JP4656046B2 - Image sensor focus adjustment mechanism - Google Patents

Image sensor focus adjustment mechanism Download PDF

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JP4656046B2
JP4656046B2 JP2006316222A JP2006316222A JP4656046B2 JP 4656046 B2 JP4656046 B2 JP 4656046B2 JP 2006316222 A JP2006316222 A JP 2006316222A JP 2006316222 A JP2006316222 A JP 2006316222A JP 4656046 B2 JP4656046 B2 JP 4656046B2
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image sensor
component mounting
liquid lens
mounting recess
transparent plate
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JP2008129461A (en
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陽一郎 中原
直人 池川
康史 正木
良幸 内野々
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Panasonic Corp
Panasonic Electric Works Co Ltd
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Panasonic Corp
Matsushita Electric Works Ltd
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Description

本発明は、撮像素子のピント調整機構に関するものである。   The present invention relates to a focus adjustment mechanism for an image sensor.

この種のピント調節機構としては、電気毛管現象により焦点距離が変化するリキッドレンズを利用した可変焦点レンズを、撮像素子の光学系に用いたものが従来提案されている（例えば特許文献１参照）。
特開２００３−５７０４９号公報（段落番号［００４４］−［００４６］、及び、第１図、第３図） As this type of focus adjustment mechanism, a mechanism using a variable focus lens using a liquid lens whose focal length changes due to an electrocapillary phenomenon in an optical system of an image sensor has been proposed (for example, see Patent Document 1). .
JP 2003-57049 A (paragraph numbers [0044]-[0046] and FIGS. 1 and 3)

上述した撮像素子のピント調整機構では、リキッドレンズからなる可変焦点レンズと、撮像素子とをそれぞれ装置に組み込んでいるため、可変焦点レンズと撮像素子の相対的な位置関係が製品毎にばらつく可能性があった。そのため、リキッドレンズの光軸中心と撮像素子の光軸中心との位置ずれが発生したり、リキッドレンズと撮像素子の間の距離がばらつくなどして、精度の良い映像が得られない可能性があった。   In the above-described focus adjustment mechanism of the image sensor, a variable focus lens composed of a liquid lens and an image sensor are incorporated in the apparatus, so the relative positional relationship between the variable focus lens and the image sensor may vary from product to product. was there. For this reason, there is a possibility that a positional deviation between the optical axis center of the liquid lens and the optical axis center of the imaging device may occur, or the distance between the liquid lens and the imaging device may vary, resulting in an inaccurate image. there were.

本発明は上記問題点に鑑みて為されたものであり、その目的とするところは、精度の良い映像を得ることができる撮像素子のピント調整機構を提供することにある。   The present invention has been made in view of the above problems, and an object of the present invention is to provide a focus adjustment mechanism of an image sensor that can obtain a highly accurate image.

上記目的を達成するために、請求項１の発明は、表面に部品搭載用凹部が設けられた立体回路部品からなるモジュール本体と、部品搭載用凹部の底面に搭載された撮像素子と、誘電材料により形成され外側縁を部品搭載用凹部の内壁に接触させた状態で部品搭載用凹部の中間部に配置された第１の透明板と、外縁部を部品搭載用凹部の内壁に接触させた状態で第１の透明板の表面側に配置されたリキッドレンズと、部品搭載用凹部の開口を塞ぐように配置された第２の透明板と、第１の透明板の表面および裏面にそれぞれ形成されリキッドレンズの焦点距離に応じた電圧が印加される第１及び第２の透明電極とを備え、第１及び第２の透明電極間に電圧が印加されていない状態でリキッドレンズの表面と部品搭載用凹部の内壁とのなす角度が所定角度を保つようにして、リキッドレンズの外縁部を部品搭載用凹部の内壁に接触させたことを特徴とする。 In order to achieve the above object, the invention of claim 1 is directed to a module main body comprising a three-dimensional circuit component having a component mounting recess provided on the surface thereof, an image pickup device mounted on the bottom surface of the component mounting recess, and a dielectric material. A state in which the outer edge is in contact with the inner wall of the component mounting recess, and the outer edge is in contact with the inner wall of the component mounting recess, with the outer edge being in contact with the inner wall of the component mounting recess. The liquid lens disposed on the front surface side of the first transparent plate, the second transparent plate disposed so as to close the opening of the component mounting recess, and the front surface and the back surface of the first transparent plate, respectively. The first and second transparent electrodes to which a voltage corresponding to the focal length of the liquid lens is applied are provided , and the surface of the liquid lens and component mounting in a state where no voltage is applied between the first and second transparent electrodes. The angle formed by the inner wall of the recess So as to maintain a constant angle, and wherein the contacting the outer edge of the liquid lens to the inner wall of the component mounting recess.

請求項１の発明によれば、誘電材料により形成された第１の透明板の表面および裏面に形成された第１及び第２の透明電極の間に電圧を印加すると、第１の透明板の表面側に配置されたリキッドレンズの表面張力が電気毛管現象により変化して、界面の形状が変化するので、リキッドレンズの焦点距離を変化させて、ピント調整を行うことができる。しかも、モジュール本体は立体回路部品からなり、このモジュール本体に設けた部品搭載用凹部の底面に撮像素子を搭載するとともに、部品搭載用凹部の中間部に配置した第１の透明板の表面側に、外縁部を部品搭載用凹部の内壁に接触させた状態でリキッドレンズを配置しているので、リキッドレンズと撮像素子との相対的な位置決め精度を向上させることができ、リキッドレンズと撮像素子の光軸中心の位置ずれや両者の距離のばらつきを低減することによって、精度の良い映像を得ることができるという効果がある。   According to the first aspect of the present invention, when a voltage is applied between the first and second transparent electrodes formed on the front surface and the back surface of the first transparent plate formed of a dielectric material, Since the surface tension of the liquid lens arranged on the surface side changes due to the electrocapillary phenomenon and the shape of the interface changes, it is possible to adjust the focus by changing the focal length of the liquid lens. In addition, the module body is made of a three-dimensional circuit component, and the image pickup device is mounted on the bottom surface of the component mounting recess provided in the module body, and on the surface side of the first transparent plate disposed in the intermediate portion of the component mounting recess. Since the liquid lens is arranged in a state where the outer edge portion is in contact with the inner wall of the component mounting recess, the relative positioning accuracy between the liquid lens and the image sensor can be improved, and the liquid lens and the image sensor can be improved. By reducing the displacement of the center of the optical axis and the variation in the distance between the two, there is an effect that a highly accurate image can be obtained.

以下に本発明の実施の形態を図１〜図４に基づいて説明する。   Embodiments of the present invention will be described below with reference to FIGS.

図１は撮像素子のピント調整機構Ａの要部断面図であり、ピント調整機構Ａは、後述する３次元立体配線基板の製造技術を用いて形成された立体回路部品からなるモジュール本体１を備える。   FIG. 1 is a cross-sectional view of a main part of the focus adjustment mechanism A of the image sensor. The focus adjustment mechanism A includes a module main body 1 made of a three-dimensional circuit component formed by using a three-dimensional three-dimensional wiring board manufacturing technique described later. .

モジュール本体１は略直方体状であって、上面の中央にはレンズ収納凹部２が開口している。また、レンズ収納凹部２の底部中央には、レンズ収納凹部２に比べて水平断面の小さい撮像素子収納凹部３が開口しており、撮像素子収納凹部３の開口部周縁には段部４が形成されている。また、撮像素子収納凹部３の内壁は、上側に行くほど外側に広がるよう斜めに傾斜している。ここにおいてレンズ収納凹部２と撮像素子収納凹部３とで部品搭載用凹部が構成されている。   The module main body 1 has a substantially rectangular parallelepiped shape, and a lens housing recess 2 is opened at the center of the upper surface. An image sensor housing recess 3 having a smaller horizontal cross section than the lens housing recess 2 is opened at the center of the bottom of the lens housing recess 2, and a step 4 is formed at the periphery of the opening of the image sensor housing recess 3. Has been. Further, the inner wall of the image sensor housing recess 3 is inclined so as to spread outward as it goes upward. Here, the lens housing recess 2 and the image sensor housing recess 3 constitute a component mounting recess.

撮像素子収納凹部３の底面には、ＣＣＤ（電荷結合素子）やＣＭＯＳイメージセンサなどからなる撮像素子５が搭載されており、撮像素子５の電極は、撮像素子収納凹部３の底面に形成された金属めっき層からなる回路パターン（図示せず）にボンディングワイヤ（図示せず）を介して電気的に接続されている。この回路パターンは、撮像素子収納凹部３およびレンズ収納凹部２の内壁を通って、モジュール本体１の表面まで延長形成されており、撮像素子５は上記回路パターンを介して外部の回路に電気的に接続されている。   On the bottom surface of the image sensor housing recess 3, an image sensor 5 comprising a CCD (charge coupled device), a CMOS image sensor or the like is mounted. The electrodes of the image sensor 5 are formed on the bottom surface of the image sensor housing recess 3. It is electrically connected to a circuit pattern (not shown) made of a metal plating layer via a bonding wire (not shown). The circuit pattern extends through the inner walls of the image sensor housing recess 3 and the lens housing recess 2 to the surface of the module body 1, and the image sensor 5 is electrically connected to an external circuit via the circuit pattern. It is connected.

またレンズ収納凹部２の内部には、透明な誘電材料により形成された第１の透明板（以下、透明板と略称す。）６が配置される。透明板６はレンズ収納凹部２の断面形状と略同じ形状に形成され、段部４上に載置された状態でレンズ収納凹部２の内部（つまり部品搭載用凹部の中間部）に固定されており、透明板６の外側縁はレンズ収納凹部２の内壁に接触している。この透明板６の表面および裏面にはそれぞれ第１の透明電極７と第２の透明電極８が設けられている。第１及び第２の透明電極７，８は、段部４の上面あるいはレンズ収納凹部２の内壁に形成された金属めっき層からなる回路パターン１１，１２に電気的に接続されており、これらの回路パターン１１，１２を介して外部の制御回路１３に電気的に接続されている。而して、第１及び第２の透明電極７，８の間には、外部の制御回路１３から回路パターン１１，１２を介して所定の電圧値の電圧が印加されるようになっている。   A first transparent plate (hereinafter abbreviated as a transparent plate) 6 made of a transparent dielectric material is disposed inside the lens housing recess 2. The transparent plate 6 is formed in substantially the same shape as the cross-sectional shape of the lens housing recess 2, and is fixed to the inside of the lens housing recess 2 (that is, the middle part of the component mounting recess) while being placed on the stepped portion 4. The outer edge of the transparent plate 6 is in contact with the inner wall of the lens housing recess 2. A first transparent electrode 7 and a second transparent electrode 8 are provided on the front and back surfaces of the transparent plate 6, respectively. The first and second transparent electrodes 7 and 8 are electrically connected to circuit patterns 11 and 12 made of a metal plating layer formed on the upper surface of the stepped portion 4 or the inner wall of the lens housing recess 2, and these The circuit is electrically connected to an external control circuit 13 via circuit patterns 11 and 12. Thus, a voltage having a predetermined voltage value is applied between the first and second transparent electrodes 7 and 8 from the external control circuit 13 via the circuit patterns 11 and 12.

またレンズ収納凹部２の開口部には、開口部を閉塞するようにして、透光性を有する第２の透明板（以下、透明板と略称す。）９が取り付けられており、透明板６と透明板９とでレンズ収納凹部２の内部が液密状態に封止されている。   A second transparent plate (hereinafter abbreviated as “transparent plate”) 9 having translucency is attached to the opening of the lens housing recess 2 so as to close the opening. And the transparent plate 9 seal the inside of the lens housing recess 2 in a liquid-tight state.

そして、透明板６の上面には導電性を有する透明な液滴からなるリキッドレンズ１０が配置されている。リキッドレンズ１０は、その外縁部がレンズ収納凹部２の内壁に接触するように配置されているので、リキッドレンズ１０の光軸中心はレンズ収納凹部２の中心位置に略一致している。透明板６およびレンズ収納凹部２の内壁はリキッドレンズ１０に対して低い濡れ性を有しており、透明電極７，８間に電圧を印加していない状態ではリキッドレンズ１０とレンズ収納凹部２の内壁との接触角がθ１となる状態を保っている。   A liquid lens 10 made of transparent conductive droplets is disposed on the upper surface of the transparent plate 6. Since the liquid lens 10 is arranged such that the outer edge thereof is in contact with the inner wall of the lens housing recess 2, the center of the optical axis of the liquid lens 10 substantially coincides with the center position of the lens housing recess 2. The transparent plate 6 and the inner wall of the lens housing recess 2 have low wettability with respect to the liquid lens 10, and when no voltage is applied between the transparent electrodes 7 and 8, the liquid lens 10 and the lens housing recess 2 are formed. The state where the contact angle with the inner wall is θ1 is maintained.

ここで、外部の制御回路１３から透明電極７，８間に電圧が印加されると、電気毛管現象（electricwetting phenomena）によってリキッドレンズ１０の表面張力が変化して、リキッドレンズ１０とレンズ収納凹部２の内壁との接触角が変化する。例えば透明電極７，８間の印加電圧に応じて接触角がθ１からθ２に増加すると、リキッドレンズ１０の界面の形状が図１中に破線で示すような形状となり、界面の曲率半径が電圧を印加していない状態に比べて小さくなるので、リキッドレンズ１０の焦点距離を短くすることができる。したがって、外部の制御回路１３により透明電極７，８間に所望の極性あるいは電圧値の電圧を印加することで、リキッドレンズ１０の表面張力を変化させて、その焦点距離を調整することができ、撮像素子５のピントを調整することができるのである。   Here, when a voltage is applied between the transparent electrodes 7 and 8 from the external control circuit 13, the surface tension of the liquid lens 10 changes due to the electrowetting phenomenon, and the liquid lens 10 and the lens housing recess 2 are changed. The contact angle with the inner wall changes. For example, when the contact angle increases from θ1 to θ2 in accordance with the applied voltage between the transparent electrodes 7 and 8, the shape of the interface of the liquid lens 10 becomes a shape as shown by a broken line in FIG. The focal length of the liquid lens 10 can be shortened because it is smaller than the state where no voltage is applied. Therefore, by applying a voltage having a desired polarity or voltage value between the transparent electrodes 7 and 8 by the external control circuit 13, the surface tension of the liquid lens 10 can be changed and the focal length can be adjusted. The focus of the image sensor 5 can be adjusted.

本実施形態のピント調整機構Ａは以上のような構成を有しており、誘電材料で形成された透明板６の表面および裏面に設けた透明電極７，８の間に電圧を印加すると、透明板６の表面側に配置されたリキッドレンズ１０の表面張力が電気毛管現象により変化して、界面の形状が変化するので、リキッドレンズ１０の焦点距離を変化させて、ピント調整を行うことができる。しかも、モジュール本体１は、３次元立体配線基板の製造技術を用いて形成されており、レンズ収納凹部２の内部に配置した透明板６の表面側に、外縁部をレンズ収納凹部２の内壁に接触させた状態でリキッドレンズ１０を配置しているので、リキッドレンズ１０の光軸中心をレンズ収納凹部２の中心位置に略一致させることができる。また撮像素子５は、モジュール本体１に設けた撮像素子収納凹部３の底面に搭載されているので、リキッドレンズ１０と撮像素子５との相対的な位置決め精度を向上させることができ、リキッドレンズ１０と撮像素子５の光軸中心の位置ずれや、両者の距離のばらつきを低減することによって、精度の良い映像を得ることができる。   The focus adjustment mechanism A according to the present embodiment has the above-described configuration. When a voltage is applied between the transparent electrodes 7 and 8 provided on the front and back surfaces of the transparent plate 6 made of a dielectric material, the focus adjustment mechanism A is transparent. Since the surface tension of the liquid lens 10 arranged on the surface side of the plate 6 changes due to the electrocapillarity and the shape of the interface changes, focus adjustment can be performed by changing the focal length of the liquid lens 10. . Moreover, the module main body 1 is formed by using a manufacturing technique of a three-dimensional three-dimensional wiring board, and the outer edge portion is formed on the inner wall of the lens housing recess 2 on the surface side of the transparent plate 6 disposed inside the lens housing recess 2. Since the liquid lens 10 is disposed in contact with the liquid lens 10, the center of the optical axis of the liquid lens 10 can be made substantially coincident with the center position of the lens housing recess 2. Further, since the image sensor 5 is mounted on the bottom surface of the image sensor housing recess 3 provided in the module main body 1, the relative positioning accuracy between the liquid lens 10 and the image sensor 5 can be improved, and the liquid lens 10. By reducing the displacement of the center of the optical axis of the imaging element 5 and the variation in the distance between them, a highly accurate image can be obtained.

ところで、上述のモジュール本体１は３次元立体配線基板の製造技術を用いて形成されるのであるが、その製造技術について図２〜図４を参照して説明する。   By the way, the module main body 1 described above is formed by using a manufacturing technique of a three-dimensional three-dimensional wiring board, and the manufacturing technique will be described with reference to FIGS.

図２は３次元立体回路基板の製造方法の概要を示すフローである。３次元立体回路基板は、樹脂材料を射出成型することで所望の三次元形状の基板２１を成型する成型工程（Ｓ１）、基板２１の表面にスパッタリング、蒸着、イオンプレーティングなどの物理蒸着法による導電性薄膜２２の成膜を行うメタライズ処理工程（Ｓ２）、高エネルギービーム（本実施形態ではレーザビーム）による回路部／非回路部の分離を行うレーザ処理工程（Ｓ３）、回路部のめっきによる厚膜化を行ってめっき層２３を形成するめっき処理工程（Ｓ４）、非回路部のエッチング処理工程（Ｓ５）の各工程を順次実施することで製造される。   FIG. 2 is a flowchart showing an outline of a method for manufacturing a three-dimensional circuit board. The three-dimensional three-dimensional circuit board is formed by a molding process (S1) in which a resin material is injection-molded to mold a desired three-dimensional substrate 21, and a physical vapor deposition method such as sputtering, vapor deposition, or ion plating on the surface of the substrate 21. A metallization process (S2) for forming the conductive thin film 22, a laser process (S3) for separating the circuit part / non-circuit part by a high energy beam (in this embodiment, a laser beam), and plating of the circuit part It is manufactured by sequentially performing each step of the plating process (S4) for forming the plating layer 23 by increasing the film thickness and the non-circuit part etching process (S5).

図３（ａ）〜（ｃ）および図４（ａ）（ｂ）は、上記各工程における３次元立体回路基板Ｂの表面処理の様子を示している。まず図３（ａ）は基板２１の成型工程（Ｓ１）であり、絶縁性を有する合成樹脂を射出成形することによって、所望の三次元形状を有する基板２１が成型される。ここにおいて基板２１の成型材料としては、例えば熱可塑性樹脂の場合は芳香族ポリアミドや液晶性ポリエステルなどが、熱硬化性樹脂の場合はエポキシ樹脂や飽和ポリエステルなどが用いられ、またセラミックの場合は窒化アルミナなどが用いられる。また基板２１の成形材料としてポリエーテルエーテルケトン（ＰＥＥＫ）やポリフタルアミド（ＰＰＡ）などを用いても良い。また基板２１の成型方法は射出成形に限らず、押出成型やトランスファ成型などの成型方法を用いても良い。   FIGS. 3A to 3C and FIGS. 4A and 4B show the surface treatment of the three-dimensional circuit board B in each of the above steps. First, FIG. 3A shows a molding step (S1) of the substrate 21, and the substrate 21 having a desired three-dimensional shape is molded by injection molding an insulating synthetic resin. Here, as the molding material of the substrate 21, for example, an aromatic polyamide or liquid crystalline polyester is used in the case of a thermoplastic resin, an epoxy resin or a saturated polyester is used in the case of a thermosetting resin, and a nitriding is used in the case of a ceramic. Alumina or the like is used. Further, polyether ether ketone (PEEK), polyphthalamide (PPA), or the like may be used as a molding material for the substrate 21. The molding method of the substrate 21 is not limited to injection molding, and a molding method such as extrusion molding or transfer molding may be used.

次に、図３（ｂ）はメタライズ処理工程（Ｓ２）であり、例えば銅をターゲットとするスパッタリング、真空蒸着、イオンプレーティングなどの物理蒸着法（ＰＶＤ法）によって、基板２１の表面に導電性薄膜２２が形成される。しかし、物理蒸着法に限定されることなく化学蒸着法などの他の方法で行ってもよい。導電性薄膜２２は、銅以外に、ニッケル、金、アルミニウム、チタン、モリブデン、クロム、タングステン、スズ、鉛などの単体金属、又は黄銅、ＮｉＣｒなどの合金を用いてもよい。   Next, FIG. 3B shows a metallization process step (S2). For example, the surface of the substrate 21 is electrically conductive by a physical vapor deposition method (PVD method) such as sputtering, vacuum vapor deposition, or ion plating using copper as a target. A thin film 22 is formed. However, it may be performed by other methods such as a chemical vapor deposition method without being limited to the physical vapor deposition method. In addition to copper, the conductive thin film 22 may use a single metal such as nickel, gold, aluminum, titanium, molybdenum, chromium, tungsten, tin, or lead, or an alloy such as brass or NiCr.

図３（ｃ）はレーザ処理工程（Ｓ３）であり、導電性薄膜２２における回路部２３ａと非回路部２３ｂとの境界部分に高エネルギービーム、例えば電磁波ビームであるレーザビームが照射され、その部分の導電性薄膜２２が蒸発除去されて、その除去部２３ｃによって回路部２３ａと非回路部２３ｂとが分離され、所定の回路パターンが形成される。   FIG. 3C shows a laser processing step (S3). A boundary portion between the circuit portion 23a and the non-circuit portion 23b in the conductive thin film 22 is irradiated with a high energy beam, for example, a laser beam which is an electromagnetic wave beam. The conductive thin film 22 is removed by evaporation, and the circuit portion 23a and the non-circuit portion 23b are separated by the removal portion 23c to form a predetermined circuit pattern.

次に、図４（ａ）はめっき処理工程（Ｓ４）であり、回路部２３ａに給電されて電流が流れ、回路部２３ａの部分が例えば電解銅めっきにより厚膜化されて、めっき層２４が形成される。このとき、非回路部２３ｂには電流が流れず、非回路部２３ｂの部分はめっきされないので、その膜厚はもとのままの薄膜の状態にある。尚、めっき層２４としてはニッケル金めっきなどを形成しても良い。   Next, FIG. 4A shows a plating process step (S4). Electricity is supplied to the circuit portion 23a, current flows, and the portion of the circuit portion 23a is thickened by, for example, electrolytic copper plating. It is formed. At this time, no current flows through the non-circuit portion 23b, and the portion of the non-circuit portion 23b is not plated, so that the film thickness remains as it is. Note that nickel gold plating or the like may be formed as the plating layer 24.

次に、図４（ｂ）はエッチング処理工程（Ｓ５）であり、回路パターン形成面全体をエッチングすることにより、非回路部２３ｂが除去されて、回路パターンが形成された３次元回路基板が完成するのであり、このような製造技術を用いて、上述のモジュール本体１を形成することができるのである。   Next, FIG. 4B is an etching process step (S5). By etching the entire circuit pattern forming surface, the non-circuit portion 23b is removed and a three-dimensional circuit board on which the circuit pattern is formed is completed. Therefore, the module body 1 described above can be formed by using such a manufacturing technique.

なお、本発明の精神と範囲に反することなしに、広範に異なる実施形態を構成することができることは明白なので、この発明は、特定の実施形態に制約されるものではない。   It should be noted that a wide variety of different embodiments can be configured without departing from the spirit and scope of the present invention, and the present invention is not limited to a specific embodiment.

本実施形態の撮像素子のピント調整機構の概略断面図である。It is a schematic sectional drawing of the focus adjustment mechanism of the image sensor of this embodiment. 同上のモジュール本体の製造方法の概要を示すフロー図である。It is a flowchart which shows the outline | summary of the manufacturing method of a module main body same as the above. （ａ）〜（ｃ）は同上の各工程における表面処理の様子を示す斜視図である。(A)-(c) is a perspective view which shows the mode of the surface treatment in each process same as the above. （ａ）（ｂ）は同上の各工程における表面処理の様子を示す斜視図である。(A) (b) is a perspective view which shows the mode of the surface treatment in each process same as the above.

符号の説明Explanation of symbols

Ａ ピント調整機構
１ モジュール本体
２ レンズ収納凹部（部品搭載用凹部）
３ 素子収納凹部（部品搭載用凹部）
５ 撮像素子
６ 第１の透明板
７ 第１の透明電極
８ 第２の透明電極
９ 第２の透明板
１０ リキッドレンズ A Focus adjustment mechanism 1 Module body 2 Lens storage recess (component mounting recess)
3 Element recess (component mounting recess)
5 Image Sensor 6 First Transparent Plate 7 First Transparent Electrode 8 Second Transparent Electrode 9 Second Transparent Plate 10 Liquid Lens

Claims (1)

表面に部品搭載用凹部が設けられた立体回路部品からなるモジュール本体と、
前記部品搭載用凹部の底面に搭載された撮像素子と、
誘電材料により形成され外側縁を前記部品搭載用凹部の内壁に接触させた状態で前記部品搭載用凹部の中間部に配置された第１の透明板と、
外縁部を前記部品搭載用凹部の内壁に接触させた状態で前記第１の透明板の表面側に配置されたリキッドレンズと、
前記部品搭載用凹部の開口を塞ぐように配置された第２の透明板と、
前記第１の透明板の表面および裏面にそれぞれ形成され前記リキッドレンズの焦点距離に応じた電圧が印加される第１及び第２の透明電極とを備え、
前記第１及び第２の透明電極間に電圧が印加されていない状態で前記リキッドレンズの表面と前記部品搭載用凹部の内壁とのなす角度が所定角度を保つようにして、前記リキッドレンズの外縁部を前記部品搭載用凹部の内壁に接触させたことを特徴とする撮像素子のピント調整機構。 A module body made of a three-dimensional circuit component having a concave portion for mounting a component on the surface;
An image sensor mounted on the bottom surface of the component mounting recess,
A first transparent plate formed of a dielectric material and arranged at an intermediate portion of the component mounting recess with the outer edge in contact with the inner wall of the component mounting recess;
A liquid lens disposed on the surface side of the first transparent plate in a state in which an outer edge is in contact with an inner wall of the component mounting recess;
A second transparent plate arranged so as to close the opening of the component mounting recess;
First and second transparent electrodes formed on the front and back surfaces of the first transparent plate, respectively, to which a voltage corresponding to the focal length of the liquid lens is applied ;
An outer edge of the liquid lens is formed such that an angle formed between the surface of the liquid lens and the inner wall of the component mounting recess is maintained at a predetermined angle when no voltage is applied between the first and second transparent electrodes. A focus adjustment mechanism for an image sensor , wherein the portion is brought into contact with the inner wall of the component mounting recess .
JP2006316222A 2006-11-22 2006-11-22 Image sensor focus adjustment mechanism Expired - Fee Related JP4656046B2 (en)

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TW201044489A (en) * 2009-06-11 2010-12-16 Utechzone Co Ltd Assembly with chip-ejection device and image-capturing device
EP2570838B1 (en) * 2010-05-14 2020-01-22 FUJIFILM Corporation Three-dimensional imaging device and autofocus adjustment method for three-dimensional imaging device
EP2815265B1 (en) * 2012-02-07 2019-09-18 Mitsui Chemicals, Inc. Laser patterning of conductive films for electro-active lenses

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004341201A (en) * 2003-05-15 2004-12-02 Konica Minolta Opto Inc Imaging unit
JP2006074464A (en) * 2004-09-02 2006-03-16 Seiko Epson Corp Optical module and its manufacturing method
JP2006078650A (en) * 2004-09-08 2006-03-23 Fuji Photo Film Co Ltd Optical element, lens unit, and imaging apparatus
JP2006081043A (en) * 2004-09-13 2006-03-23 Seiko Precision Inc Solid state imaging apparatus and electronic apparatus comprising the same
JP2006098995A (en) * 2004-09-30 2006-04-13 Casio Comput Co Ltd Optical unit, camera, and optical equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004341201A (en) * 2003-05-15 2004-12-02 Konica Minolta Opto Inc Imaging unit
JP2006074464A (en) * 2004-09-02 2006-03-16 Seiko Epson Corp Optical module and its manufacturing method
JP2006078650A (en) * 2004-09-08 2006-03-23 Fuji Photo Film Co Ltd Optical element, lens unit, and imaging apparatus
JP2006081043A (en) * 2004-09-13 2006-03-23 Seiko Precision Inc Solid state imaging apparatus and electronic apparatus comprising the same
JP2006098995A (en) * 2004-09-30 2006-04-13 Casio Comput Co Ltd Optical unit, camera, and optical equipment

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