JP4687913B2 - Polymer compound, resist material, and pattern forming method - Google Patents

Description

  The present invention relates to a high-molecular compound useful as a base polymer of a resist material suitable for microfabrication technology, particularly a chemically amplified resist material, a resist material, and a pattern forming method using the same.

  In recent years, with the high integration and high speed of LSI, there is a demand for finer pattern rules.

  The background of rapid progress in miniaturization includes high projection lens NA, improved resist performance, and shorter wavelength. With regard to higher resolution and higher sensitivity of resists, chemically amplified positive resist materials catalyzed by acids generated by light irradiation have excellent performance and have become the mainstream resist materials particularly in deep ultraviolet lithography. (Described in JP-B-2-27660, JP-A-63-27829, etc.). In addition, the shortening of the wavelength from i-line (365 nm) to KrF (248 nm) has brought about a major change. Resist materials for KrF excimer lasers started with the 0.30 micron process, passed the 0.25 micron rule, The micron rule is being applied to mass production. Furthermore, the study of the 0.15 micron rule has begun, and the momentum of miniaturization is increasingly accelerated.

  In ArF (193 nm), it is expected that the refinement of the design rule will be 0.13 μm or less. However, since resins that have been conventionally used such as novolak and polyvinylphenol have very strong absorption around 193 nm. It cannot be used as a base resin for resist. Therefore, in order to ensure transparency and necessary dry etching resistance, acrylic and cycloolefin type alicyclic resins have been studied (Japanese Patent Laid-Open Nos. 9-73173, 10-10739, and 9-93). No. 230595, International Publication No. 97/33198 Pamphlet).

As for F ₂ (157 nm), miniaturization of 0.10 μm or less is expected, but it becomes increasingly difficult to ensure transparency, and acrylic resin that is a base polymer for ArF does not transmit light at all, and cycloolefin Even in the system, those having a carbonyl bond were found to have strong absorption. Further, it was found that polyvinylphenol, which is a base polymer for KrF, has an absorption window near 160 nm and slightly improves the transmittance, but is far from a practical level.

According to the study of the present inventor, as a method for improving the transmittance around 157 nm, it can be considered to reduce the number of carbonyl groups and carbon-carbon double bonds as one method. It has been found that introduction of fluorine atoms greatly contributes to the improvement of transmittance. In fact, a polymer in which fluorine is introduced into the aromatic ring of polyvinylphenol was able to obtain a transmittance close to practical use. However, it became clear that this base polymer was negatively developed by irradiation with high energy light such as F ₂ laser, and it was found difficult to put it into practical use as a resist. On the other hand, it was found that a polymer in which fluorine was introduced into a polymer compound containing an aliphatic resin derived from an acrylic resin or a norbornene derivative in the main chain can suppress absorption and lower the problem of negativity. .

Here, co of the SPIE2001 Lecture No. 4345-31 Polymer design for 157-nm chemically amplified resists, αCF 3 acrylate t-butyl and 5- (2-hydroxy-2,2-bis-trifluoromethyl) ethyl-2-norbornene Polymerization, copolymerization of αCF ₃ tbutyl acrylate and 3- (hydroxybistrifluoromethyl) methylstyrene, was reported to be a resist polymer that is highly transparent and excellent in dry etching resistance. However, even in this case, the absorbance is about 2 to 3. In the above report, only a pattern formation example having a film thickness of about 1,000 mm has been reported, and it is necessary to further improve the transmittance. It is said that an absorbance of 2 or less is necessary to obtain a rectangular pattern of 2,000 mm or more. However, a material satisfying all the characteristics such as dry etching resistance, alkali solubility, adhesion, and transparency has not yet been reported.

  In order to process the base with an extremely thin resist pattern having a thickness of 1,000 to 1,500 mm, a resist material having high etching resistance is required.

  The polymerization method of the polymer of α-trifluoromethylacrylic acid derivative is described in A. C. S Macromolecules 1982, 15, 915-920, and has been studied as a resist application for main chain decomposition type electron beam exposure.

  Japanese Patent Laid-Open No. 9-43848 proposes α-trifluoromethyl acrylate ester having a cyclic structure, but this is proposed as a non-chemically amplified resist for main chain decomposition. .

JP-B-2-27660 JP 63-27829 A JP-A-9-73173 Japanese Patent Laid-Open No. 10-10739 Japanese Patent Laid-Open No. 9-230595 International Publication No. 97/33198 Pamphlet Japanese Patent Laid-Open No. 9-43848 SPIE 2001 Lecture Number 4345-31 Polymer design for 157-nm chemically amplified resists A. C. S Macromolecules 1982, 15, 915-920

The present invention has been made in view of the above circumstances, and is only excellent in transmittance in vacuum ultraviolet light of 300 nm or less, particularly F ₂ (157 nm), Kr ₂ (146 nm), KrAr (134 nm), Ar ₂ (126 nm) and the like. In addition, an object of the present invention is to provide a novel polymer compound useful as a base polymer of a chemically amplified resist material having excellent etching resistance, a resist material containing the same, and a pattern forming method using the resist material.

  In order to achieve the above object, the inventors of the present invention are an α-trifluoromethylacrylic acid derivative, a copolymer of an acid-removable cyclic ester-substituted product and a cycloolefin, or a hexafluoroalcohol pendant styrene copolymer. Focusing on the fact that polymers are promising materials as positive resists due to the elimination of the ester moiety by acid, and as a result of intensive studies, acrylic polymer monomers containing fluorine at the α-position In particular, by using a copolymer of a monomer having 6 to 20 carbon atoms and having at least one alicyclic structure and a norbornene derivative or a copolymer of hexafluoroisopropanol styrene as a base polymer, transparency Provides a resist material that can drastically improve resistance to dry etching and secure resistance to dry etching This has been found and the present invention has been achieved.

（式中、Ｒ¹、Ｒ²は水素原子、フッ素原子、又は炭素数１〜２０の直鎖状、分岐状もしくは環状のアルキル基又はフッ素化されたアルキル基である。Ｒ³はフッ素原子、又は炭素数１〜２０の直鎖状、分岐状もしくは環状のフッ素化されたアルキル基である。Ｒ⁴は炭素数６〜２０の少なくとも１つ以上の環状構造を持つ酸不安定基である。

は、下記式から選ばれる単位である。

ｍ、ｐは０＜ｍ＜１、０＜ｐ＜１であり、０＜ｍ＋ｐ≦１である。）
請求項２：
Ｒ³が炭素数１〜２０の直鎖状、分岐状もしくは環状のフッ素化されたアルキル基であることを特徴とする請求項１記載の高分子化合物。
請求項３：
Ｒ³がトリフルオロメチル基であることを特徴とする請求項２記載の高分子化合物。
請求項４：
請求項１乃至３のいずれか１項に記載の高分子化合物を含むことを特徴とするレジスト材料。
請求項５：
（Ａ）請求項１乃至３のいずれか１項に記載の高分子化合物、
（Ｂ）有機溶剤、
（Ｃ）酸発生剤
を含有することを特徴とする化学増幅レジスト材料。
請求項６：
更に塩基性化合物を含有する請求項５記載のレジスト材料。
請求項７：
更に溶解阻止剤を含有する請求項５又は６記載のレジスト材料。
請求項８：
（１）請求項４乃至７のいずれか１項に記載のレジスト材料を基板上に塗布する工程と、
（２）次いで加熱処理後、フォトマスクを介して波長１００〜１８０ｎｍ帯又は１〜３０ｎｍ帯の高エネルギー線で露光する工程と、
（３）必要に応じて加熱処理した後、現像液を用いて現像する工程とを含むことを特徴とするパターン形成方法。
請求項９：
前記高エネルギー線がＦ₂レーザー、Ａｒ₂レーザー、又は軟Ｘ線であることを特徴とする請求項８記載のパターン形成方法。 That is, the present invention provides the following polymer compound, resist material, and pattern forming method.
Claim 1:
A polymer compound having a repeating unit represented by the following general formulas (1m) and (1p).

Wherein R ¹ and R ² are a hydrogen atom, a fluorine atom, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms or a fluorinated alkyl group. R ³ is a fluorine atom, Or a linear, branched or cyclic fluorinated alkyl group having 1 to 20 carbon atoms, and R ⁴ is an acid labile group having at least one cyclic structure having 6 to 20 carbon atoms.

Is a unit selected from the following formulae.

m, p is 0 <m <1,0 <p < 1, is 0 <m + p ≦ 1. )
Claim 2:
The polymer compound according to claim 1, wherein R ³ is a linear, branched or cyclic fluorinated alkyl group having 1 to 20 carbon atoms.
Claim 3:
The polymer compound according to claim 2, wherein R ³ is a trifluoromethyl group.
Claim 4:
A resist material comprising the polymer compound according to claim 1.
Claim 5:
(A) The polymer compound according to any one of claims 1 to 3,
(B) an organic solvent,
(C) A chemically amplified resist material containing an acid generator.
Claim 6:
Furthermore, the resist material of Claim 5 containing a basic compound.
Claim 7:
The resist material according to claim 5 or 6, further comprising a dissolution inhibitor.
Claim 8:
(1) A step of applying the resist material according to any one of claims 4 to 7 on a substrate;
(2) Next, after the heat treatment, a step of exposing with a high energy ray having a wavelength of 100 to 180 nm band or 1 to 30 nm band through a photomask;
(3) A pattern forming method comprising a step of performing heat treatment as necessary and then developing using a developer.
Claim 9:
The pattern forming method according to claim 8, wherein the high energy beam is an F ₂ laser, an Ar ₂ laser, or a soft X-ray.

The resist material of the present invention is sensitive to high energy rays, has excellent sensitivity at a wavelength of 200 nm or less, particularly 170 nm or less, improves the transparency of the resist, and at the same time has excellent plasma etching resistance. Therefore, the resist material of the present invention can be a resist material having a small absorption particularly at the exposure wavelength of the F ₂ laser due to these characteristics, and can easily form a fine pattern perpendicular to the substrate. Therefore, it is suitable as a fine pattern forming material for VLSI manufacturing.

Hereinafter, the present invention will be described in more detail.
The polymer compound of the present invention has a repeating unit represented by the following general formulas (1m) and (1p), and such an acrylate monomer having a fluorinated alkyl group and an alicyclic structure at the α-position; A copolymer of norbornene derivative or hexafluoroisopropanol styrene can ensure high transparency near 157 nm and has excellent dry etching resistance.

（式中、Ｒ¹、Ｒ²は水素原子、フッ素原子、又は炭素数１〜２０、特に１〜１２の直鎖状、分岐状もしくは環状のアルキル基又はフッ素化されたアルキル基である。Ｒ³はフッ素原子、又は炭素数１〜２０、特に１〜１２の直鎖状、分岐状もしくは環状のフッ素化されたアルキル基である。Ｒ⁴は炭素数６〜２０の少なくとも１つ以上の環状構造を持つ酸不安定基である。
また、Ｒ⁹は水素原子、フッ素原子、又は炭素数１〜２０、特に１〜１２の直鎖状、分岐状もしくは環状のアルキル基又はフッ素化されたアルキル基である。Ｒ¹⁰は単結合又は炭素数１〜４の２価の炭化水素基、Ｒ¹¹、Ｒ¹²は同一又は異種の水素原子、フッ素原子、又は炭素数１〜４のアルキル基又はフッ素化されたアルキル基であり、Ｒ¹¹、Ｒ¹²のどちらか一方又は両方に少なくとも１個以上のフッ素原子を含む。Ｒ¹³は水素原子、炭素数１〜１０の直鎖状、分岐状もしくは環状のアルキル基、又は酸不安定基である。Ｒ¹⁴は水素原子、フッ素原子、又は炭素数１〜４の直鎖状又は分岐状のアルキル基又はフッ素化されたアルキル基である。０＜ｍ＜１、０＜ｐ＜１であり、０＜ｍ＋ｐ≦１である。ｅは０〜４の整数であり、ｆは１〜３の整数である。）

(In the formula, R ¹ and R ² are a hydrogen atom, a fluorine atom, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, particularly 1 to 12 carbon atoms, or a fluorinated alkyl group. ³ is a fluorine atom or a linear, branched or cyclic fluorinated alkyl group having 1 to 20 carbon atoms, particularly 1 to 12. R ⁴ is at least one cyclic group having 6 to 20 carbon atoms. An acid labile group with a structure.
R ⁹ is a hydrogen atom, a fluorine atom, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, particularly 1 to 12 carbon atoms, or a fluorinated alkyl group. R ¹⁰ is a single bond or a divalent hydrocarbon group having 1 to 4 carbon atoms, R ¹¹ and R ¹² are the same or different hydrogen atoms, fluorine atoms, alkyl groups having 1 to 4 carbon atoms or fluorinated alkyl. And at least one fluorine atom is contained in one or both of R ¹¹ and R ¹² . R ¹³ is a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, or an acid labile group. R ¹⁴ is a hydrogen atom, a fluorine atom, a linear or branched alkyl group having 1 to 4 carbon atoms, or a fluorinated alkyl group. 0 <m <1, 0 <p <1, and 0 <m + p ≦ 1. e is an integer of 0 to 4, and f is an integer of 1 to 3. )

  Here, as the linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, A cyclopentyl group, a cyclohexyl group, a 2-ethylhexyl group, an n-octyl group and the like can be exemplified, and those having 1 to 12 carbon atoms, particularly 1 to 10 carbon atoms are preferable. The fluorinated alkyl group is one in which part or all of the hydrogen atoms of the alkyl group are substituted with fluorine atoms, and includes a trifluoromethyl group, 2,2,2-trifluoroethyl group, 3, 3,3-trifluoropropyl group, 1,1,1,3,3,3-hexafluoroisopropyl group, 1,1,2,2,3,3,3-heptafluoropropyl group, 2,2,3 , 3,4,4,5,5-octafluoropentyl group and the like, and groups represented by the following formulas are also used.

（式中、Ｒは水素原子、フッ素原子、炭素数１〜２０の直鎖状、分岐状もしくは環状のアルキル基又はフッ素化されたアルキル基であり、０≦ｇ≦１０である。）
Ｒ¹⁰の２価の炭化水素基としては、アルキレン基が挙げられる。

(In the formula, R represents a hydrogen atom, a fluorine atom, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms or a fluorinated alkyl group, and 0 ≦ g ≦ 10.)
Examples of the divalent hydrocarbon group for R ¹⁰ include an alkylene group.

Next, the acid labile group represented by R ⁴ will be described.
First, various acid labile groups are selected. As shown in the general formula (AL-1), the total number of carbon atoms in R ¹⁶ , R ¹⁷ and R ¹⁸ is 6 to 20, and at least one or more rings. It is necessary to have a formula structure. The cyclic structure may be a monocyclic structure, but if it has a bridged cyclic structure, the etching resistance can be further improved. In addition, an acid leaving group having a cyclic structure introduced therein has high elimination reactivity and can improve contrast, that is, γ of dissolution.

Here, R ¹⁵ , R ¹⁶ and R ¹⁷ are the same or different monovalent hydrocarbon groups such as linear, branched or cyclic alkyl groups having 1 to 30 carbon atoms, particularly 1 to 12 carbon atoms, It may be a cyclic hydrocarbon group. R ¹⁵ and R ¹⁶ , R ¹⁶ and R ¹⁷ , R ¹⁵ and R ¹⁷ may be bonded to each other to form a ring having 3 to 16 carbon atoms, particularly 4 to 14 carbon atoms together with the carbon atoms to which they are bonded, At least one of R ¹⁵ , R ¹⁶ and R ¹⁷ is a cyclic group, or at least one of R ¹⁵ and R ¹⁶ , R ¹⁶ and R ¹⁷ , R ¹⁵ and R ¹⁷ is bonded to the carbon atom to which they are bonded. Form. Specifically, the following can be exemplified.

（式中、Ｒ²¹及びＲ²²は炭素数１〜６のヘテロ原子を含んでもよい直鎖状、分岐状もしくは環状のアルキル基等の１価炭化水素基を示す。この場合、ヘテロ原子としては、酸素原子、硫黄原子、窒素原子を挙げることができ、−ＯＨ、−ＯＲ²⁵、−Ｏ−、−Ｓ−、−Ｓ（＝Ｏ）−、−ＮＨ₂、−ＮＨＲ²⁵、−Ｎ（Ｒ²⁵）₂、−ＮＨ−、−ＮＲ²⁵−などの形態で含有又は介在することができる。Ｒ²³及びＲ²⁴は水素原子、ヒドロキシ基、炭素数１〜６のヘテロ原子を含んでいてもよい直鎖状、分岐状のアルキル基又はアルコキシ基を示す。Ｒ²⁵は炭素数１〜１０の直鎖状、分岐状又は環状のアルキル基を示す。）

(In the formula, R ²¹ and R ²² represent a monovalent hydrocarbon group such as a linear, branched or cyclic alkyl group which may contain a hetero atom having 1 to 6 carbon atoms. In this case, as the hetero atom, , Oxygen atom, sulfur atom, nitrogen atom, —OH, —OR ²⁵ , —O—, —S—, —S (═O) —, —NH ₂ , —NHR ²⁵ , —N (R ²⁵ ) ₂ , —NH—, —NR ²⁵ —, etc. R ²³ and R ²⁴ may contain a hydrogen atom, a hydroxy group, or a hetero atom having 1 to 6 carbon atoms. A linear or branched alkyl group or an alkoxy group, and R ²⁵ represents a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms.

Specific examples of R ²¹ and R ²² include methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, sec-butyl group, n-pentyl group, n-hexyl group, cyclopropyl group, cyclopropylmethyl. Group, cyclobutyl group, cyclopentyl group, cyclohexyl group and the like. As R ²³ and R ²⁴ , a hydrogen atom, a hydroxy group, a linear, branched or cyclic alkyl group having 1 to 6 carbon atoms, particularly 1 to 5 carbon atoms, a hydroxyalkyl group, an alkoxyalkyl group, an alkoxy group, or the like is used. Specific examples thereof include methyl group, hydroxymethyl group, ethyl group, hydroxyethyl group, propyl group, isopropyl group, n-butyl group, sec-butyl group, n-pentyl group, n-hexyl group and methoxy group. Methoxymethoxy group, ethoxy group, tert-butoxy group and the like.

Next, when R ¹³ is an acid labile group, it may be an acid labile group represented by general formula (AL-1), but is represented by the following general formulas (AL-10) and (AL-11). It may be an acid labile group.

In the formula (AL-10), R ²⁶ is a tertiary alkyl group having 4 to 20 carbon atoms, preferably 4 to 15 carbon atoms, each alkyl group is a trialkylsilyl group having 1 to 6 carbon atoms, and 4 to 20 carbon atoms. An oxoalkyl group or a group represented by the above general formula (AL-1) is shown. Specific examples of the tertiary alkyl group include a tert-butyl group, a tert-amyl group, a 1,1-diethylpropyl group, and 1-ethyl. Cyclopentyl group, 1-butylcyclopentyl group, 1-ethylcyclohexyl group, 1-butylcyclohexyl group, 1-ethyl-2-cyclopentenyl group, 1-ethyl-2-cyclohexenyl group, 2-methyl-2-adamantyl group, etc. Specific examples of the trialkylsilyl group include a trimethylsilyl group, a triethylsilyl group, and a dimethyl-tert-butylsilyl group. It is, specifically oxoalkyl group, 3-oxo-cyclohexyl group, 4-methyl-2-oxooxan-4-yl group, and 5-methyl-2-oxooxolan-5-yl group. a1 is an integer of 0-6.

In the formula (AL-11), R ²⁷ and R ^{28 each} represent a hydrogen atom or a linear, branched or cyclic alkyl group having 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms, specifically a methyl group, Examples thereof include an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, a cyclopentyl group, a cyclohexyl group, a 2-ethylhexyl group, and an n-octyl group. R ²⁹ represents a monovalent hydrocarbon group which may have a hetero atom such as an oxygen atom having 1 to 18 carbon atoms, preferably 1 to 10 carbon atoms, a linear, branched or cyclic alkyl group, Examples include those in which a part of hydrogen atoms are substituted with a hydroxyl group, an alkoxy group, an oxo group, an amino group, an alkylamino group, and the like, and specific examples include the following substituted alkyl groups.

R ²⁷ and R ²⁸ , R ²⁷ and R ²⁹ , R ²⁸ and R ²⁹ may form a ring, and in the case of forming a ring, R ²⁷ , R ²⁸ , and R ²⁹ each have 1 to 18 carbon atoms, Preferably 1-10 linear or branched alkylene groups are shown.

  Specific examples of the acid labile group of the above formula (AL-10) include tert-butoxycarbonyl group, tert-butoxycarbonylmethyl group, tert-amyloxycarbonyl group, tert-amyloxycarbonylmethyl group, 1,1 -Diethylpropyloxycarbonyl group, 1,1-diethylpropyloxycarbonylmethyl group, 1-ethylcyclopentyloxycarbonyl group, 1-ethylcyclopentyloxycarbonylmethyl group, 1-ethyl-2-cyclopentenyloxycarbonyl group, 1-ethyl Examples include 2-cyclopentenyloxycarbonylmethyl group, 1-ethoxyethoxycarbonylmethyl group, 2-tetrahydropyranyloxycarbonylmethyl group, 2-tetrahydrofuranyloxycarbonylmethyl group and the like.

  Furthermore, the substituent shown by following formula (AL-10) -1-(AL-10) -9 can also be mentioned.

（ａ２は０〜６の整数）

(A2 is an integer of 0 to 6)

Here, in the formulas (AL-10) -1 to (AL-10) -10, R ³⁰ is the same or different linear, branched or cyclic alkyl group having 1 to 8 carbon atoms, or 6 carbon atoms. -20 aryl groups or aralkyl groups are shown. R ³¹ represents a hydrogen atom or a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms. R ³² represents a linear, branched or cyclic alkyl group having 2 to 20 carbon atoms, or an aryl group or aralkyl group having 6 to 20 carbon atoms.

  Of the acid labile groups represented by the above formula (AL-11), examples of the linear or branched ones include those of the following formulas (AL-11) -1 to (AL-11) -23. be able to.

  Among the acid labile groups represented by the above formula (AL-11), the cyclic ones include tetrahydrofuran-2-yl group, 2-methyltetrahydrofuran-2-yl group, tetrahydropyran-2-yl group, 2- Examples thereof include a methyltetrahydropyran-2-yl group.

  In addition, the base resin may be intermolecularly or intramolecularly crosslinked by an acid labile group represented by the general formula (AL-11a) or (AL-11b).

In the formula, R ³³ and R ³⁴ represent a hydrogen atom or a linear, branched or cyclic alkyl group having 1 to 8 carbon atoms. Alternatively, R ³³ and R ³⁴ may be bonded to form a ring, and when forming a ring, R ³³ and R ³⁴ represent a linear or branched alkylene group having 1 to 8 carbon atoms. R ³⁵ is a linear, branched or cyclic alkylene group having 1 to 10 carbon atoms, b and d are 0 or 1 to 10, preferably 0 or an integer of 1 to 5, and c is an integer of 1 to 7. . A represents a (c + 1) -valent aliphatic or alicyclic saturated hydrocarbon group having 1 to 50 carbon atoms, an aromatic hydrocarbon group or a heterocyclic group, and these groups may intervene a hetero atom, Alternatively, a part of hydrogen atoms bonded to the carbon atom may be substituted with a hydroxyl group, a carboxyl group, a carbonyl group, or a fluorine atom. B represents —CO—O—, —NHCO—O— or —NHCONH—.

  In this case, preferably, A is a divalent to tetravalent C1-20 linear, branched or cyclic alkylene group, an alkyltriyl group, an alkyltetrayl group, or an arylene group having 6 to 30 carbon atoms. In these groups, a hetero atom may be interposed, and a part of hydrogen atoms bonded to the carbon atom may be substituted with a hydroxyl group, a carboxyl group, an acyl group, or a halogen atom. C is preferably an integer of 1 to 3.

  Specific examples of the cross-linked acetal groups represented by the general formulas (AL-11a) and (AL-11b) include those represented by the following formulas (AL-11) -24 to (AL-11) -31.

  In the present invention, specific examples of the repeating unit (1p) include the following.

  The polymer compound of the present invention contains an acid-elimination monomer of a repeating unit (1m) and a repeating unit (1p) containing an adhesive group, but may further contain the following repeating unit for improving the adhesion. it can.

In the formula, R ³⁶ , R ³⁷ , and R ³⁸ are a hydrogen atom, a fluorine atom, a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms, or a fluorinated alkyl group.

（式中、Ｒ³⁹は水素原子、ヒドロキシ基、又は炭素数１〜１０の直鎖状、分岐状又は環状のアルキル基を示し、０≦ｈ≦４、０≦ｉ≦４である。）

(In the formula, R ³⁹ represents a hydrogen atom, a hydroxy group, or a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, and 0 ≦ h ≦ 4 and 0 ≦ i ≦ 4.)

  The present invention provides a cycloolefin or styrene copolymer in which a repeating unit in which α-trifluoromethyl acrylate is substituted with an acid labile group having a cyclic structure is an essential component, and a substituted or unsubstituted hexafluoroalcohol is pendant. The trifluoromethylacrylic acid carboxylate has a cyclic unit substituted with an acid labile group having a cyclic structure and a substituted or unsubstituted hexafluoroalcohol pendant cyclohexane. A terpolymer of olefin and styrene pendant with hexafluoroalcohol or a copolymer of styrene or higher may be used. Also, two or more polymers having different molecular weights, dispersities, and copolymerization ratios may be blended.

  When synthesizing the polymer compound of the present invention, the monomer for giving the repeating unit represented by the above formulas (1m) and (1p) and the adhesion improving monomer are dissolved in a solvent, a catalyst is added, and heating may be performed in some cases. Alternatively, the polymerization reaction is performed while cooling.

  In addition, cycloolefin or styrene pendant with hexafluoroalcohol may be polymerized with a hydroxy group, or after substitution with an acetyl group, the acetoxy group may be eliminated with alkaline water after polymerization. Alternatively, an acetoxy group can be used as the adhesive group. In addition, cycloolefin pendant with hexafluoroalcohol or hydroxy group of styrene may be substituted with acetal such as ethoxyethoxy group to perform polymerization, and after polymerization, ethoxyethoxy group may be eliminated with weak acid. It can also be used as an acid labile group.

  The polymerization reaction is also governed by the type of initiator (or catalyst), the starting method (light, heat, radiation, plasma, etc.), the polymerization conditions (temperature, pressure, concentration, solvent, additives), etc. In the polymerization of the polymer compound of the present invention, radical copolymerization in which polymerization is initiated by a radical such as AIBN, ionic polymerization (anionic polymerization) using a catalyst such as alkyllithium, and the like are common. These polymerizations can be carried out according to conventional methods.

  The radical polymerization initiator is not particularly limited, and examples thereof include 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile) and 2,2′-azobis (2,4-dimethylvalero). Nitrile), 2,2′-azobisisobutyronitrile, azo compounds such as 2,2′-azobis (2,4,4-trimethylpentane), tert-butyl peroxypivalate, lauroyl peroxide, benzoyl Peroxide compounds such as peroxide, tert-butyl peroxylaurate, and water-soluble initiators such as persulfates such as potassium persulfate, and peroxides such as potassium persulfate and hydrogen peroxide Examples are redox initiators composed of a combination of reducing agents such as sodium sulfite. The amount of the polymerization initiator used can be appropriately changed according to the type, polymerization reaction conditions, etc., but is usually 0.001 to 5% by weight, particularly 0.01 to 2%, based on the total amount of monomers to be polymerized. % By weight is employed.

  In the polymerization reaction, a polymerization solvent may be used. As the polymerization solvent, those that do not inhibit the polymerization reaction are preferable, and typical examples include esters such as ethyl acetate and n-butyl acetate, ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone, toluene, xylene, cyclohexane, and the like. Aliphatic or aromatic hydrocarbons, alcohols such as isopropyl alcohol and ethylene glycol monomethyl ether, and ether solvents such as diethyl ether, dioxane and tetrahydrofuran can be used. These solvents can be used alone or in admixture of two or more. A known molecular weight regulator such as dodecyl mercaptan may be used in combination.

  The reaction temperature of the polymerization reaction is appropriately changed depending on the type of polymerization initiator or the boiling point of the solvent, and is usually preferably 20 to 200 ° C, particularly preferably 50 to 140 ° C. The reaction vessel used for such a polymerization reaction is not particularly limited.

  As a method for removing the organic solvent or water as a medium from the polymer solution or dispersion according to the present invention thus obtained, any known method can be used. For example, reprecipitation filtration may be used. Alternatively, there is a method such as heating distillation under reduced pressure.

  The polymer compound preferably has a weight average molecular weight of 1,000 to 1,000,000, particularly 2,000 to 100,000.

  In the formulas (1m) and (1p), m / (m + p) is 0.05 to 0.7, preferably 0.1 to 0.5.

  Note that m + p is 0.3 to 1, and preferably 0.5 to 1. In the case of m + p <1, m + p + q = 1 can be obtained by adding the repeating unit q giving the adhesive group.

  The polymer compound of the present invention can be used as a base resin for resist materials, particularly chemically amplified, particularly chemically amplified positive resist materials. However, the polymer physical properties, thermal properties, alkali solubility, and other physical properties of the film can be used. Other polymer compounds can be mixed for the purpose of changing. In this case, the range of the polymer compound to be mixed is not particularly limited, but it can be mixed with a known polymer compound for resist in an arbitrary range.

The resist material of the present invention can be prepared using known components except that the polymer compound of the present invention is used as a base resin.
(A) the polymer compound (base resin),
(B) an organic solvent,
(C) It may contain an acid generator.
In this case, these resist materials further include (D) a basic compound,
(E) A dissolution inhibitor may be blended.

  The organic solvent of the component (B) used in the present invention may be any as long as the base resin, acid generator, other additives, etc. can be dissolved. Examples of such an organic solvent include ketones such as cyclohexanone and methyl-2-n-amyl ketone, 3-methoxybutanol, 3-methyl-3-methoxybutanol, 1-methoxy-2-propanol, and 1-ethoxy-2. -Alcohols such as propanol, propylene glycol monomethyl ether, ethylene glycol monomethyl ether, propylene glycol monoethyl ether, ethylene glycol monoethyl ether, propylene glycol dimethyl ether, diethylene glycol dimethyl ether, and other ethers, propylene glycol monomethyl ether acetate, propylene glycol monoethyl Ether acetate, ethyl lactate, ethyl pyruvate, butyl acetate, methyl 3-methoxypropionate, 3-ethoxy Propionate ethyl acetate tert- butyl, tert- butyl propionate, and propylene glycol monobutyl tert- butyl ether acetate.

  A fluorinated organic solvent can also be used. Specifically, 2-fluoroanisole, 3-fluoroanisole, 4-fluoroanisole, 2,3-difluoroanisole, 2,4-difluoroanisole, 2,5-difluoroanisole, 5,8-difluoro-1, 4-benzodioxane, 2,3-difluorobenzyl alcohol, 1,3-difluoro-2-propanol, 2 ', 4'-difluoropropiophenone, 2,4-difluorotoluene, trifluoroacetaldehyde ethyl hemiacetal, trifluoro Acetamide, trifluoroethanol, 2,2,2-trifluoroethyl butyrate, ethyl heptafluorobutyrate, ethyl heptafluorobutyl acetate, ethyl hexafluoroglutaryl methyl, ethyl-3-hydroxy-4,4,4-trifluoro Lobutylate, ethyl-2-methyl-4,4,4-trifluoroacetoacetate, ethylpentafluorobenzoate, ethylpentafluoropropionate, ethylpentafluoropropynylacetate, ethylperfluorooctanoate, ethyl-4,4,4 4-trifluoroacetoacetate, ethyl-4,4,4-trifluorobutyrate, ethyl-4,4,4-trifluorocrotonate, ethyltrifluorosulfonate, ethyl-3- (trifluoromethyl) butyrate, ethyl Trifluoropyruvate, sec-ethyl trifluoroacetate, fluorocyclohexane, 2,2,3,3,4,4,4-heptafluoro-1-butanol, 1,1,1,2,2,3,3- Heptafluoro-7,7-dimethyl-4,6-o Tandione, 1,1,1,3,5,5,5-heptafluoropentane-2,4-dione, 3,3,4,4,5,5,5-heptafluoro-2-pentanol, 3, 3,4,4,5,5,5-heptafluoro-2-pentanone, isopropyl 4,4,4-trifluoroacetoacetate, methyl perfluorodenanoate, methyl perfluoro (2-methyl-3-oxahexa Noate), methyl perfluorononanoate, methyl perfluorooctanoate, methyl-2,3,3,3-tetrafluoropropionate, methyl trifluoroacetoacetate, methyltrifluoroacetoacetate, 1,1,1 2,2,6,6,6-octafluoro-2,4-hexanedione, 2,2,3,3,4,4,5,5-octafluoro-1-pe Butanol, 1H, 1H, 2H, 2H-perfluoro-1-decanol, perfluoro (2,5-dimethyl-3,6-dioxaneanionic) acid methyl ester, 2H-perfluoro-5-methyl-3,6 -Dioxanonane, 1H, 1H, 2H, 3H, 3H-perfluorononane-1,2-diol, 1H, 1H, 9H-perfluoro-1-nonanol, 1H, 1H-perfluorooctanol, 1H, 1H, 2H, 2H-perfluorooctanol, 2H-perfluoro-5,8,11,14-tetramethyl-3,6,9,12,15-pentaoxaoctadecane, perfluorotributylamine, perfluorotrihexylamine, perfluoro- 2,5,8-trimethyl-3,6,9-trioxadodecanoic acid methyl ester, perf Orotripentylamine, perfluorotripropylamine, 1H, 1H, 2H, 3H, 3H-perfluoroundecane-1,2-diol, trifluorobutanol, 1,1,1-trifluoro-5-methyl-2, 4-hexanedione, 1,1,1-trifluoro-2-propanol, 3,3,3-trifluoro-1-propanol, 1,1,1-trifluoro-2-propyl acetate, perfluoro (butyltetrahydrofuran ), Perfluorodecalin, perfluoro (1,2-dimethylcyclohexane), perfluoro (1,3-dimethylcyclohexane), propylene glycol trifluoromethyl ether acetate, propylene glycol methyl ether trifluoromethyl acetate, butyl trifluoromethyl acetate , - trifluoromethoxy acid methyl, perfluoro cyclohexanone, propylene glycol trifluoromethyl ether, butyl trifluoroacetate, 1,1,1-trifluoro-5,5-dimethyl-2,4-hexanedione, and the like.

  These solvents may be used alone or in combination of two or more, but are not limited thereto. In the present invention, among these organic solvents, propylene glycol monomethyl acetate, which is a safety solvent, and mixed solvents thereof, in addition to diethylene glycol dimethyl ether and 1-ethoxy-2-propanol, which have the highest solubility of the acid generator in the resist component Are preferably used.

  The amount of the solvent used may be 300 to 10,000 parts, particularly 500 to 5,000 parts, based on 100 parts of base resin (parts by weight, hereinafter the same).

  As the acid generator of component (C), onium salts of the following general formula (2), diazomethane derivatives of formula (3), glyoxime derivatives of formula (4), β-ketosulfonic acid derivatives, disulfone derivatives, nitrobenzyl sulfonate derivatives Sulfonic acid ester derivatives, imidoyl sulfonate derivatives and the like.

The general formula of the onium salt used as the acid generator is represented by the following formula (2).
_{^{(R 51) i M + K}} - (2)
(Wherein R ⁵¹ represents a linear, branched or cyclic alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 12 carbon atoms, and M ⁺ represents Iodonium and sulfonium are represented, K ⁻ represents a non-nucleophilic counter ion, and i is 2 or 3.)

^Examples of the alkyl group for R ⁵¹ include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a 2-oxocyclopentyl group, a norbornyl group, and an adamantyl group. As the aryl group, an alkoxyphenyl group such as a phenyl group, a p-methoxyphenyl group, an m-methoxyphenyl group, an o-methoxyphenyl group, an ethoxyphenyl group, a p-tert-butoxyphenyl group, or an m-tert-butoxyphenyl group. And alkylphenyl groups such as 2-methylphenyl group, 3-methylphenyl group, 4-methylphenyl group, ethylphenyl group, 4-tert-butylphenyl group, 4-butylphenyl group and dimethylphenyl group. Examples of the aralkyl group include a benzyl group and a phenethyl group. K ^- a non-nucleophilic counter chloride ions as the ion, halide ions such as bromide ion, triflate, 1,1,1-trifluoroethane sulfonate, fluoroalkyl sulfonate such as nonafluorobutanesulfonate, tosylate, benzenesulfonate And aryl sulfonates such as 4-fluorobenzene sulfonate and 1,2,3,4,5-pentafluorobenzene sulfonate, and alkyl sulfonates such as mesylate and butane sulfonate.

  Specific examples of onium salts include diphenyliodonium trifluoromethanesulfonate, trifluoromethanesulfonic acid (p-tert-butoxyphenyl) phenyliodonium, p-toluenesulfonic acid diphenyliodonium, p-toluenesulfonic acid (p-tert-butoxyphenyl). ) Phenyliodonium, trifluoromethanesulfonic acid triphenylsulfonium, trifluoromethanesulfonic acid (p-tert-butoxyphenyl) diphenylsulfonium, trifluoromethanesulfonic acid bis (p-tert-butoxyphenyl) phenylsulfonium, trifluoromethanesulfonic acid tris (p -Tert-butoxyphenyl) sulfonium, p-toluenesulfonic acid triphenylsulfonium, p-toluenesulfone (P-tert-butoxyphenyl) diphenylsulfonium, p-toluenesulfonic acid bis (p-tert-butoxyphenyl) phenylsulfonium, p-toluenesulfonic acid tris (p-tert-butoxyphenyl) sulfonium, nonafluorobutanesulfonic acid tri Phenylsulfonium, triphenylsulfonium butanesulfonate, trimethylsulfonium trifluoromethanesulfonate, trimethylsulfonium p-toluenesulfonate, cyclohexylmethyl trifluoromethanesulfonate (2-oxocyclohexyl) sulfonium, cyclohexylmethyl p-toluenesulfonate (2-oxo) (Cyclohexyl) sulfonium, dimethylmethanesulfonium trifluoromethanesulfonate, p-toluenesulfonic acid Methylphenylsulfonium, dicyclohexylphenylsulfonium trifluoromethanesulfonate, dicyclohexylphenylsulfonium p-toluenesulfonate, trinaphthylsulfonium trifluoromethanesulfonate, cyclohexylmethyl (2-oxocyclohexyl) sulfonium trifluoromethanesulfonate, trifluoromethanesulfonic acid (2- Norbornyl) methyl (2-oxocyclohexyl) sulfonium, ethylenebis [methyl (2-oxocyclopentyl) sulfonium trifluoromethanesulfonate], 1,2'-naphthylcarbonylmethyltetrahydrothiophenium triflate and the like.

（式中、Ｒ⁵²、Ｒ⁵³は炭素数１〜１２の直鎖状、分岐状又は環状のアルキル基又はハロゲン化アルキル基、炭素数６〜１２のアリール基、又はハロゲン化アリール基又は炭素数７〜１２のアラルキル基を示す。） Next, the diazomethane derivative is represented by the following formula (3).

(In the formula, R ⁵² and R ⁵³ are linear, branched or cyclic alkyl groups or halogenated alkyl groups having 1 to 12 carbon atoms, aryl groups having 6 to 12 carbon atoms, or halogenated aryl groups or carbon atoms. 7 to 12 aralkyl groups are shown.)

^Examples of the alkyl group for R ⁵² and R ⁵³ include a methyl group, an ethyl group, a propyl group, a butyl group, an amyl group, a cyclopentyl group, a cyclohexyl group, a norbornyl group, and an adamantyl group. Examples of the halogenated alkyl group include a trifluoromethyl group, a 2,2,2-trifluoroethyl group, a 2,2,2-trichloroethyl group, and a nonafluorobutyl group. As the aryl group, an alkoxyphenyl group such as a phenyl group, p-methoxyphenyl group, m-methoxyphenyl group, o-methoxyphenyl group, ethoxyphenyl group, p-tert-butoxyphenyl group, m-tert-butoxyphenyl group, Examples thereof include alkylphenyl groups such as 2-methylphenyl group, 3-methylphenyl group, 4-methylphenyl group, ethylphenyl group, 4-tert-butylphenyl group, 4-butylphenyl group, and dimethylphenyl group. Examples of the halogenated aryl group include a fluorophenyl group, a chlorophenyl group, and 1,2,3,4,5-pentafluorophenyl group. Examples of the aralkyl group include a benzyl group and a phenethyl group.

  Specific examples of the diazomethane derivative include bis (benzenesulfonyl) diazomethane, bis (p-toluenesulfonyl) diazomethane, bis (xylenesulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (cyclopentylsulfonyl) diazomethane, and bis (n-butyl). Sulfonyl) diazomethane, bis (isobutylsulfonyl) diazomethane, bis (sec-butylsulfonyl) diazomethane, bis (n-propylsulfonyl) diazomethane, bis (isopropylsulfonyl) diazomethane, bis (tert-butylsulfonyl) diazomethane, bis (n-amyl) Sulfonyl) diazomethane, bis (isoamylsulfonyl) diazomethane, bis (sec-amylsulfonyl) diazomethane, bis (tert-a) Rusulfonyl) diazomethane, 1-cyclohexylsulfonyl-1- (tert-butylsulfonyl) diazomethane, 1-cyclohexylsulfonyl-1- (tert-amylsulfonyl) diazomethane, 1-tert-amylsulfonyl-1- (tert-butylsulfonyl) And diazomethane.

（式中、Ｒ⁵⁴〜Ｒ⁵⁶は炭素数１〜１２の直鎖状、分岐状又は環状のアルキル基又はハロゲン化アルキル基、炭素数６〜１２のアリール基又はハロゲン化アリール基、又は炭素数７〜１２のアラルキル基を示す。Ｒ⁵⁵、Ｒ⁵⁶は互いに結合して環状構造を形成してもよく、環状構造を形成する場合、Ｒ⁵⁵、Ｒ⁵⁶はそれぞれ炭素数１〜６の直鎖状、分岐状のアルキレン基を示す。） The glyoxime derivative is represented by the following formula (4).

(In the formula, R ^{54 to} R ⁵⁶ are linear, branched or cyclic alkyl groups or halogenated alkyl groups having 1 to 12 carbon atoms, aryl groups or halogenated aryl groups having 6 to 12 carbon atoms, or carbon atoms. 7 to 12 represents an aralkyl group, R ⁵⁵ and R ⁵⁶ may be bonded to each other to form a cyclic structure, and when forming a cyclic structure, R ⁵⁵ and R ⁵⁶ are each a straight chain having 1 to 6 carbon atoms. Represents a branched or branched alkylene group.)

Examples of the alkyl group, halogenated alkyl group, aryl group, halogenated aryl group, and aralkyl group represented by R ^{54 to} R ⁵⁶ include the same groups as those described for R ⁵² and R ⁵³ . ^Examples of the alkylene group for R ⁵⁵ and R ⁵⁶ include a methylene group, an ethylene group, a propylene group, a butylene group, and a hexylene group.

  Specific examples of glyoxime derivatives include bis-O- (p-toluenesulfonyl) -α-dimethylglyoxime, bis-O- (p-toluenesulfonyl) -α-diphenylglyoxime, bis-O- (p-toluene). Sulfonyl) -α-dicyclohexylglyoxime, bis-O- (p-toluenesulfonyl) -2,3-pentanedione glyoxime, bis-O- (p-toluenesulfonyl) -2-methyl-3,4-pentanediol Lioxime, bis-O- (n-butanesulfonyl) -α-dimethylglyoxime, bis-O- (n-butanesulfonyl) -α-diphenylglyoxime, bis-O- (n-butanesulfonyl) -α- Dicyclohexylglyoxime, bis-O- (n-butanesulfonyl) -2,3-pentanedione glyoxime, bis O- (n-butanesulfonyl) -2-methyl-3,4-pentanedione glyoxime, bis-O- (methanesulfonyl) -α-dimethylglyoxime, bis-O- (trifluoromethanesulfonyl) -α-dimethyl Glyoxime, bis-O- (1,1,1-trifluoroethanesulfonyl) -α-dimethylglyoxime, bis-O- (tert-butanesulfonyl) -α-dimethylglyoxime, bis-O- (perfluoro Octanesulfonyl) -α-dimethylglyoxime, bis-O- (cyclohexanesulfonyl) -α-dimethylglyoxime, bis-O- (benzenesulfonyl) -α-dimethylglyoxime, bis-O- (p-fluorobenzenesulfonyl) ) -Α-dimethylglyoxime, bis-O- (p-tert-butylbenzenesulfuryl) Sulfonyl)-.alpha.-dimethylglyoxime, bis -O- (xylene sulfonyl)-.alpha.-dimethylglyoxime, bis -O- (camphor - sulfonyl)-.alpha.-dimethylglyoxime, and the like.

  Other examples of the acid generator used include β-ketosulfone derivatives such as 2-cyclohexylcarbonyl-2- (p-toluenesulfonyl) propane, 2-isopropylcarbonyl-2- (p-toluenesulfonyl) propane, and diphenyldisulfone. Disulfone derivatives such as dicyclohexyldisulfone, nitrobenzyl sulfonate derivatives such as 2,6-dinitrobenzyl p-toluenesulfonate, 2,4-dinitrobenzyl p-toluenesulfonate, 1,2,3-tris (methanesulfonyloxy) Sulfonic acid ester derivatives such as benzene, 1,2,3-tris (trifluoromethanesulfonyloxy) benzene, 1,2,3-tris (p-toluenesulfonyloxy) benzene, phthalimido-yl-triflate, phthalimide- Ru-tosylate, 5-norbornene-2,3-dicarboximido-yl-triflate, 5-norbornene-2,3-dicarboximido-yl-tosylate, 5-norbornene-2,3-dicarboximido-yl -Imidoyl sulfonate derivatives such as -n-butyl triflate sulfonate.

  Among the acid generators described above, triphenylsulfonium trifluoromethanesulfonate, trifluoromethanesulfonic acid (p-tert-butoxyphenyl) diphenylsulfonium, trifluoromethanesulfonic acid tris (p-tert-butoxyphenyl) sulfonium, p-toluene Triphenylsulfonium sulfonate, p-toluenesulfonic acid (p-tert-butoxyphenyl) diphenylsulfonium, p-toluenesulfonic acid tris (p-tert-butoxyphenyl) sulfonium, trifluoromethanesulfonic acid trinaphthylsulfonium, trifluoromethanesulfonic acid Cyclohexylmethyl (2-oxocyclohexyl) sulfonium, trifluoromethanesulfonic acid (2-norbornyl) methyl (2-oxocycle) Hexyl) sulfonium, onium salts such as 1,2'-naphthylcarbonylmethyltetrahydrothiophenium triflate, bis (benzenesulfonyl) diazomethane, bis (p-toluenesulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (n- Diazomethane derivatives such as butylsulfonyl) diazomethane, bis (isobutylsulfonyl) diazomethane, bis (sec-butylsulfonyl) diazomethane, bis (n-propylsulfonyl) diazomethane, bis (isopropylsulfonyl) diazomethane, bis (tert-butylsulfonyl) diazomethane, Glyoxy such as bis-O- (p-toluenesulfonyl) -α-dimethylglyoxime, bis-O- (n-butanesulfonyl) -α-dimethylglyoxime Beam derivative is preferably used. In addition, the said acid generator can be used individually by 1 type or in combination of 2 or more types. Since onium salts are excellent in rectangularity improving effect and diazomethane derivatives and glyoxime derivatives are excellent in standing wave reducing effect, it is possible to finely adjust the profile by combining both.

  The amount of the acid generator added is preferably 0.2 to 15 parts with respect to 100 parts of the base resin. If the amount is less than 0.2 parts, the amount of acid generated during exposure is small, and the sensitivity and resolution may be poor. If it is more than 15 parts, the transparency may be lowered and the resolution may be lowered.

  As the basic compound (D), a compound that can suppress the diffusion rate when the acid generated from the acid generator diffuses into the resist film is suitable. By blending such a basic compound, the acid diffusion rate in the resist film is suppressed, the resolution is improved, the sensitivity change after exposure is suppressed, the substrate and environment dependency is reduced, and the exposure margin is reduced. And the pattern profile can be improved (Japanese Patent Laid-Open Nos. 5-232706, 5-249683, 5-158239, 5-249626, 5-257282, 5-289322, 5). -289340 etc.).

  Examples of such basic compounds include ammonia, primary, secondary, and tertiary aliphatic amines, hybrid amines, aromatic amines, heterocyclic amines, nitrogen-containing compounds having a carboxyl group, Examples thereof include nitrogen-containing compounds having a sulfonyl group, nitrogen-containing compounds having a hydroxyl group, nitrogen-containing compounds having a hydroxyphenyl group, alcoholic nitrogen-containing compounds, amide derivatives, imide derivatives, and the like.

  Specific examples of primary aliphatic amines include methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutylamine, sec-butylamine, tert-butylamine, pentylamine, tert-amylamine, cyclopentyl. Examples include amine, hexylamine, cyclohexylamine, heptylamine, octylamine, nonylamine, decylamine, dodecylamine, cetylamine, methylenediamine, ethylenediamine, tetraethylenepentamine and the like.

Specific examples of secondary aliphatic amines include dimethylamine, diethylamine, di-n-propylamine, diisopropylamine, di-n-butylamine, diisobutylamine, di-sec-butylamine, dipentylamine, dicyclopentylamine. , Dihexylamine, dicyclohexylamine, diheptylamine, dioctylamine, dinonylamine, didecylamine, didodecylamine, dicetylamine, N, N-dimethylmethylenediamine, N, N-dimethylethylenediamine, N, N-dimethyltetraethylenepentamine, etc. Illustrated.
Specific examples of tertiary aliphatic amines include trimethylamine, triethylamine, tri-n-propylamine, triisopropylamine, tri-n-butylamine, triisobutylamine, tri-sec-butylamine, tripentylamine, tripentylamine, Cyclopentylamine, trihexylamine, tricyclohexylamine, triheptylamine, trioctylamine, trinonylamine, tridecylamine, tridodecylamine, tricetylamine, N, N, N ′, N′-tetramethylmethylenediamine, Examples thereof include N, N, N ′, N′-tetramethylethylenediamine, N, N, N ′, N′-tetramethyltetraethylenepentamine and the like.

  Specific examples of the hybrid amines include dimethylethylamine, methylethylpropylamine, benzylamine, phenethylamine, benzyldimethylamine and the like.

  Specific examples of aromatic amines include aniline, N-methylaniline, N-ethylaniline, N-propylaniline, N, N-dimethylaniline, 2-methylaniline, 3-methylaniline, 4-methylaniline and ethyl. Aniline, propylaniline, trimethylaniline, 2-nitroaniline, 3-nitroaniline, 4-nitroaniline, 2,4-dinitroaniline, 2,6-dinitroaniline, 3,5-dinitroaniline, N, N-dimethyltoluidine And aniline derivatives such as diphenyl (p-tolyl) amine, methyldiphenylamine, triphenylamine, phenylenediamine, naphthylamine, and diaminonaphthalene.

  Specific examples of heterocyclic amines include pyrrole such as pyrrole, 2H-pyrrole, 1-methylpyrrole, 2,4-dimethylpyrrole, 2,5-dimethylpyrrole and N-methylpyrrole. Derivatives, oxazole derivatives such as oxazole and isoxazole, thiazole derivatives such as thiazole and isothiazole, imidazole derivatives such as imidazole, 4-methylimidazole and 4-methyl-2-phenylimidazole, pyrazole derivatives, furazane derivatives, pyrroline, 2- Pyrroline derivatives such as methyl-1-pyrroline, pyrrolidine derivatives such as pyrrolidine, N-methylpyrrolidine, pyrrolidinone, N-methylpyrrolidone, imidazoline derivatives, imidazolidine derivatives, pyridine, methylpyridine, ethylpyridine, propylpyridine, butylpyridine, 4 (1-butylpentyl) pyridine, dimethylpyridine, trimethylpyridine, triethylpyridine, phenylpyridine, 3-methyl-2-phenylpyridine, 4-tert-butylpyridine, diphenylpyridine, benzylpyridine, methoxypyridine, butoxypyridine, dimethoxypyridine Pyridine derivatives such as 1-methyl-2-pyridine, 4-pyrrolidinopyridine, 1-methyl-4-phenylpyridine, 2- (1-ethylpropyl) pyridine, aminopyridine, dimethylaminopyridine, pyridazine derivatives, pyrimidine derivatives , Pyrazine derivatives, pyrazoline derivatives, pyrazolidine derivatives, piperidine derivatives, piperazine derivatives, morpholine derivatives, indole derivatives, isoindole derivatives, 1H-indazole derivatives, indoline Conductors, quinoline, quinoline derivatives such as 3-quinolinecarbonitrile, isoquinoline derivatives, cinnoline derivatives, quinazoline derivatives, quinoxaline derivatives, phthalazine derivatives, purine derivatives, pteridine derivatives, carbazole derivatives, phenanthridine derivatives, acridine derivatives, phenazine derivatives, 1 , 10-phenanthroline derivative, adenine derivative, adenosine derivative, guanine derivative, guanosine derivative, uracil derivative, uridine derivative and the like.

  Specific examples of nitrogen-containing compounds having a carboxyl group include aminobenzoic acid, indolecarboxylic acid, nicotinic acid, alanine, arginine, aspartic acid, glutamic acid, glycine, histidine, isoleucine, glycylleucine, leucine, methionine, phenylalanine. And amino acid derivatives such as threonine, lysine, 3-aminopyrazine-2-carboxylic acid and methoxyalanine.

  Specific examples of the nitrogen-containing compound having a sulfonyl group include 3-pyridinesulfonic acid and pyridinium p-toluenesulfonate.

  Specific examples of the nitrogen-containing compound and alcoholic nitrogen-containing compound containing a hydroxyl group and a hydroxyphenyl group include 2-hydroxypyridine, aminocresol, 2,4-quinolinediol, 3-indolemethanol hydrate, monoethanolamine, diethanolamine , Triethanolamine, N-ethyldiethanolamine, N, N-diethylethanolamine, triisopropanolamine, 2,2′-iminodiethanol, 2-aminoethanol, 3-amino-1-propanol, 4-amino-1-butanol 4- (2-hydroxyethyl) morpholine, 2- (2-hydroxyethyl) pyridine, 1- (2-hydroxyethyl) piperazine, 1- [2- (2-hydroxyethoxy) ethyl] piperazine, piperidine ethanol, 1 − 2-hydroxyethyl) pyrrolidine, 1- (2-hydroxyethyl) -2-pyrrolidinone, 3-piperidino-1,2-propanediol, 3-pyrrolidino-1,2-propanediol, 8-hydroxyeurolidine, 3- Examples include quinuclidinol, 3-tropanol, 1-methyl-2-pyrrolidine ethanol, 1-aziridine ethanol, N- (2-hydroxyethyl) phthalimide, N- (2-hydroxyethyl) isonicotinamide.

  Specific examples of the amide derivative include formamide, N-methylformamide, N, N-dimethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, propionamide, benzamide and the like.

  Specific examples of the imide derivative include phthalimide, succinimide, maleimide and the like.

Furthermore, 1 type, or 2 or more types chosen from the basic compound shown by the following general formula (B) -1 can also be added.
N (X) _n (Y) _3-n (B) -1

  In the formula, n = 1, 2 or 3. The side chains X may be the same or different and can be represented by the following general formulas (X) -1 to (X) -3. The side chain Y represents the same or different hydrogen atom or linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, and may contain an ether group or a hydroxyl group. Xs may be bonded to form a ring.

Here, R ³⁰⁰ , R ³⁰² , and R ³⁰⁵ are linear or branched alkylene groups having 1 to 4 carbon atoms, R ³⁰¹ and R ³⁰⁴ are hydrogen atoms, or linear groups having 1 to 20 carbon atoms, It is a branched or cyclic alkyl group and may contain one or a plurality of hydroxy groups, ether groups, ester groups and lactone rings.

R ³⁰³ is a single bond or a linear or branched alkylene group having 1 to 4 carbon atoms, R ³⁰⁶ is a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, and a hydroxy group , Ether, ester group, or lactone ring may be contained.

Specific examples of the compound represented by formula (B) -1 are given below.
Tris (2-methoxymethoxyethyl) amine, tris {2- (2-methoxyethoxy) ethyl} amine, tris {2- (2-methoxyethoxymethoxy) ethyl} amine, tris {2- (1-methoxyethoxy) ethyl } Amine, Tris {2- (1-ethoxyethoxy) ethyl} amine, Tris {2- (1-ethoxypropoxy) ethyl} amine, Tris [2- {2- (2-hydroxyethoxy) ethoxy} ethyl] amine, 4,7,13,16,21,24-hexaoxa-1,10-diazabicyclo [8.8.8] hexacosane, 4,7,13,18-tetraoxa-1,10-diazabicyclo [8.5.5] Eicosane, 1,4,10,13-tetraoxa-7,16-diazabicyclooctadecane, 1-aza-12-crown-4 1-aza-15-crown-5, 1-aza-18-crown-6, tris (2-formyloxyethyl) amine, tris (2-formyloxyethyl) amine, tris (2-acetoxyethyl) amine, Tris (2-propionyloxyethyl) amine, tris (2-butyryloxyethyl) amine, tris (2-isobutyryloxyethyl) amine, tris (2-valeryloxyethyl) amine, tris (2-pivalloy) Ruoxyxyethyl) amine, N, N-bis (2-acetoxyethyl) 2- (acetoxyacetoxy) ethylamine, tris (2-methoxycarbonyloxyethyl) amine, tris (2-tert-butoxycarbonyloxyethyl) amine, tris [2- (2-oxopropoxy) ethyl] amine, tris [2- Methoxycarbonylmethyl) oxyethyl] amine, tris [2- (tert-butoxycarbonylmethyloxy) ethyl] amine, tris [2- (cyclohexyloxycarbonylmethyloxy) ethyl] amine, tris (2-methoxycarbonylethyl) amine, tris (2-ethoxycarbonylethyl) amine, N, N-bis (2-hydroxyethyl) 2- (methoxycarbonyl) ethylamine, N, N-bis (2-acetoxyethyl) 2- (methoxycarbonyl) ethylamine, N, N -Bis (2-hydroxyethyl) 2- (ethoxycarbonyl) ethylamine, N, N-bis (2-acetoxyethyl) 2- (ethoxycarbonyl) ethylamine, N, N-bis (2-hydroxyethyl) 2- (2 -Methoxyethoxycarbonyl) Tylamine, N, N-bis (2-acetoxyethyl) 2- (2-methoxyethoxycarbonyl) ethylamine, N, N-bis (2-hydroxyethyl) 2- (2-hydroxyethoxycarbonyl) ethylamine, N, N- Bis (2-acetoxyethyl) 2- (2-acetoxyethoxycarbonyl) ethylamine, N, N-bis (2-hydroxyethyl) 2-[(methoxycarbonyl) methoxycarbonyl] ethylamine, N, N-bis (2-acetoxy) Ethyl) 2-[(methoxycarbonyl) methoxycarbonyl] ethylamine, N, N-bis (2-hydroxyethyl) 2- (2-oxopropoxycarbonyl) ethylamine, N, N-bis (2-acetoxyethyl) 2- ( 2-oxopropoxycarbonyl) ethylamine, N, N-bis ( -Hydroxyethyl) 2- (tetrahydrofurfuryloxycarbonyl) ethylamine, N, N-bis (2-acetoxyethyl) 2- (tetrahydrofurfuryloxycarbonyl) ethylamine, N, N-bis (2-hydroxyethyl) 2- [(2-oxotetrahydrofuran-3-yl) oxycarbonyl] ethylamine, N, N-bis (2-acetoxyethyl) 2-[(2-oxotetrahydrofuran-3-yl) oxycarbonyl] ethylamine, N, N-bis (2-hydroxyethyl) 2- (4-hydroxybutoxycarbonyl) ethylamine, N, N-bis (2-formyloxyethyl) 2- (4-formyloxybutoxycarbonyl) ethylamine, N, N-bis (2-formyl) Oxyethyl) 2- (2-formyloxyate) Sicarbonyl) ethylamine, N, N-bis (2-methoxyethyl) 2- (methoxycarbonyl) ethylamine, N- (2-hydroxyethyl) bis [2- (methoxycarbonyl) ethyl] amine, N- (2-acetoxy) Ethyl) bis [2- (methoxycarbonyl) ethyl] amine, N- (2-hydroxyethyl) bis [2- (ethoxycarbonyl) ethyl] amine, N- (2-acetoxyethyl) bis [2- (ethoxycarbonyl) Ethyl] amine, N- (3-hydroxy-1-propyl) bis [2- (methoxycarbonyl) ethyl] amine, N- (3-acetoxy-1-propyl) bis [2- (methoxycarbonyl) ethyl] amine, N- (2-methoxyethyl) bis [2- (methoxycarbonyl) ethyl] amine, N-butylbis [2 -(Methoxycarbonyl) ethyl] amine, N-butylbis [2- (2-methoxyethoxycarbonyl) ethyl] amine, N-methylbis (2-acetoxyethyl) amine, N-ethylbis (2-acetoxyethyl) amine, N- Methylbis (2-pivaloyloxyoxyethyl) amine, N-ethylbis [2- (methoxycarbonyloxy) ethyl] amine, N-ethylbis [2- (tert-butoxycarbonyloxy) ethyl] amine, tris (methoxycarbonylmethyl) Examples include, but are not limited to, amine, tris (ethoxycarbonylmethyl) amine, N-butylbis (methoxycarbonylmethyl) amine, N-hexylbis (methoxycarbonylmethyl) amine, and β- (diethylamino) -δ-valerolactone.

  Furthermore, 1 type, or 2 or more types of the basic compound which has the cyclic structure shown by the following general formula (B) -2 can also be added.

（式中、Ｘは前述の通り、Ｒ³⁰⁷は炭素数２〜２０の直鎖状又は分岐状のアルキレン基であり、カルボニル基、エーテル基、エステル基、スルフィドを１個あるいは複数個含んでいてもよい。）

(In the formula, as described above, R ³⁰⁷ is a linear or branched alkylene group having 2 to 20 carbon atoms and contains one or more carbonyl groups, ether groups, ester groups, and sulfides. May be good.)

  Formula (B) -2 specifically includes 1- [2- (methoxymethoxy) ethyl] pyrrolidine, 1- [2- (methoxymethoxy) ethyl] piperidine, 4- [2- (methoxymethoxy) ethyl] morpholine. , 1- [2-[(2-methoxyethoxy) methoxy] ethyl] pyrrolidine, 1- [2-[(2-methoxyethoxy) methoxy] ethyl] piperidine, 4- [2-[(2-methoxyethoxy) methoxy ] Ethyl] morpholine, 2- (1-pyrrolidinyl) ethyl acetate, 2-piperidinoethyl acetate, 2-morpholinoethyl acetate, 2- (1-pyrrolidinyl) ethyl formate, 2-piperidinoethyl propionate, 2-morpholinoethyl acetoxyacetate, methoxy 2- (1-pyrrolidinyl) ethyl acetate, 4- [2- (methoxycarbonyloxy) ethyl] morpholine 1- [2- (t-butoxycarbonyloxy) ethyl] piperidine, 4- [2- (2-methoxyethoxycarbonyloxy) ethyl] morpholine, methyl 3- (1-pyrrolidinyl) propionate, 3-piperidino Methyl propionate, methyl 3-morpholinopropionate, methyl 3- (thiomorpholino) propionate, methyl 2-methyl-3- (1-pyrrolidinyl) propionate, ethyl 3-morpholinopropionate, 3-piperidinopropionic acid Methoxycarbonylmethyl, 2-hydroxyethyl 3- (1-pyrrolidinyl) propionate, 2-acetoxyethyl 3-morpholinopropionate, 2-oxotetrahydrofuran-3-yl 3- (1-pyrrolidinyl) propionate, 3-morpholinopropion Tetrahydrofurfuryl acid, 3 Glycidyl piperidinopropionate, 2-methoxyethyl 3-morpholinopropionate, 2- (2-methoxyethoxy) ethyl 3- (1-pyrrolidinyl) propionate, butyl 3-morpholinopropionate, 3-piperidinopropionic acid Cyclohexyl, α- (1-pyrrolidinyl) methyl-γ-butyrolactone, β-piperidino-γ-butyrolactone, β-morpholino-δ-valerolactone, methyl 1-pyrrolidinyl acetate, methyl piperidinoacetate, methyl morpholinoacetate, methyl thiomorpholinoacetate , Ethyl 1-pyrrolidinyl acetate, 2-methoxyethyl morpholinoacetate.

  Furthermore, a basic compound containing a cyano group represented by general formulas (B) -3 to (B) -6 can be added.

（式中、Ｘ、Ｒ³⁰⁷、ｎは前述の通り、Ｒ³⁰⁸、Ｒ³⁰⁹は同一又は異種の炭素数１〜４の直鎖状又は分岐状のアルキレン基である。）

(In the formula, X, R ³⁰⁷ and n are as described above, and R ³⁰⁸ and R ³⁰⁹ are the same or different linear or branched alkylene groups having 1 to 4 carbon atoms.)

  Specific examples of the base containing a cyano group include 3- (diethylamino) propiononitrile, N, N-bis (2-hydroxyethyl) -3-aminopropiononitrile, and N, N-bis (2-acetoxyethyl). -3-aminopropiononitrile, N, N-bis (2-formyloxyethyl) -3-aminopropiononitrile, N, N-bis (2-methoxyethyl) -3-aminopropiononitrile, N, N -Bis [2- (methoxymethoxy) ethyl] -3-aminopropiononitrile, methyl N- (2-cyanoethyl) -N- (2-methoxyethyl) -3-aminopropionate, N- (2-cyanoethyl) -N- (2-hydroxyethyl) -3-aminopropionic acid methyl, N- (2-acetoxyethyl) -N- (2-cyanoethyl) -3-aminopro Methyl onate, N- (2-cyanoethyl) -N-ethyl-3-aminopropiononitrile, N- (2-cyanoethyl) -N- (2-hydroxyethyl) -3-aminopropiononitrile, N- ( 2-acetoxyethyl) -N- (2-cyanoethyl) -3-aminopropiononitrile, N- (2-cyanoethyl) -N- (2-formyloxyethyl) -3-aminopropiononitrile, N- (2 -Cyanoethyl) -N- (2-methoxyethyl) -3-aminopropiononitrile, N- (2-cyanoethyl) -N- [2- (methoxymethoxy) ethyl] -3-aminopropiononitrile, N- ( 2-cyanoethyl) -N- (3-hydroxy-1-propyl) -3-aminopropiononitrile, N- (3-acetoxy-1-propyl) -N- (2 Cyanoethyl) -3-aminopropiononitrile, N- (2-cyanoethyl) -N- (3-formyloxy-1-propyl) -3-aminopropiononitrile, N- (2-cyanoethyl) -N-tetrahydrofur Furyl-3-aminopropiononitrile, N, N-bis (2-cyanoethyl) -3-aminopropiononitrile, diethylaminoacetonitrile, N, N-bis (2-hydroxyethyl) aminoacetonitrile, N, N-bis ( 2-acetoxyethyl) aminoacetonitrile, N, N-bis (2-formyloxyethyl) aminoacetonitrile, N, N-bis (2-methoxyethyl) aminoacetonitrile, N, N-bis [2- (methoxymethoxy) ethyl Aminoacetonitrile, N-cyanomethyl-N- (2-methoxyethyl) ) Methyl 3-aminopropionate, methyl N-cyanomethyl-N- (2-hydroxyethyl) -3-aminopropionate, methyl N- (2-acetoxyethyl) -N-cyanomethyl-3-aminopropionate, N -Cyanomethyl-N- (2-hydroxyethyl) aminoacetonitrile, N- (2-acetoxyethyl) -N- (cyanomethyl) aminoacetonitrile, N-cyanomethyl-N- (2-formyloxyethyl) aminoacetonitrile, N-cyanomethyl -N- (2-methoxyethyl) aminoacetonitrile, N-cyanomethyl-N- [2- (methoxymethoxy) ethyl] aminoacetonitrile, N- (cyanomethyl) -N- (3-hydroxy-1-propyl) aminoacetonitrile, N- (3-acetoxy-1-propyl) -N (Cyanomethyl) aminoacetonitrile, N-cyanomethyl-N- (3-formyloxy-1-propyl) aminoacetonitrile, N, N-bis (cyanomethyl) aminoacetonitrile, 1-pyrrolidinepropiononitrile, 1-piperidinepropiononitrile, 4-morpholinepropiononitrile, 1-pyrrolidineacetonitrile, 1-piperidineacetonitrile, 4-morpholineacetonitrile, cyanomethyl 3-diethylaminopropionate, cyanomethyl N, N-bis (2-hydroxyethyl) -3-aminopropionate, N, Cyanomethyl N-bis (2-acetoxyethyl) -3-aminopropionate, cyanomethyl N, N-bis (2-formyloxyethyl) -3-aminopropionate, N, N-bis (2-methoxyethyl) Cyanomethyl 3-aminopropionate, N, N-bis [2- (methoxymethoxy) ethyl] -3-aminopropionate cyanomethyl, 3-diethylaminopropionic acid (2-cyanoethyl), N, N-bis (2-hydroxyethyl) ) -3-Aminopropionic acid (2-cyanoethyl), N, N-bis (2-acetoxyethyl) -3-aminopropionic acid (2-cyanoethyl), N, N-bis (2-formyloxyethyl) -3 Aminopropionic acid (2-cyanoethyl), N, N-bis (2-methoxyethyl) -3-aminopropionic acid (2-cyanoethyl), N, N-bis [2- (methoxymethoxy) ethyl] -3- Aminopropionic acid (2-cyanoethyl), 1-pyrrolidinepropionate cyanomethyl, 1-piperidinepropionate cyano Examples include methyl, cyanomethyl 4-morpholine propionate, 1-pyrrolidinepropionic acid (2-cyanoethyl), 1-piperidinepropionic acid (2-cyanoethyl), 4-morpholine propionic acid (2-cyanoethyl).

  In addition, the compounding quantity of this invention basic compound is 0.001-2 parts with respect to 100 parts of all base resins, Especially 0.01-1 part is suitable. If the blending amount is less than 0.001 part, there is no blending effect, and if it exceeds 2 parts, the sensitivity may be too low.

  The (E) component dissolution inhibitor is a compound having a molecular weight of 3,000 or less whose solubility in an alkaline developer is changed by the action of an acid, in particular, a part of the hydroxyl group of a phenol or carboxylic acid derivative having a molecular weight of 2,500 or less. Compounds in which all are substituted with acid labile groups are suitable. The acid labile group may contain fluorine mentioned in the present invention, but may not contain conventional fluorine.

  Examples of phenol or carboxylic acid derivatives having a molecular weight of 2,500 or less include 4,4 ′-(1-methylethylidene) bisphenol, [1,1′-biphenyl-4,4′-diol] -2,2′-methylenebis [ 4-methylphenol], 4,4-bis (4′-hydroxyphenyl) valeric acid, tris (4-hydroxyphenyl) methane, 1,1,1-tris (4′-hydroxyphenyl) ethane, 1,1, 2-tris (4′-hydroxyphenyl) ethane, phenolphthalein, thymolphthalein, 3,3′-difluoro [(1,1′-biphenyl) -4,4′-diol], 3,3 ′, 5 , 5′-tetrafluoro [(1,1′-biphenyl-4,4′-diol], 4,4 ′-[2,2,2-trifluoro-1- (trifluoromethyl) Tylidene] bisphenol, 4,4′-methylenebis [2-fluorophenol], 2,2′-methylenebis [4-fluorophenol], 4,4′-isopropylidenebis [2-fluorophenol], cyclohexylidenebis [ 2-fluorophenol], 4,4 ′-[(4-fluorophenyl) methylene] bis [2-fluorophenol], 4,4′-methylenebis [2,6-difluorophenol], 4,4 ′-(4 -Fluorophenyl) methylenebis [2,6-difluorophenol], 2,6-bis [(2-hydroxy-5-fluorophenyl) methyl] -4-fluorophenol, 2,6-bis [(4-hydroxy-3 -Fluorophenyl) methyl] -4-fluorophenol, 2,4-bis [(3-hydroxy-4-hydro Xylphenyl) methyl] -6-methylphenol and the like, and examples of the acid labile substituent include the same as those described above.

  Specific examples of the dissolution inhibitor suitably used include 3,3 ′, 5,5′-tetrafluoro [(1,1′-biphenyl) -4,4′-di-tert-butoxycarbonyl], 4, 4 ′-[2,2,2-trifluoro-1- (trifluoromethyl) ethylidene] bisphenol-4,4′-di-tert-butoxycarbonyl, bis (4- (2′-tetrahydropyranyloxy) phenyl ) Methane, bis (4- (2′-tetrahydrofuranyloxy) phenyl) methane, bis (4-tert-butoxyphenyl) methane, bis (4-tert-butoxycarbonyloxyphenyl) methane, bis (4-tert-butoxy) Carbonylmethyloxyphenyl) methane, bis (4- (1′-ethoxyethoxy) phenyl) methane, bis (4- (1′-e Xypropyloxy) phenyl) methane, 2,2-bis (4 ′-(2 ″ -tetrahydropyranyloxy)) propane, 2,2-bis (4 ′-(2 ″ -tetrahydrofuranyloxy) phenyl) Propane, 2,2-bis (4′-tert-butoxyphenyl) propane, 2,2-bis (4′-tert-butoxycarbonyloxyphenyl) propane, 2,2-bis (4-tert-butoxycarbonylmethyloxy) Phenyl) propane, 2,2-bis (4 ′-(1 ″ -ethoxyethoxy) phenyl) propane, 2,2-bis (4 ′-(1 ″ -ethoxypropyloxy) phenyl) propane, 4,4 -Bis (4 ′-(2 ″ -tetrahydropyranyloxy) phenyl) tert-butyl 4,4-bis (4 ′-(2 ″ -teto) Hydrofuranyloxy) phenyl) tert-butyl valerate, 4,4-bis (4′-tert-butoxyphenyl) tert-butyl valerate, 4,4-bis (4-tert-butoxycarbonyloxyphenyl) valeric acid tert-butyl 4,4-bis (4′-tert-butoxycarbonylmethyloxyphenyl) valerate tert-butyl 4,4-bis (4 ′-(1 ″ -ethoxyethoxy) phenyl) valerate tert-butyl Butyl, 4,4-bis (4 ′-(1 ″ -ethoxypropyloxy) phenyl) tert-butyl valerate, tris (4- (2′-tetrahydropyranyloxy) phenyl) methane, tris (4- ( 2'-tetrahydrofuranyloxy) phenyl) methane, tris (4-tert-butoxyphenyl) methane, tris ( 4-tert-butoxycarbonyloxyphenyl) methane, tris (4-tert-butoxycarbonyloxymethylphenyl) methane, tris (4- (1′-ethoxyethoxy) phenyl) methane, tris (4- (1′-ethoxypropyl) Oxy) phenyl) methane, 1,1,2-tris (4 ′-(2 ″ -tetrahydropyranyloxy) phenyl) ethane, 1,1,2-tris (4 ′-(2 ″ -tetrahydrofuranyloxy) ) Phenyl) ethane, 1,1,2-tris (4′-tert-butoxyphenyl) ethane, 1,1,2-tris (4′-tert-butoxycarbonyloxyphenyl) ethane, 1,1,2-tris (4′-tert-butoxycarbonylmethyloxyphenyl) ethane, 1,1,2-tris (4 ′-(1′- Toxiethoxy) phenyl) ethane, 1,1,2-tris (4 ′-(1′-ethoxypropyloxy) phenyl) ethane, 1,1-tert-butyl 2-trifluoromethylbenzenecarboxylate, 2-trifluoro Tert-butyl methylcyclohexanecarboxylate, tert-butyl decahydronaphthalene-2,6-dicarboxylate, tert-butyl cholate, tert-butyl deoxycholate, tert-butyl adamantanecarboxylate, tert-butyl adamantane acetate, 1, Examples thereof include tetra-tert-butyl 1′-bicyclohexyl-3,3 ′, 4,4′-tetracarboxylate.

  The addition amount of the dissolution inhibitor in the resist material of the present invention is 20 parts or less, preferably 15 parts or less with respect to 100 parts of the base resin in the resist material. If it exceeds 20 parts, the monomer component increases, so the heat resistance of the resist material decreases.

  In addition to the above components, a surfactant conventionally used for improving the coating property can be added to the resist material of the present invention. In addition, the addition amount of an arbitrary component can be made into a normal amount in the range which does not inhibit the effect of this invention.

  Here, the surfactant is preferably nonionic, such as perfluoroalkyl polyoxyethylene ethanol, fluorinated alkyl ester, perfluoroalkylamine oxide, perfluoroalkyl EO adduct, fluorine-containing organosiloxane compound, and the like. Can be mentioned. For example, Florard “FC-430”, “FC-431” (both manufactured by Sumitomo 3M), Surflon “S-141”, “S-145” (both manufactured by Asahi Glass Co., Ltd.), Unidyne “DS-” 401 "," DS-403 "," DS-451 "(manufactured by Daikin Industries, Ltd.), MegaFuck" F-8151 "(manufactured by Dainippon Ink Industries, Ltd.)," X-70-092 " , “X-70-093” (all manufactured by Shin-Etsu Chemical Co., Ltd.) and the like. Preferably, Florard “FC-430” (manufactured by Sumitomo 3M Co., Ltd.), “X-70-093” (manufactured by Shin-Etsu Chemical Co., Ltd.) can be used.

In order to form a pattern using the resist material of the present invention, a known lithography technique can be employed. For example, it is applied onto a substrate such as a silicon wafer by spin coating or the like so that the film thickness becomes 0.1 to 1.0 μm, and this is applied on a hot plate at 60 to 200 ° C. for 10 seconds to 10 minutes, preferably Pre-bake at 80 to 150 ° C. for 30 seconds to 5 minutes. Next, a mask for forming a target pattern is placed over the resist film, and a high energy beam such as deep ultraviolet light, excimer laser, or X-ray, or an electron beam is applied in an exposure amount of about 1 to 200 mJ / cm ² , preferably 10 to After irradiation so as to be about 100 mJ / cm ^2, post exposure baking (PEB) is performed on a hot plate at 60 to 150 ° C. for 10 seconds to 5 minutes, preferably 80 to 130 ° C. for 30 seconds to 3 minutes. Further, a developer of an alkaline aqueous solution such as 0.1 to 5%, preferably 2 to 3% tetramethylammonium hydroxide (TMAH) is used for 10 seconds to 3 minutes, preferably 30 seconds to 2 minutes. ) Method, paddle method, spray method and the like, and a desired pattern is formed on the substrate. The material of the present invention is a deep ultraviolet ray or excimer laser of 254 to 120 nm, particularly an excimer laser such as 193 nm ArF, 146 nm Kr ₂ , 134 nm KrAr ₂ , 157 nm F ₂ , 126 nm Ar among high energy rays. It is most suitable for fine patterning with _2nd laser, X-ray and electron beam. In addition, when the above range deviates from the upper limit and the lower limit, the target pattern may not be obtained.

  EXAMPLES Hereinafter, although a synthesis example and an Example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to the following Example.

[Synthesis Example 1] Copolymerization of the following monomer 1 and monomer 2 (0.7: 0.3)
In a 500 mL flask, 28.8 g of the following monomer 1 and 27.4 g of monomer 2 were dissolved in 100 mL of toluene, and after sufficiently removing oxygen in the system, the initiator AIBN (azobisisobutyronitrile) was changed to 0. .33 g was charged, the temperature was raised to 60 ° C., and the polymerization reaction was carried out for 24 hours.

In order to purify the polymer obtained, the reaction mixture was poured into hexane to precipitate the polymer obtained. Further, the operation of dissolving the obtained polymer in tetrahydrofuran and pouring it into 10 L of hexane to precipitate the polymer was repeated twice, and then the polymer was separated and dried. The 44.1 g of white polymer thus obtained is a polymer having a weight average molecular weight of 8,500 by light scattering method and a dispersity (= Mw / Mn) of 1.6 from the GPC elution curve. I was able to confirm. From the measurement result of ¹ H-NMR, it was found that the obtained polymer contained monomer 1 and monomer 2 at a molar ratio of 68:32.

[Synthesis Example 2] Copolymerization of the following monomer 3 and monomer 2 (0.7: 0.3)
In a 500 mL flask, 26.2 g of the following monomer 3 and 27.4 g of monomer 2 were dissolved in 100 mL of toluene, and after sufficiently removing oxygen in the system, 0.33 g of initiator AIBN was charged and the temperature was raised to 60 ° C. The polymerization reaction was carried out for 24 hours.

In order to purify the polymer obtained, the reaction mixture was poured into hexane to precipitate the polymer obtained. Further, the operation of dissolving the obtained polymer in tetrahydrofuran and pouring it into 10 L of hexane to precipitate the polymer was repeated twice, and then the polymer was separated and dried. The thus obtained 40.2 g of white polymer is a polymer having a weight average molecular weight of 9,800 by light scattering method and a dispersity (= Mw / Mn) of 1.85 from the GPC elution curve. I was able to confirm. From the measurement result of ¹ H-NMR, the obtained polymer was found to contain monomer 3 and monomer 2 in a molar ratio of 72:28.

[Synthesis Example 3] Copolymerization of monomer 1 and monomer 4 below (0.2: 0.8)
In a 500 mL flask, 11.6 g of the following monomer 1 and 43.2 g of monomer 4 were dissolved in 100 mL of toluene, and after sufficiently removing oxygen in the system, 0.33 g of initiator AIBN was charged and the temperature was raised to 60 ° C. The polymerization reaction was carried out for 24 hours.

In order to purify the polymer obtained, the reaction mixture was poured into hexane to precipitate the polymer obtained. Further, the operation of dissolving the obtained polymer in tetrahydrofuran and pouring it into 10 L of hexane to precipitate the polymer was repeated twice, and then the polymer was separated and dried. The 35.2 g of the white polymer thus obtained is a polymer having a weight average molecular weight of 12,100 by light scattering method and a dispersity (= Mw / Mn) of 1.75 from the GPC elution curve. I was able to confirm. From the measurement result of ¹ H-NMR, the obtained polymer was found to contain monomer 1 and monomer 4 in a molar ratio of 22:78.

[Comparative Synthesis Example 1] Copolymerization of the following monomer 5 and monomer 2 (0.7: 0.3)
In a 500 mL flask, 19.6 g of the following monomer 5 and 27.2 g of monomer 2 were dissolved in 100 mL of toluene, and after sufficiently removing oxygen in the system, 0.33 g of initiator AIBN was charged and the temperature was raised to 60 ° C. The polymerization reaction was carried out for 24 hours.

In order to purify the polymer obtained, the reaction mixture was poured into hexane to precipitate the polymer obtained. Further, the operation of dissolving the obtained polymer in tetrahydrofuran and pouring it into 10 L of hexane to precipitate the polymer was repeated twice, and then the polymer was separated and dried. The 32.2 g of the white polymer thus obtained is a polymer having a weight average molecular weight of 9,500 by the light scattering method and a dispersity (= Mw / Mn) of 1.78 from the GPC elution curve. I was able to confirm. From the measurement result of ¹ H-NMR, the obtained polymer was found to contain monomer 5 and monomer 2 in a molar ratio of 71:29.

[Comparative Synthesis Example 2] Copolymerization of monomer 5 and monomer 4 below (0.4: 0.6)
In a 500 mL flask, 15.4 g of the following monomer 5 and 32.4 g of monomer 4 were dissolved in 100 mL of toluene, and after sufficiently removing oxygen in the system, 0.33 g of initiator AIBN was charged and the temperature was raised to 60 ° C. The polymerization reaction was carried out for 24 hours.

In order to purify the polymer obtained, the reaction mixture was poured into hexane to precipitate the polymer obtained. Further, the operation of dissolving the obtained polymer in tetrahydrofuran and pouring it into 10 L of hexane to precipitate the polymer was repeated twice, and then the polymer was separated and dried. The 30.2 g of the white polymer thus obtained is a polymer having a weight average molecular weight of 12,800 by the light scattering method and a dispersity (= Mw / Mn) of 1.73 from the GPC elution curve. I was able to confirm. From the measurement result of ¹ H-NMR, the obtained polymer was found to contain monomer 5 and monomer 4 in a molar ratio of 42:58.

[Evaluation example]
Polymer Permeability Measurement 1 g of the polymer obtained was sufficiently dissolved in 20 g of propylene glycol monomethyl ether acetate (PGMEA) and filtered through a 0.2 μm filter to prepare a polymer solution.

The polymer solution was spin-coated on an MgF ₂ substrate and applied, and then baked at 100 ° C. for 90 seconds using a hot plate to form a polymer film having a thickness of 100 nm on the MgF ₂ substrate. This substrate was placed in a vacuum ultraviolet photometer (manufactured by JASCO Corporation, VUV-200S), and transmittances at 248 nm, 193 nm, and 157 nm were measured. The measurement results are shown in Table 1.

Resist Preparation and Exposure A resist solution was prepared by a conventional method using the above polymers and the components shown below in the amounts shown in Table 2. Next, after spin-coating a resist solution obtained on a silicon wafer on which DUV-30 (manufactured by Brewer Science) was formed to a film thickness of 55 nm, the resist solution was baked at 100 ° C. for 90 seconds using a hot plate. The thickness was 200 nm. This was exposed with an F ₂ laser (Risotech Japan Co., Ltd., VUVES-4500) while changing the exposure amount, and immediately after exposure, baked at 120 ° C. for 90 seconds, and then with an aqueous solution of 2.38% tetramethylammonium hydroxide. Development was performed for 2 seconds, and the relationship between the exposure amount and the remaining film ratio was determined. The exposure amount at which the film thickness became 0 was determined as Eth, and the sensitivity of the resist and the tan θ of the gradient at that time were determined as γ. The results are shown in Table 2.

Dry etching resistance In the dry etching resistance test, 10 g of PGMEA was dissolved in 2 g of polymer, and a polymer solution filtered through a 0.2 μm size filter was formed on a Si substrate by spin coating to form a 300 nm thick film. Evaluation was performed under the conditions of The results are shown in Table 3.
(1) Etching test with CHF ₃ / CF ₄ gas Using a dry etching apparatus TE-8500P manufactured by Tokyo Electron Co., Ltd., the difference in film thickness of the polymer film before and after etching was determined.
Etching conditions are as shown below.
Chamber pressure 40.0Pa
RF power 1,300W
Gap 9mm
CHF ₃ gas flow rate 30ml / min
CF ₄ gas flow rate 30ml / min
Ar gas flow rate 100ml / min
60 sec
₍₂₎ Cl ₂ / BCl ₃ system using an etching test Nichiden Anelva Co., Ltd. dry etching apparatus L-507D-L Gas was calculated the difference between the film thickness of before and after etching of the polymer film.
Etching conditions are as shown below.
Chamber pressure 40.0Pa
RF power 300W
Gap 9mm
Cl ₂ gas flow rate 30ml / min
BCl ₃ gas flow rate 30ml / min
CHF ₃ gas flow rate 100ml / min
O ₂ gas flow rate 2ml / min
60 sec

From Tables 1 and 2, it was found that the resist material using the polymer compound of the present invention can ensure sufficient transparency even at a wavelength of F ₂ (157 nm). Further, as a result of VUVES exposure, it was found that the film thickness decreased as the exposure amount increased and exhibited the characteristics of a positive resist. Further, Table 3 shows that the polymer compound of the present invention exhibits excellent dry etching resistance.

Claims (9)

A polymer compound having a repeating unit represented by the following general formulas (1m) and (1p).

Wherein R ¹ and R ² are a hydrogen atom, a fluorine atom, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms or a fluorinated alkyl group. R ³ is a fluorine atom, Or a linear, branched or cyclic fluorinated alkyl group having 1 to 20 carbon atoms, and R ⁴ is an acid labile group having at least one cyclic structure having 6 to 20 carbon atoms.

Is a unit selected from the following formulae.

m, p is 0 <m <1,0 <p < 1, is 0 <m + p ≦ 1. ) The polymer compound according to claim 1, wherein R ³ is a linear, branched or cyclic fluorinated alkyl group having 1 to 20 carbon atoms. The polymer compound according to claim 2, wherein R ³ is a trifluoromethyl group.   A resist material comprising the polymer compound according to claim 1. (A) The polymer compound according to any one of claims 1 to 3,
(B) an organic solvent,
(C) A chemically amplified resist material containing an acid generator.   Furthermore, the resist material of Claim 5 containing a basic compound.   The resist material according to claim 5 or 6, further comprising a dissolution inhibitor. (1) A step of applying the resist material according to any one of claims 4 to 7 on a substrate;
(2) Next, after the heat treatment, a step of exposing with a high energy ray having a wavelength of 100 to 180 nm band or 1 to 30 nm band through a photomask;
(3) A pattern forming method comprising a step of performing heat treatment as necessary and then developing using a developer. The pattern forming method according to claim 8, wherein the high energy beam is an F ₂ laser, an Ar ₂ laser, or a soft X-ray.