JP4583071B2 - 発光素子収納用パッケージおよび発光装置ならびに照明装置 - Google Patents

発光素子収納用パッケージおよび発光装置ならびに照明装置 Download PDF

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Publication number
JP4583071B2
JP4583071B2 JP2004156648A JP2004156648A JP4583071B2 JP 4583071 B2 JP4583071 B2 JP 4583071B2 JP 2004156648 A JP2004156648 A JP 2004156648A JP 2004156648 A JP2004156648 A JP 2004156648A JP 4583071 B2 JP4583071 B2 JP 4583071B2
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Japan
Prior art keywords
light emitting
light
emitting element
convex portion
emitting device
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Expired - Fee Related
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JP2004156648A
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Japanese (ja)
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JP2005340473A5 (enExample
JP2005340473A (ja
Inventor
民男 草野
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Kyocera Corp
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Kyocera Corp
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Priority to JP2004156648A priority Critical patent/JP4583071B2/ja
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Publication of JP2005340473A5 publication Critical patent/JP2005340473A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
JP2004156648A 2004-05-26 2004-05-26 発光素子収納用パッケージおよび発光装置ならびに照明装置 Expired - Fee Related JP4583071B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004156648A JP4583071B2 (ja) 2004-05-26 2004-05-26 発光素子収納用パッケージおよび発光装置ならびに照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004156648A JP4583071B2 (ja) 2004-05-26 2004-05-26 発光素子収納用パッケージおよび発光装置ならびに照明装置

Publications (3)

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JP2005340473A JP2005340473A (ja) 2005-12-08
JP2005340473A5 JP2005340473A5 (enExample) 2007-07-12
JP4583071B2 true JP4583071B2 (ja) 2010-11-17

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JP2004156648A Expired - Fee Related JP4583071B2 (ja) 2004-05-26 2004-05-26 発光素子収納用パッケージおよび発光装置ならびに照明装置

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JP (1) JP4583071B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102941048A (zh) * 2012-10-30 2013-02-27 无锡江原安迪科分子核医学研究发展有限公司 自动合成18f-fdg的系统

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007226190A (ja) * 2006-01-30 2007-09-06 Konica Minolta Holdings Inc 映像表示装置およびヘッドマウントディスプレイ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4432275B2 (ja) * 2000-07-13 2010-03-17 パナソニック電工株式会社 光源装置
DE10105802A1 (de) * 2001-02-07 2002-08-08 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Reflektorbehaftetes Halbleiterbauelement

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102941048A (zh) * 2012-10-30 2013-02-27 无锡江原安迪科分子核医学研究发展有限公司 自动合成18f-fdg的系统
CN102941048B (zh) * 2012-10-30 2014-09-03 米度（南京）生物技术有限公司 自动合成18f-fdg的系统

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Publication number Publication date
JP2005340473A (ja) 2005-12-08

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