JP4700441B2 - Method for manufacturing opening body having oblique through hole - Google Patents
Method for manufacturing opening body having oblique through hole Download PDFInfo
- Publication number
- JP4700441B2 JP4700441B2 JP2005248228A JP2005248228A JP4700441B2 JP 4700441 B2 JP4700441 B2 JP 4700441B2 JP 2005248228 A JP2005248228 A JP 2005248228A JP 2005248228 A JP2005248228 A JP 2005248228A JP 4700441 B2 JP4700441 B2 JP 4700441B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- turntable
- central axis
- line
- drilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Drying Of Semiconductors (AREA)
Description
本発明は、斜め貫通孔を有する開口体、例えば、半導体素子の製造過程におけるアッシング装置やエッチング装置などのプラズマ生成用の電極である斜め貫通孔を有する開口体の製造方法に関する。 The present invention relates to a method for manufacturing an opening having an oblique through hole, for example, an opening having an oblique through hole which is an electrode for plasma generation in an ashing apparatus or an etching apparatus in the process of manufacturing a semiconductor element.
プラズマエッチング装置などの反応容器内の雰囲気を均一にするためには、開口体の貫通孔の配置は、開口体面に均一に設けなければならず、開口体の中心軸に対して対称に貫通孔が配置されるようにXY軸方向に動くテーブル上に石英ガラス円盤等のワークを固定し、Z軸方向に上下動するドリルで貫通孔を形成していた。 In order to make the atmosphere in the reaction vessel such as a plasma etching apparatus uniform, the arrangement of the through holes in the opening must be provided uniformly on the surface of the opening, and the through holes are symmetrical with respect to the central axis of the opening. A workpiece such as a quartz glass disk is fixed on a table that moves in the X and Y axis directions, and a through hole is formed with a drill that moves up and down in the Z axis direction.
ワークをテーブル上に傾斜させることで斜めの貫通孔を盤体に形成することは可能であるが、複数の貫通孔を盤体の中心軸に対して線対称となるように形成することが困難であった。
本発明は、開口体に、その中心軸を中心とする同心円上に、中心軸に対して傾斜が軸対称となる貫通孔を簡単に形成できるようにするものである。 The present invention makes it possible to easily form a through-hole whose inclination is axisymmetric with respect to the central axis on the concentric circle centered on the central axis.
素材の盤体を傾斜したターンテーブル上に設置し、ターンテーブルをその中心軸に対して回転させて穿孔位置を決定し、同心円上に垂直方向から穿孔することによって中心軸に対して線対称に傾斜した貫通孔を形成するものである。 The material body is placed on a tilted turntable, the turntable is rotated with respect to its central axis, the drilling position is determined, and the drilling is performed vertically on a concentric circle so that it is symmetrical with respect to the central axis. An inclined through hole is formed.
傾斜したターンテーブルの上に設置し、ターンテーブルを回転させて位置決めし、盤体に垂直方向から穿孔するので、形成された貫通孔は同心円上にあり、その傾斜方向は中心軸に対して線対称となる。
傾斜ターンテーブル上での穿孔位置を適宜に選択することによって、任意な方向性を持たせた貫通孔を有する開口体を形成することができる。
また、貫通孔の傾斜角度、傾斜方向を任意に組み合わせることが容易であり、種々の目的に応じた開口体を製造することができる。
It is installed on an inclined turntable, rotated and positioned, and drilled from the vertical direction in the disc body, so the formed through holes are concentric, and the inclined direction is a line with respect to the central axis. It becomes symmetric.
By appropriately selecting the drilling position on the inclined turntable, it is possible to form an opening having a through hole having an arbitrary directionality.
Moreover, it is easy to arbitrarily combine the inclination angle and the inclination direction of the through hole, and it is possible to manufacture an opening body according to various purposes.
図1は、盤体に傾斜貫通孔を中心軸Cに対して線対称に形成するための加工装置の概念図を示したものであり、XY軸方向に移動可能であるとともに傾斜可能なターンテーブル5とXY平面に垂直なZ軸方向の穿孔装置6からなるものであり、傾斜角をθで示している。
開口体2に形成される貫通孔の傾斜角度に等しく傾斜させたターンテーブル5の回転中心軸Cと開口体2の素材の中心を合致させてセットし、中心軸Cから適宜の距離に穿孔装置6が位置するようにターンテーブルを移動させて位置決めし、穿孔して図2の断面図に示すように傾斜した貫通孔21を形成する。次にターンテーブル5を所定の角度回転して穿孔することによって図3のように円周上に配列された貫通孔21が形成される。
FIG. 1 is a conceptual diagram of a machining apparatus for forming a tilted through hole in a disc body in line symmetry with respect to a central axis C, and is a turntable that can move in the XY axis direction and can be tilted. 5 and a punching device 6 in the Z-axis direction perpendicular to the XY plane, and the inclination angle is indicated by θ.
The rotation center axis C of the turntable 5 inclined equal to the inclination angle of the through-hole formed in the opening 2 is set so that the center of the material of the opening 2 matches, and a punching device is set at an appropriate distance from the center axis C. The turntable is moved and positioned so that 6 is positioned, and drilled to form a through hole 21 inclined as shown in the sectional view of FIG. Next, the turntable 5 is rotated by a predetermined angle and drilled to form through holes 21 arranged on the circumference as shown in FIG.
ターンテーブル5の移動によって穿孔装置6の位置を最初の位置より中心軸から離れた位置に位置決めし、同様に穿孔することによって、最初に形成された貫通孔21の同心円上に貫通孔が形成される。
従って、盤体に設けた貫通孔の角度は、ターンテーブルの基準平面(X’−Y’平面)と加工機の水平基準面(X−Y平面)の垂線とからなる角度となり、貫通孔の内外面の開口部同士が2次元的に重なり合わないように、開口体の厚さに応じて任意の角度として貫通孔の開口部を任意にずらすことが可能となる。
穿孔装置6の固定位置を適宜に選択することによって、貫通孔21の傾斜方向を決めることができるとともに、形成された貫通孔21は常に中心軸に対して線対称となる。
By moving the turntable 5, the position of the drilling device 6 is positioned at a position farther from the central axis than the initial position, and by similarly drilling, a through hole is formed on a concentric circle of the first through hole 21 formed. The
Therefore, the angle of the through hole provided in the board is an angle formed by the reference plane (X′-Y ′ plane) of the turntable and the perpendicular of the horizontal reference plane (XY plane) of the processing machine. It is possible to arbitrarily shift the opening of the through hole at an arbitrary angle according to the thickness of the opening so that the openings on the inner and outer surfaces do not overlap two-dimensionally.
By appropriately selecting the fixing position of the drilling device 6, the inclination direction of the through hole 21 can be determined, and the formed through hole 21 is always line-symmetric with respect to the central axis.
貫通孔21の傾斜方向については、傾斜ターンテーブル5の最上点Aと最下点Bを結ぶ線L1と中心軸Cを通りL1に直行する線L2で区画される領域によって決まる。図4及び図5に示すように、L1上で中心軸CよりR1の距離の上側領域で垂直方向に貫通孔21を穿孔すると、貫通孔21はターンテーブル5の傾斜角(θ)と等しい傾斜孔となり、その穿孔方向の延長線は、矢印で示す回転中心軸Cに向かうものとなり、ターンテーブル5を一定角度回転して穿孔していくと、貫通孔21は逆向きの円錐形の一部を形成するものとなる。中心軸Cからの距離R2の位置に穿孔装置を移動させて穿孔すると、同じ向きの貫通孔21が同心円に形成され、図2に示す断面形状の開口体2が得られる。 The inclination direction of the through-hole 21 is determined by a region defined by a line L1 connecting the uppermost point A and the lowermost point B of the inclined turntable 5 and a line L2 passing through the central axis C and perpendicular to L1. As shown in FIGS. 4 and 5, when the through-hole 21 is drilled in the vertical direction in the upper region at a distance of R1 from the central axis C on L1, the through-hole 21 is inclined equal to the inclination angle (θ) of the turntable 5. An extension line in the drilling direction is directed to the rotation center axis C indicated by the arrow, and when the turntable 5 is drilled by rotating at a certain angle, the through-hole 21 is a part of a reverse conical shape. Will be formed. When the piercing device is moved to a position at a distance R2 from the central axis C and piercing is performed, the through holes 21 having the same direction are formed concentrically, and the opening body 2 having the cross-sectional shape shown in FIG. 2 is obtained.
図5において、L1上で中心軸Cより下側の領域で垂直方向に貫通孔21を穿孔すると、貫通孔21はターンテーブル5の傾斜角(θ)と等しい傾斜孔となり、その延長線は中心軸Cから離れるが、上方への延長線は中心軸Cに向かうものとなり、ターンテーブル5を一定角度回転して円周上に穿孔していくと、貫通孔21は円錐形の一部を形成するものとなる。穿孔位置を同心円上で変えることにより、図6に示すように、穿孔方向が中心軸Cに向かうものと離れるものとが混在した開口体2を形成することができる。 In FIG. 5, when the through hole 21 is vertically drilled in the region below the central axis C on L1, the through hole 21 becomes an inclined hole equal to the inclination angle (θ) of the turntable 5, and the extension line is the center. Although it is away from the axis C, the upward extension line is directed toward the central axis C. When the turntable 5 is rotated by a certain angle and drilled on the circumference, the through hole 21 forms a part of a conical shape. To be. By changing the drilling positions on concentric circles, as shown in FIG. 6, it is possible to form the opening 2 in which the drilling direction is toward the central axis C and the drilling direction is mixed.
穿孔位置を線L1からはずし、線L2より上方の領域で垂直方向に穿孔すると、貫通孔21の延長線は中心軸Cとは交差せずにねじれの位置関係となるので、貫通孔21は中心軸を巻く形状に形成される。また、線L2より下方の領域で穿孔すると、形成された貫通孔21は、中心軸Cから離れる方向に向かうものとなる。
線L2の上で穿孔した場合、貫通孔21は平面視では、円の接線方向に向かうものとなる。
When the drilling position is removed from the line L1 and drilled in the vertical direction in the region above the line L2, the extension line of the through hole 21 does not intersect the central axis C and becomes a twisted positional relationship. It is formed in the shape of winding a shaft. Further, when the hole is drilled in the region below the line L2, the formed through hole 21 is directed away from the central axis C.
When drilled on the line L2, the through-hole 21 is directed in the tangential direction of the circle in plan view.
従って、穿孔位置を線L1上からはずした場合の貫通孔21の傾斜方向については、渦流の巻き込み方向、巻き込み角度といえ、同心円上に加工された貫通孔21の中心軸Cがターンテーブル5の基準平面(X’−Y’平面)に投影してできる線と、基準平面上の同心円の接線からなる角度となり、同一円周上に開けた穿孔位置が線L1より遠ざかるにつれて、より緩やかな巻き込み角度を持ったものとなる。
ターンテーブル5の回転により穿孔した線対称に配置された貫通孔の投影図を図7に示す。図7の(a)は、図4のa点の位置でターンテーブルの回転(90度毎に穿孔:1回転)により線対称に開けた貫通孔21の投影図である。矢印は貫通孔21の向きを表わしている。図7の(b)は、図4のb点で穿孔し、ターンテーブル5の回転で線対称に開けた貫通孔21の投影図、図7の(c)は、図4のc点での貫通孔の投影図である。
このように穿孔位置を傾斜ターンテーブルの最下点と最上点を結ぶ線L1上以外の位置とした場合は、開口体を通過したガスは、中心軸の周りの渦流となり、線L1上に穿孔した場合は、中心軸に向かう或いは遠ざかるガス流となる。
Accordingly, the inclination direction of the through-hole 21 when the drilling position is removed from the line L1 can be said to be the vortex entrainment direction and the entrainment angle, and the central axis C of the through-hole 21 processed concentrically is the turntable 5 The angle formed by the line formed by projecting on the reference plane (X′-Y ′ plane) and the tangent of the concentric circle on the reference plane becomes more gradual as the drilling position opened on the same circumference moves away from the line L1. It will have an angle.
FIG. 7 shows a projected view of the through-holes arranged in line symmetry that are perforated by the rotation of the turntable 5. FIG. 7A is a projection view of the through hole 21 opened in line symmetry by rotation of the turntable (perforation every 90 degrees: one rotation) at the position of point a in FIG. The arrow represents the direction of the through hole 21. 7B is a projection view of the through-hole 21 drilled at the point b in FIG. 4 and opened in line symmetry by the rotation of the turntable 5, and FIG. 7C is a view at the point c in FIG. It is a projection figure of a through-hole.
In this way, when the drilling position is set to a position other than the line L1 connecting the lowest point and the highest point of the inclined turntable, the gas that has passed through the opening body becomes a vortex around the central axis and is drilled on the line L1. In this case, the gas flow is directed toward or away from the central axis.
各同心円毎に穿孔位置を任意に選択して、貫通孔の傾斜方向を任意に組み合わせることができるので、傾斜した貫通孔を目的に応じて簡単に穿孔することができる。 Since the drilling position can be arbitrarily selected for each concentric circle and the inclination directions of the through holes can be arbitrarily combined, the inclined through holes can be easily drilled according to the purpose.
図8(1)に示す写真は、φ50mm×6mmの石英ガラス円盤を10、20、30度の傾斜角に傾斜させたターンテーブル上に設置し、ターンテーブルの中心からの同心円上に、レーザー加工でφ0.2mmの貫通孔を形成したものの断面写真である。
図8(2)は、φ50mm×6mmのシリコン円盤をダイヤモンドドリルを用いてφ0.5mmの貫通孔を形成したものの断面写真である。
The photograph shown in Fig. 8 (1) shows a φ50mm x 6mm quartz glass disk placed on a turntable tilted at an inclination angle of 10, 20, and 30 degrees, and laser processed on a concentric circle from the center of the turntable. It is a cross-sectional photograph of what formed the through-hole of φ0.2mm.
FIG. 8 (2) is a cross-sectional photograph of a φ50 mm × 6 mm silicon disk formed with a φ0.5 mm through hole using a diamond drill.
1 プラズマエッチング装置
2 開口体(電極)
21 貫通孔
3 保持用リング
4 ウエーハ
5 ターンテーブル
6 穿孔装置
DESCRIPTION OF SYMBOLS 1 Plasma etching apparatus 2 Opening body (electrode)
21 Through-hole 3 Holding ring 4 Wafer 5 Turntable 6 Punching device
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005248228A JP4700441B2 (en) | 2005-08-29 | 2005-08-29 | Method for manufacturing opening body having oblique through hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005248228A JP4700441B2 (en) | 2005-08-29 | 2005-08-29 | Method for manufacturing opening body having oblique through hole |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007067005A JP2007067005A (en) | 2007-03-15 |
JP4700441B2 true JP4700441B2 (en) | 2011-06-15 |
Family
ID=37928881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005248228A Expired - Fee Related JP4700441B2 (en) | 2005-08-29 | 2005-08-29 | Method for manufacturing opening body having oblique through hole |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4700441B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9184028B2 (en) * | 2010-08-04 | 2015-11-10 | Lam Research Corporation | Dual plasma volume processing apparatus for neutral/ion flux control |
US8869742B2 (en) | 2010-08-04 | 2014-10-28 | Lam Research Corporation | Plasma processing chamber with dual axial gas injection and exhaust |
JP5908001B2 (en) * | 2014-01-16 | 2016-04-26 | 東京エレクトロン株式会社 | Substrate processing equipment |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1050678A (en) * | 1996-08-02 | 1998-02-20 | Ibiden Co Ltd | Electrode plate for plasma etching |
JP2005059107A (en) * | 2003-08-13 | 2005-03-10 | Arase:Kk | Drilling tool for diagonal hole and drilling tool unit for diagonal hole |
-
2005
- 2005-08-29 JP JP2005248228A patent/JP4700441B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1050678A (en) * | 1996-08-02 | 1998-02-20 | Ibiden Co Ltd | Electrode plate for plasma etching |
JP2005059107A (en) * | 2003-08-13 | 2005-03-10 | Arase:Kk | Drilling tool for diagonal hole and drilling tool unit for diagonal hole |
Also Published As
Publication number | Publication date |
---|---|
JP2007067005A (en) | 2007-03-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4700441B2 (en) | Method for manufacturing opening body having oblique through hole | |
JP2749516B2 (en) | Electrode for plasma-assisted chemical etching and method of using the same | |
JP4312001B2 (en) | Substrate support device and substrate removal method | |
JP5466820B2 (en) | Semiconductor substrate and method for manufacturing semiconductor device | |
KR100862912B1 (en) | Device for processing substrate | |
JP2010016146A (en) | Chuck table of processing apparatus | |
JP6612985B2 (en) | Sample holder | |
JP5016523B2 (en) | Vacuum chuck | |
WO2012050057A1 (en) | Template and substrate treatment method | |
JP2017135331A (en) | Substrate holding device | |
KR200405748Y1 (en) | Vacuum chuck of dual industrial structure that use porous silicon | |
JP2008311297A (en) | Electrode plate for plasma treatment apparatus, manufacturing method thereof, and plasma treatment apparatus | |
JP6870968B2 (en) | Manufacturing method of microelectrode body | |
JP2012119590A (en) | Electrode plate for plasma processing apparatus | |
JP2007229831A (en) | Cutting method by dicing blade | |
KR20210081003A (en) | Jig for drilling inclined hole of nozzle | |
JP2021077781A (en) | Chuck table and method for manufacturing chuck table | |
TW202025360A (en) | Substrate processing apparatus and substrate processing mehtod | |
JP5000147B2 (en) | Drilling tool for ultrasonic machine | |
JP2022031208A (en) | Device for processing substrate using processing gas | |
JP7118030B2 (en) | VACUUM CHUCK AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | |
JP2007214317A (en) | Ball-mounted mask, manufacturing method thereof, and method of forming solder bump employing the same | |
JP5501129B2 (en) | Method for forming container | |
JP6364388B2 (en) | Semiconductor manufacturing apparatus and semiconductor device manufacturing method | |
JP2005125357A (en) | Laser beam machining method and laser beam machining apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080805 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20101019 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101026 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101221 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110222 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110304 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4700441 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |