JP4692076B2 - Method for producing semiconductive roll - Google Patents

Description

The present invention is an electrophotographic copying machine, laser printer, facsimile, relates to the production how semiconductive roll used in the charging roller in the image forming apparatus utilizing an electrophotographic system, such as those composite OA equipment.

Conventionally, many electrophotographic image forming apparatuses employ a contact charging and contact transfer system that generates very little harmful ozone, especially in terms of wear resistance in the roll state and transfer area. A roll-shaped member having excellent transfer material transportability is mainly used. Many of these members are made of an elastic material, and can reliably form a nip with respect to a photoreceptor or an intermediate transfer member as an image carrier.
These rolls generally have a resistance of 1 × 10 ⁵ to 1 × 10 ¹² by adding carbon black or an ion conductive agent on a metal core such as stainless steel (SUS), Fe, Al metal or alloy. A semiconductive elastic roll in which rubber or resin having a [Ω] degree is formed is used.

The charging roll will be described as an example. In recent years, with the demand for higher image quality, toner particles have been reduced. It is known that due to the reduction in the particle size of the toner, the particle shape is almost spherical, and therefore, there are the following disadvantages. That is, after transfer, the toner remaining on the surface of the image carrier in the cleanerless image forming apparatus, or the toner remaining on the surface of the image carrier after passing through the cleaning process in the image forming apparatus having a cleaning process, When the toner passes through the contact portion between the contact charger and the image carrier, the toner is deformed and adheres to the surface of the image carrier. At this time, there is a problem that toner filming occurs in which the toner adheres to the surface of the image carrier as a foreign substance by repeating such adhesion.

In response to these problems, the use of a charger having a foaming layer of a charger has been proposed. In recent years, the hardness of chargers has been reduced. Specifically, a conductive elastic layer having a three-dimensional network structure is formed on the outer periphery of the metal shaft, and a semiconductive elastic layer is formed on the outer periphery of the conductive elastic layer. An electrophotographic roll has been proposed (see, for example, Patent Document 1). Since the roll for electrophotography proposed in Patent Document 1 is composed of a conductive foam layer having a three-dimensional network structure bonded to a metal shaft and a semiconductive elastic seamless tube, it functions as a semiconductive roll. In order to achieve this, it is necessary to combine the foamed conductive layer and the semiconductive seamless tube. Usually, these semiconductive rolls are used while rotating while in contact with any member.

For this reason, when the foam layer and the tube are not fixed, there is a problem that the position of the tube is shifted due to rotation. Therefore, the foam layer and the elastic layer tube are generally fixed by means such as adhesion. However, although the tube used here is 100 μm or more in the above invention, a tube having a thickness of about 500 μm to 1000 μm is used because of the relationship between tube processability and performance. Therefore, it is difficult to maintain the shape, and the distortion when the tube is extrapolated to the foamed layer is fixed by adhesion, so it is difficult to ensure shape accuracy such as deflection and roundness. As a result, it is difficult to secure a semiconductive roll having a desired accuracy, and as a result, there is a problem that the manufacturing defect rate is high and the cost as a roll is very high.

JP 2003-162105 A

The present invention aims to solve the above-mentioned problems. That is, the present invention aims at providing runout accuracy, the roundness is improved and manufacturing how the semiconductive roller for producing a semiconductive roll which can be uniformly charged at a low manufacturing defect rate .

In order to solve the above-mentioned problems, the present inventors have intensively studied and found that the present invention described below solves the above-mentioned problems and have completed the present invention.
That is, the present invention
<1> A foam layer is formed on the outer periphery of the core metal, the core metal having the foam layer formed on the outer periphery is inserted into a tube through an adhesive, and the adhesive is cured to form an outer periphery of the core metal. A method for producing a semiconductive roll in which a foam layer and a tube that are formed are bonded,
Before the adhesive is cured, the tube into which the metal core is inserted is brought into contact with the cylindrical roll, and the rotation axis of the metal core and the rotation of the cylindrical roll are brought into contact with the cylindrical roller. While rotating the cylindrical roll around the axis of rotation of the cylindrical roll while keeping the shaft parallel and at a constant distance, the tube with the cored bar applied to a smooth plane A method for producing a semiconductive roll , wherein the tube is corrected by rotating the tube around a rotation axis of a cored bar .

The present invention can provide deflection accuracy, improved roundness, producing how the semiconductive roller for producing a semiconductive roll which can be uniformly charged at a low manufacturing defect rate.

  As shown in FIG. 1, the method for producing a semiconductive roll of the present invention forms a foam layer 4 on the outer periphery of a core metal 2, and foams the core metal 2 having the foam layer 4 formed on the outer periphery into a tube 6. A method for producing a semiconductive roll, in which the outer periphery of the layer 4 and the inner periphery of the tube 6 are inserted so as to contact each other via an adhesive, and the foamed layer 4 and the tube 6 are bonded by curing the adhesive. The shape of the tube 6 into which the cored bar 2 with the foam layer 4 is inserted is corrected before the adhesive is cured. In this way, by correcting the shape of the tube 6 before the adhesive is cured, the strain generated when the tube 6 is inserted is removed, so that a semiconductive roll with improved runout accuracy and roundness can be obtained. .

  Examples of the metal core 2 include a metal or alloy material such as aluminum, copper alloy, and stainless steel, or a conductive material such as a conductive resin.

  Next, the foam layer 4 will be described. In the present invention, the foam layer is a layer having a “three-dimensional network structure”. Here, the “three-dimensional network structure” is composed of a skeleton in which a three-dimensional network is formed and a space existing between the skeletons, and the space is in communication with each other without being partitioned by the skeleton. It means what is. Therefore, in the so-called foam having a large number of bubbles inside the structure, the individual bubbles are generally independent, and the bubbles are not partitioned and communicated with each other by the film. It is not included in the concept of “dimensional network structure”.

  In the present invention, as the three-dimensional network structure, the shortest distance between the skeletons is preferably 200 μm or more, and more preferably 300 to 700 μm. Further, the thickness of the skeleton is preferably 1000 μm or less, and more preferably between 50 and 300 μm. By adopting such a structure, it is possible to realize an ultra-low hardness conductive elastic layer that could not be expressed by conventional foams such as sponges.

  When the shortest distance between the skeletons of the three-dimensional network structure in the foamed layer 4 is less than 200 μm, the foamed layer 4 becomes hard and the intended ultra-low hardness may not be expressed. Moreover, even if the thickness of the skeleton of the three-dimensional network structure in the foam layer 4 exceeds 1000 μm, the foam layer 4 may become hard and the intended ultra-low hardness may not be expressed.

  Note that the “shortest distance between skeletons” referred to here is two skeletons connected via two or more branch points and facing skeletons, or independent skeletons not directly connected to each other. It means the shortest distance. The skeleton may be thicker around the branch point, but the “skeleton thickness” is a discussion of the average thickness portion other than the vicinity of the branch point.

  Examples of the conductive or semiconductive binder material forming the foam layer 4 include SBR (styrene butadiene rubber), BR (polybutadiene rubber), high styrene rubber (Hi styrene resin masterbacch), IR (isoprene rubber), IIR (butyl rubber). ), Halogenated butyl rubber (Halogenated butyrubber), NBR (nitrile butadiene rubber), water-added NBR (H-NBR), EPDM (ethylene-propylene-diene terpolymer rubber), EPM (ethylene-propylene rubber), NBR and EPDM Blended rubber, CR (chloroprene rubber), ACM (acrylic rubber), CO (hydrin rubber), ECO (epichlorohydrin rubber), chlorinated polyethylene (Chlorinated-PE) , VAMAC (ethylene acrylic rubber), VMQ (silicone rubber), AU (urethane rubber), FKM (fluorine rubber), NR (natural rubber), CSM (chlorosulfonated polyethylene rubber) rubber material and the like. The binder material is not limited to the above examples.

The foamed layer 4 can form a layer having a three-dimensional network structure by using a binder material selected from the above material group and selecting one of the following methods.
A method in which the binder material is dissolved in an appropriate solvent and then foamed with a stirrer and then molded into a predetermined shape.
A method in which a foaming agent is kneaded into the binder material, and then molded into a predetermined shape and heated and foamed.
A method in which the binder material is kneaded with a component that can only be dissolved in a specific solvent, molded into a predetermined shape, and then immersed in the specific solvent to dissolve the component, leaving only the portion of the binder material that has not been dissolved. .

  At this time, in order to impart conductivity to a layer made of a three-dimensional network structure, (1) when forming the layer, a conductive material is mixed in advance with each material (solution, kneaded product, etc.). (2) After forming into a predetermined shape, this is immersed in a conductive paint or conductive adhesive in which a conductive material is dispersed and / or dissolved, or the conductive paint is The method of giving electroconductivity afterwards by spraying etc. is mentioned, In this invention, you may express electroconductivity by any method.

  The tube 6 forms a semiconductive elastic material layer, and the constituent materials thereof include SBR (styrene butadiene rubber), BR (polybutadiene rubber), high styrene rubber (Hi Styrene elastomer), IR (isoprene rubber). ), IIR (butyl rubber), halogenated butyl rubber (Halogenated butyrubber), NBR (nitrile butadiene rubber), hydrogenated NBR (H-NBR), EPDM, EPM (ethylene propylene rubber), NBR / EPDM blend, CR (chloroprene rubber) ), ACM (acrylic rubber), CO (hydrin rubber), ECO (epichlorohydrin rubber), chlorinated polyethylene (Chlorinated-PE), VAMAC (ethylene-acrylic rubber), VMQ (Si Rubber materials such as corn rubber), U (urethane rubber), FKM (fluoro rubber), NR (natural rubber), CSM (chlorosulfonated polyethylene rubber); PVC (polyvinyl chloride), polyethylene, polypropylene, polystyrene, polyester, polyurethane , Polyamide, polyimide, nylon, ethylene vinyl acetate, ethylene ethyl acrylate, ethylene methyl acrylate, styrene butadiene, polyarylate, polycarbonate, fluororesin, silicone resin, polymethacrylate, polybutyl methacrylate, polyvinyl acetate, polyvinyl butyral, polyacryl It is selected from resin materials such as acid resin, rosin, modified rosin, terpene resin and phenol resin. Among these, a rubber material is preferable.

Further, as an adhesive for adhering the inner periphery of the tube 6 and the outer periphery of the foam layer 4, a conductive agent such as conductive carbon or metal powder is dispersed in a resin binder such as urethane, polyester, nylon, epoxy, etc. For example, a conductive adhesive paint dissolved in The adhesive may be applied by any of spraying, spray coating, dip coating, and brush coating.
The thickness of the conductive adhesive layer formed by applying the adhesive in this way is not particularly limited, but is preferably about 1 to 20 μm. Further, the electrical resistance when 100 V is applied in the conductive adhesive layer is preferably 10 ³ Ω or less.

The method for producing a semiconductive roll according to the present invention is characterized in that the shape of the tube 6 into which the cored bar 2 having the foamed layer 4 is inserted is corrected before the adhesive is cured. By performing this correction, the runout accuracy in the semiconductive roll of the present invention described later can be set to 0.35 mm or less.
Here, “correcting” means correcting the runout accuracy and roundness of the semiconductive roll by applying an external force.

  As the correction method, a tube 6 into which a core metal 2 having a foam layer 4 is inserted is placed on two abutted cylindrical rolls, and the two abutted cylindrical shapes are placed. There is a method (first method) in which the rolls are rotated about the rotation axis. Examples of the cylindrical roll include an aluminum pipe, but there is no particular limitation as long as smoothness is obtained. Further, a hollow pipe or a solid pipe may be used. Since the outer diameter of the cylindrical roll, the number of revolutions, and the distance from the tube 6 into which the core metal 2 with the foam layer 4 is inserted differ depending on the radius of the tube 6 with the core metal 2 with the foam layer 4 inserted therein. In order to provide versatility, it is preferable that the variable setting is possible. On the other hand, the loading time is preferably 0.5 to 30 seconds, and more preferably 3 to 10 seconds.

In addition, as shown in FIG. 2, the straightening method is such that a tube 6 into which a core metal 2 having a foam layer 4 is inserted is brought into contact with a cylindrical roll 8, and the cylindrical roll 8 is centered on the rotation axis. (A second method). As the cylindrical roll 8, the cylindrical roll in the first method is preferably used. The outer diameter of the cylindrical roll 8, the number of revolutions, and the distance from the tube 6 into which the cored bar 2 on which the foam layer 4 is formed are not particularly limited.
In the second method, the foamed layer 4 was formed while keeping the rotation axis of the core metal 2 and the rotation axis of the cylindrical roll 8 parallel to each other and maintaining a constant distance (distance 51 in FIG. 2). It is preferable that the tube 6 into which the core metal 2 is inserted is brought into contact with the cylindrical roll 8 and the cylindrical roll 8 is rotated about the rotation axis.
The amount of biting between the tube 6 into which the core metal 2 having the foam layer 4 formed in this method is inserted and the cylindrical roll 8 is preferably 0.1 to 0.5 mm, more preferably 0.2 to 0.3 mm. . Further, the contact time is preferably 0.5 to 30 sec, and more preferably 3 to 10 sec.

Further, as a method for correcting, as shown in FIG. 3, the tube 6 into which the core metal 2 having the foam layer 4 is inserted is brought into contact with the smooth flat surface 9 and rotated around the rotation axis of the core metal 2. A method (third method) may be mentioned. At this time, the tube 6 into which the cored bar 2 on which the foam layer 4 is formed is inserted into the cored bar 2 while keeping the rotation axis of the cored bar 2 and a smooth plane parallel to each other and maintaining a constant distance (distance 54 in FIG. 3). It is preferable to rotate around the rotation axis.
The amount of biting with the smooth flat surface 9 into which the cored bar 2 on which the foam layer 4 is formed in this method is preferably 0.1 to 0.5 mm, and more preferably 0.2 to 0.3 mm. Further, the contact time is preferably 0.5 to 30 sec, and more preferably 3 to 10 sec. Furthermore, as the rotation speed of the tube 6 into which the cored bar 2 on which the foam layer 4 is formed is inserted, 15 to 300 rpm is preferable, and 30 to 240 rpm is more preferable.

The semiconductive roll of the first aspect of the present invention is a semiconductive roll manufactured by the method for manufacturing a semiconductive roll of the present invention described above, and the hardness of the foamed layer 4 measured by the Asker F hardness meter is 30 to 30. The semiconductive roll is 80 °, and the runout accuracy of the semiconductive roll is 0.35 mm or less. The runout accuracy in the present invention means “circumferential runout” defined in JIS B0021.
Here, the hardness by the Asker F hardness meter is a value measured by using an Asker rubber hardness meter F type manufactured by Kobunshi Keiki Co., Ltd. and measuring at 25 ° C. and 55% RH.
On the other hand, the runout accuracy is a value measured by using a roll diameter measurement system ROLL2000, Asaka Riken Kogyo Co., Ltd. Specifically, the semiconductive roll to be measured is set on the roll diameter measuring system ROLL2000 of Asaka Riken Kogyo Co., Ltd. so as to support both ends which are the measurement reference surfaces of the circumferential runout, and the rotation of the charging roll Under a condition of several 60 rpm and a rotation time of 5 sec, the distance between the semiconductive roll as the object to be measured and the knife edge installed in parallel with the semiconductive roll is measured, and from the fluctuation range of the distance during this 5 sec. Circumferential run-out was obtained. The above-mentioned measurement was measured at a position 5 mm from both ends of the semiconductive roll and at three positions in the axial central portion, and the average was taken as the runout accuracy (circumferential runout) in the present invention.

  As mentioned above, the hardness by the Asker F hardness meter of the foam layer in the semiconductive roll of the first present invention must be 30 to 80 °, preferably 30 to 50 °, preferably 30 to 30 °. More preferably, it is 40 °. If the hardness by the Scar F hardness tester is less than 30 °, the roll shape may not be maintained after the core metal having a foam layer formed on the tube is inserted. If the hardness exceeds 80 °, the roll is used as a charger. In this case, the contact pressure between the photosensitive member and the charger increases, which may cause a problem.

  Further, the runout accuracy of the semiconductive roll of the first aspect of the present invention is required to be 0.35 mm or less, and preferably 0.2 mm or less. When the runout accuracy exceeds 0.35 mm, when a semiconductive roll is used as a charger, a portion that does not come into contact with the photoconductor is generated, which may cause problems such as charging failure.

The thickness of the foamed layer 4 in the semiconductive roll of the first aspect of the present invention is 0.5 to 10.0 mm in terms of sufficiently functioning as an elastic layer and stabilizing the dimensional accuracy after inserting the tube. It is preferable that it is 1.0 to 5.0 mm.
Further, the thickness of the semiconductive elastic layer formed by the tube 6 is preferably 0.1 to 2.0 mm from the viewpoint of workability, shape maintenance, and stability of electrical characteristics, More preferably, it is 5-1.0 mm.

  On the other hand, the semiconductive roll of the second aspect of the present invention is a semiconductive roll in which a foam layer is formed on the outer periphery of the core metal, and a semiconductive elastic layer made of a rubber tube is formed on the outer periphery of the foam layer. And the hardness by the Asker F hardness meter of the said foaming layer is 30-80 degrees, and the runout precision of the said semiconductive roll is 0.35 mm or less, It is characterized by the above-mentioned.

The tube in the semiconductive roll of the second aspect of the present invention is limited to a rubber material, but preferred aspects such as physical properties and dimensions are the same as those of the tube in the semiconductive roll of the first aspect of the present invention. .
Moreover, the preferable aspect of the core metal and the foam layer in the semiconductive roll of the second aspect of the present invention is the same as the preferable aspect of the core metal and the foam layer of the semiconductive roll of the first aspect of the present invention.

  The image forming apparatus of the present invention includes at least an image carrier and a charging member in contact with the image bearing member. Prior to forming an electrostatic latent image, the charging member and the charging member are applied with a voltage applied to the charging member. An image forming apparatus including a configuration for charging the surface of the image carrier by rotating the image carrier around the image carrier, wherein the charging member is the semiconductive roll according to the first aspect of the invention described above. It is a semiconductive roll described in the second semiconductive roll of the present invention (hereinafter sometimes referred to as “the semiconductive roll of the present invention”).

Hereinafter, an example of the image forming apparatus of the present invention will be described with reference to FIG. FIG. 4 is a schematic configuration diagram illustrating an example of the image forming apparatus 10 using the semiconductive roll of the present invention. In addition, the arrow in FIG. 4 has shown the rotation direction of each rotation member. The above-described semiconductive roll of the present invention is used as a charging roll for charging the image carrier.
As shown in FIG. 4, the image forming apparatus 10 includes image forming units 12Y, 12M, 12C, and 12K that form images of colors of Y (yellow), M (magenta), C (cyan), and K (black). Are arranged in parallel at a predetermined interval. Here, since the image forming units 12Y, 12M, 12C, and 12K have substantially the same configuration, the image forming unit 12Y corresponding to yellow will be described as an example.

The image forming unit 12Y includes a photosensitive drum (image carrier) 14Y. The photosensitive drum 14Y is rotated in a direction indicated by an arrow A by a driving unit (not shown) at a predetermined speed.
A charging roll 16Y of a charging device, which will be described later, is disposed on the photosensitive drum 14Y, and charges the surface of the photosensitive drum 14Y.
An optical scanning device (not shown) is arranged on the left side of the photosensitive drum 14Y in the drawing, and irradiates the photosensitive drum 14Y with laser light 18Y. As a result, an electrostatic latent image is formed on the surface of the photosensitive drum 14Y.

Further, a developing device 20Y is disposed on the downstream side in the rotation direction of the photosensitive drum 14Y from the irradiation position of the laser beam. The developing device 20Y visualizes the electrostatic latent image formed on the surface of the photosensitive drum 14Y with yellow toner, and forms a toner image on the surface.
The toner image on the photoconductor drum 14Y is primarily transferred to the first primary intermediate transfer drum 22, becomes a yellow and magenta color image, and is secondarily transferred to the secondary intermediate transfer drum 26. It overlaps with the cyan and black toner images transferred from the secondary intermediate transfer drum 24 and becomes a full color toner image of yellow, magenta, cyan and black.

  Here, the recording paper P is fed from a paper cassette (not shown) through the paper conveyance roll 30 to the nip portion between the secondary intermediate transfer drum 26 and the transfer roll 28, and a full color toner image is electrostatically formed on the surface of the recording paper P. Transcribed. The recording paper P onto which the full-color toner image has been transferred is heated and pressed by the fixing device 32 to fix the toner image. The above is the image forming process.

  Since the semiconductive roll of the present invention has a softness of 30 to 80 ° as measured by the Asker F hardness meter of the foam layer, when used as a charging member, it absorbs toner remaining on the photosensitive drum (image carrier). Therefore, the photosensitive drum is not damaged. Further, since the runout accuracy is as good as 0.35 mm or less, uniform chargeability can be obtained.

<Example 1>
The charging roll 16 in FIG. 4 was produced as follows.
Polyether and isocyanate were mixed and sufficiently bubbled using a stirrer. The obtained urethane resin was heated and cured to produce a urethane material having a three-dimensional network structure. When the structure of the obtained urethane material having a three-dimensional network structure was observed with a microscope, the shortest distance between the skeletons was 300 μm or more (average 500 μm), and the thickness of the skeleton was 800 μm or less (average 250 μm). . The obtained urethane material having a three-dimensional network structure was cut out as a prism having a side of 10 mm and a length of 320 mm, and a hole penetrating in the longitudinal direction at 5 mmφ was provided at the center. Next, a polyester conductive adhesive was coated on the outer periphery with a thickness of 5 μm. A 6 mmφ sulfur free-cutting steel nickel-plated (SUM-Ni) metal shaft was inserted into a hole provided in the urethane material having the three-dimensional network structure, and both were integrated.
The hardness by the Asker F hardness meter at this time was 30 °.

  Thereafter, the metal shaft was rotated at a high speed to polish the urethane material having a three-dimensional network structure on the outer periphery, thereby producing a roll having an elastic layer made of urethane having a three-dimensional network structure having an outer diameter of Φ8.5 mm. Further, the obtained roll was immersed in a polyester-based conductive adhesive, and a conductive treatment of an elastic layer made of urethane having a three-dimensional network structure was performed to form a conductive elastic layer (foamed layer). Separately, after adding 3 parts by mass of ionic conductive agent PEL-100 (manufactured by Nippon Carlit Co., Ltd.) to 100 parts by mass of epichlorohydrin rubber, this is molded using an extruder, and then polished to a desired outer surface. A tube made of epichlorohydrin rubber to be a semiconductive elastic layer having an outer diameter of Φ10.0 mm, a wall thickness of 750 μm and a length of 230 mm was prepared. The inner and outer peripheral surfaces of the rubber tube serving as the semiconductive elastic layer were coated with a fluorine resin with a film thickness of 5 μm by a dip coating method. On the other hand, 5 μm of the polyester-based conductive adhesive was applied to the outer periphery of the urethane resin into which the metal shaft was inserted, and was inserted into the rubber tube by press-fitting into the tube. At this time, the runout accuracy (runout accuracy before correction) of the rubber tube into which the urethane resin into which the metal shaft was inserted was inserted was measured.

In addition, the distortion of the rubber tube generated when the core metal having the foam layer formed below is inserted into the rubber tube is reduced by the second method (the tube into which the core metal 2 having the foam layer 4 is inserted). 6 was brought into contact with the cylindrical roll 8, and a correction device for correcting the cylindrical roll 8 by rotating the cylindrical roll 8 around the rotation axis was produced.
Specifically, an aluminum pipe having a length of 250 mm, Φ20 mm, and a total runout accuracy of 20 μm is prepared, and the distance between the central axes of the aluminum pipe (Φ20 mm) and the semiconductive roll (Φ10 mm) is 14.7 mm (the amount of biting is 0). 3 mm), a device capable of fixing the position of the aluminum pipe and the semiconductive roll and capable of rotating the aluminum pipe was manufactured.

  The rubber tube into which the urethane resin into which the metal shaft had been inserted was inserted into the semiconductive roll under the conditions that the aluminum pipe was rotated at 45 rpm and the rotation time was 10 sec. The runout accuracy (runout accuracy after correction) of the obtained semiconductive roll was measured.

Under the above conditions, 96 semiconductive rolls were produced, and the shake accuracy before correction and the shake accuracy after correction were measured for each semiconductive roll. The result is shown in FIG. FIG. 5 is a graph showing the results of the shake accuracy before correction and the shake accuracy after correction as a bar graph.
From the distribution of runout accuracy shown in FIG. 5, by correcting the shape of the tube into which the cored bar with the foam layer was inserted, the runout accuracy could be improved by about 10%.
In addition, the correction improved the ratio of semiconductive rolls with a runout accuracy of 0.2 mm or less, which is a guideline for good runout accuracy, from 87% to 97%.

  In Example 1, the second method (the tube 6 into which the core 2 having the foam layer 4 formed is inserted is brought into contact with the cylindrical roll 8, and the cylindrical roll 8 is rotated around the rotation axis. The shape of the tube 6 into which the cored bar 2 with the foam layer 4 is inserted was corrected by the above-described method. A method in which the two abutted cylindrical rolls are respectively rotated about a rotation axis) and the third method (foam layer 4). The tube 6 in which the cored bar 2 in which the foamed layer 4 is formed is inserted by a method in which the tube 6 in which the cored bar 2 with the core is inserted is brought into contact with a smooth flat surface 9 and rotated around the rotation axis of the cored bar 2 Even if the shape is corrected, the same effect as in the first embodiment can be obtained.

It is a figure for demonstrating the semiconductive roll of this invention. It is a figure which shows an example of the method of correcting the shape of the tube which inserted the metal core. It is a figure which shows the other example of the method of correcting the shape of the tube which inserted the metal core. 1 is a schematic view of an example of an image forming apparatus of the present invention. It is the figure which represented as a bar graph the result of the shake accuracy before correction, and the shake accuracy after correction.

Explanation of symbols

2 Core metal 4 Foam layer 6 Tube 8 Cylindrical roll 9 Smooth flat surface 10 Image forming apparatus 14 Photosensitive drum (image carrier)
16 Charging roll 20 Developing device 22, 24 Primary intermediate transfer drum 26 Secondary intermediate transfer drum 28 Transfer roll 30 Paper transport roll 32 Fixing device 40 Conductive shaft 42 Conductive foamed elastic layer 44 Semiconductive seamless tubes 51, 54 Distance

Claims (1)

A foam layer is formed on the outer periphery of the core metal, the core metal with the foam layer formed on the outer periphery is inserted into the tube through an adhesive, and the adhesive is cured to form on the outer periphery of the core metal. A method for producing a semiconductive roll for bonding a foam layer and a tube,
Before the adhesive is cured, the tube into which the metal core is inserted is brought into contact with the cylindrical roll, and the rotation axis of the metal core and the rotation of the cylindrical roll are brought into contact with the cylindrical roller. While rotating the cylindrical roll around the axis of rotation of the cylindrical roll while keeping the shaft parallel and at a constant distance, the tube with the cored bar applied to a smooth plane A method for producing a semiconductive roll , wherein the tube is corrected by rotating the tube around a rotation axis of a cored bar .

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