JP4624763B2 - Capacitive ultrasonic transducer and manufacturing method thereof - Google Patents

Description

  The present invention relates to a capacitive ultrasonic transducer obtained by processing a silicon semiconductor substrate using silicon micromachining technology.

  2. Description of the Related Art An ultrasonic diagnostic method using an intracorporeal ultrasonic diagnostic apparatus that irradiates an ultrasonic wave into a body cavity and images and diagnoses the state of the body from the echo signal has become widespread. One of the equipment used for this ultrasonic diagnostic method is an ultrasonic endoscope. In an ultrasonic endoscope, an ultrasonic transducer (ultrasonic transducer) is attached to the tip of an insertion portion to be inserted into a body cavity. This transducer converts an electrical signal into an ultrasonic wave and irradiates it into the body cavity. It receives ultrasonic waves reflected in the body cavity and converts them into electrical signals.

  Conventionally, in an ultrasonic transducer, a ceramic piezoelectric material PZT (lead zirconate titanate) has been used as a piezoelectric element that converts an electrical signal into an ultrasonic wave, but a silicon semiconductor substrate is processed using silicon micromachining technology. The capacitive ultrasonic transducer (Capacitive Micromachined Ultrasonic Transducer (hereinafter referred to as “c-MUT”)) has attracted attention (for example, Non-Patent Document 1). This is one of the elements collectively referred to as a micromachine (MEMS: Micro Electro-Mechanical System).

  The MEMS element is formed as a fine structure on a substrate such as a silicon substrate or a glass substrate, and includes a driver that outputs a mechanical driving force, a driving mechanism that drives the driving body, and a semiconductor integrated circuit that controls the driving mechanism. An element in which a circuit or the like is electrically and further mechanically coupled. The basic feature of a MEMS device is that a drive body configured as a mechanical structure is incorporated in a part of the device, and the drive body is driven by applying Coulomb attractive force between electrodes. It is done electrically.

  In Non-Patent Document 1, a c-MUT as shown in FIG. 15 is disclosed. FIG. 15A shows a top view of two sets of a one-dimensional c-MUT array composed of 64 transducer elements, and FIG. 15B shows a single unit provided with dummy neighbors (Dummy Neighbors). FIG. 15 (c) shows an enlarged view of a c-MUT element composed of 8 × 160 cells connected in parallel. FIG. 15 (c) shows a separated c-MUT element. Here, the transducer element is a minimum unit for inputting / outputting a drive control signal. This transducer element is composed of a plurality of transducer cells.

  The transducer element 500 includes a plurality of cells 501, an upper electrode 502 provided above each cell 501, a ground electrode 503, a dummy neighbor (Dummy Neighbor) 505, and a groove (trench) portion 506. The adjacent upper electrodes 502 are electrically connected, and are further connected to the ground electrodes 503 at both ends. The dummy neighbor 505 is for preventing crosstalk with adjacent elements. A groove 506 is provided between the electrodes 502 and 503 and the dummy neighbor.

  The upper electrode 502 is supported by a membrane. Although not shown, a lower electrode is provided inside the cell at a position facing the upper electrode 502, and there is a gap (cavity) between the lower electrode and the membrane. When a voltage is applied to the upper electrode 502 and the lower electrode of the transducer element 500, the cells 501 are simultaneously driven to vibrate all at the same phase. Thereby, ultrasonic waves are emitted.

In Non-Patent Document 1, a Lamb wave (A0 mode) of a silicon substrate and a Stoneley wave (boundary wave) between a solid phase and a liquid phase have a significant effect on crosstalk between adjacent transducer elements. The effect is reduced by using the transducer element 500.
Xucheng Jin, 3 others, "Characterization of One-Dimensional Capacitive Micromachined Ultrasonic Immonia Transducer Arrays" 48, NO. 3, P750-760, MAY 2001

  However, when the electrode portion 503 is provided between the groove portion 506, the dummy neighbor region 505, and the groove portion 506 and the cell region for transmitting and receiving ultrasonic waves, like the vibrator element 500, the vibrator cell occupying the whole vibrator element. The area ratio becomes smaller.

  In this case, in order to keep the area of the cell region to a certain size, it is necessary to enlarge the transducer element, and the ultrasonic transducer using this c-MUT cannot be reduced in size. Further, if the size of the element is to be maintained at the same level as the conventional one, it is necessary to reduce the area of the cell region, resulting in a decrease in output of the generated ultrasonic wave.

  In view of the above-described problems, in the present invention, in the capacitive ultrasonic transducer in which grooves are provided at both ends of the transducer element, the output of the ultrasonic wave to be generated without reducing the area ratio of the cell region in the whole Provided is a capacitive ultrasonic transducer that does not drop.

The above object is achieved according to the invention described in claim 1 of the appended claims, a silicon substrate, a first electrode and said first electrode opposite to the predetermined gap that is disposed on the upper surface of the silicon substrate in cMUT comprising a transducer element which is composed of a transducer cell consisting of a membrane that supports the second electrode and the second electrode disposed at a, adjacent A groove is provided between the transducer elements, and further, a through-hole electrode that penetrates the silicon substrate, a conductive film that is formed in the groove and is electrically connected to the second electrode, and the silicon substrate An electrode pad formed on a back surface and connected to a ground wiring, wherein the conductive film is electrically connected to the electrode pad via an ohmic contact region formed on the silicon substrate, and Electrode Can be achieved by providing a capacitive ultrasonic transducer, characterized in that said being through-hole electrode portion electrically connected.

The above object is achieved according to the invention described in claim 2 of the appended claims, further being bonded via the electrode pad to the back surface of the silicon substrate, a flexible printed circuit board on which the ground wiring is disposed This can be achieved by providing the capacitive ultrasonic transducer according to claim 1.

  According to the third aspect of the present invention, the bottom of the groove provided between the vibrator units composed of the vibrator elements arranged one-dimensionally is It can achieve by providing the capacitive ultrasonic transducer according to claim 2, which penetrates the silicon substrate and the electrode pad and reaches the surface of the flexible printed circuit board.

According to the invention described in claim 4, the conductive film is formed on a groove inner wall portion and a bottom portion of the groove portion, and is in contact with the second electrode. It can achieve by providing the capacitive ultrasonic transducer according to any one of Items 1 to 3.

  According to the invention described in claim 5 of the claim, the groove is filled with an ultrasonic attenuating material, according to any one of claims 1 to 4. This can be achieved by providing the described capacitive ultrasonic transducer.

The above object is achieved according to the invention described in claim 6 of the appended claims, the ultrasonic attenuation material, a main component at least any one of epoxy resin, silicone resin, and c Le Thanh resin It can be achieved by providing a capacitive ultrasonic transducer according to claim 5, which is a composite resin in which tungsten fine powder is mixed with resin.

  According to the seventh aspect of the present invention, the cross-sectional shape of the groove portion is a tapered shape in which the groove width decreases toward the bottom of the groove portion. This can be achieved by providing the capacitive ultrasonic transducer according to 1.

  According to the invention described in claim 8 of the claim, the above-mentioned problem is characterized in that the inner wall of the groove portion is provided with unevenness of the order of sub-μm or more. This can be achieved by providing the capacitive ultrasonic transducer described in (1).

According to the ninth aspect of the present invention, the surface of the groove penetrated is coated with the conductive film, and the groove surface is disposed on the flexible printed circuit board. 4. The capacitive ultrasonic transducer according to claim 3, wherein the capacitive ultrasonic transducer is connected to the grounded wiring via a conductive adhesive, a ball bump, or an anisotropic conductive sheet. Can be achieved.

  According to the invention described in claim 10, the groove has a curved shape or a saw-tooth shape other than at least a linear shape when the vibrator element is viewed from above. It can achieve by providing the capacitive ultrasonic transducer of any one of Claims 1-9 characterized by the above-mentioned.

The above object is achieved according to the invention described in claim 11 of the appended claims, a silicon substrate and a through-hole electrodes extending through the silicon substrate, it is disposed on the upper surface of the silicon substrate the through-hole electrode portions transducer cell composed of a membrane for supporting the first electrode and the first electrode opposite to the second electrode and the second electrode disposed at a predetermined gap that is electrically connected with the A vibrator element comprising: an electrode pad formed on the back surface of the silicon substrate and connected to a ground wiring; and a flexible electrode on which the ground wiring is disposed and bonded to the back surface of the silicon substrate via the electrode pad and the printed circuit board, method of manufacturing a capacitive ultrasonic transducer comprising: a groove forming step of forming a groove between the transducer elements adjacent the second electrode and electrically contacts the groove Includes a conductive forming a third electrode to be a, the conductive process, the silicon substrate, forming an ohmic contact region for electrically connecting the third electrode and the electrode pad This can be achieved by providing a method for manufacturing a capacitive ultrasonic transducer , comprising a contact region forming step .

  According to the twelfth aspect of the present invention, in the conductive step, after the ion implantation or the chemical vapor deposition method is performed, the third electrode is obtained by performing a diffusion treatment. It can achieve by providing the manufacturing method of the capacitive ultrasonic transducer | vibrator of Claim 11 characterized by forming.

The above object is achieved according to the invention described in claim 13 of the appended claims, and in the conductive process, to claim 11, characterized by forming said third electrode by a physical vapor growth method This can be achieved by providing a method for producing the described capacitive ultrasonic transducer.

According to the invention described in claim 14, the object further includes an ultrasonic attenuating material filling step of filling the groove where the third electrode is formed with an ultrasonic attenuating material. It can achieve by providing the manufacturing method of the capacitive ultrasonic transducer of any one of Claims 11-13 characterized by the above-mentioned.

According to the fifteenth aspect of the present invention, the subject further includes a first cutting step of cutting the groove filled with the ultrasonic attenuation material. It can achieve by providing the manufacturing method of the capacitive ultrasonic transducer described in 1.

According to the invention described in claim 16, the above-described problem is a second cutting in which the groove portion is cut until it reaches the surface of the flexible printed circuit board through the silicon substrate and the electrode pad. It can achieve by providing the manufacturing method of the capacitive ultrasonic transducer of any one of Claims 11-15 characterized by including a process.

  According to the invention described in claim 17 of the claim, the first cutting step is performed by using a laser beam, and the capacitance type according to claim 15. This can be achieved by providing a method for manufacturing an ultrasonic transducer.

  According to the invention described in claim 18 of the claim, the second cutting step is performed by using a laser beam, and the electrostatic capacity type according to claim 16. This can be achieved by providing a method for manufacturing an ultrasonic transducer.

  According to the invention as set forth in claim 19, the above-mentioned object is provided with the capacitive ultrasonic transducer according to any one of claims 1 to 10. This can be achieved by providing a sonic endoscope.

  By using the present invention, it is not necessary to reduce the area ratio of the cell region in the entire capacitive ultrasonic transducer having grooves at both ends of the element. Thereby, the output of the generated ultrasonic wave is not reduced.

<First Embodiment>
In the present embodiment, the manufacture of a transducer element in which a ground electrode is provided at the bottom of the groove will be described.

  FIG. 1 shows a capacitive radial scanning array ultrasonic transducer according to this embodiment. The capacitive radial scanning array ultrasonic transducer 1 includes a transducer unit 2 composed of a plurality of transducer elements 3, a control circuit unit 4, and an FPC (flexible printed circuit board) 5 for wiring.

  The plurality of rectangular vibrator units 2 are connected in series in the lateral direction, and form a cylindrical shape. The wiring FPC 5 has a wiring pattern and electrode pads formed on the FPC. The control circuit unit 4 is arranged as one control circuit unit per one transducer unit by aligning the position of the transducer unit 2 on the surface opposite to the cMUT with respect to the FPC 5. Through-holes penetrating the FPC are formed in units of cMUT elements, and the cMUT unit and the control circuit unit are arranged through the through-holes. The control circuit unit 4 includes an integrated circuit such as a pulser, a charge amplifier, and a multiplexer. The shape of the vibrator unit 2 is not limited to a rectangle.

  FIG. 2 shows a top view of the single vibrator unit 2 in the present embodiment. The transducer unit 2 is composed of a plurality of square transducer elements 3. In the figure, the vibrator unit 2 is configured by arranging a plurality of vibrator elements 3 in one dimension. A transducer unit arrangement direction groove 7 is provided between adjacent transducer units. In addition, an inter-vibrator element groove 6 is provided between adjacent vibrator elements in each vibrator unit. The shape of the transducer element is not limited to a square.

  FIG. 3 shows a top view of a single element of the transducer element 3 in the present embodiment. The transducer element 3 includes a transducer unit arrangement direction groove 7, a transducer element groove 6, transducer cell electrode interconnect electrodes 8, 9, 10, a transducer cell upper electrode 11, a sacrificial layer agent removal hole 13, and a lower electrode. The through hole electrode portion 14 is configured. A cavity is formed on the back surface (perpendicular to the drawing) of the transducer cell upper electrode 11, which is represented as a cavity peripheral edge 12.

  The transducer element 3 is composed of a plurality of transducer cells, and the transducer cell is equal to the number of cavities, and is composed of four transducer cells in FIG. Reference numeral 15 denotes a dicing line for dicing.

FIG. 4 is a cross-sectional view taken along Aa-Ab in FIG. In this cross section, in the vibrator element 3, as described above, the structural unit indicated by 30 is called a vibrator cell. The membrane refers to a film covering the upper portion of the cell 30, and in FIG. 4, refers to a film composed of the upper electrode 11, the membrane upper layer 24, and the membrane lower layer 22. This membrane is a vibrating membrane fixed by membrane support portions 20 at both ends of each transducer cell. A lower electrode 19 is formed on the surface of the silicon substrate 16 (the bottom portion of the recess) between the membrane support portions 20 so as to face the upper electrode 11, and a dielectric film 27 (for example, SiO ₂ ) is formed thereon. ing.

  The lower electrode 19 is provided with a lower electrode through-hole electrode portion 14 for electrically connecting the lower electrode 19 and a signal input / output terminal electrode pad 26 provided on the bottom surface of the silicon substrate 16. Specifically, the lower electrode 19 and the signal input / output terminal electrode pad 26 are electrically connected by an interconnect wiring 191 formed on the hole surface of the lower electrode through-hole electrode portion 14.

  The bottom surface of the silicon substrate 16 is coated with a silicon oxide film 17. The upper electrode 11 and the transducer cell electrode interconnect electrode 10 are made of a metal film. The upper electrode is electrically connected to the metal film coated on the side and bottom surfaces of the groove portions 6 and 7.

The ground electrode pad 25 is a pad for electrically connecting the electrodes formed on the bottom surfaces of the grooves 6 and 7 to the bottom surface of the silicon substrate 16 in order to connect the upper electrode 11 to the GND.
The dielectric film 27 is for amplifying the capacitance between the upper electrode 11 and the lower electrode 19 across the cavity. The depletion layer 18 is a layer in which almost no electrons or holes exist.

  Note that the cavity (void portion) 21 refers to a space surrounded by the membrane, the membrane support portion 20, the lower electrode 19, and the dielectric film 27. As will be described later with reference to FIG. 5, the membrane is composed of a plurality of membrane films in the manufacturing process. In addition, the “contact resistance” between the electrode disposed at the bottom of the grooves 6 and 7 and the installation electrode pad 25 is infinitely small (ohmic contact).

  The operation of the transducer cell 30 will be described. When a voltage is applied to the pair of electrodes of the upper electrode 11 and the lower electrode 19, the electrodes are pulled together, and when the voltage is reduced to 0, the original state is restored. As a result of the vibration of the membrane by this vibration operation, ultrasonic waves are generated, and the ultrasonic waves are irradiated upward in the upper electrode 11.

5 (FIGS. 5A, 5B, and 5C), a manufacturing process of the capacitive ultrasonic transducer in this embodiment will be described.
First, the upper surface of the N-type silicon substrate 40 (thickness: about 100 to 500 μm) is masked with an oxide film (SiO ₂ ) 202 (S1). For the mask formation, an oxide film having a thickness of about 3000 to 4000 mm is formed by a wet oxidation method. Then, patterning for forming the lower electrode through-hole electrode portion 42 is performed in the photolithography process, and the oxide film patterned in the etching process is removed.

  Next, by performing ICP-RIE (Inductively Coupled Plasma Reactive Ion Etching), a hole 42 is opened in a portion not masked by S1 (S2).

Next, a depletion layer 43 is formed (S3). Here, first, the bottom surface of the N-type silicon substrate 40 is also masked with an oxide film (SiO ₂ ), and patterning for forming the depletion layer 43 is performed on the upper and lower surfaces of the N-type silicon substrate 40 by etching. The oxide film patterned in the process is removed. Then, P-type diffusion layers are formed by implanting P-type ions and performing heat treatment.

Next, the contact layer (N +) 44 is formed on both surfaces (S4). The portions other than the portion where the contact layer 44 is formed are masked with SiO ₂ by the mask formation step, the photolithography step, and the etching step. Then, N-type diffusion layers are formed by implanting N-type ions into the unmasked portion and performing heat treatment. This is performed for the contact layers (N +) 44 on both sides of the silicon substrate.

  Next, an electrode film (Pt / Ti) 45 is formed on both surfaces (S5). First, after removing the mask 41, the portion other than the portion where the electrode film is formed is masked with a resist material. Thereafter, an electrode film 45 is formed by sputtering, and the resist material masked in the lift-off process is removed. The material of the electrode is not limited to Pt / Ti, but may be Au / Cr, Mo, W, phosphor bronze, Al, or the like.

Next, a dielectric film is formed (S6). A dielectric film (for example, SrTiO ₃ ) 50 is formed through a mask formation process, a sputtering process, and a lift-off process. The dielectric film 50 is not limited to SrTiO _3, but is a high dielectric such as barium titanate BaTiO ₃ , barium strontium titanate, tantalum pentoxide, niobium oxide stabilized tantalum pentoxide, aluminum oxide, or titanium oxide TiO _2. A material having a rate may be used.

  Next, a membrane support layer is formed (S7). After masking the portion other than the portion for forming the membrane support portion, a SiN layer is formed by CVD, and the mask is removed. As a result, a membrane support is formed.

Next, polysilicon 52 is filled as a sacrificial layer between the membrane support portions formed in S7 (S8). In this embodiment, polysilicon is used for the sacrificial layer, but there is no particular limitation as long as the member can be etched, such as SiO ₂ .

  Next, a membrane is formed (S9). First, the portions to be the sacrificial layer etching hole 54 and the groove 55 are masked. Then, a SiN film 53 is formed by CVD. Then the mask is removed. As a result, the membrane 53, the sacrificial layer etching hole 54, and the groove 55 are formed.

Next, the sacrificial layer 52 is removed by etching (S10). In this embodiment, since poly-Si is used for the sacrificial layer, the sacrificial layer is removed from the sacrificial layer etching hole 54 by etching using XeF ₂ as an etcher. As a result, the cavity 56 and the groove 55 are formed.

  Next, the sacrificial layer etching hole 54 is closed (S11). First, the bottom portion (contact electrode) of the groove 55 is masked, and a SiN film is formed on the entire upper surface of the element using CVD. Then, the mask is removed, and the bottom portion (contact electrode) of the groove 55 is exposed.

  Finally, as shown in FIG. 3, the transducer cell electrode interconnect electrodes 8, 9, 10, the transducer cell upper electrode 11, the bottom electrode of the transducer unit arrangement direction groove 7, and the transducer element groove 6 The electrode element (Pt / Ti) 61 is formed on the entire top surface of the transducer element by masking other than the bottom electrode and performing sputtering and lift-off (S12), whereby the transducer element 3 is completed.

  In this embodiment, in the formation of the electrode film (and the contact layer), that is, in the process of forming the electrode in the groove (conducting process), ion implantation or CVD (Chemical Vapor Deposition) is used. Diffusion treatment or PVD (Physical Vapor Deposition) is performed.

  As described above, by forming the ground electrode in the groove portion, there is no need to separately provide a region for the ground electrode in the transducer element, and the area ratio of the ultrasonic output region in the transducer element is not reduced. . Further, since the groove is provided, the influence of crosstalk between adjacent elements can be suppressed.

In this embodiment, a radial type capacitive ultrasonic transducer is used as an example. However, the present invention is not limited to this, and may be a convex type or a linear type.
<Second Embodiment>
In the present embodiment, variations in the shape of the groove provided in the transducer element will be described.

  FIG. 6 shows an example (part 1) of variations in the shape of the groove in the present embodiment. Reference numerals 70 and 71 denote groove portions. Reference numeral 76 denotes a silicon substrate. Reference numeral 72 (72a, 72b, 72c) denotes a contact electrode on the upper surface side of the silicon substrate 76. Reference numeral 73 (73a, 73b, 73c) denotes a contact layer formed around the contact electrode 72 (72a, 72b, 72c). Reference numeral 74 denotes a contact electrode on the lower surface side of the silicon substrate 76. Reference numeral 75 denotes a contact layer formed around the contact electrode 74. Reference numerals 77 and 78 denote SiN layers. Reference numeral 79 denotes an electrode film.

  70 shows a case where the groove is tapered and the opening is wider than the bottom. By doing in this way, when the hole diameter is larger than a certain size, it is possible to form an electrode using sputtering. Further, compared with the case where the side surface of the groove is vertical, the electrode film is easily attached by sputtering, and the film can be formed thicker. Thereby, the reliability of the wiring is improved.

Reference numeral 71 denotes a case where irregularities are formed on the surface of the groove side surface by the Bosch process. The Bosch process is a process in which C ₄ F ₈ and SF ₆ are used as a reaction gas, and alternately switching etching and passivation (providing a protective film on the surface so as not to cause a chemical reaction) are repeated. High aspect ratio processing is possible. When the groove is formed by the Bosch process, it is possible to change the timing of passivation and etching to form a taper or unevenness.

  The wavy line irregularities formed by a normal Bosch process are on the order of several to several tens of nm. However, in this embodiment, in order to increase the adhesion strength, the groove sidewall is provided with unevenness of the order of sub-μm or more. The unevenness improves the adhesion of SiN, which is the same material as the membrane to be applied, and the conductor thin film connected to the upper electrode. And the adhesiveness of the ultrasonic attenuation material mentioned later improves, and it leads to the strength improvement at the time of cutting by precision cutting.

  As described above, by forming irregularities on the surface of the side surface of the groove using the Bosch process, the surface area is increased, and the electrode film and SiN film applied in the subsequent process are difficult to peel off. The GND of the contact electrode 72 (72a, 72b, 72c) at the bottom of the groove is connected from the contact electrode 74 via the silicon substrate 76.

The trench part on the left side of FIG. 6 shows an example in which the bottom part is wider than the opening part. Thus, the shape of the groove may be any shape.
FIG. 7 shows an example (part 2) of variations in the shape of the groove in the present embodiment. This figure shows a case where the bottom of the groove is dug down into the silicon substrate 76 from FIG. After etching to the silicon substrate 76, a contact layer 73 is formed, and an electrode is formed on the contact layer 73 as a base. That is, after the contact layer is formed, a film of SiN (which closes the hole for removing the sacrificial layer) is formed by CVD, and the electrode 79 connected to the membrane is formed so that the contact layer surface does not have resistance due to natural oxidation or the like. Before film formation, an electrode material having strong corrosion resistance is formed as a base electrode.

  As described above, the distance between the contact electrode 72 (72a, 72b, 72c) and the contact electrode 74 is shortened, and the electrical loss can be reduced, so that the reliability of the wiring is improved.

  In addition, since it is dry etching, it can be etched in a wavy line as long as there is no problem in mechanical strength. That is, normal groove formation (similar to cutting) is performed with a dicing saw (precision cutting machine), but therefore, grooves can only be formed in a straight line. However, in dry etching such as ICP-RIE, grooves can be formed in any shape including wavy lines.

  In addition, when the groove surface is irregular, there is an effect of reducing crosstalk from the viewpoint that a certain resonance hardly occurs due to a difference in length. In addition, there is an effect that the ground electrode can be easily taken out from the back surface of the substrate.

  In addition, the structure in which the silicon substrate has grooves also has an effect of reducing crosstalk. In other words, ultrasonic waves are transmitted and received by bending vibration of the membrane, and the bending vibration causes crosstalk between adjacent elements due to vibrations such as Lamb waves or Stoneley waves. Further, the bending vibration transmits the longitudinal vibration stress to the membrane support portion in a reactive manner. This vibration reaches the surface of the silicon substrate from the base of the membrane support, propagates along the surface of the silicon substrate, travels back along the same path to the adjacent element, and causes crosstalk. The occurrence of such crosstalk can be reduced.

  FIG. 8 shows an example (part 3) of variations in the shape of the groove in the present embodiment. This figure shows the case where the contact layers on both sides of the silicon substrate 76 are joined. As shown in the figure, when the silicon substrate 76 is thin or when the trench (for GND) is etched in the silicon substrate, contact layers 73 and 75 are formed and diffused to form a contact layer. Layers can be connected. By doing so, since a region having a low resistance value is formed between the contact electrode 72 and the contact electrode 74, electrical conduction is facilitated, and electrical loss can be reduced, so that the reliability of the wiring is improved. To do.

<Third Embodiment>
In the present embodiment, variations of the capacitive vibrator element will be described.
FIG. 9 shows an example (part 1) of variations of the capacitive vibrator element according to this embodiment.

Reference numeral 80 denotes a groove. Reference numeral 86 denotes a silicon substrate. Reference numeral 82 denotes a contact electrode on the upper surface side of the silicon substrate 86. Reference numeral 83 denotes a contact layer formed around the contact electrode 82. Reference numeral 84 denotes a contact electrode on the lower surface side of the silicon substrate 86. Reference numeral 85 denotes a contact layer formed around the contact electrode 84. Reference numerals 87 and 88 denote SiN layers. Reference numeral 89 denotes an electrode film. Reference numeral 90 denotes an SiO ₂ film. Reference numeral 81 denotes a lower electrode through-hole electrode portion.

This figure shows the case where the vicinity of the contact electrode on the lower surface side of the silicon substrate 86 is also etched. In step S1 in FIG. 5, the lower surface of the silicon substrate is also masked with SiO ₂ , and the electrode contact portion is etched by wet etching so that a concave shape is obtained. By doing so, the distance between the contact electrodes (82, 84) on both sides becomes shorter and the electrical loss can be reduced, so that the reliability of the wiring is improved.

  Similarly to FIG. 7, adopting a configuration in which the groove portion erodes into the silicon substrate 86 has an effect of reducing crosstalk. That is, ultrasonic waves are transmitted / received by bending vibration of the membrane, and the bending vibration causes crosstalk between adjacent elements due to vibration by Lamb wave or Stoneley wave. Further, the bending vibration transmits the longitudinal vibration stress to the membrane support portion in a reactive manner. This vibration reaches the surface of the silicon substrate from the base of the membrane support, propagates along the surface of the silicon substrate, travels back along the same path to the adjacent element, and causes crosstalk. By adopting a configuration in which the groove portion erodes into the silicon substrate 86, such crosstalk can be reduced. Also, there is an effect that the ground electrode can be easily taken out from the back surface of the substrate.

Instead of forming the depletion layer, a SiO ₂ wet oxide film may be used. This is because a dense film can be obtained by wet oxidation. Further, after forming the groove, in the case of an N-type silicon substrate, the contact layer (N +) may be formed by doping N + in the groove and performing diffusion treatment by heating. Further, the shape of the groove may be a shape in which a part of the groove bottom portion is deeper, or a shape in which the hole reaches the lower surface of the silicon substrate.

  FIG. 10 shows an example (part 2) of variations of the capacitive vibrator element according to the present embodiment. This figure shows the case where the cavity 91 is formed by etching the silicon substrate 86. In this case, the silicon substrate 86 also functions as a membrane support portion.

  First, anisotropic etching of Si is performed using TMAH (Tetramethyl Ammonium Hydroxide). Thus, a cavity 91 and a groove 80 having a predetermined depth are formed on the upper surface side of the silicon substrate 86, and a recess 95 is formed on the lower surface side.

  Next, the through hole 81 is formed by ICP-RIE. Thereafter, an oxide film 90 is formed by wet oxidation (used as a depletion layer). Next, a lower electrode 92 (Pt / Ti) is formed, and a conductor is applied to the side wall of the through hole 81.

  Next, a dielectric 93 is formed on the upper surface of the lower electrode 92 and heat treatment is performed. Thereafter, a sacrificial layer is formed in the cavity 91, and a SiN membrane 87 is formed thereon. A hole 94 is formed in the formed membrane and the sacrificial layer is etched away. Thereafter, the hole 94 for removing the sacrificial layer is filled with SiN (88). An upper electrode (89) is formed thereon.

By doing in this way, it is not necessary to provide the process of forming a membrane support part separately, and the number of processes can be reduced.
FIG. 11 shows an example (part 3) of variations of the capacitive vibrator element according to the present embodiment. FIG. 12 shows an example (part 4) of variations of the capacitive vibrator element according to the present embodiment. 11 and 12 show the case where the groove 80 is filled with the resin 100. FIG.

  The difference between FIG. 11 and FIG. 12 is whether or not the contact electrode on the lower surface of the silicon substrate 86 has a concave shape. If the groove portion 80 is not filled with the resin 100, a transverse standing wave (unnecessary vibration) may be excited in the vibrator, and good ultrasonic characteristics cannot be obtained. Therefore, the groove portion 80 is filled with the resin 100. As the material, in order to attenuate the vibration caused by unnecessary ultrasonic waves, a flexible composite resin in which powders such as tungsten fine powder and glass bubbles are mixed with silicone resin, epoxy resin, urethane resin, etc. is used as the ultrasonic attenuation material. . In this way, unnecessary vibration can be suppressed.

  1 to 4 (grooves are formed in the vertical and horizontal directions when the transducer element is viewed from above), at least the type in which the transducer array has a curvature, such as convex and radial, One side (for example, the upper surface) is diced. At this time, if the filling resin is present, the stress is reduced, and electrode peeling and chipping are reduced. As described above, the reliability of the wiring is improved and the chipping is reduced, so that the space between the cavity and the groove can be shortened, so that the effective portion increases in design, and the sound pressure per unit area increases, that is, Leads to improved sensitivity and reduced size.

  FIG. 13 shows an example (No. 5) of a variation of the capacitive vibrator element according to this embodiment. This figure shows a case where the vibrator element is bonded to an FPC (flexible printed circuit board) using the conductive resin 101. Instead of the conductive resin 101, an ACF (Anisotropic Conductive Film) or a ball bump such as Au or solder may be used. Further, the gap 104 between the lower surface of the silicon substrate 86 and the FPC 102 may be filled with resin.

  The dicing groove 105 can be formed by dicing without filling the groove portion 80 with resin, or the dicing groove 105 can be formed by filling the groove portion 80 with resin and dicing. After dicing, the transducer may be bent and then filled with a resin material having a large attenuation. If the depth of the cutting groove is a type that bends the transducer element such as a convex type or a radial type, it is necessary to cut the conductive resin 101, but at least silicon that does not bend such as a linear type is required. The substrate 86 may be diced. In addition, if the electrode part on the FPC side of the silicon is concave or hole-like, a positioning function can be obtained, and the mechanical strength of the connection is improved by increasing the adhesive surface area, so that a highly reliable vibrator can be obtained. Can be made.

  Note that a laser beam may be used when penetrating the silicon substrate. By using a laser beam, it is possible to cut and cut a groove in any shape as in dry etching. Therefore, the effect of reducing crosstalk and the wavy shape increase the contact area of the electrode and improve the adhesion strength. In addition, since the element can be formed in an arbitrary shape, cell arrangement can be arbitrarily performed, and high density (such as a large cell area in the element) can be achieved. This is important for achieving high sensitivity in a limited space such as an endoscope.

  Normally, when viewed from above the vibrator element, the groove is linear as shown in FIG. 3, but it is also possible to form a curved groove by using photolithography and etching. An example of this is shown in FIG.

FIG. 14 is a diagram illustrating an example in which a curved groove is formed when the transducer element 3 according to the present embodiment is viewed from above. FIG. 14 (a), the groove 111 (the lateral direction of the groove 111a surrounding the transducer element 3, the longitudinal groove 111b is curved, an example of a case where the linearly dialog Thing (dialog single line 110) Thus, the entire circumference of the transducer element may have a wavy groove shape.

FIG. 14 (b), a groove 111a surrounding the transducer element, and the 111b curved, an example of a case where the dialog sequencing (dialog single line 110) in a curved line. If laser dicing is used, dicing can be performed along the curved groove.

FIG. 14 (c), of the grooves surrounding the transducer element, longitudinal grooves 111b linear, lateral grooves 111a and curved, when dialog sequencing (dialog single line 110) linearly An example is shown. Reference numeral 112 denotes a ground electrode. In this way, a partially wavy groove structure may be provided.

Besides the example of FIG. 14 also, the shape of the shape and dialog sequencing of the groove is, of course, may be one even other such irregular a square wave or sawtooth wave.
In a straight groove, resonance becomes intense and standing waves tend to occur. However, if it is not linear, unnecessary vibrations cancel each other and weaken. As a result, crosstalk is reduced, the S / N ratio is improved, and a high-quality image can be obtained. In addition, the same function and effect can be given by adopting the dicing position and the attenuation resin to be filled in a curved shape.

It is a figure which shows the electrostatic capacitance type radial scanning array ultrasonic transducer | vibrator in 1st Embodiment. It is a figure which shows the top view of the vibrator | oscillator unit 2 single-piece | unit in 1st Embodiment. It is a figure which shows the upper side figure of the vibrator | oscillator element 3 single-piece | unit in 1st Embodiment. It is sectional drawing about Aa-Ab of FIG. FIG. 5 is a diagram (part 1) illustrating a manufacturing process of the capacitive ultrasonic transducer in the first embodiment. FIG. 6 is a diagram (part 2) illustrating a manufacturing process of the capacitive ultrasonic transducer in the first embodiment. FIG. 6 is a diagram (part 3) illustrating a manufacturing process of the capacitive ultrasonic transducer in the first embodiment; It is a figure which shows an example (the 1) of the variation of the shape of the groove | channel in 2nd Embodiment. It is a figure which shows an example (the 2) of the variation of the shape of the groove | channel in 2nd Embodiment. It is a figure which shows an example (the 3) of the variation of the shape of the groove | channel in 2nd Embodiment. It is a figure which shows an example (the 1) of the variation of the electrostatic capacitance type vibrator element in 3rd Embodiment. It is a figure which shows an example (the 2) of the variation of the electrostatic capacitance type vibrator element in 3rd Embodiment. It is a figure which shows an example (the 3) of the variation of the capacitive vibrator | oscillator element in 3rd Embodiment. It is a figure which shows an example (the 4) of the variation of the electrostatic capacitance type vibrator element in 3rd Embodiment. It is a figure which shows an example (the 5) of the variation of the electrostatic capacitance type vibrator element in 3rd Embodiment. It is a figure which shows an example in the case of forming a curved groove | channel, when the transducer | vibrator element 3 in 3rd Embodiment is seen from an upper surface. It is a figure which shows the conventional c-MUT.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Capacitance type radial scanning array ultrasonic transducer 2 Transducer unit 3 Transducer element 4 Control circuit unit 5 FPC for wiring
6 Groove between transducer elements 7 Grooves in transducer unit arrangement direction 8, 9, 10 Interconnect electrode between transducer cell electrodes 11 Upper electrode 12 Cavity peripheral portion 13 Sacrificial layer agent removal hole 14 Lower electrode through-hole electrode portion 15 Dicing line 16 Silicon Substrate 17 Silicon oxide film 18 Depletion layer 19 Lower electrode 191 Interconnect wiring 20 Membrane support part 21 Cavity 22 Membrane lower layer (cavity forming coating film)
23 Sacrificial layer removal hole 24 Membrane upper layer (Sacrificial layer removal hole shielding film)
25 Ground electrode pad 26 Signal input / output terminal electrode pad 27 Dielectric film 30 Transducer cell 70, 71 Groove 72 (72a, 72b, 72c) Contact electrode 73 (73a, 73b, 73c) Contact layer 74 Contact electrode 75 Contact layer 77 , 78 SiN layer 79 Electrode film 80 Groove part 81 Lower electrode through-hole electrode part 82 Contact electrode 83 Contact layer 84 Contact electrode 85 Contact layer 86 Silicon substrate 87,88 SiN layer 89 Electrode film 90 SiO ₂ film

Claims (19)

Supporting a silicon substrate, the first electrode and the first electrode opposite to the second electrode and the second electrode disposed at a predetermined gap that is disposed on the upper surface of the silicon substrate A capacitive ultrasonic transducer including a transducer element composed of a transducer cell comprising a membrane,
Providing a groove between adjacent transducer elements ;
A through-hole electrode portion penetrating the silicon substrate;
A conductive film formed in the groove and electrically connected to the second electrode;
An electrode pad formed on the back surface of the silicon substrate and connected to a ground wiring;
The conductive film is electrically connected to the electrode pad through an ohmic contact region formed on the silicon substrate,
The capacitive ultrasonic transducer is characterized in that the first electrode is electrically connected to the through-hole electrode portion . Moreover, are joined through the electrode pads on the back surface of the silicon substrate, the capacitive ultrasonic transducer according to claim 1, characterized in that it comprises a flexible printed circuit board on which the ground wiring is disposed .   The bottom of the groove provided between the transducer units composed of the transducer elements arranged in a one-dimensional manner passes through the silicon substrate and the electrode pad and reaches the surface of the flexible printed circuit board. The capacitive ultrasonic transducer according to claim 2. 4. The capacitive ultrasonic vibration according to claim 1, wherein the conductive film is formed on a groove inner wall portion and a bottom portion of the groove portion and is in contact with the second electrode. 5. Child.   The capacitive ultrasonic transducer according to claim 1, wherein the groove is filled with an ultrasonic attenuation material. The ultrasonic attenuation material, an epoxy resin, claim, characterized in that a silicone resin, and c Le Thanh composite resin mixed with tungsten powder in a resin mainly composed of at least any one of resin 5 The capacitive ultrasonic transducer according to 1.   2. The capacitive ultrasonic transducer according to claim 1, wherein a cross-sectional shape of the groove portion is a tapered shape in which a groove width decreases toward a bottom portion of the groove portion.   8. The capacitive ultrasonic transducer according to claim 1, wherein the inner wall of the groove is provided with unevenness on the order of sub μm or more. 9. The penetrated groove surface is coated by the conductive film surface, the groove surface conductive adhesive to said ground wiring disposed on the flexible printed circuit board, the ball bump or anisotropic conductor sheet The capacitive ultrasonic transducer according to claim 3, wherein the capacitive ultrasonic transducers are connected via each other.   10. The groove according to claim 1, wherein the groove has a curved shape or a saw-tooth shape other than at least a linear shape when the vibrator element is viewed from above. Capacitive ultrasonic transducer. A silicon substrate, a through-hole electrodes extending through the silicon substrate, opposite to the first electrode and the first electrode is disposed on the upper surface of the silicon substrate connected said in electrical through-hole electrode portions a transducer element consisting of the transducer cell composed of a membrane for supporting the second electrode and the second electrode disposed at a predetermined gap, formed on a rear surface of the silicon substrate and the ground line an electrode pad connected, in the manufacturing method of the capacitive ultrasonic transducer comprising a flexible printed circuit board bonded to a rear surface of the silicon substrate through the electrode pad the ground wiring is disposed,
A groove forming step of providing a groove between the adjacent transducer elements;
Forming a third electrode electrically connected to the second electrode in the groove, and
The conductive step includes a contact region forming step of forming an ohmic contact region that electrically connects the electrode pad and the third electrode to the silicon substrate. A method for manufacturing a capacitive ultrasonic transducer.   12. The capacitive ultrasonic wave according to claim 11, wherein, in the conducting step, the third electrode is formed by performing diffusion treatment after performing ion implantation or chemical vapor deposition. A method for manufacturing a vibrator. Wherein in the conductive process, capacitive method for producing an ultrasonic oscillator of claim 11, characterized by forming said third electrode by a physical vapor growth method. The capacitance according to any one of claims 11 to 13, further comprising an ultrasonic attenuating material filling step of filling the groove formed with the third electrode with an ultrasonic attenuating material. Type ultrasonic transducer manufacturing method. Furthermore, the capacitive method for producing an ultrasonic oscillator of claim 14, characterized in that it comprises a first cutting step of cutting the ultrasonic attenuation material the groove filled with. 16. The method according to claim 11, further comprising a second cutting step of cutting the groove until the silicon substrate and the electrode pad are penetrated to reach the surface of the flexible printed circuit board. The manufacturing method of the capacitive ultrasonic transducer as described.   The method of manufacturing a capacitive ultrasonic transducer according to claim 15, wherein the first cutting step is performed using a laser beam.   The method of manufacturing a capacitive ultrasonic transducer according to claim 16, wherein the second cutting step is performed using a laser beam.   An ultrasonic endoscope comprising the capacitive ultrasonic transducer according to any one of claims 1 to 10.