JP4704267B2 - Vapor deposition source, vapor deposition equipment - Google Patents

Description

  The present invention relates to a vapor deposition apparatus, and in particular, a film forming apparatus suitable for diamond-like carbon (DLC), a semiconductor high dielectric thin film, an insulating film, a copper thin film, a magnetic thin film, and a refractory metal thin film.

  Conventionally, a vapor deposition apparatus has been used for forming diamond-like carbon (DLC), a semiconductor high dielectric thin film, an insulating film, a copper thin film, a magnetic thin film, a refractory metal thin film, or the like.

  Reference numeral 101 in FIG. 6 is an example of a conventional vapor deposition apparatus, and the vapor deposition apparatus 101 has a vacuum chamber 102. A vapor deposition source 103 is disposed inside the vacuum chamber 102.

  The vapor deposition source 103 includes a cylindrical anode electrode part 131 and a rod-shaped discharge part 130. The anode electrode part 131 and the discharge part 130 are respectively fixed to the bottom wall in the vacuum chamber 102 by the attachment part 132 in a state where the discharge part 130 is inserted through the anode electrode part 131.

  The discharge part 130 has a vapor deposition material part 135, a trigger electrode 137, and a rod-shaped electrode 140. The insulating member 134 is disposed on the mounting base 133 of the mounting portion 132, the trigger electrode 137 is disposed on the insulating member 134, and the vapor deposition material portion 135 is disposed on the trigger electrode 137 via the insulating washer 139. .

  The vapor deposition material part 135, the trigger electrode 137, the insulating member 134, and the insulating washer 139 are each formed in a ring shape, and the rod-shaped electrode 140 is inserted through the trigger electrode 137, the vapor deposition material part 135, the insulating member 134, and the insulating washer 139, respectively. In this state, the lower end is fixed to the attachment portion 132, and the upper end is covered with a cap 136 made of the same material as the vapor deposition material portion 135.

  The vapor deposition material portion 135 and the rod-shaped electrode 140 are electrically connected, while the trigger electrode 137 is insulated from the rod-shaped electrode 140 and the vapor deposition material portion 135. The rod-shaped electrode 140 and the trigger electrode 137 are connected to the trigger power source 125, and a negative voltage is applied to the rod-shaped electrode 140 with the anode electrode portion 131 and the vacuum chamber 102 connected to the ground potential, and the trigger electrode 137 is positively connected. Is applied, a trigger discharge occurs between the trigger electrode 137 and the vapor deposition material part 135, and the trigger discharge induces an arc discharge between the anode electrode part 131 and the vapor deposition material part 135, resulting in a large arc current. By flowing, the vapor deposition material particles are released from the vapor deposition material part 135.

  Among the particles of the vapor deposition material, giant charged particles and neutral particles having a small charged particle ratio go straight and collide with the wall surface of the anode electrode part 131, but charged particles having a large charge mass ratio are emitted from the opening of the anode electrode part 131. Then, it reaches the substrate 111 disposed in the vacuum chamber 102 and grows a thin film.

  By the way, when film formation is continued in the above-described vapor deposition apparatus 101, the insulating washer 139 between the trigger electrode 137 and the vapor deposition material part 135 is gradually soiled, and the insulation resistance thereof is lowered. When the insulation resistance between the trigger electrode 137 and the vapor deposition material part 135 is lowered, sufficient triggers (electrons and ions) are not generated, and arc discharge is not induced. As a result, film formation is stopped.

  For example, when iron (Fe) is used as the vapor deposition material of the vapor deposition material portion 135, arc discharge is not induced when the number exceeds 20000, and when hafnium (Hf) or molybdenum (Mo) is used as the vapor deposition material, 10000 When the firing is exceeded, arc discharge is not induced.

  Therefore, when a film having a large thickness is formed or when a plurality of substrates 111 are continuously formed, it is necessary to replace the discharge unit 130. Each time the discharge unit 130 is replaced, the inside of the vacuum chamber 102 is replaced. Is exposed to the atmosphere, so work efficiency is poor.

  For example, when a plurality of vapor deposition sources 103 are provided in one vacuum chamber 102 and the film formation efficiency of one vapor deposition source 103 decreases, the substrate holder 119 is moved onto another vapor deposition source 103 to perform film formation. Is possible. However, such a vapor deposition apparatus is large because a plurality of vapor deposition sources 103 are provided, and the manufacturing cost increases because the substrate holder 119 can be moved.

  A typical example of a vapor deposition source for solving the above-described problem is disclosed in Patent Document 1 below. This vapor deposition source has an anode electrode part and a discharge part arranged in the vicinity of the anode electrode part. The discharge portion is a rod-shaped electrode, a plurality of substantially cylindrical vapor deposition material portions, a plurality of substantially cylindrical trigger electrodes, and a substantially cylindrical trigger electrode and a substantially cylindrical vapor deposition material portion that are alternately arranged and inserted into these rod-shaped electrodes. An electrode, and a cap disposed at one end of the rod-shaped electrode. Insulating members are respectively disposed between the substantially cylindrical vapor deposition material portion and the substantially cylindrical trigger electrode.

  Each of the substantially cylindrical trigger electrodes is electrically insulated from the rod-shaped electrode and the cylindrical vapor deposition material part by these insulating members, and the substantially cylindrical vapor deposition material part is the Since the inner peripheral surface is in contact with the outer peripheral surface of the rod-shaped electrode, it is in electrical contact with the rod-shaped electrode. What contacts the cap in the cylindrical vapor deposition material portion is electrically connected to the rod-shaped electrode through the cap.

  However, in the vapor deposition source as described above, when the arc discharge is repeated, the cylindrical vapor deposition material part is deformed, thereby separating the outer peripheral surface of the rod-shaped electrode and the inner peripheral surface of the substantially cylindrical vapor deposition material part, Or the upper surface of a cap and a substantially cylindrical vapor deposition material part will space apart. FIG. 7 shows a state in which the cylindrical vapor deposition material portion 135 is deformed and is separated from both the outer peripheral surface of the rod-shaped electrode 140 and the outer peripheral surface of the cap 136. There is a risk that the arc discharge will stop.

The deformation of the vapor deposition material part 135 is because the temperature of the vapor deposition material part 135 rises due to arc discharge. In particular, when the vapor deposition material part 135 is made of a low melting point material, the arc discharge is likely to stop. For example, when the vapor deposition material part 135 is tin (melting point: 231 ° C.), the number of arc discharges is 200 to 300 on the condition that the capacitance of the capacitor is 2200 μF, the charging voltage is 100 V, and the arc discharge cycle is 1 Hz. Discharge stopped.
JP 2004-197176 A

  An object of the present invention is to provide a vapor deposition source that can be easily replaced and increase the number of arc discharges, and a vapor deposition apparatus using the vapor deposition source.

In order to solve the above-mentioned problem, the invention described in claim 1 includes a trigger electrode, an anode electrode insulated from the trigger electrode, a bar electrode, and a vapor deposition material part, and the vapor deposition material part and the bar shape The electrode is electrically connected, the vapor deposition material portion is ring-shaped, and is a vapor deposition source attached to the rod-shaped electrode and in contact with the rod-shaped electrode, wherein the rod-shaped electrode and the vapor deposition material portion are in contact with each other A male screw and a female screw are respectively formed on the surfaces to be processed, and the vapor deposition material portion and the rod-shaped electrode are screwed together.
A second aspect of the present invention is the vapor deposition source according to the first aspect, wherein a screwing depth H of the male screw and the female screw is in a range of 0.379 mm to 0.677 mm.
Invention of Claim 3 is a vapor deposition source of any one of Claim 1 or Claim 2, Comprising: As for the said rod-shaped electrode, any material of invar 42, inconel, stainless steel, tungsten, or tantalum is used. It is a vapor deposition source configured in a rod shape.
A fourth aspect of the present invention is the vapor deposition source according to any one of the first to third aspects, wherein the female screw is a vapor deposition source formed on a vapor deposition material included in the vapor deposition material portion.
Invention of Claim 5 is the vapor deposition source of any one of Claim 1 thru | or 3, Comprising: The said vapor deposition material part has a mounting member, The said internal thread is the vapor deposition formed in the said mounting member Is the source.
Invention of Claim 6 has a vacuum chamber and the vapor deposition source of any one of Claim 1 thru | or 5, so that vapor | steam of vapor deposition material can be discharge | released from the said vapor deposition material part in the said vacuum chamber. It is the vapor deposition apparatus comprised in this.

The present invention is configured as described above, and when a voltage is applied between the trigger electrode and the vapor deposition material while a voltage is applied between the anode electrode and the rod-shaped electrode, a trigger discharge is generated between the vapor deposition material and the trigger electrode. Will occur.
The vapor deposition material part has a vapor deposition material, and the vapor deposition material is exposed on the outer peripheral side surface of the ring of the vapor deposition material part.

  The vapor deposition material is exposed in the vicinity of the trigger electrode. Therefore, when trigger discharge occurs, vapor of the vapor deposition material is generated from the outer peripheral side surface of the vapor deposition material portion. When steam is generated by the trigger discharge, an arc discharge is generated between the anode electrode and the vapor deposition material part. Since the vapor deposition material portion has an outer peripheral side surface facing the anode electrode, and the vapor deposition material is exposed on the outer peripheral side surface, vapor of the vapor deposition material is generated by arc discharge.

  The vapor deposition material portion may be composed of a vapor deposition material or may have other members such as a mounting member in addition to the vapor deposition material. In any case, the vapor deposition material is present on the outer peripheral side surface of the ring of the vapor deposition material portion. When it is exposed and trigger discharge or arc discharge occurs, vapor of the vapor deposition material is generated from the outer peripheral side surface.

  Since the screw threads and the screw grooves are engaged with each other, even a slight deformation does not cause separation and electrical connection is maintained. Since the vapor deposition material portion and the rod-shaped electrode are only screwed, they can be easily removed and the vapor deposition material portion can be easily replaced.

  Reference numeral 3 in FIG. 1 is a vapor deposition source of the present invention, and reference numeral 1 is a vapor deposition apparatus of the present invention in which the vapor deposition source 3 is arranged in a vacuum chamber 2. The vapor deposition source 3 includes an anode electrode part 31 and a discharge part 30.

  The anode electrode portion 31 is a cylindrical metal plate such as a cylindrical shape or a polygonal cylindrical shape, and one opening is directed to the inside of the vacuum chamber, and the other opening is closely fixed to the bottom wall of the vacuum chamber 2. Yes. The anode electrode unit 31 and the vacuum chamber 2 are electrically connected. When the vacuum chamber 2 is connected to the ground potential, the anode electrode unit 31 is also placed at the ground potential.

  The discharge part 30 has a rod shape, and is fixed to the bottom wall of the vacuum chamber 2 by an attachment part 32 while being inserted through the anode electrode part 31. The mounting portion 32 is plate-shaped, and is attached to the bottom wall of the vacuum chamber 2 so that the surface faces the internal space of the vacuum chamber 2, and a columnar pedestal 33 is erected on the surface of the mounting portion 32. .

  The discharge part 30 has a vapor deposition material part 35, a trigger electrode 37, and a rod-like electrode 40. At the upper end of the pedestal 33, a ring-shaped insulating member 34, a trigger electrode 37, an insulating washer 39, a vapor deposition material portion 35, and a cap 36 are arranged in this order from the pedestal 33 side.

  A bottomed concave portion is formed on the surface of the pedestal 33 on the insulating member 34 side, and the insulating member 34, the trigger electrode 37, the insulating washer 39, and the vapor deposition material portion 35 have cavities with their central axes aligned. The cavity is connected to the internal space of the recess of the pedestal 33, and when a rod-shaped member is inserted into the cavity, the tip of the member is disposed in the recess.

  A female screw 42 is provided on the inner side of the ring of the vapor deposition material portion 35, that is, on the inner peripheral surface of the vapor deposition material portion 35, and a male screw 41 is provided on the outer peripheral surface of the rod-shaped electrode 40. When the rod-shaped electrode 40 is screwed into a cavity extending from the cap 36 to the recess of the pedestal 33 while rotating the rod-shaped electrode 40 so that these screws are screwed together, the tip of the rod-shaped electrode 40 is accommodated in the recess of the pedestal 33. .

  Here, a female screw is also provided on the inner peripheral surface of the recess of the pedestal 33, and is configured to be screwed with the male screw 41 at the lower end portion of the rod-like electrode 40. The pedestal 33 is fixed to the mounting portion 32, and the rod-like electrode 40 is fixed to the vacuum chamber 2 via the mounting portion 32 by being screwed and fixed to the pedestal 33.

  The outer peripheries of the insulating member 34, the trigger electrode 37, the insulating washer 39, and the vapor deposition material portion 35 have substantially the same diameter, and the insulating member 34, the trigger electrode 37, and the insulating washer 39 are fixed to each other in this order. The insulating member 34 is fixed to the pedestal 33, and thus the member from the pedestal 33 to the insulating washer 39 is fixed to the attachment portion 32.

  The upper end of the rod-shaped electrode 40 is formed in a flange shape, and when the vapor deposition material portion 35 is screwed and fixed to the rod-shaped electrode 40, the cap 36 is pressed by the flange portion, and the vapor deposition material portion 35 and the cap 36 are also attached portions. 32.

  The vapor deposition material part 35 and the rod-shaped electrode 40 are also electrically connected when the male screw 41 and the female screw 42 are screwed together. The trigger electrode 37 is insulated from the pedestal 33 and the vapor deposition material part 35 by an insulating member 34 and an insulating washer 39, respectively. Although an insulating member is not disposed between the trigger electrode 37 and the rod-shaped electrode 40, the insulating member is separated by a predetermined distance, and the insulating washer 39 has a voltage higher than the dielectric breakdown voltage of the space between the trigger electrode 37 and the rod-shaped electrode 40. Since the voltage at which creeping discharge is generated on the surface is small, the trigger discharge is generated between the trigger electrode 37 and the vapor deposition material portion 35 when a voltage is applied between the trigger electrode 37 and the rod-shaped electrode 40. .

  An arc power source 27 and a trigger power source 25 are disposed outside the vacuum chamber 2. The rod-shaped electrode 40 and the anode electrode portion 31 are connected to the arc power source 27, and the trigger electrode 37 and the rod-shaped electrode 40 are connected to the trigger power source 25.

  After operating the evacuation system 9 connected to the vacuum chamber 2 and evacuating the inside of the vacuum chamber 2, the substrate to be deposited is carried into the vacuum chamber while maintaining the vacuum atmosphere and placed in the vacuum chamber 2. The held substrate holder 19 is held.

Reference numeral 11 in FIG. 1 indicates the substrate held by the substrate holder 19.
The substrate 11 is positioned immediately above the vapor deposition source 3, and the film formation surface of the substrate 11 is directed to the vapor deposition source 3.

When the arc power supply 27 and the trigger power supply 25 are activated and the anode electrode unit 31 and the vacuum chamber 2 are connected to the ground potential, a negative voltage is applied to the rod electrode 40 and a positive voltage is applied to the trigger electrode 37. A trigger discharge occurs between the trigger electrode 37 and the vapor deposition material part 35, and an arc discharge is induced between the anode electrode part 31 and the vapor deposition material part 35 by the trigger discharge, and a large arc current flows.
Here, the vapor deposition material part 35 is comprised with the vapor deposition material which is a film-forming target substance, and when the arc current flows, the vapor deposition material particles are emitted from the vapor deposition material part 35.

  The tip of the cap 36 protrudes above the flange portion of the rod-shaped electrode 40, and the flange portion is surrounded by the inner peripheral side surface of the cap 36. Therefore, even if arc discharge occurs between the cap 36 and the anode electrode part 31, no arc discharge occurs between the flange part and the anode electrode part 31.

  The cap 36 is made of the same material as the vapor deposition material of the vapor deposition material portion 35. When arc discharge occurs between the cap 36 and the anode electrode portion 31, particles of the vapor deposition material are emitted. Eventually, only the particles of the vapor deposition material are released into the anode electrode portion 31.

  The arc power supply 27 is equipped with a capacitor unit (not shown), and the arc current is supplied by the discharge of the capacitor unit. Therefore, the arc current has a pulse waveform that is maintained only for the discharge time of the capacitor unit. Become.

  When a large arc current flows through the rod-shaped electrode 40, the arc current forms a magnetic field inside the anode electrode portion 31. Electrons are emitted into the vacuum chamber 2 from the opening of the anode electrode portion 31 by the Lorentz force by the magnetic field.

  Among the particles of the vapor deposition material emitted from the side surface of the vapor deposition material portion 35 toward the inner wall surface of the anode electrode portion 31, the minute charged particles having a large charge mass ratio (charge / mass) fly by the magnetic field formed by the arc current. Although the direction is bent, giant charged particles and neutral particles having a small charged particle ratio are less likely to be bent in the flight direction by the arc current, and adhere to the inner wall of the anode electrode portion 31.

  Charged particles having a large charge mass ratio are attracted to electrons and emitted from the opening of the anode electrode portion 31 as atomic ions or clusters. When the vapor reaches the substrate 11 held by the substrate holder 19, a thin film grows on the surface of the substrate 11. As described above, since only the minute charged particles having high reactivity are achieved on the substrate 11, a thin film with good film quality is formed on the surface of the substrate 11.

  As the number of arc discharges increases, the growth amount of the thin film increases. However, when the arc discharge is repeatedly performed, the vapor deposition material portion 35 is heated to thermally expand or soften, and its shape may be deformed.

  FIG. 2 shows a state after the vapor deposition material portion 35 is deformed. When the vapor deposition material part 35 is made of a low melting point material (for example, tin, melting point 231 ° C.), the degree of deformation is particularly large. However, as described above, the rod-shaped electrode 40 and the vapor deposition material part 35 of the present invention are externally threaded. 41 and female screw 42 are formed, and are closely adhered to each other. Therefore, even if the vapor deposition material portion 35 is deformed and separated from the cap 36, at least a part of the inner peripheral wall surface is adhered to the rod-shaped electrode 40. State is maintained. That is, since the state in which the vapor deposition material portion 35 is electrically connected to the rod-shaped electrode 40 is maintained, the arc discharge does not stop.

FIG. 3 is an enlarged view of a threaded portion between the vapor deposition material portion 35 and the rod-shaped electrode 40.
When the male screw 41 and the female screw 42 are screwed together, the vapor deposition material portion 35 is in close contact with the rod-shaped electrode 40, and even if the arc discharge is repeatedly induced and the vapor deposition material portion 35 is deformed, the rod-shaped electrode 40 and the vapor deposition material portion. The electrical connection between the vapor deposition material part 35 and the rod-shaped electrode 40 is maintained without being spaced apart from the electrode 35.

  The deeper the degree of screwing between the male screw 41 and the female screw 42, the easier it is to maintain the electrical connection. However, if the degree of screwing is too deep, there may be a disadvantage that it cannot be replaced with a slight deformation.

  FIG. 4 is an enlarged cross-sectional view further enlarging the portion where the male screw 41 and the female screw 42 are screwed together. The screwing depth H of the male screw 41 and the female screw 42 is changed to determine the number of times arc discharge can be generated and the arc discharge. It was investigated whether or not the rod-like electrode 40 that no longer occurred could be removed. The results are shown in Table 1 below.

  Table 1 above shows that when one screw thread of the male screw and the female screw is inserted into the other screw groove, the state immediately before the male screw side surface and the female screw side surface are in contact is defined as the screwing depth H = zero. The length in the direction perpendicular to the side surface of the cylinder C on which the thread is formed. That is, the screw thread tip portion A where the screw threads do not contact each other when screwed is not included in the screwing depth.

From Table 1 above, the screwing depth H is
0.379mm ≦ H ≦ 0.677mm
It can be seen that maintaining the electrical connection and detachability are both compatible with each other.

  If the bar electrode 40 is made of any one of Invar 42, Inconel, stainless steel, tungsten, or tantalum, the thermal expansion can be reduced, so that the bar electrode 40 can be easily replaced when the vapor deposition material portion 35 is replaced. Can be removed.

  Here, the invar 42 is a kind of nickel iron alloy, and the total content of Ni and Co is 41 wt% or more and 42 wt% or less, and a very small amount of Mn (0.1 wt% or more and 1.25 wt%). And the remainder is Fe.

  The above describes the case where the male screw 41 is formed on the entire outer peripheral surface of the rod-shaped electrode 40 and the male screw 41 is screwed to the female screw of the vapor deposition material portion 35 and the pedestal 33. However, the present invention is not limited to this. Instead, the male screw 41 may be provided only at least in a portion where the rod-shaped electrode 40 is screwed with the female screw 42 of the vapor deposition material portion 35.

  The settings of the trigger power supply 25 and the arc power supply 27 are not particularly limited, but an example thereof will be specifically described. A capacitor unit connected to the arc power supply 27 has four capacitors each having a capacity of 2200 μF (withstand voltage: 160 V) in parallel. It is connected to the. The trigger power source 25 is composed of a pulse transformer, and transforms a pulse voltage of 200 μs of μs by about 17 times and outputs 3.4 kV (several μA). The arc power supply 27 is a DC power supply having a capacity of 100 V and several A, and charges the 8800 μF capacitor unit. Since charging time is required for about 1 second, in this system, the cycle when discharging is repeated at 8800 μF is performed at 1 Hz.

  When vapor deposition was performed using the vapor deposition material part 35 made of tin under these conditions, it was confirmed that the arc discharge was stably continued for 5000 or more shots in the vapor deposition apparatus 1 of the present invention.

  Although the above has described the case where the vapor deposition material portion 35 is formed of a vapor deposition material, the present invention is not limited to this. Reference numeral 55 in FIG. 5 shows another example of the vapor deposition material portion used in the present invention. The vapor deposition material portion 55 includes, in addition to the vapor deposition material 56, a mounting member 57 made of a material different from the vapor deposition material 56. have.

  The vapor deposition material 56 has a ring shape, and the mounting member 57 has a ring shape whose outer periphery is substantially the same size as the inner periphery of the ring of the vapor deposition material 56. It arrange | positions inside the vapor deposition material 56 so that it may contact | adhere. Therefore, the overall shape of the vapor deposition material portion 55 is also a ring shape.

  The female screw 52 is formed on the inner peripheral side surface of the mounting member 57. Accordingly, the female screw 52 is located on the inner peripheral surface of the ring of the vapor deposition material portion 55, and the vapor deposition material portion 55 is easily exchanged by the female screw 52 in the same manner as the vapor deposition material portion 35 shown in FIG.

  The mounting member 57 is made of a conductive material and is in electrical contact with the vapor deposition material 56 by being in close contact with the vapor deposition material 56. Therefore, when the female screw 52 is screwed with the male screw 41 of the rod electrode 40, the mounting member 57 is mounted. The vapor deposition material 56 is electrically connected to the rod-shaped electrode 40 through the member 57.

  Also in this vapor deposition material portion 55, since the female screw 52 and the male screw 41 are screwed together, the vapor deposition material portion 55 and the rod-shaped electrode 40 are in close contact with each other. Electrical connection with the electrode 40 is maintained.

  If the mounting member 57 is made of a material having a high thermal expansion coefficient or a low melting point material having a melting point of 700 ° C. or lower, the mounting member 57 is deformed together when the vapor deposition material 56 is deformed. Is maintained in close contact.

Sectional drawing explaining the vapor deposition apparatus of this invention Enlarged cross-sectional view of a deposition source with deformed deposition materials Enlarged cross-sectional view of the threaded part of the male screw and female screw An enlarged cross-sectional view further enlarging the threaded portion Sectional drawing explaining the other example of vapor deposition material Sectional drawing explaining the vapor deposition apparatus of a prior art Enlarged cross-sectional view of a prior art vapor deposition source with deformed vapor deposition material

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Deposition apparatus 2 ... Vacuum chamber 3 ... Deposition source 31 ... Anode electrode part 35 ... Deposition material 37 ... Trigger electrode 40 ... Rod-shaped electrode 41 ... Male screw 42 ... Female screw

Claims (6)

A trigger electrode;
An anode electrode insulated from the trigger electrode, a rod-shaped electrode, and a vapor deposition material portion;
The vapor deposition material part and the rod-shaped electrode are electrically connected,
The vapor deposition material part is ring-shaped, and is a vapor deposition source attached to the rod-shaped electrode and in contact with the rod-shaped electrode,
A vapor deposition source in which a male screw and a female screw are formed on the surface where the rod-shaped electrode and the vapor deposition material portion are in contact with each other, and the vapor deposition material portion and the rod-shaped electrode are screwed together.
  The vapor deposition source according to claim 1, wherein a screwing depth H of the male screw and the female screw is in a range of 0.379 mm to 0.677 mm.   The vapor deposition source according to any one of claims 1 and 2, wherein the rod-shaped electrode is configured by forming any one of Invar 42, Inconel, stainless steel, tungsten, or tantalum into a rod shape.   The vapor deposition source according to any one of claims 1 to 3, wherein the female screw is formed in a vapor deposition material included in the vapor deposition material portion. The vapor deposition material part has a mounting member,
The vapor deposition source according to claim 1, wherein the female screw is formed on the mounting member.   A vapor deposition apparatus having a vacuum chamber and the vapor deposition source according to any one of claims 1 to 5 and configured to discharge vapor of the vapor deposition material from the vapor deposition material portion into the vacuum chamber.

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