JP4645222B2 - Multilayer wiring board and connection structure of multilayer wiring board - Google Patents

Description

  The present invention relates to a multilayer wiring board in which wiring patterns are formed in a plurality of layers insulated by an insulating layer, and a connection structure of the multilayer wiring board.

In a multilayer printed circuit board, a technology is known in which a ground pattern formed around the component mounting surface of a substrate and a ground formed over the entire back surface of the substrate are conducted through a through hole recessed in the end surface of the substrate. (For example, refer to Patent Document 1). In this configuration, since no reactance is generated between the end face of the substrate and the through hole, the ground of the ground pattern on the component mounting surface is stabilized.
JP 7-254784 A

  However, the conventional technology as described above has a structure in which each layer is conducted through a through hole, and therefore there is no conduction between adjacent through holes. For this reason, in this technique, in order to suppress noise from between the through-holes to the outside of the substrate, it is necessary to take a measure for setting the entire surface of the lowermost layer to the ground. As described above, the conductive structures of different conductive layers have limitations in arrangement, number, dimensions, and the like, and there is room for improvement.

  In view of the above fact, an object of the present invention is to obtain a multilayer wiring board capable of conducting different conductive layers at an interlayer conductive portion with few restrictions. Another object of the present invention is to obtain a multilayer wiring board connection structure suitable for the multilayer wiring board.

A multilayer wiring board according to the first aspect of the present invention in order to achieve the above object, a multilayer wiring substrate in which an insulating layer is laminated on at least two conductive layers, formed on the end surface along the base plate periphery and the stacking direction And an interlayer conductive portion for conducting the ground patterns formed at the peripheral portions of the two conductive layers arranged on the outermost side in the laminating direction, and a signal contact in the conductive layer arranged on the outermost side in the laminating direction. A connector portion connected to a mating connector, and the interlayer conductive portion formed on the end surface of the connector portion is connected to the mating connector. It contacts the ground conduction part provided in the connector in a conductive state .

  In the multilayer wiring board according to claim 1, the interlayer conductive portion formed on both the peripheral edge of the substrate and the end face along the lamination (plate thickness direction) direction includes at least a part of the plurality of conductive layers (wiring patterns formed therein). Conducted. Since the interlayer conductive part is formed on the end face of the substrate, there is no restriction on the arrangement and dimensions of the interlayer conductive part (the length along the circumferential direction of the substrate, etc.), and each layer is effectively conducted to obtain the required performance. Can do. Moreover, the interlayer conductive portion formed on the substrate end face does not impair the mounting area of the multilayer wiring board at all.

  As described above, in the multilayer wiring board according to the first aspect, different conductive layers can be conducted at an interlayer conduction portion with few restrictions. The interlayer conductive portion can be easily formed by, for example, metal plating.

Further, in this multilayer wiring board, the ground patterns formed on the front and back surfaces (each outermost layer) are electrically connected to each other at the interlayer conductive portion on the end face of the substrate. Since the inter-layer conductive portion with no length limitation in the circumferential direction of the substrate is conducted through the front and back ground patterns formed along the peripheral edge of the substrate, in other words, the front and back ground patterns are continuously provided over the required length. Therefore, for example, noise generated by the substrate can be effectively suppressed.
Furthermore, in this multilayer wiring board, when the connector portion is connected to the mating connector, the interlayer conducting portion formed on the end face of the connector portion contacts the ground conducting portion provided in the mating connector. Thereby, for example, even when it is difficult to connect the ground to the device main body by using a single multilayer wiring board, the ground pattern of the printed circuit board can be connected to the ground via the counterpart connector on the device side.

A multilayer wiring board according to a second aspect of the present invention is the multilayer wiring board according to the first aspect, wherein the interlayer conductive portion is formed endlessly over the entire circumference of the substrate end face.

The multilayer wiring board according to claim 2 , wherein the endless interlayer conductive portion is formed so as to continuously surround the end surface of the substrate over the entire circumference, and constitutes an endless ground pattern which is continuous in the circumferential direction. To do. Thereby, for example, noise generation from the substrate is effectively suppressed.

According to a third aspect of the present invention, there is provided a connection structure for a multilayer wiring board, comprising: a connector portion of a multilayer wiring board having an insulating layer between at least two conductive layers; The interlayer conductive portion is formed on the peripheral surface of the multilayer wiring substrate and the end surface along the stacking direction, and the two conductive layers arranged on the outermost side in the stacking direction The ground pattern formed on the peripheral edge of each other is electrically connected to each other, and the connector part is configured by forming a signal contact in a conductive layer arranged on the outermost side in the stacking direction of the multilayer wiring board. the mating connector, ground the interlayer conductive portion in the connected state of the connector portion to the mating connector toward the insertion direction of the connector portion is in contact Provided with a through part.

In the connection structure of the multilayer wiring board according to claim 3 , when the connector part of the printed board is connected to the mating connector, the interlayer conduction part formed on the end face of the connector part contacts the ground conduction part provided in the mating connector. To do. Thereby, for example, even when it is difficult to ground the printed circuit board alone with the device main body, the ground pattern of the printed circuit board can be connected to the ground via the counterpart connector on the device side.

A multilayer wiring board connection structure according to a fourth aspect of the present invention is the multilayer wiring board connection structure according to the third aspect , wherein the ground conductive portion is a metal leaf spring that is pressed against the interlayer conductive portion by an elastic force. including.

In the connection structure of the multilayer wiring board according to claim 4, the interlayer conductive portion formed on the end surface of the connector portion presses the leaf spring of the ground conductive portion elastically as the connector portion is connected to the mating connector. Deform. Thereby, a leaf | plate spring is press-contacted to an interlayer conduction | electrical_connection part, and these carry out reliably.

  As described above, the multilayer wiring board according to the present invention has an excellent effect that different conductive layers can be electrically connected by an interlayer conductive portion with few restrictions. The multilayer wiring board connection structure according to the present invention has an excellent effect of providing a connection method suitable for the multilayer wiring board.

A multilayer printed wiring board 10 as a multilayer wiring board according to a reference example will be described with reference to FIG. FIG. 1A shows a component mounting surface 12 of the multilayer printed wiring board 10 in a front view, and FIG. 1B shows the multilayer printed wiring board 10 in a side view. . FIG. 1C shows a partially enlarged side sectional view of the multilayer printed wiring board 10.

As shown in FIG. 1C, the multilayer printed wiring board 10 has a first conductive layer 16 laminated on the component mounting surface 12 side of the substrate body 14 and a back surface opposite to the component mounting surface of the substrate body 14. The second conductive layer 20 is laminated on the 18 side. The substrate body 14 has a structure in which an insulating substrate alone or an intermediate conductive layer and an insulating layer (not shown) are further stacked on the insulating substrate, and includes the insulating layer in the present invention. A description of the intermediate conductive layer is omitted. In this reference example , the first conductive layer 16 and the second conductive layer 20 are each made of copper which is a metal conductor.

As shown in FIG. 1A, on the component mounting surface 12 side, a ground pattern 22 is provided on the first conductive layer 16 along the peripheral edge of the multilayer printed wiring board 10 formed in a rectangular shape. The ground pattern 22 formed in a frame shape surrounds a wiring pattern (not shown) of the component mounting surface 12 formed by the first conductive layer 16. In this reference example , the ground pattern 22 is notched at the attachment site of the connector component 24.

  On the other hand, as shown in FIG. 1C, a ground pattern 26 is provided on the second conductive layer 20 on the back surface 18 of the multilayer printed wiring board 10. Although not shown, the ground pattern 26 is formed in a shape corresponding to the ground pattern 22 along the periphery of the back surface 18. The ground pattern 26 may be formed in an endless shape without being cut out at the attachment part of the connector component 24.

  Screw through holes 28 are respectively provided in the four corners of the rectangular multilayer printed wiring board 10 so as to penetrate in the plate thickness direction, and are used for attachment to an applicable device. The ground patterns 22 and 26 on the front and back sides respectively surround the screw through holes 28 and are configured to be electrically connected to the ground on the device side through screws (screws) for fixing to the device.

1B and 1C, the end face 10A of the multilayer printed wiring board 10, that is, the end face of the multilayer substrate in which the first and second conductive layers 16 and 20 are laminated on the substrate main body 14. In 10A, an interlayer conductive portion 30 is formed. The interlayer conductive portion 30 is formed by conductive metal plating, and is joined to the ground patterns 22 and 26 to conduct between the ground patterns 22 and 26 as shown in FIG. In this reference example , the interlayer conductive portion 30 is formed in an endless manner so as to cover the end face 10 </ b> A over the entire circumference of the multilayer printed wiring board 10. Therefore, in the multilayer printed wiring board 10, the ground patterns 22 and 26 are electrically connected over the entire length, and are not cut off at the attachment site of the connector component 24 by the interlayer conductive portion 30 (see FIG. 1B). ) An endless ground pattern is formed.

Next, the operation of this reference example will be described.

In the multilayer printed wiring board 10 having the above configuration, the interlayer conductive portion 30 that conducts the ground patterns 22 and 26 is formed on the end surface 10A along the circumferential direction and the thickness direction. Unlike the configuration for conducting the pattern, there is no restriction on the arrangement and dimensions (the length in the circumferential direction) of the interlayer conductive portion 30. For this reason, the structure which covers the end surface 10A of the multilayer printed wiring board 10 with the interlayer conduction | electrical_connection part 30 over the perimeter was realized like this reference example .

  Since the interlayer conductive portion 30 formed over the entire circumference forms an endless ground pattern, there is no noise generation site between conventional through holes, and noise generation from the multilayer printed wiring board 10 is eliminated. It can be prevented or effectively suppressed. Moreover, the interlayer conductive portion 30 formed on the end face 10A does not impair the mounting area of the multilayer printed wiring board 10 at all.

As described above, in the multilayer printed wiring board 10 according to the reference example , the ground patterns 22 and 26 of the different conductive layers 16 and 20 can be conducted by the interlayer conductive portion 30 with few restrictions.

(Implementation form)
Next, a multilayer printed wiring board 40 according to the implementation embodiments of the present invention will be described with reference to FIGS. It should be noted that the above reference example are basically the same components and parts, and the description thereof is omitted denoted by the same reference numerals as in Reference Example.

Figure 2 is a multi-layer printed wiring board 40 according to the implementation embodiments of the present invention in a perspective view. As shown in this figure, the multilayer printed wiring board 40 is different from the multilayer printed wiring board 40 in that a connector portion 42 is provided instead of the connector component 24. The connector portion 42 extends from the central portion of one side of the multilayer printed wiring board 40, and a plurality of signal contacts (terminals) 44 are formed on the first conductive layer 16 and the second conductive layer 20, respectively. (Refer to FIG. 4 for the signal contact 44 on the back surface 18 side).

  In the multilayer printed wiring board 40, the ground patterns 22 and 26 are formed except for the tip end portion (arrow A side end portion) of the connector portion 42, and the interlayer conductive portion 30 extends over the entire circumference including the connector portion 42. Is formed. A portion of the interlayer conductive portion 30 that covers the distal end surface of the connector portion 42 in the insertion direction (arrow A direction) into the connector 48 described later is referred to as a daughter-side ground connection portion 30A. Further, the multilayer printed wiring board 40 is not provided with the screw through holes 28. Other configurations of the multilayer printed wiring board 40 are the same as the corresponding configurations of the multilayer printed wiring board 10.

  The multilayer printed wiring board 40 described above is a so-called daughter board. As shown in FIG. 3, the connector portion 42 is connected to a connector 48 (female connector) as a mating connector constituting the mother board 46. It is inserted (fitted) along the direction to be electrically and mechanically connected. As shown in FIG. 4, the connector 48 of the mother board 46 includes signal contacts 50 that contact the corresponding signal contacts 44 of the multilayer printed wiring board 40.

  Further, in the connector 48, as a ground conduction part for contact with the daughter-side ground connection part 30A (interlayer conduction part 30) of the multilayer printed wiring board 40 (connector part 42) inserted and fixed in the connector 48. The mother-side ground connection portion 52 is provided. The mother-side ground connection portion 52 includes a conductive contact spring 52A as a leaf spring supported so as to face the daughter-side ground connection portion 30A in the connector 48 (housing), and the contact spring 52A and the mother board 46. It is comprised with the earth | ground conduction | electrical_connection part 52B which conducts the ground pattern which is not shown in figure. A ground pattern (not shown) of the mother board 46 is electrically connected to the ground wire of the applicable device (not shown).

  When the connector portion 42 of the multilayer printed wiring board 40, which is a daughter board, is inserted into the connector 48 of the mother board 46, each signal contact 44 contacts the signal contact 50 in a conductive state, and the daughter-side ground connection portion 30A The contact spring 52A is brought into contact with the contact spring 52A. In this state, the contact spring 52A is configured to be deformed and pressed into contact with the daughter-side ground connection portion 30A by an elastic force. Thereby, the multilayer printed wiring board 40 is electrically connected to the ground of the application device via the mother board 46.

Next, a different part from the reference example in the effect | action of this embodiment is demonstrated.

  The multilayer printed wiring board 40 having the above configuration is connected to the mother board 46 by inserting the connector portion 42 into the connector 48 of the mother board 46. Along with this connection, the daughter-side ground connection portion 30A of the multilayer printed wiring board 40 comes into pressure contact with the contact spring 52A of the mother-side ground connection portion 52, and the mother-side ground connection portion 52 and the ground pattern of the mother board 46 are interposed therebetween. Is connected to the ground of the applicable equipment.

  Thereby, in the multilayer printed wiring board 40 which cannot be electrically connected to the ground of the application device via the screw as in the multilayer printed wiring board 10, the ground patterns 22 and 26 can be electrically connected to the ground of the application device. In addition, the contact area of the ground can be increased, and the ground patterns 22 and 26 can be stabilized. Further, when the mother board 46 is a multilayer printed wiring board, by applying the present invention to the mother board 46 as well, by providing an interlayer conductive portion that covers the end face of the mother board 46 over the entire circumference and conducts the front and back ground patterns. Noise can be reduced as a whole apparatus. Although explanation is omitted, the multilayer printed wiring board 40 can obtain the same effect as the multilayer printed wiring board 10.

In the above reference example and embodiment, the multilayer printed wiring boards 10 and 40 have shown preferable examples having the endless interlayer conductive portion 30, but the present invention is not limited to this, for example, the interlayer conductive portion 30 A discontinuous portion may be set in a part of the circumferential direction.

In the reference example and the embodiment, the example in which the interlayer conductive portion 30 conducts between the ground patterns 22 and 26 in the outermost layer in the stacking direction has been described. However, the present invention is not limited to this example. However, the intermediate conductive layer and the outermost conductive layer may be communicated, different intermediate conductive layers may be conducted, or patterns of three or more layers may be conducted. These conductive layers are not limited to the ground patterns 22 and 26, and may be, for example, a power supply pattern or a signal pattern.

Furthermore, in the above reference examples and embodiments, the example in which the interlayer conductive portion 30 is configured by copper plating is shown. However, the present invention is not limited to this, and for example, the interlayer conductive portion 30 is formed by metal deposition or the like. Also good.

It is a figure which shows the multilayer printed wiring board which concerns on a reference example , Comprising: (A) is a front view, (B) is a side view, (C) is a partially expanded sectional side view. It is a perspective view of a multilayer printed circuit board according to the implementation embodiments of the present invention. It is a schematic side view showing the multilayer printed wiring board and the motherboard according to the implementation embodiments of the present invention. Is a side sectional view showing a structure of a connector multilayer printed wiring board is connected according to the implementation embodiments of the present invention.

Explanation of symbols

10 Multilayer printed circuit board (Multilayer circuit board)
10A end face (end face along substrate periphery and stacking direction)
14 Substrate body (insulating layer)
16 First conductive layer (conductive layer)
20 Second conductive layer (conductive layer)
22 Ground pattern 26 Ground pattern 30 Interlayer conduction part 30A Daughter side ground connection part (the interlayer conduction part facing the connector connection direction)
40 Multilayer printed circuit board (Multilayer circuit board)
42 Connector part 48 Connector (mating connector)
52 Mother-side ground connection (ground conduction)
52A Contact spring (leaf spring)

Claims (4)

A multilayer wiring board in which an insulating layer is laminated between at least two conductive layers,
Formed on the end face along the base plate periphery and the stacking direction, and the interlayer conductive portion to conduct ground between patterns formed on the periphery of the most are located outside the two said conductive layers in the stacking direction,
A signal contact is formed in the conductive layer arranged on the outermost side in the stacking direction, and a connector portion connected to the mating connector;
Have
A multilayer wiring board in which the interlayer conductive portion formed on the end surface of the connector portion contacts the ground conductive portion provided in the counterpart connector in a conductive state in a state where the connector portion is connected to the counterpart connector . The multilayer wiring board according to claim 1 , wherein the interlayer conductive portion is formed endlessly over the entire circumference of the end face of the substrate. A connection structure of a multilayer wiring board for connecting a connector part of a multilayer wiring board having an interlayer conducting part that conducts between the conductive layers while an insulating layer is laminated between at least two conductive layers, and a mating connector,
The interlayer conductive portion is formed on the periphery of the multilayer wiring board and the end surface along the stacking direction, and conducts the ground patterns formed on the peripheral portions of the two conductive layers arranged on the outermost side in the stacking direction. And
The connector part is configured by forming a signal contact in a conductive layer arranged on the outermost side in the stacking direction in the multilayer wiring board,
A connection structure of a multilayer wiring board, wherein the counterpart connector includes a ground conduction portion that contacts the interlayer conduction portion facing the insertion direction in the connector portion in a connected state of the connector portion to the counterpart connector. The multi-layer wiring board connection structure according to claim 3, wherein the ground conductive portion includes a metal leaf spring that is pressed against the interlayer conductive portion by an elastic force.

Images