JP4699019B2 - Manufacturing method of film-forming molded product - Google Patents

Manufacturing method of film-forming molded product Download PDF

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JP4699019B2
JP4699019B2 JP2004362983A JP2004362983A JP4699019B2 JP 4699019 B2 JP4699019 B2 JP 4699019B2 JP 2004362983 A JP2004362983 A JP 2004362983A JP 2004362983 A JP2004362983 A JP 2004362983A JP 4699019 B2 JP4699019 B2 JP 4699019B2
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JP2006168160A (en
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隆男 梅澤
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Mitsuba Corp
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本発明は、成膜部分を樹脂材でサンドイッチ状に積層した成膜成型品の製造方法の技術分野に属するものである。   The present invention belongs to the technical field of a method for manufacturing a film-forming molded product in which film-forming portions are laminated in a sandwich with a resin material.

一般に、この種成膜成型品のなかには、例えば、車両用のエンブレム等の部材ように、部材表面に着色効果や反射効果等の効果を有する素材で被覆して、意匠性を高めたものがあり、この製造方法として、例えば、部材表面を装飾クロム鍍金皮膜で被覆して形成したものがある(例えば、特許文献1参照。)。
ところで今日、鍍金に使用する六価クロムは人体に有害な物質であって、環境汚染による公害問題を発生することから規制の対象ともなっており、脱クロムが要求されている。
この改善策として、基材表面に真空蒸着やスパッタリング等の成膜装置で成膜を形成し、さらに、該成膜の表面を樹脂材で被覆したものがある(例えば、特許文献2参照。)。
特開平6−146069号公報 特開平6−169191号公報
In general, some of these types of film-formation molded products have an improved design by covering the surface of the member with a material having an effect such as a coloring effect or a reflection effect, such as a member such as an emblem for a vehicle. As this manufacturing method, for example, there is a method in which the surface of a member is formed by coating with a decorative chrome plating film (see, for example, Patent Document 1).
Nowadays, hexavalent chromium used for plating is a substance harmful to the human body, and since it causes pollution problems due to environmental pollution, it is subject to regulation and dechromation is required.
As an improvement measure, there is one in which a film is formed on a substrate surface by a film forming apparatus such as vacuum deposition or sputtering, and the surface of the film is covered with a resin material (for example, refer to Patent Document 2). .
Japanese Patent Laid-Open No. 6-146069 JP-A-6-169191

ところがこのようなものは、射出成形した基材を射出成形装置から取り出した後、真空蒸着装置にセットして成膜し、しかる後、成膜した基材を真空蒸着装置から取り出した後、射出成形装置にセットして成膜面に樹脂材を射出成形することになって工程数も多く、手間がかかり、作業能率が悪いだけでなく、取り出し工程、セット工程、装置から装置への搬送工程の際に被成膜面、さらには成膜面に傷や埃がついたり手が触れて油が付着してしまうようなことがあり、これらが原因で所期の成膜製品ができず不良品が発生し歩留まりが悪いという問題があり、ここらに本発明が解決せんとする課題がある。   However, in such a case, after the injection-molded base material is taken out from the injection molding apparatus, it is set in a vacuum vapor deposition apparatus to form a film, and then the film-formed base material is taken out from the vacuum vapor deposition apparatus and then injected. The number of processes is increased because it is set on the molding machine and injection molding of the resin material on the film forming surface is troublesome, and the work efficiency is not only poor. At this time, the film-forming surface, as well as the film-forming surface, may be scratched, dusty, or touched and the oil may adhere to it. There is a problem that non-defective products are produced and the yield is low, and there is a problem that the present invention does not solve.

本発明は、上記の如き実情に鑑みこれらの課題を解決することを目的として創作されたものであって、請求項1の発明は、金型面同志の対向方向の離接移動と面方向に沿った平行移動とが相対的に行われるように構成した第一と第二の金型を備え、該両金型に形成の第一成型品成型用の型面同志を突き合わせた後、第一成型品を成型するための第一の射出工程と、該成型された第一成型品を第一金型に支持する状態で第二金型から脱型する第一の脱型工程と、前記第一成型品を第二金型に設けた第一成膜形成手段に対向するよう突き合わせて第一成型品に第一成膜面を形成して第一成膜成型品を形成する第一の成膜工程と、該第一成膜成型品を第一金型に支持される状態で第二金型から脱型する第二の脱型工程と、前記第一成膜成型品を第二金型に設けた第二成型品用の型面に突き合わせて第一成膜成型品の第一成膜面の一部を残して射出して第二成型品を形成する第二の射出工程と、該第二成型品を第一金型に支持される状態で第二金型から脱型する第三の脱型工程と、前記第二成型品を第二金型に設けた第二成膜形成手段に対向するよう突き合せて第二成型品および前記残した第一成膜面に連通するようにして第二成膜面を形成して第二成膜成型品を形成する第二の成膜工程とが順次実行されるようにしたことを特徴とする成膜成型品の製造方法である。
請求項2の発明は、請求項1において、さらに前記第二の成膜工程の後、第二成膜成型品を第一金型に支持される状態で第二金型を脱型する第四の脱型工程と、前記第二成膜成型品を第二金型に設けた第三成型品用の型面に突き合わせて第二成膜成型品の第二成膜面の一部を残して射出して第三成型品を形成する第三の射出工程と、該第三成型品を第一金型に支持される状態で第二金型から脱型する第五の脱型工程と、前記第三成型品を第二金型に設けた第三成膜形成手段に対向するよう突き合せて第三成型品および前記残した第二成膜面に連通するようにして第三成膜面を形成して第三成膜成型品を形成する第三の成膜工程とが順次実行されるようにしたことを特徴とする成膜成型品の製造方法である。
請求項3の発明は、請求項1または2において、成膜成型品は電気基材であり、成膜面が電気配線となることを特徴とする成膜成型品の製造方法である。
The present invention was created in view of the above-described circumstances in order to solve these problems, and the invention of claim 1 is based on the separation movement in the opposing direction between the mold surfaces and the surface direction. A first mold and a second mold configured to be relatively moved in parallel with each other, the mold surfaces for forming the first molded product formed on both molds are matched, A first injection step for molding a molded product, a first demolding step of demolding from the second mold in a state where the molded first molded product is supported by the first mold, and the first first deposition for forming the first film molding to form a first film forming surface against so as to face the first deposition forming means provided one molding the second mold the first molded product a membrane process, a second demolding step of demolding from the second mold in a state that is supporting the first film molding a first mold, the first film molding a second A second injection step of forming a second molding by injecting leaving a portion of the first film molding of the Kazunari film surface against the mold surface for the second moldings provided on the mold, A third demolding step of demolding the second molded product from the second mold while being supported by the first mold, and a second film forming process in which the second molded product is provided in the second mold. A second film-formation product that forms a second film-formation product by forming a second film-formation surface so as to communicate with the second molded product and the remaining first film-formation surface. A process for producing a film-molded article characterized in that the steps are sequentially executed .
According to a second aspect of the present invention, in the first aspect , the second mold is removed from the first mold in a state where the second film-formed molded product is supported by the first mold after the second film-forming step. And a part of the second film-forming surface of the second film-formed molded product, leaving the second film-formed molded product butted against the mold surface for the third molded product provided in the second mold. A third injection step of injecting to form a third molded product, a fifth demolding step of releasing the third molded product from the second mold in a state supported by the first mold, and The third film formation surface is made to communicate with the third molded product and the remaining second film formation surface by abutting the third molded product against the third film formation means provided on the second mold. A third film forming step of forming a third film forming product by forming the film forming step is sequentially performed .
The invention of claim 3 is the method of manufacturing a film-formed molded article according to claim 1 or 2 , characterized in that the film-formed molded article is an electric base material, and the film-forming surface is an electric wiring.

請求項1または2の発明とすることにより、三次元方向で立体的な成膜成型品を、従来に比べ作業性が良く、歩留まりの高いものとすることができる。
請求項の発明とすることにより、配線に用いる金属の量が少なく、無駄のない電気基材を容易に形成することができる。
According to the invention of claim 1 or 2, a three-dimensionally formed film-molded product can be improved in workability and high in yield compared to the prior art.
By setting it as invention of Claim 3 , the quantity of the metal used for wiring is small, and an electric base material without waste can be formed easily.

次ぎに、第一の参考例について図1〜5に基づいて説明する。図面において、1は可動金型(第一金型)、2は固定金型(第二金型)であって、可動金型1は、固定金型2に対して対向方向に離接移動できると共に、固定金型2から離間した状態で固定金型2に対して面に沿う方向の移動(金型面に対する平行移動)ができるように構成されているが、移動機構の詳細については、従来から知られた金型移動方式の技術を用いて実行できるので省略する。尚、金型の移動は相対的なものでよいから、第一金型を固定、第二金型を移動させるように構成してもよく、また両者を移動するように構成しても勿論良い。また移動は、面に沿う方向の移動であれば、直線方向の平行移動に限らず、軸を中心とする回転移動であっても良いものである。 Next, a first reference example will be described with reference to FIGS. In the drawings, 1 is a movable mold (first mold), 2 is a fixed mold (second mold), and the movable mold 1 can be moved away from and in contact with the fixed mold 2. At the same time, it is configured to move in the direction along the surface with respect to the fixed mold 2 while being separated from the fixed mold 2 (parallel movement with respect to the mold surface). Since it can be performed using the technique of the mold moving method known from No. 1, it will be omitted. Since the movement of the mold may be relative, the first mold may be fixed and the second mold may be moved, or of course, both may be moved. . Further, the movement is not limited to the parallel movement in the linear direction as long as the movement is in the direction along the surface, and may be a rotational movement around the axis.

前記可動金型1には、基材3(第一成型品)を射出成形するための凹型状をした射出用成型面1aが形成される一方、固定金型2には、前記基材3の成膜側面3a(内側面)を射出成形するため平面状になった第一の射出用成型面2aと被覆材4(第二成型品)を射出形成するため凹型状をした第二の射出用成型面2bとがそれぞれ形成されると共に、さらに真空蒸着装置(成膜形成手段、成膜装置)5を収容(内装)するため凹型状をした成膜用成型面2cが形成されている。ちなみに本実施の形態の固定金型2は、成膜用成型面2cが第一射出用成型面2aと第二射出用成型面2bとのあいだに形成されているが、これら型面の配置は必要において任意に設定できるものである。また、前記真空蒸着装置5は公知のものが設けられるが、その概略として、真空ポンプPに接続される吸気路6、蒸着する金属(例えばアルミニウムやクロム)を入れるボート7、該ボート7を加熱するためのヒータ8とを備えて構成されている。   The movable mold 1 is formed with an injection molding surface 1a having a concave shape for injection molding of the base material 3 (first molded product), while the fixed mold 2 is provided with the base 3 A first injection molding surface 2a that is flat for injection molding the film formation side surface 3a (inner side surface) and a concave injection molding for forming the coating material 4 (second molded product) by injection molding Each of the molding surfaces 2b is formed, and a film forming surface 2c having a concave shape is formed to accommodate (internally) a vacuum vapor deposition apparatus (film forming means, film forming apparatus) 5. Incidentally, in the fixed mold 2 of the present embodiment, the film forming molding surface 2c is formed between the first injection molding surface 2a and the second injection molding surface 2b. It can be set arbitrarily if necessary. The vacuum vapor deposition apparatus 5 is provided with a publicly known apparatus. As an outline, an intake passage 6 connected to a vacuum pump P, a boat 7 for containing a metal to be deposited (for example, aluminum or chromium), and heating the boat 7 are provided. And a heater 8 for doing so.

成膜成型品9は、本実施の形態では車両用のエンブレムであって、前記金型1、2を用いて後述するように一連の工程で成型されるものであるが、樹脂材の射出成型により形成される基材3と、透光性を有する樹脂材の射出成型により形成される被覆材4と、これら基材3、被覆材4によってサンドイッチ状に挟まれた位置に真空蒸着により形成される成膜10とからなっていて成膜10が剥がれにくく、意匠性に優れた構成となっている。   The film-formed molded product 9 is an emblem for a vehicle in the present embodiment, and is molded in a series of steps using the molds 1 and 2 as will be described later. The base material 3 formed by the above process, the covering material 4 formed by injection molding of a light-transmitting resin material, and the base material 3 and the covering material 4 are formed by vacuum deposition at positions sandwiched between the base material 3 and the covering material 4. The film 10 is difficult to be peeled off and has an excellent design.

次に、成膜成型品9の製造方法について説明する。図2(A)は両金型1、2について、基材3を形成する射出用成形面1a、第一射出用成型面2a同志が互いに離間する状態で対向したものを示しており、この離間状態から可動金型1を固定金型2側に移動して前記対向する型面同志が型合わせされる(第一の型合わせ工程:図2(B)参照)。この型合わせ状態で、第一の射出が行われて基材3(第一成型品)が射出成形される(第一の射出工程:図2(C)参照)。   Next, the manufacturing method of the film forming product 9 will be described. FIG. 2A shows both molds 1 and 2 in which the molding surface 1a for forming the base material 3 and the molding surface 2a for first injection face each other in a state of being separated from each other. The movable mold 1 is moved from the state to the fixed mold 2 side, and the opposing mold surfaces are matched (first mold matching step: see FIG. 2B). In this mold matching state, the first injection is performed, and the base material 3 (first molded product) is injection-molded (first injection step: see FIG. 2C).

しかる後、図3(A)に示すように、可動金型1が固定金型2から離間する方向に移動するが、このとき、基材3は、固定金型2から離間(脱型)して可動金型1側に支持される(残る)ように型設計されている(第一の脱型工程)。次いで可動金型1は、基材3が真空蒸着装置5と対向するよう平行移動(図3(B)参照)した後、固定金型2側に移動して型合わせ状態となる(第二の型合わせ工程:図3(C)参照)。   Thereafter, as shown in FIG. 3A, the movable mold 1 moves in a direction away from the fixed mold 2. At this time, the base material 3 is separated (demolded) from the fixed mold 2. The mold is designed so as to be supported (remain) on the movable mold 1 side (first demolding step). Next, the movable mold 1 is translated (see FIG. 3B) so that the base material 3 faces the vacuum deposition apparatus 5, and then moves to the fixed mold 2 side to be in a mold-matching state (second state). Mold matching step: see FIG.

そして、前記基材3と真空蒸着装置5とが対向した型合わせ状態となると、成膜用成型面2c内の空気が吸気路6から抜かれて内部が真空状態になると共に、加熱したヒータ8によりボート7に供給され、溶融した金属が蒸気化することになって基材3の露出する成膜側面3a(図4(A)の下面)が真空蒸着されて成膜10が形成される(成膜工程:図4(A)参照)。次いで可動金型1を、基材3を支持したまま固定金型2から離間させた(第二の離型工程:図4(B)参照)後、可動金型1を固定金型2に対して平行移動させて基材3と第二射出用成型面2bとを対向させる(図4(C)参照)。
因みに、成膜10は、一般には膜厚が数マイクロメートル〜数十マイクロメートル程度と薄いものであるため、例えば断面図で示そうとしたときに、事実上これを図示することは難しく、そこでこれを判りやすくするため、図面では便宜上それなりの厚みを持たせたものとして記載しているが、実際には被成膜面と殆んど同一面となっている(以下同じ)。このため後述するように、成膜を部分的に積層したものである場合、図面(例えば図11(C)の断面図)では積層部位が段差状に厚くなって記載されていたとしても、これらは肉眼視したときに段差状ではなく殆んど面一状にしか見えないものであることはいうまでもない。
また、膜厚については、蒸着時間を長短調整することにより任意に調整できるものであることもいうまでもない。
When the base material 3 and the vacuum vapor deposition apparatus 5 are in a mold-matching state, the air in the film forming surface 2c is drawn from the intake passage 6 to be in a vacuum state, and the heated heater 8 The film 7 is supplied to the boat 7 and the molten metal is vaporized, and the film formation side surface 3a (the lower surface of FIG. 4A) where the substrate 3 is exposed is vacuum-deposited to form the film formation 10 (synthetic film formation). Membrane process: see FIG. Next, the movable mold 1 is separated from the fixed mold 2 while supporting the base material 3 (second mold release step: see FIG. 4B), and then the movable mold 1 is fixed to the fixed mold 2. The base material 3 and the second injection molding surface 2b are opposed to each other (see FIG. 4C).
Incidentally, since the film formation 10 is generally as thin as several micrometers to several tens of micrometers, for example, when trying to show it in a cross-sectional view, it is practically difficult to illustrate this. In order to make this easy to understand, in the drawings, it is described as having a certain thickness for the sake of convenience, but in actuality, it is almost the same surface as the film formation surface (hereinafter the same). For this reason, as will be described later, in the case where the film formation is partially laminated, even if the laminated portion is described in a stepped shape in the drawing (for example, the cross-sectional view in FIG. 11C), these Needless to say, when viewed with the naked eye, they are not stepped but can be seen only almost flush.
Needless to say, the film thickness can be arbitrarily adjusted by adjusting the deposition time.

しかる後、可動金型1を固定金型2側に移動させて、前記対向する基材3と第二射出用成型面2bを型合せ(第三の型合わせ工程:図5(A)参照)した後、成膜10を形成した成膜側面3aに樹脂材を射出し(第二の射出工程:図5B)参照)て被覆材4(第二成型品)を形成し、これによって基材3、成膜10、そして被覆材4が一体化された成膜成型品9となる。そして可動金型1が固定金型2から離間し、あわせて前記成膜成型品9の取り出し(図5(C)参照)した後、可動金型1を図2(A)の最初の位置まで平行移動し、以降、この工程を繰り返すことで、成膜成型品9が連続して成形できるようになっている。   Thereafter, the movable mold 1 is moved to the fixed mold 2 side, and the opposing base material 3 and the second injection molding surface 2b are mold-matched (third mold-matching step: see FIG. 5A). After that, a resin material is injected onto the film formation side surface 3a on which the film formation 10 is formed (see the second injection step: FIG. 5B) to form the covering material 4 (second molded product), thereby forming the base material 3 The film formation 10 is formed by integrating the film 10 and the covering material 4. Then, after the movable mold 1 is separated from the fixed mold 2 and the film-forming molded product 9 is taken out (see FIG. 5C), the movable mold 1 is moved to the first position in FIG. By moving in parallel and thereafter repeating this process, the film-formed molded product 9 can be continuously formed.

叙述の如く構成された第一の参考例において、基材3の成膜側面3aに形成した成膜10の表面を被覆材4で被覆した中実の成膜成型品9を製造して成膜10を保護するにあたり、基材3を射出成型するための第一の射出成型の工程と、該基材3、被覆材4とを一体化するための第二の射出工程とのあいだに、成膜10する成膜工程を設けて一連の工程により成膜成型品9が形成できるようにした結果、従来のように、一旦、金型から取り出した基材3に成膜10を形成し、しかる後、再び金型にセットして被覆材4で被覆しなければならない従来の場合のように、基材3の取り出し、再セットの作業が不要になって作業能率が向上する。しかも基材3の取り出し、再セットがないため、成膜面に手が触れて指紋がついたり物に当って傷がついたりようなこともなく、一連の工程が全てクリーンルームでもできることになって不良品発生を大幅に低減できる。 In the first reference example configured as described above, a solid film-formation molded article 9 in which the surface of the film-formation 10 formed on the film-formation side surface 3a of the base material 3 is coated with the coating material 4 is manufactured to form a film. 10 is protected between a first injection molding process for injection molding of the base material 3 and a second injection process for integrating the base material 3 and the covering material 4. As a result of providing a film forming process for forming the film 10 and forming the film forming article 9 by a series of processes, the film forming 10 is once formed on the substrate 3 once taken out of the mold as in the prior art. Thereafter, as in the conventional case where it is necessary to set the mold again and cover with the covering material 4, the work of taking out and resetting the base material 3 becomes unnecessary, and the work efficiency is improved. Moreover, since the substrate 3 is not taken out and re-set, there is no touch of the film-forming surface, fingerprints, or damage to the object, and the entire process can be performed in a clean room. The occurrence of defective products can be greatly reduced.

、成膜形成手段としては、真空蒸着装置5に限定されず、例えば陰極スパッタリングによる方法等、通常知られた成膜形成装置を必要において採用することができる。 As the film forming means is not limited to vacuum deposition apparatus 5, it is possible to employ for example, a method by cathode sputtering or the like, in the normal requires a known film deposition forming apparatus.

また前記第一の参考例では、基材3の成膜側面3aの全面に成膜10を施し、その全成膜10面を被覆材4で被覆した成膜成型品9の形成であったが、成膜10が樹脂材と接着性が悪いものである場合、剥離が考えられ、そこで成膜成型体11について、図6に示すように基材14の周縁に被覆材17が入り込むことで樹脂材同志が直接接触して強固に接着するように構成することができる。
この第二の参考例は、同じく固定金型12と可動金型13とを有するが、固定金型12には可動金型13の周縁部13aに入り込む凸型面12aが形成されている。そして基材14の周面14aを該凸型面12aで成型(図7(A)参照)した後、真空蒸着装置15により基材14の成膜側面14bを真空蒸着(図7(B)参照)して成膜16を施し、しかる後、該成膜した面および周面14aに被覆材17を射出して中実の成膜成型品11を形成するようにようにしたものである(図7(c)参照)。尚、可動金型13の移動については前記第一の参考例に準じるものであるので、その詳細については省略してある(以下同じ)。
In the first reference example , the film formation 10 was formed on the entire surface of the film formation side surface 3 a of the substrate 3, and the entire film formation 10 surface was covered with the coating material 4. In the case where the film formation 10 has poor adhesion to the resin material, separation may be considered, and therefore the film formation molded body 11 is formed by the covering material 17 entering the periphery of the base material 14 as shown in FIG. It can be configured such that the materials are in direct contact and firmly bonded.
The second reference example similarly includes a fixed mold 12 and a movable mold 13, but the fixed mold 12 is formed with a convex surface 12 a that enters the peripheral portion 13 a of the movable mold 13. Then, after molding the peripheral surface 14a of the base material 14 with the convex surface 12a (see FIG. 7A), the film deposition side surface 14b of the base material 14 is vacuum-deposited by the vacuum deposition device 15 (see FIG. 7B). ), And after that, a coating material 17 is injected onto the film-formed surface and the peripheral surface 14a to form a solid film-formed molded article 11 (see FIG. 7 (c)). The movement of the movable mold 13 is the same as that of the first reference example , and the details thereof are omitted (the same applies hereinafter).

また、前記第一または第二の参考例では、基材3、14の成膜側面3a、14bの全体に成膜10、16を施していたが、図8に示すように、基材18の成膜側面18aの周縁部等、一部をマスキングして部分的に成膜48を施さない部分(非成膜部)18bを有するようにして成膜成型品19を形成することができる。そしてこの場合に、マスキングは、図9(A)に示す第三の参考例のように真空蒸着装置20を収容する固定金型21の成膜用成型面21aの周縁21bで行うことができ、また図9(B)に示す第四の参考例のようにマスキング材22を取付けて行うことができる。そしてマスキング材22を用いる場合、第一の脱型の工程から第二の型合わせ工程のあいだにマスキング材22を基材18の成膜側面18aに被覆することで行うことができる。
そしてこのようにマスキングをした場合、基材18と被覆材23とが、非成膜部18bで直接接触して互いに樹脂同志の接着がなされることになって強度アップが達成できることになる。
In the first or second reference example , the film formation surfaces 10 and 16 were applied to the entire film formation side surfaces 3a and 14b of the base materials 3 and 14, but as shown in FIG. The film-forming molded article 19 can be formed so as to have a portion (non-film-forming portion) 18b that is partially masked and not subjected to the film-forming 48, such as the peripheral portion of the film-forming side surface 18a. And in this case, masking can be performed at the peripheral edge 21b of the film forming surface 21a of the fixed mold 21 that accommodates the vacuum evaporation apparatus 20 as in the third reference example shown in FIG. Further, the masking material 22 can be attached as in the fourth reference example shown in FIG. And when using the masking material 22, it can carry out by coat | covering the masking material 22 on the film-forming side surface 18a of the base material 18 between the 1st demolding process and the 2nd mold matching process.
When masking is performed in this way, the base material 18 and the covering material 23 are directly brought into contact with each other at the non-film-forming portion 18b and are bonded to each other, so that an increase in strength can be achieved.

またさらに、前記第一〜第四の参考例のものは、成膜工程が一回であったが、二回以上の複数回行うようにすることができる。例えば図10(A)に示すように、二組の真空蒸着装置24、25をそれぞれ固定金型26に形成した成膜用型面26a、26bに内装し、第一の射出工程で成型した基材27の成膜側面27aに第一の成膜工程で第一の成膜を施した後、第二の成膜工程で第二の成膜を施し、しかる後、第二の射出工程で成膜表面を被覆材28で被覆するようにして形成することができる。 Furthermore, in the first to fourth reference examples , the film forming process is performed once, but it can be performed two or more times. For example, as shown in FIG. 10 (A), two sets of vacuum vapor deposition devices 24 and 25 are mounted on film forming mold surfaces 26a and 26b formed on a fixed mold 26, respectively, and are molded in the first injection process. After the first film formation process is performed on the film formation side surface 27a of the material 27, the second film formation process is performed, and then the second injection process is performed. The film surface can be formed so as to be covered with the covering material 28.

この場合に、第五の参考例のように、第一の成膜29の全面に第二の成膜30を施した(図10(B)参照)場合には、成膜成型品31の表裏が異なる成膜となって目視される(基材および被覆材が透光材である場合に限る)ことになる。また第六の参考例のように、第一の成膜32と第二の成膜33との成膜位置について、前記マスキングをすることで異ならしめるように施した(図11(A)、(B)参照)場合、成膜成型品34の表面から二つの異なった成膜32、33が目視されることになる。さらにまた、第七の実施の形態のように、第一の成膜35と第二の成膜36との成膜位置について、前記マスキングをすることで一部が重なったように施した(図11(C)、(D)参照)場合において、第二の成膜36の膜厚が薄く、第一の成膜35が透けて目視されるもののであるときには、成膜成型品37の表面からは、第一、第二の成膜35、36と、両成膜35、36が混じったものとの三つの異なった成膜が目視されることになる。
この場合に、一つの成膜用型面に二つ以上の真空蒸着装置を内装し、連続して複数の成膜をするようにしても実施することができる。
因みに、第一の成膜35と第二の成膜36とが重なっている部分は、図11(C)に示すように、重合状になっているが、真空蒸着する時間を制御して、成膜の厚みを非常に薄いものとすることによって、第一、第二の成膜36と略面一状に形成することができる。
In this case, as in the fifth reference example , when the second film 30 is formed on the entire surface of the first film 29 (see FIG. 10B), the front and back of the film-formed molded article 31 Will be visually observed as a different film formation (limited to the case where the base material and the covering material are translucent materials). Further, as in the sixth reference example , the film formation positions of the first film formation 32 and the second film formation 33 are made different by performing the masking (FIGS. 11A and 11B). In the case of B), two different film formations 32 and 33 are visually observed from the surface of the film formation product 34. Furthermore, as in the seventh embodiment, the first film formation 35 and the second film formation position 36 are applied so as to partially overlap each other by performing the masking (FIG. 11 (C), (D)), the second film 36 is thin and the first film 35 is visible through the surface of the film-formed molded article 37. The three different film formations of the first and second film formations 35 and 36 and the mixture of the film formations 35 and 36 are visually observed.
In this case, two or more vacuum vapor deposition apparatuses are built in one film forming mold surface, and a plurality of films can be continuously formed.
Incidentally, the portion where the first film formation 35 and the second film formation 36 overlap is in a polymerized state as shown in FIG. 11C, but the time for vacuum evaporation is controlled, By making the film thickness very thin, it can be formed substantially flush with the first and second film formations 36.

さらにまた、第八の参考例のように、第一の実施の形態に準じる成膜工程と第二の脱型工程と第二の射出工程とを繰り返して行うことができ、この場合に、成膜38と樹脂材の射出とを、第四の実施の形態のように、マスキングする等して成膜位置は異ならしめた状態で単純に重合するように繰り返す(図12(A)、(B)参照)ことができ、この場合には、成膜38が立体的な状態で目視される成膜成型品39となる。 Furthermore, as in the eighth reference example , the film forming process according to the first embodiment, the second demolding process, and the second injection process can be repeatedly performed. The film 38 and the injection of the resin material are repeated so as to be simply polymerized in a state where the film forming positions are different by masking or the like as in the fourth embodiment (FIGS. 12A and 12B). In this case, the film formation 38 is a film formation product 39 that is visually observed in a three-dimensional state.

図13、14に本発明の実施の形態を説明するが、前記各参考例で記載されたように、成膜工程と第二の脱型工程と第二の射出工程とを繰り返す場合に、先の第二の射出工程は、先の成膜工程で成膜された第一の成膜40の一部を残して行い、繰り返される成膜工程は、先の第二の射出工程で残された第一の成膜40と先の第二の射出工程で射出成型した第二の基材41の成型側面41aに行われるようにすることができる。つまり図13、図14(A)、(B)に示す本発明の実施の形態のように、第一の射出工程で第一の基材(第一成型品)42を形成した後、前記参考例に記載したように第一の脱型工程が実施され、そして第一の基材42に対して第一の成膜工程で線状(または帯状、以下同じ)の第一の成膜40を真空蒸着して第一成膜成型品40および42を製造する。しかる後、第二の脱型工程後に、該第一の成膜40の一端部を露出する(残す)ようにして第一成膜成型品40及び42に第二の基材(第二成型品)41を射出形成する(第二の射出工程)。次いで、第三の脱型工程を経た後、第二の成膜工程が繰り返され、第二基材41の成膜面側41aから第一の成膜40に連通する線状の第二の成膜43が形成される(第二の成膜成型品)。
さらに第四の脱型工程を経た後、続く第三の射出工程では、第二の成膜43の成膜面側41a側の一端を残して、第二の成膜成型品に第三の射出工程がなされ第三の基材(第三成型品)44が形成され、ついで第五の脱型工程を経た後、続く第三の成膜工程で、第三の基材44の成膜面側44aから第二の成膜43に連通する第三の成膜45が施された第三成膜成型品が形成された後、露出している第三の成膜45、第二、第三の基材41、44を、被覆材46で被覆して、成膜成型品47が形成される。そしてこのように形成することで、三次元方向での立体的な成膜成型品を成型することができる。
Embodiments of the present invention will be described with reference to FIGS. 13 and 14, and as described in the respective reference examples, when the film forming process, the second demolding process, and the second injection process are repeated, The second injection step was performed leaving a part of the first film formation 40 formed in the previous film formation step, and the repeated film formation step was left in the previous second injection step. It can be performed on the molding side surface 41a of the second base material 41 injection-molded in the first film formation 40 and the second injection step. That is, after the first base material (first molded product) 42 is formed in the first injection step as in the embodiment of the present invention shown in FIGS. As described in the example, the first demolding step is performed, and the first film formation 40 that is linear (or strip-like, the same applies hereinafter) is formed on the first substrate 42 in the first film formation step. The first film-forming molded products 40 and 42 are manufactured by vacuum deposition. Thereafter, after the second demolding step, the second base material (second molded product) is placed on the first film-formed molded products 40 and 42 so that one end of the first film formed 40 is exposed (leaves). ) 41 is formed by injection (second injection step). Next, after passing through the third demolding step, the second film forming step is repeated, and the second linear formation component communicating from the film forming surface side 41 a of the second base material 41 to the first film forming 40 is performed. A film 43 is formed (second film-forming molded product).
Further, after passing through the fourth demolding step, in the subsequent third injection step, the third injection is performed on the second film-formed molded product, leaving one end of the second film-forming 43 on the film-forming surface side 41a side. After the process is performed and the third base material (third molded product) 44 is formed, and after the fifth demolding process, the film forming surface side of the third base material 44 is followed by the third film forming process. After the formation of the third film-formation product having the third film-formation 45 communicating from the second film-formation 44a to the second film-formation 43, the exposed third film-formation 45, second, and third The base materials 41 and 44 are covered with a covering material 46 to form a film-forming molded product 47. And by forming in this way, the three-dimensional film-forming molded product in a three-dimensional direction can be shape | molded.

因みに、本発明の実施の形態では、上下方向にのみ階層状になっているが、前後、左右等いずれの方向にも階層状となる構成とすることができる。また、第一、第二、第三の成膜40、43、45は、ともに直線状のものであるが、それぞれ、L字状、T字状、Y字状、湾曲状等さまざまな分岐形状とすることもでき(図14(C)参照)、さらに、成膜を金、銀、銅等の導電性金属で形成することにより電気配線となって、成膜成型品47を電気基板とすることができる。この結果、成膜40、43、45は、従来の電気配線に比べ薄く形成できるため、コスト削減ができ、さらに、マスキングする等して様々な形状とすることができるため、必要に応じた回路基板を容易に形成できる。 Incidentally, in the embodiment of the present invention, it is hierarchical only in the vertical direction, but it can be configured to be hierarchical in any direction such as front and rear, left and right. The first, second, and third film formations 40, 43, and 45 are all linear, but have various branched shapes such as an L shape, a T shape, a Y shape, and a curved shape. (See FIG. 14C), and further, the film formation is made of a conductive metal such as gold, silver, copper, etc., so that electric wiring is formed, and the film-formed molded article 47 is used as the electric substrate. be able to. As a result, the films 40, 43, and 45 can be formed thinner than the conventional electric wiring, so that the cost can be reduced, and further, various shapes can be formed by masking or the like. The substrate can be easily formed.

(A)、(B)はそれぞれ第一参考例の成膜成型品の斜視図、縦断面図である。(A), (B) is the perspective view and longitudinal cross-sectional view of the film-forming molded article of a 1st reference example , respectively. (A)、(B)、(C)は第一参考例の第一の射出をするまでの工程概略図である。(A), (B), (C) is process schematic until it carries out the 1st injection of a 1st reference example . (A)、(B)、(C)は第一参考例の第二の突合せまでの工程概略図である。(A), (B), (C) is process schematic until the second butt | matching of a 1st reference example . (A)、(B)、(C)は第一参考例の基材と固定金型の凹型面とが対向するまでの工程概略図である。(A), (B), (C) is process schematic until the base material of a 1st reference example and the concave surface of a fixed mold oppose. (A)(B)(C)は第一参考例の成膜成型品の取出しまでの工程概略図である。(A), (B), and (C) are process schematic diagrams until the film-forming molded product of the first reference example is taken out. 第二参考例の成膜成型品の縦断面図である。It is a longitudinal cross-sectional view of the film-forming molded article of a 2nd reference example . (A)、(B)、(C)はそれぞれ第二参考例の第一射出工程、成膜工程、第二射出工程の概略図である。(A), (B), (C) is the schematic of the 1st injection process of the 2nd reference example , a film-forming process, and a 2nd injection process, respectively. (A)、(B)はそれぞれ第三または第四参考例の側面図、平面図である。(A) and (B) are a side view and a plan view of a third or fourth reference example , respectively. (A)、(B)はそれぞれ第三参考例における成膜工程、第四参考例における成膜工程の概略図である。(A), (B) is the schematic of the film-forming process in a 3rd reference example, and the film-forming process in a 4th reference example , respectively. (A)、(B)はそれぞれ第五参考例における成膜工程の概略図、成膜成型品の縦断面図である。(A), (B) is the schematic of the film-forming process in a 5th reference example, respectively, and the longitudinal cross-sectional view of a film-forming molded article. (A)、(B)はそれぞれ第六参考例の成膜成型品の横断面図、正面図、(C)、(D)はそれぞれ第七の実施の形態の成膜成型品の横断面図、正面図である。(A), (B) is a cross-sectional view and a front view of a film-formed molded product of the sixth reference example , respectively, and (C), (D) are cross-sectional views of a film-formed molded product of the seventh embodiment. FIG. (A)、(B)はそれぞれ第八参考例における成膜工程の概略図、成膜成型品の側面図である。(A), (B) is the schematic of the film-forming process in a 8th reference example, respectively, and the side view of a film-forming molded article. (A)、(B)、(C)はそれぞれ本発明の実施の形態の成膜成型品の正面図、側面図、図13(A)のX−X断面図である。(A), (B), (C) is the front view of the film-forming molded article of embodiment of this invention , a side view, and XX sectional drawing of FIG. 13 (A), respectively. (A)、(B)、(C)はそれぞれ本発明の実施の形態における成膜成型品の工程概略図である。(A), (B), (C) is the process schematic of the film-forming molded article in embodiment of this invention, respectively.

符号の説明Explanation of symbols

1 可動金型
1a 射出用成型面
2 固定金型
2a 第一の射出用成型面
2b 第二の射出用成型面
2c 成膜用成型面
3 基材
3a 成膜側面
4 被覆材
5 真空蒸着装置
9 成膜成型品
10 成膜
11 成膜成型体
12 固定金型
13 可動金型
14 基材
17 被覆材
18 基材
48 成膜
18b 非成膜部
19 成膜成型品
20 真空蒸着装置
21 固定金型
21b 周縁
22 マスキング材
23 被覆材
24、25 真空蒸着装置
26 固定金型
26a、26b 成膜用型面
27 基材
27a 成膜側面
28 被覆材
29、30 成膜
31 成膜成型品
32、33 成膜
34 成膜成型品
35、36 成膜
37 成膜成型品
38 成膜
39 成膜成型品
40、43、45 成膜
41a、42a、44a 成形側面
41、42、44 基材
46 被覆材
47 成膜成型品
DESCRIPTION OF SYMBOLS 1 Movable metal mold 1a Injection molding surface 2 Fixed mold 2a First injection molding surface 2b Second injection molding surface 2c Film forming surface 3 Base material 3a Film forming side surface 4 Covering material 5 Vacuum deposition apparatus 9 Film-forming molded article 10 Film-forming 11 Film-forming molded body 12 Fixed mold 13 Movable mold 14 Base material 17 Covering material 18 Base material 48 Film-forming 18b Non-film-forming part 19 Film-forming molded article 20 Vacuum evaporation apparatus 21 Fixed mold 21b Periphery 22 Masking material 23 Coating material 24, 25 Vacuum deposition apparatus 26 Fixed mold 26a, 26b Film forming mold surface 27 Base material 27a Film forming side surface 28 Coating material 29, 30 Film forming 31 Film forming molded product 32, 33 Film 34 Film-formed molded product 35, 36 Film-formed 37 Film-formed molded product 38 Film-formed 39 Film-formed molded product 40, 43, 45 Film-formed 41a, 42a, 44a Molded side surfaces 41, 42, 44 Base material 46 Coating material 47 Composition Membrane molded product

Claims (3)

金型面同志の対向方向の離接移動と面方向に沿った平行移動とが相対的に行われるように構成した第一と第二の金型を備え、
該両金型に形成の第一成型品成型用の型面同志を突き合わせた後、第一成型品を成型するための第一の射出工程と、
該成型された第一成型品を第一金型に支持する状態で第二金型から脱型する第一の脱型工程と、
前記第一成型品を第二金型に設けた第一成膜形成手段に対向するよう突き合わせて第一成型品に第一成膜面を形成して第一成膜成型品を形成する第一の成膜工程と、
第一成膜成型品を第一金型に支持される状態で第二金型から脱型する第二の脱型工程と、 前記第一成膜成型品を第二金型に設けた第二成型品用の型面に突き合わせて第一成膜成型品の第一成膜面の一部を残して射出して第二成型品を形成する第二の射出工程と、
該第二成型品を第一金型に支持される状態で第二金型から脱型する第三の脱型工程と、
前記第二成型品を第二金型に設けた第二成膜形成手段に対向するよう突き合せて第二成型品および前記残した第一成膜面に連通するようにして第二成膜面を形成して第二成膜成型品を形成する第二の成膜工程とが順次実行されるようにしたことを特徴とする成膜成型品の製造方法。
The first and second molds are configured so that the separation movement in the opposing direction between the mold surfaces and the parallel movement along the surface direction are relatively performed,
A first injection step for molding the first molded product after matching the mold surfaces for molding the first molded product formed on both molds;
A first demolding step of demolding from the second mold in a state where the molded first molded product is supported by the first mold;
First forming a first film molding to form a first film-forming surface in the first molded product against so as to face the first deposition forming means provided with the first molding to the second mold A film forming process of
The a second demolding step of demolding from the second mold in a state that is supporting the first film molding a first mold, the first film molding is provided in the second mold A second injection process in which a second molded product is formed by injecting but leaving a part of the first film- formed surface of the first film- formed molded product by butting against the mold surface for the two molded products;
A third demolding step of demolding the second molded product from the second mold while being supported by the first mold;
The second film-formed surface is formed so as to face the second film-forming unit provided on the second mold so as to face the second molded product and the remaining first film-formed surface. And a second film forming step of forming a second film- forming molded product in order.
請求項1において、さらに前記第二の成膜工程の後、第二成膜成型品を第一金型に支持される状態で第二金型を脱型する第四の脱型工程と、
前記第二成膜成型品を第二金型に設けた第三成型品用の型面に突き合わせて第二成膜成型品の第二成膜面の一部を残して射出して第三成型品を形成する第三の射出工程と、
該第三成型品を第一金型に支持される状態で第二金型から脱型する第五の脱型工程と、
前記第三成型品を第二金型に設けた第三成膜形成手段に対向するよう突き合せて第三成型品および前記残した第二成膜面に連通するようにして第三成膜面を形成して第三成膜成型品を形成する第三の成膜工程とが順次実行されるようにしたことを特徴とする成膜成型品の製造方法。
4. The fourth demolding step according to claim 1, wherein after the second film-forming step, the second mold is demolded in a state where the second film-formed molded product is supported by the first die,
The second film-forming molded product is abutted against the mold surface for the third molded product provided in the second mold, and a part of the second film-forming surface of the second film-forming molded product is left to be injected and third molded. A third injection process to form a product;
A fifth demolding step of demolding the third molded product from the second mold while being supported by the first mold;
The third film-forming surface is formed so as to face the third film-forming unit provided in the second mold so as to face the third molded product and the remaining second film-forming surface. And a third film forming step of forming a third film- forming molded product in order.
請求項1または2において、成膜成型品は電気基材であり、成膜面が電気配線となることを特徴とする成膜成型品の製造方法。 3. The method for producing a film-formed molded article according to claim 1, wherein the film-formed molded article is an electric base material, and the film-forming surface is an electric wiring.
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JP4974376B2 (en) * 2007-12-26 2012-07-11 株式会社ミツバ Film-forming molded body and manufacturing apparatus thereof
JP4974377B2 (en) * 2007-12-27 2012-07-11 株式会社ミツバ Method for manufacturing film-formed molded product
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