JP4606296B2 - Electrical copper plate joining method - Google Patents

Description

  The present invention relates to a joining method for superposing and joining two electrodeposited copper plates (electrocopper plates) obtained by electrolytic refining or electrowinning of copper.

  Conventionally, in electrolytic refining and electrowinning of copper, copper is electrodeposited on a copper cathode, that is, a copper seed plate, to purify copper. The thus obtained cathode copper (electro-copper) is then melted in a copper-reflective furnace, removed impurities, adjusted for oxygen content, cast into a suitable mold, and made into copper, mold copper, etc. The

  The copper seed plate used in the conventional method is inferior in flatness, and the obtained electrolytic copper has a problem in terms of quality.

  Therefore, in recent years, the electrolytic copper production method has shifted from a method using a conventional copper seed plate to a method using a SUS (stainless steel) plate as a seed plate, which is called a permanent cathode method.

  That is, in the permanent cathode method, as shown in FIG. 1, the electric copper plate 1 is electrodeposited on both surfaces of the SUS plate 2 having a thickness of about 3 mm until the thickness T becomes about 6 to 9 mm. The obtained electrical copper plate 1 is separated from both surfaces of the SUS plate 2 by a stripper.

  The SUS plate 2 as a seed plate used in such a permanent cathode method is strong and can be used repeatedly, and has the advantage that the flatness is extremely good and high-quality electrolytic copper can be obtained. .

  As described above, the electrolytic copper is then transported to a copper refining furnace for casting into copper, mold copper, and the like.

  However, the electrical copper transport equipment for the existing copper reflection furnace is designed based on the conventional electrical copper, that is, the weight of one electrical copper is designed to be 150 kg.

  On the other hand, the weight of one electrolytic copper plate obtained by the permanent cathode method is about 70 kg.

  In other words, when using an electrical copper plate obtained by the permanent cathode method in an existing fine copper reflection furnace, it is necessary to operate the incidental equipment, for example, material handling equipment, twice as much as the current level. Therefore, there is a problem that the existing copper copper plate produced by the permanent cathode method is unacceptable due to time cycle restrictions.

Therefore, as described in Patent Document 1, the inventors of the present invention overlap two electric copper plates, arrange the two electric copper plates between the punch and the die, and stack the two punches. We proposed a method for joining electric copper plates by pressing the combined electric copper plates, pressing them into dies, and simultaneously deforming and caulking the two electric copper plates.
JP 2003-170232 A

  However, as a result of further research conducted by the present inventors, the following was found.

  That is, according to the said joining method, two electrolytic copper plates are deform | transformed simultaneously, and the two electrolytic copper plates are joined by the friction in the fracture surface of each electrolytic copper plate formed at that time.

  However, due to the variation in the thickness of the copper sheet and the unevenness of the surface of the copper sheet, an insufficiently caulked part occurs, and the friction between the two copper sheets is simply caused by friction caused by the fracture surface in a state where the sheet is cut with a punch and a die. There was a case where the bonding was disengaged.

  Further, the electric copper plate is preheated in the preheating furnace before being charged into the reflection furnace, and then charged into the reflection furnace. The preheating furnace is a tunnel type, and heats copper plates arranged on a conveyor from the upper surface with LP gas. At this time, if the joining force by caulking is weak, the upper copper sheet of the two copper sheets is further heated, and the bonding may be disconnected inside the furnace.

  If this happens, the conveyor in the preheating furnace meanders, and when it is inserted into the reverberation furnace, the two copper sheets break apart, float on the surface of the molten metal, and do not sink. occured.

  Therefore, an object of the present invention is to solve the problems of the above-described conventional method of joining an electric copper plate, further improving the joining force of the two-layered electric copper plate, and joining the two-layered electric copper plate. It is an object of the present invention to provide a method for joining electric copper plates that is prevented from coming off.

The above object is achieved by the method for joining electrolytic copper plates according to the present invention. In summary, the present invention is a joining method for superposing two electrical copper plates and joining them together,
Stacking two sheets of the electric copper plate on top and bottom;
The two copper electroplated copper plates are disposed between a punch disposed on the lower side and a die disposed on the upper side opposite to the punch, wherein the punch has a rectangular cross-sectional shape. And a pressing portion protruding in a mountain shape from the tip of the shaft portion, the tip of the mountain pressing portion has a curved shape, and the die has a rectangular shape corresponding to the cross-sectional shape of the punch Having a hole,
The two copper electroplated plates are pushed into the die by pressing the two stacked copper plates upward from the lower copper plate side to the upper copper plate side by the punch. Are simultaneously deformed into a convex shape to form protrusions and crimped together,
Pressing the convex top of the protrusions downward by a predetermined distance and crushing them flatly;
This is a method for joining electric copper plates.

  According to one embodiment of the present invention, the electric copper plate is a rectangular electrodeposited copper plate obtained by a permanent cathode method, and is caulked in the vicinity of at least four corners of the two laminated electric copper plates. .

  According to another embodiment of the present invention, the protrusions formed on the two-layer superposed copper sheet are composed of a two-layer superposed copper sheet forming one group and a two-layer superposed electric sheet forming another group. The protrusions of the two-layer bonded copper-plated copper plates that are different from each other in the copper plate are formed along the diagonal lines of the copper-plated copper plate, and the other groups are bonded to each other. The protruding portion of the copper electroplating plate is formed at a position that is orthogonal to and overlaps the protruding portion of the one group of two-layer bonded electric copper plates, and the one group of two-layer bonded electric copper plates and the other When a group of two-layer bonded electrical copper plates are stacked, the protrusions of the two-layer bonded electrical copper plates do not fit together.

According to another embodiment of the present invention, the two copper electroplated plates have substantially the same thickness, and the protruding amount of the protrusions above the surface of the upper copper electroplated plate is approximately twice the thickness of the copper electroplated plate. It is said.

According to another embodiment of the present invention, the convex top of the protrusion is pressed downward by approximately half of the amount of protrusion upward of the surface of the upper electric copper plate of the protrusion and is crushed flat.

  According to the present invention, the joining force of the two-layered electric copper plate is improved, and the joining of the two-layered electric copper plate is not released during handling, heating in a preheating furnace, or the like.

  In the following, the method for joining electric copper plates according to the present invention will be described in more detail with reference to the drawings.

Example 1
2A and 2B show a schematic configuration of a joining facility for carrying out the method for joining an electrolytic copper plate according to the present invention.

  As described above, in FIG. 1, the electrolytic copper plate 1 electrodeposited on the SUS plate by the permanent cathode method is peeled off from the SUS plate 2 by the stripping machine of the stripping equipment. Next, as shown in FIGS. 2A and 2B, the electric copper plate 1 is transported to the joining facility 10 by the transport conveyor 100 in a two-layered manner. The joining facility 10 includes an alignment station 20, a first press station 30, and a second press station 40.

  The electric copper plate 1 has a surface that is in close contact with the SUS plate surface and a surface on the opposite side, and the surface properties, particularly the surface roughness, are different. However, when carrying out the joining method of the present invention, when two sheets of electrolytic copper plate 1 are stacked, any combination of surfaces, that is, rough surfaces, rough surfaces and smooth surfaces, or smooth surfaces, Any combination of surfaces may be used. In other words, the operator is not required to have a great deal of attention when stacking the two copper sheets 1.

  The two-layered copper copper plates 1 (1a, 1b) transported to the alignment station 20 by the transport conveyor 100 are aligned at the front end by the stopper means 21 that protrudes into the transport path in a timely manner. The side surfaces are aligned by the aligning means 22. The stopper means 21 and the side surface alignment means 22 are driven by drive means (not shown) such as a hydraulic cylinder.

  The two-layered copper copper plates 1a and 1b that have been aligned are transported by the transport conveyor 100 again and transferred to the first press station 30 when the stopper means 21 is retracted downward from the transport path. .

  The first press station 30 is provided with a first caulking device 31 that is operated by a press machine (not shown). The first caulking device 31 caulks the two stacked copper sheets 1a and 1b at four press points set in the vicinity of the four corners of the copper sheets 1a and 1b in this embodiment. The caulking process will be described in detail later with reference to FIGS.

  The two-layer joined electroplated copper plate 1D integrated by the first caulking process is further transferred to the second press station 40 by the conveyor 100.

  In the second press station 40, a second caulking device 41 operated by a press machine (not shown) is arranged. The second caulking device 41 re-presses (crushes) the heads (convex tops) of the pressed protrusions of the two-layer joined copper electroplated sheet 1D integrated into a flat surface by the first caulking process. This further strengthens the bonding force. The second caulking process will be described in detail later with reference to FIG.

  The two-ply bonded electroplated copper plate 1E that is made stronger and stronger by the second caulking process is transported to the shipping position by the transport conveyor 100.

  In this way, the two-ply bonded electroplated copper plate 1E integrated can be transported without being dropped during transport in the transport system with the suction plate, and the joint is not disconnected even in the preheating furnace. Moreover, it turned out that it can be used conveniently also in the existing refined copper reflection furnace.

  Next, with reference to FIG. 3, FIG. 4, FIG. 5, the first caulking process of the two-layered copper sheets 1 (1a, 1b) performed according to the present invention will be described.

  First, the first caulking device 31 used for the first caulking process will be described with reference to FIG.

  In this embodiment, the first caulking device 31 is a floating die set, a punch 32 is disposed below, and a die 33 is provided above. The punch 32 is attached to a fixed base (not shown), and the die 33 is attached to a press machine cylinder (not shown).

  According to the present embodiment, the die 33 is lowered by the cylinder head which is movable up and down, and pushes down the punch base 50 which is movable in the vertical direction. At this time, the punch 32 set on a fixed base (not shown) is supported by a guide hole 52 formed in the punch base 50, and is pushed into the die 33 when the punch base 50 moves downward. The Thereby, it caulks with respect to the electrical copper plates 1a and 1b.

  The top 32 a of the punch 32 is usually located below the upper surface 51 of the punch base 50. In the caulking operation of the electric copper plates 1a and 1b, the two stacked electric copper plates 1a and 1b are transferred to the upper surface 51 of the punch base 50 and positioned at predetermined positions. Further, a spring hole 53 is formed in the punch base 50 and a pressing spring 54 is disposed. This pressing spring 54 presses the punch base 50 against the die 33 with a predetermined urging force, and stably holds the electric copper plates 1 a and 1 b placed on the upper surface of the base between the die 33. Make it. The procedure of the first caulking process by the first caulking device 31 will be described later with reference to FIG.

  A punch 32 used for caulking of the two-layer superposed copper sheets 1a and 1b includes a shaft portion 34 having a rectangular cross-sectional shape, and a pressing portion 32a protruding in a mountain shape from the front end of the central portion in the longitudinal direction of the shaft portion 34. Have. The tip of the chevron pressing portion 32a has a curved shape with a radius R.

  In the present embodiment, the punch 32 has a width W1 of 40 mm, a width W2 of 34 mm, a protruding height H of the mountain-shaped pressing portion 32a of 14 mm, and the opening angle θ of the top of the mountain-shaped pressing portion 32a is 90 degrees. The point radius R of the pressing part 32a is approximately 10 mm.

  On the other hand, the die 33 has a hole 36 having a shape corresponding to the cross-sectional shape of the punch 32. In this embodiment, a rectangular hole 36 of w1 × w2 = 40 × 34 mm is formed, and the thickness t of the die 33 is Was 30 mm. A pressing member 38 urged toward the punch by a spring 37 is disposed in the hole 36 of the die 33.

  In this example, the punch 32 and the die 33 were both made using carbon tool steel.

  Next, the first caulking process according to the present invention will be described.

  According to the present embodiment, as shown in FIG. 4A, the punch 32 disposed on the lower side and the die 33 disposed on the upper side are disposed to face each other, and two sheets of electricity are stacked on the punch base 50. Copper plates 1a and 1b are placed. In this example, each of the electric copper plates 1a and 1b had a thickness of 9 mm.

  Next, as shown in FIG. 4B, the upper die 33 is lowered and the punch base 50 is pushed down. Between the punch base 50 and the die 33, the two-layered copper sheets 1a and 1b are held with a predetermined spring force.

  Next, as shown in FIG. 4C, the punch 32 bites into the copper plates 1a and 1b when the punch base 50 is lowered downward. A pressing force P of 60 to 75 tons per punch is applied at a pressing speed (downward rising speed of the die 33) of 3 to 6 cm / sec.

  According to the present invention, the downward stroke of the die 33 is increased so that the lower electric copper plate 1a reliably breaks through the upper electric copper plate 1b.

  In the present embodiment, the punch 32 pressed the two-layered electric copper plates 1a and 1b with a protruding amount from the surface of the upper electric copper plate 1b, that is, the caulking amount E1 = 19 mm of the electric copper plates 1a and 1b.

  Usually, the caulking amount E1 is preferably about twice as large as the thickness T of the electric copper plate 1. More than this, the electric copper plate 1 is cut between the punch 32 and the die 33, and the pressed electric copper plate protrusion 1A and the electric copper plate main body are separated, thereby joining the two electric copper plates 1a and 1b. The problem of not being able to occur occurs. Further, it has been found that when the caulking amount E1 is smaller than twice the thickness T of the electric copper plates 1a and 1b, a sufficient caulking amount cannot be obtained.

  Two such caulking processes were applied to the corners of the electric copper plates 1a and 1b, each having a width W of 1 m and a thickness T of 6 to 9 mm. In the present embodiment, as described above, the thickness T of the electrical copper plates 1a and 1b was 9 mm.

  As a result of observing the caulking portion of the two-layer joined electric copper plate 1D caulked as described above, that is, the protruding portion 1A (FIG. 4C), as shown in FIG. 5A and FIG. The projection 11a on the long side of the projection 1A (11a, 11b), whose planar shape is rectangular, has a convex portion 11a on the lower copper plate 1a and a recess 12b on the upper copper plate 1b. It was found that the two electric copper plates 1a and 1b were joined so as to be caught. This joining part 1a was joined not by welding but by catching by the joining area.

  As described above, the punch 32 and the die 33 are preferably rectangular in shape as in this embodiment, and it is necessary to make the joining area as large as possible. In the experiments by the present inventors, it was found that when the punch 32 and the die 33 are formed in a round shape, the protruding portion 1A is easily cut and the bonding is poor.

  As shown in FIG. 2, the rectangular protrusion 1 </ b> A can be formed so that the rectangular shape is arranged along the side of the electrolytic copper plate 1, but as described later, along the diagonal line of the electrolytic copper plate 1. (See FIG. 7).

  Furthermore, according to the present invention, the two caulking plates 1D subjected to the first caulking process are subjected to the second caulking process.

  Next, with reference to FIG. 6 (A) and (B), the 2nd crimping process of the two-layered electrical copper plate 1D joined by a present Example is demonstrated.

  First, the second caulking device 41 used for the second caulking process will be described with reference to FIG.

  In the present embodiment, the second caulking device 41 has a fixed lower mold 42 and a movable upper mold 43. The upper mold 43 is attached to a press machine (not shown).

  According to the present embodiment, in the second caulking operation of the joined two-layered electric copper plates 1D, the electric copper plate 1D joined to the upper surface 44 of the lower mold 42 is transferred and positioned at a predetermined position.

  In this example, the lower mold 42 and the upper mold 43 were produced using carbon tool steel.

  Next, the second caulking process according to the present invention will be described.

  According to the present embodiment, as shown in FIG. 6A, the lower mold 42 and the upper mold 43 are arranged to face each other, and the joined electric copper plate 1 </ b> D is placed on the lower mold 42.

  Next, as shown in FIG. 6 (B), the upper upper mold 43 is lowered toward the lower mold 42, and the pressing speed (lowering speed of the upper mold 42) is 3 to 6 cm / sec. Apply a pressing force P of ~ 75 tons.

  Thereby, the heads of the protrusions 1A of the electric copper plate 1D joined by the first caulking process are re-pressed, ie, crushed, into a flat shape. Thereby, the electric copper plate 1E having the protrusion 1B whose upper surface is pressed into a flat shape and further strengthening the bonding force is formed.

  According to the present invention, the protrusion 1A once plastically deformed by the first caulking is re-pressed by the second caulking, so that further plastic deformation is performed in the direction of the arrow as shown in FIG. 6C. Wake up. For this reason, the fractured surfaces of the protrusions 1A of the two copper sheets 1D formed by the first caulking process become denser and the frictional force increases. That is, the bonding strength of the copper electroplating plate 1E having the protrusions 1B whose upper surface is pressed flat is further enhanced.

  The stroke of the upper die 43 in the second caulking process, that is, the deformation amount (crushing amount) E2 of the protrusion 1A is appropriately about 1/2 (50%) of the deformation amount (protruding amount) E1 in the first caulking process. is there. When it is further deformed, the engagement portion between the lower electric copper plate 1a and the upper electric copper plate 1b is reduced, and the joining is easily released. When the deformation amount E2 does not reach about 30% of the deformation amount E1, the effect of the second caulking process is insufficient.

  The joining force of the two-layered electro-copper plate 1E joined in this way is greatly improved as compared with the conventional case, and the joined electro-copper plate is disconnected during handling and heating in a preheating furnace. There was no.

Example 2
With reference to FIG. 7, another embodiment of the present invention will be described.

  In the present embodiment, the first caulking process in the first embodiment has two types of shapes different from each other with respect to a two-layered electrolytic copper plate forming one group and a two-layered electrolytic copper plate forming another group. Protrusions 1Aa and 1Ab are formed.

  Next, the second caulking process in the first embodiment is performed on the two groups of the two-layer jointed copper sheets formed with the two different types of protrusions 1Aa and 1Ab. In other words, according to the present embodiment, the protrusions formed on the electrolytic copper plate are different from each other between the two-layer superposed copper sheet forming one group and the two-layer superposed copper sheet forming another group.

  In the present embodiment, the protrusions 1Aa of the two-layer bonded electrical copper plates 1a and 1b joined to each other in one group are formed along the diagonal lines of the electrical copper plates 1a and 1b, and the other groups 2 joined to each other. The protrusions 1Ab of the sheet-lap bonded electrical copper plates 1a, 1b are formed at positions that are orthogonal to and overlap with the protrusions 1Aa of the two-layer overlap-bonded electric copper plates of the one group.

  Therefore, when the two-layer bonded copper electroplated plates of one group and the two-layer bonded copper-plated copper plates of the other group are stacked, the protrusions 1Aa, 1Ab of the two overlap-bonded copper electroplated plates do not fit each other.

  Further explanation will be given with reference to FIG. 7. The first caulking process for the first group of double-layered copper electroplated plates is performed by two sheets conveyed to the alignment station 20 by the conveyor 100 as in the first embodiment. This is performed on the stacked electric copper plates 1a and 1b.

  That is, as in the case of the first embodiment, the front ends of the two-layered laminated copper plates 1 (1a, 1b) of the first group are aligned by the stopper means 21 that protrudes into the conveyance path in a timely manner. The side surfaces are aligned by the side surface aligning means 22. The stopper means 21 and the side surface alignment means 22 are driven by drive means (not shown) such as a hydraulic cylinder.

  The two-layered copper electroplated plates 1a and 1b that have been aligned are transported by the transport conveyor 100 again and transferred to the first press station 30a when the stopper means 21 is retracted downward from the transport path. .

  The press station 30a is provided with a caulking device 31 that is operated by a press machine (not shown) similar to that described in the first embodiment. The caulking device 31 performs caulking processing of the first type on the two-layered electric copper plates 1a and 1b at four press points set in the vicinity of the four corners of the electric copper plates 1a and 1b in this embodiment.

  At this time, according to the present embodiment, the two-layered copper electroplated copper plate in which the placement shape of the projections 1Aa after the crimping process formed at the four corner positions of the two-layered copper electroplated plates 1a, 1b is rectangular. It forms so that it may align along the diagonal of 1a, 1b. In this example, the shape of the protrusion 1Aa was a rectangle, and the longitudinal direction thereof was aligned on the diagonal line of the rectangular electric copper plates 1a and 1b.

  The two-layer joined copper electroplated plate 1Da integrated by caulking is transported to the next second press station 30b by the transport conveyor 100, but is not caulked here.

  On the other hand, the second type of first caulking process for the second group of two-layered copper sheets is carried out by the transfer conveyor 100 at the alignment station 20 in the same manner as for the first group of two-layered copper sheets. This is performed on the two-layered copper electroplated plates 1a and 1b conveyed to the head.

  That is, this second group of two-layered copper electroplated plates is transported to the next press station 30a by the transporting conveyor 100, but is not caulked here.

  The second group of copper electroplated plates 1a and 1b that have not been subjected to the first type of caulking are transported to the second press station 30b for the second type of caulking.

  In the second press station 30b, a caulking device 31 similar to the caulking device 31 of the first press station 30a, which is arranged so as to have different caulking processing modes, is installed.

  With the caulking device 31, the second type of caulking is performed in the same manner as the first type of caulking described above for the second group of copper sheets 1a and 1b.

  The second type of caulking for the second group of two-layered copper sheets 1a, 1b is a two-layered electric process in which the shape of the protrusions 1Ab formed at the four corner positions of the copper sheet is rectangular. It is formed so as to be orthogonal to the diagonal lines of the copper plates 1a and 1b. The caulking position is a position that overlaps with the first type of caulking position for the first group of two-layered copper sheets.

  Next, for the copper electroplated plates 1Da and 1Db subjected to the first and second types of caulking, which have been conveyed to the third press station 40, the same as described in the first embodiment. Two caulking processes are performed.

  In the third press station 40, a second caulking device 41 similar to that in the first embodiment having a fixed lower die 42 and a movable upper die 43 is also arranged in this embodiment. Yes.

  As a result, the heads of the protrusions 1Aa and 1Ab of the first and second groups of copper electroplating plates 1Da and 1Db subjected to the first and second types of caulking by the first caulking are re-pressed on a flat surface. As a result, the first and second groups of copper electroplating plates 1Da and 1Db have protrusions 1Ba and 1Bb whose upper surfaces are pressed into a flat shape, respectively, and the copper electroplating plates 1Ea and 1Eb with further enhanced bonding strength are formed. Is done. 7 shows a state in which the first group of copper copper plates 1Da is pressed, and a state in which the second group of copper copper plates 1Db is pressed is indicated by a one-dot chain line.

It is a perspective view which shows the electrolytic copper plate produced by the permanent cathode method. The joining equipment for enforcing the joining method of an electric copper board of the present invention is shown, and Drawing 2 (A) is a top view and Drawing 2 (B) is a side view. It is a figure explaining the relationship between the punch and die | dye used by this invention, FIG. 3 (A) is a front longitudinal cross-sectional view, FIG.3 (B) is a side longitudinal cross-sectional view. It is process drawing for demonstrating the joining method of the electrical copper plate of this invention. FIG. 5 (A) is a side view showing details of the joining location of the electrolytic copper plate, and FIG. 5 (B) is a perspective view showing the appearance of the protrusions of the two-layer joined electrical copper plate after caulking. It is process drawing for demonstrating the joining method of the electrical copper plate of this invention. FIG. 7A is a plan view and FIG. 7B is a side view showing a joining facility for carrying out a joining method according to another embodiment of the electric copper plate of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electric copper plate 1 (1a, 1b) Two-layered electric copper plate 2 SUS board 10 Joining equipment 20 Alignment station 30 (30a, 30b) Press station 40 Press station 31 Caulking device 32 Punch 33 Die 33 Punch shaft part 35 Punch press part 36 Die hole 41 Caulking device 42 Lower mold 43 Upper mold

Claims (5)

It is a joining method for superposing two electrical copper plates and joining them together,
Stacking two sheets of the electric copper plate on top and bottom;
The two copper electroplated plates are disposed between a punch disposed on the lower side and a die disposed on the upper side facing the punch, wherein the punch has a rectangular cross-sectional shape. And a pressing portion protruding in a mountain shape from the tip of the shaft portion, the tip of the mountain pressing portion has a curved shape, and the die has a rectangular shape corresponding to the cross-sectional shape of the punch Having a hole,
The two copper electroplated plates are pushed into the die by pressing the two stacked copper plates upward from the lower copper plate side to the upper copper plate side by the punch. Are simultaneously deformed into a convex shape to form protrusions and crimped together,
Pressing the convex top of the protrusions downward by a predetermined distance and crushing them flatly;
An electrical copper plate joining method characterized by the above.   The electric copper plate is a rectangular electrodeposited copper plate obtained by a permanent cathode method, and is caulked in the vicinity of at least four corners of two superposed copper plates. Copper plate joining method. The protrusions formed on the two-layer superposed copper sheet are different from each other between a two-layer superposed copper sheet forming one group and a two-layer superposed copper sheet forming another group,
The protrusions of the two-layer jointed copper sheet joined to each other in one group are formed along the diagonal line of the copper sheet, and the protrusions of the two-layer jointed copper sheet joined to each other group are It is formed at a position that is orthogonal to and overlaps with the protrusion of the one group of two-layer bonded electrical copper plates,
When the one group of two lap jointed copper sheets and the other group of two lap jointed copper sheets are stacked, the protrusions of the two lap jointed copper sheets do not fit each other. The method for joining electric copper plates according to claim 1 or 2. 2. The two copper copper plates have substantially the same thickness, and the protruding amount of the protrusions above the surface of the upper copper copper plate is approximately twice the thickness of the copper copper plate. The method for joining electric copper plates according to any one of items 1 to 3 . 5. The electrolytic copper plate according to claim 4 , wherein the protruding top portion of the protruding portion is pressed downward by approximately half of the protruding amount upward from the surface of the upper electrolytic copper plate of the protruding portion to be flattened. Joining method.

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