JP4733477B2 - Electroplating tester - Google Patents

Electroplating tester Download PDF

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JP4733477B2
JP4733477B2 JP2005256847A JP2005256847A JP4733477B2 JP 4733477 B2 JP4733477 B2 JP 4733477B2 JP 2005256847 A JP2005256847 A JP 2005256847A JP 2005256847 A JP2005256847 A JP 2005256847A JP 4733477 B2 JP4733477 B2 JP 4733477B2
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plating
plated
cathode
water tank
anode
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JP2006052471A (en
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渡 山本
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Yamamoto MS Co Ltd
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本発明は、電気めっきの試験器に関し、特に均一なめっきをすることができる電気めっき試験器に関する。   The present invention relates to an electroplating tester, and more particularly to an electroplating tester capable of uniform plating.

近年、めっき技術は各方面の技術分野で応用されており、特に微小な金属体を形成する技術として次のようなものが注目されている。1つはダマシンプロセスといわれるLSIの配線技術である。LSIの高集積化、高性能化を実現するためには、半導体上の配線ピッチを縮小することが必要とされている。ダマシンプロセスは層間絶縁膜を成膜後にドライエッチングプロセスを行うことによって配線溝を確保し、その配線溝にめっきにより配線材料を埋め込む方法である。   In recent years, the plating technique has been applied in various technical fields, and the following are particularly attracting attention as a technique for forming a minute metal body. One is LSI wiring technology called damascene process. In order to realize high integration and high performance of LSI, it is necessary to reduce the wiring pitch on the semiconductor. The damascene process is a method of securing a wiring groove by performing a dry etching process after forming an interlayer insulating film and embedding a wiring material in the wiring groove by plating.

また、他のめっき技術を使用した最新技術として、LIGA(Lithographie,Galvanoformung devices)といわれる微小機械部品を作成するための技術がある。LIGAはX線によりアクリル樹脂を鋳型加工し、この型にめっきを厚く堆積させ、金属微小部品を型取りする技術である。   Further, as the latest technology using other plating technologies, there is a technology for creating micro mechanical parts called LIGA (Lithographie, Galvanoforming devices). LIGA is a technique in which an acrylic resin is cast by X-rays, a plating is deposited thickly on this mold, and a metal micro part is molded.

前記のめっき技術を実現するためには、被めっき物に形成された溝に均一にめっきを堆積させる必要がある。また、実験室レベルの小規模なめっき試験において種々のめっき液や電流密度等の条件を試験して、めっき条件の選定をし、工業化していく必要がある。そこで、本発明では小規模な電気めっき試験器において、均一な膜を形成することができる電気めっき試験器を提供することを目的とする。   In order to realize the above-described plating technique, it is necessary to deposit the plating uniformly in the groove formed in the object to be plated. In addition, it is necessary to test various plating solutions and current density conditions in a small-scale plating test at a laboratory level, select plating conditions, and industrialize. Therefore, an object of the present invention is to provide an electroplating tester capable of forming a uniform film in a small-scale electroplating tester.

前記課題を解決するため、本発明では、めっき液が注入されるめっき水槽と、前記めっき水槽内に設置される陽極と、前記めっき水槽内に前記陽極に平行に設置される被めっき物である陰極と、前記陽極と前記陰極との間に電圧を印加させる直流電源とを備える電気めっき試験器において、前記めっき水槽の底面に設けられためっき液の排出口と、前記被めっき物の表面近傍を攪拌する前記めっき水槽底面に設けられためっき液の噴出孔と、前記排出口からめっき液を吸い込み前記噴出孔からめっき液を噴出するように接続されためっき液の循環ポンプと、を有し、前記噴出孔は、前記被めっき物のめっき面の直下に前記被めっき物と平行に複数設けられているとともに、前記陽極の前記被めっき物側の面の直下に前記陽極と平行に複数設けられていることを特徴とする電気めっき試験器を構成した。 In order to solve the above-described problems, the present invention is a plating water tank into which a plating solution is injected, an anode installed in the plating water tank, and an object to be plated installed in parallel to the anode in the plating water tank. In an electroplating tester comprising a cathode and a DC power source for applying a voltage between the anode and the cathode, a plating solution outlet provided on the bottom surface of the plating water tank, and the vicinity of the surface of the object to be plated the has a jetting hole of the plating solution provided in the plating water tank bottom stirring, and a circulating pump connected plating liquid to eject the plating solution of the plating liquid from the suction the ejection hole from the discharge port The spray holes are provided in parallel with the object to be plated immediately below the plating surface of the object to be plated, and are provided in parallel with the anode under the surface of the anode on the object side. It was constructed an electroplating apparatus according to claim being.

このように構成することで、めっき面に発生する気泡を除去することができ、かつめっき面近傍の陽イオン濃度を一定にすることができるため、均一なめっき膜を形成させることができる。
また、電気めっき試験器は、前記被めっき物の表面近傍を撹拌する撹拌手段をさらに備え、前記撹拌手段は、前記被めっき物の表面近傍に上下方向に沿って配置された棒状部材と、前記めっき水槽の上方に水平方向にスライド自在に配置され、前記棒状部材の上端側を支持するスライドシャフトと、前記スライドシャフトの一端側に設けられ、前記スライドシャフトと交差する方向に水平に延在する溝を有するフォロワーと、水平方向に回転駆動する円盤と、前記円盤の外周部に立設され、前記溝に挿入されるローラーピンと、前記円盤を回転駆動する回転駆動機構と、を備えるのが好ましい。
By comprising in this way, the bubble which generate | occur | produces in a plating surface can be removed, and since the cation density | concentration of the plating surface vicinity can be made constant, a uniform plating film can be formed.
The electroplating tester further includes an agitating means for agitating the vicinity of the surface of the object to be plated, and the agitating means includes a rod-shaped member disposed in the vertical direction near the surface of the object to be plated; It is slidably disposed in the horizontal direction above the plating water tank, and is provided on one end side of the slide shaft that supports the upper end side of the rod-shaped member, and extends horizontally in a direction intersecting the slide shaft. It is preferable to include a follower having a groove, a disk that rotates in a horizontal direction, a roller pin that is erected on the outer periphery of the disk and is inserted into the groove, and a rotation drive mechanism that rotates the disk. .

なお、電気めっき試験器に使用される陰極カートリッジは、陰極板である被めっき物のめっき面の外形に開口され、前記めっき面周縁に当接する突起部を複数有し、めっき液に漬からない部分で直流電源と接続可能に露出している板状の陰極伝導体と、前記被めっき物の後面側と前記陰極伝導体の後面側を覆い、前記被めっき物と前記陰極伝導体が入り込む溝部を有する板状の後面側絶縁体と、前記めっき面の形状に開口され、前記陰極伝導体の前面側を覆う前面側絶縁体と、前記被めっき物と前記後面側絶縁体の間に挟まれる弾性体薄板とを含んでなるのが好ましい。   The cathode cartridge used in the electroplating tester has a plurality of protrusions that are opened in the outer shape of the plating surface of the object to be plated, which is a cathode plate, and abuts the periphery of the plating surface, and is not immersed in the plating solution. A plate-like cathode conductor that is exposed so as to be connectable to a DC power source, and a groove portion that covers the rear surface side of the object to be plated and the rear surface side of the cathode conductor, and into which the object to be plated and the cathode conductor enter. A plate-like rear surface side insulator having an opening, a front surface side insulator that covers the front side of the cathode conductor, and is sandwiched between the object to be plated and the rear side insulator. It preferably comprises an elastic thin plate.

このように構成することで、めっき面以外の陰極部を絶縁体でめっき液から遮断できるため、陽極からめっき面に向かって電気力線が走り、均一なめっき膜を形成することができる。また、陰極伝導体に設けられた突起部が被めっき物と当接するように構成されているため、陰極伝導体と被めっき物の接触を確実にすることができる。さらにその突起部は複数設けられているので、被めっき物に電気力線が均一に入り、均一なめっき膜を得ることができる。なお、本発明でいう伝導体は電気の伝導体であり、例えば金属や炭素を意味する。   By comprising in this way, since cathode parts other than a plating surface can be interrupted | blocked from a plating solution with an insulator, an electric force line runs from an anode toward a plating surface, and a uniform plating film can be formed. Moreover, since the protrusion provided on the cathode conductor is configured to contact the object to be plated, the contact between the cathode conductor and the object to be plated can be ensured. Further, since a plurality of protrusions are provided, the lines of electric force uniformly enter the object to be plated, and a uniform plating film can be obtained. In addition, the conductor as used in the field of this invention is an electrical conductor, for example, means a metal and carbon.

また、前記前面側絶縁体の外側に、前記めっき面の形状に開口された伝導体であるダミー板を設け、前記ダミー板が陰極となるように直流電源を接続されるようにするのが好ましい。   Further, it is preferable that a dummy plate which is a conductor opened in the shape of the plating surface is provided outside the front-side insulator, and a DC power source is connected so that the dummy plate becomes a cathode. .

このように構成することで、被めっき物の側方からめっき面の周辺に集中して入りやすい電気力線をダミー板に入らせることができるので、めっき面に入る電気力線を均一にでき、均一なめっき膜を得ることができる。   By configuring in this way, it is possible to allow the electric lines of force that tend to concentrate on the periphery of the plating surface from the side of the object to be plated to enter the dummy plate, so that the electric lines of force that enter the plating surface can be made uniform. A uniform plating film can be obtained.

以上詳述したとおり、本発明によれば、めっき面近傍の金属陽イオン濃度が一定となり、めっき面に付着した気泡も除去されるため、均一にめっき膜を形成させることができる。   As described above in detail, according to the present invention, the metal cation concentration in the vicinity of the plating surface is constant, and the bubbles attached to the plating surface are also removed, so that a plating film can be formed uniformly.

以下に、本発明の実施の形態につき、具体例をあげて説明する。図1は、本発明の実施の形態に係る電気めっき試験器の陰極カートリッジ及びシリコンウエハの分解斜視図である。また、図2(a)は本発明の実施の形態に係る電気めっき試験器の陰極カートリッジ及びシリコンウエハの正面図、(b)は同部品のA−A線断面図である。   Hereinafter, embodiments of the present invention will be described with specific examples. FIG. 1 is an exploded perspective view of a cathode cartridge and a silicon wafer of an electroplating tester according to an embodiment of the present invention. 2A is a front view of the cathode cartridge and the silicon wafer of the electroplating tester according to the embodiment of the present invention, and FIG. 2B is a cross-sectional view taken along line AA of the same part.

陰極カートリッジ1は、次のように構成されている。被めっき物である円形薄板状のシリコンウエハ2のめっき面2aと反対側(以下、「後面側」という)には、めっき面2aの裏面をめっき液から遮断するように密着するゴム状の弾性力のある弾性体薄板3があてられる。シリコンウエハ2のめっき面2a側(以下、「前面側」という)には、ステンレス薄板からなる陰極伝導体4があてられる。陰極伝導体4は、めっき面とほぼ同じ円形に開口されたリング部4a及びリング部4aから上方に細長く伸びた短冊状の電源接続部4b、及びリング部4aの円周上に8箇所等間隔で中心に向けて設けられた接点片4cから構成される。接点片4cはさらに図2(b)に示すように、めっき面2aに向けて突起部4dが設けられており、かつ4cは若干撓まされながらめっき面2aに当接するように構成されている。   The cathode cartridge 1 is configured as follows. A rubber-like elastic material that is in close contact with the plating surface 2a (hereinafter referred to as "rear surface side") of the circular thin plate silicon wafer 2 that is an object to be plated so as to shield the back surface of the plating surface 2a from the plating solution. A strong elastic thin plate 3 is applied. A cathode conductor 4 made of a stainless steel thin plate is applied to the plated surface 2a side (hereinafter referred to as “front side”) of the silicon wafer 2. The cathode conductor 4 includes a ring portion 4a that is opened in a circle substantially the same as the plating surface, a strip-shaped power supply connection portion 4b that extends upward from the ring portion 4a, and eight equal intervals on the circumference of the ring portion 4a. It is comprised from the contact piece 4c provided toward the center. As shown in FIG. 2B, the contact piece 4c is further provided with a projection 4d toward the plating surface 2a, and the 4c is configured to abut against the plating surface 2a while being slightly bent. .

弾性体薄板3と陰極伝導体4の後面側の面は、アクリル板の後面側絶縁体5により覆われる。後面側絶縁体5は長方形の上部2箇所の頂点に陰極カートリッジ1をめっき水槽に引っ掛けるための被支持部5aを備え、陰極伝導体4及び弾性体薄板3が接する面にはこれらの部品が納まるように凹部5b,5cが設けられている。   The elastic thin plate 3 and the cathode conductor 4 on the rear surface side are covered with an acrylic plate rear surface insulator 5. The rear surface side insulator 5 is provided with a supported portion 5a for hooking the cathode cartridge 1 to the plating water tank at the two apexes of the rectangular upper part, and these parts are accommodated on the surface where the cathode conductor 4 and the elastic thin plate 3 are in contact. In this way, recesses 5b and 5c are provided.

陰極伝導体4の前面側にはめっき面2aと同一形状に開口された前面側絶縁体6が設けられ、さらにその前面側にはめっき面と同一形状に開口された電気伝導体からなるダミー板7が備えられる。ダミー板7の前面側からは、図示しない樹脂のねじにより、後面側絶縁体5、前面側絶縁体6、ダミー板7を共締めすることで、シリコンウエハ2、弾性体薄板3、陰極伝導体4が挟まれて固定されている。共締めされた陰極カートリッジ1及びシリコンウエハ2(以下、単に「陰極1」という)は図2(a)に示すようにめっき面2a側から見ると、陰極カートリッジ1の前面側及び後面側の絶縁部品からはめっき面2aと電源接続部4bのみが露出した状態になっている。   A front-side insulator 6 opened in the same shape as the plating surface 2a is provided on the front side of the cathode conductor 4, and a dummy plate made of an electric conductor opened in the same shape as the plating surface on the front side. 7 is provided. From the front side of the dummy plate 7, the rear-side insulator 5, the front-side insulator 6, and the dummy plate 7 are fastened together with a resin screw (not shown), so that the silicon wafer 2, the elastic thin plate 3, and the cathode conductor are combined. 4 is sandwiched and fixed. The cathode cartridge 1 and silicon wafer 2 (hereinafter simply referred to as “cathode 1”) that are fastened together are insulated on the front side and the rear side of the cathode cartridge 1 when viewed from the plating surface 2a side as shown in FIG. Only the plating surface 2a and the power supply connection portion 4b are exposed from the components.

図3は本発明の実施の形態に係る電気めっき試験器の外観を表す斜視図であり、前記陰極1及び陽極8を取り付け、必要な電源、ポンプ及びヒーターを設置した状態を示す。なお、図3において電源及びポンプの図は省略してある。また、図4は本発明の実施の形態に係る電気めっき試験器の平面図であり、図5(a)は本発明の実施の形態に係る電気めっき試験器の図4におけるB−B線断面図、(b)は同図4におけるC−C線断面図、及び図6は同図4におけるD−D線断面図である。   FIG. 3 is a perspective view showing the appearance of the electroplating tester according to the embodiment of the present invention, and shows a state in which the cathode 1 and the anode 8 are attached and necessary power source, pump and heater are installed. In FIG. 3, illustrations of the power source and the pump are omitted. 4 is a plan view of the electroplating tester according to the embodiment of the present invention, and FIG. 5A is a cross-sectional view taken along line BB in FIG. 4 of the electroplating tester according to the embodiment of the present invention. 4B is a cross-sectional view taken along line CC in FIG. 4, and FIG. 6 is a cross-sectional view taken along line DD in FIG.

電気めっき試験器10は、めっき水槽11と、陰極1と、陽極8と、ヒーター25と、図示しない循環ポンプ及び電源より構成される(図3参照)。めっき水槽11は、透明なアクリル板よりなる水槽で、仕切り板12により容積の大きいめっき槽17と容積の小さい排水槽18に分離されている(図6参照)。陰極1はめっき槽17の仕切り板12と対向する壁の際に被支持部5aを水槽の縁に引っ掛けて設置されている。陽極8は陰極1に対向して仕切り板12の側に陰極1同様めっき水槽の縁に引っ掛けて設置されている。ヒーター25はめっき水槽11の底部に開口し、所定深さに側面側から設けられたヒーター設置穴16(図5(a)参照)に差し込まれている。なお、ヒーター設置穴16の入り口はゴムの栓25aで密閉することでめっき液の漏れを防止している。   The electroplating tester 10 includes a plating water tank 11, a cathode 1, an anode 8, a heater 25, a circulation pump and a power source (not shown) (see FIG. 3). The plating water tank 11 is a water tank made of a transparent acrylic plate, and is separated by a partition plate 12 into a plating tank 17 having a large volume and a draining tank 18 having a small volume (see FIG. 6). The cathode 1 is installed by hooking the supported portion 5a to the edge of the water tank at the wall facing the partition plate 12 of the plating tank 17. The anode 8 faces the cathode 1 and is installed on the side of the partition plate 12 by being hooked on the edge of the plating water tank like the cathode 1. The heater 25 opens at the bottom of the plating water tank 11 and is inserted into a heater installation hole 16 (see FIG. 5A) provided at a predetermined depth from the side surface side. The inlet of the heater installation hole 16 is sealed with a rubber plug 25a to prevent leakage of the plating solution.

図示しない循環ポンプは排水槽18の底部に側面から設けられた排水口13からめっき液を吸い込み、流入口14からめっき槽11内部にめっき液を送るように接続されている。図示しない電源は、電源の陽極を端子20により陽極8へ接続され、電源の陰極を端子21により電源接続部4bへ、また端子22によりダミー板7へ接続されている。めっき水槽11には例えば銅イオン等の陽イオンを含んだめっき液が注入され、めっき槽17からあふれためっき液は仕切り板12を超えて排水槽18に流れるようになっている。   A circulation pump (not shown) is connected so that the plating solution is sucked from a drainage port 13 provided from the side surface at the bottom of the drainage tank 18 and sent from the inlet 14 into the plating tank 11. A power source (not shown) has a power source anode connected to the anode 8 via a terminal 20, a power source cathode connected to a power source connection 4 b via a terminal 21, and a dummy plate 7 via a terminal 22. For example, a plating solution containing cations such as copper ions is injected into the plating water tank 11, and the plating solution overflowing from the plating tank 17 flows over the partition plate 12 to the drain tank 18.

図5(b)に示すように、流入口14から入っためっき液は流入口14と連通している噴出孔15から勢いよく吹き上げられるようになっている。噴出孔15は図4及び図6に示すようにめっき槽17の底に穿孔され、陰極1のめっき面2a及び陽極8の陰極1に向かう面の近傍(約1〜2mm)に複数並ぶように位置している。   As shown in FIG. 5B, the plating solution entering from the inlet 14 is blown up vigorously from the ejection holes 15 communicating with the inlet 14. As shown in FIGS. 4 and 6, the ejection holes 15 are perforated at the bottom of the plating tank 17, and are arranged in the vicinity of the plating surface 2 a of the cathode 1 and the surface of the anode 8 facing the cathode 1 (about 1 to 2 mm). positioned.

以上のように構成された電気めっき試験器に使用される陰極カートリッジ1及び電気めっき試験器10は、次のように操作する。まず、めっき水槽11に仕切り板12より若干下の水位までめっき液を注入する。そして、図示しない循環ポンプの電源を入れる。次に、端子20に電源の陽極を接続し、端子21及び22には電源の陰極を接続する。この際、端子22には、端子21に比べ微弱な電流が流れるようにする。   The cathode cartridge 1 and the electroplating tester 10 used in the electroplating tester configured as described above are operated as follows. First, the plating solution is poured into the plating water tank 11 to a water level slightly below the partition plate 12. Then, a circulation pump (not shown) is turned on. Next, the anode of the power source is connected to the terminal 20, and the cathode of the power source is connected to the terminals 21 and 22. At this time, a weak current flows through the terminal 22 as compared with the terminal 21.

以上の操作によりシリコンウエハ2にめっきがなされるが、本発明はめっき過程において以下のように作用する。まず、めっき面2aと陰極伝導体4の接触点について説明する。図7(a)は本発明にかかる陰極カートリッジの正面図であり、(b)は突起部を設けない場合の陰極カートリッジの正面図である。同図において、矢印はめっき面の電流の流れを示す。本発明のような構成を有しない場合、例えば、突起部4dを設けないでめっき面2aと陰極伝導体4をめっき面2aの周縁で接触させた場合には、部品の微小なゆがみ、部品組立の不均一により、図7(b)のように円周上の一部でのみ接する場合がある。そのため、電気力線は接触部付近のめっき面に偏って入るので、接触部付近の膜厚ばかりが厚い不均一なめっきとなってしまう。ところが、本発明では突起部4dの先端の狭い点でめっき面と接触するので、接触点の面圧が高く、確実に接触を確保することが出来る。特に本実施の形態では、図2(b)のように突起部4dが撓まされながらめっき面2aと接するため、めっき面2aの周縁8点で確実に陰極伝導体4が接触する。従って、図7(a)に示すようにめっき面2aに均一に電気力線が入り、各接点へと均等に電流が流れ、均一なめっき膜の形成が可能になる。なお、本実施の形態では陰極伝導体4のリング部4aの内側に接点片4cを設け、接点片4cの突起部4dを接触点としたが、接点片4cを設けずに例えばリング部4aに突起部4dを設けることもできる。この場合弾性体薄板3の弾性力により接点の接触圧力を確保するとよい。   Although the silicon wafer 2 is plated by the above operation, the present invention operates as follows in the plating process. First, the contact point between the plating surface 2a and the cathode conductor 4 will be described. FIG. 7A is a front view of the cathode cartridge according to the present invention, and FIG. 7B is a front view of the cathode cartridge when no protrusion is provided. In the figure, arrows indicate the flow of current on the plating surface. When the configuration as in the present invention is not provided, for example, when the plating surface 2a and the cathode conductor 4 are brought into contact with each other at the periphery of the plating surface 2a without providing the protrusion 4d, the component is slightly distorted, and the component assembly is performed. Due to the non-uniformity, there may be a case where only a part of the circumference touches as shown in FIG. For this reason, the lines of electric force are biased into the plating surface in the vicinity of the contact portion, resulting in uneven plating with only a thick film near the contact portion. However, in the present invention, since the contact with the plating surface is made at a narrow point at the tip of the protrusion 4d, the surface pressure at the contact point is high, and the contact can be reliably ensured. In particular, in the present embodiment, as shown in FIG. 2B, the protruding portion 4d is in contact with the plating surface 2a while being bent, so that the cathode conductor 4 is surely in contact with the eight peripheral edges of the plating surface 2a. Therefore, as shown in FIG. 7 (a), the lines of electric force uniformly enter the plating surface 2a, and an electric current flows evenly to each contact, so that a uniform plating film can be formed. In the present embodiment, the contact piece 4c is provided inside the ring portion 4a of the cathode conductor 4 and the protrusion 4d of the contact piece 4c is used as a contact point. However, the contact piece 4c is not provided, for example, on the ring portion 4a. A protrusion 4d can also be provided. In this case, the contact pressure of the contacts may be secured by the elastic force of the elastic thin plate 3.

次に、前面側絶縁体4の外側にダミー板7を設けてダミー板7が陰極となるように電源を接続したことについて説明する。図8(a)は図7(a)のF−F線断面図であり、(b)はダミー板を設けない場合の図7(a)におけるF−F線断面に相当する図である。同図において、矢印は、めっき液中の電気力線を表す。陰極のダミー板を設けない場合、図8(b)のようにめっき液中の電気力線はめっき面2aの側方からめっき面2aの周辺部に向かって集中して入ってくる。そのため、めっき面2aの周辺部のめっき厚さが厚くなる傾向がある。これに対し、本発明のようにダミー板7を設けると、側方からめっき面2aに近づいてきた電気力線は、図8(a)に示すようにダミー板に吸い寄せられる。そのため、めっき面2aには前方から近づいてきた電気力線のみが入るので、めっき面2aには均一なめっき膜が形成される。   Next, a description will be given of providing a dummy plate 7 outside the front-side insulator 4 and connecting a power source so that the dummy plate 7 serves as a cathode. 8A is a cross-sectional view taken along line FF in FIG. 7A, and FIG. 8B is a view corresponding to a cross-sectional view taken along line FF in FIG. 7A when no dummy plate is provided. In the figure, the arrows represent lines of electric force in the plating solution. When no cathode dummy plate is provided, the electric lines of force in the plating solution are concentrated from the side of the plating surface 2a toward the periphery of the plating surface 2a as shown in FIG. 8B. Therefore, the plating thickness in the peripheral part of the plating surface 2a tends to increase. On the other hand, when the dummy plate 7 is provided as in the present invention, the electric lines of force approaching the plating surface 2a from the side are attracted to the dummy plate as shown in FIG. For this reason, only the lines of electric force approaching from the front enter the plating surface 2a, so that a uniform plating film is formed on the plating surface 2a.

次に、めっき面2aの近傍で、噴出孔15からめっき液を噴出させたことについて説明する。電気めっきは、被めっき物を陰極とし、めっき液中の金属陽イオンを陰極に引き寄せ、これをめっき面に堆積させるものである。この際、めっき面2a直近の金属陽イオンが引き寄せられやすいことから、時間が経過するとめっき面2a近傍の陽イオン濃度が低くなってくる。すると、めっきの条件が変化するため、時間の経過につれめっきの品質が変化してしまう。また、めっき液中の気体性の陽イオンが陰極に引き寄せられた場合には、めっき面上で気泡を生ずることがある。こうなると、気泡が付着した部分ではその後電気が流れないため、めっきの堆積が停止してしまい、不均一なめっきの原因となる。ところが、本発明のようにめっき面2aの近傍でめっき液を噴出させてめっき液を循環させた場合には、めっき面2a近傍の金属陽イオン濃度は時間的に変化することもない。また、めっき面2aに気泡が付着した場合には、めっき面2aに勢いよく流れてくるめっき液により気泡が流される。これらの作用により、本発明のめっき試験器では、めっき条件が安定して均一なめっき膜の形成が可能となっている。   Next, a description will be given of the fact that the plating solution is ejected from the ejection hole 15 in the vicinity of the plating surface 2a. In electroplating, an object to be plated is used as a cathode, metal cations in the plating solution are attracted to the cathode, and this is deposited on the plating surface. At this time, the metal cations in the immediate vicinity of the plating surface 2a are easily attracted, so that the cation concentration in the vicinity of the plating surface 2a decreases as time passes. Then, since the plating conditions change, the quality of the plating changes with time. In addition, when gaseous cations in the plating solution are attracted to the cathode, bubbles may be generated on the plating surface. In this case, electricity does not flow afterwards in the part where the bubbles are attached, so that the deposition of the plating is stopped, which causes uneven plating. However, when the plating solution is ejected in the vicinity of the plating surface 2a and the plating solution is circulated as in the present invention, the metal cation concentration in the vicinity of the plating surface 2a does not change with time. Further, when air bubbles adhere to the plating surface 2a, the air bubbles are caused to flow by the plating solution flowing vigorously on the plating surface 2a. With these actions, the plating tester of the present invention can form a uniform plating film with stable plating conditions.

以上、本発明の実施の形態について説明したが、本発明のめっき試験器は、前記実施の形態に限定されるものではない。例えば、本発明のめっき試験器の使用方法の応用として、めっき液攪拌器を併せて使用する方法もある。図9(a)は本発明の実施の形態の電気めっき試験器にめっき液攪拌器を装備した状態の平面図、(b)は図9(a)におけるE−E線断面図である。なお、図9(a)及び(b)において、めっき水槽11の枠部分と、めっき液攪拌器30及び陰極1及び陽極8以外の部分については図を省略してある。   As mentioned above, although embodiment of this invention was described, the plating tester of this invention is not limited to the said embodiment. For example, as an application of the method of using the plating tester of the present invention, there is a method of using a plating solution stirrer together. FIG. 9A is a plan view of a state in which the electroplating tester according to the embodiment of the present invention is equipped with a plating solution agitator, and FIG. 9B is a cross-sectional view taken along line EE in FIG. 9A and 9B, illustrations of the frame portion of the plating water tank 11 and portions other than the plating solution stirrer 30, the cathode 1 and the anode 8 are omitted.

めっき液攪拌器30は直径約2mmの金属棒であるパドル31をめっき面2aの近傍でめっき面2aに沿ってパドル軸と垂直方向に往復運動させることによりめっき面2a近傍のめっき液を攪拌するものである。パドル31は固定ねじ37によりスライドシャフト34に固定されており、スライドシャフト34はスライドレール33,33の溝上をX方向にスライド可能になっている。スライドシャフト34の一方の末端にはスライドシャフト34と垂直のY方向に溝が切られたフォロワー35が固定されている。フォロワー35の溝にはローラーピン36aが入り込んでおり、ローラーピン36aはモーター32により回転される円盤36の円周付近の1箇所に円盤36に対し自転可能に支持されている。   The plating solution agitator 30 agitates the plating solution in the vicinity of the plating surface 2a by reciprocating the paddle 31 which is a metal rod having a diameter of about 2 mm in the vicinity of the plating surface 2a along the plating surface 2a in the direction perpendicular to the paddle axis. Is. The paddle 31 is fixed to the slide shaft 34 by a fixing screw 37, and the slide shaft 34 can slide in the X direction on the grooves of the slide rails 33 and 33. A follower 35 having a groove cut in the Y direction perpendicular to the slide shaft 34 is fixed to one end of the slide shaft 34. A roller pin 36 a is inserted into the groove of the follower 35, and the roller pin 36 a is supported at one place near the circumference of the disk 36 rotated by the motor 32 so as to be rotatable with respect to the disk 36.

このように構成しためっき液攪拌器30は次のように動作する。モーター32を作動させると、モーター32に固定されている円盤36が回転し、円盤上のローラーピン36aのX位置及びY位置が変化する。フォロワー35はX方向のみ移動可能であり、ローラーピン36aのY位置の変化はフォロワー35の溝に吸収されるため、溝に入ったローラーピン36aのX方向の位置変化に連動してフォロワー35がX方向に往復運動する。スライドシャフト34さらにはパドル31はフォロワー35と一体に固定されているため、パドル31はX方向に往復運動をする。めっき液攪拌器30は以上のようにして、めっき面2aの近傍を激しく攪拌するので、めっき面2a近傍の金属陽イオン濃度を一定にし、また、めっき面2aに付着した気泡を除去することができる。従って、めっき面2aに均一なめっき膜を形成することができる。   The plating solution stirrer 30 configured as described above operates as follows. When the motor 32 is operated, the disk 36 fixed to the motor 32 rotates, and the X position and the Y position of the roller pin 36a on the disk change. The follower 35 can move only in the X direction, and the change in the Y position of the roller pin 36a is absorbed by the groove of the follower 35. Therefore, the follower 35 is interlocked with the change in the position of the roller pin 36a entering the groove in the X direction. Reciprocates in the X direction. Since the slide shaft 34 and the paddle 31 are fixed integrally with the follower 35, the paddle 31 reciprocates in the X direction. Since the plating solution agitator 30 vigorously stirs the vicinity of the plating surface 2a as described above, the metal cation concentration in the vicinity of the plating surface 2a can be made constant, and bubbles adhering to the plating surface 2a can be removed. it can. Therefore, a uniform plating film can be formed on the plating surface 2a.

また、他の応用例として、陰極1と陽極8の間の陰極付近に絶縁体からなる遮蔽版を設けることができる。図10は陰極と陽極の間の陰極1付近に絶縁体からなる遮蔽板を設けた場合の電気めっき試験器の平面図である。同図中、矢印はめっき液中の電気力線の流れを表す。遮蔽板40は絶縁体からなる平板で、めっき面2aの前方に、めっき面2aと相似形で若干小さい形状の穴、例えば、めっき面2aに対し5%小さい穴をあけたものである。この遮蔽板40を陰極1付近、例えばめっき面2aの前面10mmの位置に、めっき面2aと遮蔽板40の穴の中心位置が合うように設置する。この状態でめっきを行うと、図10に示すように陽極から出た電気力線は横に広がった後めっき面に向けて入ろうとするところ、遮蔽板40に経路を制限されるため、めっき面の側方からめっき面2aに入ることができず、めっき面2a前方から均一に入ることになる。そのため、めっき面2aでの電流密度は均一となり、陰極には均一にめっき膜が形成される。   As another application example, a shielding plate made of an insulator can be provided near the cathode between the cathode 1 and the anode 8. FIG. 10 is a plan view of an electroplating tester when a shielding plate made of an insulator is provided near the cathode 1 between the cathode and the anode. In the figure, the arrows represent the flow of electric lines of force in the plating solution. The shielding plate 40 is a flat plate made of an insulator, and has a hole slightly similar to the plating surface 2a and slightly smaller in shape, for example, 5% smaller than the plating surface 2a, in front of the plating surface 2a. The shielding plate 40 is installed in the vicinity of the cathode 1, for example, at a position 10 mm in front of the plating surface 2 a so that the center positions of the holes of the plating surface 2 a and the shielding plate 40 are aligned. When plating is performed in this state, as shown in FIG. 10, the lines of electric force emitted from the anode spread laterally and then enter toward the plating surface. It cannot enter into the plating surface 2a from the side of the surface, and enters uniformly from the front of the plating surface 2a. Therefore, the current density on the plating surface 2a is uniform, and a plating film is uniformly formed on the cathode.

本発明の実施の形態に係る電気めっき試験器の陰極カートリッジ及びシリコンウエハの分解斜視図である。It is a disassembled perspective view of the cathode cartridge and silicon wafer of the electroplating test device which concerns on embodiment of this invention. (a)は本発明の実施の形態に係る電気めっき試験器の陰極カートリッジ及びシリコンウエハの正面図、(b)は同部品のA−A線断面図である。(A) is a front view of a cathode cartridge and a silicon wafer of an electroplating tester according to an embodiment of the present invention, and (b) is a cross-sectional view taken along line AA of the same part. 図3は本発明の実施の形態に係る電気めっき試験器の外観を表す斜視図である。FIG. 3 is a perspective view showing the appearance of the electroplating tester according to the embodiment of the present invention. 本発明の実施の形態に係る電気めっき試験器の平面図である。It is a top view of the electroplating test device which concerns on embodiment of this invention. (a)は本発明の実施の形態に係る電気めっき試験器の図4におけるB−B線断面図であり、(b)は同図4におけるC−C線断面図である。(A) is the BB sectional view taken on the line in FIG. 4 of the electroplating test device based on Embodiment of this invention, (b) is CC sectional view taken on the line in FIG. 本発明の実施の形態に係る電気めっき試験器の図4におけるD−D線断面図である。It is the DD sectional view taken on the line in FIG. 4 of the electroplating test device which concerns on embodiment of this invention. (a)は本発明にかかる陰極カートリッジの正面図であり、(b)は突起部を設けない場合の陰極カートリッジの正面図である。(A) is a front view of the cathode cartridge concerning this invention, (b) is a front view of the cathode cartridge in case a projection part is not provided. (a)は図7(a)のF−F線断面図であり、(b)はダミー板を設けない場合の図7(a)におけるF−F線断面に相当する図である。(A) is the FF sectional view taken on the line of Fig.7 (a), (b) is a figure corresponded to the FF sectional view in FIG.7 (a) at the time of not providing a dummy board. (a)は本発明の実施の形態の電気めっき試験器にめっき液攪拌器を装備した状態の平面図、(b)は図9(a)におけるE−E線断面図である。(A) is a top view of the state which equipped the electroplating test device of embodiment of this invention with the plating solution stirrer, (b) is the EE sectional view taken on the line in Fig.9 (a). 陰極と陽極の間の陰極付近に絶縁体からなる遮蔽板を設けた場合の電気めっき試験器の平面図である。It is a top view of the electroplating test device at the time of providing the shielding board which consists of an insulator in the cathode vicinity between a cathode and an anode.

符号の説明Explanation of symbols

1 陰極カートリッジ(陰極)
2 陰極板
2a めっき面
3 弾性体薄板
4 陰極伝導体
4d 突起部
5 後面側絶縁体
6 前面側絶縁体
7 ダミー板
8 陽極
10 電気めっき試験器
11 めっき水槽
13 排水口
14 流入口
15 噴出孔
1 Cathode cartridge (cathode)
DESCRIPTION OF SYMBOLS 2 Cathode plate 2a Plating surface 3 Elastic thin plate 4 Cathode conductor 4d Protrusion part 5 Rear surface side insulator 6 Front surface side insulator 7 Dummy plate 8 Anode 10 Electroplating tester 11 Plating water tank 13 Drainage port 14 Inlet 15 Outlet

Claims (2)

めっき液が注入されるめっき水槽と、前記めっき水槽内に設置される陽極と、前記めっき水槽内に前記陽極に平行に設置される被めっき物である陰極と、前記陽極と前記陰極との間に電圧を印加させる直流電源とを備える電気めっき試験器において、
前記めっき水槽の底面に設けられためっき液の排出口と、
前記被めっき物の表面近傍を攪拌する前記めっき水槽底面に設けられためっき液の噴出孔と、
前記排出口からめっき液を吸い込み前記噴出孔からめっき液を噴出するように接続されためっき液の循環ポンプと、を有し、
前記噴出孔は、前記被めっき物のめっき面の直下に前記被めっき物と平行に複数設けられているとともに、前記陽極の前記被めっき物側の面の直下に前記陽極と平行に複数設けられていることを特徴とする電気めっき試験器。
A plating water tank into which a plating solution is injected, an anode installed in the plating water tank, a cathode that is an object to be plated installed in parallel to the anode in the plating water tank, and between the anode and the cathode In an electroplating tester comprising a direct current power source for applying a voltage to
A plating solution outlet provided on the bottom surface of the plating water tank;
A plating solution ejection hole provided on the bottom of the plating water tank for stirring the vicinity of the surface of the object to be plated;
A plating solution circulation pump connected to suck the plating solution from the discharge port and to eject the plating solution from the ejection hole ;
A plurality of the ejection holes are provided in parallel to the object to be plated immediately below the plating surface of the object to be plated, and a plurality of the ejection holes are provided in parallel to the anode just below the surface of the anode on the object to be plated side. An electroplating tester characterized by comprising:
前記被めっき物の表面近傍を撹拌する撹拌手段をさらに備え、  A stirring means for stirring the vicinity of the surface of the object to be plated;
前記撹拌手段は、  The stirring means includes
前記被めっき物の表面近傍に上下方向に沿って配置された棒状部材と、  A rod-shaped member disposed along the vertical direction in the vicinity of the surface of the object to be plated;
前記めっき水槽の上方に水平方向にスライド自在に配置され、前記棒状部材の上端側を支持するスライドシャフトと、  A slide shaft that is slidably disposed in the horizontal direction above the plating water tank and supports the upper end side of the rod-shaped member;
前記スライドシャフトの一端側に設けられ、前記スライドシャフトと交差する方向に水平に延在する溝を有するフォロワーと、  A follower provided on one end of the slide shaft and having a groove extending horizontally in a direction intersecting the slide shaft;
水平方向に回転駆動する円盤と、  A disk that rotates in a horizontal direction;
前記円盤の外周部に立設され、前記溝に挿入されるローラーピンと、  A roller pin standing on the outer periphery of the disk and inserted into the groove;
前記円盤を回転駆動する回転駆動機構と、  A rotational drive mechanism for rotationally driving the disk;
を備えることを特徴とする請求項1に記載の電気めっき試験器。The electroplating tester according to claim 1, comprising:
JP2005256847A 2005-09-05 2005-09-05 Electroplating tester Expired - Lifetime JP4733477B2 (en)

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KR20200118864A (en) * 2018-03-13 2020-10-16 가부시키가이샤 야마모토메키시켄키 Plating device and plating system

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JP4673924B2 (en) 2007-05-01 2011-04-20 富士通株式会社 Electronics
US10697079B2 (en) 2015-12-25 2020-06-30 Yamamoto-Ms Co., Ltd. Plating device

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JPH02222190A (en) * 1989-02-22 1990-09-04 Fujitsu Ltd Electroplating device for printed board
JPH0570988A (en) * 1991-09-17 1993-03-23 Matsushita Electric Ind Co Ltd Plating apparatus for the whole surface
JP3386672B2 (en) * 1996-11-29 2003-03-17 株式会社東芝 Wafer plating equipment
JPH1192997A (en) * 1997-09-16 1999-04-06 Ebara Corp Method for filling liquid into minute hole, straight low melting point solder bump plating method and device therefor

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Publication number Priority date Publication date Assignee Title
KR20200118864A (en) * 2018-03-13 2020-10-16 가부시키가이샤 야마모토메키시켄키 Plating device and plating system
KR102373893B1 (en) 2018-03-13 2022-03-11 가부시키가이샤 야마모토메키시켄키 Plating equipment and plating system

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