JP4656979B2 - Precision cleaning method - Google Patents
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本発明は、精密洗浄方法に関する。 The present invention relates to a precision cleaning method.
ＩＣチップ等の半導体は、通常半導体搬送容器に格納され、メーカーからユーザーへ送られている。そして、多くの場合、使用された半導体搬送容器は、回収されて、精密洗浄された後、再利用されている。 A semiconductor such as an IC chip is usually stored in a semiconductor transfer container and sent from a manufacturer to a user. In many cases, the used semiconductor transfer container is collected, precision cleaned, and reused.
ところで、半導体搬送容器を回収する際、回収をより容易に進めるため、半導体搬送容器を数個纏めてテープでとめたりすることがよくある。また、前記半導体搬送容器に格納されている半導体を識別するためのラベルが貼られていることもよくある。 By the way, when collecting the semiconductor transfer container, in order to facilitate the recovery, it is often the case that several semiconductor transfer containers are collected and taped together. In addition, a label for identifying a semiconductor stored in the semiconductor transport container is often attached.
このような場合には、回収された半導体搬送容器から、このようなテープやラベルをはがした後に精密洗浄が行われるが、テープやラベルをはがした後には、該テープやラベル由来の粘着物が付着していることが多かった。このようなテープやラベル等に由来する粘着物が付着したままの半導体搬送容器を再利用すると、半導体のリード曲がりが生じる、半導体搬送容器に半導体が付着して該半導体搬送容器から半導体を取り出すことが出来ず、半導体組立ラインが停止してしまう等のトラブルが起こるため、粘着物が付着していない半導体搬送容器を再利用することが必要であった。 In such a case, the tape or label is removed from the collected semiconductor transport container and then precision cleaning is performed. After the tape or label is peeled off, the adhesive derived from the tape or label is used. Many things were attached. Reusing a semiconductor transport container with adhesives derived from such tapes and labels, etc. causes lead bending of the semiconductor, and the semiconductor adheres to the semiconductor transport container and the semiconductor is removed from the semiconductor transport container. Therefore, troubles such as the semiconductor assembly line being stopped occur, and thus it is necessary to reuse the semiconductor transfer container to which no adhesive is attached.
粘着物が付着した半導体搬送容器を精密洗浄して、該粘着物を除去する方法としては、該粘着物を溶解可溶な有機溶媒を洗浄溶媒として精密洗浄する方法があるが、粘着物の種類によって、溶解可能な有機溶媒の種類が異なるため、粘着物の種類に応じて洗浄溶媒を予め選定し、切り替える必要があり、また、排出される洗浄廃液の処理等の環境面でも問題があった。 As a method of precisely cleaning the semiconductor transfer container to which the adhesive is adhered and removing the adhesive, there is a method of precision cleaning using a soluble organic solvent that dissolves the adhesive as a cleaning solvent. Depending on the type of organic solvent that can be dissolved, it is necessary to select and switch the cleaning solvent according to the type of adhesive, and there is also a problem in terms of the environment such as the treatment of the discharged cleaning waste liquid. .
一方、より環境にやさしい精密洗浄方法として、水を洗浄溶媒として用いる方法が知られているが、前記粘着物は水には溶解しにくいことから、粘着物が付着した半導体搬送容器を水で精密洗浄すると、粘着物が除去されないという問題があった。そのため、精密洗浄前に、粘着物が付着した半導体搬送容器と付着していない半導体搬送容器とを分離する必要があるが、特に、このようなテープやラベル由来の粘着物が微量な場合には、その有無自体を目視で判別することが困難な場合が多く、半導体搬送容器に粘着物が付着しているか否かを、容易に判別して、粘着物が付着していない半導体搬送容器のみを水で精密洗浄する方法の開発が望まれていた。 On the other hand, as an environmentally friendly precision cleaning method, a method using water as a cleaning solvent is known. However, since the adhesive is difficult to dissolve in water, the semiconductor transfer container to which the adhesive is attached is precisely When washed, there was a problem that the sticky material was not removed. Therefore, before precise cleaning, it is necessary to separate the semiconductor transport container to which the adherent has adhered from the semiconductor transport container to which the adherent has not adhered. In many cases, it is difficult to visually determine the presence / absence of the semiconductor itself, and it is easy to determine whether or not an adhesive is attached to the semiconductor transport container. Development of a method for precision cleaning with water has been desired.
このような状況のもと、本発明者らは、半導体搬送容器に粘着物が付着しているか否かを、容易に判別して、粘着物が付着していない半導体搬送容器のみを水で精密洗浄する方法を開発すべく検討したところ、粘着物の有無を確認するために、水溶性粉粒体を半導体搬送容器に接触させることにより、粘着物が付着しているところに、水溶性粉粒体が付着し、粘着物の有無がより容易に判別でき、粘着物が付着している半導体搬送容器と粘着物が付着していない半導体搬送容器とを容易に分別し、粘着物が付着していない半導体搬送容器のみを水で精密洗浄できることを見出し、本発明に至った。 Under such circumstances, the present inventors can easily determine whether or not an adhesive is attached to the semiconductor transport container, and use only water to clean only the semiconductor transport container to which no adhesive is attached. When we studied to develop a cleaning method, in order to confirm the presence or absence of sticky substances, water-soluble powder granules were found where the sticky substances were attached by contacting the water-soluble powder granules with the semiconductor transport container. The body adheres and the presence or absence of the sticky substance can be more easily discriminated. The semiconductor transport container to which the sticky substance is attached is easily separated from the semiconductor transport container to which the sticky substance is not attached. The present inventors have found that only a semiconductor transfer container that is not present can be precisely cleaned with water, and have reached the present invention.
すなわち、本発明は、半導体搬送容器を水で精密洗浄する方法において、
（１）前記半導体搬送容器と、水溶性粉粒体とを接触させる工程、
（２）付着しなかった水溶性粉粒体を、前記半導体搬送容器から除去する工程、
（３）水溶性粉粒体が付着した半導体搬送容器を検出する工程、
（４）水溶性粉粒体が付着していない半導体搬送容器と水溶性粉粒体が付着した半導体搬送容器とを分離する工程、
（５）水溶性粉粒体が付着していない半導体搬送容器を水で精密洗浄する工程、
を含むことを特徴とする精密洗浄方法および精密洗浄装置等を提供するものである。
That is, the present invention provides a method for precisely washing a semiconductor transport container with water,
(1) The step of bringing the semiconductor transport container into contact with the water-soluble powder,
(2) removing the water-soluble powder particles that have not adhered from the semiconductor transport container;
(3) a step of detecting the semiconductor transport container to which the water-soluble powder particles are attached;
(4) a step of separating the semiconductor transport container to which the water-soluble powder particles are not attached and the semiconductor transport container to which the water-soluble powder particles are attached;
(5) A step of precisely washing a semiconductor transport container to which no water-soluble powder is adhered with water,
A precision cleaning method, a precision cleaning device, and the like are provided.
本発明によれば、粘着物が微量であっても、半導体搬送容器に粘着物が付着しているか否かを、容易に判別することができるため、粘着物が付着したままの半導体搬送容器を精密洗浄することを避けることができる。しかも、粘着物の検出に、水溶性粉粒体を用いているため、精密洗浄後の半導体容器に、水溶性粉粒体が残存することなく、精密洗浄後の半導体搬送容器の清浄性も保持できる。 According to the present invention, it is possible to easily determine whether or not the adhesive is attached to the semiconductor transport container even if the amount of the adhesive is very small. Precision cleaning can be avoided. In addition, because water-soluble granular materials are used to detect adhesives, the water-soluble granular materials do not remain in the semiconductor container after precision cleaning, and the cleanliness of the semiconductor transport container after precision cleaning is maintained. it can.
本発明の精密洗浄方法は、半導体搬送容器を水で精密洗浄する方法において、（１）前記半導体搬送容器と、水溶性粉粒体とを接触させる工程（以下、工程（１）と略記する。）、（２）付着しなかった水溶性粉粒体を、前記半導体搬送容器の面上から除去する工程（以下、工程（２）と略記する。）、（３）水溶性粉粒体が付着した半導体搬送容器を検出する工程（以下、工程（３）と略記する。）、（４）水溶性粉粒体が付着していない半導体搬送容器と水溶性粉粒体が付着した半導体搬送容器とを分離する工程（以下、工程（４）と略記する。）、（５）水溶性粉粒体が付着していない半導体搬送容器を水で精密洗浄する工程（以下、工程（５）と略記する。）を含むことを特徴とする精密洗浄方法であり、以下、工程ごとに、図１に示した概略フロー図を参照しながら説明する。 The precision cleaning method of the present invention is a method of precisely cleaning a semiconductor transport container with water, and is abbreviated as (1) a step of bringing the semiconductor transport container into contact with a water-soluble powder (hereinafter referred to as step (1)). ), (2) Step of removing the water-soluble powder particles that have not adhered from the surface of the semiconductor transport container (hereinafter abbreviated as step (2)), (3) Water-soluble powder particles are adhered (4) a semiconductor transport container to which water-soluble powder particles are not attached and a semiconductor transport container to which water-soluble powder particles are attached; (5) A step of precisely washing a semiconductor transfer container to which no water-soluble powder particles are adhered (hereinafter abbreviated as step (5)). )), And includes the steps shown in FIG. It is described with reference to the schematic flow diagram.
まず、工程（１）は、前記のとおり、洗浄対象の半導体搬送容器と、水溶性粉粒体とを接触させる工程である（図１ Ｓ１）。予め粘着物が付着している部位が特定可能な場合は、当該部位と水溶性粉粒体とを接触させればよく、また、粘着物が付着している部位が特定できない場合には、洗浄対象の半導体搬送容器の全ての面と水溶性粉粒体とを接触させればよい。 First, as described above, the step (1) is a step of bringing the semiconductor transfer container to be cleaned into contact with the water-soluble powder (S1 in FIG. 1). If the part to which the adhesive is attached can be identified in advance, the part and the water-soluble powder should be brought into contact with each other. If the part to which the adhesive is attached cannot be identified, washing is performed. What is necessary is just to make all the surfaces of the object semiconductor conveyance container and water-soluble granular material contact.
水溶性粉粒体としては、水に可溶な粉粒体であれば特に制限されないが、精密洗浄後の排水の処理が容易という点で、例えば砂糖、グラニュー糖、ブドウ糖、カルボキシメチルセルロース、アセチル化澱粉等の多糖類、例えば酢酸ビニル重合体、ポリビニルアルコール等の水溶性高分子、例えば食塩、炭酸ナトリウム、炭酸水素ナトリウム、塩化カリウム、硫酸ナトリウム等のアルカリ金属塩、例えば塩化カルシウム、塩化マグネシウム等のアルカリ土類金属塩等が挙げられ、多糖類、アルカリ金属塩またはアルカリ土類金属塩が好ましく、なかでも砂糖、グラニュー糖、ブドウ糖、食塩、炭酸ナトリウム、塩化カリウム、硫酸ナトリウムがより好ましい。かかる水溶性粉粒体を用いることにより、例えば半導体搬送容器に水溶性粉粒体が残存した場合であっても、後述する工程（５）において、水により水溶性粉粒体は溶解され、除去されるので、かかる水溶性粉粒体が精密洗浄後の半導体搬送容器上に残存することはなく、精密洗浄後の半導体搬送容器の清浄性を保持することができる。 The water-soluble granular material is not particularly limited as long as it is soluble in water, but it is easy to treat the waste water after precision washing, for example, sugar, granulated sugar, glucose, carboxymethylcellulose, acetylated. Polysaccharides such as starch, water-soluble polymers such as vinyl acetate polymer and polyvinyl alcohol, alkali metal salts such as sodium chloride, sodium carbonate, sodium bicarbonate, potassium chloride and sodium sulfate, such as calcium chloride and magnesium chloride Examples include alkaline earth metal salts, and polysaccharides, alkali metal salts, or alkaline earth metal salts are preferable, and sugar, granulated sugar, glucose, sodium chloride, sodium carbonate, potassium chloride, and sodium sulfate are more preferable. By using such a water-soluble granular material, for example, even when the water-soluble granular material remains in the semiconductor transport container, the water-soluble granular material is dissolved and removed by water in the step (5) described later. Therefore, such water-soluble powder particles do not remain on the semiconductor transport container after precision cleaning, and the cleanliness of the semiconductor transport container after precision cleaning can be maintained.
かかる水溶性粉粒体は着色されていてもよい。 Such water-soluble powder particles may be colored.
半導体搬送容器と水溶性粉粒体とを接触させる方法としては、例えば半導体搬送容器に水溶性粉粒体をふりかける方法、水溶性粉粒体が充填されたトレイ内に半導体搬送容器を埋める方法、半導体搬送容器に、水溶性粉粒体を含む気流を吹きかける方法等が挙げられる。半導体搬送容器と水溶性粉粒体との接触時間は特に制限されない。 Examples of the method for bringing the semiconductor transport container and the water-soluble powder into contact with each other include, for example, a method of sprinkling the water-soluble powder on the semiconductor transport container, a method of filling the semiconductor transport container in the tray filled with the water-soluble powder, The method etc. which spray the airflow containing a water-soluble granular material on a semiconductor conveyance container are mentioned. The contact time between the semiconductor transport container and the water-soluble powder is not particularly limited.
かかる工程（１）により、半導体搬送容器の粘着物が付着した部位は、水溶性粉粒体が付着した状態に、一方、半導体搬送容器の粘着物が付着していない部位は、単に水溶性粉粒体が載った状態になる。 By this step (1), the part of the semiconductor transport container to which the adhesive is attached is in a state where the water-soluble powder is attached, while the part of the semiconductor transport container to which the adhesive is not attached is simply a water-soluble powder. It will be in the state where a granular object was put.
半導体搬送容器と水溶性粉粒体とを接触させる操作が終了すれば、次工程（２）に進む。 If operation which makes a semiconductor conveyance container and a water-soluble powder granular material contact is complete | finished, it will progress to the following process (2).
工程（２）は、付着しなかった水溶性粉粒体を、前記半導体搬送容器から除去する工程であり（図１ Ｓ２）、半導体搬送容器の粘着物が付着していない部位は、単に水溶性粉粒体が載った状態であり、かかる操作により、半導体搬送容器から除去され、一方、半導体搬送容器の粘着物が付着した部位は、水溶性粉粒体が付着した状態のままである。 Step (2) is a step of removing the water-soluble powder particles that have not adhered from the semiconductor transport container (S2 in FIG. 1). The part of the semiconductor transport container to which the adhesive is not attached is simply water-soluble. This is a state in which the granular material is placed, and is removed from the semiconductor transport container by such an operation. On the other hand, the portion of the semiconductor transport container to which the adhesive is attached remains in the state in which the water-soluble powder is attached.
付着しなかった水溶性粉粒体を除去する方法としては、例えば水溶性粉粒体と接触させた半導体搬送容器を所定角度に傾ける方法、水溶性粉粒体と接触させた半導体搬送容器を回転させる方法、水溶性粉粒体と接触させた半導体搬送容器を所定時間振動させる方法、水溶性粉粒体と接触させた半導体搬送容器に空気等の気体を吹きかける方法、水溶性粉粒体と接触させた半導体搬送容器上を箒状の除去手段により掃く方法等が挙げられる。 As a method for removing the water-soluble powder particles that have not adhered, for example, a method of inclining a semiconductor transport container brought into contact with the water-soluble powder granules at a predetermined angle, or rotating a semiconductor transport container brought into contact with the water-soluble powder granules A method of vibrating the semiconductor transport container in contact with the water-soluble powder for a predetermined time, a method of spraying a gas such as air on the semiconductor transport container in contact with the water-soluble powder, and contact with the water-soluble powder For example, a method of sweeping the top of the transferred semiconductor transport container with a bowl-shaped removing means.
半導体搬送容器から、付着しなかった水溶性粉粒体を除去し終われば、次工程（３）に進む。 Once the water-soluble powder particles that have not adhered are removed from the semiconductor transport container, the process proceeds to the next step (3).
工程（３）は、水溶性粉粒体が付着した半導体搬送容器を検出する工程である（図１ Ｓ３）。前工程（２）で、半導体搬送容器に付着しなかった水溶性粉粒体が除去され、粘着物が付着した部位には、水溶性粉粒体が付着しており、本工程（３）において、後者の付着した水溶性粉粒体がある半導体搬送容器が検出される。 Step (3) is a step of detecting the semiconductor transport container to which the water-soluble powder particles are attached (S3 in FIG. 1). In the previous step (2), the water-soluble granular material that did not adhere to the semiconductor transport container was removed, and the water-soluble granular material adhered to the site where the adhesive was adhered. In this step (3) The semiconductor transport container with the latter adhering water-soluble powder particles is detected.
かかる検出方法としては、半導体搬送容器上に付着した水溶性粉粒体が検出可能であれば特に制限されず、例えば目視、マイクロスコープ観察、画像処理等が挙げられる。水溶性粉粒体が付着することにより、目視でも検出が容易になっているが、より検出を容易にするため、例えば半導体搬送容器に斜光を照射してもよい。 Such a detection method is not particularly limited as long as water-soluble powder particles adhering to the semiconductor transport container can be detected, and examples thereof include visual observation, microscope observation, and image processing. Although the water-soluble granular material adheres, the visual detection is easy. However, for easier detection, for example, the semiconductor transport container may be irradiated with oblique light.
工程（４）は、水溶性粉粒体が付着していない半導体搬送容器と水溶性粉粒体が付着した半導体搬送容器とを分離する工程であり（図１ Ｓ４）、前記工程（３）において付着した水溶性粉粒体が検出された半導体搬送容器と、検出されなかった、すなわち、水溶性粉粒体が付着していない半導体搬送容器とが分離される。水溶性粉粒体が付着していない半導体搬送容器と水溶性粉粒体が付着した半導体搬送容器とを分離する方法としては、例えば前記工程（３）で検出された半導体搬送容器をピックアップし、水溶性粉粒体の付着のない半導体搬送容器と分離する方法、水溶性粉粒体が付着していない半導体搬送容器をピックアップし、水溶性粉粒体が付着した半導体搬送容器と分離する方法等が挙げられる。水溶性粉粒体が付着していない半導体搬送容器は、次工程（５）に進む。 Step (4) is a step of separating the semiconductor transport container to which the water-soluble powder particles are not attached from the semiconductor transport container to which the water-soluble powder particles are attached (FIG. 1 S4). The semiconductor transport container in which the attached water-soluble powder is detected is separated from the semiconductor transport container in which the water-soluble powder is not detected, that is, the water-soluble powder is not attached. As a method of separating the semiconductor transport container to which the water-soluble powder particles are not attached and the semiconductor transport container to which the water-soluble powder particles are adhered, for example, the semiconductor transport container detected in the step (3) is picked up, A method of separating from a semiconductor transport container without water-soluble powder particles, a method of picking up a semiconductor transport container without water-soluble powder particles and separating from a semiconductor transport container with water-soluble powder particles attached, etc. Is mentioned. The semiconductor transport container to which the water-soluble powder particles are not attached proceeds to the next step (5).
工程（５）は、水溶性粉粒体が付着していない半導体搬送容器を水で精密洗浄する工程であり（図１ Ｓ５）、前記工程（４）において、水溶性粉粒体が付着していない半導体搬送容器が水で精密洗浄される。精密洗浄方法としては、特に制限されない。水溶性粉粒体を用いているため、精密洗浄後の半導体容器に、水溶性粉粒体が残存することなく、精密洗浄後の半導体搬送容器の清浄性も保持できる。本工程（５）は、通常クリーンルーム内で実施される。 Step (5) is a step of precisely washing a semiconductor transport container to which water-soluble powder particles are not attached with water (FIG. 1, S5). In step (4), water-soluble powder particles are attached. No semiconductor transport container is precision cleaned with water. The precision cleaning method is not particularly limited. Since the water-soluble powder is used, the cleanliness of the semiconductor transport container after the precision cleaning can be maintained without the water-soluble powder remaining in the semiconductor container after the precision cleaning. This process (5) is normally implemented in a clean room.
続いて、本発明の半導体搬送容器の精密洗浄装置について説明する。本発明の精密洗浄装置は、半導体搬送容器と、水溶性粉粒体とを接触させる接触手段と、付着しなかった水溶性粉粒体を、前記半導体搬送容器から除去する除去手段と、水溶性粉粒体が付着した半導体搬送容器を検出する検出手段と、水溶性粉粒体が付着していない半導体搬送容器と水溶性粉粒体が付着した半導体搬送容器とを分離する分離手段と、水溶性粉粒体が付着していない半導体搬送容器を水で精密洗浄する精密洗浄手段とを備えている。 Next, the precision cleaning device for a semiconductor transport container according to the present invention will be described. The precision cleaning apparatus of the present invention comprises a contact means for bringing a semiconductor transport container and a water-soluble powder into contact with each other, a removal means for removing the water-soluble powder that has not adhered from the semiconductor transport container, and a water-soluble powder. Detection means for detecting a semiconductor transport container to which powder particles are adhered, separation means for separating a semiconductor transport container to which water-soluble powder particles are not adhered and a semiconductor transport container to which water-soluble powder particles are adhered, And a precision cleaning means for precisely cleaning the semiconductor transport container to which the conductive powder particles are not adhered with water.
図２に、本発明の精密洗浄装置の一実施態様の概略図を示した。図２に示した精密洗浄装置１は、洗浄対象の半導体搬送容器２を載せて移送するローラーコンベア３と、水溶性粉粒体４を半導体搬送容器にふりかけるスクリューフィーダー５および５’と、半導体搬送容器を持ち上げて、該半導体搬送容器を反転させて、付着しなかった水溶性粉粒体を除去するためのアーム６および６’と、水溶性粉粒体を除去した後の半導体搬送容器を撮影するためのカメラ７および７’と、半導体搬送容器を反転させるためのアーム８と、該カメラ７および７’で得た画像をもとに、付着した水溶性粉体が有るか否かを確認し、水溶性粉粒体が付着した半導体搬送容器を検出する画像処理装置９と、該画像処理装置９で検出された水溶性粉体が付着した半導体搬送容器をローラーコンベア３上から、回収箱１０内へ移送するアーム１１と、超音波照射機能を有する洗浄槽１２とを備えている。
FIG. 2 shows a schematic view of one embodiment of the precision cleaning apparatus of the present invention. The precision cleaning apparatus 1 shown in FIG. 2 includes a
かかる精密洗浄装置１の動作について、説明する。まず、洗浄対象の半導体搬送容器２が、稼動中のローラーコンベア３上に載せられる。半導体搬送容器は、ローラーコンベア３により移送される。該半導体搬送容器が、スクリューフィーダー５の排出口の下部に来ると、スクリューフィーダー５から水溶性粉粒体４が供給され、半導体搬送容器２と水溶性粉粒体４とが接触する。余分な水溶性粉粒体はローラーコンベアの下部に設けられた水溶性粉粒体回収容器内に回収される。次に、アーム６が水溶性粉粒体と接触した半導体搬送容器を持ち上げて、持ち上げた半導体搬送容器を反転させる。半導体搬送容器が反転することにより、該半導体搬送容器から、付着しなかった水溶性粉粒体が落とされ、除去される。反転させられた半導体搬送容器が、ローラーコンベア３上に戻され、スクリューフィーダー５’の排出口の下部に来ると、スクリューフィーダー５’から水溶性粉粒体４が供給され、半導体搬送容器２と水溶性粉粒体４とが接触する。次に、アーム６’が水溶性粉粒体と接触した半導体搬送容器を持ち上げて、持ち上げた半導体搬送容器を再度反転させ、該半導体搬送容器から、付着しなかった水溶性粉粒体が落とされ、除去される。反転させられた半導体搬送容器が、ローラーコンベア３上に戻される。カメラ７で、半導体搬送容器が撮影され、次に、アーム８で、半導体搬送容器が反転させられ、カメラ７’で再度撮影される。得られた画像は、画像処理装置９で解析され、水溶性粉粒体の付着が検出された半導体搬送容器は、アーム１１により、ローラーコンベア３の横に設けられた回収箱１０内へ落とされる。水溶性粉粒体の付着が検出されなかった半導体搬送容器は、そのままローラーコンベア３により洗浄槽１２へ導かれ、洗浄槽１２で精密洗浄される。
The operation of the precision cleaning apparatus 1 will be described. First, the
以下、実施例により本発明をさらに詳細に説明するが、本発明はこの実施例に限定されない。 EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to this Example.
比較例１
黒色の半導体搬送容器２０枚（そのうちの２枚には、黒色の両面テープの微小片（直径約０．５ｍｍ程度）が貼り付けられている）を、目視検査した。しかしながら、目視検査では、両面テープが付着している半導体搬送容器を見つけることはできなかった。目視検査後の半導体搬送容器２０枚を、クリーンルーム（５μｍ以上のパーティクル数が１０００個／ｆｔ３以下）内で、純水（比抵抗値：１０ＭΩ・ｃｍ）で、精密洗浄（超音波照射下）し、温風乾燥した。温風乾燥後の半導体搬送容器２０枚のうちの１枚を用いて、下記測定条件でパーティクル数を測定したところ、２μｍ以上のパーティクル数は、１６０個であった。
Comparative Example 1
Twenty black semiconductor transfer containers (two of which are adhered with a small piece of black double-sided tape (about 0.5 mm in diameter) are visually inspected). However, by visual inspection, it was not possible to find a semiconductor transport container having a double-sided tape attached thereto. Twenty semiconductor transfer containers after visual inspection are precisely cleaned (under ultrasonic irradiation) with pure water (specific resistance: 10 MΩ · cm) in a clean room (number of particles of 5 μm or more is 1000 / ft 3 or less). And dried with warm air. When the number of particles was measured under the following measurement conditions using one of the 20 semiconductor transfer containers after hot air drying, the number of particles of 2 μm or more was 160.
温風乾燥後の半導体搬送容器２０枚の表面にグラニュー糖をふりかけ、次いで反転させて付着しなかったグラニュー糖を除去した。裏面についても同様の操作を行った後、グラニュー糖が付着した半導体搬送容器があるか否かを目視で確認したところ、２枚の半導体搬送容器にグラニュー糖が付着していることを見つけた。 Granulated sugar was sprinkled on the surface of 20 semiconductor transfer containers after drying with hot air, and then inverted to remove granulated sugar that did not adhere. After the same operation was performed on the back surface, it was visually confirmed whether or not there was a semiconductor transport container with granulated sugar attached, and it was found that granulated sugar had adhered to the two semiconductor transport containers.
この結果から、目視検査では、テープ等に由来する粘着物が付着しているか否かを判断することが難しく、そのまま水で精密洗浄すると、粘着物が除去されずに、付着したままの半導体搬送容器が回収されることが分かった。 From this result, in visual inspection, it is difficult to determine whether or not adhesives derived from tape or the like are attached, and when washed with water as it is, the adhesives are not removed and the semiconductor transport remains attached. It was found that the container was recovered.
＜測定条件＞
（ａ）パーティクルが付着していないポリエチレン製袋に、超純水（比抵抗値：１８ＭΩ・ｃｍ）１００ｍＬを入れて、ゆっくりと左右に５回まわした。２時間静置した後、該袋内の超純水１０ｍＬを採取し、リオン製ＫＲ−３２型パーティクル測定器で２〜１００μｍのパーティクル数を測定した。
（ｂ）上記（ａ）で超純水１０ｍＬを採取した後のポリエチレン製袋に、測定対象の半導体搬送容器１枚を入れ、ゆっくりと左右に５回まわした。２時間静置した後、該袋内の超純水１０ｍＬを採取し、リオン製ＫＲ−３２型パーティクル測定器で２〜１００μｍのパーティクル数を測定した。
（ｃ）上記（ｂ）で得られたパーティクル数から上記（ａ）で得られたパーティクル数を差し引いた値を、測定対象の半導体搬送容器のパーティクル数とした。
<Measurement conditions>
(A) 100 mL of ultrapure water (specific resistance value: 18 MΩ · cm) was put into a polyethylene bag to which particles were not attached, and was slowly turned left and right five times. After standing for 2 hours, 10 mL of ultrapure water in the bag was collected, and the number of particles of 2 to 100 μm was measured with a KR-32 type particle measuring device manufactured by Rion.
(B) One semiconductor transfer container to be measured was placed in the polyethylene bag after collecting 10 mL of ultrapure water in (a) above, and slowly turned left and right five times. After standing for 2 hours, 10 mL of ultrapure water in the bag was collected, and the number of particles of 2 to 100 μm was measured with a KR-32 type particle measuring device manufactured by Rion.
(C) The value obtained by subtracting the number of particles obtained in the above (a) from the number of particles obtained in the above (b) was used as the number of particles in the semiconductor transfer container to be measured.
実施例１
黒色の半導体搬送容器２０枚（そのうちの２枚には、黒色の両面テープの微小片（直径約０．５ｍｍ程度）が貼り付けられている）を、目視検査した。しかしながら、目視検査では、両面テープが付着している半導体搬送容器を見つけることはできなかった。次に、この半導体搬送容器２０枚の表面にグラニュー糖をふりかけ、次いで反転させて付着しなかったグラニュー糖を除去した。裏面についても同様の操作を行った後、グラニュー糖が付着した半導体搬送容器があるか否かを目視で確認したところ、２枚の半導体搬送容器にグラニュー糖が付着していることを見つけた。
Example 1
Twenty black semiconductor transfer containers (two of which are adhered with a small piece of black double-sided tape (about 0.5 mm in diameter) are visually inspected). However, by visual inspection, it was not possible to find a semiconductor transport container having a double-sided tape attached thereto. Next, granulated sugar was sprinkled on the surface of the 20 semiconductor transfer containers, and then inverted to remove granulated sugar that did not adhere. After the same operation was performed on the back surface, it was visually confirmed whether or not there was a semiconductor transport container with granulated sugar attached, and it was found that granulated sugar had adhered to the two semiconductor transport containers.
グラニュー糖が付着した半導体搬送容器を取り除いた後の１８枚の半導体搬送容器を、クリーンルーム（５μｍ以上のパーティクル数が１０００個／ｆｔ３以下）内で、純水（比抵抗値：１０ＭΩ・ｃｍ）で、精密洗浄（超音波照射下）し、温風乾燥した。温風乾燥後の半導体搬送容器１８枚のうちの１枚を用いて、前記比較例１に記載の測定条件でパーティクル数を測定したところ、２μｍ以上のパーティクル数は、１５５個であった。この結果から、本発明の方法によれば、テープ等に由来する粘着物が付着した半導体搬送容器を容易に判別でき、また、精密洗浄後のパーティクル数もほぼ同じであることから、清浄性も保持可能であることが分かる。 Eighteen semiconductor transfer containers after removing the semiconductor transfer containers with attached granulated sugar, in pure water (specific resistance: 10 MΩ · cm) in a clean room (number of particles of 5 μm or more is 1000 / ft 3 or less) Then, it was precision cleaned (under ultrasonic irradiation) and dried with warm air. When the number of particles was measured under the measurement conditions described in Comparative Example 1 using one of the 18 semiconductor transfer containers after hot air drying, the number of particles of 2 μm or more was 155. From this result, according to the method of the present invention, it is possible to easily discriminate the semiconductor transport container to which the sticky material derived from the tape or the like is attached, and since the number of particles after the precision cleaning is almost the same, the cleanliness is also good. It can be seen that it can be held.
１・・精密洗浄装置、２・・半導体搬送容器、３・・ローラーコンベア、４・・水溶性粉粒体、５・・スクリューフィーダー、５’・・スクリューフィーダー、６・・アーム、６’・・アーム、７・・カメラ、７’・・カメラ、８・・アーム、９・・画像処理装置、１０・・回収箱、１１・・アーム、１２・・洗浄槽、１３・・水溶性粉粒体回収容器 1. ・ Precision cleaning device, 2 .... Semiconductor transport container, 3 .... Roller conveyor, 4 .... Water-soluble powder, 5 .... Screw feeder, 5 '... Screw feeder, 6 .... Arm, 6' ... · Arm, 7 ·· Camera, 7 '·· Camera, 8 ·· Arm, 9 ·· Image processing device, 10 ·· Recovery box, 11 ·· Arm, 12 ·· Washing tank, 13 ·· Water-soluble powder Body recovery container
Claims (5)
（１）前記半導体搬送容器と、水溶性粉粒体とを接触させる工程、
（２）付着しなかった水溶性粉粒体を、前記半導体搬送容器から除去する工程、
（３）水溶性粉粒体が付着した半導体搬送容器を検出する工程、
（４）水溶性粉粒体が付着していない半導体搬送容器と水溶性粉粒体が付着した半導体搬送容器とを分離する工程、
（５）水溶性粉粒体が付着していない半導体搬送容器を水で精密洗浄する工程、
を含むことを特徴とする精密洗浄方法。 In the method of precision cleaning the semiconductor transport container with water,
(1) The step of bringing the semiconductor transport container into contact with the water-soluble powder,
(2) removing the water-soluble powder particles that have not adhered from the semiconductor transport container;
(3) a step of detecting the semiconductor transport container to which the water-soluble powder particles are attached;
(4) a step of separating the semiconductor transport container to which the water-soluble powder particles are not attached and the semiconductor transport container to which the water-soluble powder particles are attached;
(5) A step of precisely washing a semiconductor transport container to which no water-soluble powder is adhered with water,
A precision cleaning method comprising:
前記半導体搬送容器と、水溶性粉粒体とを接触させる接触手段と、
付着しなかった水溶性粉粒体を、前記半導体搬送容器から除去する除去手段と、
水溶性粉粒体が付着した半導体搬送容器を検出する検出手段と、
水溶性粉粒体が付着していない半導体搬送容器と水溶性粉粒体が付着した半導体搬送容器とを分離する分離手段と、
水溶性粉粒体が付着していない半導体搬送容器を水で精密洗浄する精密洗浄手段とを備えてなる精密洗浄装置。 In precision cleaning equipment for semiconductor transport containers,
Contact means for contacting the semiconductor transport container and the water-soluble powder,
Removing means for removing the water-soluble powder particles that did not adhere from the semiconductor transport container;
Detection means for detecting the semiconductor transport container to which the water-soluble powder particles are attached;
Separation means for separating the semiconductor transport container to which the water-soluble powder particles are not attached and the semiconductor transport container to which the water-soluble powder particles are attached;
A precision cleaning apparatus comprising a precision cleaning means for precisely cleaning a semiconductor transport container, to which water-soluble powder particles are not attached, with water.
The method for determining whether or not an adhesive is attached to the semiconductor transport container according to claim 4, wherein the water-soluble powder is a polysaccharide, a water-soluble polymer, an alkali metal salt, or an alkaline earth metal salt.
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| JPH06323992A (en) * | 1993-01-07 | 1994-11-25 | Alfill Getraenketechnik Gmbh | Method and device for optically inspecting transparent container |
| JPH1147710A (en) * | 1997-08-05 | 1999-02-23 | Taisei Corp | Automatic cleaning apparatus for items of every kind of container, etc. |
| JP2003144368A (en) * | 2001-11-12 | 2003-05-20 | Toray Ind Inc | Wiping cloth and method for manufacturing the same |
| JP2004284601A (en) * | 2003-03-19 | 2004-10-14 | Renesas Technology Corp | Method for carrying, mounting and packaging semi-conductor device, and method for reusing stored article |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06323992A (en) * | 1993-01-07 | 1994-11-25 | Alfill Getraenketechnik Gmbh | Method and device for optically inspecting transparent container |
| JPH1147710A (en) * | 1997-08-05 | 1999-02-23 | Taisei Corp | Automatic cleaning apparatus for items of every kind of container, etc. |
| JP2003144368A (en) * | 2001-11-12 | 2003-05-20 | Toray Ind Inc | Wiping cloth and method for manufacturing the same |
| JP2004284601A (en) * | 2003-03-19 | 2004-10-14 | Renesas Technology Corp | Method for carrying, mounting and packaging semi-conductor device, and method for reusing stored article |
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