JP4654748B2 - Differential thickness plating manufacturing method and differential thickness plating manufacturing apparatus used therefor - Google Patents

Description

  The present invention relates to hoop plating of terminal materials and the like used for electronic components and the like, and particularly relates to a manufacturing method and manufacturing apparatus for differential thickness plating in which portions having different plating thicknesses are formed in the same hoop.

  In recent years, as electronic devices have become smaller, thinner, and lighter, the terminals of electroacoustic transducers used in these devices have also to be reduced in size, thickness, weight, and mounting. There is a strong demand for diversification of plating and high-performance plating used in the field. As a typical plating method, a manufacturing method by so-called differential thickness plating for forming plating films having different film thicknesses will be described with reference to the conceptual diagram of FIG.

  According to the figure, reference numeral 1 denotes a hoop-shaped metal band that becomes a cathode, 2 denotes an anode provided oppositely, and has a high current density portion 2a and a low current density portion 2b.

  3 is a plating tank filled with a plating solution 4 in which the hoop-shaped metal strip 1 and the anode 2 are immersed.

  In the plating tank configured as described above, the plating on the hoop-shaped metal strip 1 corresponding to the high current density portion 2a is obtained from the difference in current density between the hoop-shaped metal strip 1 serving as the cathode and the anode body 2. The thickness of the layer 1a is thick, and the plating layer 1a on the hoop-shaped metal strip 1 corresponding to the low current density portion 2b is formed thin. In this conventional technique, the high current density portion 2a and the low current density portion are formed. Since the boundary portion of the portion 2b is provided to be inclined, the plating is formed in such a manner that the plating thickness successively changes in thickness at this boundary portion.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP-A-62-40392

  However, in the electrode part of an electronic component, the contact part with other parts is made thick, for example, gold plating, and the part exposed at the other part is plated for rust prevention.

  In such a case, the plating thickness is made thinner than the above-mentioned contact portion to suppress an increase in cost. However, if the plating is performed twice, the original purpose is hindered.

  In addition, although the method described in the prior art can perform plating with high accuracy, the structure of the anode 2 of the electrode becomes complicated, which may contribute to an increase in cost.

  The present invention solves the above-mentioned problem of differential thickness plating at low cost by simultaneously processing plating at a plurality of places having different plating thicknesses, and simultaneously processing plating at a portion requiring accuracy of plating thickness and a portion not so much. It is what.

In order to solve the above-mentioned problem, a manufacturing method of differential thickness plating according to the present invention includes a positive electrode, the hoop-like thin plate serving as a negative electrode disposed opposite to the positive electrode, and covering the hoop-like thin plate, the first is not covered by the mask to form a second exposed portion, the first, have a hole corresponding to the second exposure portion, and a sparger provided to overlap the mask, the plating solution A shielding plate for controlling the flow rate, and a voltage is applied between the positive electrode and the hoop-like thin plate, the plating solution is brought into direct contact with the first exposed portion, and the plating solution is applied to the second exposed portion. By attenuating the flow rate and making it contact, and forming the plating thickness of the first exposed portion thicker than the plating thickness of the second exposed portion, the flow rate of the plating solution contacting the exposed portion can be reduced by the sparger and the shielding plate. controlled to form plating thickness of different sites in the same plating A shall, first by controlling the plating solution flow rate, in which the plating thickness of the second exposed portion is formed differently.

  The manufacturing apparatus for differential thickness plating according to claim 2 of the present invention is the manufacturing apparatus for differential thickness plating used in the manufacturing method according to claim 1, wherein a hoop-like thin plate made of at least a conductor is separated from the plating solution. The plating solution is directly brought into contact with the first exposed portion formed on the hoop-like thin plate to obtain a predetermined plating thickness, and the plating solution is also brought into contact with the second exposed portion indirectly. This is a manufacturing apparatus for differential thickness plating provided with a plating solution blow-out portion, in which a plating solution is brought into direct contact with the first exposed portion, and a plating solution is brought into contact indirectly with the second exposed portion. The flow rate of the plating solution to be contacted is greater in the first exposed portion than in the second exposed portion, and the flow rate is reliably adjusted, and a second plating thick layer having a predetermined thickness is applied to the first exposed portion. The difference thickness plating manufacturing apparatus in which a thin plating thickness layer is formed on the exposed portion of the first exposed portion. It is intended to provide.

  The manufacturing apparatus for differential thickness plating according to claim 3 of the present invention is the manufacturing apparatus for differential thickness plating according to claim 2, further comprising a positive electrode provided with a gap and a blow-out portion for blowing the plating solution from the gap between the positive electrodes. In this case, the plating solution blowing direction and the direction between the electrodes are substantially matched to stabilize the plating formation.

  As described above, the manufacturing method of differential thickness plating of the present invention has a high practical value that can easily form plating layers having different plating thicknesses at discontinuous positions by controlling the plating solution flow rate.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

(Embodiment 1)
The manufacturing method of the differential thickness plating of the present invention will be described with reference to FIGS.

  FIG. 1 is a conceptual diagram of an embodiment of a jet type plating apparatus using the manufacturing method of differential thickness plating according to the present invention, and FIG. 2 shows the relationship between the blowing flow rate of the blowing apparatus, which is the main part, and the plating thickness. FIG.

  According to the figure, 10 is a plating tank, 11 is a blowing device provided with a blowing part 11a provided in the plating tank, and the plating solution 10a for gold plating in the plating tank 10 is taken in from the blowing part 11a. The plating solution 10a is blown out toward the gap 12a of the positive electrode 12 described later. As can be understood from FIG. 1, the plating solution 10 a circulates in the plating tank 10 through the blowing device 11.

  The plating solution 10a in the plating tank 10 corresponds to a first exposed portion 20a of a hoop-like thin plate 20 (for example, a hoop-like thin plate such as a stainless steel plate or phosphor bronze plate used for a terminal of an electronic component) to be a negative electrode to be described later. The positive electrode is provided with a gap 12 a at the position, and 13 is a shielding plate provided between the positive electrode 12 and the hoop-like thin plate 20.

  Reference numeral 20b denotes a second exposed portion provided on the hoop-shaped thin plate 20, and both the first exposed portion 20a and the second exposed portion 20b expose the surface of the hoop-shaped thin plate 20 to the first and second exposed portions. The mask 21 is covered except for the portions 20a and 20b.

  A sparger 22 is provided so as to overlap the mask 21, and has an opening 22a corresponding to the first and second exposed portions 20a and 20b.

  The opening 22a is for guiding the plating solution 10a blown from the blowing portion 11a to the first and second exposed portions 20a and 20b by driving the blowing device 11 in the plating tank 10.

  Although not particularly shown, the hoop-like thin plate 20 on which the sparger 22 and the mask 21 are mounted is brought into contact with the raised portion of the plating solution 10a by the blow-out device 11 in the plating apparatus. 1. It has a holding and lowering portion that descends in the A direction to the extent that the plating solution 10a reaches the second exposed portions 20a and 20b.

  Next, the plating method in the present embodiment will be described in detail. The plating solution 10a in the plating tank 10 is not in contact with the hoop-like thin plate 20 by the holding and descending portion, and the sparger is driven when the blowing device 11 is driven. The hoop-like thin plate 20 is lowered so as to blow out into the opening 22a of 22 and come into contact with the first and second exposed portions 20a and 20b.

  At this time, while applying a voltage between the positive electrode 12 and the hoop-like thin plate 20, the direction of the plating solution 10a blown up through the gap 12a of the positive electrode 12 is controlled by the shielding plate 13, and the gap between the positive electrode 12 The second exposed portion 20b is in direct contact with the first exposed portion 20a opposed to 12a, and is guided to the shielding plate 13 and the sparger 22, and the blown plating solution 10a passes through the opening 22b of the sparger 22 to form the first exposed portion 20a. Thus, the plating layer is formed on the first and second exposed portions 20a and 20b.

  Note that the thickness of the plating layer formed in the first exposed portion 20a where the sprayed plating solution 10a directly contacts as described above is reduced in flow rate by the shielding plate 13 and the like as in the second exposed portion 20b. The second exposed portion 20b is formed thicker. This is considered to be due to the difference in the flow rate of the plating solution in contact with the exposed portions 20a and 20b.

  FIG. 2 shows the correlation between the blowing flow rate of the blowing device 11 and the thickness of the plating layer. When a predetermined plating thickness is required at the first exposed portion 20a, the flow rate of the plating solution is controlled to A predetermined plating thickness is obtained by controlling the flow rate of contact with one exposed portion 20a, and the second exposed portion 20b is formed with a plating layer equal to or less than this plating thickness.

  Therefore, in the above embodiment, a part having a thick plating thickness and a part allowed by a thinner plating layer such as a contact part (for example, contact with other parts in a metal terminal or a plating thickness of a soldering part, etc. are required. And other rust-preventing protective portions, etc.) can be formed in the same plating process.

  In the description of the above embodiment, a member having a portion requiring a plating thickness and a portion having a smaller plating thickness is described. However, a portion requiring the minimum plating thickness is a second exposed portion. By setting at, it is also possible to increase the plating thickness on the first exposed portion side.

  Moreover, in this Embodiment, although demonstrated as what provided the blowing apparatus 11 in the plating tank 10, it provided outside the plating tank 10, the intake part 11a and the intake of the plating solution 10a were provided by the pipe etc., or plating solution Another replenisher tank 10a may be provided.

  The present invention is capable of simultaneously forming plating layers having different plating thicknesses in the same plating tank by controlling the flow rate of the plating solution in contact with the plating-necessary portion, and requires a plurality of plating thicknesses. In the member to be used, at least one plating thickness is set as a predetermined one, and in other plating portions, it is widely used as a plating method of a member allowed with a plating thickness equal to or less than the predetermined thickness.

The conceptual diagram of one Embodiment of the jet type plating apparatus using the manufacturing method of differential thickness plating of this invention Correlation diagram showing the relationship between the blowout flow rate and plating thickness of the blowout device, which is the main part Conceptual diagram of plating equipment explaining the conventional manufacturing method using differential thickness plating

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Plating tank 10a Plating solution 11 Blowing apparatus 11a Blowing part 12 Positive electrode 20 Hoop-like thin plate 20a 1st exposed part 20b 2nd exposed part 21 Mask 22 Sparger 22a Opening

Claims (3)

A differential thickness plating method for forming portions having different plating thicknesses on a hoop-like thin plate made of a conductor, the positive electrode, the hoop-like thin plate serving as a negative electrode disposed opposite to the positive electrode, and the hoop-like shape covering the upper sheet, possess a mask for forming the first, second exposed portion that is not at least covered, the first, the hole corresponding to the second exposed portion, provided to overlap the mask It consists of a sparger and a shielding plate that controls the flow rate of the plating solution, and while applying a voltage between the positive electrode and the hoop-like thin plate, the plating solution is brought into direct contact with the first exposed portion, The second exposed portion is brought into contact with the flow rate of the plating solution attenuated, and the exposed thickness is formed so that the plating thickness of the first exposed portion is larger than the plated thickness of the second exposed portion. wherein the plating solution flow contacts the part between the sparger Method for manufacturing differential thickness plating control to form a different site plating thickness in the same plating by蔽板. It is a manufacturing apparatus of differential thickness plating used for the manufacturing method of Claim 1, Comprising: The hoop-like thin plate which consists of an electric conductor at least is arrange | positioned away from plating solution, and the 1st exposed part formed in this hoop-like thin plate A plating apparatus for differential thickness plating provided with a plating solution blowing device for bringing the plating solution into direct contact toward the surface to obtain a predetermined plating thickness and indirectly contacting the plating solution also to the second exposed portion. 3. The apparatus for producing differential thickness plating according to claim 2, wherein a positive electrode provided with a gap and a blow-out portion for blowing a plating solution from the gap between the positive electrodes are provided.

Images