JP4732834B2 - Circuit component and manufacturing method thereof - Google Patents

Description

  The present invention relates to a circuit component including an electric circuit member such as a semiconductor device provided in a motor or the like, and a method for manufacturing the circuit component.

Conventionally, a motor for a power window device or the like is provided with a circuit component including an electric circuit member such as a semiconductor device for controlling the rotation thereof. As such a circuit component, a holding member having a base member made of a resin material and a holding member side terminal exposed from the base member, a base portion made of a resin material fixed to the holding member, and the base member There is a semiconductor device including an electric circuit side terminal exposed from a base portion and connected to the holding member side terminal (see, for example, Patent Document 1). In this circuit component, the base member and the base portion are fixed by screws, and the semiconductor device is fixed to the holding member.
JP-A-8-33296

  However, in the circuit components as described above, the base member and the base portion are fixed with screws, which increases the number of components and, consequently, the manufacturing cost. Therefore, it is conceivable to bond the base member and the base portion with an adhesive. However, particularly when the linear expansion coefficients of the resin materials constituting the base member and the base portion are different, for example, when the base member and the base portion are deformed with different deformation amounts based on a temperature change due to heat generation of the semiconductor device, etc. In the case of bonding with an adhesive, there is a risk that a large stress is applied to the adhesive to cause cracks. Therefore, there is a concern about peeling of the semiconductor device (base part) from the holding member (base member) and a decrease in reliability of electrical connection between the holding member side terminal and the electric circuit side terminal.

  The present invention has been made in order to solve the above-described problems. The object of the present invention is to reduce the separation of the electric circuit member from the holding member while reducing the number of components, and to improve the electrical connection. An object of the present invention is to provide a circuit component and a method for manufacturing the same that can increase reliability.

According to the first aspect of the present invention, a holding member having a base member made of a resin material and a holding member side terminal exposed from the base member, and a base made of a resin material bonded to the holding member with an adhesive Part and an electric circuit member having an electric circuit side terminal exposed from the base portion and connected to the holding member side terminal, wherein the base member and the base portion have different linear expansion coefficients A terminal connection base is erected on a surface of the base member to which the base portion is bonded, and a mounting portion is erected adjacent to the terminal connection base. In the connection base, the holding member side terminal is disposed so as to be exposed on the terminal connection base, and the electric circuit side terminal is disposed on the terminal connection base. The member side terminal and the electric terminal The circuit-side terminal is connected, and the top surface of the mounting portion is an adhesive surface on the base member side to be bonded to the base portion, and a concave portion is formed on the adhesive surface on the base member side. Was formed to a position in contact with the terminal connection base .

According to a second aspect of the present invention, in the circuit component according to the first aspect, the base member is provided with the terminal connection bases on both outer sides of the base part to be bonded, and the terminal connection bases. Adjacent to each other, the above-described placement portions were provided .
According to a third aspect of the present invention, in the circuit component according to the second aspect, on the surface of the base member on the side to which the base portion is bonded, the mounting portion is provided adjacent to the terminal connection base. In addition, the second mounting portion is erected at the center of the surface to which the base portion is bonded, and the top surface of the second mounting portion is bonded to the base portion. A concave portion was formed on the adhesive surface on the base member side in the second placement portion.
According to a fourth aspect of the present invention, in the circuit component according to any one of the first to third aspects, the concave portion is formed at the center of the adhesive surface.

According to a fifth aspect of the present invention, a holding member having a base member made of a resin material and a holding member side terminal exposed from the base member, and a base made of a resin material bonded to the holding member with an adhesive And an electric circuit member having an electric circuit side terminal exposed from the base portion and connected to the holding member side terminal , wherein the base member and the base portion are made of resin materials having different linear expansion coefficients, A terminal connection base is erected on the surface of the base member to which the base portion is bonded, and a mounting portion is erected adjacent to the terminal connection base. A holding member side terminal is disposed so as to be exposed on the terminal connection base, and the electric circuit side terminal is disposed on the terminal connection base, and the holding member side terminal and the electric terminal are disposed on the terminal connection base. Circuit side terminal The top surface of the mounting portion is an adhesive surface on the base member side to be bonded to the base portion, and a concave portion is formed on the adhesive surface on the base member side, and the concave portion is connected to the terminal connection base. A method of manufacturing a circuit component formed up to a contact position , wherein the concave portion is formed on an adhesive surface on the base member side , and then the adhesive surface is filled with an adhesive so that the concave portion is filled with the adhesive. applied by bonding and the base member and the base part, then, welding the said electrical circuit side terminal and the retaining member side terminal in the terminal connection block.

(Function)
According to the invention described in the claims 1-4, since the base member and the base portion is adhered with an adhesive, it is possible to reduce the number of parts as compared with the case of using a screw or the like. And since the recessed part is formed in the adhesive surface by the side of the said base member , an adhesive agent will be hold | maintained in this recessed part, and the film thickness of an adhesive agent is compared with the part (a recessed part is not formed) in this part. ) Become thicker. Therefore, even if the base member or the base portion is deformed due to a temperature change or the like and stress is applied to the adhesive, the occurrence of cracks in the adhesive is reduced. As a result, peeling of the electric circuit member from the holding member is reduced, and reliability of electrical connection between the holding member side terminal and the electric circuit side terminal can be increased.

In addition , since the base member and the base part are made of resin materials having different linear expansion coefficients, cracks occur in the adhesive in circuit components in which the base member and the base part deform with different deformation amounts due to temperature changes. Is reduced.

According to invention of Claim 4 , since the said recessed part is formed in the center of an adhesive surface, the edge of an adhesive surface will be formed in frame shape, and it will become difficult to leak an adhesive agent from a recessed part. Therefore, the thickness of the adhesive can be stably increased.

According to the fifth aspect of the present invention, a concave portion is formed on the adhesive surface on the base member side , and then the adhesive is applied to the adhesive surface so that the concave portion is filled with the adhesive, and the base member and the base parts and are bonded, thereafter, the holding member side terminal and the electric circuit side terminals in the terminal connection block is welded. In this way, the number of parts can be reduced compared to the case where screws or the like are used. In addition, the adhesive is held in the recess, and the thickness of the adhesive becomes thicker in this portion (compared to the case where the recess is not formed). Therefore, even if the base member or the base portion is deformed due to a temperature change or the like and stress is applied to the adhesive, the occurrence of cracks in the adhesive is reduced. As a result, peeling of the electric circuit member from the holding member is reduced, and reliability of electrical connection between the holding member side terminal and the electric circuit side terminal can be increased.
In addition, since the base member and the base part are made of resin materials having different linear expansion coefficients, cracks occur in the adhesive in circuit components in which the base member and the base part deform with different deformation amounts due to temperature changes. Is reduced.

  According to the present invention, it is possible to provide a circuit component capable of reducing the separation of the electric circuit member from the holding member while reducing the number of components and increasing the reliability of the electrical connection, and a method for manufacturing the circuit component. be able to.

  Hereinafter, an embodiment in which the present invention is embodied in a motor 1 for a power window device in a vehicle will be described with reference to FIGS. As shown in FIG. 1, the motor 1 includes a motor main body 2 and a speed reducing unit 3 for decelerating and outputting the rotation of the motor main body 2.

  As shown in FIGS. 1 and 2, the motor main body 2 includes a yoke housing (hereinafter simply referred to as a yoke) 4 formed in a flat, substantially bottomed cylindrical shape, and a pair of magnets 5 fixed to the inner surface of the yoke 4. (See FIG. 2), an armature (armature) 6 that is rotatably supported in the yoke 4, a brush holder 7, and a pair of power supply brushes 8.

  The brush holder 7 is made of a resin material, and a holder body 7a, a flange portion 7b, an extension portion 7c, a connector portion 7d, and a terminal support portion 7e are integrally formed. The holder body 7 a is formed so as to be substantially accommodated in the opening of the yoke 4. A bearing 9 is fixed to the central hole of the holder body 7a, and the tip end side of the rotary shaft 10 of the armature 6 is rotatably supported by the bearing 9. The tip of the rotating shaft 10 protrudes to the outside of the yoke 4, and a sensor magnet 10a is fixed to the protruding portion via a metal plate. A power supply brush 8 is held on the inner side of the yoke 4 in the holder main body 7 a, and the power supply brush 8 is in press contact with a commutator 11 fixed to the rotating shaft 10.

  The flange portion 7b is extended to the holder body 7a in a flange shape (outward in the radial direction with the rotation shaft 10 as an axis center). The extending portion 7c is on one side (the right side in FIGS. 1 and 2) along the flat surface 4a of the yoke 4 in the flange portion 7b (see FIG. 1, in FIG. 1 and FIG. 2, a plane parallel to the paper surface). It is formed so as to protrude from the end portion in the external direction (outside in the radial direction), and a connector portion 7d is formed at the tip portion. The connector portion 7d is formed so that an external connector (not shown) can be fitted from the orthogonal direction of the flat surface 4a (the back side of the paper surface in the direction orthogonal to the paper surface in FIGS. 1 and 2). Further, the terminal support portion 7e is formed so as to extend in the axial direction along the rotation shaft 10 from the extension portion 7c.

  The brush holder 7 has a plurality of brush-side terminals 12 and connector-side terminals 13 embedded therein (insert molding). The brush-side terminal 12 extends from the inner side of the yoke 4 in the holder body 7a to the extension portion 7c, and the internal connection terminal 12a, which is the tip of the brush-side terminal 12, extends from the terminal support portion 7e in the axial direction of the motor body 2 (in FIG. Projected (exposed) downward (downward). The power supply brush 8 is electrically connected to the base end portion of the brush side terminal 12 through a pigtail. The connector-side terminal 13 extends from the connector portion 7d to the extending portion 7c, and the internal connection terminal 13a that is the tip thereof protrudes from the terminal support portion 7e in the axial direction of the motor body 2 (downward in FIG. 2) ( Exposed). The base end portion of the connector side terminal 13 is exposed at the connector portion 7d to form an external connection terminal 13b, and is electrically connected to the terminal of the external connector by fitting the external connector to the connector portion 7d. Will be. The internal connection terminals 12a and 13a are arranged side by side along the orthogonal direction of the flat surface 4a (in FIG. 2, the direction orthogonal to the paper surface). In FIG. 2, only one is shown because the internal connection terminals 12a and 13a are arranged side by side in the direction perpendicular to the paper surface. Further, in the brush holder 7, the flange portion 7b, the extending portion 7c, and the connector portion 7d are substantially covered with a waterproof member 14 made of an elastomer, except for portions corresponding to the external connection terminals 13b of the connector portion 7d.

  The speed reduction unit 3 includes a gear housing 21, a worm shaft 22, a worm wheel 23, a clutch 24 (see FIG. 2), a control circuit member 25 as a circuit component, and a cover 26.

The gear housing 21 is made of a resin material. The gear housing 21 includes a fixed portion 21a, a worm accommodating portion 21b, a wheel accommodating portion 21c, and a circuit accommodating portion 21d.
The fixing portion 21a is formed in a shape corresponding to the flange portion 4b formed in the opening of the yoke 4 and is fixed to the flange portion 4b and the screw 27, and the flange portion 7b of the brush holder 7 together with the flange portion 4b. (Via the waterproof member 14).

  The worm accommodating portion 21b is formed to extend in a cylindrical shape on the extension line of the rotary shaft 10, and supports the worm shaft 22 in a rotatable manner therein. A clutch 24 (see FIG. 2) for drivingly connecting the worm shaft 22 and the rotary shaft 10 is provided on the motor main body 2 side in the worm housing portion 21b. The clutch 24 operates to lock the rotation of the worm shaft 22 so that the driving force from the rotating shaft 10 is transmitted to the worm shaft 22 and conversely, the driving force from the worm shaft 22 is not transmitted to the rotating shaft 10. That is, the clutch 24 is provided to prevent the motor 1 from rotating due to the force applied from the load side.

  The wheel accommodating part 21c is formed in a flat disk shape in a direction orthogonal to the worm accommodating part 21b, and supports the worm wheel 23 rotatably therein. The worm accommodating portion 21b and the wheel accommodating portion 21c are partially communicated with each other, and the worm shaft 22 and the worm wheel 23 are engaged with each other at the communicating portion. The wheel accommodating portion 21c is formed on the opposite side (left side in FIG. 1) of the connector portion 7d (as the center) with respect to the worm accommodating portion 21b. Further, the flat surface 21e of the wheel accommodating portion 21c is formed along the flat surface 4a of the yoke 4, and the surface of the gear housing 21 as viewed from the direction orthogonal to the flat surface 21e is called the flat surface of the gear housing 21. It will be.

  The circuit accommodating part 21d is a position corresponding to the internal connection terminals 12a and 13a, and is formed such that the internal connection terminals 12a and 13a are disposed therein. Specifically, the circuit housing portion 21d is on the opposite side of the wheel housing portion 21c (as the center) with respect to the worm housing portion 21b, and between the worm housing portion 21b and the connector portion 7d (excluding the control circuit member 25). In the configuration, it is formed in a portion that becomes a dead space of the motor 1). The circuit housing portion 21d communicates with the motor body 2 side (the portion corresponding to the sensor magnet 10a) inside the worm housing portion 21b. In addition, an opening 21 f is formed in the circuit housing portion 21 d so that the control circuit member 25 can be inserted from the direction along the axial direction of the rotary shaft 10 in order to accommodate the control circuit member 25. The opening 21f is set so that the opening direction (direction orthogonal to the opening 21f) is inclined with respect to the axial direction of the rotating shaft 10 and the orthogonal direction. The opening portion 21f of the present embodiment is formed in an inclined straight line connecting the connector portion 7d and the tip side of the worm housing portion 21b (opposite side of the motor body 2) when viewed from the direction orthogonal to the flat surface of the gear housing 21. Has been. The internal connection terminals 12a and 13a of the brush side terminal 12 and the connector side terminal 13 are arranged at positions where they are exposed (visible) when viewed from the outside in the opening direction of the opening 21f. And the control circuit member 25 is substantially accommodated in the circuit accommodating part 21d.

  As shown in FIGS. 3 and 4, the control circuit member 25 includes a holding member 31, a mold IC 32 as an electric circuit member and a semiconductor device, a heat sink 33, a plurality of capacitors 34, a choke coil 35, a Hall IC 36, and LIN communication. The oscillator 37 is provided.

  The holding member 31 includes a base member 41 made of a resin material and a plurality of terminals 42 (insert-molded) disposed on the base member 41. Base member 41 of the present embodiment is made of PBT resin (polybutylene terephthalate). The base member 41 is a pair of a plate-like portion 41a having a substantially flat shape (flat plate shape) having a quadrangular shape, and a pair of flat-like portions 41a erected in a direction orthogonal to one flat surface 41b of the plate-like portion 41a from both longitudinal ends of the plate-like portion 41a. Terminal connection bases 41c and 41d are provided. Further, the base member 41 includes a sensor holding portion 41e extending from the one terminal connection base 41c along the longitudinal direction of the plate-like portion 41a (outward), and the longitudinal direction of the plate-like portion 41a from the other terminal connection base 41d. And an oscillator holding portion 41f extending along the direction (outward). In addition, the sensor holding part 41e of this Embodiment is formed through the step part 41g of 2 steps | paragraphs along the standing direction from the terminal connection base 41c.

  Further, as shown in FIGS. 3 and 4, in the plate-like portion 41a, one flat surface 41b is arranged along the standing direction of the terminal connection bases 41c and 41d (that is, the flat surface 41b of the plate-like portion 41a). A mounting portion 41h that is erected (in the orthogonal direction) is formed, and the top surface of the mounting portion 41h is an adhesive surface 41i on the base member 41 side. 4 shows the holding member 31 in a state where the mold IC 32 and the heat sink 33 are not fixed (manufacturing state). There are a plurality of mounting portions 41h on the flat surface 41b. In the present embodiment, the mounting portions 41h are formed at both ends in the longitudinal direction of the flat surface 41b and at the center in the longitudinal direction of the flat surface 41b. Further, the mounting portion 41h on the sensor holding portion 41e side (upper side in FIG. 4) of the present embodiment is formed up to the vicinity of both ends in the short side direction substantially along the short side direction on the flat surface 41b. In addition, the placement portion 41h on the opposite side (lower side in FIG. 4) of the sensor holding portion 41e of the present embodiment is formed in the vicinity of both ends in the lateral direction on the flat surface 41b. In addition, the center placement portion 41h in the present embodiment is formed in a substantially cylindrical shape at the center in the lateral direction of the flat surface 41b. Moreover, the recessed part 41j is formed in each adhesive surface 41i. The recess 41j of the present embodiment is formed at the center (only) of each bonding surface 41i. In other words, the recess 41j is formed in a portion excluding the edge so that the edge of each bonding surface 41i is formed in a frame shape. The concave portions 41j at both ends in the longitudinal direction of the flat surface 41b are formed such that the mounting portion 41h is formed adjacent to the terminal connection bases 41c and 41d, and the terminal connection bases 41c and 41d are frame-shaped (edges). It is formed to a position where it contacts the connection bases 41c and 41d.

  In addition, the pair of terminal connection bases 41c and 41d is formed with a restricting portion 41k that is erected so as to further protrude in a direction orthogonal to one flat surface 41b of the plate-like portion 41a. As shown in FIG. 4, the restricting portion 41k of the present embodiment is formed at four locations. Specifically, the restricting portion 41k is formed at both end portions in the short direction of the plate-like portion 41a in each of the terminal connection bases 41c and 41d. Further, the restricting portion 41k of the present embodiment has different terminal connection bases 41c and 41d side end portions (that is, the restricting portion 41k in the terminal connection stand 41c is an end portion on the terminal connection stand 41d side, The restricting portion 41k in 41d is formed at the end of the terminal connection base 41c.

In addition, a protective wall 41m is formed on the tip end portion (lower end portion in FIG. 3) of the oscillator holding portion 41f so as to protrude in a direction orthogonal to the other flat surface 41l of the plate-like portion 41a. Yes.
Each of the plurality of terminals 42 includes an IC connection portion 42a, a sensor connection portion 42b, an external connection portion 42c, and the like serving as holding member side terminals, each of which is provided so as to be partially exposed to the outside (of the base member 41). (See FIGS. 3 and 4). FIG. 4 shows the holding member 31 in a state before the plurality of IC connection portions 42a and sensor connection portions 42b (terminals 42) are divided (in the middle of manufacturing). The IC connection part 42a is disposed so as to be exposed on the terminal connection bases 41c and 41d. The plurality of IC connection portions 42a are disposed between the two restricting portions 41k on the terminal connection bases 41c and 41d. Further, the sensor connection portion 42b is disposed so as to be exposed on the sensor holding portion 41e. The external connection portion 42c protrudes from the other flat surface 41l of the plate-like portion 41a at a position corresponding to the internal connection terminals 12a and 13a of the brush side terminal 12 and the connector side terminal 13 (see FIG. 2). Established.

  The mold IC 32 has a base portion (package) 51 made of a substantially quadrangular (specifically rectangular) flat plate-like resin material on which a semiconductor element is mounted (embedded), and extends along the plane (longitudinal direction) of the base portion 51. A plurality of lead terminals 52 as electrical circuit side terminals electrically connected to the semiconductor element are drawn out to the outside in the above direction. Base portion 51 of the present embodiment is made of an epoxy resin. The mold IC 32 according to the present embodiment is provided with a plurality of inspection lead terminals 53. In addition, the motor 1 of the present embodiment does not include a relay as a drive circuit, and a semiconductor element mounted on the mold IC 32 includes a power MOSFET as a drive circuit. When the mold IC 32 determines that the vehicle window glass has been pinched according to the rotational speed of the sensor magnet 10a (rotary shaft 10) detected by the Hall IC 36, the power supply brush 8 (motor body 2). The anti-pinch control is performed such that a reverse rotation current is supplied to.

  The mold IC 32 is fixed to the holding member 31 from the direction perpendicular to the one flat surface 41b. Specifically, in the mold IC 32, an adhesive surface 51a on the mold IC 32 side, which is a part of one plane of the base portion 51, is adhered to an adhesive surface 41i (including the bottom surface of the recess 41j) on the holding member 31 side with an adhesive. The At this time, the adhesive is applied to the adhesive surface 41i so that the concave portion 41j is sufficiently filled. At this time, the plurality of lead terminals 52 are disposed between the two restricting portions 41k on the terminal connection bases 41c and 41d. Therefore, the positional deviation of the lead terminal 52 with respect to the terminal 42 (specifically, the IC connection portion 42a) is restricted. Specifically, even if the lead terminal 52 is displaced from the terminal 42 (specifically, the IC connection portion 42a), the displacement (movement) is restricted by the contact of the restricting portion 41k. And the front-end | tip part of the lead terminal 52 and the IC connection part 42a of the terminal 42 are connected and fixed by welding.

  Moreover, the heat sink 33 is formed in a substantially rectangular flat plate shape from an aluminum alloy. In order to dissipate the heat generated by the mold IC 32 (semiconductor element), the heat sink 33 has its flat surface abutting on the flat surface of the base portion 51 of the mold IC 32 (the flat surface opposite to the side facing the plate-like portion 41a). It is fixed (adhered).

  Further, as shown in FIG. 3, the capacitor 34 and the choke coil 35 are disposed on the other flat surface 41l of the plate-like portion 41a, and their terminals are connected to a terminal 42 embedded in the plate-like portion 41a. The connection is fixed by solder.

  Further, as shown in FIG. 3, the Hall IC 36 is disposed on the sensor holding portion 41e (on one flat surface 41b side), and its terminal is connected and fixed to the sensor connecting portion 42b of the terminal 42 by welding. The Hall IC 36 has two Hall elements (not shown) inside.

  Further, as shown in FIG. 3, the oscillator 37 for LIN communication is disposed on the oscillator holding portion 41f (on the other flat surface 41l side), and its terminal is embedded in the plate-like portion 41a. The terminal 42 is connected and fixed to the terminal 42 (shared with the IC connection portion 42a in this embodiment) by soldering. The oscillator 37 according to the present embodiment is disposed on the inside of the protective wall 41m (upper side in FIG. 3) on the oscillator holding portion 41f, and falls outside or is further disposed outside. Contact with is prevented.

  The control circuit member 25 configured as described above is partly opened from the opening 21f into the gear housing 21 (circuit housing portion 21d) in a state where the motor body 2 and the speed reduction unit 3 are assembled. It is assembled so as to protrude to the outside of 21f. At this time, the control circuit member 25 is inserted and assembled into the opening 21f from the direction along the rotation axis 10 in the armature 6. As a result of the assembly, the plurality of external connection portions 42c are electrically connected to the internal connection terminals 12a and 13a (the power supply brush 8 and the connector portion 7d) of the brush side terminal 12 and the connector side terminal 13, respectively. It is arranged to be connectable. The plurality of external connection portions 42c exposed when viewed from the outside in the opening direction of the opening 21f are welded and electrically connected to the internal connection terminals 12a and 13a, respectively.

A metal cover 26 is caulked and fixed to the opening 21f of the gear housing 21 so as to close the opening 21f in a state where the control circuit member 25 is assembled.
The motor 1 for a power window device configured as described above is disposed in a vehicle door, and an output shaft 23a (see FIG. 1) connected to a worm wheel 23 is connected to a vehicle window glass via a regulator (not shown). Is connected to the drive.

Next, characteristic effects of the above embodiment will be described below.
(1) Since the base member 41 of the holding member 31 and the base portion 51 of the mold IC 32 are bonded with an adhesive, the number of parts can be reduced compared to the case where screws or the like are used. And since the recessed part 41j is formed in the adhesion surface 41i in the base member 41 (holding member 31), an adhesive agent will be hold | maintained in this recessed part 41j, and the film thickness of an adhesive agent in this part (( It is thicker (compared to the case where the recess 41j is not formed). Therefore, even if the base member 41 and the base portion 51 are deformed due to a temperature change or the like and a stress is applied to the adhesive, the occurrence of cracks in the adhesive is reduced. As a result, peeling of the mold IC 32 from the holding member 31 is reduced, and the reliability of electrical connection between the IC connection portion 42a and the lead terminal 52 can be increased.

  (2) Since the base member 41 is made of PBT resin and the base portion 51 is made of epoxy resin, the base member 41 has a linear expansion coefficient larger than that of the base portion 51, and the base member 41 is more than the base portion 51 based on a temperature change. It will be deformed with a large amount of deformation. In the control circuit member 25 having a severe environment with respect to such an adhesive, occurrence of cracks in the adhesive is reduced.

  (3) The adhesive surface 41i on the base member 41 side is formed to protrude at a plurality of locations (on the standing mounting portion 41h), and the concave portion 41j is the center (only) of each adhesive surface 41i, in other words, each adhesive surface. Since it is formed in a portion excluding the edge of 41i, the edge of the bonding surface 41i is formed in a frame shape, and the adhesive is difficult to leak from the recess 41j. Therefore, the thickness of the adhesive can be stably increased.

  (4) Since the electric circuit member of the present embodiment is a mold IC 32 (semiconductor device) in which a semiconductor element is mounted on the base portion 51, heat is likely to be generated, and the base member 41 and the base portion are based on a temperature change caused by the heat generation. 51 is easily deformed. In the control circuit member 25 having a severe environment with respect to such an adhesive, occurrence of cracks in the adhesive is reduced.

The above embodiment may be modified as follows.
In the above embodiment, the concave portion 41j is formed on the adhesive surface 41i on the base member 41 (holding member 31) side, but the base member 41 (holding member 31) side and the base portion 51 (mold IC 32) side are provided. As long as a concave portion is formed on at least one of the bonding surfaces, the configuration may be changed to another configuration. In other words, the concave portion may be formed only on the bonding surface 51a on the base portion 51 (mold IC 32) side, or on the bonding surfaces 41i and 51a on the base member 41 (holding member 31) side and the base portion 51 (mold IC 32) side. You may form a recessed part, respectively.

  In the above embodiment, the base member 41 is made of PBT resin and the base portion 51 is made of epoxy resin. However, the present invention is not limited to this, and the base member 41 is made of another resin material having a different linear expansion coefficient. Alternatively, it may be changed to a resin material having the same linear expansion coefficient. Even when the linear expansion coefficient is made of the same resin material, when one side (for example, the mold IC 32 (semiconductor device) as in the present embodiment) is likely to generate heat, the base member and the base portion May be deformed with different deformation amounts. Even in such a case, occurrence of cracks in the adhesive is reduced.

  In the above-described embodiment, the adhesive surface 41i on the base member 41 (holding member 31) side is formed to protrude at a plurality of locations (on the standing mounting portion 41h), and the recess 41j has an edge of each adhesive surface 41i. Although it was formed in the part except this edge so that it might be formed in a frame shape, it is not limited to this and may be changed to a concave part of other shape (configuration). For example, you may form a recessed part so that the edge of each adhesion surface 41i may not be formed in a frame shape, ie, it may communicate with the exterior of the orthogonal direction of a recessed direction (it is groove shape). Even if it does in this way, since an adhesive agent is hold | maintained in a recessed part by surface tension etc., the film thickness of an adhesive agent will become thick in this part (as compared with the thing in which a recessed part is not formed).

In the above embodiment, the number and position of the bonding surfaces 41i on the base member 41 (holding member 31) side may be changed to other modes.
In the above embodiment, the electric circuit member is the mold IC 32 (semiconductor device) in which the semiconductor element is mounted on the base 51, but is not limited to this, and other electric elements in which other elements are mounted It may be changed to an electric circuit member. In such a case, of course, the shape and configuration of the electric circuit side terminal (lead terminal 52) and the holding member side terminal (IC connection part 42a) may be changed as appropriate.

  In the above embodiment, the control circuit member 25 includes the capacitor 34, the choke coil 35, the Hall IC 36, and the like, but the control circuit member as a circuit component that does not include them (for example, does not include the choke coil 35). The control circuit member (circuit component) including other components may be used.

  In the above embodiment, the motor 1 for the power window device is embodied. However, for example, the motor 1 may be embodied in a motor for other devices such as a sunroof device, a slide door device, a back door device, or the like. The present invention may be embodied in devices other than motors having circuit components.

The technical idea that can be grasped from the above embodiments will be described below together with the effects thereof.
(B) before SL base member is made of PBT resin, the base portion you characterized by comprising an epoxy resin. If it does in this way, a base member will have a larger linear expansion coefficient than a base part, and a base member will deform | transform with a bigger deformation amount than a base part based on a temperature change. In such a circuit component, occurrence of cracks in the adhesive is reduced.

(B) pre-Symbol electrical circuit member, you being a semiconductor device in which a semiconductor element is mounted on the base portion. In this case, since the electric circuit member is a semiconductor device in which a semiconductor element is mounted on the base portion, the electric circuit member easily generates heat, and the base member and the base portion are easily deformed based on a temperature change caused by the heat generation. In such a circuit component, occurrence of cracks in the adhesive is reduced.

The top view of the motor in this Embodiment. FIG. 2 is a partial cross-sectional view of a motor in the present embodiment. The top view of the control circuit member in this Embodiment. The left view of the holding member in this Embodiment.

Explanation of symbols

  25: Control circuit member (circuit component), 31: Holding member, 32 ... Mold IC (semiconductor device and electric circuit member), 41 ... Base member, 41i ... Adhesive surface, 41j ... Recess, 42a ... IC connection part, 51 ... Base part, 52 ... lead terminal (electric circuit side terminal).

Claims (5)

A holding member having a base member made of a resin material and a holding member side terminal exposed from the base member;
A circuit component comprising: a base portion made of a resin material bonded to the holding member with an adhesive; and an electric circuit member having an electric circuit side terminal exposed from the base portion and connected to the holding member side terminal. And
The base member and the base portion are made of resin materials having different linear expansion coefficients,
A terminal connection base is erected on the surface of the base member to which the base portion is bonded, and a placement portion is erected adjacent to the terminal connection base,
In the terminal connection base, the holding member side terminal is disposed so as to be exposed on the terminal connection base, and the electric circuit side terminal is disposed on the terminal connection base. The holding member side terminal and the electric circuit side terminal are connected,
The top surface of the mounting portion is an adhesive surface on the base member side to be bonded to the base portion, a concave portion is formed on the adhesive surface on the base member side, and the concave portion is in contact with the terminal connection base. Circuit parts characterized by being formed up to . The circuit component according to claim 1,
The circuit component, wherein the base member is provided with the terminal connection bases on both outer sides of the base part to be bonded, and the mounting part is provided adjacent to each terminal connection base. . The circuit component according to claim 2,
On the surface of the base member to which the base portion is bonded, the second mounting portion is bonded to the base portion in addition to the mounting portion provided adjacent to the terminal connection base. The top surface of the second mounting portion is an adhesive surface on the base member side to be bonded to the base portion, and the base member side of the second mounting portion is on the base member side. A circuit component characterized in that a concave portion is formed on an adhesive surface. The circuit component according to any one of claims 1 to 3 ,
The circuit component according to claim 1, wherein the recess is formed in the center of the adhesive surface. A holding member having a base member made of a resin material and a holding member side terminal exposed from the base member;
An electric circuit member having a base portion made of a resin material bonded to the holding member with an adhesive and an electric circuit side terminal exposed from the base portion and connected to the holding member side terminal ;
The base member and the base portion are made of resin materials having different linear expansion coefficients,
A terminal connection base is erected on the surface of the base member to which the base portion is bonded, and a placement portion is erected adjacent to the terminal connection base,
In the terminal connection base, the holding member side terminal is disposed so as to be exposed on the terminal connection base, and the electric circuit side terminal is disposed on the terminal connection base. The holding member side terminal and the electric circuit side terminal are connected,
The top surface of the mounting portion is an adhesive surface on the base member side to be bonded to the base portion, a concave portion is formed on the adhesive surface on the base member side, and the concave portion is in contact with the terminal connection base. A method of manufacturing a circuit component formed up to
Wherein a recess on the adhesive surface of the base member side,
Then, the base member and the base part are bonded by applying an adhesive to the adhesive surface so that the concave portion is filled with the adhesive,
Thereafter, the manufacturing method of the circuit components to be welded and the electric circuit terminals and the holding member side terminal in the terminal connection block.

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