JP4738722B2 - Micropart supply device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a minute component supply apparatus that aligns and supplies minute components such as chip-shaped electronic components.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a technique for supplying a micro component has been publicly known.
For example, there are those disclosed in Patent Document 1 and Patent Document 2.
In this patent document 1, a vibratory bowl feeder and a vibratory rectilinear feeder are arranged in combination, and a drop is provided in a transfer portion from the bowl transport path of the bowl feeder to the trough transport path of the straight feeder, and the transport path The chip resistor is provided with an orientation aligning section so that the chip resistor can be constantly supplied from the discharge end without causing clogging of components.
[0003]
In Patent Document 2, ions, ionized air, or ionized air containing ions are sprayed onto a micro component to eliminate charging due to static electricity of the chip resistor being transported. It is possible to prevent the dust from being disturbed by repulsion and inquiries, and dust from adhering to the chip resistor due to static electricity.
[0004]
[Patent Document 1]
JP 2000-118682 A [Patent Document 2]
Japanese Patent Laid-Open No. 2001-253533
[Problems to be solved by the invention]
However, since the configuration of Patent Document 1 is a micropart supply device that combines a vibrating bowl feeder and a vibrating linear feeder, it has become a large-scale device.
[0006]
Further, the configuration of Patent Document 2 has a problem that there is almost no static elimination effect when the sum of the charges charged in the minute parts is ± 0.
[0007]
[Means for Solving the Problems]
The problem to be solved by the present invention is as described above. Next, means for solving the problem will be described.
[0008]
That is, the micropart supply device of the present invention is provided along the vibratory linear feeder, a trough having a micropart conveying path provided on the upper part of the vibratory linear feeder, and the trough conveying path, A return conveyance path that enables circulation of the micro parts, and a gas ejection means that is provided near the entrance of the return conveyance path and that pumps the micro parts to the vicinity of the exit.
[0009]
Thereby, since there is one vibrating body, it is easy to manufacture and a small micropart supply device can be provided.
[0010]
Moreover, in this invention, it is preferable that the mechanism in which the said micropart sent by pressure settles in the accumulation part is provided .
[0011]
Thereby, the damage at the time of landing of the micropart sent by pressure can be prevented.
[0012]
Furthermore, in this invention, it is preferable that the other gas ejection means which blows up the said micro component is provided .
[0013]
Thereby, it is possible to surely blow up the minute parts to the accumulation portion.
[0014]
Furthermore, in the present invention, it is preferable that the return conveyance path is a pipe line .
[0015]
Thereby, a micropart can be reliably returned and conveyed by a gas ejection means.
[0016]
Furthermore, in this invention, it is preferable to humidify the gas of the said gas ejection means, and to use it for the said pressure feeding .
[0017]
Thereby, it can prevent that static electricity generate | occur | produces in a micro component.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the invention will be described.
FIG. 1 is a front view showing an embodiment of a microcomponent supply apparatus according to the present invention, FIG. 2 is a partially cutaway plan view showing a trough and a component supply section of FIG. 1, and FIG. FIG. 4 and FIG. 4 are diagrams showing a sorting / exclusion mechanism that eliminates excessive minute parts.
[0019]
The micro component supply device A includes a vibration type linear feeder 1, a trough 2 having a conveyance path 8 for a micro component 14 provided on the vibration linear movement feeder 1, and a micro component provided in the middle of the conveyance path 8. Sorting / exclusion mechanism 5 that sorts out 14 to the groove 3, a groove 3 provided on the trough 2 along the conveyance path 8, and a trough 2 provided on the trough 2 along the groove 3 and conveyance path 8. A return conveyance path 4 that enables circulation of the component 14, a gas ejection means 6 that is provided near the entrance of the return conveyance path 4 and that pumps the micro component 14 to the vicinity of the exit, and blows up the micro component 14 that has been pumped. It consists of the gas jetting means 7 and the well 9 of the micropart 14 that has been pumped.
[0020]
The micro component 14 includes a chip resistor 15 shown in FIG. 5 and a chip capacitor 16 shown in FIG.
The chip resistor 15 has a resistor 15a embedded on the front surface side of the base body 15b and has a front and back direction.
The chip capacitor 16 is obtained by surrounding both ends of a dielectric 16a with two metal portions 16b.
A microcomponent supply apparatus A according to an embodiment of the present invention is to supply microcomponents such as the chip resistor 15 and the chip capacitor 16 in alignment.
[0021]
The vibratory linear feeder 1 reciprocally vibrates the trough 2 having the linear conveyance path 8. As a result, the micro component 14 can be transported along the transport path 8.
[0022]
The trough 2 includes the above-described linear conveyance path 8, a sorting / exclusion mechanism 5 that sorts and removes the microparts 14 to the grooves 3, a groove 3 that receives the microparts that have been removed, and a return that transports the microparts back. And a gas ejection means 6 for pumping the micro component 14 to the vicinity of the exit of the return conveyance path 4.
Further, the trough 2 is provided integrally with the squirting portion 9 at the upper portion of the vibration type linear feeder 1, and is reciprocated by the vibration of the vibration type linear feeder 1.
[0023]
The sorting / exclusion mechanism group 5 is provided in the middle of the conveying path 8 of the trough 2. The sorting / exclusion mechanism group 5 includes a sorting / exclusion mechanism 5a, a sorting mechanism 5b, and an exclusion mechanism 5c.
The sorting / exclusion mechanism 5a is provided with a narrow portion 8a shown in FIG. 4 in the conveying path 8, dropping excess micro components 14 into the groove 3, and aligning the remaining micro components 14 in a row with the narrow portion 8a. is there.
The sorting mechanism 5b is a sensor or the like that recognizes the direction of a minute part.
For example, if the micro component 14 is a chip resistor 15, it is a photoelectric sensor that discriminates the front and back of the chip resistor 15.
When the micro component 14 is the chip capacitor 16, unlike the chip resistor 15, it is not necessary to make a front / back determination, and the chip capacitors 16 may be aligned. As a selection mechanism for determining this direction, for example, a CCD camera or the like recognizes the direction of the chip capacitor 16 by image recognition.
The exclusion mechanism 5c is for removing the minute component 14 in the groove 3 when the sorting mechanism 5b determines that the micro component 14 is in a different direction. For example, it is a gas jetting means that blows gas from the side and excludes it into the groove 3.
[0024]
The groove 3 is provided along the conveyance path 8 of the trough 2 at the lower side of the conveyance path 8.
The groove 3 receives the micro component 14 that has been removed by the sorting and removing mechanism 5. Further, since the groove 3 vibrates by the vibration type linear feeder 1, the removed micro component 14 flows along the groove 3 in the supply direction and is conveyed to the entrance of the return conveyance path 4.
[0025]
The return conveyance path 4 includes pipe lines 11 and 12.
The pipe line 11 (first pipe line) is provided in a straight line along the groove 3 at the lower side of the groove 3. The conduit 11 includes a lid portion 11a and a groove portion 11b. By making the lid portion 11a openable and closable, dust accumulated in the groove portion 11b can be removed.
The pipe 12 (second pipe) is provided at the end of the pipe 11 and orthogonal to the pipe 11. Further, it has a curved portion and communicates with the well 9.
The return transport path 4 receives the microparts 14 transported from the groove 3 and transports the microparts 14 to the vicinity of the return transport path 4 exit by the gas ejection means 6 provided near the entrance of the return transport path 4. To do.
[0026]
The gas ejection means 6 is provided in the vicinity of the entrance of the return conveyance path 4 (one end of the pipeline 11) so as to eject gas into the pipeline 11.
This gas ejection means 6 can eject compressed gas, and thereby can transport the micro component 14 to the vicinity of the exit of the return transport path 4.
[0027]
The gas ejection means 7 is provided at the other end of the pipeline 11 of the return conveyance path 4 so that gas can be ejected along the pipeline 12, and blows up the microparts 14 to the accumulation part 9.
The gas jetting means 7 can jet compressed gas, thereby transporting the micro component 14 along the pipe line 12 to the outlet of the return transport path 4 and blowing it up to the blow-off portion 9.
[0028]
In addition, when the pressure of the compressed gas of the gas ejection means 6 is large, the microparts 14 can be directly blown up to the well 9 without using the gas ejection means 7.
[0029]
Moreover, it is possible to prevent static electricity from being generated in the micro component 14 by humidifying the gas from the gas ejection means 6 and 7. Here, for example, if humidification is performed using dry fog, apparatus parts such as the micro component 14 and the return conveyance path 4 can be prevented from getting wet at all.
Furthermore, without humidifying the gas of the gas ejection means 6 and 7 as described above, it is possible to prevent generation of static electricity by spraying the humidified gas on the minute parts in the transport path 8 or the like. In addition, the same effect can be obtained by humidifying the entire facility where the micropart supply device according to the present invention is located.
[0030]
The spray reservoir 9 is integrated with the trough 2 and provided on the upper part of the vibration type linear feeder 1.
Since the inner wall of the squirting portion 9 is a cylinder 13, the micro component 14 blown up by the gas jetting means 7 along the pipe line 12 makes a spiral motion along the inner wall. . At this time, the micro component 14 is decelerated due to friction with the wall surface, and is stationary with almost no impact.
Since the spray pool 9 is integrated with the trough 2, it is vibrated by the vibration type linear feeder 1, and the micro component 14 is again conveyed to the conveying path 8 of the trough 2.
[0031]
As described above, when the micro parts 14 are not aligned and circulate, the micro parts 14 are sorted by the sorting / exclusion mechanism group 5 from the transport path 8 while traveling straight on the transport path 8 of the trough 2 due to the vibration of the vibration type linear feeder 1. It is eliminated and dropped into the groove 3. Next, it is conveyed along the groove 3 in the supply direction by the vibration of the vibration type linear feeder 1 and is transferred from the groove 3 to the return conveying path 4. In the pipeline 11 of the return conveyance path 4, the gas is ejected by the gas ejection means 6 in the direction opposite to the supply direction to the inlet of the pipeline 12 of the return conveyance path 4, and blown up by the gas ejection means 7 along the pipeline 12. It is done. Then, the cycle of reaching the sump 9 and being settled and transported again to the transport path 8 of the trough 2 is repeated.
The fine parts 14 that have been aligned go straight through the conveyance path 8 and are supplied to an assembly apparatus or the like.
[0032]
According to this embodiment, since there is one vibrating body, it is possible to provide a small micropart supply device that is easy to manufacture.
Further, the micro parts can be reliably conveyed by the gas ejection means 6 and 7. Microparts are blown up by the gas jetting means 7 and spiral movement along the inner wall of the cylinder 13 of the accumulation portion 9 is made into a micropart, so that damage at the time of landing of the microparts can be prevented.
Furthermore, since humidified gas is sprayed, it is possible to prevent static electricity from being generated in the minute parts. In addition, when dry fog is used for the humidified gas, it is possible to prevent the minute parts from getting wet.
[0033]
【The invention's effect】
Since the present invention is configured as described above, the following effects can be obtained.
That is, since there is only one vibrating body, it is possible to provide a small micropart supply device that is easy to manufacture.
In addition, since the spiral movement of the minute parts spirals along the cylindrical inner wall of the accumulation part, the damage of the minute parts blown up and pumped can be prevented.
Furthermore, since the humidified gas is blown onto the minute parts, it is possible to prevent static electricity from being generated in the minute parts.
[Brief description of the drawings]
FIG. 1 is a front view showing an embodiment of a micropart supply device according to the present invention.
FIG. 2 is a partially cutaway plan view showing the trough and the puddle part of FIG. 1;
3 is a cross-sectional view taken along line III-III in FIG.
FIG. 4 is a diagram showing a sorting / exclusion mechanism that eliminates excess microparts.
FIG. 5 is a view showing a chip resistor as an example of a micro component.
FIG. 6 is a view showing a chip capacitor which is an example of a micro component.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Vibrating linear feeder 2 Trough 3 Groove 4 Return conveyance path 5 Sorting exclusion mechanism group 5a Sorting exclusion mechanism 5b Sorting mechanism 5c Exclusion mechanism 6, 7 Gas ejection means 8 Conveying path 8a Narrow part 9 Blowing part 11, 12 Pipe line 11a Lid 11b Groove 13 Cylinder 14 Micropart 15 Chip Resistor 15a Resistor 15b Base 16 Chip Capacitor 16a Dielectric 16b Metal Part

Claims (2)

Vibrating linear feeder,
A trough having a conveyance path for micro parts provided on the upper part of the vibratory linear feeder;
A groove provided in a lower part of the conveyance path along the conveyance path;
A first pipe provided along the groove at a side lower part of the groove and a second pipe provided at the end of the first pipe and orthogonal to the first pipe , A return transport path that allows parts to circulate,
A gas jetting means provided at one end of the first pipe , for pumping the micro component to the vicinity of the exit of the return transport path ;
The micro-part puddle portion provided integrally with the trough at the top of the vibratory linear feeder and communicating with the return conveyance path;
Gas is blown along the inner surface of the second pipe line outside the orthogonal part between the first pipe line and the second pipe line, provided at the other end of the first pipe line, so that the micro-parts are collected in the well portion. Other gas blowing means to blow up to,
A mechanism to settle the microparts that have been pumped into the pool ,
With
A micropart supply device in which a corner of an inner surface of a pipeline inside an orthogonal portion between the first pipeline and the second pipeline is dropped . Micro component supply device according to claim 1, characterized by using said pumping a wet gas in the gas ejection means.

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