JP4645562B2 - Imaging device - Google Patents

Imaging device Download PDF

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JP4645562B2
JP4645562B2 JP2006245230A JP2006245230A JP4645562B2 JP 4645562 B2 JP4645562 B2 JP 4645562B2 JP 2006245230 A JP2006245230 A JP 2006245230A JP 2006245230 A JP2006245230 A JP 2006245230A JP 4645562 B2 JP4645562 B2 JP 4645562B2
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light
electronic component
light receiving
light shielding
region
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JP2008065738A (en
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貴之 畑瀬
浩 村田
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は、線状に配列された複数の光電素子を備えた撮像装置に関するものである。 The present invention relates to an imaging equipment having a plurality of photoelectric elements arranged in a line.

電子部品を基板に実装する実装分野においては、ピックアップされた電子部品を撮像した画像に基づいて電子部品の位置および角度を認識し、正規の位置および角度に補正した後に基板に搭載することで、実装精度の向上を図っている。電子部品の撮像にはCCDカメラが広く用いられており、複数の光電素子を所定の領域に配列して構成した受光領域に電子部品を結像させ、各光電素子の受光量を電気信号に変換したものを画像処理することで電子部品の撮像が行われる。この画像処理に要する時間は、CCDカメラの解像度、すなわち受光領域に配列された光電素子の個数と相関しており、光電素子の個数が多いほど画像処理に要する時間が長くなる。そのため、比較的小さな電子部品や少数の電子部品など、比較的小さな対象を撮像する場合には、受光領域を部分的に遮光板で覆い、受光領域に撮像対象の形態に対応した形態の遮光領域を形成し、受光する光電素子の個数を減らすことで画像処理に要する時間の短縮する手法が提案されている(特許文献1参照)。
特開平8−214128号公報
In the mounting field where electronic components are mounted on a substrate, the position and angle of the electronic component are recognized based on an image obtained by picking up the picked-up electronic component, and after being corrected to a normal position and angle, mounted on the substrate, The mounting accuracy is improved. A CCD camera is widely used for imaging electronic components, and the electronic components are imaged in a light receiving area configured by arranging a plurality of photoelectric elements in a predetermined area, and the amount of light received by each photoelectric element is converted into an electrical signal. An image of the electronic component is captured by performing image processing on the processed image. The time required for this image processing correlates with the resolution of the CCD camera, that is, the number of photoelectric elements arranged in the light receiving area. The larger the number of photoelectric elements, the longer the time required for image processing. Therefore, when imaging a relatively small object such as a relatively small electronic component or a small number of electronic components, the light-receiving area is partially covered with a light-shielding plate, and the light-shielding area has a shape corresponding to the form of the object to be imaged. A method for shortening the time required for image processing by reducing the number of photoelectric elements that receive light is proposed (see Patent Document 1).
JP-A-8-214128

このような手法によれば、撮像対象となる電子部品の形態が変更される度に遮光領域を対応する形態に形成することで、画像処理時間を累積的に削減することができ、実装効率の向上に資することができるが、電子部品の形態と遮光領域の形態が正確に対応していないと、電子部品の一部が遮光領域に入ってしまうことがある。このような場合には、電子部品の全体画像が正確に撮像されないので、電子部品の位置および角度が誤って認識され、結果として実装精度に悪影響を与えることになる。   According to such a method, every time the form of the electronic component to be imaged is changed, the light shielding region is formed in a corresponding form, so that the image processing time can be cumulatively reduced, and the mounting efficiency is improved. Although it can contribute to improvement, if the form of the electronic component and the form of the light shielding area do not correspond accurately, a part of the electronic component may enter the light shielding area. In such a case, since the entire image of the electronic component is not accurately captured, the position and angle of the electronic component are erroneously recognized, resulting in an adverse effect on the mounting accuracy.

そこで本発明は、撮像対象を正確に撮像するとともに画像処理に要する時間を短縮することができる撮像装置を提供することを目的とする。 Accordingly, the present invention aims at providing an imaging equipment which can shorten the time required for image processing with accurately imaging the imaging object.

請求項1に記載の撮像装置は、電子部品を基板に実装する電子部品実装装置のヘッドのノズルに吸着された電子部品を撮像する撮像装置であって、複数の光電素子を配列した受光領域と、前記複数の光電素子の何れかを遮光することにより電子部品に対応した形態の遮光領域を前記受光領域に形成する遮光領域形成手段と、各光電素子の受光量に対応した電気信号を出力する出力手段と、前記受光領域を照射する照射手段と、前記照射手段により前記受光領域が照射されたときの前記出力手段からの出力に基づいて前記受光領域に形成された前記遮光領域の形態を確認する遮光領域形態確認手段と、を備え、前記遮光領域形成手段は、大きさが異なる第1のパターン孔と第2のパターン孔が形成された遮光板から成り、水平移動することで前記第1のパターン孔と前記第2のパターン孔を切り換え、前記第1のパターン孔は、前記受光領域を構成する前記複数の光電素子のうち両端にある光電素子が遮光され、電子部品と相対する位置にある受光素子のみが受光可能となるように形成され、前記第2のパターン孔は、前記受光領域を構成する前記複数の光電素子のうち両端と中央にある光電素子が遮光され、2つの電子部品と相対する位置にある受光素子のみが受光可能となるように形成されたThe imaging device according to claim 1 is an imaging device that images an electronic component adsorbed by a nozzle of a head of an electronic component mounting device that mounts the electronic component on a substrate, and a light receiving region in which a plurality of photoelectric elements are arranged; A light shielding region forming means for forming a light shielding region in a form corresponding to an electronic component by shielding any one of the plurality of photoelectric elements in the light receiving region, and an electric signal corresponding to the amount of light received by each photoelectric element. Confirming the form of the light shielding area formed in the light receiving area based on the output from the output means, the irradiation means for irradiating the light receiving area, and the output means when the light receiving area is irradiated by the irradiating means comprising a light shielding region forms confirmation means, wherein the light-shielding region forming means comprises a first pattern holes and a second pattern holes having different sizes are formed light shielding plate, before by horizontal movement Switching between the first pattern hole and the second pattern hole, the photoelectric elements at both ends of the plurality of photoelectric elements constituting the light receiving region are shielded from light and the first pattern hole is opposed to the electronic component. It is formed so that only the light receiving element at the position can receive light, and the second pattern hole shields light from the photoelectric elements at both ends and the center among the plurality of photoelectric elements constituting the light receiving region. Only the light receiving element located at a position facing the electronic component can receive light .

請求項2に記載の撮像装置は、請求項1に記載の撮像装置において、確認された遮光領域の形態が撮像対象の電子部品の形態に対応していない場合には、前記遮光板を水平移動させて遮光領域の形態を変更するThe imaging device according to claim 2 is the imaging device according to claim 1, wherein when the form of the confirmed light shielding area does not correspond to the form of the electronic component to be imaged, the light shielding plate is moved horizontally. To change the shape of the light shielding area .

本発明によれば、撮像対象の形態と受光領域に形成された遮光領域の形態との対応関係を確認し、対応していなければ対応する形態の遮光領域に変更することで、撮像対象を正確に撮像するとともに画像処理に要する時間を短縮することができる。   According to the present invention, the correspondence between the form of the imaging target and the form of the light-shielding area formed in the light-receiving area is confirmed. The time required for image processing and image processing can be reduced.

本発明の実施の形態について図面を参照して説明する。図1は本発明の実施の形態の電子部品実装装置の平面図、図2は本発明の実施の形態の電子部品実装装置の側面図、図3は本発明の実施の形態の撮像装置の平面図、図4は本発明の実施の形態の撮像装置の側面図、図5は本発明の実施の形態の撮像装置の側面図、図6は本発明の実施の形態の撮像装置の制御系の構成図、図7は本発明の実施の形態の電子部品実装装置における遮光領域形態の確認動作を示すフローチャートである。   Embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 3 is a plan view of the imaging apparatus according to the embodiment of the present invention. 4 is a side view of the imaging apparatus according to the embodiment of the present invention, FIG. 5 is a side view of the imaging apparatus according to the embodiment of the present invention, and FIG. 6 is a control system of the imaging apparatus according to the embodiment of the present invention. FIG. 7 is a flow chart showing the confirmation operation of the light shielding region form in the electronic component mounting apparatus according to the embodiment of the present invention.

図1および図2において、電子部品実装装置1は、電子部品の実装対象となる基板2を所定の位置に搬送する搬送レール3と、それぞれ複数の電子部品を供給可能に収納する複数のパーツフィーダ4と、パーツフィーダ4から供給される電子部品を複数のノズル5で吸着して基板2に移載するヘッド6と、ヘッド6をパーツフィーダ4と基板2の上方で水平移動させる水平移動手段であるXY直交ロボット7と、ノズル5に吸着された電子部品を下方から撮像する部品撮像手段であるカメラ8と、ヘッド6に一体的に備えられ、下方に向けて光を照射する照射手段であるライト9と、を備えている。   1 and 2, an electronic component mounting apparatus 1 includes a transport rail 3 that transports a substrate 2 on which electronic components are to be mounted to a predetermined position, and a plurality of parts feeders that each store a plurality of electronic components so that they can be supplied. 4, a head 6 that picks up an electronic component supplied from the parts feeder 4 by a plurality of nozzles 5 and transfers it to the substrate 2, and a horizontal moving means that horizontally moves the head 6 above the parts feeder 4 and the substrate 2. An XY orthogonal robot 7, a camera 8 that is a component imaging unit that captures an electronic component adsorbed by the nozzle 5 from below, and an irradiation unit that is provided integrally with the head 6 and irradiates light downward. And a light 9.

図3において、上部に透光用のスリット10が設けられた遮光性の筐体11内にCCDカメラが内蔵されている。図4において、CCDカメラは、線状に配列された複数の光電素子12と、各光電素子12に対応して配列された複数のCCD素子13と、出力アンプ14とで構成されている。撮像対象の電子部品をスリット10の上方に配置すると、電子部品の各部と対応する位置にある各光電素子12がスリット10を透過した光を受光する。CCD素子13は、光電素子12の受光量に対応した電荷を出力アンプ14に転送する。出力アンプ14は、各光電素子12の受光量に対応した電子信号を出力する出力手段として機能し、各CCD素子13から転送されてきた電荷を電気信号に変換して画像処理部15に出力する。画像処理部15は、入力された電気信号を処理して画像を構成する。画像処理部15には位置認識部15aが含まれており、電子部品の位置および角度を認識する。なお、カメラ8は、光電素子12を線状に配列したラインカメラであるので、一度に光電変換できるのは線状の一次元像のみである。従って、二次元像である電子部品の画像を得るために、電子部品を吸着したノズル5を光電素子12の配列方向と交差する方向に一定の速度で移動させ、電子部品を複数の一次元像に分割して撮像する。   In FIG. 3, a CCD camera is built in a light-shielding housing 11 having a light-transmitting slit 10 provided at the top. In FIG. 4, the CCD camera includes a plurality of photoelectric elements 12 arranged linearly, a plurality of CCD elements 13 arranged corresponding to each photoelectric element 12, and an output amplifier 14. When the electronic component to be imaged is disposed above the slit 10, each photoelectric element 12 at a position corresponding to each part of the electronic component receives light transmitted through the slit 10. The CCD element 13 transfers charges corresponding to the amount of light received by the photoelectric element 12 to the output amplifier 14. The output amplifier 14 functions as an output unit that outputs an electronic signal corresponding to the amount of light received by each photoelectric element 12, converts the electric charge transferred from each CCD element 13 into an electric signal, and outputs the electric signal to the image processing unit 15. . The image processing unit 15 processes the input electrical signal to form an image. The image processing unit 15 includes a position recognition unit 15a and recognizes the position and angle of the electronic component. Since the camera 8 is a line camera in which the photoelectric elements 12 are arranged in a line, only a linear one-dimensional image can be converted at a time. Therefore, in order to obtain an image of the electronic component which is a two-dimensional image, the nozzle 5 that has attracted the electronic component is moved at a constant speed in a direction intersecting the arrangement direction of the photoelectric elements 12, and the electronic component is displayed in a plurality of one-dimensional images. The image is divided into two.

図3において、筐体11の上方には遮光板16が設けられている。遮光板16は、筐体11の上部に沿って一方向に往復移動可能であり、移動した位置により、複数の光電素子12が配列された受光領域に遮光領域を形成する機能を備えている。遮光板16には、大きさが異なる透光用の第1のパターン孔16aと第2のパターン孔16bが形成されており、図3(a)に示すように遮光板16を筐体11の一端側に移動させると、スリット10の上方に第1のパターン孔16aが配置され、透光可能な面積がスリット10の開口面積から第1のパターン孔16aの開口面積まで縮小された状態となる。これにより、図4(a)に示すように、受光領域を構成する複数の光電素子12のうち両端にある光電素子12aが遮光され、電子部品P1と相対する位置にある受光素子12bのみが受光可能となる。 In FIG. 3, a light shielding plate 16 is provided above the housing 11. The light shielding plate 16 can reciprocate in one direction along the upper portion of the housing 11 and has a function of forming a light shielding region in a light receiving region in which a plurality of photoelectric elements 12 are arranged depending on the moved position. The light shielding plate 16 is formed with a first pattern hole 16a and a second pattern hole 16b for light transmission having different sizes . The light shielding plate 16 is attached to the casing 11 as shown in FIG. When the first pattern hole 16a is disposed above the slit 10, the translucent area is reduced from the opening area of the slit 10 to the opening area of the first pattern hole 16a. Become. As a result, as shown in FIG. 4A, among the plurality of photoelectric elements 12 constituting the light receiving region, the photoelectric elements 12a at both ends are shielded from light, and only the light receiving element 12b at a position facing the electronic component P1 receives light. It becomes possible.

一方、図3(b)に示すように遮光板16を筐体11の他端側に移動させると、スリット10の上方に2つの第2のパターン孔16bが配置され、透光可能な面積がスリット10の開口面積から2つの第2のパターン孔16の開口面積まで縮小された状態となる。これにより、図4(b)に示すように、受光領域を構成する複数の光電素子12のうち両端と中央にある光電素子12cが遮光され、2つの電子部品P2と相対する位置にある受光素子12dのみが受光可能となる。遮光板16の移動は、遮光板駆動モータ17の駆動により制御され、筐体11の側部に沿って一方向に延伸された送りねじ18を遮光板駆動モータ17の駆動により正逆回転させることで、送りねじ18に螺合するナット19と連結された遮光板16が筐体11の上部に沿って一方向に往復移動する。 On the other hand, when the light shielding plate 16 is moved to the other end side of the housing 11 as shown in FIG. 3B, the two second pattern holes 16b are arranged above the slit 10, and the light transmissive area is increased. The state is reduced from the opening area of the slit 10 to the opening area of the two second pattern holes 16b . As a result, as shown in FIG. 4B, among the plurality of photoelectric elements 12 constituting the light receiving region, the photoelectric elements 12c at both ends and the center are shielded from light, and the light receiving elements are positioned opposite to the two electronic components P2. Only 12d can receive light. The movement of the light shielding plate 16 is controlled by driving the light shielding plate driving motor 17, and the feed screw 18 extended in one direction along the side portion of the housing 11 is rotated forward and backward by driving the light shielding plate driving motor 17. Thus, the light shielding plate 16 connected to the nut 19 screwed to the feed screw 18 reciprocates in one direction along the upper portion of the housing 11.

このように、遮光板16は、遮光板駆動モータ17の駆動により筐体11の上部を水平移動することで第1のパターン孔16aと第2のパターン孔16bを切り換えて、複数の光電素子12の何れかを遮光することにより撮像対象となる電子部品の形態に対応した形態の遮光領域を受光領域に形成する遮光領域形成手段として機能し、撮像に必要ない領域にある光電素子が受光しないようにすることで、画像処理時間が短縮される。 As described above, the light shielding plate 16 switches the first pattern hole 16 a and the second pattern hole 16 b by horizontally moving the upper portion of the housing 11 by the drive of the light shielding plate driving motor 17. The light-shielding region forming means for forming a light-shielding region corresponding to the form of the electronic component to be imaged in the light-receiving region by shielding one of the light-shielding elements so that photoelectric elements in the region not necessary for imaging do not receive light By doing so, the image processing time is shortened.

図5(a)において、遮光板16の上方に位置するライト9によりパターン孔16aを照射すると、受光領域に配列された複数の光電素子12のうち両端の光電素子12aは受光せず、その間の光電素子12bのみが受光する。一方、図5(b)において、パターン孔16bを照射すると、受光領域に配列された複数の光電素子12のうち両端と中央の光電素子12cは受光せず、その間に位置する光電素子12dのみが受光する。各光電素子12の受光量に対応して出力アンプ14から出力された電気信号は画像処理部15において処理される。画像処理部15には、遮光領域形態確認部15bが含まれており、入力された電気信号に基づいて受光領域に形成された遮光領域の形態を確認する遮光領域形態確認手段として機能する。出力アンプ14から出力される電気信号は、各光電素子12の受光量に対応しているので、電気信号の波形20a、20bから受光領域に形成された遮光領域の形態を確認することができる。   In FIG. 5A, when the pattern hole 16a is irradiated by the light 9 located above the light shielding plate 16, the photoelectric elements 12a at both ends among the plurality of photoelectric elements 12 arranged in the light receiving region do not receive light. Only the photoelectric element 12b receives light. On the other hand, in FIG. 5B, when the pattern hole 16b is irradiated, the photoelectric elements 12c at both ends and the center of the plurality of photoelectric elements 12 arranged in the light receiving region do not receive light, and only the photoelectric element 12d positioned therebetween is received. Receive light. The electric signal output from the output amplifier 14 corresponding to the amount of light received by each photoelectric element 12 is processed in the image processing unit 15. The image processing unit 15 includes a light shielding region form confirmation unit 15b, and functions as a light shielding region form confirmation unit that confirms the form of the light shielding region formed in the light receiving region based on the input electric signal. Since the electrical signal output from the output amplifier 14 corresponds to the amount of light received by each photoelectric element 12, the form of the light shielding region formed in the light receiving region can be confirmed from the waveforms 20a and 20b of the electrical signal.

図6において、制御部21は、予め設定されたプログラムに基づいて電子部品実装装置における実装動作の制御を行う。ヘッド駆動部22は、XY直交ロボット7の駆動部であるX軸モータ23、Y軸モータ24と、各ノズル5を鉛直方向(Z方向)に移動させるZ軸モータ25と、各ノズル5を軸心周り(θ方向)に回転させる回転手段であるθ軸モータ26とで構成されている。ヘッド駆動部22の駆動により、各ノズル5は電子部品をパーツフィーダ4から吸着し、電子部品の撮像のためカメラ8の上方を撮像方向に移動する。このとき、電子部品の形態に他対応した撮像パターンを形成するため、遮光板16は遮光板駆動モータ17の駆動により対応する位置に移動している。各ノズル5は、画像処理部15により認識された電子部品の位置や角度に基づいてXY方向における位置およびθ方向における回転角を変更し、電子部品の位置や角度の補正を行い、補正後の電子部品を基板2に移載する。また、制御部21は、選択された撮像パターンの判定動作のため、カメラ8、ライト9、画像処理部15、遮光板駆動モータ17、出力解析部20、ヘッド駆動部22の動作制御を行う。   In FIG. 6, the control unit 21 controls the mounting operation in the electronic component mounting apparatus based on a preset program. The head drive unit 22 includes an X-axis motor 23 and a Y-axis motor 24 that are drive units of the XY orthogonal robot 7, a Z-axis motor 25 that moves each nozzle 5 in the vertical direction (Z direction), and each nozzle 5. It is comprised with the (theta) axis | shaft motor 26 which is a rotation means to rotate the center circumference ((theta) direction). By driving the head drive unit 22, each nozzle 5 sucks the electronic component from the parts feeder 4 and moves above the camera 8 in the imaging direction for imaging the electronic component. At this time, the light shielding plate 16 is moved to a corresponding position by driving the light shielding plate driving motor 17 in order to form an imaging pattern corresponding to the form of the electronic component. Each nozzle 5 changes the position in the XY direction and the rotation angle in the θ direction based on the position and angle of the electronic component recognized by the image processing unit 15 to correct the position and angle of the electronic component. The electronic component is transferred to the substrate 2. The control unit 21 controls operations of the camera 8, the light 9, the image processing unit 15, the light shielding plate drive motor 17, the output analysis unit 20, and the head drive unit 22 for the determination operation of the selected imaging pattern.

図7は遮光領域の形態を確認する際の一連の動作をフローチャートで示している。まず、ヘッド駆動部22の駆動によりライト9をカメラ8の上方に移動させ(ST1)、その位置で下方にある受光領域を照射する(ST2)。遮光領域形態確認部15bは出力波形の解析から受光領域に形成された遮光領域の形態を確認する(ST3)。確認された遮光領域形態が撮像対象の電子部品の形態に対応していない場合には、遮光板16を水平移動させて遮光領域形態を変更し(ST4)、再度、遮光領域形態確認(ST3)を行う。一方、電子部品の形態に対応している場合、また、変更後の遮光領域形態が撮像対象の電子部品の形態に対応した場合には、確認動作を終了し、通常の実装動作に戻る。 FIG. 7 is a flowchart showing a series of operations when confirming the form of the light shielding area. First, the light 9 is moved above the camera 8 by driving the head drive unit 22 (ST1), and the light receiving region below is irradiated at that position (ST2). The light shielding area form confirmation unit 15b confirms the form of the light shielding area formed in the light receiving area from the analysis of the output waveform (ST3). If the confirmed light shielding area form does not correspond to the form of the electronic component to be imaged, the light shielding plate 16 is moved horizontally to change the light shielding area form (ST4), and again the light shielding area form confirmation (ST3). I do. On the other hand, when it corresponds to the form of the electronic component, or when the changed light shielding area form corresponds to the form of the electronic component to be imaged, the confirmation operation is terminated and the normal mounting operation is resumed.

このように、受光領域に形成された遮光領域形態の確認を行うことで、電子部品の形態と遮光領域の形態を正確に対応させることが可能となり、電子部品の全体像を正確に撮像することができる。   In this way, by checking the form of the light shielding area formed in the light receiving area, it becomes possible to accurately correspond the form of the electronic component and the form of the light shielding area, and accurately capture the entire image of the electronic component. Can do.

本発明によれば、撮像対象の形態と受光領域に形成された遮光領域の形態との対応関係を確認し、対応していなければ対応する形態の遮光領域に変更することで、撮像対象を正
確に撮像するとともに画像処理に要する時間を短縮することができるという利点を有し、電子部品の実装分野において有用である。
According to the present invention, the correspondence between the form of the imaging target and the form of the light-shielding area formed in the light-receiving area is confirmed. In addition, it has the advantage that the time required for image processing can be reduced and the time required for image processing can be shortened, which is useful in the field of mounting electronic components.

本発明の実施の形態の電子部品実装装置の平面図The top view of the electronic component mounting apparatus of embodiment of this invention 本発明の実施の形態の電子部品実装装置の側面図The side view of the electronic component mounting apparatus of embodiment of this invention 本発明の実施の形態の撮像装置の平面図The top view of the imaging device of an embodiment of the invention 本発明の実施の形態の撮像装置の側面図The side view of the imaging device of embodiment of this invention 本発明の実施の形態の撮像装置の側面図The side view of the imaging device of embodiment of this invention 本発明の実施の形態の撮像装置の制御系の構成図1 is a configuration diagram of a control system of an imaging apparatus according to an embodiment of the present invention. 本発明の実施の形態の電子部品実装装置における遮光領域形態の確認動作を示すフローチャートThe flowchart which shows the confirmation operation | movement of the light shielding area form in the electronic component mounting apparatus of embodiment of this invention

符号の説明Explanation of symbols

9 ライト
12 光電素子
14 出力アンプ
15b 遮光領域形態確認部
16 遮光板
9 Light 12 Photoelectric element 14 Output amplifier 15b Light shielding area form confirmation part 16 Light shielding plate

Claims (2)

電子部品を基板に実装する電子部品実装装置のヘッドのノズルに吸着された電子部品を撮像する撮像装置であって、
複数の光電素子を配列した受光領域と、
前記複数の光電素子の何れかを遮光することにより電子部品に対応した形態の遮光領域を前記受光領域に形成する遮光領域形成手段と、
各光電素子の受光量に対応した電気信号を出力する出力手段と、
前記受光領域を照射する照射手段と、
前記照射手段により前記受光領域が照射されたときの前記出力手段からの出力に基づいて前記受光領域に形成された前記遮光領域の形態を確認する遮光領域形態確認手段と、
を備え
前記遮光領域形成手段は、大きさが異なる第1のパターン孔と第2のパターン孔が形成された遮光板から成り、水平移動することで前記第1のパターン孔と前記第2のパターン孔を切り換え、
前記第1のパターン孔は、前記受光領域を構成する前記複数の光電素子のうち両端にある光電素子が遮光され、電子部品と相対する位置にある受光素子のみが受光可能となるように形成され、
前記第2のパターン孔は、前記受光領域を構成する前記複数の光電素子のうち両端と中央にある光電素子が遮光され、2つの電子部品と相対する位置にある受光素子のみが受光可能となるように形成されたことを特徴とすることを特徴とする撮像装置。
An imaging device for imaging an electronic component adsorbed by a nozzle of a head of an electronic component mounting apparatus that mounts the electronic component on a substrate,
A light receiving region in which a plurality of photoelectric elements are arranged; and
A light shielding region forming means for forming a light shielding region of a form corresponding to an electronic component in the light receiving region by shielding any of the plurality of photoelectric elements;
Output means for outputting an electrical signal corresponding to the amount of light received by each photoelectric element;
Irradiating means for irradiating the light receiving region;
A light shielding area form confirmation means for confirming a form of the light shielding area formed in the light receiving area based on an output from the output means when the light receiving area is irradiated by the irradiation means;
Equipped with a,
The light-shielding region forming means includes a light-shielding plate having a first pattern hole and a second pattern hole having different sizes, and moves the first pattern hole and the second pattern hole by moving horizontally. switching,
The first pattern hole is formed such that photoelectric elements at both ends of the plurality of photoelectric elements constituting the light receiving region are shielded from light, and only the light receiving elements at positions facing the electronic component can receive light. ,
In the second pattern hole, among the plurality of photoelectric elements constituting the light receiving region, the photoelectric elements at both ends and the center are shielded, and only the light receiving elements at positions facing the two electronic components can receive light. An imaging apparatus characterized by being formed as described above .
確認された遮光領域の形態が撮像対象の電子部品の形態に対応していない場合には、前記遮光板を水平移動させて遮光領域の形態を変更することを特徴とする請求項1に記載の撮像装置。The shape of the light shielding region is changed by horizontally moving the light shielding plate when the confirmed shape of the light shielding region does not correspond to the shape of the electronic component to be imaged. Imaging device.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1126558A (en) * 1997-07-08 1999-01-29 Nikon Corp Pre-alignment device
JP2000241116A (en) * 1999-02-23 2000-09-08 Matsushita Electric Ind Co Ltd Image reading device
JP2006018567A (en) * 2004-07-01 2006-01-19 Canon Inc Light-shielding type coordinate input device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1126558A (en) * 1997-07-08 1999-01-29 Nikon Corp Pre-alignment device
JP2000241116A (en) * 1999-02-23 2000-09-08 Matsushita Electric Ind Co Ltd Image reading device
JP2006018567A (en) * 2004-07-01 2006-01-19 Canon Inc Light-shielding type coordinate input device

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