JP4595120B2 - Imprint method and apparatus by back surface pressurization - Google Patents

Description

  The present invention relates to an imprint method by back surface pressurization that performs imprinting by pressurizing the back surface in a pattern transfer mechanism of an imprint lithography apparatus that is one of lithography techniques for semiconductors and the like, and an imprint apparatus that performs the method.

  In recent years, downsizing of VLSI devices represented by high-density memories and system LSIs has progressed, and a technology capable of further miniaturization has been demanded. Therefore, in the semiconductor manufacturing process, lithography (transfer) technology is required. The importance is increasing. Among them, imprint lithography is a technique for transferring a pattern by pressing a mold having a predetermined circuit pattern against a sample substrate coated with a resist on its surface, and various methods have been proposed. This is done as shown in FIG.

  In FIG. 9, a reverse pattern corresponding to a mirror image of the pattern to be transferred is first formed on the surface of the mold material 30 as shown in FIG. A mold 32 having On the other hand, as shown in FIG. 5B, a resist material such as PMMA is applied on the silicon substrate 33 on which a pattern is to be formed and cured to form a resist layer 34.

  Next, the entire silicon substrate 33 provided with the resist layer 34 is heated to about 200 ° C., and the resist layer 34 is slightly softened. In this state, as shown in FIG. 9C, the uneven shape 31 of the mold 32 is arranged at a predetermined position of the resist layer 34, and the uneven shape 31 is pressed against the resist layer 34. At this time, since the resist layer 34 is softened, the resist layer 34 enters the concave portion of the concavo-convex shape 31, and the resist layer 34 has substantially the same shape as the concavo-convex shape 31. In this state, the resist layer 34 is cured by lowering the entire temperature to about 105 ° C., and then the mold 32 is removed. In this manner, a concavo-convex pattern having a predetermined shape is formed on the resist layer 34.

  In the imprint lithography method, in addition to the above, for example, a mold is made of a transparent material such as a quartz substrate, and a liquid photo-curing resin is applied onto the substrate to be transferred. Press the mold irregularities, let the liquid photo-curing resin flow into the irregularities, and in this state, irradiate ultraviolet rays etc. from the back side of the transparent mold to cure the resin, and then remove the mold to form the irregularities of the predetermined shape A method of forming a pattern has also been proposed.

  In the imprint lithography system as described above, it is necessary to make the pressure distribution in the pressing surface uniform when pressing the mold against the sample substrate. In order to make the in-plane pressure distribution uniform, it is necessary to increase the parallelism of the mold and the sample substrate. When the two are not parallel, the mutual inclination must be adjusted on the mold side or the sample side.

  In order to make the in-plane pressure distribution uniform when pressing the mold against the sample substrate as described above, conventionally, an inclination adjusting mechanism having an elastic body and a fulcrum and changing the inclination around the fulcrum is used. Things have been done. The case where an inclination adjusting mechanism is used on the mold side is shown in the schematic diagrams of FIGS. In FIG. 10, a silicon substrate 37 coated with a resist 36 is placed on a sample stage 35, and a mold 38 is pressed against the resist 36 on the silicon substrate 37 by a pressing mechanism 40. FIG. 10 shows a case where the pivot structure 41 is used as the tilt adjusting mechanism. For example, when the sample stage 35 is tilted relative to the pressurizing mechanism 40, the mold 38 is moved to the resist 36 by the pressurizing mechanism 40. The pivot structure 41 absorbs this inclination when pressed against the resist 36, and the mold 38 is pressed against the resist 36 with an equal force. 11 uses an elastic body 42 as the tilt adjustment mechanism of FIG. 10, and the elastic body 42 can absorb the tilt. As in the case shown in FIG. Pressed with equal force.

  Although the above example shows an example in which the tilt adjustment mechanism is used on the pressure side, the same action can be performed even if the tilt adjustment mechanism is used on the sample side, and examples thereof are shown in FIGS. ) And (c) are schematic views. 4A shows an example in which the sample stage 35 is supported by the pivot structure 43, FIG. 5B shows an elastic body 44 on the bottom surface of the sample stage 35, and FIG. 5C shows between the sample stage 35 and the silicon substrate 37. The example which provided the elastic body 44 is shown. In any of these methods, the tilt adjustment mechanism functions as expected when the sample is not moved.

  As described above, in order to press the mold against the resist with an equal force, a tilt adjusting mechanism made of a pivot or an elastic body is provided on the pressure side or the pressure side. When the mold is pressed against a plurality of locations, if the tilt adjusting mechanism is provided on the pressure side as shown in FIGS. 10 and 11, the tilt adjusting mechanism acts on the entire surface. If it is provided on the pressurized side, it cannot function on the entire surface.

As described above, a thermal mold was applied to a patterned mold by heating or pressing the thermoplastic resin applied on the substrate, and then releasing the mold after cooling, or a patterned transparent mold was dropped or applied on the substrate. In order to achieve uniform imprinting in the technique of optical nanoimprinting, which is pressed against a liquid photo-curing resin, irradiated through the mold and irradiated with light to solidify the resin, and then released to form a pattern, it is conventionally a mold. A method of preparing a mechanism for adjusting the inclination on the mold side or the sample substrate side is used (Patent Documents 1 and 2).
Patent publication 2003-517727 Japanese Patent Publication No. 2003-77867

  The tilt adjustment mechanism will not work unless the mold and sample are very flat. In addition, the degree of freedom in designing the pressure distribution at the contact surface between the mold and the sample is small. Furthermore, when the mold and the sample come into contact with each other, an isolated non-contact area may be generated inside the contact area. In this case, in the atmospheric imprint, the atmosphere is sealed in that area and normal imprint cannot be performed in that area. There was a problem such as.

  Therefore, the present invention enables accurate imprinting even if the flatness of the mold and the sample is slightly worse, suppresses the formation of an isolated non-contact region when the mold and the sample are in contact, The pressure distribution on the contact surface can be made uniform by a simple method and various methods, thereby making it possible to perform a precise imprint corresponding to the flatness and inclination of the sample. Objective.

  In order to solve the above problems, the present invention controls the amount of bending of the sample by holding the periphery of the sample and locally pushing up the back surface of the sample, suppressing the occurrence of an isolated non-contact region at the time of contact, and the structure of the member to be pushed up By designing the pressure distribution on the back side of the sample, it is reflected in the pressure distribution on the contact surface between the mold and the sample, and as a result, a uniform imprint is realized.

More specifically, the imprint method by backside pressurization according to the present invention holds a periphery of a thin substrate, and a pressurizing structure is arranged below the substrate so as to be movable up and down, and above the substrate. The mold is disposed opposite to the pressing structure, the pressing structure is raised to press the back surface of the substrate, and the mold is pressed onto the substrate surface above the free holding position of the substrate. It is characterized by doing.

  According to another imprint method by backside pressurization according to the present invention, in the imprint method by backside pressurization, the structure for pressurization is made of a material more flexible than a mold and a substrate.

Further, the imprint apparatus by backside pressure according to the present invention includes a thin substrate that is imprinted on the front surface, a substrate holding member that holds the periphery of the substrate, and a pressurizing structure that is arranged below the substrate so as to freely move up and down. A body, a mold disposed above the substrate and facing the pressing structure, and the pressing structure is raised to press the back surface of the substrate, and the substrate surface is positioned above the free holding position of the substrate . characterized in that a pressing means for imprinting by pressing the mold.

  The imprint apparatus by backside pressurization according to the present invention is characterized in that in the imprint apparatus by backside pressurization, the pressing structure is made of a material that is more flexible than the mold and the substrate.

  The imprint apparatus by backside pressurization according to the present invention is the imprint apparatus by backside pressurization, wherein the pressurizing structure has a liquid, gas, gel, It is characterized by containing a deformable material made of any material of elastomer.

  The imprint apparatus by back surface pressing according to the present invention is the imprint apparatus by back surface pressing, wherein the pressing structure includes a pressing bar that presses the flexible member from the bottom surface, and the pressing bar is a pressing tip. The portion has a convex curved surface.

  The imprint apparatus by backside pressurization according to the present invention is the imprint apparatus by backside pressurization, wherein the pressurizing structure is an electric actuator such as a linear actuator, a motor, a voice coil, a piezo element, a gas pressure or a liquid pressure. It moves by either of fluid actuators, such as.

  The imprint apparatus by backside pressurization according to the present invention is characterized in that in the imprint apparatus by backside pressurization, a load measuring device for measuring a load between the pressing structure and the substrate during operation is provided.

  The imprint apparatus by backside pressurization according to the present invention is characterized in that in the imprint apparatus by backside pressurization, a position measuring device for measuring the position of the pressurizing portion of the pressurizing structure is provided.

  The imprint apparatus by backside pressurization according to the present invention is characterized in that in the imprint apparatus by backside pressurization, there is provided means for changing the pressure distribution on the surface of the pressurizing structure that presses the substrate.

  The imprinting device by backside pressure according to the present invention is the imprinting device by backside pressing, wherein the means for changing the pressure distribution on the surface of the pressing structure that presses the substrate is the surface of the pressing surface or It is characterized by unevenness formed on the back surface.

  The imprint apparatus by backside pressurization according to the present invention is such that, in the imprint apparatus by backside pressurization, the surface of the pressurizing structure that presses the substrate is set so that the inclination is variable by a minute force. It is characterized by being.

  According to the present invention, accurate imprinting can be performed even if the flatness of the mold and the sample is slightly worse, and it is possible to suppress the occurrence of an isolated non-contact region when the mold and the sample are in contact with each other. The pressure distribution on the contact surface can be made uniform by simple methods and various methods, thereby enabling precise imprinting corresponding to the flatness and inclination of the sample. it can. Further, since it is not necessary to prepare a mechanism for uniform imprinting on the mold side, other functions such as alignment can be easily designed and constructed on the mold side. In addition, since the mold side tilt adjustment may be about 1 mrad, a simple semi-fixed tilt adjustment mechanism is prepared, or in some cases, the tilt adjustment mechanism is not required at all, and only a function for raising and lowering the mold is prepared. Therefore, the mold side mechanism can be simplified.

  In addition, pressure distribution design during imprinting can be performed by selecting the material of the back surface pressurization structure and making minor structural changes, and even if the substrate used does not have ideal flatness, uniform pressurization can be achieved. It becomes possible. Furthermore, it is possible to adjust the final pressure distribution by the amount of bending when the substrate is bent. In the case of atmospheric imprinting, it is possible to avoid the trapping of the atmosphere by bending and to realize imprints without defects. Become. In addition, in the case of imprinting using liquid resin, the liquid resin is effectively discharged outward due to bending, and the substrate and mold can be brought close to each other, so that uniform imprinting can be realized. become.

  In the present invention, in order to enable uniform imprinting over a wide range of conditions, a periphery of a thin substrate is held, and a pressurizing structure is arranged below the substrate so as to be movable up and down, and above the substrate. A mold is disposed opposite to the pressing structure, the pressing structure is raised and the back surface of the substrate is pressed, and the substrate surface is pressed onto the mold and imprinted above the holding position of the substrate. Realized by.

  FIG. 1B is a schematic cross-sectional view showing the basic configuration of the present invention and the operation during imprint operation. The periphery of the substrate 1 is held by a substrate holding member 2, and the surface 3 of the substrate 1 has a mold 4. The pattern forming surface 5 is provided. Further, the pressing surface 9 of the pressing structure 7 is pressed against the back surface 6 of the substrate 1 so as to face the portion of the mold 4 that is in contact with the substrate 1. The mold 4 is fixed to the lower surface of the movable member 8 that can move up and down independently of the pressure structure 7.

  In the present invention, by adopting the above-described configuration, for example, as shown in FIG. 1A, when the substrate 1 is first supported, the support line a in the free holding state of the substrate 1 is horizontal. When the vertical action line is c, the pressing axis b of the mold 4 imprinted on the surface 3 of the substrate 1 has an angle α with respect to the vertical action line c as shown in FIG. The substrate portion sandwiched between the pressing structure 7 and the mold 4 by the pressing force of the pressing structure 7 that presses against the substrate 1 when tilted only as shown in FIG. Imprinting is performed in the state of following the same angle with an elastic deformation.

The periphery of the substrate 1 is supported as described above, and the mold 4 is lowered together with the movable member 8 on the front surface 3 side of the substrate 1, and the pressing structure 7 is raised on the back surface 6 side of the substrate 1. By the operation of performing imprinting while sandwiching, even when the α is inclined with respect to the action line c perpendicular to the support line a of the substrate 1, the inclination can be followed by the elasticity of the substrate 1. As shown in FIG. 1C according to the principle, the substrate 1 can follow the inclination even when the pressing axis b is inclined relative to −α in the opposite direction to that shown in FIG. Accurate imprinting can be performed. As described above, the present invention finally raises the pressurizing structure to press the back surface of the substrate, and presses the mold onto the substrate surface above the free holding position of the substrate, so that imprinting is performed. Of course, the pressurizing structure 7 and the movable member 8 may be moved up and down in the process up to that point, and this point is the same in the embodiments described later.

  In the above embodiment, even if the pressurizing structure 7 is made of a material that hardly undergoes elastic deformation, it is disposed so as to be movable up and down on the mold 4 fixed on the front surface 3 side of the substrate 1 and on the back surface 6 side. By arranging the pressurizing structure 7 that pressurizes the substrate 1 locally on the same pressurizing axis b, even if it is not arranged at right angles to the support line a of the substrate 1 By pressing up the pressure structure 7 from the back surface 6 side of the substrate 1 and sandwiching the substrate 1 between the mold 4 and the pressure structure 7, accurate imprinting can be performed.

  However, when the substrate 1 has a substantially uniform flat plate shape, even if the pressing structure 7 is made of a material that hardly undergoes elastic deformation, accurate imprinting can be performed by the above operation. For example, FIG. 2), when the imprinting is performed in the form shown in FIG. 1, for example, the mold shown in FIG. 2A is used as a transparent flat plate. As shown in the performed example, only the tip of the projecting portion is in contact, and uniform imprinting cannot be performed. In the case of such a substrate, for example, as shown in FIG. 2 (c), even if the pressing structure 7 is supported so as to be tilted and pressed, only the projecting portions are in contact with each other. The problem cannot be solved. Such a problem can also occur when the surface of the mold or a structure made of a material that hardly undergoes elastic deformation is not flat.

  On the other hand, when the pressurizing structure 7 is formed of an elastic body as shown in FIG. 2 (d), the projecting portion of the substrate 1 is pressed toward the pressurizing structure 7 by the mold 4. Due to this deformation, the protruding portion bulges toward the pressure structure 7 having elasticity, and the mold 4 side becomes a substantially flat surface. As a result, accurate imprinting can be performed on the surface 3 of the substrate 1. Although the above experiment shows a state in which the mold is a flat plate and the substrate is formed of a single plate, a pattern 9 is formed on the lower surface of the mold as shown in FIG. A liquid or solid resin 10 is applied to the surface of the substrate 1, and the above-described aspect is the same.

  As described above, when the mold 4 is moved from above and the pressurizing structure 7 is moved from below so as to sandwich the upper and lower sides of the substrate 1 whose periphery is fixed, the lower surface of the mold 4 and the upper surface of the pressurizing structure 7 are In order to solve the above-mentioned problem when not parallel, for example, as shown in FIG. 3A, the pressing structure 7 is formed by two members of the pressing rod 11 and the pressing member 12, and the pressing member 12. Is formed of a member having a predetermined elastic force such as a flexible resin or rubber. In the example shown in FIG. 3A, an example in which the tip of the push rod 11 is flattened is shown, but this portion is formed so as to form a convex curved surface such as a spherical surface as shown in FIG. 3B, for example. In addition, it is possible to flexibly cope with the inclined surface. The pressing tip of the push rod can be formed in various shapes as long as the structure allows the flexible member to be inclined by slight movement or deformation at the contact or connection portion with the flexible member.

  When imprinting is performed using the pressurizing structure 7 shown in FIG. 3B, the printing is performed as shown in FIG. That is, when the mold 4 is arranged on the upper side and the pressing member 12 made of the elastic material is arranged on the lower side with respect to the substrate 1 whose periphery is fixed by the substrate holding member 2, for example, the mold 4 is attached to the pressing structure 7 and the substrate 1. When the pressure structure 7 and the mold 4 are moved to the substrate 1 side in this state and the imprint is performed, the mold and the substrate are inclined and waved by the elasticity of the pressing member 12, Since the pattern forming surface 5 of the mold 4 is pressed against the surface 3 of the substrate 1 over the entire surface with uniform force, accurate imprinting can be performed.

  The pressing member 12 made of the elastic material of the pressurizing structure 7 as described above may be formed as shown in FIG. 4, for example, in addition to forming the entire pressing member 12 as described above with an elastic material. That is, in the pressurizing structure 7 shown in FIG. 4A, the pressing member 12 provided with the pressing chamber 14 is provided with elasticity at least at the top surface portion 15 by forming the portion thinly. Make it. In the pressing chamber 14, a deformable material 16 made of a material softer than the top surface portion 15, such as a substance such as liquid, gas, gel, or elastomer, is closed with a hard lid member 17. A pressing rod 11 similar to that shown in FIG. 3A is brought into contact with the lower surface of 17 so that the pressing member 12 can be pressed against the substrate 1 from below.

  Even in the case where such a pressure structure 7 is used, as shown in FIG. 3B, for example, as shown in FIG. Can be handled more flexibly. When imprinting using this pressure structure 7, when the mold 4 is inclined with respect to the substrate 1 as shown in FIG. 4C in the same state as in FIG. When the pressurizing structure 7 is pushed up from the back surface of the substrate 1 so that the substrate 1 is sandwiched between the mold 4 and the pressing member 12 as shown in FIG. The top surface is inclined, the surface 3 of the substrate 1 and the pattern forming surface 5 of the mold 4 are in close contact, and accurate imprinting can be performed. Note that various materials can be used as the deformable material 16, and in addition to the gel-like material, a liquid, a gas, or the like stored in a flexible bag or the like can also be used. For the pressure structure as described above, the shape of the contact surface is set so as to be adapted to the shape of the mold, and further, various types different from the mold so as to be adapted to the pressure distribution between the molds. It can be set to the shape.

  Further, the pressure on the top surface portion 15 of the pressing member 12 in the pressurizing structure 7 as shown in FIG. 4 tends to weaken the pressure around the pressing surface depending on the state of the mold pattern, pressing conditions, or the like. According to the characteristics, for example, as shown in FIG. 5A, a protrusion 22 is formed in the peripheral portion so that the substrate of this portion is in contact with the mold more strongly than the other portion, or FIG. As shown in (b), the inner side of the peripheral portion may be made thinner and the center side thicker, so that the elastic characteristics of the peripheral region of the top surface portion and the pressure distribution state in the entire pressing surface may be changed in advance. In addition, in order to change the pressure distribution on the surface to be pressurized of the substrate of the structure for pressurization, for example, a protrusion is provided at the central portion of the top surface, or a thin portion is formed on the back surface. can do.

  In the present invention, as described above, the pressure structure 7 is disposed on the back side of the substrate 1, and the substrate 1 is pushed up to press the substrate 1 against the mold 4 disposed above the substrate 1. In this case, if at least the pressing surface portion of the pressurizing structure 7 disposed on the back surface side is formed of a soft material, the following effects can be obtained. That is, for example, as shown in FIG. 6 (a), the mold 4 is usually formed of a hard material. On the other hand, when the surface portion of the pressure structure 7 is formed of a hard material, the manufacturing error of the substrate 1 and the like. When the pressure structure 7 is in contact with the back surface of the substrate 1 when the front surface and the back surface are not flat, only the convex portion on the back surface of the substrate 1 is contacted and not the other portion. The central portion is mainly pressed, and in particular, in the illustrated embodiment, the central portion may be convex on the surface side of the substrate 1 so that the peripheral portion A of the mold 4 does not contact or the imprinting pressure is small, and the central portion Or the central portion is imprinted with excessive pressure.

  On the other hand, for example, as shown in FIG. 6B, when the pressure structure 7 is a soft material, the surface of the pressure structure 7 is deformed along the unevenness of the back surface of the substrate 1, thereby The force by which the body 7 pushes up the substrate 1 acts evenly on the back surface of the substrate 1. Therefore, at the time of imprinting as shown in FIG. 5C, the pressing structure 7 pushes the substrate toward the mold 4 with a strong force, and the mold also presses the substrate 1 relatively opposite to the mold. As shown in the figure, the pressing structure 7 deforms the substrate 1 and imprints the mold 1 with an equal force. Therefore, even imprinting is possible regardless of the deformation of the substrate.

  In the present invention, the pressurizing structure is pressed against the mold 1 so as to push up the substrate from the back surface of the substrate and imprinting is performed. . That is, when the imprint operation is performed in the atmosphere, as shown in FIG. 7A, there is no strong restraining force around the substrate 1 and the substrate 1 is formed to wave. In particular, when the central portion is depressed, even if the pressure structure 7 is a soft material as described above and is in close contact with the back surface of the substrate 1, the substrate 1 is molded into the mold 4 by the pressure structure 7. When imprinting is performed by pushing up to the side, the air is sandwiched and sealed in the central portion B surrounded by a broken-line ellipse in the drawing, and a defect occurs in the imprint of this portion.

  On the other hand, as shown in FIG. 7B, the periphery of the substrate 1 is held by the substrate holding member 2, and the pressurizing structure 7 made of a soft material is placed above the free holding state of the substrate from the back surface of the substrate 1. When the substrate is pushed up, the corrugated state of the substrate is eliminated and the central portion of the pressure structure 7 becomes the highest convex shape, and the surface thereof is pressed against the upper mold 4. The sealed space in the central portion shown in (a) is not formed, and the occurrence of defects in the imprint as described above can be prevented.

  Further, when imprinting as shown in FIG. 7 is performed using a liquid resin, the liquid resin is sandwiched and sealed in the central portion B as shown in FIG. 8A corresponding to FIG. 7A. In other words, since the substrate and the mold cannot be brought close to each other, the film thickness of this portion becomes extremely large. On the other hand, as shown in FIG. 8B corresponding to FIG. 7B, the periphery of the substrate 1 is held by the substrate holding member 2, and the pressurizing structure 7 made of a soft material is removed from the back surface of the substrate 1. When pushed up, the undulating state of the substrate is eliminated and the central portion of the pressure structure 7 becomes the highest convex shape, as described above. In this state, the surface of the substrate 1 is pressed against the upper mold 4. In the process, the liquid resin at the center is pushed out to the periphery, and finally pressed against the mold 1 without sealing the liquid resin as described above, and imprinting is performed.

  Regarding the present invention as described above, when imprinting was performed in a situation where the imprinting was intentionally deteriorated and the uniform imprinting was inhibited, it was uniform even if the parallelism of about 1 mrad was ensured. It was confirmed that pressurization was possible. Moreover, it was confirmed that by applying the gel to the pressurizing structure, pressurization having better uniformity than the pressurizing structure of a single material can be performed.

  In addition, various methods can be employed for moving the pressurizing structure 7 as described above to pressurize the substrate to the mold. For example, an electric actuator such as a linear actuator, a motor, a voice coil, or a piezoelectric element. Furthermore, fluid actuators such as gas pressure and liquid pressure can be used. Further, when imprinting is performed, more accurate imprinting can be performed by providing a mechanism of a pressure structure that pressurizes the substrate from the back surface and a load measuring device for measuring the load between the samples. Further, when a position measuring device for measuring the position of the pressing portion of the back surface pressing mechanism is used, more accurate imprint control can be performed.

It is explanatory drawing of the Example of this invention. It is a figure which shows the various aspects of imprint. It is explanatory drawing of the other Example of this invention. It is explanatory drawing of other Example of this invention. It is a figure which shows the various various embodiment of this invention. It is a figure which shows the effect | action by this invention. It is a figure which shows an effect | action when imprinting by this invention is performed in air | atmosphere. It is a figure which shows an effect | action when performing the imprint by this invention in a liquid. It is explanatory drawing of the imprint conventionally performed. It is explanatory drawing at the time of the imprint of a prior art example. It is explanatory drawing at the time of the imprint of another prior art example. It is explanatory drawing at the time of the imprint of another prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Substrate holding member 3 Front surface 4 Mold 5 Pattern formation surface 6 Back surface 7 Pressure structure 8 Movable member 9 Press surface

Claims (12)

Hold around the thin substrate,
A pressurizing structure is arranged below the substrate so as to be movable up and down,
A mold is disposed above the substrate so as to face the pressing structure,
An imprinting method by backside pressing, wherein the pressing structure is raised to press the backside of the substrate, and the mold is pressed onto the surface of the substrate above the free holding position of the substrate for imprinting.   2. The imprint method according to claim 1, wherein the pressing structure is made of a material that is more flexible than the mold and the substrate. A thin substrate imprinted on the surface;
A substrate holding member for holding the periphery of the substrate;
A pressurizing structure disposed below the substrate so as to be movable up and down;
A mold disposed above the substrate and facing the structure for pressurization;
Raises the pressurizing structure presses the back surface of the substrate, the back surface pressure, characterized in that a pressing means for imprinting by pressing the mold on the substrate surface above the free holding position of the substrate Imprint device by pressure.   4. The imprint apparatus according to claim 3, wherein the pressing structure is made of a material that is more flexible than the mold and the substrate.   The said structure for pressurization has accommodated the deformation material which consists of a substance of either a liquid, gas, a gel, and an elastomer in the inside of the elastic press member which formed the top part thinly. Imprint device by backside pressure. The structure for pressurization includes a push bar that presses the flexible member from the lower surface,
5. The imprint apparatus according to claim 4, wherein the push rod has a convex curved surface at a pressing tip.   4. The back surface pressurization according to claim 3, wherein the pressurizing structure is moved by any one of a linear actuator, an electric actuator such as a motor, a voice coil, and a piezo element, and a fluid actuator such as a gas pressure and a liquid pressure. By imprint device.   4. The imprint apparatus according to claim 3, further comprising a load measuring device that measures a load between the pressing structure and the substrate during the imprint operation.   The imprint apparatus according to claim 3, further comprising a position measuring device that measures a position of a pressing portion of the pressing structure.   4. The imprint apparatus according to claim 3, further comprising means for changing a pressure distribution on a surface of the pressing structure that presses the substrate. It means for varying the pressure distribution on the surface to pressurize the substrate of the pressurizing structure, in accordance with the backside pressure according to claim 1 0, wherein it is unevenness formed in the surface or the back surface of the pressurized pressure surface Printing device.   4. The imprint apparatus according to claim 3, wherein the surface of the pressing structure that presses the substrate is set so that the inclination is variable by a minute force.

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