JP4633325B2 - Substrate bonding equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate bonding method and apparatus, and more particularly, a bonding method capable of uniformly pressurizing and heat-bonding a plurality of stacked substrates without causing a thermal deformation by plane heating and the same. It relates to the device.
[0002]
[Prior art]
Conventionally, as shown in FIG. 2, the substrate is bonded to a support 82 on which the substrates a and b are placed, and is disposed above the support 82 so as to face each other with a predetermined interval. The load receiver 84, heating sources 86 and 86 arranged in the vertical direction on both side surfaces between the load support 84 and the support table 82 and the load support 84 facing each other with the required interval, and the support table 82. In order to apply a load to the substrates a and b when the substrates a and b placed on the substrate are heated and bonded, a heating and bonding apparatus in which an elevating mechanism 88 is attached to the weight receiver 84 via a rod 90 is used. .
[0003]
Then, after superimposing the substrates a and b on the support base 82, the upper load receiver 84 is lowered by the elevating mechanism 88 and is brought into contact with the substrate a to pressurize the substrates a and b, and at the same time, a heating source ( The heaters 86 and 86 are energized to join the substrates a and b. In the above, a lifting mechanism 88a is also attached to the support 82 via a rod 90a, and a method of pressing the substrates a and b from both sides at the time of heat bonding is also performed.
[0004]
However, in this bonding, the heating to the substrates a and b is indirect heating from the peripheral heating sources 86 and 86, and the heat is dissipated throughout the heating chamber, so that the temperature required for bonding the substrates a and b is reached. There is a problem that the heat loss is large until the temperature distribution of the substrates varies, and it takes a very long time to completely bond the substrates a and b, and the cooling time after the bonding also takes a long time. .
[0005]
In addition, as a method for solving the above-described problems in bonding between substrates, in recent years, methods and apparatuses for uniformly heating the entire surface of the substrate have been proposed (Patent Documents 1 and 2).
[0006]
[Patent Document 1]
JP-A-8-110504 ([0007], [0015])
[Patent Document 2]
JP-A-8-136937 (Claims 1, 2, [0014])
[0007]
[Problems to be solved by the invention]
In each of the above disclosure documents, a heating element that generates heat by energization is used as a method of uniformly heating the entire surface of the substrate in bonding between the substrates, but the heating element is composed of ceramic, quartz, A thin plate of insulating material such as a synthetic resin material printed with carbon and formed in the form of a planar heating element is attached and fixed to the surface of a stainless steel thin plate. However, since the conductor in this heating element is a thin plate of insulator printed with carbon in a pattern, the heating element is a planar heating element, but the temperature does not exist in the part with or without the conductor. There is a difference, and it is difficult to heat the entire surface of the substrate at a uniform temperature. In addition, when the temperature is high (about 200 ° C.), there is a problem that the heater is damaged due to a difference in thermal expansion between the insulator and the carbon serving as the heater, or that the insulator is damaged when a large load is applied during heating.
[0008]
The present invention solves the problems of the prior art as described above, and can uniformly heat the entire surface of the substrate with a uniform temperature distribution, and in that case, a uniform load is applied in a short time. A method and an apparatus capable of bonding substrates are provided.
[0009]
[Means for Solving the Problems]
A bonding apparatus according to claim 1 of the present application is a bonding apparatus for substrates that bonds a plurality of stacked substrates by heating and pressurizing, and has two upper and lower conductive plates sandwiching the plurality of substrates. A plurality of substrates placed on the lower conductive plate-like body, and a lower conductive plate-like body on which the plurality of substrates are placed; The upper conductive plate to be pressed has both ends connected to electrodes, and is connected to a weighted receiver via an insulator, and a lifting mechanism is connected to the weighted receiver. Is.
[0010]
A second aspect of the present invention is characterized in that, in the first aspect, the conductive plate-like body is a carbon plate-like body, and the third aspect of the invention is that the substrate is made of a metal, a semiconductor, or an insulator. It is characterized by being the same kind or different kind combination.
[0012]
According to the first aspect of the present invention, the upper and lower conductive plates sandwiching at least two substrates to be joined are energized from the electrodes while being applied with a weighting mechanism. By heating the substrate, heat is uniformly propagated over the entire surface of the substrate in a short heating time, and the temperature distribution is good. By using a conductive plate, the substrate is almost thermally deformed. In addition, by using a conductive plate-like body, this serves as a cushion and can be uniformly pressurized, so that the entire surface of the substrate can be uniformly pressure-bonded.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an example of an embodiment of the present invention will be described with reference to the drawings. FIG. 1 schematically shows a substrate bonding apparatus, in which at least two stacked substrates are bonded by pressing and heating. In the figure, reference numeral 2 denotes an upper conductive plate-like body, to which electrodes 6 are connected at both ends. Reference numeral 4 denotes a lower conductive plate-like member disposed with a predetermined distance from the upper conductive plate-like member 2, and the electrodes 8 and 8 are arranged at both ends in the same manner. ing.
[0014]
Reference numeral 10 denotes a weighted receiver attached on the insulator 12, which is moved up and down by an elevating mechanism 14 so as to contact and pressurize the upper conductive plate-like body 2. The lower conductive plate 4 on which the substrates a and b to be bonded are placed has a weight receiver 16 attached to its lower surface via an insulator 18 so that it can be operated by an elevating mechanism 20. It is configured.
[0015]
The operation of the above-described bonding apparatus will be described. In the state where the upper conductive plate 2 is disposed with a slight gap with respect to the lower conductive plate 4, the lower conductive plate After the substrates a and b to be bonded are superposed and placed on the body 4, the upper conductive plate 2 is lowered and the substrates a and b are sandwiched between the two plates 2 and 4. . Thereafter, the weight receiver 10 is lowered by the elevating mechanism 14 until the insulator 12 contacts the upper conductive plate-like body 2. Next, the load receiver 10 is further lowered, and at the same time, the load receiver 16 that is in contact with the lower conductive plate-like body 4 is also pushed up by the elevating mechanism 20 and the two plate-like bodies 2 are moved by the load receivers 10 and 16. While pressurizing 4, currents are passed from the electrodes 6, 8 to both the plate-like bodies 2, 4, and both the plate-like bodies 2, 4 are heated to heat and bond the substrates a, b.
[0016]
In the above, as the conductive plate-like bodies 2 and 4, a plate-like body made of a conductive material such as a carbon plate or stainless steel is used. In addition, since the plate-like body is directly surface-heat bonded in a state where the entire surface of the substrate is uniformly pressed by pressing, the temperature distribution on the substrate is good, the substrate is not thermally deformed, and a good bonded substrate can be obtained. it can.
[0017]
In addition, as a substrate to be joined, a metal plate such as Ni, Sn, Cu, Be, Fe, a semiconductor such as Si, Ge, Si compound, GaAs, GaP, ITO (InSnO ₃ ), Al ₂ O ₃ , ZrO ₂ , insulators (ceramics) such as SiN _x and SiO ₂ . In FIG. 1, an example of bonding a and b is shown for the bonding of the substrates. However, even if there are three or more, the bonding can be performed similarly. And the joining by the apparatus shown in FIG. 1 can be implemented in any atmosphere in a vacuum or air. Further, even when a sealant or a spacer is interposed between the substrates, the same implementation is possible. The insulator attached to one side of the weighted receiver is for preventing heat conduction of the generated heat to the weighted receiver, and a plate-like body such as porcelain, quartz, acrylic resin or polystyrene resin is used. .
[0018]
【The invention's effect】
As described above, according to the present invention, by using a conductive plate-like body such as a carbon plate-like body that generates heat by energization, the entire surfaces of at least two sandwiched substrates are uniformly heated in a short time. At the same time, this clamping allows the substrate to be pressurized during heating with a uniform distributed weight, thus enabling good bonding.
[Brief description of the drawings]
FIG. 1 is a schematic front view showing an embodiment of a joining apparatus according to the present invention.
FIG. 2 is a schematic view of a conventional joining apparatus.
[Explanation of symbols]
a, b Substrate 2, 4 Conductive plate-like body 6, 8 Electrode 10, 16 Weighted receptacle 12, 18 Insulator 14, 20 Lifting mechanism

Claims (3)

A substrate bonding apparatus for bonding a plurality of stacked substrates by heating and pressing,
Two upper and lower conductive plates sandwiching a plurality of substrates are arranged with a required interval,
The lower conductive plate on which the plurality of substrates are placed and the upper conductive plate that presses the plurality of substrates placed on the lower conductive plate are: also the rewritable heating by connecting the both ends to the electrode, the conductive of the lower a separate from each conductive plate-like body of the upper the lower conductive plate-like body and through the insulator The weight plate and the upper conductive plate are connected to a movable weight receiver that can move independently, and the weight receiver is connected to a lifting mechanism ,
The upper conductive plate-like member, the movable der Ru bonding apparatus vertically the weight receiving and independently.   The joining apparatus according to claim 1, wherein the conductive plate is a carbon plate.   The bonding apparatus according to claim 1, wherein the substrate is made of a metal, a semiconductor, or an insulator, and is the same type or a combination of different types thereof.

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