JP4580704B2 - Base material for electrical insulation, method for producing the same, and prepreg and printed wiring board using the base material - Google Patents

Description

  The present invention has a high sheet strength, a good resin impregnation property, a low hygroscopic property, an electrical insulating base material excellent in electrical characteristics and thermal characteristics, a manufacturing method thereof, and an electrical insulation thereof The present invention relates to a prepreg using a base material for printed circuit boards and a printed wiring board in which an insulating layer is constituted by the prepreg.

  In recent years, electronic devices have been miniaturized and densified, and components mounted on printed wiring boards have changed from insertion type to imposition type, and along with that, surface mounting methods have become mainstream. It has become. In this surface mounting method, the connection reliability between a component such as a chip to be surface mounted and a printed wiring board is a big problem. One is a problem of thermal expansion, and it is necessary to make the thermal expansion coefficient of a component such as a chip and a printed wiring board as close as possible.

  Also, the dielectric constant should be considered. Generally, the dielectric constant of a glass / epoxy composite (for example, FR-4), which is a laminated printed wiring board in which a conventional glass cloth base material is impregnated with an epoxy resin, is about 4.7 to 5.1. A high dielectric constant slows down the propagation speed of electrical pulses in adjacent signal circuits, resulting in excessive signal propagation delay time. The higher the performance of a component, the more important the delay time due to signal propagation in the printed wiring board. Therefore, a high performance component requires a low dielectric constant laminate material.

  In view of the above requirements, as a laminated board which is a basic material of a printed wiring board, a laminated board using a nonwoven fabric made of an aromatic polyamide fiber as a base material has been studied. As a typical example, Patent Document 1 discloses a base material obtained by subjecting p-phenylene terephthalamide fiber floc and m-phenylene isophthalamide fibrid to mixed paper making and then applying heat compression treatment. The base material has a small coefficient of thermal expansion and is suitable for high-density mounting, and is lightweight and suitable for portable devices such as a mobile phone. However, since the base material has high water absorbability, a printed wiring board using the base material has an increased dielectric constant and dielectric loss tangent due to moisture absorption, which causes electrical problems.

  Further, the printed wiring board is required to be thin. Conventionally, glass cloth is used as a core material for general prepregs and printed wiring boards, but it is difficult to make glass cloth thin. Even if it can be made thin, there is a problem that handling is very bad, and there are several other problems. For example, a glass cloth has a weave due to the weaving of glass fibers, but the thinner the glass cloth, the more noticeably uneven the texture. When a prepreg is produced by impregnating this with a glass, the glass fiber protrudes in the vicinity of the surface at the convex and concave portions of the weave, and the resin becomes rich at the concave portion. Such variation in the ratio of resin to glass affects the electrical characteristics. As fine patterning progresses, this variation itself becomes a problem.

Further, a metal such as a copper foil is laminated and integrally formed at a place where the resin amount of the convex portion of the glass cloth weave is small, and a circuit is formed. In this case, the glass portion may directly contact the metal foil. Moreover, even when it does not contact, only a slight resin is interposed between the glass portion and the metal foil, and there is a risk that an electrical insulation failure due to ion migration or the like may occur. In particular, the glass cloth is a glass fiber woven fabric, and the fibers are connected. Therefore, ion migration may occur in the front and back of the copper-clad plate, that is, in the Z-axis direction, which may cause electrical conduction.
Japanese Patent Publication No. 5-65640

  The present invention was made for the purpose of improving the above-mentioned problems in the prior art, the purpose is small dielectric constant and dielectric loss tangent, which is essential for component mounting of high-performance electronic equipment, An object of the present invention is to provide a base material for electrical insulation having a dimensional stability and a thermal stability, a low hygroscopic property, a low thermal expansion coefficient, and a good resin impregnation property, and a method for producing the same. Another object of the present invention is to provide a prepreg and a printed wiring board using the base material for electrical insulation.

  The present invention has solved the above problems by the following technical configuration.
  (1) A base material for electrical insulation containing polyparaphenylene benzobisoxazole fiber and polyparaphenylene benzobisoxazole pulp and binder fiber,
The freeness of the polyparaphenylene benzobisoxazole pulp is 500 ml or more and 750 ml or less in the Canadian freeness test according to JIS P 8121,
The blending ratio of the polyparaphenylene benzobisoxazole fiber and the polyparaphenylene benzobisoxazole pulp is in the range of 1: 9 to 9: 1;
The binder fiber is blended in the range of 1 to 20% by weight of the whole base material for electrical insulation, and
Polyethylene terephthalate fiber, core-sheath fiber with polyethylene terephthalate as a core, containing at least one kind of fiber,
And the porosity is 10% or more and 60% or less, The base material for electrical insulation characterized by the above-mentioned.
  (2) The substrate for electrical insulation according to (1) above, wherein the thickness of the substrate for electrical insulation is 10 μm or more and 500 μm or less.
  (3) A prepreg for electrical insulation obtained by impregnating a base material for electrical insulation according to (1) or (2) above with a thermosetting resin and drying it.
  (4) A printed wiring board in which a metal foil is laminated on an insulating layer, wherein the insulating layer is formed by heating and pressing the electrical insulating prepreg according to (3). substrate.
  (5) Polyparaphenylene benzobisoxazole fiber and polyparaphenylene benzobisoxazole pulp having a freeness of 500 ml to 750 ml in a Canadian standard freeness test according to JIS P 8121 at a blending ratio of 1: 9 to 9: 1 After the PBO fiber / PBO pulp mixed raw material is dispersed in water in the range of the following, at least one of the binder sheath fibers, polyethylene terephthalate fiber and core-sheath fiber having polyethylene terephthalate as the core, is added to the PBO fiber / After adding water in the range of 1 to 20% by weight to the PBO pulp mixed raw material and dispersing in water to obtain a water-dispersed slurry, and papermaking the water-dispersed slurry by a wet papermaking method, water is removed, A step of obtaining a next sheet, and subjecting the primary sheet to a heat and pressure treatment, the binder Method for producing an electrical insulating base material according to (1), characterized in that a step of fusing between the fibers and pulp by melting of Wei.

  The base material for electrical insulation of the present invention is a base material for electrical insulation containing polyparaphenylene benzobisoxazole fiber and polyparaphenylene benzobisoxazole pulp and binder fiber, and the binder fiber is polyethylene terephthalate fiber, polyethylene Since it is characterized by containing at least one kind of core-sheath fiber having terephthalate as a core, it has high sheet strength and good resin impregnation property, low hygroscopicity, dielectric constant and Dielectric loss tangent is small, and thermal stability, low thermal expansion coefficient, and dimensional stability are excellent. Moreover, it has sufficient sheet strength and resin impregnation required in the manufacturing process of the prepreg and printed wiring board. Therefore, printed wiring boards made using this base material for electrical insulation have excellent electrical insulation, solder heat resistance, electrical properties (low dielectric constant, low dielectric loss tangent), dimensional stability, and low thermal expansion. It has a modulus and a high elastic modulus, and can be provided as an insulating printed wiring board used in high-performance electronic equipment.

  The polyparaphenylene benzobisoxazole (hereinafter abbreviated as “PBO”) fiber used in the present invention is a supermarket currently available on the market as described in, for example, JP-A-8-41728. It has twice the strength and elastic modulus (270GPs) of polyparaphenylene terephthalamide fiber, which is a typical fiber, and has superior heat resistance (decomposition temperature 650 ° C.) and low moisture absorption (0. 6%), low dielectric constant (dielectric constant 3.0 / dielectric loss tangent 0.001), negative thermal expansion coefficient (−6 ppm / ° C.), etc. . Further, it is also known that this PBO fiber can be produced from a polyphosphoric acid solution of a polybenzazole polymer, and there are, for example, U.S. Pat. No. 5,296,185 and U.S. Pat. No. 5,294,390. WO94 / 04726 and a heat treatment method are proposed in US Pat. No. 5,296,185. Specifically, for example, the product name “ZYLON” of Toyobo Co., Ltd. is used. The fiber diameter of the PBO fiber is about 12 μm, but the present invention is not limited to this. The fiber length of about 3 mm to 9 mm is preferably used in the present invention.

  The PBO pulp is a fibrillated PBO fiber, and can be produced by a beating process using long fibers of PBO fibers or short fibers of about several mm. As a means for producing PBO pulp, general beating machines such as a ball mill, a beater, a lampen mill, a Kohler gang, a PFI mill, a jocromill, an SDR (single disc refiner), a DDR (double disc refiner), and other refiners can be used. .

  As the role of PBO pulp, the role of improving the sheet strength, thinning the sheet, adjusting the sheet density, suppressing the orientation during papermaking, and the like can be given. The increase in sheet strength is due to the fibrillated fine fibers increasing the physical entanglement between the fibers.

  The thinning of the sheet is achieved because the PBO fiber is made into a pulp. That is, by making it into a pulp, the fiber diameter is reduced, and the fibers are crushed into a flat shape, so that the sheet thickness can be made thinner than when only PBO fibers are used. By thinning the sheet-like base material, a thin prepreg impregnated with a thermosetting resin using the sheet-like base material as a core material and a printed wiring board using the prepreg can be produced. Moreover, although it is related also to sheet thinning, since the fiber diameter of PBO pulp is thin, the density | concentration of the sheet | seat which uses PBO pulp becomes higher than the sheet | seat which uses only PBO fiber. Therefore, the sheet density can be adjusted by mixing PBO pulp with PBO fibers.

  Suppression of orientation during papermaking with PBO pulp refers to the following. When a fiber having a certain length is made, the fibers tend to be oriented in either direction in the flow direction and the width direction of the making. The tendency becomes more remarkable as the fiber length is longer. In a sheet having such an orientation, the sheet strength is affected by the orientation, and differs depending on the papermaking flow direction and the width direction. Since PBO pulp is split from PBO fiber and many thin fibers like branches extend in all directions and are shortened, paper made from PBO pulp is paper-made compared to PBO fiber. It is difficult to show the orientation due to, and the sheet is uniform in the papermaking direction, the width direction, and all other directions. The non-orientation naturally affects the sheet strength, and the difference in sheet strength between the paper making direction and the width direction can be suppressed as much as possible.

  In order to sufficiently fulfill the role of the above PBO pulp, it is necessary to use a pulp in a state suitable for it. In this invention, it represents using the freeness used as a parameter | index of a general natural pulp as a state of PBO pulp. The freeness is an index (numerical value) indicating the degree of drainage of pulp, and indicates the degree of beating of fibers. The smaller the freeness, the worse the water drainage, the higher the degree of beating and the pulping. The test method for the freeness of PBO pulp fibrillated from the PBO fiber of the present invention employs the Canadian standard freeness test method defined in JIS P8121. The freeness of PBO pulp measured by the above method is preferably 750 ml or less. When it is larger than 750 ml, fibrillation is not sufficient and sufficient entanglement between fibers cannot be obtained. More preferably, the freeness is in the range of 500 ml to 750 ml. When the freeness is less than 500 ml, water pulling at the time of paper making deteriorates, and there is a risk that defects in the paper making process, such as wire clogging. Further, the density of the sheet is high, the sheet becomes clogged, the porosity is lowered, and the resin impregnation property when impregnating the resin is deteriorated.

  Since the freeness is an index (numerical value) representing the degree of drainage of the pulp, in the process of obtaining PBO pulp by fibrillating the PBO fibers, even when the PBO fibers are severely cut and become extremely short fibers, The freeness value is low. However, if the fibers are simply cut and shortened, the effect of entanglement between the fibers is not expected, so that it is not suitable as the PBO pulp used in the present invention. In the present invention, a PBO pulp in which a small branch is slightly separated from a thick main PBO fiber, the fiber is cut into short fibers, and the fibers are crushed into a flat shape is preferably used.

  In the present invention, in order to obtain a prepreg by impregnating a sheet containing PBO fibers and PBO pulp with a thermosetting resin, the sheet must have voids necessary for resin impregnation. However, the higher the porosity is, the more advantageous the resin impregnation is, and the preferable range of the porosity value from the viewpoint of resin impregnation is 10% to 60%. If it is less than 10%, there is no room for the resin to impregnate, and the impregnation property deteriorates. If it is larger than 60%, the sheet becomes in a scrambled state, and even if it is impregnated with resin, it becomes difficult to fill all the gaps with the resin. If prepreg or copper-clad plate is used, the gaps may remain inside. . A more preferable value of the porosity is in the range of 20% to 40%. In order to obtain a porosity suitable for resin impregnation, the blend ratio of PBO fiber and PBO pulp in the present invention is preferably in the range of 1: 9 to 9: 1. When the blending ratio of PBO pulp is smaller than 1, the porosity is excessive, and when the blending ratio of PBO pulp is larger than 9, the porosity is excessively small. The reason is that PBO pulp has a fiber diameter smaller than that of PBO fiber and is in a pulp state (a state in which a large number of thin fibers are branched from the trunk fiber). Therefore, if the ratio of PBO pulp is increased, the density of the sheet is increased. This is because the void ratio increases and the porosity decreases. The blending ratio of PBO fiber and PBO pulp is more preferably in the range of 2: 8 to 7: 3. More preferably, it is in the range of 3: 7 to 5: 5.

  As the binder fiber used in the present invention, it is essential to use at least one kind of fiber among polyethylene terephthalate (PET) fiber and core-sheath fiber having polyethylene terephthalate as a core. The PBO fiber has a very high heat resistance, and the substrate for electrical insulation of the present invention using this PBO fiber naturally has a high heat resistance. However, since the PBO fiber has high heat resistance, the PBO fibers cannot be fused together. Therefore, it is necessary to form a sheet-like substrate by fusing PBO fibers with a binder. In this case, if the binder has a low melting point and is not heat resistant, the heat resistance of the formed sheet-like substrate is governed by the binder, and the meaning of using PBO fibers is reduced. Therefore, in the present invention, in order to make full use of the heat resistance of the PBO fiber, a polyethylene terephthalate fiber having a high melting point of 260 ° C. and heat resistance is used as the binder.

  A core-sheath fiber having polyethylene terephthalate as a core and a resin having a melting point lower than that of polyethylene terephthalate as a sheath can also be used. By using this fiber, it is possible to obtain a binder effect by treatment in a temperature range in which only the sheath part melts, and to maintain heat resistance by allowing the polyethylene terephthalate in the core part to exist as it is. Further, when this core-sheath fiber is used as a binder fiber, there are the following merits.

  In order to obtain a binder effect for improving the sheet strength, the binder fibers must be melted to fuse the PBO fibers. However, when the binder fiber is melted and the fluidity of the melted binder fiber increases, in addition to the effect of improving the sheet strength due to the binder effect, it becomes easier to make a binder resin film on the surface of the sheet substrate, There is also an adverse effect of impairing the impregnation property of the thermosetting resin during the preparation of the prepreg. As a means for suppressing the resin impregnation deterioration due to the formation of the binder resin film, a binder fiber having a core-sheath structure is effective. For example, by using polyethylene terephthalate for the core part of the core-sheath fiber and using a resin having a melting point lower than that of the core polyethylene terephthalate for the sheath part, such as polyethylene, polypropylene, low melting point polyethylene terephthalate, etc. In the treatment, only the sheath portion is melted to fuse the PBO fibers. On the other hand, since the polyethylene terephthalate in the core part is present as a fiber, the surface of the sheet base material is not covered with the binder resin film. Further, since the core portion is present as it is, the porosity of the sheet does not decrease, and the molten resin enters the space in the sheet. Therefore, the problem of resin impregnation deterioration can be solved. In addition, melting | fusing point of this invention is the value of melting | fusing point measured using the differential scanning calorimeter (DSC). Further, the above-described binder fibers, polyethylene terephthalate fiber and core-sheath fiber having polyethylene terephthalate as a core, can be used in combination.

  It is preferable that the compounding quantity of the binder fiber in this invention is the range of 1-20 weight% of the whole base material for electrical insulation materials. More preferably, they are 3 weight%-15 weight%, More preferably, they are 5 weight%-10 weight%. When it is 1% by weight or less, the function as a binder is lowered, and the optimum sheet strength cannot be obtained. On the other hand, if it is 20% by weight or more, characteristics such as heat resistance, low dielectric property, and low hygroscopicity, which are characteristic of PBO fiber or PBO pulp, may be impaired. The binder content is preferably smaller in order to maintain the required binder performance. In addition, the base material for electrical insulation of the present invention has various paper strength enhancers, dispersants, antifoaming agents, surfactants, synthetic adhesives, pigment components and the like used in ordinary papermaking. It may be included.

  The base material for electrical insulation of the present invention has the following advantages as compared with a glass cloth used as a core material for conventional general prepregs and printed wiring boards. That is, it is difficult to make the glass cloth thin, and there is a problem in that the ratio between the resin of the convex and concave portions of the weave and the glass varies and adversely affects the electrical characteristics. On the other hand, unlike the woven fabric, the sheet-like base material for electrical insulation of the present invention has no unevenness on the sheet surface and is excellent in surface flatness. The advantages over these glass cloths become more prominent as the sheet thickness decreases.

  Moreover, PBO fiber has the characteristic that it has a high elastic modulus, and the elastic modulus of the printed wiring board which laminated | stacked the prepreg which impregnated the resin to the PBO fiber sheet which made the PBO fiber and PBO pulp the main component Also gets higher. For this reason, even when the thickness of these substrates is reduced, the amount of change such as elongation and bending when stress is applied is small, and electrical connection reliability, crack generation prevention, strength, dimensional stability, etc. are excellent. Retains characteristics.

  The electrical insulating base material of the present invention can be produced by the method described below, but the present invention is not limited to this method. First, PBO fiber and PBO pulp obtained by fibrillating the PBO fiber are dispersed in water, and then a binder fiber is added, and further stirred and dispersed in water. The obtained water-dispersed slurry is dewatered on a paper-making net by a normal paper machine to form a web, moisture is removed through a dryer and dried to obtain a primary sheet. Thereafter, the primary sheet is heated and pressurized by a pair of hot rolls such as a heat calender, and the binder fibers are melt-fused to form a sheet. The electrical insulating base material of the present invention must have voids for impregnating with the thermosetting resin later, and the porosity depends on the pressure applied at this time. Increasing the pressure pressure decreases the porosity, and decreasing the pressure pressure increases the porosity. Therefore, it is necessary to adjust the pressurization pressure and the heating temperature in order to obtain a desired porosity by the resin to be impregnated. In addition, for the production of the base material for electrical insulation of the present invention, various paper strength enhancers, dispersants, antifoaming agents, surfactants, synthetic sticking agents, pigment components, etc. used in ordinary papermaking are added. Agents can be used.

  In addition, in order to have sufficient electrical insulation as an electrically insulating substrate, in order to remove impurities contained in the paper making process, particularly organic substances, the obtained electrically insulating substrate is used in the binder used. It is also possible to add a step of thermally decomposing and removing the organic matter contained by exposure to a temperature below the melting point for a long time. Thereby, sufficient electrical insulation as an electrical insulation base material can be provided.

  The base material for electrical insulation of the present invention obtained as described above is an excellent feature that the thickness is thin and the formation is uniform because it is a wet method compared to the dry method used in the production of nonwoven fabrics. have. As for the thickness of the base material for electrical insulation of this invention, 10-500 micrometers is preferable. If the thickness is less than 10 μm, practical strength cannot be maintained. On the other hand, when it is thicker than 500 μm, the productivity is lowered.

  The prepreg in the present invention can be produced by impregnating a base material for electrical insulation obtained as described above without impregnation with a thermosetting resin varnish having high electrical resistance, drying and curing. As the thermosetting resin, for example, an epoxy resin, a phenol resin, an unsaturated polyester resin, a melamine resin, a polyimide resin, or the like can be used. The thickness of the prepreg formed can be set to a thickness of 15 mm or more.

  The printed wiring board in the present invention is produced by stacking a metal foil on the prepreg layer obtained as described above, and heating and pressing them. When a circuit is formed on the metal layer of the obtained printed wiring board, a metal foil is laminated on this through a prepreg, and integrated by heating and pressing, a multilayer printed wiring board with an increased number of circuit layers is produced. You can also Also, a multilayer printed wiring board can be produced by interposing a prepreg between a plurality of printed wiring boards, stacking a metal foil on the surface via the prepreg, and integrating them by heat and pressure molding. .

  Next, the base material for electrical insulation according to the present invention, the prepreg using the base material, and the printed wiring board will be described with reference to examples.

Example 1
PBO fiber (Toyobo Co., Ltd., trade name: Zylon, fiber diameter 12 μm, fiber length 6 mm) and its PBO fiber are fibrillated and processed with a Canadian standard freeness of 670 ml (JIS P 8121) as shown in FIG. A fiber raw material of PBO fiber / PBO pulp in which PBO pulp with few thin branches was blended at a ratio of 5: 5 (weight ratio) was dispersed in water. After that, polyethylene terephthalate (PET) fiber (Kuraray: EP133 (1.3d × 5mm)) as a binder fiber is added in an amount of 10% by weight to the PBO fiber / PBO pulp mixed raw material, stirred, dispersed in water and wet-paper-made. To obtain a nonwoven fabric. Using a heat calender in which the nonwoven fabric was heated and adjusted to 240 ° C., thermocompression treatment was performed by heating and pressing under conditions of a linear pressure of 50 kg / cm, the binder was melted and fused, and the basis weight was 40 g / cm 2 and the thickness was 40 μm. The base material for electrical insulation of the present invention was obtained. The obtained base material for electrical insulation was impregnated with a brominated bisphenol A type epoxy resin varnish, dried and cured to obtain a prepreg having a resin content of 50% by weight. Four obtained prepregs were overlapped, copper foil (18 μm / electrolytic copper foil) was placed on the upper and lower surfaces, and heat-press molding was performed at a temperature of 170 ° C. and a pressure of 4 MPa to obtain a printed wiring board.

(Example 2)
The printed wiring according to the present invention was produced in the same manner as in Example 1 except that 5% by weight of PET fiber (Kuraray Co., Ltd .: EP133 (1.3d × 5 mm)) was used as the binder fiber with respect to the PBO fiber / PBO pulp mixed raw material. A substrate was obtained.

(Example 3)
The printed wiring according to the present invention was produced in the same manner as in Example 1 except that 15% by weight of PET fiber (Kuraray Co., Ltd .: EP133 (1.3d × 5 mm)) was used as the binder fiber based on the PBO fiber / PBO pulp mixed raw material. A substrate was obtained.

Example 4
A printed wiring board of the present invention was obtained in the same manner as in Example 1 except that the blending ratio of PBO fiber and PBO pulp was 7: 3 (weight ratio).

(Example 5)
A printed wiring board of the present invention was obtained in the same manner as in Example 1 except that the blending ratio of PBO fiber and PBO pulp was 3: 7 (weight ratio).

(Example 6)
The print of the present invention was produced in the same manner as in Example 1 except that a core-sheath fiber (made by Kuraray Co., Ltd .: N720K (2.0d × 5 mm)) using PET as the core and modified PET as the sheath was used as the binder fiber. A wiring board was obtained.

(Example 7)
The printed wiring of the present invention is the same as in Example 1 except that PBO pulp has Canadian freeness of 520 ml (JIS P 8121) and PBO pulp having many fine branches as shown in FIG. 2 is used. A substrate was obtained .

(Comparative Example 1 )
A printed wiring board was obtained in the same manner as in Example 1 except that only PBO fibers were used without using PBO pulp.

(Comparative Example 2 )
A printed wiring board was obtained in the same manner as in Example 1 except that aramid fibers and aramid pulp (Kevlar manufactured by DuPont) were used instead of PBO fibers and PBO pulp.

(Comparative Example 3 )
A copper-clad plate FR-4 in which a glass cloth was impregnated with an epoxy resin was used for comparison.

Evaluation items and evaluation methods of the base material for electrical insulation, the prepreg, and the printed wiring board in each of the above examples are shown below.
(1) Sheet strength of substrate for electrical insulation Measured at room temperature according to JIS P8113.
(2) Air permeability of base material for electrical insulation Measured according to JIS P 8117.
(3) Resin-impregnated base material for electrical insulation 50 × 50 mm was cut out from the base material for electrical insulation, the sheet was floated on castor oil, and the time until castor oil was impregnated over the entire sheet was measured at room temperature.
(4) Solder heat resistance In accordance with JIS C 6481, the measurement sample is boiled for 8 hours, placed in a 260 ° C. solder bath for 30 seconds, and checked for appearance defects such as copper foil swelling of the printed wiring board, The case where the appearance defect occurred was indicated as “x”, and the case where the appearance defect did not occur was indicated as “◯”.
(5) After the insulating printed wiring board was processed for 200 hours in a pressure cooker, the insulation resistance was measured in accordance with JIS C 6481. did.
(6) Dielectric constant The dielectric constant in a frequency band of 1 MHz was measured according to JIS C 6481.
(7) Coefficient of thermal expansion Measured according to JIS C 6481. The measurement range was from room temperature to 200 ° C.
The obtained results are shown in Table 1.

  As shown in Table 1, at least one of polyparaphenylene benzobisoxazole fiber and polyparaphenylene benzobisoxazole pulp of the present invention, and a core-sheath fiber having polyethylene terephthalate as a core as a binder. The base material for electrical insulation characterized by containing fibers has sufficient strength in the manufacturing process of a prepreg or a printed wiring board, and has good resin impregnation properties. Moreover, it turns out that the prepreg using the base material for electrical insulation and the board | substrate for printed wiring have the outstanding electrical insulation, solder heat resistance, an electrical property, and a low thermal expansion coefficient.

It is a microscope picture of the polyparaphenylene benzobisoxazole (PBO) pulp used for Example 1 of this invention. It is a microscope picture of the polyparaphenylene benzobisoxazole (PBO) pulp used for Example 7 of this invention.

Claims (5)

A substrate for electrical insulation containing polyparaphenylene benzobisoxazole fiber and polyparaphenylene benzobisoxazole pulp and binder fiber,
The freeness of the polyparaphenylene benzobisoxazole pulp is 500 ml or more and 750 ml or less in a Canadian freeness test according to JIS P 8121,
The blending ratio of the polyparaphenylene benzobisoxazole fiber and the polyparaphenylene benzobisoxazole pulp is in the range of 1: 9 to 9: 1;
The binder fiber is blended in the range of 1 to 20% by weight of the whole base material for an electrical insulating material, and at least one fiber of polyethylene terephthalate fiber and core-sheath fiber having polyethylene terephthalate as a core. contain,
And the porosity is 10% or more and 60% or less, The base material for electrical insulation characterized by the above-mentioned. The thickness of the said base material for electrical insulation is 10 micrometers or more and 500 micrometers or less, The base material for electrical insulation of Claim 1 characterized by the above-mentioned. A prepreg for electrical insulation, wherein the electrical insulation base material according to claim 1 or 2 is impregnated with a thermosetting resin and dried. A printed wiring board in which a metal foil is laminated on an insulating layer, wherein the insulating layer is formed by heat-pressing the electrical insulating prepreg according to claim 3 . The blending ratio of polyparaphenylene benzobisoxazole fiber and polyparaphenylene benzobisoxazole pulp whose freeness is 500 ml or more and 750 ml or less in Canadian standard freeness test according to JIS P 8121 is in the range of 1: 9 to 9: 1. in after a PBO fiber / PBO pulp raw material mixture is dispersed in water, a binder fiber, polyethylene terephthalate fiber, core-sheath fibers as a core of polyethylene terephthalate, the PBO fiber / PBO pulp at least one fiber of the After adding water in the range of 1 to 20% by weight to the mixed raw material and dispersing in water to obtain a water-dispersed slurry and papermaking the water-dispersed slurry by a wet papermaking method, the water is removed and the primary sheet is removed. And heating and pressurizing the primary sheet to dissolve the binder fiber. Method for producing an electrical insulating substrate according to claim 1, characterized in that a step of fusing between the fibers and pulp by.

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