JP4661118B2 - Resin molded body and molded circuit board - Google Patents

Description

  The present invention relates to an epoxy resin-based resin molded body on which a metal film is formed, and a molded circuit board using the resin molded body as a substrate.

  Epoxy resins generally have excellent mechanical properties, water resistance, heat resistance, chemical resistance, electrical insulation, etc. by selecting and curing various curing agents. Adhesives and molding materials It is used for a wide range of applications such as laminates and semiconductor sealing. In addition, a molded circuit board made of a resin molded product such as MID (Molded Interconnect Device) requires relatively high heat resistance (that is, a high glass transition temperature), and particularly when a semiconductor element such as an IC is flip-chip mounted. It is necessary to keep the coefficient of thermal expansion low, and a high glass transition temperature is required. As one of resins suitable as a material for the resin molded body of such a molded circuit board, an epoxy resin can be cited.

On the other hand, when a resin molded body is used as a molded circuit board, a metal film is formed on the surface of the resin molded body by a dry plating method such as sputtering or vacuum deposition, and a circuit is manufactured from the metal film. Thus, when forming a circuit with the metal film formed on the surface of the resin molded body, it is necessary to obtain a high adhesion strength of the metal film to the surface of the resin molded body in order to increase the conduction reliability of the circuit. Therefore, after the surface of the resin molded body is activated by plasma treatment, a metal film is formed on the surface of the resin molded body by a dry plating method, thereby improving the adhesion strength of the metal film to the surface of the resin molded body. (For example, refer to Patent Document 1, Patent Document 2, etc.).
JP 2002-60522 A JP 2002-283498 A

  When the plasma treatment is performed on the surface of the resin molded body molded with the thermoplastic resin as described above, it is possible to obtain a high effect of improving the adhesion strength of the metal film by the surface treatment by the plasma treatment. In the case of a resin molded body molded with an epoxy resin, there is a problem that it is difficult to obtain a high effect of improving the adhesion strength of the metal film by plasma treatment, and it is difficult to obtain sufficient adhesion strength of the metal film. .

  The present invention has been made in view of the above points, and aims to provide an epoxy resin-based resin molded body having high adhesion strength of a metal film, and molding having high adhesion reliability of a circuit. The object is to provide a circuit board.

  A resin molded body according to claim 1 of the present invention is a resin molded body in which a metal film is formed by dry plating on a surface activated by plasma treatment, and an epoxy resin containing a curing agent having a nitrogen functional group It is obtained by molding and curing the composition.

  According to this invention, nitrogen having high chemical reactivity with a metal can be introduced into the surface of a resin molded body molded with an epoxy resin, and the adhesion strength of the metal film to the resin molded body can be increased. is there.

Also, it is characterized in that the plasma treatment is intended to be performed in a nitrogen atmosphere.

  According to this invention, the amount of nitrogen on the surface of the resin molded body can be increased, and the adhesion strength of the metal film to the resin molded body can be further increased.

Also, it is characterized in that the plasma treatment is to be performed on the surface of nitriding treatment has been.

  According to this invention, the amount of nitrogen on the surface of the resin molded body can be further increased, and the adhesion strength of the metal film to the resin molded body can be further increased.

The invention of claim 2, the curing agent having fraud and mitigating risk nitrogen functionality in claim 1 is characterized in that an aminotriazine novolak resin.

  According to this invention, the effect which improves the adhesive strength of the metal film with respect to a resin molding can be acquired highly.

The invention according to claim 3 is the invention according to claim 1 or 2, wherein the main component of the epoxy resin composition is selected from epoxidized dicyclopentadiene-phenol resin, bisphenol A type epoxy resin, and glycidyl amine type epoxy resin. It is characterized by this.

  According to this invention, the effect which improves the adhesive strength of the metal film with respect to a resin molding can be acquired highly.

A molded circuit board according to a fourth aspect of the present invention is characterized in that a circuit is formed by a metal film formed on the surface of the resin molded body according to any one of the first to third aspects. is there.

  According to this invention, a circuit with high adhesion reliability can be formed by the metal film formed on the surface of the resin molded body with high adhesion strength.

  According to the present invention, nitrogen having high chemical reactivity with a metal can be introduced into the surface of a resin molded body molded with an epoxy resin, and the adhesion strength of the metal film to the resin molded body can be increased. In addition, a molded circuit board having a circuit with high adhesion reliability can be obtained.

  Hereinafter, the best mode for carrying out the present invention will be described.

  In the present invention, the epoxy resin is not particularly limited, but is preferably a bisphenol type epoxy resin or a cycloaliphatic epoxy resin. Examples of the former bisphenol type epoxy resin include bisphenol A type liquid epoxy resin, bisphenol A type solid epoxy resin, bisphenol AD type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy resin. Examples of the latter cycloaliphatic epoxy resins include epoxidized dicyclopentadiene type phenol resins (see Chemical Formula 1). Among these, epoxidized products of bisphenol A type epoxy resins and dicyclopentadiene type phenol resins are preferable, and glycidylamine type epoxy resins (including the structure of Chemical Formula 2) are preferable. These are preferable from the viewpoints of higher adhesion to a metal film than other epoxy resins, and further improving moisture resistance and heat resistance.

  And in this invention, what has a nitrogen functional group is used as a hardening | curing agent which hardens this epoxy resin. As the curing agent having a nitrogen functional group, those having a phenol skeleton and a triazine skeleton are preferable, and such a compound is not particularly limited, but a condensation reaction between a triazine compound, a phenol and an aldehyde. It can be used as a mixture of various compounds.

  The phenols used here are not particularly limited, and various known phenols can be used alone or in combination of two or more, but they can react with an amino group-containing triazine compound. Since it is excellent in property, it is preferable to use phenol. The aldehydes are not particularly limited, but it is preferable to use formaldehyde.

  Further, the triazine compound is not particularly limited as long as it contains a triazine ring, but a compound represented by the following general formula (3) or isocyanuric acid is preferable, and these are used alone or 2 More than one species can be used in combination.

(In the general formula (1), R ₁ , R ₂ and R ₃ are amino groups, alkyl groups, phenyl groups, hydroxyl groups, hydroxylalkyl groups, ether groups, ester groups, acid groups, unsaturated groups, cyano groups. Any one)
Of the compounds obtained by condensation reaction of triazine compounds, phenols and aldehydes, aminotriazine novolac phenol resins represented by the following chemical formula (4) are preferably used as curing agents. By using an aminotriazine novolak phenol resin as the curing agent, it is possible to obtain a higher effect of improving the adhesion to the metal film than when other curing agents are used.

  The curing agent preferably has a hydroxyl equivalent in the range of 120 to 160. When the hydroxyl group equivalent is less than 120, the content of the nitrogen functional group in the curing agent decreases, and it is difficult to greatly improve the adhesion of the metal film. On the other hand, when the hydroxyl equivalent exceeds 160, the curing performance of the curing agent is lowered, and there may be a problem in mechanical properties such as strength of the resin molded body obtained by curing the epoxy resin.

  An epoxy resin composition can be prepared by blending this curing agent with the above epoxy resin. The amount of the curing agent is not particularly limited as long as it is an amount capable of completely curing the epoxy resin, but the number of epoxy groups contained in one molecule of the epoxy resin to be used and the curing agent are not limited. It is preferable to set the amount of active hydrogen in the amount to be around the equivalent.

  When using said compound as a hardening | curing agent, a hardening accelerator can be mix | blended suitably. As the curing accelerator, known ones can be used and are not particularly limited. Examples thereof include phosphorus compounds, tertiary amines, imidazoles, organic acid metal salts, Lewis acids, amine complex salts, and the like. These can be used not only independently but also in combination.

  An inorganic filler can also be further mix | blended with an epoxy resin composition. By blending an inorganic filler, the mechanical strength and hardness of the resin molded body can be increased, and the linear expansion coefficient and water absorption can be reduced. The blending amount is not particularly limited, but the range of 70 to 95% by mass in the composition is preferable from the viewpoint of the linear expansion coefficient. Examples of such inorganic fillers include, but are not limited to, fused silica, crystalline silica, alumina, glass beads, glass flakes, glass fibers, talc, and mica.

  In addition to the above components, various additives such as a colorant, a flame retardant, a release agent, and a coupling agent can be appropriately blended in the epoxy resin composition as necessary.

  Then, by molding the epoxy resin composition by an arbitrary molding method and curing the epoxy resin, the electrically insulating resin molded body according to the present invention can be obtained.

In forming the metal film on the surface of the resin molded body, prior to the formation of the metal film, the surface of the resin molded body is subjected to plasma treatment to chemically activate the surface of the resin molded body. The plasma processing can be performed using a plasma processing apparatus in which a pair of electrodes are arranged opposite to each other in the chamber, a high frequency power source is connected to one electrode, and the other electrode is grounded. And after setting a resin molding on one electrode between electrodes and evacuating the inside of a chamber and depressurizing to about 10 ^<-4> Pa, while introducing and distribute | circulating the active gas for plasma generation in a chamber, The gas pressure in the chamber is controlled to 8 to 15 Pa, and then a high frequency voltage (RF: 13.56 MHz) is applied between the electrodes by a high frequency power source for about 10 to 100 seconds. At this time, the active gas in the chamber is excited by the gas discharge phenomenon due to the high-frequency glow discharge between the electrodes, plasma such as cations and radicals is generated, and cations and radicals are formed in the chamber. The surface of the resin molded body can be activated by collision of ions and radicals with the surface of the resin molded body, and the adhesion between the resin molded body and the metal film coated on the surface is improved. Is something that can be done.

  Here, in the present invention, it is preferable to use nitrogen as an active gas for plasma generation and perform plasma treatment in a nitrogen atmosphere. By performing the nitrogen plasma treatment in this manner, the nitrogen content on the surface of the resin molded body can be increased, and the adhesion of the metal film can be improved.

  In addition, prior to the plasma treatment of the surface of the resin molded body as described above, it is preferable that the surface of the resin molded body is subjected to a nitriding treatment as a pretreatment. The nitriding treatment can be performed by holding the resin molded body in a pressurized nitrogen gas atmosphere for a predetermined time. The conditions for the nitriding treatment are not particularly limited, but it is desirable to perform the nitriding treatment by holding the resin molded body in a nitrogen gas atmosphere of 0.3 to 0.7 MPa for 0.5 to 3 hours. By nitriding the resin molded body in this way, the nitrogen content on the surface of the resin molded body can be increased, and the adhesion of the metal film can be improved.

  After the resin molded body is plasma-treated as described above, a metal film is formed on the surface of the resin molded body by a dry plating method (physical vapor deposition method: PVD method) selected from sputtering, vacuum deposition, ion plating, and the like. . Here, after the molded body is plasma-treated in the chamber as described above, it is preferable to perform sputtering, vacuum deposition, ion plating and the like in a continuous process without opening the inside of the chamber to the atmosphere. As a metal forming the metal film, a simple substance such as copper, nickel, gold, aluminum, titanium, molybdenum, chromium, tungsten, tin, lead, brass, nichrome, or an alloy can be used. Among these, it is preferable to use copper (Cu), nickel (Ni), chromium (Cr), titanium (Ti), or an alloy containing these because of high adhesion to the resin molded body.

As sputtering, for example, a DC sputtering method can be applied. That is, after first placing the molded body in the chamber, vacuuming is performed by a vacuum pump until the pressure in the chamber becomes 10 ⁻⁴ Pa or less, and in this state, an inert gas such as argon is 0.1 Pa in the chamber. Introduce gas pressure. Furthermore, by applying a DC voltage of 500 V, the copper target can be bombarded, and a metal film such as copper having a film thickness of about 200 to 500 nm can be formed on the surface of the molded body.

Further, as the vacuum deposition, for example, an electron beam heating vacuum deposition method can be applied. That is, first, vacuuming is performed by a vacuum pump until the pressure in the chamber becomes 10 ⁻⁴ Pa or less, and then an electron current of 400 to 800 mA is generated, and this electron current is collided with the vapor deposition material in the crucible and heated. Then, the vapor deposition material evaporates, and a metal film such as copper having a thickness of about 200 nm can be formed on the surface of the molded body.

Furthermore, when forming a metal film by ion plating, for example, vacuuming is first performed until the pressure in the chamber becomes 10 ⁻⁴ Pa or less, and the vapor deposition material is evaporated under the above-described vacuum vapor deposition conditions, and a molded body An inert gas such as argon is introduced into an induction antenna provided between the crucibles, plasma is generated with a gas pressure of 0.05 to 0.1 Pa, and a high frequency of 13.56 MHz is applied to the induction antenna. And a metal film such as copper having a thickness of about 200 to 500 nm is applied to the surface of the molded body by applying a high frequency so that a desired bias voltage is applied to the electrode on which the molded body is mounted. It can be formed.

  In forming the metal film on the surface of the resin molded body by the dry plating method as described above, the resin molded body is made of an epoxy resin cured with a curing agent containing nitrogen, and the metal film is formed with a metal. Nitrogen having high chemical reactivity can be introduced into the surface of the resin molded body, and the adhesion strength of the metal film to the resin molded body can be increased. The surface of the resin molded body is chemically activated by the plasma treatment as described above, and the adhesion of the metal film to the surface of the molded body can be increased.

  In particular, by performing the plasma treatment by nitrogen plasma treatment as described above, the nitrogen content on the surface of the resin molded body can be increased, and the adhesion of the metal film can be further improved. is there. Further, as a pretreatment of the plasma treatment, the nitrogen content of the surface of the resin molded body can be further increased by nitriding the resin molded body, and the adhesion of the metal film can be further improved. Is.

  A molded circuit board can be produced using the resin molded body on which the metal film is formed as described above. That is, by forming a metal film such as copper with a thickness of about 200 to 500 nm on the surface of the resin molded body as described above, and forming a circuit pattern with this metal film, it can be finished as a molded circuit board. Is. Here, a resin molded body is formed so as to have a three-dimensional solid surface, and a metal film is formed on the solid surface, and then a circuit pattern is formed, whereby a solid circuit board such as MID can be finished. The circuit pattern can be formed by a laser method, for example. That is, the metal film is irradiated with laser light along the boundary between the circuit formation portion and the circuit non-formation portion, and the metal film at the boundary portion is removed, whereby the metal film at the circuit formation portion is used as a circuit pattern. Separate from other parts. Next, a current is applied to the metal film in the circuit forming portion, and electrolytic plating such as copper is applied to thicken the conductive film to form a conductive layer having a thickness of about 5 to 20 μm. Next, a soft etching process is performed to remove the metal film remaining on the circuit non-formation portion, and the circuit formation portion subjected to electrolytic plating is left to obtain a molded circuit board on which a circuit having a desired pattern shape is formed. It is something that can be done. On the surface of this circuit, a conductive layer such as nickel plating or gold plating may be further provided with a thickness of about several μm.

  Next, the present invention will be specifically described with reference to examples.

( Reference Example 1)
Epoxy product of dicyclopentadiene-phenol resin as an epoxy resin (“Epicron HP-7200” manufactured by Dainippon Ink & Chemicals, Inc., softening point 60 ° C., epoxy equivalent 255-260 g / eq), aminotriazine novolac resin (large) as a curing agent “Phenolite KA-7052-L2” manufactured by Nippon Ink Industries, Ltd., softening point 80 ° C., hydroxyl group equivalent 120 g / eq) was used. Then, in order to lower the viscosity of the epoxidized product of dicyclopentadiene-phenol resin and aminotriazine novolak resin, each was heated to 100 ° C. and weighed to a weight ratio of epoxy resin: curing agent = 100: 46, An epoxy resin composition was obtained by sufficiently uniformly stirring and mixing with a mixer.

Next, a flat mold (cavity dimensions 30 mm × 60 mm × 2 mm) preheated to 150 ° C. is subjected to a plunger pressure of 7.8 MPa (80 kgf / cm ² ) and a molding time of 180 seconds by a transfer molding machine. An epoxy resin composition was injected and molded, and then after-curing at 150 ° C. for 8 hours, a resin molded body was obtained.

Next, the surface of the resin molding was subjected to plasma treatment, and a metal film was formed using a DC magnetron sputtering apparatus. That is, the molded body is first set in the chamber of the plasma processing apparatus, the inside of the chamber is evacuated and depressurized to about 10 ⁻⁴ Pa, and then N ₂ is introduced into the chamber as an active gas and circulated. The internal gas pressure was controlled to 10 Pa, and then a plasma treatment was performed in a nitrogen atmosphere by applying a high frequency voltage (RF: 13.56 MHz) with a power of 350 W between the electrodes for 30 seconds. Further, the chamber is evacuated until the pressure in the chamber becomes 10 ⁻⁴ Pa or less, and after introducing argon gas into the chamber so as to have a gas pressure of 0.1 Pa in this state, a DC voltage of 500 V is further applied. Thus, the copper target was bombarded and sputtered to form a 300 nm thick copper metal film on the surface of the resin molded body.

  Then, laser processing is performed by irradiating the metal film with a laser along the boundary between the circuit forming portion and the circuit non-forming portion, and the metal film of the circuit forming portion is subjected to copper electroplating to increase the thickness, and soft etching is performed. By removing the metal film remaining in the non-circuit-formed portion after processing, a peel strength evaluation circuit having a width of 5 mm and a thickness of 15 μm was formed.

( Reference Example 2)
In Reference Example 1, when the surface of the resin molded body was subjected to plasma treatment, oxygen plasma treatment was performed using O ₂ instead of N ₂ as an active gas. Others were the same as in Reference Example 1.

( Reference Example 3)
In Reference Example 1, when performing plasma treatment on the surface of the resin molded body, argon plasma treatment was performed using Ar gas instead of N ₂ as the active gas. Others were the same as in Reference Example 1.

(Example 1 )
In the same manner as in Reference Example 1, an epoxy resin composition was prepared, and a resin molded body was molded. Then, this resin molded body is put in a pressure vessel and sealed, and nitrogen gas is sealed in the pressure vessel and the internal pressure is increased to 0.49 MPa (5 kg / cm ² ) and held for 1 hour to nitride the resin molded body. Processed. Then, the pressure vessel was opened and the resin molded body was taken out. Thereafter, in the same manner as in Reference Example 1, the resin molded body was subjected to plasma treatment, a metal film was further formed, and a peel strength evaluation circuit was formed.

( Reference Example 4 )
In Reference Example 1, when forming the metal film on the surface of the resin molded body, first, Ni sputtering with a film thickness of 100 nm was performed, and then Cu sputtering with a film thickness of 200 nm was performed. Others were the same as in Reference Example 1.

( Reference Example 5 )
A bisphenol A type epoxy resin (“Epiclon 850S” manufactured by Dainippon Ink Industries, Ltd., epoxy equivalent 190 g / eq) was used as an epoxy resin, and the same aminotriazine novolak resin as in Reference Example 1 was used as a curing agent. The bisphenol A type epoxy resin was heated to 80 ° C. and the aminotriazine novolak resin was heated to 100 ° C. to reduce the viscosity, and weighed to a weight ratio of epoxy resin: curing agent = 100: 63, and then thoroughly mixed with a mixer. By uniformly stirring and mixing, an epoxy resin composition was obtained.

After, by molding the same epoxy resin composition as in Reference Example 1 to prepare a resin molded product, also after the plasma treatment in the same manner as in Reference Example 1, a metal film is formed, further peel strength evaluation circuit Formed.

( Reference Example 6 )
The same epoxidized dicyclopentadiene-phenol resin as in Reference Example 1 is used as the epoxy resin, and aminotriazine novolak resin (“Phenolite LA-7571” manufactured by Dainippon Ink Industries, Ltd., hydroxyl group equivalent 135 g / eq) is used as the curing agent. It was. Then, in order to lower the viscosity of the epoxidized product of dicyclopentadiene-phenol resin and aminotriazine novolak resin, each was heated to 100 ° C., and weighed to a weight ratio of epoxy resin: curing agent = 100: 52, An epoxy resin composition was obtained by sufficiently uniformly stirring and mixing with a mixer.

After, by molding the same epoxy resin composition as in Reference Example 1 to prepare a resin molded product, also after the plasma treatment in the same manner as in Reference Example 1, a metal film is formed, further peel strength evaluation circuit Formed.

( Reference Example 7 )
The same epoxidized dicyclopentadiene-phenol resin as in Reference Example 1 is used as the epoxy resin, and aminotriazine novolak resin (“Phenolite EXB-9808” manufactured by Dainippon Ink & Chemicals, hydroxyl equivalent: 151 g / eq) is used as the curing agent. It was. Then, in order to reduce the viscosity of the epoxidized dicyclopentadiene-phenol resin and the aminotriazine novolak resin, each was heated to 100 ° C., and weighed to a weight ratio of epoxy resin: curing agent = 100: 58, An epoxy resin composition was obtained by sufficiently uniformly stirring and mixing with a mixer.

After, by molding the same epoxy resin composition as in Reference Example 1 to prepare a resin molded product, also after the plasma treatment in the same manner as in Reference Example 1, a metal film is formed, further peel strength evaluation circuit Formed.

( Reference Example 8 )
Glycidylamine-type tetraglycidyldiaminodiphenylmethane (“Araldite MY720” manufactured by Ciba-Geigy) was used as the epoxy resin, and diaminodiphenylsulfone (“Hardner HY906” manufactured by Ciba-Geigy) was used as the curing agent. Then, in order to reduce the viscosity of tetraglycidyl diaminodiphenylmethane and diaminodiphenyl sulfone, each was heated to 80 ° C. and weighed to a weight ratio of epoxy resin: curing agent = 100: 120, and then thoroughly homogenized by a mixer. An epoxy resin composition was obtained by stirring and mixing.

Next, the epoxy resin composition was poured into a flat plate mold (cavity dimensions 30 mm × 60 mm × 2 mm) with a transfer molding machine under a plunger pressure of 7.8 MPa (80 kgf / cm ² ) and a molding time of 180 seconds. The resin molded body was obtained by curing at 120 ° C. for 1.5 hours and at 180 ° C. for 4 hours.

(Comparative Example 1)
Epoxy product of dicyclopentadiene-phenol resin same as Reference Example 1 as epoxy resin, phenol novolak resin as a curing agent (“Phenolite TD2131” manufactured by Dainippon Ink & Chemicals, softening point 80 ° C., hydroxyl group equivalent 103 g / eq) Was used. Then, in order to lower the viscosity of the epoxidized dicyclopentadiene-phenol resin and the phenol novolac resin, each was heated to 100 ° C. and weighed to a weight ratio of epoxy resin: curing agent = 100: 40, and then a mixer By stirring and mixing sufficiently uniformly, an epoxy resin composition was obtained.

After, by molding the same epoxy resin composition as in Reference Example 1 to prepare a resin molded product, also after the plasma treatment in the same manner as in Reference Example 1, a metal film is formed, further peel strength evaluation circuit Formed.

(Comparative Example 2)
The same bisphenol A type epoxy resin as in Reference Example 5 was used as the epoxy resin, and the same phenol volac resin as in Comparative Example 1 was used as the curing agent. Then, the bisphenol A type epoxy resin is heated to 80 ° C. and the phenol borak resin is heated to 100 ° C. to lower the viscosity, and weighed to a weight ratio of epoxy resin: curing agent = 100: 54. By uniformly stirring and mixing, an epoxy resin composition was obtained.

After, by molding the same epoxy resin composition as in Reference Example 1 to prepare a resin molded product, also after the plasma treatment in the same manner as in Reference Example 1, a metal film is formed, further peel strength evaluation circuit Formed.

(Comparative Example 3)
In Reference Example 1, a metal film was formed on the surface of the resin molded body without subjecting the surface of the resin molded body to plasma treatment. Others were the same as in Reference Example 1.

About the peel strength evaluation circuit formed in the above Reference Examples 1 to 8, Example 1 and Comparative Examples 1 to 3, the peel strength per unit width (90) using a universal testing machine (“EGTest” manufactured by Shimadzu Corporation) Degree peel strength). The results are shown in Table 1.

As seen in the comparison between each reference example and the examples and the comparative examples, it is confirmed that the peel strength of the circuit by the metal film is improved by using the compound having a nitrogen functional group as the curing agent. Further, it is confirmed from the comparison between Reference Example 1 and Reference Examples 2 and 3 that the peel strength is improved by performing the nitrogen plasma treatment. Further, as seen in Example 1 , it is confirmed that the peel strength is further improved by nitriding.

Claims (4)

A resin molded body in which a metal film is formed by dry plating on the surface activated by plasma treatment, and obtained by molding and curing an epoxy resin composition containing a curing agent having a nitrogen functional group Ah is, the resin molded body, wherein the plasma treatment is intended to be performed in a nitrogen atmosphere to a surface nitriding treatment is. The resin molding according to claim 1, wherein the curing agent having a nitrogen functional group is an aminotriazine novolac resin. 3. The resin molding according to claim 1, wherein the main component of the epoxy resin composition is selected from epoxidized dicyclopentadiene-phenol resin, bisphenol A type epoxy resin, and glycidylamine type epoxy resin. body. A molded circuit board, wherein a circuit is formed by a metal film formed on the surface of the resin molded body according to any one of claims 1 to 3 .