中空弾性体を挿入し製造する手段をとってびびり振動の防止をする方法であるが、中空弾性体を切削加工前後で装着や分離する特殊な装置・工程が必要となりコスト高につながる不具合が発生する(例えば、特許文献4参照)。   There has also been proposed a method of manufacturing a highly accurate cylindrical substrate without pre-processing the cylindrical substrate before cutting. Specifically, it is a method of preventing chatter vibration by taking a means for inserting and manufacturing a hollow elastic body inside a cylindrical base body during cutting, but a special device for mounting and separating the hollow elastic body before and after cutting. There is a problem that a process is required and leads to high costs (for example, see Patent Document 4).

また、びびり振動を防止する際の中空弾性体の形状を提供しているものも知られている(例えば、特許文献5、6参照)。この場合も上記と同様に、中空弾性体を切削加工前後に装着したり分離する特殊な装置・工程が必要となり、コスト高につながる不具合が発生する。   Moreover, what is providing the shape of the hollow elastic body at the time of preventing chatter vibration is also known (for example, refer patent document 5, 6). In this case as well, as described above, a special device / process for mounting and separating the hollow elastic body before and after the cutting process is required, which causes a problem that leads to high costs.

類似の方法として、円筒状基体の切削加工時に中空弾性体を円筒状基体内部に挿入して製造し、びびり振動を防止する方法も提案されている(例えば、特許文献7参照)が、重量物を円筒状基体に挿入するため、作業性が低下し、かつ重量物の脱着が別途必要になるという問題が発生する。   As a similar method, a method has been proposed in which a hollow elastic body is inserted into a cylindrical base body during cutting of the cylindrical base body to prevent chatter vibration (for example, see Patent Document 7). Is inserted into the cylindrical base body, the workability is lowered, and there is a problem in that it is necessary to separately attach and detach heavy objects.

前述した方法のように前処理や別工程を設けずに高精度の電子写真感光体用円筒状基体を製造する方法として、切削加工時に基体を保持する装置に、基体を安定させるための治具を付加させる製造方法も提案されている(例えば、特許文献8参照)。しかしエアー配管を螺旋状に配置し、エアー圧により基体を安定させる方法を用いるため基体保持装置が非常に複雑となりコスト高になる問題が発生する。   As a method for producing a high-precision cylindrical substrate for an electrophotographic photosensitive member without providing a pretreatment or a separate step as in the above-described method, a jig for stabilizing the substrate in an apparatus for holding the substrate during cutting processing. There has also been proposed a manufacturing method for adding (see, for example, Patent Document 8). However, since the air pipes are arranged in a spiral shape and the method of stabilizing the substrate by air pressure is used, there is a problem that the substrate holding device becomes very complicated and the cost is increased.

円筒状基体切削時に切削加工面に静圧支持体を付設することでびびり振動を防止する方法も提供されている(例えば、特許文献9参照)。   There has also been provided a method for preventing chatter vibration by attaching a static pressure support to the cut surface when a cylindrical substrate is cut (see, for example, Patent Document 9).

また、本明細書中の図5に示されるように、従来の中子は、円筒状の防振材のものを用いていた(例えば、特許文献10参照)。
特開平10−314843号公報 特開平11−160901号公報 特開2003−167361公報 特開平06−198501号公報 特開平06−304803号公報 特開平09−234639号公報 実用新案登録第2604434号 特開平08−52680号公報 特開平09−239604号公報 特開2000−227671号公報
Further, as shown in FIG. 5 in the present specification, a conventional core used is a cylindrical vibration-proof material (see, for example, Patent Document 10).
Japanese Patent Laid-Open No. 10-314843 Japanese Patent Laid-Open No. 11-160901 JP 2003-167361 A Japanese Patent Laid-Open No. 06-198501 Japanese Patent Laid-Open No. 06-304803 Japanese Patent Laid-Open No. 09-234039 Utility model registration No. 2604434 Japanese Patent Application Laid-Open No. 08-52680 JP 09-239604 A JP 2000-227671 A

特許文献10に示す従来の中子は、感度向上のために基体の薄肉化した場合、基体の内面一杯まで保持力が高まると、中子を抜いた際に切削後の基体へひずみが生じるといった問題が生じる。   When the core of the conventional core shown in Patent Document 10 is thinned to improve sensitivity, if the holding power increases to the full inner surface of the base, distortion occurs in the base after cutting when the core is removed. Problems arise.

また、図6に示す中子は、切削の際に抜き差ししているうちに、弾性体の位置がずれるという問題がある。また、基体の径や長さに応じた個別の中子として用意する必要があった。   Further, the core shown in FIG. 6 has a problem that the position of the elastic body is shifted while being inserted and removed during cutting. In addition, it has been necessary to prepare individual cores corresponding to the diameter and length of the substrate.

したがって、本発明は、上述に鑑みてなされたもので、特別な装置・工程を用いることなく、上記問題も解消できる高精度電子写真感光体用の円筒状基体の加工に使用する中子、中子を用い円筒状基体の加工方法並びに該円筒状基体の加工方法を用いて加工されている円筒状基体を備えている電子写真感光体及び画像形成装置を提供することを目的とする。 Therefore, the present invention has been made in view of the above, and a core used for processing a cylindrical substrate for a high-precision electrophotographic photosensitive member that can solve the above-described problems without using a special apparatus / process. and to provide an electrophotographic photosensitive member and an image forming apparatus includes a cylindrical substrate being processed using the processing methods of the working method and the cylindrical body of the cylindrical supports Ru with a core.

求項1に記載の発明は、円筒状基体の表面を切削加工する際に、該円筒状基体の内部に挿入して用いられる中子であって、軸部材と、該軸部材によ中心に挿通支持されており、外径部が該軸部材の軸方向に弾性変形して、該円筒状基体の内面を弾性的に支持する振動吸収部材と、該振動吸収部材の両面側に配置されており、該振動吸収部材を補強する補助部材と、を備えており該補助部材は、弾性体であることを特徴とする。 The inventions described in Motomeko 1, when cutting a surface of the cylindrical substrate, a core used by inserting into the interior of the cylindrical body, and the shaft member, the shaft member Ri being inserted and supported in the center, the outer diameter is elastically deformed in the axial direction of the shaft member, and a vibration absorbing member to the inner surface of the cylindrical base body to elastically support, both surfaces of the vibration absorbing member are arranged in an auxiliary member for reinforcing the vibration absorbing member comprises a, the auxiliary member may be an elastic body.

請求項2の発明に記載の発明は、請求項1に記載の中子において、前記円筒状基体の内径に対する前記補助部材の外径の比が50乃至95%、好ましくは60乃至90、更に好ましくは65乃至85であることを特徴とする。 The invention according to the invention of claim 2 is the core of claim 1, the ratio of the outer diameter of 5 0 to 95% of the auxiliary member to the inner diameter of the cylindrical substrate, preferably 60 to 90, further Preferably, it is 65 to 85.

請求項3に記載の発明は、請求項1又は2に記載の中子において、前記振動吸収部材は、ゴム硬度が50乃至95、好ましくは55乃至90、更に好ましくは60乃至80であることを特徴とする。 The inventions of claim 3, in the core according to claim 1 or 2, wherein the vibration absorbing member, the rubber hardness of 50 to 95, is preferably 55 to 90, more preferably 60 to 80 It is characterized by that.

ゴム硬度の測定法は JIS K6301(スプリングA型)に準拠した。   The measuring method of rubber hardness was based on JIS K6301 (spring A type).

請求項4に記載の発明は、請求項1乃至3のいずれか一項に記載の中子において、前記振動吸収部材は、前記中心部から放射状に外径方向突出し周方向に等間隔に配置されている複数の羽根を備えていることを特徴とする。 The inventions of claim 4, in core according to any one of claims 1乃optimum 3, wherein the vibration absorbing member protrudes radially outwardly radially from the center, in the circumferential direction equal A plurality of blades arranged at intervals are provided.

請求項5に記載の発明は、請求項4に記載の中子において、前記複数の羽根は、円に均等に配置されていることを特徴とする。 The inventions of claim 5, in the core according to claim 4, wherein the plurality of blades is characterized in that it is uniformly arranged in a circular circumferential shape.

請求項6に記載の発明は円筒状基体の加工方法において、請求項1乃至5のいずれか一項に記載の中子を前記円筒状基体の内部に挿した状態で該円筒状基体の表面を切削加工する工程を有することを特徴とする。 The inventions of claim 6, in the processing method of the cylindrical substrate, the cylindrical substrate in a state in which the core according to inserted inside the cylindrical body in any one of claims 1 to 5 It has the process of cutting the surface of this.

請求項7に記載の発明は、電子写真感光体において、請求項に記載の円筒状基体の加工方法を用いて加工されている円筒状基体を備えていることを特徴とする。 The invention according to claim 7, an electrophotographic photosensitive member, characterized in that it comprises a cylindrical body which is processed using a processing method of a cylindrical substrate according to claim 6.

請求項8に記載の発明は、画像形成装置において、請求項7に記載の電子写真感光体を備えていることを特徴とする。 The invention according to claim 8, in the image forming apparatus, characterized by comprising an electrophotographic photosensitive member according to claim 7.

本発明によれば、切加工時の振動吸収部材の接触圧力が向上し、従来技術に記載のように切削加工前に円筒状基体の前処理を施したり、特殊な装置で円筒状基体を把持したりする必要なく、容易に切削加工することが可能となり高精度の電子写真感光体用基体製造することが可能となる。 According to the present invention improves the contact pressure of the vibration absorbing member at the time of switching cutting machining, or subjected to a pretreatment of the cylindrical substrate before cutting, as described in the prior art, the cylindrical substrate in a special device I gripped it is not necessary or, easily can be machined with it it is possible to manufacture an electrophotographic photoreceptor substrate with high accuracy.

また、加工機への投入又は排出時に中子からの円筒状基体の抜け落ちがなく電子写真感光体用基体を製造することが可能となる。   In addition, it is possible to manufacture an electrophotographic photosensitive member substrate without causing the cylindrical substrate to come off from the core when being charged into or discharged from the processing machine.

さらに、切削時の振動吸収部材の接触圧力が向上し、振動を抑制することが可能となるため、高精度の電子写真感光体用基体を製造することが可能となる。   Furthermore, since the contact pressure of the vibration absorbing member during cutting can be improved and vibration can be suppressed, a highly accurate electrophotographic photosensitive member substrate can be manufactured.

また、振れが小さく、真円度精度がよい電子写真感光体を提供でき、この電子写真感光体を使用することで、色ずれのない画像形成システムを提供できる。 Moreover, small vibration les is to provide a roundness accuracy better electrophotographic photosensitive member, the use of this electrophotographic photosensitive member, can be provided without imaging system color shift.

以下、図面を参照して、本発明の実施形態を詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

なお、いわゆる当業者は特許請求の範囲内における本発明を変更・修正して他の実施態様をなすことは容易であり、これらの変更・修正は、この特許請求の範囲に含まれるものであり、以下の説明はこの発明における最良の形態の例であって、本発明の特許請求の範囲を限定するものではない。   Note that it is easy for a person skilled in the art to make other embodiments by changing or correcting the present invention within the scope of the claims, and these changes and modifications are included in the scope of the claims. The following description is an example of the best mode of the present invention, and does not limit the scope of the claims of the present invention.

図1は、中子Aの構成を示している。この中子Aは、感光体ドラム等の円状基体表面を切削加工する時に、加工対象物としての円筒状基体の内部にて切削加工の精度を高く維持すると共に、びびり振動の発生を有効に防止するために使用される。この中子Aは、その一端開口部内周を把持する円筒状基体把持部7と円筒状基体導入部材6とが軸部材5により連結された構成を有すると共に、軸部材5には所定のピッチにて大径の振動吸収部材1、振動吸収部材1の両側に夫々添設されて振動吸収部材が円筒状基体内面に接する力を補強する上補助部材2及び下補助部材3、各部材1、2、3から成る部材群間に配置されて間隔を所定に保持するスペーサー4が挿通して設置されている。 FIG. 1 shows the configuration of the core A. The core A, when cutting a circular cylindrical substrate surface such as a photosensitive drum, with and inserted into the interior of the cylindrical substrate as the object to maintain a high accuracy of cutting, chatter vibration Used to effectively prevent occurrence. The core A has a configuration in which a cylindrical base body gripping portion 7 that grips the inner periphery of one end opening of the core A and the cylindrical base body introduction member 6 are connected by a shaft member 5, and the shaft member 5 has a predetermined pitch. Large-diameter vibration absorbing member 1, upper auxiliary member 2 and lower auxiliary member 3 that are attached to both sides of vibration absorbing member 1 and reinforce the force with which the vibration absorbing member comes into contact with the inner surface of the cylindrical substrate, and each member 1, 2. The spacer 4 which is arranged between the member groups consisting of 3 and maintains a predetermined interval is inserted and installed.

振動吸収部材を補助部材両側で固定することにより図2のように基体へ中子を挿入時に振動吸収部材が変形したとしても、切削が完了後に中子を抜いたときに振動吸収部材が抜け落ちるといった問題が発生しない。   Even if the vibration absorbing member is deformed when the core is inserted into the base as shown in FIG. 2 by fixing the vibration absorbing member on both sides of the auxiliary member, the vibration absorbing member falls off when the core is pulled out after the cutting is completed. There is no problem.

換言すれば、軸部材5の両端部に夫々円筒状基体把持部7と円筒状基体導入部材6とが固定されると共に、その中間に位置する軸部材上には所定の配置にて弾性材料から成る板状の振動吸収部材1がその中心孔を挿通支持され、振動吸収部材1の両側は上補助部材2及び下補助部材3により補強されるとともにこれらの部材群1、2、3の間の距離はスペーサー4によって一定に確保されている。振動吸収部材1の外径は、円筒状基体8の内径よりも大きく設定されていると共に、該外部は軸方向へ弾性変形できるように構成されている。 In other words, the cylindrical base gripping portion 7 and the cylindrical base introduction member 6 are fixed to both ends of the shaft member 5, respectively, and an elastic material is placed on the shaft member located between them in a predetermined arrangement. The plate-like vibration absorbing member 1 is inserted and supported through the center hole, and both sides of the vibration absorbing member 1 are reinforced by the upper auxiliary member 2 and the lower auxiliary member 3 and between these member groups 1, 2, and 3. The distance is kept constant by the spacer 4. The outer diameter of the vibration absorbing member 1 is, with is set larger than the inner diameter of the cylindrical substrate 8, the outer diameter portion is configured to be elastically deformed in the axial direction.

振動吸収部材1、上補助部材2、下補助部材3、スペーサー4には軸部材5が貫通する事が可能な穴加工が施されており、中子Aの状態に組みあがったときに軸方向に動かないように固定されている。   The vibration absorbing member 1, the upper auxiliary member 2, the lower auxiliary member 3, and the spacer 4 are provided with holes that allow the shaft member 5 to pass through, and the axial direction when assembled into the state of the core A It is fixed so that it does not move.

振動吸収部材と補助部材からなる基体内面と接触する部分とスペーサーを適宜組み合わせることで基体の径あるいは長さの変更へと対応できる。   It is possible to cope with a change in the diameter or length of the substrate by appropriately combining a spacer and a portion that contacts the inner surface of the substrate comprising the vibration absorbing member and the auxiliary member.

振動吸収部材1の両面に対して上補助部材2、及び下補助部材3を密着配置してもよいし接着してもよい。上補助部材2、及び下補助部材3は、ゴム材料、その他の所定の弾性を有する材料にて構成してもよいし、振動吸収部材1の弾性変形を妨げない程度の剛性を有した材料にて構成してもよい。   The upper auxiliary member 2 and the lower auxiliary member 3 may be disposed in close contact with both surfaces of the vibration absorbing member 1 or may be bonded. The upper auxiliary member 2 and the lower auxiliary member 3 may be made of a rubber material or other material having a predetermined elasticity, or may be made of a material having a rigidity that does not hinder the elastic deformation of the vibration absorbing member 1. May be configured.

具体的には薄板状弾性体であり、一般に防振効果の高い材質とされている天然ゴム、ブタジエンゴム、アクリルゴム、ウレタンゴム、ネオプレンゴム等で形成され、形態は発泡していてもしていなくてもよい。   Specifically, it is a thin plate-like elastic body, and it is made of natural rubber, butadiene rubber, acrylic rubber, urethane rubber, neoprene rubber, etc., which are generally considered to have a high anti-vibration effect, and the form may or may not be foamed May be.

図2は、円筒状基体8に中子Aを挿入した時の状態を示している。振動吸収部材1の外径が円筒状基体8の内径より大きいため、中子を円筒状基体8に挿入したとき、振動吸収部材1の外周の一部が円筒状基体8の内壁に密着される。振動吸収部材1の外周が円筒状基体8の内壁に密着することにより、切削加工時にびびり振動の発生が抑制され、高精度の電子写真感光体用円筒状基体の加工が可能となる。   FIG. 2 shows a state when the core A is inserted into the cylindrical base body 8. Since the outer diameter of the vibration absorbing member 1 is larger than the inner diameter of the cylindrical substrate 8, a part of the outer periphery of the vibration absorbing member 1 is brought into close contact with the inner wall of the cylindrical substrate 8 when the core is inserted into the cylindrical substrate 8. . When the outer periphery of the vibration absorbing member 1 is in close contact with the inner wall of the cylindrical substrate 8, chatter vibration is suppressed during cutting, and the cylindrical substrate for an electrophotographic photosensitive member can be processed with high accuracy.

図3は、円筒状基体切削加工時の状態を示している。円筒状基体把持部10は円筒状基体8の他端開口内に嵌合されると共に、切削加工機連結部11により切削加工機本体(図示せず)と連結されている。中子Aを内部に挿入した円筒状基体8(図2に示す状態)を手動あるいは自動搬送システム(図示せず)にて切削加工機(図示せず)に装着する。このとき、円筒状基体8の一方の端部は中子Aの円筒状基体把持部7に把持されているが、もう一方の把持されていない端部を切削加工機連結部11により切削加工機本体(図示せず)と連結されている円筒状基体把持部10に把持させるように装着する。   FIG. 3 shows a state when the cylindrical substrate is cut. The cylindrical base gripping part 10 is fitted in the other end opening of the cylindrical base 8 and is connected to a cutting machine main body (not shown) by a cutting machine connecting part 11. A cylindrical base body 8 (in the state shown in FIG. 2) in which the core A is inserted is mounted on a cutting machine (not shown) manually or by an automatic conveyance system (not shown). At this time, one end of the cylindrical base 8 is held by the cylindrical base holding part 7 of the core A, while the other non-held end is cut by the cutting machine connecting part 11. A cylindrical base body gripping part 10 connected to a main body (not shown) is mounted so as to be gripped.

円筒状基体8を切削加工機(図示せず)に装着後、切削加工機に付設されているモーター(図示せず)を駆動させ、ベルト、チェーン等の伝達装置により円筒状基体を回転させる。円筒状基体の回転が安定した後に、バイト12を円筒状基体端部から軸方向に移動させ円筒状基体8の表面の切削加工を行う。   After the cylindrical base 8 is mounted on a cutting machine (not shown), a motor (not shown) attached to the cutting machine is driven, and the cylindrical base is rotated by a transmission device such as a belt or a chain. After the rotation of the cylindrical substrate is stabilized, the cutting tool 12 is moved on the surface of the cylindrical substrate 8 by moving the cutting tool 12 in the axial direction from the end of the cylindrical substrate.

図3では、円筒状基体導入部6と切削加工時円筒状基体把持部10が接触していないが、接触していても問題ない。また、駆動方式として片側駆動と両側駆動が知られているが、本発明はこれら駆動方式に限定されるものではない。   In FIG. 3, the cylindrical substrate introduction portion 6 and the cylindrical substrate gripping portion 10 are not in contact with each other during cutting, but there is no problem even if they are in contact. Further, one-side driving and two-side driving are known as driving methods, but the present invention is not limited to these driving methods.

図4(a)乃至(c)では、振動吸収部材の羽根の形状及び枚数の代表例を示す。(a)の振動吸収部材1は4本の羽根を中心孔から十字型に組み付けた構成を備え、(b)の振動吸収部材1は6本の羽根を周方向に等間隔に配置した構成を備え、(c)の振動吸収部材1は8本の羽根を等間隔に配置した構成を備えている。スペーサー4は、振動吸収部材を円筒状基体の任意の位置に固定するための機能を有していれば材質や形状は規定する必要はない。ただし、円筒状基体8内部に挿入するため硬質の部材を使用する場合は、スペーサーの外径が円筒状基体の内径より小さいことが望ましい。   4A to 4C show typical examples of the shape and the number of blades of the vibration absorbing member. The vibration absorbing member 1 of (a) has a configuration in which four blades are assembled in a cross shape from the center hole, and the vibration absorbing member 1 of (b) has a configuration in which six blades are arranged at equal intervals in the circumferential direction. The vibration absorbing member 1 of (c) has a configuration in which eight blades are arranged at equal intervals. As long as the spacer 4 has a function for fixing the vibration absorbing member to an arbitrary position of the cylindrical base body, it is not necessary to define the material and shape. However, when a hard member is used for insertion into the cylindrical base 8, it is desirable that the outer diameter of the spacer is smaller than the inner diameter of the cylindrical base.

羽根の外部に張り出す数を円周状に均等に配置することで、切削時においても内部にかかる力を均等に分散することができるので抜き差し時に負荷が一方向に偏ることがなくなる。   By arranging the number of blades that protrude outward from the blades evenly around the circumference, the force applied to the inside can be evenly distributed even during cutting, so that the load is not biased in one direction during insertion and removal.

また、羽根の外部に張り出す数が多いほど基体内面を押さえる力が分散する効果が得られる。但し、中子の抜き差しを考慮すると、羽根の外部に張り出す数は4乃至8が好ましい。   In addition, the greater the number of blades projecting to the outside of the blade, the greater the effect of dispersing the force that holds the inner surface of the substrate. However, considering the insertion / removal of the core, the number of protrusions to the outside of the blade is preferably 4 to 8.

ここで使用される円筒状基体8としては、アルミニウム、銅、鉄、亜鉛、などの金属製ドラムであり、公知の材料を用いることができるが、これらの中でも、アルミニウム合金が特に好ましい。該アルミニウム合金としては、例えば、JIS1000番系アルミニウム合金、JIS3000番系アルミニウム合金、JIS6000番系アルミニウム合金などが挙げられる。なお、これらのアルミニウム合金以外にも、マグネシウム合金、ニッケルも適用可能であり、更に、各種高分子材料製の円筒体であっても、適用することができる。   The cylindrical substrate 8 used here is a metal drum such as aluminum, copper, iron, or zinc, and a known material can be used. Among these, an aluminum alloy is particularly preferable. Examples of the aluminum alloy include a JIS 1000 series aluminum alloy, a JIS 3000 series aluminum alloy, and a JIS 6000 series aluminum alloy. In addition to these aluminum alloys, magnesium alloys and nickel can also be applied, and even cylindrical bodies made of various polymer materials can be applied.

(感光体)
本発明の感光体は、本発明の円筒状基体上に、感光層を有してなり、更に必要に応じてその他の層を有してなる。
(Photoconductor)
The photoreceptor of the present invention comprises a photosensitive layer on the cylindrical substrate of the present invention, and further comprises other layers as necessary.

本発明の感光体としては、第一の形態では、円筒状基体と、該基体上に単層型感光層を設けてなり、更に必要に応じて、保護層、中間層、その他の層を有してなる。   In the first embodiment, the photoreceptor of the present invention comprises a cylindrical substrate and a single-layer type photosensitive layer provided on the substrate, and further includes a protective layer, an intermediate layer, and other layers as necessary. Do it.

また、本発明の感光体としては、第二の形態では、円筒状基体と、該基体上に電荷発生層、及び電荷輸送層を少なくともこの順に有する積層型感光層を設けてなり、更に必要に応じて、保護層、中間層、その他の層を有してなる。なお、第二形態では、電荷発生層、及び電荷輸送層は逆に積層しても構わない。   In the second embodiment, the photoreceptor of the present invention comprises a cylindrical substrate, and a laminated photosensitive layer having a charge generation layer and a charge transport layer at least in this order on the substrate. Accordingly, it has a protective layer, an intermediate layer, and other layers. In the second embodiment, the charge generation layer and the charge transport layer may be laminated in reverse.

−複層型感光層−
上述の複層型感光層は、電荷発生層、及び電荷輸送層を少なくともこの順に有し、更に必要に応じて、保護層、中間層、その他の層を有してなる。
-Multilayer type photosensitive layer-
The multilayer photosensitive layer described above has at least a charge generation layer and a charge transport layer in this order, and further includes a protective layer, an intermediate layer, and other layers as necessary.

さらに、この電荷発生層は、少なくとも電荷発生物質を含んでなり、バインダー樹脂、更に必要に応じてその他の成分を含んでなる。   Further, the charge generation layer includes at least a charge generation material, and includes a binder resin and, if necessary, other components.

この電荷発生層に含まれる電荷発生物質としては、特に制限はなく、目的に応じて適宜選択することができるが、無機系材料と有機系材料とのいずれかを用いることができる。   There is no restriction | limiting in particular as a charge generation substance contained in this charge generation layer, Although it can select suitably according to the objective, Either an inorganic material and an organic material can be used.

無機系材料としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、結晶セレン、アモルファス・セレン、セレン−テルル、セレン−テルル−ハロゲン、セレン−ヒ素化合物、などが挙げられる。   The inorganic material is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include crystalline selenium, amorphous selenium, selenium-tellurium, selenium-tellurium-halogen, and selenium-arsenic compounds. .

また、有機系材料としては、特に制限はなく、公知の材料の中から目的に応じて適宜選択することができ、例えば、シーアイピグメントブルー25(カラーインデックスC.I.21180)、シーアイピグメントレッド41(C.I.21200)、シーアイシッドレッド52(C.I.45100)、シーアイベーシックレッド3(C.I.45210)、カルバゾール骨格を有するアゾ顔料、ジスチリルベンゼン骨格を有するアゾ顔料、トリフェニルアミン骨格を有するアゾ顔料、ジベンゾチオフェン骨格を有するアゾ顔料、オキサジアゾール骨格を有するアゾ顔料、フルオレノン骨格を有するアゾ顔料、ビススチルベン骨格を有するアゾ顔料、ジスチリルオキサジアゾール骨格を有するアゾ顔料、ジスチリルカルバゾール骨格を有するアゾ顔料等のアゾ顔料;シーアイピグメントブルー16(C.I.74100)等のフタロシアニン系顔料;シーアイバットブラウン(C.I.73410)、シーアイバットダイ(C.I.730.50)等のインジゴ系顔料;アルゴールスカーレット5(バイエル社製)、インダスレンスカーレットR(バイエル社製)等のペリレン系顔料;スクエリック染料、などが挙げられる。これらは、1種単独で使用してもよいし、2種以上を併用してもよい。   Moreover, there is no restriction | limiting in particular as an organic material, According to the objective, it can select suitably according to the objective, for example, C-I Pigment Blue 25 (Color Index CI21180), C-I Pigment Red 41 (C.I. 21200), C.I.C. Red 52 (C.I. 45100), C.I. Basic Red 3 (C.I. 45210), azo pigments having a carbazole skeleton, azo pigments having a distyrylbenzene skeleton, triphenyl An azo pigment having an amine skeleton, an azo pigment having a dibenzothiophene skeleton, an azo pigment having an oxadiazole skeleton, an azo pigment having a fluorenone skeleton, an azo pigment having a bis-stilbene skeleton, an azo pigment having a distyryl oxadiazole skeleton, Has a distyrylcarbazole skeleton Azo pigments such as azo pigments; phthalocyanine pigments such as C.I. Pigment Blue 16 (C.I. 74100); indigo such as C. I.But Brown (C.I. 73410) and C. I.But Dye (C.I. 730.50) Pigments; perylene pigments such as Argol Scarlet 5 (manufactured by Bayer), Indusence Scarlet R (manufactured by Bayer); and squalic dyes. These may be used individually by 1 type and may use 2 or more types together.

また、上述の電荷発生層に含まれるバインダー樹脂としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、ポリアミド樹脂、ポリウレタン樹脂、エポキシ樹脂、ポリケトン樹脂、ポリカーボネート樹脂、シリコーン樹脂、アクリル樹脂、ポリビニルブチラール樹脂、ポリビニルホルマール樹脂、ポリビニルケトン樹脂、ポリスチレン樹脂、ポリ−N−ビニルカルバゾール樹脂、ポリアクリルアミド樹脂、などが挙げられる。これらは、1種単独で使用してもよいし、2種以上を併用してもよい。   The binder resin contained in the charge generation layer is not particularly limited and may be appropriately selected depending on the purpose. For example, polyamide resin, polyurethane resin, epoxy resin, polyketone resin, polycarbonate resin, silicone resin , Acrylic resin, polyvinyl butyral resin, polyvinyl formal resin, polyvinyl ketone resin, polystyrene resin, poly-N-vinyl carbazole resin, polyacrylamide resin, and the like. These may be used individually by 1 type and may use 2 or more types together.

なお、必要に応じて、電荷輸送物質を添加してもよい。また、電荷発生層のバインダー樹脂として、上述のバインダー樹脂の他に、高分子電荷輸送物質を添加することもできる。   If necessary, a charge transport material may be added. In addition to the binder resin described above, a polymer charge transport material can be added as the binder resin for the charge generation layer.

また、電荷発生層を形成する方法としては、真空薄膜作製法と、溶液分散系からのキャスティング法とが大きく挙げられる。   In addition, as a method for forming the charge generation layer, a vacuum thin film preparation method and a casting method from a solution dispersion system can be largely mentioned.

前者の真空薄膜作製法としては、グロー放電重合法、真空蒸着法、CVD法、スパッタリング法、反応性スパッタリング法、イオンプレーティング法、加速イオンインジェクション法等が挙げられる。この真空薄膜作製法は、上述した無機系材料又は有機系材料を良好に形成することができる。   Examples of the former vacuum thin film production method include a glow discharge polymerization method, a vacuum deposition method, a CVD method, a sputtering method, a reactive sputtering method, an ion plating method, and an accelerated ion injection method. This vacuum thin film manufacturing method can satisfactorily form the inorganic material or organic material described above.

また、後者のキャスティング法によって電荷発生層を設けるには、電荷発生層形成用塗工液を用いて、浸漬塗工法やスプレーコート法、ビードコート法などの慣用されている方法を用いて行うことができる。   In order to provide the charge generation layer by the latter casting method, a charge generation layer forming coating solution is used and a conventional method such as a dip coating method, a spray coating method, or a bead coating method is used. Can do.

上述の電荷発生層形成用塗工液に用いられる有機溶媒としては、特に制限はなく、目的に応じて適宜選択することができ、例えば、アセトン、メチルエチルケトン、メチルイソプロピルケトン、シクロヘキサノン、ベンゼン、トルエン、キシレン、クロロホルム、ジクロロメタン、ジクロロエタン、ジクロロプロパン、トリクロロエタン、トリクロロエチレン、テトラクロロエタン、テトラヒドロフラン、ジオキソラン、ジオキサン、メタノール、エタノール、イソプロピルアルコール、ブタノール、酢酸エチル、酢酸ブチル、ジメチルスルホキシド、メチルセロソルブ、エチルセロソルブ、プロピルセロソルブ、などが挙げられる。これらは、1種単独で使用してもよいし、2種以上を併用してもよい。   The organic solvent used in the above-described coating solution for forming a charge generation layer is not particularly limited and can be appropriately selected depending on the purpose. For example, acetone, methyl ethyl ketone, methyl isopropyl ketone, cyclohexanone, benzene, toluene, Xylene, chloroform, dichloromethane, dichloroethane, dichloropropane, trichloroethane, trichloroethylene, tetrachloroethane, tetrahydrofuran, dioxolane, dioxane, methanol, ethanol, isopropyl alcohol, butanol, ethyl acetate, butyl acetate, dimethyl sulfoxide, methyl cellosolve, ethyl cellosolve, propyl cellosolve , Etc. These may be used individually by 1 type and may use 2 or more types together.

これらの中でも、沸点が40℃乃至80℃のテトラヒドロフラン、メチルエチルケトン、ジクロロメタン、メタノール、エタノールは、塗工後の乾燥が容易であることから特に好適である。   Among these, tetrahydrofuran, methyl ethyl ketone, dichloromethane, methanol, and ethanol having a boiling point of 40 ° C. to 80 ° C. are particularly preferable because they can be easily dried after coating.

この電荷発生層形成用塗工液は、これらの有機溶媒中に上述した電荷発生物質と、バインダー樹脂を分散、溶解して製造する。有機顔料を有機溶媒に分散する方法としては、例えば、ボールミル、ビーズミル、サンドミル、振動ミルなどの分散メディアを用いた分散方法、高速液衝突分散方法などが挙げられる。   This coating solution for forming a charge generation layer is produced by dispersing and dissolving the above-described charge generation material and binder resin in these organic solvents. Examples of the method for dispersing the organic pigment in the organic solvent include a dispersion method using a dispersion medium such as a ball mill, a bead mill, a sand mill, and a vibration mill, and a high-speed liquid collision dispersion method.

また、電荷発生層の厚みは、通常、0.01乃至5μmが好ましく、0.05乃至2μmがより好ましい。   The thickness of the charge generation layer is usually preferably from 0.01 to 5 μm, more preferably from 0.05 to 2 μm.

また、上述の複層型感光層に含まれる電荷輸送層は、帯電電荷を保持させ、かつ、露光により電荷発生層で発生分離した電荷を移動させて保持していた帯電電荷と結合させることを目的とする層である。帯電電荷を保持させる目的を達成するためには、電気抵抗が高いことが要求される。また、保持していた帯電電荷で高い表面電位を得る目的を達成するためには、誘電率が小さく、かつ、電荷移動性がよいことが要求される。   In addition, the charge transport layer included in the multi-layered photosensitive layer described above holds the charged charge and combines the charge generated and separated in the charge generation layer by exposure with the charged charge held. The target layer. In order to achieve the purpose of holding the charged charge, it is required that the electric resistance is high. Further, in order to achieve the purpose of obtaining a high surface potential with the charged charge that has been held, it is required that the dielectric constant is small and the charge mobility is good.

この電荷輸送層は、少なくとも電荷輸送物質を含んでなり、バインダー樹脂、更に必要に応じてその他の成分を含有してなる。   This charge transport layer contains at least a charge transport material, and contains a binder resin and, if necessary, other components.

この電荷輸送物質としては、正孔輸送物質、電子輸送物質、高分子電荷輸送物質、などが挙げられる。   Examples of the charge transport material include a hole transport material, an electron transport material, and a polymer charge transport material.

また、電子輸送物質(電子受容性物質)としては、例えば、クロルアニル、ブロムアニル、テトラシアノエチレン、テトラシアノキノジメタン、2,4,7−トリニトロ−9−フルオレノン、2,4,5,7−テトラニトロ−9−フルオレノン、2,4,5,7−テトラニトロキサントン、2,4,8−トリニトロチオキサントン、2,6,8−トリニトロ−4H−インデノ〔1,2−b〕チオフェン−4オン、1,3,7−トリニトロジベンゾチオフェン−5,5−ジオキサイド、などが挙げられる。これらは、1種単独で使用してもよいし、2種以上を併用してもよい。   Examples of the electron transporting substance (electron accepting substance) include chloroanil, bromanyl, tetracyanoethylene, tetracyanoquinodimethane, 2,4,7-trinitro-9-fluorenone, 2,4,5,7- Tetranitro-9-fluorenone, 2,4,5,7-tetranitroxanthone, 2,4,8-trinitrothioxanthone, 2,6,8-trinitro-4H-indeno [1,2-b] thiophene-4-one 1,3,7-trinitrodibenzothiophene-5,5-dioxide, and the like. These may be used individually by 1 type and may use 2 or more types together.

上述の正孔輸送物質(電子供与性物質)としては、例えば、オキサゾール誘導体、オキサジアゾール誘導体、イミダゾール誘導体、トリフェニルアミン誘導体、9−(p−ジエチルアミノスチリルアントラセン)、1,1−ビス−(4−ジベンジルアミノフェニル)プロパン、スチリルアントラセン、スチリルピラゾリン、フェニルヒドラゾン類、α−フェニルスチルベン誘導体、チアゾール誘導体、トリアゾール誘導体、フェナジン誘導体、アクリジン誘導体、ベンゾフラン誘導体、ベンズイミダゾール誘導体、チオフェン誘導体、などが挙げられる。これらは、1種単独で使用してもよいし、2種以上を併用してもよい。   Examples of the above hole transporting material (electron donating material) include oxazole derivatives, oxadiazole derivatives, imidazole derivatives, triphenylamine derivatives, 9- (p-diethylaminostyrylanthracene), 1,1-bis- ( 4-dibenzylaminophenyl) propane, styrylanthracene, styrylpyrazoline, phenylhydrazones, α-phenylstilbene derivatives, thiazole derivatives, triazole derivatives, phenazine derivatives, acridine derivatives, benzofuran derivatives, benzimidazole derivatives, thiophene derivatives, etc. Can be mentioned. These may be used individually by 1 type and may use 2 or more types together.

また、上述の高分子電荷輸送物質としては、以下のような構造を有するものが挙げられる。
(a)カルバゾール環を有する重合体
例えば、ポリ−N−ビニルカルバゾール、特開昭50−82056号公報、特開昭54−9632号公報、特開昭54−11737号公報、特開平4−175337号公報、特開平4−183719号公報、特開平6−234841号公報に記載の化合物等が例示される。
(b)ヒドラゾン構造を有する重合体
例えば、特開昭57−78402号公報、特開昭61−20953号公報、特開昭61−296358号公報、特開平1−134456号公報、特開平1−179164号公報、特開平3−180851号公報、特開平3−180852号公報、特開平3−50555号公報、特開平5−310904号公報、特開平6−234840号公報に記載の化合物等が例示される。
(c)ポリシリレン重合体
例えば、特開昭63−285552号公報、特開平1−88461号公報、特開平4−264130号公報、特開平4−264131号公報、特開平4−264132号公報、特開平4−264133号公報、特開平4−289867号公報に記載の化合物等が例示される。
(d)トリアリールアミン構造を有する重合体
例えば、N,N−ビス(4−メチルフェニル)−4−アミノポリスチレン、特開平1−134457号公報、特開平2−282264号公報、特開平2−304456号公報、特開平4−133065号公報、特開平4−133066号公報、特開平5−40350号公報、特開平5−202135号公報に記載の化合物等が例示される。
(e)その他の重合体
例えば、ニトロピレンのホルムアルデヒド縮重合体、特開昭51−73888号公報、特開昭56−150749号公報、特開平6−234836号公報、特開平6−234837号公報に記載の化合物等が例示される。
Moreover, what has the following structures is mentioned as said polymeric charge transport material.
(A) Polymer having carbazole ring For example, poly-N-vinylcarbazole, JP-A-50-82056, JP-A-54-9632, JP-A-54-11737, JP-A-4-175337 And the compounds described in JP-A-4-183719 and JP-A-6-234841.
(B) Polymer having a hydrazone structure For example, JP-A-57-78402, JP-A-61-20953, JP-A-61-296358, JP-A-1-134456, JP-A-1-134456 179164, JP-A-3-180851, JP-A-3-180852, JP-A-3-50555, JP-A-5-310904, JP-A-6-234840, and the like. Is done.
(C) Polysilylene polymer For example, JP-A-63-285552, JP-A-1-88461, JP-A-4-264130, JP-A-4-264131, JP-A-4-264132, Examples thereof include compounds described in Kaihei 4-264133 and JP-A-4-289867.
(D) Polymer having a triarylamine structure For example, N, N-bis (4-methylphenyl) -4-aminopolystyrene, JP-A-1-134457, JP-A-2-282264, JP-A-2- Examples include compounds described in JP-A-304456, JP-A-4-133605, JP-A-4-133066, JP-A-5-40350, and JP-A-5-202135.
(E) Other polymers For example, formaldehyde condensation polymer of nitropyrene, JP-A-51-73888, JP-A-56-150749, JP-A-6-234836, JP-A-6-234837 The described compounds and the like are exemplified.

また、上述の高分子電荷輸送物質としては、上記以外にも、例えば、トリアリールアミン構造を有するポリカーボネート樹脂、トリアリールアミン構造を有するポリウレタン樹脂、トリアリールアミン構造を有するポリエステル樹脂、トリアリールアミン構造を有するポリエーテル樹脂、などが挙げられる。この高分子電荷輸送物質としては、例えば、特開昭64−1728号公報、特開昭64−13061号公報、特開昭64−19049号公報、特開平4−11627号公報、特開平4−225014号公報、特開平4−230767号公報、特開平4−320420号公報、特開平5−232727号公報、特開平7−56374号公報、特開平9−127713号公報、特開平9−222740号公報、特開平9−265197号公報、特開平9−211877号公報、特開平9−304956号公報、等に記載の化合物が挙げられる。   In addition to the above, the polymer charge transport material described above includes, for example, a polycarbonate resin having a triarylamine structure, a polyurethane resin having a triarylamine structure, a polyester resin having a triarylamine structure, and a triarylamine structure. And polyether resins having Examples of the polymer charge transporting material include, for example, JP-A 64-1728, JP-A 64-13061, JP-A 64-19049, JP-A-4-11627, JP-A 4-116627. JP 2225014, JP 4-230767, JP 4-320420, JP 5-232727, JP 7-56374, JP 9-127713, JP 9-222740. And compounds described in JP-A-9-265197, JP-A-9-211877, JP-A-9-30495, and the like.

また、電子供与性基を有する重合体としては、上記重合体だけでなく、公知の単量体との共重合体、ブロック重合体、グラフト重合体、スターポリマー、更には、例えば、特開平3−109406号公報に開示されているような電子供与性基を有する架橋重合体などを用いることもできる。   Examples of the polymer having an electron donating group include not only the above-mentioned polymer but also a copolymer with a known monomer, a block polymer, a graft polymer, a star polymer, It is also possible to use a crosslinked polymer having an electron donating group as disclosed in JP-A-109406.

また、上述したバインダー樹脂としては、例えば、ポリカーボネート樹脂、ポリエステル樹脂、メタクリル樹脂、アクリル樹脂、ポリエチレン樹脂、ポリ塩化ビニル樹脂、ポリ酢酸ビニル樹脂、ポリスチレン樹脂、フェノール樹脂、エポキシ樹脂、ポリウレタン樹脂、ポリ塩化ビニリデン樹脂、アルキッド樹脂、シリコーン樹脂、ポリビニルカルバゾール樹脂、ポリビニルブチラール樹脂、ポリビニルホルマール樹脂、ポリアクリレート樹脂、ポリアクリルアミド樹脂、フェノキシ樹脂、などが挙げられる。これらは、1種単独で使用してもよいし、2種以上を併用してもよい。   Examples of the binder resin described above include polycarbonate resin, polyester resin, methacrylic resin, acrylic resin, polyethylene resin, polyvinyl chloride resin, polyvinyl acetate resin, polystyrene resin, phenol resin, epoxy resin, polyurethane resin, and polychlorinated resin. Examples thereof include vinylidene resins, alkyd resins, silicone resins, polyvinyl carbazole resins, polyvinyl butyral resins, polyvinyl formal resins, polyacrylate resins, polyacrylamide resins, and phenoxy resins. These may be used individually by 1 type and may use 2 or more types together.

なお、上述の電荷輸送層は、架橋性のバインダー樹脂と架橋性の電荷輸送物質との共重合体を含むこともできる。   Note that the above-described charge transport layer can also include a copolymer of a crosslinkable binder resin and a crosslinkable charge transport material.

この電荷輸送層は、これらの電荷輸送物質及びバインダー樹脂を適当な溶剤に溶解ないし分散し、これを塗布、乾燥することにより形成できる。この電荷輸送層には、更に必要に応じて、上述した電荷輸送物質及びバインダー樹脂以外に、可塑剤、酸化防止剤、レベリング剤等などの添加剤を適量添加することもできる。   This charge transport layer can be formed by dissolving or dispersing these charge transport materials and a binder resin in a suitable solvent, and applying and drying them. In addition to the above-described charge transport material and binder resin, an appropriate amount of additives such as a plasticizer, an antioxidant, and a leveling agent can be added to the charge transport layer as necessary.

また、上述した電荷輸送層の厚みは、特に制限はなく、目的に応じて適宜選択することができ、5乃至100μmが好ましく、近年の高画質化の要求から、電荷輸送層を薄膜化することが図られており、1200dpi以上の高画質化を達成するためには、5乃至30μmがより好ましい。   The thickness of the above-described charge transport layer is not particularly limited and can be appropriately selected according to the purpose, and is preferably 5 to 100 μm. In view of the recent demand for higher image quality, the charge transport layer is made thinner. In order to achieve high image quality of 1200 dpi or more, 5 to 30 μm is more preferable.

−単層型感光層−
この単層型感光層は、電荷発生物質、電荷輸送物質、バインダー樹脂、更に必要に応じてその他の成分を含んでなる。
-Single layer photosensitive layer-
This single-layer type photosensitive layer comprises a charge generation material, a charge transport material, a binder resin, and other components as required.

また、電荷発生物質、電荷輸送物質、及びバインダー樹脂としては、上述した材料を用いることができる。   The materials described above can be used as the charge generation material, the charge transport material, and the binder resin.

さらに、その他の成分としては、例えば、可塑剤、微粒子、各種添加剤、などが挙げられる。   Furthermore, examples of other components include plasticizers, fine particles, and various additives.

この単層型感光層の厚みは、5乃至100μmが好ましく、5乃至50μmがより好ましい。膜厚が5μm未満であると、帯電性が低下することがあり、100μmを超えると感度の低下をもたらすことがある。   The thickness of this single-layer type photosensitive layer is preferably 5 to 100 μm, more preferably 5 to 50 μm. When the film thickness is less than 5 μm, the chargeability may decrease, and when it exceeds 100 μm, the sensitivity may decrease.

さらに、この感光層上には、必要に応じて保護層を設けてもよい。該保護層は、少なくともバインダー樹脂、電荷輸送物質、更に必要に応じてその他の成分を含有してなる。   Further, a protective layer may be provided on the photosensitive layer as necessary. The protective layer contains at least a binder resin, a charge transport material, and, if necessary, other components.

また、バインダー樹脂、及び電荷輸送物質としては、上述した材料を用いることができる。   In addition, the above-described materials can be used as the binder resin and the charge transport material.

また、上述の保護層には、更に必要に応じて接着性、平滑性、化学的安定性を向上させる目的で、種々の添加剤を加えてもかまわない。   Moreover, you may add various additives to the above-mentioned protective layer for the purpose of improving adhesiveness, smoothness, and chemical stability as needed.

この保護層の厚みは、特に制限はなく、目的に応じて適宜選択することができ、例えば、1乃至15μmが好ましく、1乃至10μmがより好ましい。   The thickness of the protective layer is not particularly limited and may be appropriately selected depending on the purpose. For example, it is preferably 1 to 15 μm, and more preferably 1 to 10 μm.

上述した基体と感光層との間には、必要に応じて、下引き層を設けてもよい。この下引き層は、接着性を向上する、モアレなどを防止する、上層の塗工性を改良する、残留電位を低減するなどの目的で設けられる。   An undercoat layer may be provided between the substrate and the photosensitive layer as necessary. This undercoat layer is provided for the purpose of improving adhesiveness, preventing moire, improving the coatability of the upper layer, and reducing residual potential.

また、この下引き層は、少なくとも樹脂、及び微粉末を含み、更に必要に応じてその他の成分を含有してなる。   The undercoat layer contains at least a resin and fine powder, and further contains other components as necessary.

この樹脂としては、例えば、ポリビニルアルコール樹脂、カゼイン、ポリアクリル酸ナトリウム等の水溶性樹脂;共重合ナイロン、メトキシメチル化ナイロン等のアルコール可溶性樹脂;ポリウレタン樹脂、メラミン樹脂、アルキッド−メラミン樹脂、エポキシ樹脂等の三次元網目構造を形成する硬化型樹脂、などが挙げられる。   Examples of the resin include water-soluble resins such as polyvinyl alcohol resin, casein, and sodium polyacrylate; alcohol-soluble resins such as copolymer nylon and methoxymethylated nylon; polyurethane resins, melamine resins, alkyd-melamine resins, and epoxy resins. And a curable resin that forms a three-dimensional network structure.

また、上述の微粉末としては、例えば、酸化チタン、シリカ、アルミナ、酸化ジルコニウム、酸化スズ、酸化インジウム等の金属酸化物、金属硫化物、又は金属窒化物などが挙げられる。   Examples of the fine powder include metal oxides such as titanium oxide, silica, alumina, zirconium oxide, tin oxide, and indium oxide, metal sulfides, and metal nitrides.

また、上述した下引き層の厚みについては、特に制限はなく、目的に応じて適宜選択することができ、0.1乃至10μmが好ましく、1乃至5μmがより好ましい。   Moreover, there is no restriction | limiting in particular about the thickness of the undercoat layer mentioned above, According to the objective, it can select suitably, 0.1 thru | or 10 micrometers is preferable, and 1 thru | or 5 micrometers is more preferable.

また、上述した感光体においては、必要に応じて基体上に、接着性、電荷ブロッキング性を向上させるために中間層を設けてもよい。この中間層は樹脂を主成分とするが、これらの樹脂はその上に感光層を溶剤で塗布することを考えると、有機溶剤に対して耐溶剤性の高い樹脂であることが望ましい。   In the above-described photoreceptor, an intermediate layer may be provided on the substrate as necessary in order to improve adhesion and charge blocking properties. This intermediate layer has a resin as a main component. However, considering that the photosensitive layer is applied on the resin with a solvent, the intermediate layer is preferably a resin having a high solvent resistance to an organic solvent.

この樹脂としては、上述の下引き層と同様のものを適宜選択して用いることができる。   As this resin, those similar to the above undercoat layer can be appropriately selected and used.

したがって、本発明の感光体は、上述したように、高精度な本発明の感光体用基体を用いているので、極めて高精度な感光体が得られ、この感光体を用いて、画像欠陥がなく、高解像度化、フルカラー出力可能な画像形成が可能である。   Therefore, as described above, since the photoconductor of the present invention uses the high-precision photoconductor substrate of the present invention, an extremely high-precision photoconductor can be obtained, and image defects can be obtained using this photoconductor. In addition, it is possible to form an image with high resolution and full color output.

以下実施例により本発明を更に説明するが、本発明はこれに限定されるものではない。   EXAMPLES The present invention will be further described below with reference to examples, but the present invention is not limited thereto.

(実施例1)
外径60.4mm、全長352mm、肉厚1.0mmのアルミニウム製の円筒状基体を下記条件で切削加工し、外径60.0mm、全長352mm、肉厚0.8mmの円筒状基体を連続して5000本作成した。
Example 1
An aluminum cylindrical substrate having an outer diameter of 60.4 mm, a total length of 352 mm, and a thickness of 1.0 mm is cut under the following conditions, and a cylindrical substrate having an outer diameter of 60.0 mm, a total length of 352 mm, and a thickness of 0.8 mm is continuously formed. 5000 were made.

振動吸収部材1は、羽根の枚数:4枚、羽根の長さ:70mm、肉厚:1.0mm、硬度:60を採用し、上補助部材2は、外径:45mm、肉厚:2.0mm、硬度:80を採用し、下補助部材3は、外径:45mm、肉厚:2.0mm、硬度:80を採用して軸部材5に15枚貫通させ中子とした。   The vibration absorbing member 1 employs the number of blades: 4, blade length: 70 mm, wall thickness: 1.0 mm, hardness: 60, and the upper auxiliary member 2 has an outer diameter: 45 mm, wall thickness: 2. Adopting 0 mm and hardness: 80, the lower auxiliary member 3 adopted outer diameter: 45 mm, wall thickness: 2.0 mm, hardness: 80 and penetrated 15 pieces into the shaft member 5 to form a core.

次に、前記円筒状基体の両端をコレットチャックにて保持した状態で、旋盤(株式会社昌運工作所製、SPA 5 ×600)を用いて、下記旋削条件で旋削加工を行い、外径60.0mm、全長352mm、肉厚0.8mmの円筒状基体を作製した。
<旋削条件>
・回転数 :5000rpm
・送り速度 :0.15mm/rev
・バイト形状:Rバイト
次に、同じ旋削条件で旋削加工を行い、旋削加工後の円筒状基体の振れ及びびびりの有無の評価を実施した。具体的には、振れ測定は、旋削後の円筒状基体の両端を専用の保持治具にて保持し、両端にセットした保持治具の中心を結んだ直線に対し、平行になるようにナイフエッジを配置した。センサ(KEYENC社製、LS7030)を、この保持治具の中心を結んだ直線に対し、垂直になるように配置して測定した。
Next, in a state where both ends of the cylindrical base are held by a collet chuck, turning is performed under the following turning conditions using a lathe (manufactured by Shoun Kogyo Co., Ltd., SPA 5 × 600) to obtain an outer diameter of 60 A cylindrical substrate having a thickness of 0.0 mm, a total length of 352 mm, and a wall thickness of 0.8 mm was produced.
<Turning conditions>
・ Rotation speed: 5000rpm
・ Feeding speed: 0.15mm / rev
-Bite shape: R bite Next, turning was performed under the same turning conditions, and the presence or absence of vibration and chatter of the cylindrical base body after turning was evaluated. Specifically, in the run-out measurement, the both ends of the cylindrical base after turning are held by a dedicated holding jig, and the knife is parallel to the straight line connecting the centers of the holding jigs set at both ends. Arranged the edges. A sensor (manufactured by KEYENC, LS7030) was placed and measured so as to be perpendicular to the straight line connecting the centers of the holding jigs.

旋削後の円筒状基体の表面と、ナイフエッジとの間隔は10mmとし、ナイフエッジと円筒状基体間の距離を測定することで、振れを計測した。   The distance between the surface of the cylindrical substrate after turning and the knife edge was 10 mm, and the run-out was measured by measuring the distance between the knife edge and the cylindrical substrate.

びびりの評価は、旋削後の円筒状基体の表面を、表面粗さ測定装置(東京精密株式会社製、SURFCOM1400)を用いて、Rzの測定を数箇所行った。   For evaluation of chatter, the surface of the cylindrical substrate after turning was measured several times using a surface roughness measuring device (manufactured by Tokyo Seimitsu Co., Ltd., SURFCOM 1400).

(実施例2)
振動吸収部材1を、羽根の枚数:5枚、羽根の長さ:70mm、肉厚:1.0mm、硬度:70を採用し、上補助部材2は、外径:35mm、肉厚:1.0mm、硬度:80を採用し、下補助部材3は、外径:35mm、肉厚:1.0mm、硬度:70を採用して軸部材5に20枚貫通させ中子とし、実施例1同様にサンプルを作成し、測定を実施した。
(Example 2)
The vibration absorbing member 1 employs the number of blades: 5, blade length: 70 mm, wall thickness: 1.0 mm, hardness: 70, and the upper auxiliary member 2 has an outer diameter: 35 mm, wall thickness: 1. Adopting 0 mm and hardness: 80, the lower auxiliary member 3 adopts outer diameter: 35 mm, wall thickness: 1.0 mm, hardness: 70 and penetrates 20 pieces into the shaft member 5 to form a core, similar to Example 1. A sample was prepared and measured.

(実施例3)
振動吸収部材1を、羽根の枚数:6枚、羽根の長さ:65mm、肉厚:1.0mm、硬度:80を採用し、上補助部材2は、外径:55mm、肉厚:1.5mm、硬度:70を採用し、下補助部材3は、外径:40mm、肉厚:1.0mm、硬度:80を採用して軸部材5に20枚貫通させ中子とし、実施例1同様にサンプルを作成し、測定を実施した。
(Example 3)
The vibration absorbing member 1 employs the number of blades: 6, blade length: 65 mm, wall thickness: 1.0 mm, hardness: 80, and the upper auxiliary member 2 has an outer diameter: 55 mm, wall thickness: 1. 5 mm, hardness: 70 is adopted, and the lower auxiliary member 3 adopts an outer diameter: 40 mm, a wall thickness: 1.0 mm, hardness: 80, and 20 shafts 5 are passed through the shaft member 5 as a core. A sample was prepared and measured.

(実施例4)
振動吸収部材1を、羽根の枚数:8枚、羽根の長さ:75mm、肉厚:1.0mm、硬度:60を採用し、上補助部材2は、外径:40mm、肉厚:2.0mm、硬度:70を採用し、下補助部材3は、外径:55mm、肉厚:1.5mm、硬度:70を採用して軸部材5に25枚貫通させ中子とし、実施例1同様にサンプルを作成し、測定を実施した。
Example 4
The vibration absorbing member 1 adopts the number of blades: 8 blade length: 75 mm, wall thickness: 1.0 mm, hardness: 60, and the upper auxiliary member 2 has an outer diameter: 40 mm, wall thickness: 2. Adopting 0 mm and hardness: 70, and the lower auxiliary member 3 adopting outer diameter: 55 mm, wall thickness: 1.5 mm, hardness: 70 and penetrating 25 shaft members 5 as cores, the same as in Example 1. A sample was prepared and measured.

(比較例1)
中子を使用しない状態で実施例1同様にサンプルを作成し、測定を実施した。
(Comparative Example 1)
A sample was prepared and measured in the same manner as in Example 1 without using the core.

(比較例2)
振動吸収部材1を、羽根の枚数:8枚、羽根の長さ:70mm、肉厚:1.0mm、硬度:40を採用し、上補助部材2は、外径:25mm、肉厚:2.0mm、硬度:70を採用して軸部材5に20枚貫通させ中子とし、実施例1同様にサンプルを作成し、測定を実施した。
(Comparative Example 2)
The vibration absorbing member 1 adopts the number of blades: 8, blade length: 70 mm, wall thickness: 1.0 mm, hardness: 40, and the upper auxiliary member 2 has an outer diameter: 25 mm, wall thickness: 2. Samples were prepared and measured in the same manner as in Example 1 by adopting 0 mm and a hardness of 70 to penetrate 20 shaft members 5 into cores.

各中子の条件を表1に示し、測定結果を表2に示す。   Table 1 shows the conditions of each core, and Table 2 shows the measurement results.

切削加工後の円筒状基体8の振れを測定した。   The runout of the cylindrical substrate 8 after cutting was measured.

表1:中子の条件   Table 1: Core conditions

Figure 0004746437
表2:切削結果
Figure 0004746437
Table 2: Cutting results

Figure 0004746437
画像出力結果
<感光体の作製>
次に、実施例1乃至4及び比較例1乃至2の各感光体用基体を洗浄した後、以下のようにして、これら感光体用基体上に、下引き層、電荷発生層、及び電荷輸送層を順次形成した。
Figure 0004746437
Image output results <Production of photoconductor>
Next, after cleaning the photoreceptor substrates of Examples 1 to 4 and Comparative Examples 1 and 2, the undercoat layer, the charge generation layer, and the charge transport were formed on these photoreceptor substrates as follows. Layers were formed sequentially.

まず、各基体上に、下記組成の下引き層用塗工液を浸漬法により塗布した。次に、150℃にて15分間加熱し、熱硬化させて、基体表面に厚み5μmの下引き層を形成した。   First, an undercoat layer coating solution having the following composition was applied on each substrate by a dipping method. Next, the substrate was heated at 150 ° C. for 15 minutes and thermally cured to form an undercoat layer having a thickness of 5 μm on the substrate surface.

−下引き層用塗工液の組成−
・酸化チタン・・・20質量部
・アルキッド樹脂・・・10質量部
・メラミン樹脂・・・10質量部
・メチルエチルケトン・・・60質量部
次に、下記組成の電荷発生層用塗工液を調製した。得られた塗工液を、形成した下引き層上に、同様の浸漬法により塗布し、100℃にて10分間乾燥し、厚み0.02μmの電荷発生層を形成した。
-Composition of coating liquid for undercoat layer-
Titanium oxide: 20 parts by mass Alkyd resin: 10 parts by mass Melamine resin: 10 parts by mass Methyl ethyl ketone: 60 parts by mass Next, a coating liquid for charge generation layer having the following composition is prepared. did. The obtained coating solution was applied onto the formed undercoat layer by the same dipping method and dried at 100 ° C. for 10 minutes to form a charge generation layer having a thickness of 0.02 μm.

−電荷発生層用塗工液の組成−
・ブチラール樹脂(UCC社製、XYHL)・・・1質量部
・チタニルフタロシアニン・・・9質量部
・シクロヘキサノン・・・30質量部
・テトラヒドロフラン(THF)・・・30質量部
次に、下記組成の電荷輸送層用塗工液を調製した。得られた塗工液を形成した電荷発生層上に、同様の浸漬法により塗布し、120℃にて15分間乾燥して、電荷輸送層を形成した。
-Composition of coating solution for charge generation layer-
-Butyral resin (UCC, XYHL)-1 part by mass-Titanyl phthalocyanine-9 parts by mass-Cyclohexanone-30 parts by mass-Tetrahydrofuran (THF)-30 parts by mass Next, the following composition A charge transport layer coating solution was prepared. The charge generation layer on which the obtained coating solution was formed was applied by the same dipping method and dried at 120 ° C. for 15 minutes to form a charge transport layer.

<電荷輸送層用塗工液の組成>
・ポリカーボネート樹脂(帝人株式会社製、パンライトK−1300)・・・10質量

・下記構造式で表される電荷移動剤・・・10質量部
<Composition of coating solution for charge transport layer>
Polycarbonate resin (manufactured by Teijin Limited, Panlite K-1300) 10 parts by mass Charge transfer agent represented by the following structural formula: 10 parts by mass

Figure 0004746437
・ジクロロメタン・・・80質量部
最後に、両端にフランジを取り付けて、実施例1乃至4及び比較例1乃至2の各感光体を作製した。
Figure 0004746437
-Dichloromethane ... 80 parts by mass Finally, flanges were attached to both ends, and the photoreceptors of Examples 1 to 4 and Comparative Examples 1 to 2 were produced.

次に、得られた各感光体を、コピー・プリンター・FAXの複合機(株式会社リコー製、IMAGIO NEO C 600)に搭載して、白ベタ、シアン色ハーフトーン画像、マゼンタ色ハーフトーン画像、イエロー色ハーフトーン画像、及び黒色ハーフトーン画像を各5枚づつ印字し、目視観察により色ずれ、画像異常の有無を評価した。画像評価結果を表3に示す。   Next, each obtained photoconductor is mounted on a multi-function printer (printer / printer / fax) (Ricoh Co., Ltd., IMAGEIO NEO C 600), and a solid white, cyan halftone image, magenta halftone image, Five yellow halftone images and five black halftone images were printed, and the presence or absence of color shift and image abnormality was evaluated by visual observation. Table 3 shows the image evaluation results.

Figure 0004746437
以上のように本発明によれば、切加工時における振動吸収部材と基体内面との接触圧力が向上し、切削加工前に円筒状基体の前処理を施したり、特殊な装置で円筒状基体を把持したりする必要がなくなり、容易に切削加工することが可能となり高精度の電子写真感光体用基体製造することが可能となる。
Figure 0004746437
As described above, according to the present invention improves the contact pressure between the vibration absorbing member and the base inner surface during switching-cutting machining, or subjected to a pretreatment of the cylindrical substrate before cutting, cylindrical with a special device it is not necessary or holding the substrate, easily can be machined with it it is possible to manufacture an electrophotographic photoreceptor substrate with high accuracy.

また、加工機への投入又は排出時に中子Aからの円筒状基体の抜け落ちがなく電子写真感光体用基体を製造することが可能となる。   In addition, it is possible to manufacture an electrophotographic photosensitive member substrate without causing the cylindrical substrate to come off from the core A when being charged into or discharged from the processing machine.

さらに、切削時の振動吸収部材の接触圧力が向上し、振動を抑制することが可能となるため、高精度の電子写真感光体用基体を製造することが可能となる。   Furthermore, since the contact pressure of the vibration absorbing member during cutting can be improved and vibration can be suppressed, a highly accurate electrophotographic photosensitive member substrate can be manufactured.

また、振れが小さく、真円度精度がよい電子写真感光体を提供でき、この電子写真感光体を使用することで、色ずれのない画像形成システムを提供できる。 Moreover, small vibration les is to provide a roundness accuracy better electrophotographic photosensitive member, the use of this electrophotographic photosensitive member, can be provided without imaging system color shift.

なお、本発明の中子を用い円筒状基体の加工法及該円筒状基体の加工方法を用いて加工されている円筒状基体を電子写真感光体基体として備えている画像形成装置(複写機、プリンタ、ファクシミリ等)も本発明の範囲内に含まれるものである。 The image forming apparatus includes a cylindrical substrate being processed using the processing methods of the working side Ho及 beauty the cylindrical body of the cylindrical supports Ru with a core of the present invention as an electrophotographic photosensitive member for a substrate (Copiers, printers, facsimiles, etc.) are also included within the scope of the present invention.

以上、本発明の実施例を具体的に説明してきたが、本発明は、これらの実施例に限定されるものではなく、これら本発明の実施例を、本発明の主旨及び範囲を逸脱することなく、変更又は変形することができる。
Although the embodiments of the present invention have been specifically described above, the present invention is not limited to these embodiments, and these embodiments of the present invention depart from the spirit and scope of the present invention. And can be changed or modified.

本発明の感光体円筒状基体に挿入する中子の構成図である。It is a block diagram of the core inserted in the photoreceptor cylindrical base | substrate of this invention. 本発明の中子を感光体円筒状基体に挿入した断面図である。FIG. 3 is a cross-sectional view of the core of the present invention inserted into a photosensitive cylindrical substrate. 本発明の感光体円筒状基体に挿入後切削加工する断面図である。FIG. 3 is a cross-sectional view of cutting after insertion into the photosensitive cylindrical substrate of the present invention. 本発明の中子に使用の振動吸収部材の羽根形状の説明図である。It is explanatory drawing of the blade | wing shape of the vibrational absorption member used for the core of this invention. 従来の中子の説明図である。It is explanatory drawing of the conventional core. (a)はサンドイッチ形状でない中子の構成例を示し、(b)は中子を中空円筒状被加工物に挿入した状態を示し、(c)は中子を挿入した中空円筒状被加工物の切削加工時の状態を示す中子の説明図である。(A) shows a configuration example of a non-sandwich core, (b) shows a state in which the core is inserted into a hollow cylindrical workpiece, and (c) shows a hollow cylindrical workpiece in which the core is inserted. It is explanatory drawing of the core which shows the state at the time of cutting.

符号の説明Explanation of symbols

1 振動吸収部材
2 上補助部材
3 下補助部材
4 スペーサー
5 軸部材
6 円筒状基体導入部材
7 切削加工時円筒状基体把持部
8 円筒状基体
9 切削加工機連結部
10 切削加工時円筒状基体把持部
11 切削加工機連結部
12 バイト
13 振動吸収部材の補助部材
14 基体
15 Rバイト
16 ノズル
17 切粉排出フード
18 防振部材
19 切粉
A 中子
DESCRIPTION OF SYMBOLS 1 Vibration absorption member 2 Upper auxiliary member 3 Lower auxiliary member 4 Spacer 5 Shaft member 6 Cylindrical base | substrate introduction member 7 Cylindrical base | substrate holding | grip part at the time of cutting 8 Cylindrical base | substrate 9 Cutting machine connection part 10 Cylindrical base | substrate holding | grip at the time of cutting Part 11 Cutting machine connecting part 12 Bit 13 Auxiliary member 14 of vibration absorbing member Base 15 R Bit 16 Nozzle 17 Chip discharge hood 18 Anti-vibration member 19 Chip A Core

Claims (8)

円筒状基体の表面を切削加工する際に、該円筒状基体の内部に挿入して用いられる中子であって、
軸部材と、
該軸部材によ中心に挿通支持されており、外径部が該軸部材の軸方向に弾性変形して、該円筒状基体の内面を弾性的に支持する振動吸収部材と、
該振動吸収部材の両面側に配置されており、該振動吸収部材を補強する補助部材と、を備えており
該補助部材は、弾性体であることを特徴とする中子。
When cutting the surface of the cylindrical substrate, a core used by being inserted into the cylindrical substrate,
A shaft member;
Are inserted and supported in the center Ri by the shaft member, and a vibration absorbing member outer diameter portion is elastically deformed in the axial direction of the shaft member, to support the inner surface of the cylindrical base elastically,
Are arranged on both sides of the vibration absorbing member comprises a an auxiliary member for reinforcing the vibration absorbing member,
The core is characterized in that the auxiliary member is an elastic body .
前記円筒状基体の内径に対する前記補助部材の外径の比が50乃至95%であることを特徴とする請求項1記載の中子。 The core according to claim 1 , wherein a ratio of an outer diameter of the auxiliary member to an inner diameter of the cylindrical base is 50 to 95%. 前記振動吸収部材は、ゴム硬度が50乃至95であることを特徴とする請求項1又は2に記載の中子。 The core according to claim 1 or 2, wherein the vibration absorbing member has a rubber hardness of 50 to 95. 前記振動吸収部材は、前記中心部から放射状に外径方向突出し周方向に等間隔に配置されている複数の羽根を備えていることを特徴とする請求項1乃至3のいずれか一項に記載の中子。 The vibration absorbing member protrudes radially outwards radially from the central portion, any one of claims 1 to 3, characterized in that it comprises a plurality of blades in the circumferential direction are arranged at regular intervals The core described in 前記複数の羽根は、円に均等に配置されていることを特徴とする請求項4に記載の中子。 Wherein the plurality of blades, core according to claim 4, characterized in that they are arranged uniformly in a circular circumferential shape. 請求項1乃至5のいずれか一項に記載の中子を前記円筒状基体の内部に挿した状態で該円筒状基体の表面を切削加工する工程を有することを特徴とする円筒状基体の加工方法。 Of the cylindrical substrate, characterized in that it comprises a step of cutting a surface of the cylindrical substrate in a state in which the core according to inserted inside the cylindrical body in any one of claims 1 to 5 Processing method. 請求項に記載の円筒状基体の加工方法を用いて加工されている円筒状基体を備えていることを特徴とする電子写真感光体。 An electrophotographic photoreceptor comprising a cylindrical substrate processed using the cylindrical substrate processing method according to claim 6 . 請求項7に記載の電子写真感光体を備えていることを特徴とする画像形成装置。 An image forming apparatus characterized by comprising an electrophotographic photosensitive member according to claim 7.
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Publication number Priority date Publication date Assignee Title
JPS5848009Y2 (en) * 1980-06-26 1983-11-01 日平産業株式会社 Mandrel for holding workpieces
JPH0526215U (en) * 1991-09-24 1993-04-06 オークマ株式会社 Anti-sway device for thin pipe-shaped workpieces
JP2002224905A (en) * 2001-01-31 2002-08-13 Ricoh Co Ltd Core for processing thin-walled core and processing machine for thin-walled core

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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5848009Y2 (en) * 1980-06-26 1983-11-01 日平産業株式会社 Mandrel for holding workpieces
JPH0526215U (en) * 1991-09-24 1993-04-06 オークマ株式会社 Anti-sway device for thin pipe-shaped workpieces
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