JP4744093B2 - LIGHTING UNIT AND LIGHTING DEVICE USING THE SAME - Google Patents

Description

The present invention relates to an illumination unit and an illumination device (or a light projection device) using the illumination unit.
In particular, the present invention relates to an LED illumination unit (or LED floodlight unit) using a light emitting diode element (LED element) and an illumination device using the same.

Various illumination devices (or light projecting devices or light emitting devices) are known.
A lighting device (or lighting devices or light emitting device), described light projecting device for projecting light vehicle number of a vehicle speeding to allow image shot with the imaging means.
Such a light projecting device is required to project light necessary for imaging even at night, for example, on a vehicle about 20 meters away. In other words, such a light projecting device is required to project the necessary light far away.
For example, a projector using a combination of a high-illuminance halogen lamp and a condensing lens has been used as a projector that satisfies such conditions.

Such light emitting devices, for example, often used in mounting the like on top of the support mechanism of the road, the light required longer distance to other conditions that can light projection, from the viewpoint of giving up in the support mechanism it is small, it does not require a large driving power, it is low power consumption, it has a long life, reduced maintenance is requested.
As a means for meeting such a demand, a method using a light emitting diode element (LED element) as a light projecting device can be considered. The lifetime of LED elements is semi-permanent, each LED element is small, consumes little power, and recently has been developed that has a considerably high radiation intensity (luminance).
Of course, with only one LED element, it is impossible to provide light that can capture the vehicle number at night, so a large number of LED elements are used and a condensing lens is used.

Japanese Utility Model Laid-Open No. 4-111769 (Patent Document 1) discloses a display device in which a module type LED element and a condensing lens are opposed to each other.
Japanese Patent No. 3319393 (Patent Document 2) discloses a light emitting device in which an LED lamp is mounted on a lead frame and light distribution characteristics are improved.

Japanese Utility Model Publication No. 4-111769 Japanese Patent No. 3319393

The display device disclosed in Japanese Utility Model Laid-Open No. 4-111769 is mainly used for a tail lamp, a direction indicator lamp, or the like of a vehicle.
The display device disclosed in real-Open 4-111769 discloses the above-mentioned night, assuming the application of a lighting device for imaging the number of vehicles (light projecting device), the luminance of the LED elements as the light emitting means Improvements to increase the brightness, a large number of high-brightness LED elements are required, so there is a need for various solutions to solve the problem of integration and the problem of heat dissipation, and to provide light with a predetermined brightness (illuminance) far away Don't be.
Therefore, the display device disclosed in Japanese Utility Model Laid-Open No. 4-111769 cannot be directly applied to the light projecting device.

Japanese Patent No. 3319393 discloses a technique for improving the light distribution characteristics of one LED element, but is applied to the illumination device (light projector) for imaging the vehicle number at night described above. Is unsuitable. The reason is that a large number of LED elements are required for the lighting device (light projecting device) described above. However, when the LED elements packaged one by one described in Japanese Patent No. 3319393 are used, The dimensions become very large. Furthermore, it is necessary to provide a power supply line individually for each LED element described in Japanese Patent No. 3319393 and cannot be wired in practice. Moreover, when many LED elements described in Japanese Patent No. 3319393 are used, it is not possible to take effective heat dissipation measures.

  The idea of using an LED element for an illumination device (or a light projection device) is easy, but in order to ensure luminance as a light projection device and to arrange a large number of high radiation intensity (luminance) and LED elements in a narrow range. In order to develop a floodlighting device capable of providing light of a predetermined radiant intensity stably even at night by optimizing the optical conditions in consideration of an effective power supply method to a large number of LED elements, and heat dissipation measures are inevitable. Various problems have been encountered.

  The above-described example illustrates a projector that is applied to a lighting device that can capture the number of a vehicle whose speed has been violated even at night, but requires a predetermined radiation intensity, and is compact, lightweight, low power consumption, maintainability, etc. However, the same problem as described above has been encountered with respect to lighting devices and projectors used therefor.

The present invention uses LED elements with high radiation intensity, and reduces the size of an illumination unit using such LED elements, and effectively arranges a large number of LED elements in a limited range. In such cases, effective heat dissipation is found, and an effective power supply method to a large number of LED elements is found.As a whole, it is small and lightweight, with low power consumption, long life, and excellent maintainability. An object of the present invention is to provide a light emitting diode illumination unit capable of providing light having a predetermined radiation intensity even at night.

  Another object of the present invention is to provide an illuminating device that can use such a light-emitting diode illumination unit to effectively provide light having a predetermined radiation intensity even at night.

According to the present invention, a first substrate, a first insulating adhesive layer disposed in contact with the first substrate, and a plurality of cylinders formed on the first substrate and the first insulating adhesive layer. A plurality of spherical or quasi-spherical lenses arranged with a portion of the lower part inserted into the heads of the plurality of openings, and the first insulating adhesive layer. A first conductive / heat dissipating layer on the second substrate having a conductive function and a heat conductive function, which are electrically separated and formed on the second substrate and the surface of the second substrate on the first substrate side; A second substrate having a conductive function and a heat conductive function formed on the second substrate on the second conductive / heat dissipating layer and a surface of the second substrate facing the first substrate, which are electrically separated from each other. The lower first conductive / heat dissipating layer and the second substrate lower second conductive / heat dissipating layer, and the opening of the first insulating adhesive layer of the second substrate Conductive function and heat formed on the side wall of the first via hole formed in the portion not formed and connected to the first conductive / heat dissipation layer on the second substrate and the first conductive / heat dissipation layer below the second substrate. A second substrate sidewall having a conductive function, and a first conductive / heat dissipating layer, and a second via hole formed in a portion of the second substrate where the opening of the first insulating adhesive layer is not formed. A second substrate side wall second conductive / heat dissipating layer connected to the second conductive / heat dissipating layer on the second substrate and the second conductive / heat dissipating layer below the second substrate and having a conducting function and a heat conducting function; The top of each opening formed in the first substrate and the first insulating adhesive layer is disposed on the second substrate or on the first conductive / heat dissipating layer on the second substrate. Arranged in line with the optical axis of each lens, the anode is connected to the first conductive and heat dissipation layer on the second substrate. A plurality of light emitting diode elements having cathodes connected to the second conductive / heat dissipating layer on the second substrate via wiring, a second insulating adhesive layer disposed in contact with the second substrate, A conductive function and a heat conductive function formed on the second substrate side surface of the third substrate and the third substrate disposed in contact with the second insulating adhesive layer, and electrically separated. The first conductive / heat dissipation layer on the third substrate and the second conductive / heat dissipation layer on the third substrate are formed on the surface of the third substrate facing the first substrate, and are electrically separated. The first conductive / heat radiation layer under the third substrate and the second conductive / heat radiation layer under the third substrate, the second insulating adhesive layer, and the third substrate having a conductive function and a heat conductive function. A first conductive / heat dissipating layer on the third substrate and a first conductive / radiating layer under the third substrate are formed on a side wall of the third via hole. Side wall of third substrate side wall first conductive / heat dissipating layer connected to the heat layer and having a conductive function and a heat conduction function, the second insulating adhesive layer and the fourth via hole formed in the third substrate. The third substrate side wall second conductive / heat dissipated and connected to the second conductive / heat dissipating layer on the third substrate and the second conductive / heat dissipating layer below the third substrate. And having a layer
The contact portion between the lens and the opening disposed at the head of the opening is sealed with resin, the inside of the opening is sealed, the first conductive / heat radiation layer under the third substrate, and the side wall of the third substrate First conductive / heat dissipating layer, first conductive / heat dissipating layer on the third substrate, first conductive / heat dissipating layer under the second substrate, second substrate side wall first conductive / heat dissipating layer, first on the second substrate A first power supply path is formed to supply power to the cathode or anode of the light emitting diode element, including a conductive / heat dissipation layer,
The second conductive / heat dissipation layer under the third substrate, the second conductive / heat dissipation layer on the third substrate side wall, the second conductive / heat dissipation layer on the third substrate, the second conductive / heat dissipation layer under the second substrate, the second A second power supply path for supplying power to the anode or the cathode of the light emitting diode element, including a second conductive / heat dissipation layer on the second substrate side wall and a second conductive / heat dissipation layer on the second substrate;
The plurality of light emitting diode elements corresponding to the plurality of lenses are disposed on a plurality of concentric rings having different diameters and along the circumference of each ring, and correspond to the plurality of lenses. The plurality of light emitting diode elements are arranged on a central axis of the concentric circle according to the position of each ring so that the light emitted from the plurality of lenses arranged in the concentric circles having different diameters converges to one point in front. by varying the angle of the light for the said lens, the positional relationship between the LED elements corresponding thereto, in accordance with distance from the center of the concentric circles, many away from the center of the optical axis of the corresponding lens The LED element is disposed on
A lighting unit is provided.

Moreover, according to this invention, the illuminating device which has the said illumination unit and the power supply control unit which provides drive electric power to this illumination unit and controls is provided.
The power supply control unit includes a selection circuit that selects a rising edge or a falling edge of an external trigger signal to be applied by a switch, a delay adjustment circuit that delays a signal selected by the selection circuit for a predetermined time, and the delay adjustment circuit. A lighting pulse width adjusting circuit that outputs a signal for lighting the plurality of light emitting diode elements for a predetermined time based on the delayed signal, and the plurality of light emitting diodes based on the signal output from the lighting pulse width adjusting circuit And a drive circuit for outputting a current for driving the element .

  The lighting unit of the present invention is small and lightweight, has low power consumption, has sufficient heat dissipation measures, has a long life, has excellent maintainability, and can provide light with a predetermined radiation intensity far away.

  The illuminating device of the present invention consumes little electric power instantaneously for a long time and can stably provide a necessary amount of light.

1st Embodiment With reference to FIGS. 1-7, 1st Embodiment of the illuminating device of this invention and the illuminating unit used for the illuminating device is described.
FIG. 1 is a diagram showing an application example of the illumination device according to the first embodiment of the present invention.
The illuminating device 1 of 1st Embodiment of this invention has the illumination unit 10 and the power supply control unit 20 which used the light emitting diode (LED) element .
Assuming that the illumination device 1 is used as an illumination means for photographing a vehicle number, the illumination unit 10 can irradiate (project) light having a predetermined radiation intensity from the illumination unit 10 to the area 3 positioned in front of the illumination unit 10. It is. In the area 3, for example, a moving vehicle is located, and the imaging device 2 can capture the number of the vehicle with light from the lighting unit 10 even at night.
The distance D from the LED lighting unit 10 to the region 3 is, for example, about 15 to 25 meters.

The power supply control unit 20 receives a DC voltage and an external trigger signal TS indicating imaging timing from a device (not shown), supplies power to the illumination unit 10 and irradiates (projects) light from the illumination unit 10 to the region 3.
Since the imaging device 2 takes a short time to capture the number of the vehicle moving in the region 3, the power supply control unit 20 drives the illumination unit 10 in a short-time pulse according to the imaging trigger signal TS of the imaging device 2. To do. Also by this, the power consumption of the lighting unit 10 can be significantly reduced.
Imaging apparatus 2 performs imaging from the illumination unit 10 in the region 3 in the period in which light is projected, for example, to image the number of vehicles traveling the area 3.
Details of the driving method of the power supply control unit 20 will be described later.

Details will be described of the illumination unit 10 to provide a light illumination unit described above.
2 is a diagram illustrating the illumination unit 10 of the first embodiment in the illumination device 1 illustrated in FIG. 1, FIG. 2 (A) is a front view, and FIG. 2 (B) is a back view. FIG. 2C is an external cross-sectional view.
The lighting unit 10 illustrated in FIG. 2 is manufactured with the above-described number of a vehicle traveling in front of 15 to 25 m having the ability to provide light that can be imaged by the imaging device 2 even at night, for example, near infrared light. The case is shown as an example.
As illustrated in FIG. 2A, the illumination unit 10 has, for example, a substrate 13 having a size of 10 cm wide × 10 cm long, 15 LED × 15 LED in total, and a total of 225 LED elements and lenses LS. The distance between adjacent LED elements and the lens LS is, for example, about 6 mm.
For example, the LED element disclosed in Japanese Patent No. 3319393 or a packaged LED element for normal use alone cannot be integrated at such a short interval.
In other words, the LED elements of the present embodiment are mounted densely on the substrate 13 with a high degree of integration.
Further, when the height (thickness) t of the illumination unit 10 illustrated in FIG. 2C is exemplified, the thickness of the substrate 13 is about 3.6 mm, and the protruding height of the lens LS is about 4.3 mm. In total, it is about 8 mm, and the thickness of the lighting unit 10 is also thin.

As illustrated in FIG. 2B, power is supplied to the 225 LED elements from the outside by 4 × 5 electrodes J1 to J20 provided on the back surface.
Although details of whether the power supplied from the electrodes J1 to J20 is supplied to the 225 LED elements will be described later, it should be noted that in the lighting unit 10, a power supply wiring to each LED element is provided. That is not.

A method for supplying power to 225 LED elements will be described.
FIGS. 3A and 3B are diagrams illustrating an outline of an equivalent circuit illustrating a method of supplying power to each LED element.
3A shows a circuit in which the first column LED1 to LED15 in FIG. 2A are connected in series between the two electrodes J1 and J2 and the two electrodes J3 and J4. It is the figure which illustrated the circuit which connected LED16-LED30 of this, the circuit which connects LED31-LED45 of the 3rd row in series, and connects the circuit of the 1st row-the 3rd row in parallel.
FIG. 3B illustrates a circuit in which all of the first to third rows of LEDs 1 to 45 are connected in parallel between the two electrodes J1 and J2 and the two electrodes J3 and J4. It is.
In the case of the circuit configuration illustrated in FIG. 3A, the current capacity flowing between the electrodes J1 and J2 and the electrodes J3 and J4 can be small, but even one LED element in one row can be disconnected. When a failure occurs, there is a possibility that the entire LED elements in the row cannot emit light.
On the other hand, in the case of the circuit configuration illustrated in FIG. 3B, the light emission of other LED elements in one column is not affected by a failure such as disconnection of one LED element in one column, but the electrodes J1, J2 and The capacity of current flowing between the electrodes J3 and J4 increases.
In this embodiment, any of the circuit configuration in FIG. 3A, the circuit configuration in FIG. 3B, or another circuit configuration may be used.
In this embodiment, an example in which power is supplied to three rows and 45 LED elements by using two electrodes J1 and J2 and two electrodes J3 and J4 is described.
The reason why the two electrodes J1 and J2 and the two electrodes J3 and J4 are used is to secure a sufficient current capacity because a large amount of current flows through many LED elements.

  The same applies to the other electrode sets, electrodes J5 and J6 and electrodes J7 and J8, electrodes J9 and J10 and electrodes J11 and 12, electrodes J13 and J14 and electrodes J15 and J16, and electrodes J17 and J18 and electrodes J19 and 20. .

The details of the illumination unit 10 that enables the circuit configuration described above, takes heat dissipation measures for a large number of LED elements, and effectively mounts the lens LS and the LED elements will be described with reference to FIG.
4A to 4C are cross-sectional views of a part of the lighting unit 10, for example, a part of the first row in FIG.
As illustrated in FIG. 4A, a plurality of LED elements and a plurality of lenses LS are mounted on the substrate 13 illustrated in FIGS.
As the LED element, for example, an LED element that emits near-infrared light is used.
For example, a glass lens is used as the lens LS.
The substrate 13 includes a first substrate 131, a second substrate 132, and a third substrate 133. These substrates 131 to 133 are formed of a material having insulating properties, heat resistance, and excellent strength, for example, glass epoxy resin.
The first substrate 131 and the second substrate 132 are bonded by the first insulating adhesive layer 151, and the second substrate 132 and the third substrate 133 are bonded by the second insulating adhesive layer 152.

The first substrate 131 has openings for accommodating the lenses LS and the LED elements in the respective rows illustrated in FIG. 2A , the number of the lenses LS and the LED elements, for example, 15 in each row, and Each row illustrated in FIG. 2A , for example, 15 rows are provided.
Except for the opening of the first substrate 131, the first substrate 131 heat dissipation layer 141U is formed on the upper surface of the first substrate 131, the first substrate lower heat dissipation layer 141L is formed on the lower surface of the first substrate 131, and the first wall 131 is formed on the inner wall of the opening. A substrate wall heat dissipation layer 141W is formed.
These radiating layer 141U, 141L, 141W is high thermal conductivity material, for example, a copper foil with copper is formed at a thickness of 70 [mu] m.
These radiating layer 141U, 141L, 141W is not essential in the embodiment of the present invention, the LED lighting unit 10 of the present invention that implements in a sealed state a large number of LED elements in the cavity CV in the opening It is provided to promote the heat dissipation effect.

The lens LS is fitted into the head of the opening of the first substrate 131, and the surface of the first substrate 131 is sealed with the sealing resin layer 19, whereby the lens LS is fixed to the head of the opening, and the cavity in the opening CV is sealed from the outside.
An LED element is disposed on the second substrate 132 below the lens LS in the opening of the first substrate 131.
By the arc cavity CV in the opening is sealed by a sealing resin layer 19 and the lens LS, and has a structure in which LED elements without the package is sealed from the outside. In other words, the LED element disposed on the second substrate 132 and mounted in the cavity CV in the opening is defined by the inner wall of the opening, the second substrate 132, the lens LS, and the sealing resin layer 19. Since it is sealed in a sealed space, it is not necessary to perform package processing with a countermeasure for sealing, unlike an LED element used alone, and the LED element alone can be downsized. As a result, an area of the substrate 13 be mounted a number of LED elements to the substrate 13 may be small.

A second substrate 132 is disposed below the first substrate 131 with a first insulating adhesive layer 151 interposed therebetween.
The upper surface of the second substrate 132, or on the second first-conductivity-radiating layer on the substrate 142U1 formed on the upper surface of the second substrate 132, LED elements are mounted.
As illustrated, the lens LS may be a spherical lens or a quasi-spherical lens having a flat bottom surface as illustrated by a broken line. The reason why the spherical or quasi-spherical lens is used as the lens LS is that the distance between the lens LS and the LED element is small. Therefore, a lens other than a spherical lens or a quasi-spherical lens can be used according to the distance between the lens LS and the LED element.
LED elements are disposed in the vicinity of the focal position or the focal position of the lens LS located thereon. The positions of the lens LS and the LED element are the thickness of the first substrate 131 and the first substrate conductive / heat dissipation layer 141U, the first substrate lower conductive / heat dissipation layer 141L, or the opening formed in the first substrate 131. by adjusting the size of the diameter can be adjusted. For example, when the diameter of the opening formed in the first substrate 131 is increased, the lens LS sinks in the opening and the distance from the LED element approaches. The same applies even if the thickness of the first substrate 131 is reduced.
The optical axis of the LED element and the optical axis of the lens LS match or substantially match. Thereby, the light emitted from the LED element becomes narrow-directional condensed light after passing through the lens LS.

In the second substrate 132, a second substrate first via hole VH21 and a second substrate second via hole VH22 are formed in a direction perpendicular to the horizontal plane .
Upper surface of the second substrate 132 (the first surface of the substrate 131 side) is formed with a second substrate over the conductive-radiating layer 142U (which is deposited). A second substrate lower conductive / heat dissipation layer 142L is formed on the lower surface of the second substrate 132 (the surface on the third substrate 133 side) . A second substrate first wall conductive / heat radiation layer 142W1 is formed from the inner wall of the second substrate first via hole VH21 to the second insulating adhesive layer 152 . A second substrate second wall conductive / heat dissipation layer 142W2 is formed from the inner wall of the second substrate second via hole VH22 to the second substrate lower conductive / heat dissipation layer 142L.

As illustrated in FIG. 4B, the second conductive / heat radiation layer 142U on the second substrate and the first conductive / heat radiation layer 142U1 on the second substrate separated by the gap G and the second conductive on the second substrate. -It is separated into a heat dissipation layer 141U2.
As illustrated in FIG. 4C, the LED element is mounted on the first conductive / heat dissipation layer 142U1 on the second substrate , and the anode A of the LED element is mounted on the first conductive / heat dissipation layer 142U1 on the second substrate. Are connected, and the cathode K of the LED element is connected to the second conductive / heat radiation layer 141U2 on the second substrate via the wiring WR.
The LED element does not need to be mounted on the first conductive / heat dissipation layer 142U1 on the second substrate, and may be mounted on the upper surface of the second substrate 132. However, the anode A of the LED element is connected to the first conductive / heat radiation layer 142U1 on the second substrate.
In addition, the objects to which the anode A and the cathode K of the LED element are connected (the first conductive / heat dissipation layer 142U1 on the second substrate and the second conductive / heat dissipation layer 141U2 on the second substrate via the wiring WR) are described above. The first conductive / heat radiation layer 142U1 on the second substrate and the second conductive / heat radiation layer 141U2 on the second substrate may be reversed. However, in that case, the directions of power feeding from electrodes J1 and 2 and electrodes J3 and 4 described later are reversed.

In order to form a power feeding circuit to the LED element from the electrodes J1 to J20 provided on the back surface of the substrate 13 illustrated in FIG. 2C (the lower surface of the third substrate 133 illustrated in FIG. 4A), Through the second substrate first wall conductive / heat dissipation layer 142W1 on the inner wall of the substrate first via hole VH21, the first conductive / heat dissipation layer 142U1 on the second substrate and the third substrate 133 on the upper surface of the third substrate 133 (to be described later) It is connected to the heat dissipation layer 143U. Similarly, the second substrate on the second substrate and the second substrate 132 on the lower surface of the second substrate 132 through the second substrate second wall conductive / heat radiating layer 142W2 on the inner wall of the second substrate second via hole VH22. It is connected to the lower conductive / heat dissipation layer 142L.

The second conductive / heat dissipation layer 142U on the second substrate, which is composed of the first conductive / heat dissipation layer 142U1 on the second substrate and the second conductive / heat dissipation layer 141U2 on the second substrate, the second conductive / heat dissipation layer 142L below the second substrate, Since the two-substrate first wall conductive / heat dissipation layer 142W1 and the second substrate second wall conductive / heat dissipation layer 142W2 are conductors for feeding the LED element, they are basically formed of a conductive material.
Preferably, these layers are preferably formed of a material having high conductivity and heat conductivity in consideration of heat dissipation measures for the LED element.
As an example of such a material, it is formed of, for example, a copper foil having a thickness of 70 μm, similarly to the first substrate conductive / heat dissipation layer 141U, the first substrate lower conductive / heat dissipation layer 141L, and the like.

The third substrate 133 is disposed below the second substrate 132 with the second insulating adhesive layer 152 interposed therebetween. The third substrate 133 is arranged in the vertical direction in the third substrate first via hole VH31 and the second substrate 133. A three-substrate second via hole VH32 is formed.
Upper surface of the third substrate 133 (the second surface of the substrate 132 side) is formed with a third substrate on the conductive-radiating layer 143U (which is deposited). A third substrate lower conductive / heat dissipation layer 143 </ b> L is formed on the lower surface of the third substrate 133 . A third substrate first wall conductive / heat dissipation layer 143W1 is formed on the inner wall of the third substrate first via hole VH31 . A third substrate second wall conductive / heat dissipation layer 143W2 is formed on the inner wall of the third substrate second via hole VH32.
The third substrate lower conductive / heat dissipation layer 143L is, for example, in the circuit example of FIGS. 3A and 3B, the third substrate lower conductive / heat dissipation layer 143L1 connected to the first electrode J1, for example, The second conductive / heat radiation layer 143L2 is separated from the third substrate connected to the third electrode J3.

In order to form a power supply circuit to the LED element, the third substrate first conductive / heat radiation on the upper surface of the third substrate 133 through the third substrate first wall conductive / heat radiating layer 143W1 on the inner wall of the third substrate first via hole VH31. The layer 143U and the third substrate lower first conductive / heat dissipation layer 143L1 on the lower surface of the third substrate 133 are connected.
Similarly, the second substrate second wall conductive / heat dissipating layer 142W2 on the singing surface of the second substrate 132 via the third substrate second wall conductive / heat dissipating layer 143W2 on the inner wall of the third substrate second via hole VH32; The second conductive / heat radiation layer 143L2 under the third substrate on the lower surface of the third substrate 133 is connected.

Third and the substrate over the conductive-radiating layer 143U, and the third third substrate under the conductive-radiating layer made of a first conductive lower substrate, the heat dissipation layer 143L1 and the third substrate under the second conductive-radiating layer 143L2 Prefecture 143L, third a substrate first Kabeshirubeden-radiating layer 143W1, respectively third substrate second Kabeshirubeden-radiating layer 143W2, since a conductor for power supply of the LED element, essentially formed of a conductive material.
Preferably, these layers are preferably formed of a material having high conductivity and heat conductivity in consideration of heat dissipation measures for the LED element.
As an example of such a material, it is formed of, for example, a copper foil having a thickness of 70 μm, similar to the second substrate conductive / heat dissipation layer 142U, the second substrate conductive / heat dissipation layer 142L, and the like.

A circuit configuration in the configuration illustrated in FIG.
The electrode J1 that feeds power to the anode A of the LED element includes a third substrate lower first conductive / heat dissipating layer 143L1, a third substrate first wall conductive / heat dissipating layer 143W1, and an upper surface of the third substrate 133 on the lower surface of the third substrate 133. The third substrate conductive / heat-dissipating layer 143U, the second substrate first wall conductive / heat-dissipating layer 142W1, and the second substrate 132 on the second substrate on the second substrate first conductive / heat-dissipating layer 142U1 are connected to the anode A of the LED element. A current can be supplied. In addition, these conductive layers also constitute a heat dissipation layer, and the heat of the LED element can be released to the outside of the lighting unit 10 through these layers.
Similarly, the electrode J3 that supplies power to the cathode K of the LED element includes a second conductive / heat radiation layer 143L2 below the third substrate on the lower surface of the third substrate 133, a second wall conductive / heat radiation layer 143W2, and a second substrate. The cathode of the LED element is passed through the second substrate lower conductive / heat radiation layer 142L on the lower surface of 132, the second substrate second wall conductive / heat radiation layer 142W2, and the second substrate upper conductive / heat radiation layer 141U2 on the upper surface of the second substrate 132. A current can be supplied to K. In addition, these conductive layers also constitute a heat dissipation layer, and the heat of the LED element can be released to the outside of the lighting unit 10 through these layers.
With the circuit configuration described above, it will be understood that basically when a voltage is applied to the electrodes J1 and J3, a current flows through the LED element and the LED element emits light.
Further, via a feed path and a first substrate conductor, the heat dissipation layer 141U~ first substrate under the conductive-radiating layer around the first substrate 131 141L having these conductive-radiating properties, are mounted in the cavity CV The heat of the LED element can be released to the outside of the lighting unit 10.

In order to achieve the circuit configuration illustrated in FIG. 3A or 3B, the second substrate lower conductive / heat dissipation layer 142L on the lower surface of the second substrate 132 and / or the upper surface of the third substrate 133 is changed. The conductive / heat radiation layer 143U on the three substrates is processed into a predetermined circuit pattern corresponding to the circuit illustrated in FIG. 3A or FIG .
As described above, power can be effectively supplied to a number of LED elements corresponding to the circuit illustrated in FIG. 3A or FIG. 3B without connecting each LED element using a wiring.

4 as illustrated (A), the LED element by matching the optical axis of the LED element to match the optical axis of the lens LS of openings disposed a spherical or quasi spherical first substrate 131 second The first conductive / heat radiation layer 142U1 is disposed on the second substrate formed on the second substrate 132.
FIG. 5 is a diagram showing a partial ray trajectory of the LED illumination unit 10.
As illustrated in FIG. 5, the light emitted from the LED element is converted into condensed light with a narrow directivity through the lens LS, and is emitted toward the region 3, for example.
FIG. 5 shows the light rays of some LED elements and the lens LS. In this embodiment, light from 225 LED elements is condensed into narrow-directional light with 225 lenses LS. A bundle of 225 light beams is emitted toward the region 3.

FIG. 6 is a diagram illustrating an example of the power supply control unit 20.
The power supply control unit 20 includes a delay circuit 21, a lighting pulse width adjustment circuit 22, and a current drive circuit 23.
As illustrated in FIG. 7, the delay circuit 21 selects either the rising edge or the falling edge of the external trigger signal TS with a switch, and then lights up after a predetermined time d , for example, 7 μs to 0.6 ms. In this circuit, a pulse is generated and applied to the lighting pulse width adjustment circuit 22.
The lighting pulse width adjustment circuit 22 is a circuit that adjusts the lighting pulse width so that the LED element is lit for a predetermined time p , for example, 0.1 ms to 6 ms, and adjusts the pulse width in accordance with the imaging timing. .
The current drive circuit 23 is a circuit that applies a constant current to the LED elements and suppresses fluctuations in the amount of light. In addition, in order to control lighting on / off at high speed, switching is performed by a transistor, so that power consumption in the LED element can be reduced.

  The example of the lighting unit 10 and the power supply control unit 20 according to the first embodiment of the present invention has been described above with reference to specific examples. The lighting device and the lighting unit of the present invention are described with reference to FIG. It is not limited to the above-described examples.

According to the lighting unit of the first embodiment of the present invention, an LED element that emits near-infrared rays having radiant intensity is used, and the LED element is reduced in size without being housed in a chip or a package. A large number of LED elements are effectively densely arranged in a given range, and heat radiation that is a problem in such a case is effectively performed, and by an effective power supply method to a large number of LED elements as a whole, A compact, lightweight, low-power consumption, long-life, excellent maintainability, and capable of providing light with a predetermined radiation intensity even at night and far away.
Moreover, according to the illuminating device of 1st Embodiment of this invention, the said illuminating unit was driven effectively with the power supply control unit, and the power saving could be aimed at further.

Second Embodiment A lighting unit according to a second embodiment of the present invention will be described with reference to FIGS.
8A and 8B are a front view and a back view of the illumination unit 10A of the second embodiment corresponding to FIGS. 2A and 2B.
FIG. 8A shows a state in which a plurality of LED elements are concentrically arranged on the front side of the substrate 13A. FIG. 8B shows the arrangement of the electrodes J1 to J20 on the back side of the substrate 13A.
The illumination unit 10A according to the second embodiment is an illumination unit that outputs a convergent light beam with a focal length F as shown in a cross-sectional view in FIG.

8A, the illumination unit 10A is replaced with a substrate 13A having the same configuration as the substrate 13 of the first embodiment described with reference to FIG. 4, and FIGS. 10B and 11B. As illustrated, the lens LS is disposed on the head of the opening of the first substrate 131, and the LED element is disposed on the second substrate 132 below the lens LS.
In FIGS. 10B and 11B, in order to simplify the illustration, the first insulating property disposed between the first substrate 131 and the second substrate 132 illustrated in FIG. The adhesive layer 151, the first substrate conductive / heat dissipation layer 141U, the first substrate lower conductive / heat dissipation layer 141L, and the first substrate wall conductive / heat dissipation layer 141W formed around the first substrate 131 are not illustrated. 10B and 11B, for the sake of simplicity, the first conductive / heat radiation layer 142U1 on the second substrate on the upper surface of the second substrate 132 illustrated in FIG. Although the second conductive / heat radiation layer 141U2 on the second substrate is not illustrated, the first conductive / heat radiation layer 142U1 on the second substrate is shown in FIGS. 10A and 11A, as in FIG. 4B. And the second conductive / heat dissipation layer 141U2 on the second substrate.

10B and 11B , the illustration of the configuration below the second substrate 132 illustrated in FIG. 4A is omitted.
A method for integrating a plurality of LED elements and lenses LS, a power feeding method, a heat dissipation measure, and the like are the same as those in the first embodiment.

In order to output the luminous flux illustrated in FIG. 9, in the illumination unit 10A, the relationship between the LED element and the lens LS is varied according to the position of the ring.
Light is emitted along the center of the optical axis in FIG. 9 from the LED element and the lens LS located in the first ring R1 in FIG. Therefore, as illustrated in FIGS. 10A and 10B, the LED element and the lens LS positioned in the first ring R1 have the optical axes O of the lens LS and the LED element coincide with each other.
The LED element and the lens LS located in the second ring R2 to the fifth ring R5 are, for example, as illustrated in FIGS. 11A to 11C, between the lens LS and the LED element according to the ring position. Shift the position.
As a method of shifting the position of the lens LS and the LED element, the lens LS mounted on the head of the opening of the first substrate 131 is fixed, and the position of the LED element is the amount corresponding to the angle α from the center of the optical axis O. The first substrate 132 is mounted on the second substrate 132 with a shift. For example, as illustrated in FIGS. 12A to 12D, the position of the LED element corresponding to the ring position is provided with four triangular marks on the first conductive / heat radiation layer 142U1 on the second substrate, What is necessary is just to match | combine an LED element with the mark part according to a ring position.

  The power feeding method and the driving method of the plurality of LED elements of the lighting unit 10A can be performed in the same manner as in the first embodiment.

  According to the second embodiment, a convergent light beam having a circular cross section can be provided instead of a parallel light beam as in the first embodiment.

As is obvious from the first embodiment and the second embodiment, according to the present invention, an arbitrary light beam can be provided.
Moreover, arbitrary LED elements can be used for the lighting unit.
Similarly lenses, can be used any with reference to the optical properties.

FIG. 1 is a schematic configuration diagram of a lighting device according to a first embodiment of the present invention. 2 is a diagram illustrating the illumination unit of the first embodiment in the illumination device illustrated in FIG. 1, FIG. 2 (A) is a front view, FIG. 2 (B) is a rear view, and FIG. (C) is an outline sectional view. FIGS. 3A and 3B are diagrams illustrating an outline of an equivalent circuit illustrating a method of supplying power to each LED element in the illumination unit illustrated in FIG. 4A to 4C are partial cross-sectional views of the LED lighting unit. FIG. 5 is a diagram showing a ray trajectory of a part of the LED lighting unit according to the first embodiment. FIG. 6 is a schematic configuration diagram of the power supply control unit illustrated in FIG. FIG. 7 is a diagram illustrating the operation of the power supply control unit illustrated in FIG. 8A and 8B are a front view and a rear view of the illumination unit according to the second embodiment corresponding to FIGS. 2A and 2B. FIG. 9 is a diagram showing a ray trajectory of the illumination unit illustrated in FIG. FIGS. 10A and 10B are diagrams illustrating the first positional relationship between the LED elements and the lenses in the illumination unit illustrated in FIG. 8. 11A, 11B, and 11C are diagrams illustrating a second positional relationship between the LED element and the lens in the illumination unit illustrated in FIG. 12A to 12D are plan views of a conductive / heat dissipating layer that facilitates positioning of the LED elements in the second embodiment.

1. ・ Lighting device 10, 10A ・ ・ Lighting unit 13, 13A ・ ・ Board
131-133 .. 1st-3rd board
VH21 ・ ・ Second substrate 1st via hole
VH22 ... Second board second via hole
VH31 ・ ・ 3rd substrate 1st via hole
VH32 ・ ・ 3rd substrate 2nd via hole
141U ・ ・ Conductive and heat dissipation layer on the first substrate
141L ・ ・ Conductive and heat dissipation layer under the first substrate
141W ・ ・ First board wall conductive ・ Heat dissipation layer
142U ・ ・ Conductive and heat dissipation layer on second substrate
142U1..First conductive / heat dissipation layer on second substrate
142U2 ... Second conductive / heat dissipation layer on second substrate
142L ... Conductivity / heat dissipation layer under the second substrate
142W1..Second substrate first wall conductive / heat radiation layer
142 W 2 .. Second substrate second wall conductive and heat dissipation layer
143U · · Conductivity and heat dissipation layer on the third substrate
143L ・ ・ Conductive and heat dissipation layer under the third substrate
143L1..First conductive / heat radiation layer under third substrate
143L2 ・ ・ Second conductive / heat dissipation layer under third substrate
151, 152 .. First and second insulating adhesive layers J1 to J20 .. Electrode 19 .. Sealed resin layer CV .. Cavity 20 .. Power supply control unit 21 .. Power distribution unit 22 .. Timing control circuit 2.・ Imaging device 3 ・ ・ Region

Claims (1)

A first substrate;
A first insulating adhesive layer disposed in contact with the first substrate;
A plurality of cylindrical openings formed in the first substrate and the first insulating adhesive layer;
A plurality of spherical or quasi-spherical lenses arranged with a portion of the lower part inserted into the heads of the plurality of openings;
A second substrate disposed in contact with the first insulating adhesive layer;
The second substrate first conductive / heat dissipating layer and the second substrate second formed on the surface of the second substrate on the first substrate side, which are electrically separated and have a conductive function and a heat conductive function. A conductive and heat dissipation layer;
A first conductive / heat dissipating layer under the second substrate and under the second substrate, which are electrically separated and formed on the surface of the second substrate facing the first substrate, and have a conductive function and a heat conductive function. A second conductive / heat dissipating layer;
A first conductive / heat dissipating layer on the second substrate and a second substrate formed on a sidewall of a first via hole formed in a portion of the second substrate where the opening of the first insulating adhesive layer is not formed. A second substrate side wall first conductive / heat dissipating layer connected to the lower first conductive / heat dissipating layer and having a conducting function and a heat conducting function;
A second conductive / heat dissipating layer on the second substrate and a second substrate formed on a side wall of a second via hole formed in a portion of the second substrate where the opening of the first insulating adhesive layer is not formed. A second substrate side wall second conductive / heat dissipating layer connected to the lower second conductive / heat dissipating layer and having a conductive function and a heat conductive function;
The respective units disposed on the heads of the openings formed in the first substrate and the first insulating adhesive layer on the second substrate or on the second conductive layer on the second substrate. An anode is connected to the first conductive / heat dissipation layer on the second substrate, and a cathode is connected to the second conductive / heat dissipation layer on the second substrate via wiring. A plurality of light emitting diode elements; and
A second insulating adhesive layer disposed in contact with the second substrate;
A third substrate disposed in contact with the second insulating adhesive layer;
A first conductive / heat dissipating layer on the third substrate and a second on the third substrate, which are formed on the surface of the third substrate on the second substrate side and are electrically separated and have a conductive function and a heat conductive function. A conductive and heat dissipation layer;
Formed on the surface of the third substrate facing the first substrate side and electrically separated, having a conductive function and a heat conductive function, below the third substrate, the first conductive / heat dissipating layer and below the third substrate A second conductive / heat dissipating layer;
Formed on sidewalls of the second insulating adhesive layer and a third via hole formed in the third substrate, and connected to the first conductive / heat dissipating layer on the third substrate and the first conductive / heat dissipating layer below the third substrate. Formed on the side wall of the third substrate side wall first conductive / heat dissipating layer having the conductive function and the heat conductive function, the second insulating adhesive layer and the fourth via hole formed in the third substrate, A third substrate side wall second conductive / heat dissipating layer connected to the second conductive / heat dissipating layer on the third substrate and the second conductive / heat dissipating layer below the third substrate;
Have
Sealing the contact portion of the lens and the opening disposed at the head of the opening with resin, and sealing the inside of the opening,
The first conductive / heat dissipating layer under the third substrate, the first conductive / heat dissipating layer on the third substrate side wall, the first conductive / heat dissipating layer on the third substrate, the first conductive / heat dissipating layer under the second substrate, the first A first power supply path for supplying power to a cathode or an anode of the light emitting diode element, including a first conductive / heat dissipating layer on two substrate side walls and a first conductive / heat dissipating layer on the second substrate;
The second conductive / heat dissipation layer under the third substrate, the second conductive / heat dissipation layer on the third substrate side wall, the second conductive / heat dissipation layer on the third substrate, the second conductive / heat dissipation layer under the second substrate, the second A second power supply path for supplying power to the anode or the cathode of the light emitting diode element, including a second conductive / heat dissipation layer on the second substrate side wall and a second conductive / heat dissipation layer on the second substrate;
The plurality of light emitting diode elements corresponding to the plurality of lenses are arranged on a plurality of concentric rings having different diameters and along the circumference of each ring,
The plurality of light emitting diode elements corresponding to the plurality of lenses are arranged at positions of the rings so that light emitted from the plurality of lenses arranged in the concentric circles having different diameters converges to one front point. Accordingly, the angle of light is made different from the central axis of the concentric circle, and the positional relationship between the lens and the LED element corresponding thereto is increased as the distance from the center of the concentric circle increases. The LED element is disposed at a position more distant from the center of
Lighting unit.

Images