JP4666858B2 - 重ね合せレジストレーションのランごとの制御のための方法および装置 - Google Patents
重ね合せレジストレーションのランごとの制御のための方法および装置 Download PDFInfo
- Publication number
- JP4666858B2 JP4666858B2 JP2001516238A JP2001516238A JP4666858B2 JP 4666858 B2 JP4666858 B2 JP 4666858B2 JP 2001516238 A JP2001516238 A JP 2001516238A JP 2001516238 A JP2001516238 A JP 2001516238A JP 4666858 B2 JP4666858 B2 JP 4666858B2
- Authority
- JP
- Japan
- Prior art keywords
- control input
- step size
- semiconductor device
- processing
- program storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/371,550 US6405096B1 (en) | 1999-08-10 | 1999-08-10 | Method and apparatus for run-to-run controlling of overlay registration |
| US09/371,550 | 1999-08-10 | ||
| PCT/US2000/010249 WO2001011678A1 (en) | 1999-08-10 | 2000-04-18 | Method and apparatus for run-to-run controlling of overlay registration |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003506898A JP2003506898A (ja) | 2003-02-18 |
| JP2003506898A5 JP2003506898A5 (enExample) | 2007-04-26 |
| JP4666858B2 true JP4666858B2 (ja) | 2011-04-06 |
Family
ID=23464424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001516238A Expired - Fee Related JP4666858B2 (ja) | 1999-08-10 | 2000-04-18 | 重ね合せレジストレーションのランごとの制御のための方法および装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6405096B1 (enExample) |
| EP (1) | EP1208592A1 (enExample) |
| JP (1) | JP4666858B2 (enExample) |
| KR (1) | KR100734526B1 (enExample) |
| WO (1) | WO2001011678A1 (enExample) |
Families Citing this family (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7069101B1 (en) | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
| US6405096B1 (en) * | 1999-08-10 | 2002-06-11 | Advanced Micro Devices, Inc. | Method and apparatus for run-to-run controlling of overlay registration |
| US6640151B1 (en) | 1999-12-22 | 2003-10-28 | Applied Materials, Inc. | Multi-tool control system, method and medium |
| US6449524B1 (en) * | 2000-01-04 | 2002-09-10 | Advanced Micro Devices, Inc. | Method and apparatus for using equipment state data for run-to-run control of manufacturing tools |
| US6549822B1 (en) * | 2000-07-25 | 2003-04-15 | Advanced Micro Devices, Inc. | Method and apparatus for control of multi-cup semiconductor manufacturing tracks |
| KR100336525B1 (ko) * | 2000-08-07 | 2002-05-11 | 윤종용 | 반도체 장치의 제조를 위한 노광 방법 |
| US6708074B1 (en) | 2000-08-11 | 2004-03-16 | Applied Materials, Inc. | Generic interface builder |
| US6625513B1 (en) * | 2000-08-15 | 2003-09-23 | Applied Materials, Inc. | Run-to-run control over semiconductor processing tool based upon mirror image target |
| US7188142B2 (en) | 2000-11-30 | 2007-03-06 | Applied Materials, Inc. | Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility |
| DE10120701A1 (de) | 2001-04-27 | 2002-10-31 | Infineon Technologies Ag | Verfahren zur Steuerung eines Prozeßgerätes zur sequentiellen Verarbeitung von Halbleiterwafern |
| US7698012B2 (en) | 2001-06-19 | 2010-04-13 | Applied Materials, Inc. | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| US6910947B2 (en) | 2001-06-19 | 2005-06-28 | Applied Materials, Inc. | Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| US6913938B2 (en) | 2001-06-19 | 2005-07-05 | Applied Materials, Inc. | Feedback control of plasma-enhanced chemical vapor deposition processes |
| US7201936B2 (en) | 2001-06-19 | 2007-04-10 | Applied Materials, Inc. | Method of feedback control of sub-atmospheric chemical vapor deposition processes |
| US7082345B2 (en) * | 2001-06-19 | 2006-07-25 | Applied Materials, Inc. | Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
| US7047099B2 (en) | 2001-06-19 | 2006-05-16 | Applied Materials Inc. | Integrating tool, module, and fab level control |
| US7101799B2 (en) * | 2001-06-19 | 2006-09-05 | Applied Materials, Inc. | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| US6444481B1 (en) * | 2001-07-02 | 2002-09-03 | Advanced Micro Devices, Inc. | Method and apparatus for controlling a plating process |
| US7337019B2 (en) | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
| US6984198B2 (en) | 2001-08-14 | 2006-01-10 | Applied Materials, Inc. | Experiment management system, method and medium |
| US7804994B2 (en) * | 2002-02-15 | 2010-09-28 | Kla-Tencor Technologies Corporation | Overlay metrology and control method |
| US7225047B2 (en) | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
| US20030199112A1 (en) | 2002-03-22 | 2003-10-23 | Applied Materials, Inc. | Copper wiring module control |
| TW533468B (en) * | 2002-04-02 | 2003-05-21 | Macronix Int Co Ltd | Yield monitoring and analysis system and method |
| US6672716B2 (en) * | 2002-04-29 | 2004-01-06 | Xerox Corporation | Multiple portion solid ink stick |
| US20040007325A1 (en) * | 2002-06-11 | 2004-01-15 | Applied Materials, Inc. | Integrated equipment set for forming a low K dielectric interconnect on a substrate |
| US20040206621A1 (en) * | 2002-06-11 | 2004-10-21 | Hongwen Li | Integrated equipment set for forming a low K dielectric interconnect on a substrate |
| JP2005535130A (ja) | 2002-08-01 | 2005-11-17 | アプライド マテリアルズ インコーポレイテッド | 最新のプロセス制御システム内で誤って表された計測データを取り扱う方法、システム、および媒体 |
| US6735485B1 (en) * | 2002-11-08 | 2004-05-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Overlay registration correction method for multiple product type microelectronic fabrication foundry facility |
| DE10252605A1 (de) * | 2002-11-12 | 2004-06-24 | Infineon Technologies Ag | Verfahren, Vorrichtung, computerlesbarer Speicher und Computerprogramm-Element zum rechnergestützten Überwachen und Regeln eines Herstellungsprozesses |
| CN1720490B (zh) | 2002-11-15 | 2010-12-08 | 应用材料有限公司 | 用于控制具有多变量输入参数的制造工艺的方法和系统 |
| US6823231B1 (en) * | 2002-11-25 | 2004-11-23 | Advanced Micro Devices, Inc. | Tuning of a process control based upon layer dependencies |
| US6815232B2 (en) * | 2002-11-26 | 2004-11-09 | Advanced Micro Devices, Inc. | Method and apparatus for overlay control using multiple targets |
| US6912433B1 (en) * | 2002-12-18 | 2005-06-28 | Advanced Mirco Devices, Inc. | Determining a next tool state based on fault detection information |
| US7333871B2 (en) | 2003-01-21 | 2008-02-19 | Applied Materials, Inc. | Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools |
| US7089528B2 (en) * | 2003-03-11 | 2006-08-08 | International Business Machines Corporation | Methods and systems for estimating reticle bias states |
| US6766214B1 (en) * | 2003-04-03 | 2004-07-20 | Advanced Micro Devices, Inc. | Adjusting a sampling rate based on state estimation results |
| CN100419983C (zh) * | 2003-05-16 | 2008-09-17 | 东京毅力科创株式会社 | 处理系统健康指数及其使用方法 |
| US7205228B2 (en) | 2003-06-03 | 2007-04-17 | Applied Materials, Inc. | Selective metal encapsulation schemes |
| US7608468B1 (en) | 2003-07-02 | 2009-10-27 | Kla-Tencor Technologies, Corp. | Apparatus and methods for determining overlay and uses of same |
| US7346878B1 (en) | 2003-07-02 | 2008-03-18 | Kla-Tencor Technologies Corporation | Apparatus and methods for providing in-chip microtargets for metrology or inspection |
| US7354332B2 (en) | 2003-08-04 | 2008-04-08 | Applied Materials, Inc. | Technique for process-qualifying a semiconductor manufacturing tool using metrology data |
| US6978191B2 (en) * | 2003-09-06 | 2005-12-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Overlay registration control system and method employing multiple pilot lot in-line overlay registration measurement |
| US7031794B2 (en) * | 2003-09-26 | 2006-04-18 | Taiwan Semiconductor Manufacturing Co. Ltd. | Smart overlay control |
| TWI269943B (en) * | 2003-12-25 | 2007-01-01 | Promos Technologies Inc | Photolithographic parameter feed back system and control method |
| US7356377B2 (en) | 2004-01-29 | 2008-04-08 | Applied Materials, Inc. | System, method, and medium for monitoring performance of an advanced process control system |
| US7260442B2 (en) * | 2004-03-03 | 2007-08-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for mask fabrication process control |
| US20050209818A1 (en) * | 2004-03-17 | 2005-09-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for predicting a parameter for a lithography overlay first lot |
| US6980873B2 (en) | 2004-04-23 | 2005-12-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment |
| US7437404B2 (en) * | 2004-05-20 | 2008-10-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for improving equipment communication in semiconductor manufacturing equipment |
| US6961626B1 (en) | 2004-05-28 | 2005-11-01 | Applied Materials, Inc | Dynamic offset and feedback threshold |
| US7096085B2 (en) | 2004-05-28 | 2006-08-22 | Applied Materials | Process control by distinguishing a white noise component of a process variance |
| TWI266154B (en) * | 2004-09-21 | 2006-11-11 | Promos Technologies Inc | Method and system for determining lithography overlay offsets |
| US8676538B2 (en) * | 2004-11-02 | 2014-03-18 | Advanced Micro Devices, Inc. | Adjusting weighting of a parameter relating to fault detection based on a detected fault |
| US7305634B2 (en) * | 2004-11-23 | 2007-12-04 | Lsi Corporation | Method to selectively identify at risk die based on location within the reticle |
| JP2006278767A (ja) * | 2005-03-29 | 2006-10-12 | Toshiba Corp | オーバーレイ制御システム及びオーバーレイ制御方法 |
| JP4541237B2 (ja) * | 2005-06-29 | 2010-09-08 | リンテック株式会社 | 半導体ウエハ処理テープ巻装体およびそれを用いた半導体ウエハ処理テープ貼着装置ならびに半導体ウエハ加工処理装置 |
| TW200941010A (en) * | 2008-03-24 | 2009-10-01 | Promos Technologies Inc | Method and system for processing test wafer in photolithography process |
| US8350337B2 (en) * | 2009-12-29 | 2013-01-08 | United Microelectronics Corp. | Semiconductor device and method of forming the same |
| US9927718B2 (en) | 2010-08-03 | 2018-03-27 | Kla-Tencor Corporation | Multi-layer overlay metrology target and complimentary overlay metrology measurement systems |
| DE112011103259T5 (de) | 2010-09-28 | 2013-08-08 | International Business Machines Corporation | Verfahren, Programm und Vorrichtung zum Gruppieren einer Vielzahl von Elementen |
| US10890436B2 (en) | 2011-07-19 | 2021-01-12 | Kla Corporation | Overlay targets with orthogonal underlayer dummyfill |
| US10295993B2 (en) * | 2011-09-01 | 2019-05-21 | Kla-Tencor Corporation | Method and system for detecting and correcting problematic advanced process control parameters |
| WO2018089217A1 (en) * | 2016-11-11 | 2018-05-17 | Applied Materials, Inc. | Hybrid laser and implant treatment for overlay error correction |
| KR102606104B1 (ko) | 2019-01-29 | 2023-11-29 | 에이에스엠엘 네델란즈 비.브이. | 반도체 제조 공정에서의 의사 결정 방법 |
| CN119535898A (zh) * | 2023-08-30 | 2025-02-28 | 上海华力微电子有限公司 | 监控光刻机照明系统残影效应的方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0616475B2 (ja) | 1987-04-03 | 1994-03-02 | 三菱電機株式会社 | 物品の製造システム及び物品の製造方法 |
| JPH06349706A (ja) * | 1993-06-08 | 1994-12-22 | Nikon Corp | 位置合わせ方法 |
| JPH06349707A (ja) * | 1993-06-14 | 1994-12-22 | Nikon Corp | 位置合わせ方法 |
| JPH06291021A (ja) * | 1993-04-06 | 1994-10-18 | Nikon Corp | 位置合わせ方法 |
| JPH06302496A (ja) * | 1993-04-13 | 1994-10-28 | Nikon Corp | 位置合わせ方法 |
| JPH06310403A (ja) * | 1993-04-21 | 1994-11-04 | Nikon Corp | 位置合わせ方法 |
| US5444538A (en) * | 1994-03-10 | 1995-08-22 | New Vision Systems, Inc. | System and method for optimizing the grid and intrafield registration of wafer patterns |
| US5741732A (en) | 1995-05-03 | 1998-04-21 | Sony Corporation | Method for detecting implantation mask misalignment |
| KR0165320B1 (ko) * | 1995-12-27 | 1999-02-01 | 김광호 | 반도체 산화 공정의 소크타임 설정 방법 |
| JPH1022190A (ja) * | 1996-06-28 | 1998-01-23 | Nikon Corp | 露光装置における位置合わせ誤差補正方法および該方法を用いた露光装置 |
| JPH10199784A (ja) * | 1997-01-06 | 1998-07-31 | Mitsubishi Electric Corp | アライメント補正方法及び半導体装置 |
| US5877861A (en) * | 1997-11-14 | 1999-03-02 | International Business Machines Corporation | Method for overlay control system |
| US5866437A (en) | 1997-12-05 | 1999-02-02 | Advanced Micro Devices, Inc. | Dynamic process window control using simulated wet data from current and previous layer data |
| TW420833B (en) * | 1998-04-17 | 2001-02-01 | Taiwan Semiconductor Mfg | Overlay correction method of wafer alignment |
| US6263255B1 (en) * | 1998-05-18 | 2001-07-17 | Advanced Micro Devices, Inc. | Advanced process control for semiconductor manufacturing |
| TW419720B (en) * | 1999-03-26 | 2001-01-21 | Mosel Vitelic Inc | The method of monitoring the overlay accuracy of the stepper and the device using the same |
| US6556959B1 (en) * | 1999-07-12 | 2003-04-29 | Advanced Micro Devices, Inc. | Method and apparatus for updating a manufacturing model based upon fault data relating to processing of semiconductor wafers |
| US6368883B1 (en) * | 1999-08-10 | 2002-04-09 | Advanced Micro Devices, Inc. | Method for identifying and controlling impact of ambient conditions on photolithography processes |
| US6405096B1 (en) * | 1999-08-10 | 2002-06-11 | Advanced Micro Devices, Inc. | Method and apparatus for run-to-run controlling of overlay registration |
| US6535774B1 (en) * | 1999-08-12 | 2003-03-18 | Advanced Micro Devices, Inc. | Incorporation of critical dimension measurements as disturbances to lithography overlay run to run controller |
| US6427093B1 (en) * | 1999-10-07 | 2002-07-30 | Advanced Micro Devices, Inc. | Method and apparatus for optimal wafer-by-wafer processing |
| US6248602B1 (en) * | 1999-11-01 | 2001-06-19 | Amd, Inc. | Method and apparatus for automated rework within run-to-run control semiconductor manufacturing |
| US6405144B1 (en) * | 2000-01-18 | 2002-06-11 | Advanced Micro Devices, Inc. | Method and apparatus for programmed latency for improving wafer-to-wafer uniformity |
| US6460002B1 (en) * | 2000-02-09 | 2002-10-01 | Advanced Micro Devices, Inc. | Method and apparatus for data stackification for run-to-run control |
| US6458605B1 (en) * | 2001-06-28 | 2002-10-01 | Advanced Micro Devices, Inc. | Method and apparatus for controlling photolithography overlay registration |
-
1999
- 1999-08-10 US US09/371,550 patent/US6405096B1/en not_active Expired - Lifetime
-
2000
- 2000-04-18 EP EP00926042A patent/EP1208592A1/en not_active Withdrawn
- 2000-04-18 JP JP2001516238A patent/JP4666858B2/ja not_active Expired - Fee Related
- 2000-04-18 WO PCT/US2000/010249 patent/WO2001011678A1/en not_active Ceased
- 2000-04-18 KR KR1020027001937A patent/KR100734526B1/ko not_active Expired - Fee Related
-
2002
- 2002-05-31 US US10/160,963 patent/US6622061B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US6622061B1 (en) | 2003-09-16 |
| JP2003506898A (ja) | 2003-02-18 |
| EP1208592A1 (en) | 2002-05-29 |
| US6405096B1 (en) | 2002-06-11 |
| WO2001011678A1 (en) | 2001-02-15 |
| KR20020020964A (ko) | 2002-03-16 |
| KR100734526B1 (ko) | 2007-07-03 |
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