JP4594137B2 - Film forming apparatus and organic polymer film forming method - Google Patents

Description

  The present invention relates to a film forming apparatus for forming an organic film on a substrate such as a wafer or a glass plate by a polymerization method such as plasma polymerization or vapor deposition polymerization, and a method for forming an organic polymer film using the same.

Conventionally, in this type of film forming apparatus, there has been a problem that dust generated in the processing chamber becomes a nucleus and foreign matter protrusions are formed on the substrate surface during the film forming process.
In order to solve this problem, Patent Document 1 discloses a comb configured such that a base material (attachment) is inclined at a predetermined angle, and one surface of the base material can be inserted downward. A shaped holding member (holder jig) is disclosed.
However, in the holding member disclosed in Patent Document 1, foreign matter protrusions formed on the substrate surface cannot be eliminated due to dust generated from the holding member. Furthermore, in the film forming apparatus disclosed in Patent Document 1, since the holding member and the substrate are in linear contact with each other, and a film is also formed on this portion, the substrate is removed from the holding member after the film is formed. In addition, the film formed on the substrate sometimes peels off. When the holding member is made of metal or ceramics, the substrate surface may be damaged when the substrate is held by the holding member.

JP 2000-3250 A (FIGS. 3 to 5)

  Therefore, the present invention does not cause foreign matter protrusion due to dust generation on the substrate during the film formation process, and does not peel off the film formed on the substrate when removed from the holding member. An object of the present invention is to provide a film forming apparatus and an organic polymer film forming method that do not damage the film.

As a result of intensive studies to solve the above-mentioned problems, the present inventors have found a solution means as follows.
That is, the film forming apparatus of the present invention, as described in claim 1, forms a film for forming an organic polymer film by reacting a monomer gas with a substrate held by a holding member in a processing chamber. The apparatus is characterized in that the holding member is composed of a linear member, and the surface for supporting the substrate by point contact is covered with a film made of the same organic polymer as the film.
The film forming apparatus according to claim 2 is the film forming apparatus according to claim 1, wherein the film covering the holding member has a thickness of 1 μm or more.
A film forming apparatus according to a third aspect is the film forming apparatus according to the first or second aspect, wherein the holding member erects and holds a plurality of the substrates adjacent to each other.
The film forming apparatus according to claim 4 is characterized in that, in the film forming apparatus according to claim 1 or 2, the linear member constituting the holding member has a circular cross section, and the substrate is supported by point contact. To do.
The film forming apparatus according to claim 5 is the film forming apparatus according to any one of claims 1 to 3, wherein the organic polymer is polyimide.
Moreover, the formation method of the organic polymer membrane | film | coat of this invention is the said polymer polymer membrane | film | coat on the said board | substrate using the membrane | film | coat formation apparatus in any one of Claims 1 thru | or 5. It is characterized by forming.

  According to the present invention, by reducing or eliminating dust generated from the holding member, dust adheres to the substrate, and generation of abnormal protrusions formed on the substrate in the film formation process using the dust as a nucleus can be prevented. . In addition, when the substrate is removed from the holding member, the film formed on the substrate is not peeled off. Further, the substrate is not damaged.

INDUSTRIAL APPLICABILITY The present invention can be widely used for a film forming apparatus having a configuration capable of forming a film by reacting a monomer gas with a substrate held by a holding member. For example, when performing vacuum deposition polymerization Is a processing chamber that can exhaust the internal air to the outside and make it vacuum, a gas generator that can gasify the monomer, and an introduction that introduces the monomer gas gasified by the gas generator to the processing chamber It can be set as the structure provided with a pipe | tube and the holding member for hold | maintaining a base material in a process chamber. As a method for forming a film on the substrate, a polymerization method such as a plasma polymerization method or a vapor deposition polymerization method can be used.
The monomer gas to be introduced is not limited as long as the monomer gas can be reacted to form a film on the substrate. For example, when a polyimide film is formed on a substrate, as a combination of monomer gas, a combination of pyromellitic anhydride (PMDA) and 4,4′-oxydianiline (ODA), or PMDA and 3,5 Examples thereof include a combination with '-diaminobenzoic acid (DBA).

The holding member for holding the substrate is covered with an organic polymer film.
Examples of the organic polymer film include polyimide, polyamide, polyurea, polyurethane, and the like, and this film is formed by a vapor deposition polymerization method using a vacuum apparatus, a physical vapor deposition method, a chemical vapor deposition method, or the like. Form.
Further, the portion covered with the organic polymer film is at least a portion where the holding member is in contact with the substrate and a portion facing the substrate surface. The reason for covering the portion facing the substrate surface is that even if the holding member is separated from the substrate surface, dust may adhere to the substrate surface from the holding member due to the airflow generated in the vicinity of the substrate.

The structure of the holding member is not particularly limited as long as it can hold the substrate at least during film formation, but it is preferable to have a structure that can hold the substrate upright in the processing chamber. This is because the film thickness of the film formed on the front and back surfaces of the substrate can be made uniform. In addition, in this specification, the said standing state includes even the state which the gas made to react on the front and back of a board | substrate contacts.
In addition, it is preferable to have a structure in which a plurality of substrates can be held adjacently. This is because a film can be formed on a plurality of substrates simultaneously. As a method for making the substrates adjacent to each other, for example, there is a method in which a plurality of substrates are arranged in parallel with a predetermined interval. Furthermore, the structure of the holding member is preferably a structure that can support and hold the substrate by point contact. Since the contact portion between the substrate and the holding member is reduced, the coating film formed on the joining portion is reduced, and when the base material is removed from the holding member, peeling of the coating film formed on the base material can be prevented. It is.
Moreover, although there is no restriction | limiting in particular also about the material which comprises a holding member, It is preferable to comprise from a metal or ceramics.

Next, a film forming apparatus according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic cross-sectional view of a film forming apparatus 1 for forming a polyimide film.
The film forming apparatus 1 includes a processing chamber 2, and a pair of a first gas inlet 3 and a second gas inlet 4 for introducing a monomer gas into the processing chamber 2 via a gas inlet valve (not shown), A vacuum exhaust port 5 communicating with an oil diffusion pump (not shown) for performing an exhaust operation is provided via an exhaust valve (not shown). The holding member 6 is provided on a gantry 11 in the processing chamber 2 and holds a disk-shaped substrate 7. Further, the film forming apparatus 1 is provided with a temperature control means 8 capable of controlling the internal temperature, and is configured to supply heat necessary for the vapor deposition polymerization reaction.
The holding member 6 is covered with an organic polymer film, and includes a curved recess 6a and leg portions 6b for fixing the curved recess 6a in the processing chamber 2 as shown in FIG. And support the bottom. The board | substrate 7 is clamped between the site | parts where the curved recessed part 6a of the holding member 6 opposes, and the corner | angular part of the board | substrate 7 can contact the curved recessed part 6a in a dot shape, and can be supported. In addition, this curved recessed part 6a is comprised with a linear member, and the outer diameter shall be 3 mm or less at maximum.
Examples of the organic polymer film that covers the holding member 6 include polyimide, polyamide, polyurea, and polyurethane.
In the present invention, the holding member 6 may have any structure that can hold the substrate 7 by point contact, and a modification other than the structure shown in FIG. 2 is shown in FIG. The holding member 9 shown in the figure is disposed above the base portion 9a and a base portion 9a formed in a curved concave shape to stand the substrate 10, and processes the diameter direction of the substrate 10 in order to support both sides of the substrate 10. An annular portion 9b configured to be parallel or inclined with respect to the bottom surface of the chamber 2 and a leg portion 9c provided in the annular portion 9a for fixing the annular portion 9b in the processing chamber 2 are configured.

Next, specific examples of the present invention will be described.
A method of forming a film on the alumina substrate 7 using the film forming apparatus 1 of the embodiment described with reference to FIGS. 1 and 2 will be specifically described.
Example 1
The evacuation is activated by an exhaust valve (not shown) connected to the evacuation port 5 to reduce the internal pressure of the apparatus 1 to 10 ⁻² Pa, and the temperature is controlled by the temperature control means 8 while maintaining this pressure state. To maintain this state. And, while introducing pyromellitic dianhydride (PMDA) in a gaseous state previously heated to 208 ° C. by the temperature control means 8 from the first gas introduction port 3, the gas previously heated to 190 ° C. by the temperature control means 8 4,4′-diaminodiphenyl ether (ODA) in a state is introduced from the second gas inlet 4, and the vapor deposition polymerization reaction is allowed to proceed for 30 minutes on the surface of the substrate 7. A polyimide film having a thickness was formed. Note that the thickness of the polyimide coating on the surface of the holding member 6 was 0.5 μm.
Further, FIG. 4 shows the result of measuring the amount of dust generated in the processing chamber 2 with a particle size of 0.3, 0.5, 1.0, 5.0, 10.0 μm during this processing.

(Example 2)
Next, in order to compare the amount of dust generated in the processing chamber 2, instead of the holding member 6 of Example 1, the thickness of the polyimide coating is set to 1.0 μm, and the alumina substrate is formed in the same manner as in Example 1. A film was formed and the amount of dust generated was measured in the same manner as in Example 1. The result is shown in FIG.

  Further, as Comparative Example 1, instead of the holding member 6 of Example 1, using a holding member not coated with polyimide, the amount of dust generation was measured in the same manner as in Example 1, and the result is shown in FIG. Show.

  As can be seen from FIG. 4, it was found that when the treatment was performed in Example 1 and Example 2, the amount of dust generation was reduced compared to the case where the treatment was performed with the holding member of Comparative Example 1. . Furthermore, in Example 2 rather than Example 1, it turned out that the amount of dust generation can be 20% or less irrespective of the magnitude | size of dust.

  The present invention can be widely used as a film forming apparatus and a film forming method for forming an organic film on a substrate such as a wafer or a glass plate by a polymerization method such as plasma polymerization or vapor deposition polymerization.

Explanatory drawing of the film formation apparatus which is one embodiment of this invention Explanatory drawing of the holding member of the film forming apparatus which is one embodiment of this invention Explanatory drawing of the modification of the holding member of the film forming apparatus which is one embodiment of this invention The graph which shows the result of the comparative test in a present Example

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Film formation apparatus 2 Processing chamber 3 1st gas introduction port 4 2nd gas introduction port 5 Vacuum exhaust port 6 Holding member 7 Substrate 8 Temperature control means 9 Holding member 10 Substrate 11 Mounting stand

Claims (6)

A film forming apparatus for forming an organic polymer film by reacting a monomer gas with a substrate held by a holding member in a processing chamber, wherein the holding member is a linear member, and the substrate A film forming apparatus characterized in that the surface of the film supported by point contact is coated with a film made of the same organic polymer as the film.   The film forming apparatus according to claim 1, wherein the film covering the holding member has a thickness of 1 μm or more.     The film forming apparatus according to claim 1, wherein the holding member holds a plurality of the substrates upright and is adjacent to each other.   The film forming apparatus according to claim 1, wherein the linear member constituting the holding member has a circular cross section and supports the substrate by point contact.   The film forming apparatus according to claim 1, wherein the organic polymer is polyimide.   A method for forming an organic polymer film, comprising: forming the organic polymer film on the substrate using the film forming apparatus according to claim 1.

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