JP4670643B2 - Speaker diaphragm, manufacturing method thereof, and speaker using the speaker diaphragm - Google Patents

Speaker diaphragm, manufacturing method thereof, and speaker using the speaker diaphragm Download PDF

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Publication number
JP4670643B2
JP4670643B2 JP2006001145A JP2006001145A JP4670643B2 JP 4670643 B2 JP4670643 B2 JP 4670643B2 JP 2006001145 A JP2006001145 A JP 2006001145A JP 2006001145 A JP2006001145 A JP 2006001145A JP 4670643 B2 JP4670643 B2 JP 4670643B2
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film
speaker
speaker diaphragm
manufacturing
voice coil
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JP2007184750A (en
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昌志 川邊
浩司 佐野
健市 阿式
慎一 山中
直人 立石
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は例えば携帯電話等に採用されるスピーカと、このスピーカのスピーカ振動板とこのスピーカ振動板の製造方法に関するものである。   The present invention relates to a speaker employed in, for example, a mobile phone, a speaker diaphragm of the speaker, and a method for manufacturing the speaker diaphragm.

例えば携帯電話等に採用されるスピーカは小型軽量化が求められることから、そのスピーカ振動板を、エッジ用の第１フィルムと、この第１フィルムにその一部を接合した振動用の第２フィルムにより形成していた。   For example, since a speaker employed in a mobile phone or the like is required to be small and light, the speaker diaphragm is made up of a first film for edges and a second film for vibration in which a part thereof is joined to the first film. It was formed by.

なお、このような先行技術を開示した文献としては例えば下記特許文献１が知られている。
特開２００５−２９４９８２号公報 As a document disclosing such a prior art, for example, the following Patent Document 1 is known.
Japanese Patent Laid-Open No. 2005-294882

上記従来例においては音圧特性が低いという課題があった。   The conventional example has a problem that the sound pressure characteristic is low.

すなわち、この従来例においても、スピーカ振動板を軽量化することによりその音圧特性を向上させるべく、上述のごとくエッジ用の第１フィルムと振動用の第２フィルムの一部を接合した構造としているが、これら第１、第２フィルムの接合のために両者の接合部には接着剤が塗布されており、このように接着剤を用いると結論としてスピーカ振動板が重くなり、この結果として音圧特性が低くなってしまうのであった。   That is, also in this conventional example, in order to improve the sound pressure characteristics by reducing the weight of the speaker diaphragm, as described above, a structure in which a part of the first film for edges and the second film for vibrations are joined. However, an adhesive is applied to the joint between the first and second films, and as a result, the use of such an adhesive makes the speaker diaphragm heavier. The pressure characteristics would be lowered.

そこで本発明は音圧特性を高めることを目的とするものである。   Therefore, the present invention aims to improve sound pressure characteristics.

そしてこの目的を達成するために本発明は振動用の第２のフィルムの肉厚を、エッジ用の第１のフィルムよりも厚くするとともに、第２のフィルムは、第１のフィルムよりもレーザー光の吸収率が高い材料により形成し、これらの第１、第２のフィルムの接合部はレーザー光により、ボイスコイル近傍で熱溶着させることにより一体化することで、第１のフィルムは肉薄とすることにより軽量化を図り、エッジとしての弾性変形がしやすいものとし、第２のフィルムはボイスコイルを固定した状態でも適切に振動できるものとし、接着剤による重量化を回避して音圧特性を向上させたものである。 In order to achieve this object, the present invention makes the thickness of the second film for vibration larger than that of the first film for edges, and the second film is more laser light than the first film. The first film is made thin by integrating the first and second film joints by laser welding in the vicinity of the voice coil with a laser beam. The second film should be able to vibrate properly even when the voice coil is fixed, avoiding weighting by the adhesive and providing sound pressure characteristics. It is an improvement .

以上のように本発明はエッジ用の第１のフィルムは肉薄とすることにより軽量化を図るとともに、エッジとしての弾性変形がしやすいものとし、また振動用の第２のフィルムはボイスコイルを固定した状態でも適切に振動できるものとし、さらにこれら第１、第２のフィルムの接合部を熱溶着することで、従来のように大量の接着剤を用いる結果としての重量化を回避し、これにより音圧特性を向上させることができるのである。   As described above, according to the present invention, the first film for the edge is made thin so that the weight is reduced and the edge is easily elastically deformed, and the second film for vibration fixes the voice coil. It is possible to vibrate properly even in a state where the heat treatment is performed, and furthermore, by thermally welding the joint portions of the first and second films, a weight increase as a result of using a large amount of adhesive as in the past is avoided, thereby The sound pressure characteristic can be improved.

図１は携帯電話等の携帯機器に用いられるスピーカを示し、１は枠状のフレームで、このフレーム１の内方には凹状のヨーク２が装着されている。   FIG. 1 shows a speaker used in a portable device such as a cellular phone. Reference numeral 1 denotes a frame-like frame, and a concave yoke 2 is attached to the inside of the frame 1.

ヨーク２の上方には板状のマグネット３、およびプレート４が重合されており、プレート４とヨーク２の上方部との間で磁気ギャップ５が形成されている。   A plate-like magnet 3 and a plate 4 are superposed above the yoke 2, and a magnetic gap 5 is formed between the plate 4 and the upper portion of the yoke 2.

磁気ギャップ５には筒状のボイスコイル６が可動自在に配置されており、このボイスコイル６の上端はスピーカ振動板７の下面に、例えば接着剤（図示せず）により固定されている。   A cylindrical voice coil 6 is movably disposed in the magnetic gap 5, and the upper end of the voice coil 6 is fixed to the lower surface of the speaker diaphragm 7 with, for example, an adhesive (not shown).

スピーカ振動板７はポリエチレンナフタレートより形成したリング状でエッジ用の第１のフィルム８と、ポリイミドにより形成した逆皿状で振動用の第２のフィルム９とにより構成されている。   The speaker diaphragm 7 is composed of a ring-shaped edge first film 8 made of polyethylene naphthalate and an inverted dish-shaped vibration second film 9 made of polyimide.

またこれらの第１、第２フィルム８、９は図２のごとく第１フィルム８の内周部を、第２フィルム９のボイスコイル６近傍で熱溶着させることにより一体化している。   The first and second films 8 and 9 are integrated by thermally welding the inner peripheral portion of the first film 8 in the vicinity of the voice coil 6 of the second film 9 as shown in FIG.

具体的には図２に示すごとくこれら第１、第２フィルム８、９の一部を重合させ、第２フィルム９側を上にした状態で石英ガラスよりなる透明板１０を重しとして載せ、その状態で上方から例えば４０５ｎｍのレーザー光を照射した。   Specifically, as shown in FIG. 2, a part of these first and second films 8 and 9 is polymerized, and a transparent plate 10 made of quartz glass is placed as a weight with the second film 9 side up, In this state, for example, a laser beam of 405 nm was irradiated from above.

この場合ポリイミドよりなる第２のフィルム９はレーザー光の吸収率がポリエチレンナフタレートよりなる第１のフィルム８よりもレーザー光の吸収率よりも高いことから、この第２のフィルム９は発熱し、この発熱により第１、第２のフィルム８、９の接合面１１が溶着した状態となっている。   In this case, since the second film 9 made of polyimide has a higher absorption rate of laser light than that of the first film 8 made of polyethylene naphthalate, the second film 9 generates heat, Due to this heat generation, the joining surfaces 11 of the first and second films 8 and 9 are welded.

なお本実施形態においては透明板１０上におけるレーザー光の角度は例えば図２のごとく１２度としたが、透明板１０を通過することで第２のフィルム９へ向う時には約１０度と絞られた状態になってレーザー光が、第１、第２のフィルム８、９の接合部へと集中しやすい状態となっている。   In this embodiment, the angle of the laser beam on the transparent plate 10 is set to 12 degrees as shown in FIG. 2, for example. However, when the laser beam passes through the transparent plate 10 and goes to the second film 9, the angle is reduced to about 10 degrees. In this state, the laser beam is likely to concentrate on the joint between the first and second films 8 and 9.

以上のように本発明の実施形態においては、エッジ用の第１のフィルム８は肉薄とすることにより軽量化を図るとともに、エッジとしての弾性変形がしやすいものとし、また振動用の第２のフィルム９はボイスコイル６を固定した状態でも適切に振動できるものとし、さらにこれら第１、第２のフィルム８、９の接合部を熱溶着することで、従来のように大量の接着剤を用いる結果としての重量化を回避し、これにより音圧特性を向上させることができるものとなった。   As described above, in the embodiment of the present invention, the edge first film 8 is lightened by being thinned, and is easily elastically deformed as an edge. Further, the second film 8 for vibration is used. The film 9 can vibrate properly even when the voice coil 6 is fixed, and further, a large amount of adhesive is used as in the past by thermally welding the joint portions of the first and second films 8 and 9. As a result, weight gain can be avoided, thereby improving the sound pressure characteristics.

具体的には第１、第２のフィルム８、９を２．５ｍｇの接着剤で接着したものに比べ音圧特性を約１ｄＢも向上させることができた。   Specifically, the sound pressure characteristics could be improved by about 1 dB as compared with the case where the first and second films 8 and 9 were bonded with 2.5 mg adhesive.

図３は本発明の他の実施形態を示し、第２のフィルム９ａの内方に凹部ａを形成することで強度アップを図り、その状態でこの第２のフィルム９ａの下面にボイスコイル６ａを固定したものである。   FIG. 3 shows another embodiment of the present invention, in which a concave portion a is formed inward of the second film 9a to increase the strength. In this state, the voice coil 6a is attached to the lower surface of the second film 9a. It is fixed.

また図４はボイスコイル６ｂを、第２のフィルム９ｂの強度アップ用の凹部ｂの下方に固定したものである。   FIG. 4 shows the voice coil 6b fixed below the concave portion b for increasing the strength of the second film 9b.

これら図３、図４および図１のものも第１、第２のフィルム８、９、９ａ、９ｂの接合部は重合による強度アップが図られているので、この近傍にボイスコイル６、６ａ、６ｂを固定することが好ましい。   In these FIG. 3, FIG. 4 and FIG. 1 as well, the strength of the first and second films 8, 9, 9a, 9b is increased by polymerization, so that the voice coils 6, 6a, It is preferable to fix 6b.

以上のように本発明はエッジ用の第１のフィルムは肉薄とすることにより軽量化を図るとともに、エッジとしての弾性変形がしやすいものとし、また振動用の第２のフィルムはボイスコイルを固定した状態でも適切に振動できるものとし、さらにこれら第１、第２のフィルムの接合部を熱溶着することで、従来のように大量の接着剤を用いる結果としての重量化を回避し、これにより音圧特性を向上させることができるものであり、各種機器に適用される。   As described above, according to the present invention, the first film for the edge is made thin so that the weight is reduced and the edge is easily elastically deformed, and the second film for vibration fixes the voice coil. It is possible to vibrate properly even in a state where the heat treatment is performed, and furthermore, by thermally welding the joint portions of the first and second films, a weight increase as a result of using a large amount of adhesive as in the past is avoided, thereby The sound pressure characteristic can be improved and applied to various devices.

本発明の一実施形態の断面図Sectional drawing of one embodiment of the present invention 同拡大断面図The same enlarged sectional view 本発明の他の実施形態の断面図Sectional drawing of other embodiment of this invention 本発明のさらに他の実施形態の断面図Sectional drawing of other embodiment of this invention.

符号の説明Explanation of symbols

６ ボイスコイル
７ スピーカ振動板
８ 第１フィルム
９ 第２フィルム 6 Voice coil 7 Speaker diaphragm 8 First film 9 Second film

Claims (6)

エッジ用の第１のフィルムと、この第１のフィルムにその一部が接合された振動用の第２のフィルムとを備え、前記第２のフィルムの肉厚を第１のフィルムの肉厚よりも厚くするとともに、前記第２のフィルムは、前記第１のフィルムよりもレーザー光の吸収率が高い材料により形成し、これらの第１、第２のフィルムの接合部はレーザー光により、ボイスコイル近傍で熱溶着させることにより一体化することで、前記第１のフィルムは肉薄とすることにより軽量化を図り、前記エッジとしての弾性変形がしやすいものとし、前記第２のフィルムは前記ボイスコイルを固定した状態でも適切に振動できるものとし、接着剤による重量化を回避して音圧特性を向上させたスピーカ振動板。 A first film for an edge, and a second film for vibration that is partially bonded to the first film, wherein the thickness of the second film is greater than the thickness of the first film. The second film is made of a material having a higher laser light absorption rate than the first film, and the joining portion of these first and second films is formed by a laser beam and a voice coil. By integrating by heat welding in the vicinity, the first film is thinned to reduce the weight, and the edge is easily elastically deformed, and the second film is the voice coil A loudspeaker diaphragm that can be properly vibrated even in a fixed state, and has improved sound pressure characteristics by avoiding weighting due to adhesive . 第１のフィルムはポリエチレンナフタレートにより形成し、第２のフィルムはポリイミドにより形成した請求項１に記載のスピーカ振動板。 The speaker diaphragm according to claim 1, wherein the first film is formed of polyethylene naphthalate, and the second film is formed of polyimide. 請求項１または請求項２のいずれか一つに記載のスピーカ振動板の製造方法であって、先ず第１、第２のフィルムの一部を重合させ、次にこの重合部に透明板を介してレーザー光を照射するスピーカ振動板の製造方法。 3. The method for manufacturing a speaker diaphragm according to claim 1, wherein a part of the first and second films is first polymerized, and then a transparent plate is interposed in the superposed portion. A method for manufacturing a speaker diaphragm that emits laser light. 請求項１または請求項２のいずれか一つに記載のスピーカ振動板の製造方法であって、レーザー光は第２のフィルム側から照射するスピーカ振動板の製造方法。 3. The method for manufacturing a speaker diaphragm according to claim 1 , wherein the laser beam is irradiated from the second film side. レーザー光は透明板を介して第２のフィルムに照射する請求項４に記載のスピーカ振動板の製造方法。 The method for manufacturing a speaker diaphragm according to claim 4 , wherein the laser beam is applied to the second film through a transparent plate. 請求項１または請求項２のいずれか一つに記載のスピーカ振動板の第２のフィルムにボイスコイルを固定したスピーカ。 The speaker which fixed the voice coil to the 2nd film of the speaker diaphragm as described in any one of Claim 1 or Claim 2 .
JP2006001145A 2006-01-06 2006-01-06 Speaker diaphragm, manufacturing method thereof, and speaker using the speaker diaphragm Expired - Fee Related JP4670643B2 (en)

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Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851695A (en) * 1981-09-24 1983-03-26 Sony Corp Speaker
JPS58156298A (en) * 1982-03-12 1983-09-17 Sanyo Electric Co Ltd Joining method of speaker diaphragm and its edge
JPS5927697A (en) * 1982-08-04 1984-02-14 Sanyo Electric Co Ltd Join method of speaker diaphragm and edge
JPS61137493A (en) * 1984-12-10 1986-06-25 Mitsuru Nagai Loudspeaker device
JPH0461596A (en) * 1990-06-29 1992-02-27 Onkyo Corp Speaker and its manufacture
JPH0542336B2 (en) * 1985-12-17 1993-06-28 Honda Motor Co Ltd
JPH07284193A (en) * 1994-04-05 1995-10-27 Matsushita Electric Ind Co Ltd Diaphragm for speaker and manufacture therefor
JPH07312798A (en) * 1994-05-19 1995-11-28 Pioneer Cone Corp Manufacture of diaphragm for speaker
JPH07322390A (en) * 1994-05-26 1995-12-08 Foster Electric Co Ltd Diaphragm for electroacoustic transducer manufacture therefor
JPH09107598A (en) * 1995-10-13 1997-04-22 Calsonic Corp Cone speaker
JP2001346291A (en) * 2000-06-05 2001-12-14 Sony Corp Loudspeaker system
JP2004001500A (en) * 2002-04-26 2004-01-08 Ts Corporation Apparatus and method for sheet laminated molding
JP2004015280A (en) * 2002-06-05 2004-01-15 Matsushita Electric Ind Co Ltd Manufacturing method for acoustic transducer
JP2004040612A (en) * 2002-07-05 2004-02-05 Citizen Electronics Co Ltd Manufacturing method for electroacoustic transducer
WO2004060658A1 (en) * 2002-12-27 2004-07-22 Toray Industries, Inc. Layered product, electromagnetic-shielding molded object, and processes for producing these
JP2005193614A (en) * 2004-01-09 2005-07-21 Ube Ind Ltd Method for joining pipe-shaped article
WO2005082982A1 (en) * 2004-02-27 2005-09-09 Toray Industries, Inc. Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, sheet of fiber-reinforced composite material and cabinet for electrical/electronic equipment
JP2005294982A (en) * 2004-03-31 2005-10-20 Matsushita Electric Ind Co Ltd Speaker and module using this, electronic apparatus, and apparatus
WO2005099305A1 (en) * 2004-03-31 2005-10-20 Matsushita Electric Industrial Co., Ltd. Speaker, module using the same, electronic equipment and device, and speaker producing method

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5851695A (en) * 1981-09-24 1983-03-26 Sony Corp Speaker
JPS58156298A (en) * 1982-03-12 1983-09-17 Sanyo Electric Co Ltd Joining method of speaker diaphragm and its edge
JPS5927697A (en) * 1982-08-04 1984-02-14 Sanyo Electric Co Ltd Join method of speaker diaphragm and edge
JPS61137493A (en) * 1984-12-10 1986-06-25 Mitsuru Nagai Loudspeaker device
JPH0542336B2 (en) * 1985-12-17 1993-06-28 Honda Motor Co Ltd
JPH0461596A (en) * 1990-06-29 1992-02-27 Onkyo Corp Speaker and its manufacture
JPH07284193A (en) * 1994-04-05 1995-10-27 Matsushita Electric Ind Co Ltd Diaphragm for speaker and manufacture therefor
JPH07312798A (en) * 1994-05-19 1995-11-28 Pioneer Cone Corp Manufacture of diaphragm for speaker
JPH07322390A (en) * 1994-05-26 1995-12-08 Foster Electric Co Ltd Diaphragm for electroacoustic transducer manufacture therefor
JPH09107598A (en) * 1995-10-13 1997-04-22 Calsonic Corp Cone speaker
JP2001346291A (en) * 2000-06-05 2001-12-14 Sony Corp Loudspeaker system
JP2004001500A (en) * 2002-04-26 2004-01-08 Ts Corporation Apparatus and method for sheet laminated molding
JP2004015280A (en) * 2002-06-05 2004-01-15 Matsushita Electric Ind Co Ltd Manufacturing method for acoustic transducer
JP2004040612A (en) * 2002-07-05 2004-02-05 Citizen Electronics Co Ltd Manufacturing method for electroacoustic transducer
WO2004060658A1 (en) * 2002-12-27 2004-07-22 Toray Industries, Inc. Layered product, electromagnetic-shielding molded object, and processes for producing these
JP2005193614A (en) * 2004-01-09 2005-07-21 Ube Ind Ltd Method for joining pipe-shaped article
WO2005082982A1 (en) * 2004-02-27 2005-09-09 Toray Industries, Inc. Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, sheet of fiber-reinforced composite material and cabinet for electrical/electronic equipment
JP2005294982A (en) * 2004-03-31 2005-10-20 Matsushita Electric Ind Co Ltd Speaker and module using this, electronic apparatus, and apparatus
WO2005099305A1 (en) * 2004-03-31 2005-10-20 Matsushita Electric Industrial Co., Ltd. Speaker, module using the same, electronic equipment and device, and speaker producing method

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