JP4637268B1 - Light bulb lamp - Google Patents

Light bulb lamp Download PDF

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JP4637268B1
JP4637268B1 JP2010103145A JP2010103145A JP4637268B1 JP 4637268 B1 JP4637268 B1 JP 4637268B1 JP 2010103145 A JP2010103145 A JP 2010103145A JP 2010103145 A JP2010103145 A JP 2010103145A JP 4637268 B1 JP4637268 B1 JP 4637268B1
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emitting element
light emitting
drive circuit
type lamp
wiring
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JP2011233384A (en
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秀一 田端
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ORION ELECTRIC CO., LTD.
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Abstract

【課題】組み立ての簡略化を図った電球型ランプを提供する。
【解決手段】発光素子基板7とその発光素子を駆動する駆動回路部11を接続する配線の貫通孔部を放熱部8の位置決めのための突部に設けることで、配線と組み立ての作業効率の向上を図るとともに、発光素子基板7をリング状取り付け部3と放熱部8とで挟持して配置する構成によって固定部材を不要とし、組み立て作業効率の向上とコストの低減を図った電球型ランプを実現する。
【選択図】図2
To provide a light bulb type lamp that is simplified in assembling.
By providing a through-hole portion of a wiring connecting a light emitting element substrate and a drive circuit section that drives the light emitting element at a protrusion for positioning a heat radiation portion, the wiring and assembly work efficiency is improved. A light bulb-type lamp that improves the assembly work efficiency and reduces the cost by improving the assembly work efficiency and reducing the cost by making the light emitting element substrate 7 sandwiched between the ring-shaped mounting portion 3 and the heat radiating portion 8. Realize.
[Selection] Figure 2

Description

本発明は、例えばLED(発光ダイオード)等の発光素子を光源として使用した電球型ランプに関する。 The present invention relates to a light bulb type lamp using a light emitting element such as an LED (light emitting diode) as a light source.

光源にLEDを使用した電球型ランプは、フィラメントを光源とする白熱電球に比べて消費電力が少ない製品として知られている。そして、電球型ランプは、白熱電球と同じ口金を備えており、白熱電球と同じソケットに取り付けられる構造としている。この電球型ランプには、ランプ内部に、光源となるLEDの他にも、LEDを駆動する駆動回路、ランプ内部の発熱部の温度上昇を低減するための放熱部などが必要であり、白熱電球に比べて部品点数が多く複雑な構造となる。 A light bulb type lamp using an LED as a light source is known as a product that consumes less power than an incandescent light bulb using a filament as a light source. The bulb-type lamp has the same base as the incandescent bulb, and is structured to be attached to the same socket as the incandescent bulb. In addition to the LED that is the light source, this bulb-type lamp requires a drive circuit that drives the LED, a heat radiating part for reducing the temperature rise of the heat generating part inside the lamp, etc. Compared to the above, the number of parts is large and the structure becomes complicated.

このように部品点数が多いため、組み立てやすく工程を簡略化した電球型ランプの技術が知られている。特許文献1の電球型ランプは、LEDの発光素子が配置された素子基板と素子基板に密着して取り付けられた放熱体に給電線が挿通可能な貫通した配線孔を設け、素子基板と点灯装置を接続する構造としている。 Since there are a large number of parts in this way, a technique of a light bulb type lamp that is easy to assemble and has a simplified process is known. The bulb-type lamp of Patent Document 1 includes an element substrate on which a light emitting element of an LED is disposed, and a heat dissipating body attached in close contact with the element substrate, and a wiring hole through which a feed line can be inserted. Are connected.

また、特許文献2の電球型ランプでは、配線が通る配線通孔部を放熱部の中央に設け、放熱部を支持する支持部にはLEDモジュールからの配線を通す配線溝を設けて配線を配線溝に這わせ、支持部中央に設けた配線用の貫通孔に通すことでLEDモジュールと点灯回路を接続する構造としている。 Moreover, in the light bulb type lamp of Patent Document 2, a wiring hole through which the wiring passes is provided in the center of the heat radiating part, and a wiring groove through which the wiring from the LED module is provided is provided in the support part that supports the heat radiating part. The LED module and the lighting circuit are connected by passing through a through hole for wiring provided in the center of the support portion along the groove.

また、特許文献3の電球型ランプでは、収納部と共に駆動回路部品を密閉する放熱部の中央部に配線が通る貫通孔を設け、光源モジュールと駆動回路部品をリード線で接続する構造としている。 Further, the light bulb type lamp of Patent Document 3 has a structure in which a through-hole through which wiring is provided is provided in the central portion of the heat radiating portion that seals the drive circuit component together with the housing portion, and the light source module and the drive circuit component are connected by lead wires.

また、特許文献4の電球型ランプでは、放熱部の光源モジュールを設ける面に配線用の貫通孔を設け、光源モジュールと活電部を接続する構造としている。 Further, the light bulb type lamp of Patent Document 4 has a structure in which a through hole for wiring is provided on the surface where the light source module of the heat radiating part is provided, and the light source module and the live part are connected.

特開2010−33959号公報JP 2010-33959 A 特開2010−56059号公報JP 2010-56059 A 特開2009−4130号公報JP 2009-4130 A 特開2009−163954号公報JP 2009-163954 A

特許文献1の電球型ランプは、素子基板と放熱体に配線孔が形成されているが、互いの孔の位置合わせが必要であり、目視によって位置合わせを行うため、位置決め確認による組立工程の増加が懸念される。 In the light bulb-type lamp of Patent Document 1, wiring holes are formed in the element substrate and the heat radiating body. However, since the holes need to be aligned with each other and are aligned visually, the assembly process is increased by positioning confirmation. Is concerned.

また、放熱体はアルミニウム等の金属で形成されており、放熱体の下方に位置する口金の間には点灯装置を収納するためのカップ状の収納ケースを介在させ、収納ケースのフランジ部により放熱体と口金を電気的に絶縁した構造としている。そして、収納ケースのフランジ部は、本体カバーと口金を絶縁するため径方向に突出して周方向に連続形成されており、必然的に収納ケースは本体カバーの下側から入れる構成となる。従って、特許文献1の収納ケースは、点灯装置の上部と側面を覆うような形状であるために、点灯装置は放熱体の下側からしか収納することができない。そして、放熱体の上面に取り付けている素子基板と点灯装置をリード線によって接続するためには、放熱体の下側から収納ケースに点灯装置を収納する前に、あらかじめ長めのリード線で素子基板と接続しておき、それから放熱体の下側より収納ケースに点灯装置を収納するようにしなければならない。このように、点灯装置を放熱体の下側から収納する構成とした場合には、点灯装置と素子基板を取り付け段階において放熱体に相当する長さのリード線によって接続する必要があり、結果としてコストアップに繋がる。また、収納ケースを筒状としているために、点灯装置と素子基板を接続するためにリード線を貫通孔に通す作業が困難となる。さらに、放熱体に対して素子基板をネジにより固定する構造としているため、組み立て工程の増加に繋がり製造効率の悪化が懸念される。 The radiator is made of a metal such as aluminum, and a cup-shaped storage case for storing the lighting device is interposed between the caps located below the heat sink, and the heat is dissipated by the flange portion of the storage case. The body and base are electrically insulated. The flange portion of the storage case protrudes in the radial direction and is continuously formed in the circumferential direction in order to insulate the main body cover and the base, and the storage case is inevitably inserted from the lower side of the main body cover. Therefore, since the storage case of patent document 1 is a shape which covers the upper part and side surface of a lighting device, a lighting device can be accommodated only from the lower side of a heat radiator. And, in order to connect the lighting device to the element substrate mounted on the upper surface of the radiator, the element substrate is previously connected with a long lead wire before the lighting device is stored in the storage case from the lower side of the radiator. Then, the lighting device must be stored in the storage case from the lower side of the radiator. Thus, when it is set as the structure which accommodates a lighting device from the lower side of a heat radiator, it is necessary to connect a lighting device and an element board with the lead wire of the length equivalent to a heat radiator in an attachment stage, and as a result It leads to cost increase. In addition, since the storage case has a cylindrical shape, it is difficult to pass the lead wire through the through hole in order to connect the lighting device and the element substrate. Furthermore, since the element substrate is fixed to the heat radiating body with screws, there is a concern that the assembly process is increased and the manufacturing efficiency is deteriorated.

また、特許文献2の電球型ランプでは、LEDモジュールからの配線を通すため放熱部に配線溝を形成して線を這わせて放熱部の中央に設けた配線通孔部に配線を通し、口金の中央部に配置された点灯回路に接続する構成としている。また、LEDモジュールの下方には金属製の放熱部を設け、さらに放熱部の下方に位置する口金の間に絶縁部を介在させることで、放熱部と口金を電気的に絶縁している。 Moreover, in the light bulb type lamp of Patent Document 2, a wiring groove is formed in the heat radiating portion so as to let the wiring from the LED module pass, and the wire is passed through the wiring through hole provided in the center of the heat radiating portion. It is set as the structure connected to the lighting circuit arrange | positioned in the center part. Further, a metal heat dissipating part is provided below the LED module, and an insulating part is interposed between the bases located below the heat dissipating part, thereby electrically insulating the heat dissipating part and the base.

それによって口金と金属製の放熱部を絶縁する絶縁部の内部が中空となっており、その中にLEDの点灯回路が内蔵される構成としているため、点灯回路は放熱体の下側からしか入れることができない。従って特許文献1と同様に、点灯回路とLEDモジュールの取り付け段階においては、放熱部に相当するだけの長さのリード線によって接続する必要があり、結果としてコストアップに繋がる。また、点灯回路とLEDモジュールの接続作業において、配線を貫通孔に通す作業や配線溝に這わす作業等、組み立て工程の増加に繋がり製造効率の悪化が懸念される。 As a result, the interior of the insulating part that insulates the base and the metal heat dissipating part is hollow, and the LED lighting circuit is built in, so the lighting circuit can be inserted only from the lower side of the radiator. I can't. Therefore, similarly to Patent Document 1, it is necessary to connect the lighting circuit and the LED module with a lead wire having a length corresponding to the heat radiating portion, resulting in an increase in cost. Moreover, in the connection work of the lighting circuit and the LED module, there is a concern that the manufacturing efficiency may be deteriorated due to an increase in the assembly process such as a work of passing the wiring through the through hole or a work of turning the wiring groove.

特許文献3、特許文献4においても特許文献1および特許文献2と同様であり、特許文献3においては、筒状の放熱部に光源モジュールの駆動回路部品を内蔵するため、駆動回路部品が放熱部の下側からしか挿入できず、駆動回路部品と光源モジュールの取り付け段階においては、放熱部に相当するだけの長さのリード線によって接続する必要があり、特許文献4においては、活電部を筒状の収容部に収容するとき、収容部の下側からしか挿入できないため、リード線の接続において貫通孔に挿通させる困難さやリード線が長くなるなど、結果としてどちらの特許文献もコストアップに繋がる。また、駆動回路部品と光源モジュールの接続作業が困難であり、組み立て工程の増加に繋がり製造効率の悪化が懸念される。 Patent Document 3 and Patent Document 4 are the same as Patent Document 1 and Patent Document 2, and in Patent Document 3, since the drive circuit component of the light source module is built in the cylindrical heat dissipation portion, the drive circuit component is the heat dissipation portion. Can be inserted only from the lower side, and in the mounting stage of the drive circuit component and the light source module, it is necessary to connect with a lead wire having a length corresponding to the heat radiating portion. When accommodated in a cylindrical accommodating part, since it can only be inserted from the lower side of the accommodating part, it is difficult to insert the lead wire into the through hole and the lead wire becomes long. As a result, both patent documents increase the cost. Connected. Further, it is difficult to connect the drive circuit component and the light source module, which leads to an increase in the assembly process, and there is a concern that the manufacturing efficiency is deteriorated.

本発明の目的は作業効率の向上とコストの低減のため、駆動回路部の上に収納部の蓋部と放熱部を配置し、前記蓋部には位置決め用の突部と配線の貫通孔部を設け、駆動回路部からの配線を貫通孔部に通すことでLEDを備える発光素子基板の配線を容易にして駆動回路部と発光素子基板の接続方法を簡略化する。また前記貫通孔部は放熱部を取り付けるための位置決め用突部内に設けられており、配線のための貫通孔部と、放熱部取り付け時の位置決めを兼用した突部を前記蓋部に形成したことを特徴とする電球型ランプの構造を提供することにある。
さらには、発光素子基板を放熱部とリング状取り付け部の間に挟持して配置する構造とすることで作業効率の向上とコストの低減を図る電球型ランプの提供することにある。
An object of the present invention is to arrange a cover part and a heat radiating part on a drive circuit part in order to improve work efficiency and reduce costs, and a positioning protrusion and a wiring through-hole part on the cover part And wiring of the light emitting element substrate including the LEDs is facilitated by passing the wiring from the driving circuit section through the through hole portion, thereby simplifying the connection method between the driving circuit section and the light emitting element substrate. In addition, the through-hole portion is provided in a positioning projection for attaching the heat radiating portion, and a through-hole portion for wiring and a projection that serves as positioning at the time of attaching the heat radiating portion are formed on the lid portion. It is providing the structure of the light bulb type lamp characterized by this.
It is another object of the present invention to provide a light bulb type lamp that improves work efficiency and reduces costs by adopting a structure in which a light emitting element substrate is sandwiched and disposed between a heat radiating portion and a ring-shaped attachment portion.

請求項1に係る電球型ランプは、発光素子が配置された発光素子基板と、前記発光素子から発生する熱を放熱する放熱部と、前記発光素子を覆う透光性カバーと、前記発光素子を駆動させる駆動回路部と、前記駆動回路部を収納する収納部と、前記駆動回路部に電気的に接続されると共に、外部電源に接続される口金を備えた電球型ランプであって、前記収納部には突部を形成した蓋部を設け、前記蓋部には配線を通す貫通孔部が形成されており、前記突部は、配線を通す前記貫通孔部と前記放熱部の位置決めを兼用することを特徴とする。 The light bulb-type lamp according to claim 1 includes a light emitting element substrate on which a light emitting element is disposed, a heat radiating portion that radiates heat generated from the light emitting element, a translucent cover that covers the light emitting element, and the light emitting element. A light bulb type lamp including a drive circuit unit to be driven, a storage unit that stores the drive circuit unit, and a base that is electrically connected to the drive circuit unit and connected to an external power source. The cover is provided with a lid having a protrusion, and the lid is formed with a through-hole that allows wiring to pass therethrough. The protrusion also serves as a positioning of the through-hole that allows wiring to pass through and the heat dissipation part. It is characterized by doing.

請求項2に係る電球型ランプは、請求項1に記載の電球型ランプであって、前記貫通孔部は、前記蓋部に形成された前記突部に設けたことを特徴とする。 A light bulb type lamp according to a second aspect is the light bulb type lamp according to the first aspect, wherein the through-hole portion is provided in the protrusion formed in the lid portion.

請求項3に係る電球型ランプは、請求項1から請求項のいずれか1項に記載の電球型ランプであって、前記収納部と前記放熱部を接触させて取り付けることで、前記発光素子の熱を、前記放熱部を介して前記収納部へ放熱させることを特徴とする。 The light bulb-type lamp according to claim 3 is the light bulb-type lamp according to any one of claims 1 to 2 , wherein the light-emitting element is obtained by attaching the housing portion and the heat radiating portion in contact with each other. This heat is radiated to the storage part through the heat radiating part.

請求項4に係る電球型ランプは、請求項1から請求項のいずれか1項に記載の電球型ランプであって、前記発光素子基板と前記駆動回路部の配線は前記突部に形成された前記貫通孔部を通して接続することを特徴とする。 A light bulb type lamp according to a fourth aspect of the present invention is the light bulb type lamp according to any one of the first aspect to the third aspect , wherein the wiring of the light emitting element substrate and the drive circuit portion is formed on the protrusion. Further, the connection is made through the through-hole portion.

請求項5に係る電球型ランプは、発光素子が配置された発光素子基板と、前記発光素子から発生する熱を放熱する放熱部と、前記発光素子を覆う透光性カバーと、前記発光素子を駆動させる駆動回路部を収納する収納部と、前記駆動回路部に電気的に接続されると共に外部電源に接続される口金を備え、前記収納部には突部を形成した蓋部を設け、前記蓋部には配線を通す貫通孔部が形成されており、前記突部が、配線を通す前記貫通孔部と前記放熱部の位置決めを兼用した電球型ランプにおいて、前記透光性カバーを取り付けるリング状取り付け部を備え、前記発光素子基板は前記放熱部と前記リング状取り付け部の間に挟持することを特徴とする電球型ランプThe light bulb-type lamp according to claim 5 includes: a light emitting element substrate on which a light emitting element is disposed; a heat radiating part that dissipates heat generated from the light emitting element; a translucent cover that covers the light emitting element; A storage unit that stores a drive circuit unit to be driven; a base that is electrically connected to the drive circuit unit and connected to an external power source; and the storage unit is provided with a lid portion that forms a protrusion, A through-hole portion through which wiring is passed is formed in the lid portion, and the projection is a ring for attaching the translucent cover in a bulb-type lamp that serves as positioning of the through-hole portion through which wiring passes and the heat radiating portion. A light bulb-type lamp comprising: a light-emitting attachment portion, wherein the light emitting element substrate is sandwiched between the heat dissipating portion and the ring attachment portion.

請求項1の発明によれば、発光素子が配置された発光素子基板と、前記発光素子から発生する熱を放熱する放熱部と、前記発光素子を覆う透光性カバーと、前記発光素子を駆動させる駆動回路部を収納する収納部と、前記駆動回路部に電気的に接続されると共に外部電源に接続される口金を備え、前記収納部には突部を形成した蓋部を設けて、前記蓋部には配線を通す貫通孔部が形成されており、前記突部は、配線を通す前記貫通孔部と前記放熱部の位置決めを兼用しているため、前記発光素子基板と前記駆動回路部の配線が貫通孔部を挿通して容易に行え、突部や貫通孔部を別々に設ける必要も無く、貫通孔部の増加による放熱部面積の減少が低減できる。また、蓋部の上に放熱部や発光素子基板等を取り付ける場合、位置決めによって容易に取り付け可能なため作業効率の向上と正確さが図れる。 According to the invention of claim 1, a light emitting element substrate on which a light emitting element is disposed, a heat radiating part that radiates heat generated from the light emitting element, a translucent cover that covers the light emitting element, and driving the light emitting element A storage portion for storing the drive circuit portion to be connected; and a base that is electrically connected to the drive circuit portion and connected to an external power source. The storage portion is provided with a lid portion having a protrusion, The lid portion is formed with a through-hole portion through which the wiring passes, and the protrusion serves as a positioning of the through-hole portion through which the wiring passes and the heat radiating portion, so that the light-emitting element substrate and the drive circuit portion The wiring can be easily inserted through the through-hole portion, and there is no need to separately provide a protrusion or a through-hole portion, and the reduction of the heat radiation portion area due to the increase of the through-hole portion can be reduced. Moreover, when attaching a heat radiating part, a light emitting element board | substrate, etc. on a cover part, since it can attach easily by positioning, the improvement and precision of work efficiency can be aimed at.

請求項2の発明によれば、前記貫通孔部が前記突部に兼用して形成されているため、別途配線のための貫通孔部を放熱部や蓋部に設ける必要も無く、放熱部における放熱面積の拡大が可能となる。 According to invention of Claim 2, since the said through-hole part is formed also as the said protrusion, it is not necessary to provide the through-hole part for wiring separately in a thermal radiation part or a cover part, and in a thermal radiation part The heat dissipation area can be expanded.

請求項3の発明によれば、前記収納部と前記放熱部を接触させて取り付けることで、簡単な構造によって、前記発光素子の熱を、前記放熱部を介して前記収納部へ放熱させることが可能となる。 According to the invention of claim 3, the heat of the light emitting element can be radiated to the storage part via the heat dissipation part by a simple structure by attaching the storage part and the heat dissipation part in contact with each other. It becomes possible.

請求項4の発明によれば、前記発光素子基板と前記駆動回路部の配線は前記突部に形成された前記貫通孔部を通して前記発光素子基板と前記駆動回路部を接続することが可能なため、配線が容易に行え、作業の効率向上となり、またリード線も短くでき、コストを低減できる。 According to the invention of claim 4, since the wiring of the light emitting element substrate and the drive circuit unit can connect the light emitting element substrate and the drive circuit unit through the through hole formed in the protrusion. Wiring can be performed easily, work efficiency can be improved, lead wires can be shortened, and cost can be reduced.

請求項5の発明によれば、発光素子が配置された発光素子基板と、前記発光素子から発生する熱を放熱する放熱部と、前記発光素子を覆う透光性カバーと、前記発光素子を駆動させる駆動回路部を収納する収納部と、前記駆動回路部に電気的に接続されると共に外部電源に接続される口金を備え、前記収納部には突部を形成した蓋部を設け、前記蓋部には配線を通す貫通孔部が形成されており、前記突部が、配線を通す前記貫通孔部と前記放熱部の位置決めを兼用した電球型ランプにおいて、前記透光性カバーを取り付けるリング状取り付け部を備え、前記発光素子基板は前記放熱部と前記リング状取り付け部の間に挟持されて配置するため、発光素子基板を固定するためのネジ等の固定部材も不要となり作業効率の向上とコスト低減ができる。 According to the invention of claim 5, the light emitting element substrate on which the light emitting element is arranged, the heat radiating part that radiates the heat generated from the light emitting element, the translucent cover that covers the light emitting element, and the light emitting element are driven. A storage unit that stores the drive circuit unit to be connected; a base that is electrically connected to the drive circuit unit and connected to an external power supply; and the storage unit is provided with a lid portion having a protrusion, A through-hole part through which wiring is passed is formed in the part, and the projection is a ring-shaped attachment that attaches the translucent cover in a bulb-type lamp that also serves as a positioning of the through-hole part through which the wiring passes and the heat dissipation part A mounting portion is provided, and the light emitting element substrate is sandwiched and disposed between the heat dissipation portion and the ring-shaped mounting portion, so that a fixing member such as a screw for fixing the light emitting element substrate is not required, and work efficiency is improved. Cost reduction .

このように、駆動回路部を収納するための収納部の蓋部に、放熱部を取り付けるための位置決め用突部と、突部には収納部の駆動回路部と、蓋部の上面に位置する発光素子基板を接続する配線のための貫通孔部を設けることによって、位置決め用の突部と配線用の貫通孔部を別々に設ける必要も無く、また貫通孔部を設けた突部を蓋部に形成したことにより容易に配線が可能となり、リード線も短くでき線処理も容易となり電球型ランプを製造する作業効率の向上が図れる。 Thus, the positioning projection for attaching the heat radiating portion to the lid portion of the housing portion for housing the drive circuit portion, the drive circuit portion of the housing portion on the projection, and the upper surface of the lid portion By providing a through hole for wiring to connect the light emitting element substrate, there is no need to separately provide a positioning projection and a wiring through hole, and the projection having the through hole is a lid. Thus, the wiring can be easily performed, the lead wire can be shortened, the wire processing can be facilitated, and the working efficiency of manufacturing the bulb-type lamp can be improved.

また、前記発光素子基板を前記リング状取り付け部と前記放熱部で挟持して配置することで、発光素子基板をネジ等の固定部材で固定する必要も無く、また発光素子基板への配線も容易に行えるため、電球型ランプを製造する作業効率の向上が図れる。 Further, by arranging the light emitting element substrate so as to be sandwiched between the ring-shaped attachment portion and the heat radiating portion, it is not necessary to fix the light emitting element substrate with a fixing member such as a screw, and wiring to the light emitting element substrate is easy. Therefore, it is possible to improve the working efficiency of manufacturing the light bulb type lamp.

本発明の実施例における電球型ランプの斜視図。The perspective view of the light bulb type lamp in the example of the present invention. 本発明の実施例における電球型ランプの分解斜視図。The disassembled perspective view of the lightbulb type lamp in the Example of this invention. 本発明の実施例におけるリング状取り付け部の斜視図。The perspective view of the ring-shaped attachment part in the Example of this invention. 本発明の実施例における収納部の形状を示す図であり、図4(a)は収納部の天面側斜視図、図4(b)は同底面側斜視図。It is a figure which shows the shape of the accommodating part in the Example of this invention, Fig.4 (a) is a top | upper surface side perspective view of a accommodating part, FIG.4 (b) is the same bottom side perspective view. 本発明の実施例における収納部の形状を示す図であり、図5(a)は収納部の平面図、図5(b)は同正面図。It is a figure which shows the shape of the accommodating part in the Example of this invention, Fig.5 (a) is a top view of an accommodating part, FIG.5 (b) is the same front view. 本発明の実施例における発光素子基板を示す平面図。The top view which shows the light emitting element substrate in the Example of this invention. 本発明の実施例における放熱部を示す平面図。The top view which shows the thermal radiation part in the Example of this invention. 本発明の実施例における透光性カバーを示す正面図。The front view which shows the translucent cover in the Example of this invention. 本発明の実施例におけるスペーサーを示す斜視図。The perspective view which shows the spacer in the Example of this invention. 本発明の実施例における収納部に蓋部を組み込んだ状態を示す斜視図。The perspective view which shows the state which integrated the cover part in the accommodating part in the Example of this invention. 本発明の実施例における収納部に駆動回路部を配置して口金を取り付けた状態を示す断面図。Sectional drawing which shows the state which arrange | positioned the drive circuit part to the accommodating part in the Example of this invention, and attached the nozzle | cap | die. 本発明の実施例におけるリング状取り付け部の構成を示す図であり、図12(a)はリング状取り付け部と放熱部で発光素子基板を挟持する前の状態を示す斜視図、図12(b)はリング状取り付け部と放熱部で発光素子基板を挟持した状態を示す斜視図。FIG. 12A is a perspective view showing a state before the light emitting element substrate is sandwiched between the ring-shaped attachment portion and the heat radiating portion, and FIG. ) Is a perspective view showing a state in which the light emitting element substrate is sandwiched between the ring-shaped attachment portion and the heat dissipation portion. 本発明の実施例におけるリング状取り付け部と収納部の取り付け状態を示す斜視図。The perspective view which shows the attachment state of the ring-shaped attachment part and storage part in the Example of this invention.

図1から図13を参照して本発明の実施形態を説明する。なお、本発明はその主旨に反しない範囲で、実施例において説明した構成以外に対しても適用可能である。 An embodiment of the present invention will be described with reference to FIGS. The present invention can be applied to configurations other than those described in the embodiments without departing from the spirit of the present invention.

図1は、本発明の実施例における電球型ランプの斜視図である。同図で示すように、本実施例の電球型ランプ1は、発光素子を覆う透光性カバー2と、透光性カバー2の下方に位置する収納部12bと、収納部12bの下方に位置して電球ソケットに装着することで電源と接続可能な口金5を主要構成部品として備える。ここで、口金5は白熱電球に使われているものと同じものである。 FIG. 1 is a perspective view of a light bulb type lamp in an embodiment of the present invention. As shown in the figure, the bulb-type lamp 1 of the present embodiment includes a translucent cover 2 that covers the light emitting element, a storage portion 12b that is located below the translucent cover 2, and a position that is below the storage portion 12b. Then, the base 5 that can be connected to the power source by being attached to the light bulb socket is provided as a main component. Here, the base 5 is the same as that used for the incandescent bulb.

本実施例においては、収納部12bがアルミニウム等の金属製で構成されており、前記駆動回路部を収納する収納部12aを絶縁する材質として別途設けることにより絶縁が可能となる。従って、収納部12bと収納部12aを用いた構成にて説明を続けるが、例えば、収納部12bが金属以外の材質の場合、収納部12aは不要となる。 In the present embodiment, the storage portion 12b is made of metal such as aluminum, and insulation can be achieved by separately providing the storage portion 12a for storing the drive circuit portion as an insulating material. Accordingly, the description will be continued with the configuration using the storage portion 12b and the storage portion 12a. However, for example, when the storage portion 12b is made of a material other than metal, the storage portion 12a is not necessary.

図2は、本発明の実施例における電球型ランプの分解斜視図である。同図で示すように、電球型ランプ1の透光性カバー2の中には発光素子を備えた発光素子基板7、収納部12aには発光素子基板7を駆動するための駆動回路部11を収納する。さらに収納部12aを覆う収納部12bを備える。本実施例では発光素子にLED(発光ダイオード)を使用し、LEDを実装した発光素子基板7と、LEDを駆動するための駆動回路部11を備える。また、駆動回路部11を収納するための収納部12aには蓋部9を構成して駆動回廊部11を収納部12aに収納する構成とする。さらに蓋部9の上面にはLEDから発生する熱を逃がすための放熱部8を備える構成とする。放熱部8は蓋部に設けられた突部91によって位置決めされ蓋部9に取り付けられる。放熱部8は板状や円状の形状やシリコンラバーやボンド、テープ等の素材であっても良く形状や素材を限定しない。 FIG. 2 is an exploded perspective view of the light bulb type lamp in the embodiment of the present invention. As shown in the figure, the light-transmitting cover 2 of the light bulb type lamp 1 includes a light-emitting element substrate 7 having a light-emitting element, and a storage circuit 12 a having a drive circuit unit 11 for driving the light-emitting element substrate 7. Store. Furthermore, the storage part 12b which covers the storage part 12a is provided. In this embodiment, an LED (light emitting diode) is used as a light emitting element, and a light emitting element substrate 7 on which the LED is mounted and a drive circuit unit 11 for driving the LED are provided. Further, the storage unit 12a for storing the drive circuit unit 11 is configured to include the lid unit 9 so that the drive corridor unit 11 is stored in the storage unit 12a. Furthermore, it is set as the structure provided with the thermal radiation part 8 for releasing the heat which generate | occur | produces from LED on the upper surface of the cover part 9. FIG. The heat dissipating part 8 is positioned by a protrusion 91 provided on the cover part and attached to the cover part 9. The heat radiating portion 8 may be a plate-like or circular shape, or a material such as silicon rubber, bond, or tape, and the shape or material is not limited.

図3は、本発明の実施例におけるリング状取り付け部の斜視図であり、ほぼ中央に開口部32を形成した平面部31と、平面部31の外周上面に位置する凹溝33と、凹溝33の外周に位置するベルト状の帯34を一体に形成する。そして平面部31には後述するネジ締めするための貫通孔部35を形成する。また平面部31の下面には後述する収納部12bと位置決めするための突起36を形成する。また、凹溝33には接着剤を溜めるための凹部37を形成する。ここで、ベルト状の帯34は平面部31に対して上下方向に連続して湾曲した波状としているが、これはデザイン的なものであり、ベルト状の帯34を平面部31と同一面に平面部を囲むように形成しても良い。また、リング状取り付け部3は、電球の外観形状に合わせた形状とすれば良く、複雑な形状であっても成形が容易な合成樹脂製とし、LEDからの光を反射しやすくするために例えば白色とする。 FIG. 3 is a perspective view of the ring-shaped attachment portion in the embodiment of the present invention, and includes a flat portion 31 having an opening 32 formed substantially at the center, a concave groove 33 located on the outer peripheral upper surface of the flat portion 31, and a concave groove. A belt-like band 34 located on the outer periphery of 33 is integrally formed. And the through-hole part 35 for screwing mentioned later is formed in the plane part 31. FIG. Further, a projection 36 for positioning with a storage portion 12b described later is formed on the lower surface of the flat portion 31. The concave groove 33 is formed with a concave portion 37 for storing an adhesive. Here, the belt-like band 34 has a wave shape that is continuously curved in the vertical direction with respect to the plane part 31, but this is a design and the belt-like band 34 is flush with the plane part 31. You may form so that a plane part may be enclosed. Moreover, the ring-shaped attachment portion 3 may be formed in a shape that matches the external shape of the light bulb, and is made of a synthetic resin that can be easily molded even if it has a complicated shape. For example, in order to easily reflect the light from the LED, White.

図4は本発明の実施例における収納部の形状を示す図であり、図4(a)は収納部の天面側斜視図、図4(b)は同底面側斜視図である。同図で示すように、円筒部125と、円筒部125より直径の大きい基板収納部126を一体としており、円筒部125の外周下側には、口金5が嵌合するネジ山128や、ネジ山128の上方には後述するスペーサー13を取り付けるための凸部123を形成する。基板収納部126の外周には、後述する収納部12bに当接するリブ129を形成し、基板収納部126の内周には、駆動回路部11を保持するためのリブ127を形成する。収納部12aは駆動回部11を水平に配置することができる。 4A and 4B are views showing the shape of the storage portion in the embodiment of the present invention. FIG. 4A is a top perspective view of the storage portion, and FIG. 4B is a bottom perspective view of the storage portion. As shown in the figure, a cylindrical portion 125 and a substrate storage portion 126 having a diameter larger than that of the cylindrical portion 125 are integrated, and a screw thread 128 to which the base 5 is fitted, a screw A convex portion 123 for attaching a spacer 13 described later is formed above the mountain 128. Ribs 129 are formed on the outer periphery of the substrate storage portion 126 to be in contact with the storage portion 12b described later, and ribs 127 for holding the drive circuit portion 11 are formed on the inner periphery of the substrate storage portion 126. The accommodating part 12a can arrange | position the drive rotation part 11 horizontally.

図5は、本発明の実施例における収納部の形状を示す図であり、図5(a)は収納部の平面図、図5(b)は同正面図である。同図で示すように、収納部12bは、下端から上端に向かって直径を大きくした略円筒状とする。そして、収納部12bの上側には放熱部8を面接触するための平坦部41を形成し、この平坦部41には、後述するネジ等の固定部材を締めるためのネジ孔42を形成する。また、収納部12bの内側には、収納部12aを保持するためのリブ43を形成する。ここで、収納部12bの上端を平坦部41に対して上下方向に連続して湾曲した波状としているが、これはデザイン的なことであり、上端を水平とすることでも良い。また、収納部12bの材質は、アルミニウムを含む金属やセラミック、放熱可能なプラスチック等LEDから発生する熱を放熱可能であればなんでも良い。そして収納部12bの表面積を増やすために収納部12bの表面に複数のリブ44を形成しても良い。前述のように収納部12bにおいては、直接駆動回路部11を収納し収納部とすることで本実施例の収納部12aを削除する構成でも良い。 FIGS. 5A and 5B are views showing the shape of the storage portion in the embodiment of the present invention. FIG. 5A is a plan view of the storage portion, and FIG. 5B is a front view thereof. As shown in the figure, the storage portion 12b has a substantially cylindrical shape whose diameter increases from the lower end toward the upper end. And the flat part 41 for surface-contacting the thermal radiation part 8 is formed above the accommodating part 12b, and the screw hole 42 for fastening fixing members, such as the screw mentioned later, is formed in this flat part 41. As shown in FIG. A rib 43 for holding the storage portion 12a is formed inside the storage portion 12b. Here, although the upper end of the storage portion 12b has a wave shape that is continuously curved in the vertical direction with respect to the flat portion 41, this is a design and the upper end may be horizontal. The material of the storage portion 12b may be anything as long as it can dissipate heat generated from the LED, such as a metal containing aluminum, ceramic, or a heat-dissipable plastic. A plurality of ribs 44 may be formed on the surface of the storage portion 12b in order to increase the surface area of the storage portion 12b. As described above, the storage unit 12b may be configured to delete the storage unit 12a of the present embodiment by directly storing the drive circuit unit 11 as a storage unit.

図6は、本発明の実施例における発光素子基板を示す平面図である。同図で示すように、発光素子基板7の上面には配線パターン(図示せず)を形成しLED73を実装する。なお、発光素子の実施例として、複数のLEDを使用しても良いし、一つのパッケージに複数のLED素子が入っているパワーLEDを使用することでも良い。また、発光素子基板7の材質を、例えばガラス基板や金属基板などの熱伝導性に優れた材質とすることで、後述する放熱部8の厚みの変更も可能である。 FIG. 6 is a plan view showing a light emitting element substrate in an example of the present invention. As shown in the figure, a wiring pattern (not shown) is formed on the upper surface of the light emitting element substrate 7 to mount the LEDs 73. As an example of the light emitting element, a plurality of LEDs may be used, or a power LED in which a plurality of LED elements are contained in one package may be used. Moreover, the thickness of the thermal radiation part 8 mentioned later is also changeable by making the material of the light emitting element substrate 7 into the material excellent in thermal conductivity, such as a glass substrate and a metal substrate, for example.

そして発光素子基板7は駆動回路部11と接続するため、蓋部9に形成された突部91に設けた貫通孔部92からリード線112が配線され、発光素子基板7のパターン部71、72でハンダ付けされる。なお、発光素子基板7と駆動回路部11の接続は、駆動回路部11からのリード線112を発光素子基板7にコネクタで接続する方法でも良い。 Since the light emitting element substrate 7 is connected to the drive circuit unit 11, a lead wire 112 is wired from a through hole portion 92 provided in a protrusion 91 formed in the lid portion 9, and the pattern portions 71 and 72 of the light emitting element substrate 7 are connected. Soldered with. The light emitting element substrate 7 and the drive circuit unit 11 may be connected by connecting the lead wires 112 from the drive circuit unit 11 to the light emitting element substrate 7 with a connector.

また、駆動回路部11は収納部12aに収納できる形状とすればよい。駆動回路部11は、口金5から取り込んだ商用電源(AC100V)を使用してLEDを駆動するための回路で、収納部12aに収納される。 Further, the drive circuit unit 11 may have a shape that can be stored in the storage unit 12a. The drive circuit unit 11 is a circuit for driving an LED using a commercial power supply (AC 100 V) taken in from the base 5, and is stored in the storage unit 12 a.

図7は、本発明の実施例における放熱部を示す平面図である。同図で示すように、放熱部8には、外側にネジ締め用の切欠き82と、収納部12aの蓋部9に設けられた突部91の位置に対応した貫通孔部83が形成されている。 FIG. 7 is a plan view showing a heat radiating portion in the embodiment of the present invention. As shown in the figure, the heat radiating portion 8 is formed with a notch 82 for screw tightening on the outside and a through hole portion 83 corresponding to the position of the protrusion 91 provided on the lid portion 9 of the storage portion 12a. ing.

図8は、本発明の実施例における透光性カバーを示す正面図である。透光性カバー2は、透光性を有する材料で形成する。ここで、透光性カバー2の下端の縁21を水平面に対して上下方向に連続して湾曲した波状としているが、これはデザイン的なことであり、下端の縁21を水平とすることでも良い。 FIG. 8 is a front view showing the translucent cover in the embodiment of the present invention. The translucent cover 2 is formed of a material having translucency. Here, the edge 21 at the lower end of the translucent cover 2 has a wave shape that is continuously curved in the vertical direction with respect to the horizontal plane. This is a design, and the edge 21 at the lower end may be horizontal. good.

図9は、本発明の実施例におけるスペーサーを示す斜視図である。同図で示すように、スペーサー13は中央位置に貫通孔部132を有するリング形状としている。そして、スペーサー13は、口金5と収納部12bの間に取り付けるもので、収納部12bが金属製の材料のときには、口金5と収納部12bを電気的に絶縁する必要があるため、スペーサー13は絶縁材料で形成する。また、スペーサー13の内側には、収納部12aの凸部123に嵌る凹部131を形成する。 FIG. 9 is a perspective view showing the spacer in the embodiment of the present invention. As shown in the figure, the spacer 13 has a ring shape having a through-hole portion 132 at the center position. The spacer 13 is attached between the base 5 and the storage portion 12b. When the storage portion 12b is made of a metal material, it is necessary to electrically insulate the base 5 and the storage portion 12b. It is made of an insulating material. In addition, a concave portion 131 that fits into the convex portion 123 of the storage portion 12 a is formed inside the spacer 13.

図10は、本発明の実施例における収納部に蓋部を組み込んだ状態を示す斜視図である。同図で示すように、収納部12aのリブ127に駆動回路部11の外縁を挿し込むことで、駆動回路部11は保持される。なお、駆動回路部11にはあらかじめ、口金5に接続するリード線113と、発光素子基板7に接続するリード線112が接続されている。 FIG. 10 is a perspective view showing a state in which the lid portion is incorporated in the storage portion in the embodiment of the present invention. As shown in the figure, the drive circuit unit 11 is held by inserting the outer edge of the drive circuit unit 11 into the rib 127 of the storage unit 12a. Note that a lead wire 113 connected to the base 5 and a lead wire 112 connected to the light emitting element substrate 7 are connected to the drive circuit unit 11 in advance.

収納部12aに駆動回路部11を略水平に配置し、収納部12aの上側から蓋部9によって密閉するが、蓋部9に設けた位置決め用の突部91に設けた貫通孔部92に発光素子基板7と駆動回路部11を接続するリード線112を挿通して配線し、収納部12aの下側からは駆動回路部11と口金5を接続するリード線113を出す。 The drive circuit unit 11 is disposed substantially horizontally in the storage unit 12a, and is sealed from above the storage unit 12a by the lid 9, but emits light to the through-hole 92 provided in the positioning projection 91 provided in the lid 9. A lead wire 112 connecting the element substrate 7 and the drive circuit unit 11 is inserted and wired, and a lead wire 113 connecting the drive circuit unit 11 and the base 5 is provided from the lower side of the storage unit 12a.

収納部12bの上側から収納部12aを挿し込むと、収納部12bの下側から収納部12aの円筒部125の一部が突出するが、収納部12bの内側に形成してある収納部12aを保持するためのリブ43に収納部12aの外周に形成してあるリブ129が当接するため、収納部12aは固定され下側に移動することは無い。そして、スペーサー13を収納部12aの突出している円筒部125の下側から挿通して上側に移動させると、円筒部125に形成されている凸部123とスペーサー13の凹部131が係合し、係合した位置でスペーサー13が固定される。スペーサー13が収納部12aの円筒部125に固定されることで、収納部12aに対して収納部12bが外れることなく固定されることになる。 When the storage portion 12a is inserted from the upper side of the storage portion 12b, a part of the cylindrical portion 125 of the storage portion 12a protrudes from the lower side of the storage portion 12b, but the storage portion 12a formed inside the storage portion 12b is Since the rib 129 formed on the outer periphery of the storage portion 12a contacts the holding rib 43, the storage portion 12a is fixed and does not move downward. Then, when the spacer 13 is inserted from the lower side of the cylindrical portion 125 protruding from the storage portion 12a and moved upward, the convex portion 123 formed in the cylindrical portion 125 and the concave portion 131 of the spacer 13 are engaged, The spacer 13 is fixed at the engaged position. By fixing the spacer 13 to the cylindrical portion 125 of the storage portion 12a, the storage portion 12b is fixed to the storage portion 12a without being detached.

図11は、本発明の実施例における収納部に駆動回路部を配置して口金を取り付けた状態を示す断面図である。同図で示すように、口金5を取り付ける前に、あらかじめリード線113を収納部12aの側面と下側にそれぞれ引き出しておき、収納部12aの円筒部125の外周には口金5に嵌合するネジ山128が形成されており口金5を回しながら取り付ける。そして収納部12aの円筒部125の側面と下側から引き出しておいたそれぞれのリード線113を口金5にハンダ付けする。 FIG. 11 is a cross-sectional view showing a state where the drive circuit unit is arranged in the storage unit in the embodiment of the present invention and the base is attached. As shown in the figure, before attaching the base 5, the lead wires 113 are previously drawn to the side surface and the lower side of the storage portion 12 a, respectively, and are fitted to the base 5 on the outer periphery of the cylindrical portion 125 of the storage portion 12 a. A screw thread 128 is formed, and the base 5 is attached while turning. Then, the lead wires 113 drawn out from the side surface and the lower side of the cylindrical portion 125 of the storage portion 12 a are soldered to the base 5.

図12は、本発明の実施例におけるリング状取り付け部の構成を示す図であり、図12(a)はリング状取り付け部と放熱部で発光素子基板を挟持する前の状態を示す斜視図、図12(b)はリング状取り付け部と放熱部で発光素子基板を挟持した状態を示す斜視図である。同図で示すように、リング状取り付け部3の下側からLEDの実装面を上にして発光素子基板7を取り付ける。その際、リング状取り付け部3の開口部32と発光素子基板7の形状を合わせることで、リング状取り付け部3に発光素子基板7が位置決めできる。このとき開口部32には蓋部9の突部91を挿通してリード線112を配線可能な開口部が図12(b)の開口部38のように形成される。次に、発光素子基板7の下側に放熱部8を面接触させてリング状取り付け部3と発光素子基板7を挟持して取り付ける。その際、リング状取り付け部3の開口部32に発光素子基板7を取り付けた後の開口部38と放熱部8の貫通孔部81、リング状取り付け部3の貫通孔部35と放熱部8の切欠き82を合わせることでリング状取り付け部3に放熱部8が位置決めでき、リード線112を開口部38より出すことができる。 FIG. 12 is a diagram illustrating a configuration of a ring-shaped attachment portion in an embodiment of the present invention, and FIG. 12A is a perspective view illustrating a state before the light-emitting element substrate is sandwiched between the ring-shaped attachment portion and the heat dissipation portion, FIG. 12B is a perspective view showing a state where the light emitting element substrate is sandwiched between the ring-shaped attachment portion and the heat dissipation portion. As shown in the figure, the light emitting element substrate 7 is attached with the LED mounting surface facing upward from the lower side of the ring-shaped attachment portion 3. At that time, the light emitting element substrate 7 can be positioned on the ring-shaped mounting portion 3 by matching the shape of the light emitting element substrate 7 with the opening 32 of the ring-shaped mounting portion 3. At this time, an opening through which the protrusion 91 of the lid 9 can be inserted and the lead wire 112 can be wired is formed in the opening 32 as shown in the opening 38 in FIG. Next, the heat dissipating part 8 is brought into surface contact with the lower side of the light emitting element substrate 7 so that the ring-shaped attaching part 3 and the light emitting element substrate 7 are sandwiched and attached. At that time, the opening 38 after attaching the light emitting element substrate 7 to the opening 32 of the ring-shaped attachment portion 3 and the through-hole portion 81 of the heat-dissipating portion 8, the through-hole portion 35 of the ring-shaped attachment portion 3 and the heat-dissipating portion 8. By aligning the notches 82, the heat radiating portion 8 can be positioned on the ring-shaped mounting portion 3, and the lead wire 112 can be taken out from the opening 38.

図13は、本発明の実施例におけるリング状取り付け部と収納部の取り付け状態を示す斜視図である。同図で示すように、駆動回路部11からのリード線112が収納部12aの蓋部9に形成された突部91の貫通孔部92より配線され、リング状取り付け部3に発光素子基板7を取り付けることで形成された開口部38と蓋部9の位置決め用突部91が嵌合するように収納部12bの平坦部41にリング状取り付け部3を載置し、ネジ等の固定部材6によって収納部12bとカバー取り付け部3を固定する。リード線112は突部91の位置に嵌合する開口部38より挿通し、発光素子基板7に半田付けされる。リング状取り付け部3には、発光素子基板7と放熱部8が取り付けられているため、収納部12bに固定することにより、放熱部8と発光素子基板7とリング状取り付け部3が順番に重なった状態となり、収納部12bの平坦部41と放熱部8は面接触することになり、発光素子73の熱が外部に放熱される構成となっている。 FIG. 13 is a perspective view showing an attachment state of the ring-shaped attachment portion and the storage portion in the embodiment of the present invention. As shown in the figure, the lead wire 112 from the drive circuit portion 11 is wired from the through hole portion 92 of the protrusion 91 formed in the lid portion 9 of the storage portion 12 a, and the light emitting element substrate 7 is connected to the ring-shaped attachment portion 3. The ring-shaped attachment portion 3 is placed on the flat portion 41 of the storage portion 12b so that the opening 38 formed by attaching the positioning portion 91 and the positioning projection 91 of the lid portion 9 are fitted, and the fixing member 6 such as a screw is mounted. The storage portion 12b and the cover attachment portion 3 are fixed by the above. The lead wire 112 is inserted through the opening 38 that fits into the position of the protrusion 91 and soldered to the light emitting element substrate 7. Since the light emitting element substrate 7 and the heat radiating part 8 are attached to the ring-shaped attaching part 3, the heat radiating part 8, the light emitting element substrate 7 and the ring-shaped attaching part 3 overlap in order by fixing to the storage part 12b. Thus, the flat portion 41 and the heat radiating portion 8 of the storage portion 12b are in surface contact, and the heat of the light emitting element 73 is radiated to the outside.

そして、リング状取り付け部3の上側からネジ等の固定部材6で収納部12bにリング状取り付け部3と発光素子基板7と放熱部8が固定できる。 And the ring-shaped attachment part 3, the light emitting element board | substrate 7, and the heat radiating part 8 can be fixed to the accommodating part 12b from the upper side of the ring-shaped attachment part 3 with the fixing members 6 such as screws.

次に透光性カバー2をリング状取り付け部3に取り付けるが、あらかじめリング状取り付け部3の凹部37に接着剤(図示せず)を塗布しておく。そしてリング状取り付け部3の凹溝33に透光性カバー2の縁21を取り付ける。 Next, the translucent cover 2 is attached to the ring-shaped attachment portion 3, and an adhesive (not shown) is applied in advance to the concave portion 37 of the ring-shaped attachment portion 3. Then, the edge 21 of the translucent cover 2 is attached to the concave groove 33 of the ring-shaped attachment portion 3.

このようにして、リング状取り付け部3の上面には透光性カバー2を取り付け、収納部12bにはリング状取り付け部3と発光素子基板7と放熱部8を取り付ける。また、リング状取り付け部3のベルト状の帯34によって、リング状取り付け部3と透光性カバー2のつなぎ目(境目)は見えないようになっており、見た目上の品位が良い。また、スペーサー13で嵌合することで、収納部12aに口金5が固定される。LED73から発生した熱は、発光素子基板7から放熱部8を介して収納部12bに伝わることで放熱される。また、口金5から取り込んだ商用電源を使用して駆動回路によってLED73を駆動することでLED73が発光する。そしてLED73からの光は透光性カバー2を通過して外部に照射される。 In this way, the translucent cover 2 is attached to the upper surface of the ring-like attachment portion 3, and the ring-like attachment portion 3, the light emitting element substrate 7, and the heat dissipation portion 8 are attached to the storage portion 12b. Further, the belt-shaped band 34 of the ring-shaped mounting portion 3 prevents the joint (border) between the ring-shaped mounting portion 3 and the translucent cover 2 from being seen, and the visual quality is good. Further, by fitting with the spacer 13, the base 5 is fixed to the storage portion 12 a. The heat generated from the LED 73 is dissipated by being transmitted from the light emitting element substrate 7 to the storage portion 12b via the heat dissipation portion 8. Further, the LED 73 emits light when the LED 73 is driven by a drive circuit using a commercial power source taken in from the base 5. And the light from LED73 passes the translucent cover 2, and is irradiated outside.

収納部12aの円筒部125には口金5を取り付けるためのネジ山128とスペーサー13を取り付けるための凸部123を形成し、スペーサー13の内側には凸部123に嵌合する凹部131を形成した構成とする。そして収納部12aを収納部12bの上側から入れて、収納部12bの下方から収納部12aの一部である円筒部125を突出させ、この円筒部125にスペーサー13を挿通して凸部123に凹部131を嵌合することで、スペーサー13を収納部12aに取り付けることができ、また、収納部12bに対して収納部12aが外れないようにスペーサー13によって固定することができる。そして、収納部12aに口金5を取り付けても、金属製の収納部12bと口金5の間に絶縁性のスペーサー13が介在するため、金属製の収納部12bと口金5を電気的に絶縁することができる。 A screw thread 128 for attaching the base 5 and a convex part 123 for attaching the spacer 13 are formed in the cylindrical part 125 of the storage part 12a, and a concave part 131 that fits the convex part 123 is formed inside the spacer 13. The configuration. Then, the storage portion 12a is inserted from the upper side of the storage portion 12b, the cylindrical portion 125 that is a part of the storage portion 12a is protruded from below the storage portion 12b, and the spacer 13 is inserted into the cylindrical portion 125 to form the convex portion 123. By fitting the recess 131, the spacer 13 can be attached to the storage portion 12a, and can be fixed by the spacer 13 so that the storage portion 12a is not detached from the storage portion 12b. Even when the base 5 is attached to the storage portion 12a, the insulating spacer 13 is interposed between the metal storage portion 12b and the base 5, so that the metal storage portion 12b and the base 5 are electrically insulated. be able to.

また、駆動回路部11を収納する収納部12aの蓋部9に形成された突部91の貫通孔部92から配線のリード線112を出すことから、発光素子基板7に溝部を設けて這わせる等の作業が不要となり、発光素子基板7と駆動回路部11の接続に要するリード線112を短くできると共にリード線112の線処理も容易となることから接続作業が改善される。 In addition, since the lead wire 112 of the wiring is taken out from the through-hole portion 92 of the protrusion 91 formed in the lid portion 9 of the storage portion 12a for storing the drive circuit portion 11, a groove portion is provided on the light emitting element substrate 7 to be formed. Thus, the lead wire 112 required for the connection between the light emitting element substrate 7 and the drive circuit unit 11 can be shortened and the wire processing of the lead wire 112 is facilitated, so that the connection work is improved.

なお、本発明の電球型ランプ1において、収納部12bの形状は、白熱電球のような形状だけでなく、円筒型やレフ型のような電球とは異なる形状であっても適用可能であり、本実施例に限定するものではなく、本発明の主旨に反しない範囲において適宜選定すればよい。 In the light bulb type lamp 1 of the present invention, the shape of the storage portion 12b is applicable not only to a shape such as an incandescent light bulb but also to a shape different from a light bulb such as a cylindrical shape or a reflex type, The present invention is not limited to this embodiment, and may be appropriately selected within a range that does not contradict the gist of the present invention.

1 電球型ランプ
2 透光性カバー
3 リング状取り付け部
5 口金
6 固定部材
7 発光素子基板
8 放熱部
9 蓋部
11 駆動回路部
12a 収納部
12b 収納部
13 スペーサー
91 突部
92 貫通孔部
DESCRIPTION OF SYMBOLS 1 Light bulb type lamp 2 Translucent cover 3 Ring-shaped attachment part 5 Base 6 Fixing member 7 Light emitting element substrate 8 Heat radiation part 9 Cover part 11 Drive circuit part 12a Storage part 12b Storage part 13 Spacer 91 Protrusion 92 Through-hole part

Claims (5)

発光素子が配置された発光素子基板と、前記発光素子から発生する熱を放熱する放熱部と、前記発光素子を覆う透光性カバーと、前記発光素子を駆動させる駆動回路部を収納する収納部と、前記駆動回路部に電気的に接続されると共に外部電源に接続される口金を備え、前記収納部には突部を形成した蓋部を設け、前記蓋部には配線を通す貫通孔部が形成されており、前記突部は、配線を通す前記貫通孔部と前記放熱部の位置決めを兼用することを特徴とする電球型ランプ。 A light receiving element substrate on which a light emitting element is disposed, a heat radiating part that dissipates heat generated from the light emitting element, a translucent cover that covers the light emitting element, and a storage part that houses a drive circuit unit that drives the light emitting element. And a cap that is electrically connected to the drive circuit unit and connected to an external power source, the storage unit is provided with a lid part having a protrusion, and the lid part is a through-hole part through which wiring is passed. The light bulb type lamp is characterized in that the protrusion serves as a positioning of the through hole portion through which the wiring passes and the heat radiating portion. 前記貫通孔部は、前記蓋部に形成された前記突部に設けたことを特徴とする請求項1に記載の電球型ランプ。 The bulb-type lamp according to claim 1, wherein the through-hole portion is provided in the protruding portion formed in the lid portion. 前記収納部は前記放熱部と接触させて取り付けることで、前記発光素子の熱を、前記放熱部を介して前記収納部から放熱させることを特徴とする請求項1から請求項のいずれか1項に記載の電球型ランプ。 The said accommodating part is made to contact with the said thermal radiation part, and the heat | fever of the said light emitting element is radiated from the said accommodating part via the said thermal radiation part, The any one of Claim 1 to 2 characterized by the above-mentioned. The light bulb type lamp according to item. 配線は前記突部に形成された前記貫通孔部を通して前記発光素子と前記駆動回路部を接続することを特徴とする請求項1から請求項のいずれか1項に記載の電球型ランプ。 The electric light bulb type lamp according to any one of claims 1 to 3 , wherein the wiring connects the light emitting element and the drive circuit portion through the through hole portion formed in the protrusion. 発光素子が配置された発光素子基板と、前記発光素子から発生する熱を放熱する放熱部と、前記発光素子を覆う透光性カバーと、前記発光素子を駆動させる駆動回路部を収納する収納部と、前記駆動回路部に電気的に接続されると共に外部電源に接続される口金を備え、前記収納部には突部を形成した蓋部を設け、前記蓋部には配線を通す貫通孔部が形成されており、前記突部が、配線を通す前記貫通孔部と前記放熱部の位置決めを兼用した電球型ランプにおいて、前記透光性カバーを取り付けるリング状取り付け部を備え、前記発光素子基板は前記放熱部と前記リング状取り付け部の間に挟持することを特徴とする電球型ランプA light receiving element substrate on which a light emitting element is disposed, a heat radiating part that dissipates heat generated from the light emitting element, a translucent cover that covers the light emitting element, and a storage part that houses a drive circuit unit that drives the light emitting element. And a cap that is electrically connected to the drive circuit unit and connected to an external power source, the storage unit is provided with a lid part having a protrusion, and the lid part is a through-hole part through which wiring is passed. The light emitting element substrate is provided with a ring-shaped mounting portion for mounting the translucent cover in a light bulb type lamp in which the projection serves as a positioning of the through hole portion through which the wiring passes and the heat radiating portion. bulb-type lamp, characterized in that clamped between the ring-shaped mounting portion and the heat radiating portion.
JP2010103145A 2010-04-28 2010-04-28 Light bulb lamp Expired - Fee Related JP4637268B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03156685A (en) * 1989-11-15 1991-07-04 Sanyo Electric Co Ltd Picture input device
JP2009206026A (en) * 2008-02-29 2009-09-10 Toshiba Lighting & Technology Corp Light-emitting element lamp and lighting fixture
JP2010034546A (en) * 2008-06-27 2010-02-12 Toshiba Lighting & Technology Corp Light-emitting element lamp and luminaire

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03156685A (en) * 1989-11-15 1991-07-04 Sanyo Electric Co Ltd Picture input device
JP2009206026A (en) * 2008-02-29 2009-09-10 Toshiba Lighting & Technology Corp Light-emitting element lamp and lighting fixture
JP2010034546A (en) * 2008-06-27 2010-02-12 Toshiba Lighting & Technology Corp Light-emitting element lamp and luminaire

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