JP4572420B2 - Board holder - Google Patents

Description

  The present invention relates to a substrate holder in which a mask is accurately and reproducibly arranged with respect to a substrate when a film forming device such as a vapor deposition device or a sputtering device is used to form a film in an arbitrary pattern through the mask.

  When using a film forming device such as a sputtering device or a vapor deposition device to form a film in an arbitrary pattern, it has traditionally been done by attaching a metal mask to cover a part of the substrate surface. Has been done. In this case, in order to form a film only at an appropriate location on the substrate, it is important to position the mask accurately and attach it to the substrate. To increase the yield of the product, the mask is placed accurately and with good reproducibility. It is important to.

  From this, a substrate holder comprising a substrate holder for holding the substrate and a mask holder for holding the mask and being aligned and assembled with each other is used, and the substrate and the mask are respectively placed at predetermined positions. It is known that a set substrate holder and a mask holder are assembled and transported into a film forming apparatus to form a film (see Patent Document 1).

In this case, the mutual alignment between the substrate holder and the mask holder is performed by fitting the fitting ring and the alignment pin of the substrate holder into the fitting groove and the alignment hole of the mask holder, respectively. The mask used for the film is maintained in the same positional relationship with respect to the substrate with reference to the mask mounting hole of the mask so that the mask can be arranged accurately and with good reproducibility.
Japanese Patent Laid-Open No. 2002-33283 (for example, see the description of the embodiment of the invention).

  By the way, during film formation using a film formation apparatus, depending on the film formation process, plasma is generated in the chamber of the film formation apparatus, or the adhesion strength of the thin film to the substrate is increased, for example, In order to prevent damage due to the stress of the thin film, the substrate may be heated to a predetermined temperature (for example, 300 ° C. or higher) by a heating means provided in the film forming apparatus.

  In this case, when film formation is performed with the substrate held by the above-described substrate holder, the substrate holder itself is heated together with the substrate by being heated by a heating means or exposed to plasma. When the substrate holder is heated, due to the difference in thermal expansion between the substrate holder and the mask holder due to the difference in shape, galling occurs at the mated part, making it difficult to separate the substrate holder and the mask holder after film formation. There is a problem of becoming. At that time, if a plurality of alignment pins and alignment holes are provided for more accurate positioning, the frequency of pin galling in any of the alignment holes increases, making it more difficult to separate each other. .

  On the other hand, if galling occurs in the mated part, if the substrate holder and the mask holder are separated by applying force, the substrate holder, the mask holder and the alignment pin may be deformed. If the mask holder and the alignment pin are deformed, the mask cannot be accurately and reproducibly arranged on the substrate.

  In view of the above, an object of the present invention is to provide a substrate holder in which the substrate holder and the mask holder can be easily separated and the substrate and the mask can be accurately and reproducibly arranged.

  In order to solve the above problems, a substrate holder of the present invention comprises a substrate holder that holds a substrate, and a mask holder that has an opening facing the substrate, and a mask is mounted on the opening. And a mask holder, and a substrate holder that can form a film in an arbitrary pattern on the substrate through the mask. One of the substrate holder and the mask holder protrudes toward the other. A pin hole is formed on the other side, and a pin hole into which the pin is inserted is formed on the other side, and a part of the peripheral wall surface of the substrate holder and the mask holder in which the substrate holder and the mask holder are fitted with a taper surface corresponding to each other. It is characterized by that.

  According to the present invention, the substrate is set at a predetermined position of the substrate holder, and the mask is set at a predetermined position of the mask holder. Then, the substrate holder and the mask holder are fitted to each other while one pin provided on either the substrate holder or the mask holder is inserted into the pin hole formed on the other, and the two are assembled. In this case, a part of each peripheral wall surface of the substrate holder and the mask holder is made into a taper surface corresponding to each other, and each taper surface is overlapped at the time of assembly, so that the substrate holder and the mask holder are positioned with reference to the pin. In addition, the mask can be accurately and reproducibly arranged on the substrate.

  In addition, since each taper surface is superposed and one pin is used, even if the substrate holder itself is heated during film formation and a difference in thermal expansion occurs between the substrate holder and the mask holder. The difference in thermal expansion is absorbed by the overlapped taper surface, and the occurrence of galling at the fitted portion can be prevented, so that it is not difficult to separate the substrate holder and the mask holder after film formation.

  In this case, each peripheral wall surface of the substrate holder and the mask holder excluding the tapered surface has a cylindrical shape, and the circumferential length of the tapered surface is based on a center line passing through the center of the pin and the substrate holder or the mask holder, If it is set so as to be symmetrical in a predetermined angle range, a thermal expansion between the substrate holder and the mask holder is caused by the presence of a tapered surface near the portion where the pin is fitted in the pin hole. Even if there is a difference, pin pinning can be prevented from occurring in the pin hole, and when the board holder and mask holder are fitted and assembled together, unnecessary force is applied to the pin and it can be deformed. It can be prevented.

  In addition, when each peripheral wall surface of the substrate holder and the mask holder is a polyhedron, one of the vertices is positioned on the center line passing through the center of the pin and the substrate holder or the mask holder, and two sides forming the vertices are What is necessary is just to set it as the said taper surface.

  If the substrate holder is formed on the substrate holder so as to substantially match the shape of the substrate, and the substrate is dropped into the substrate holder, the substrate is set in a fixed position relative to the substrate holder. Good.

  In addition, if the mask holder is formed in the mask holder so that it substantially matches the shape of the mask, and the mask is placed in the mask holder, the mask setting position with respect to the mask holder becomes constant. Good.

  It is preferable that flange portions are provided on the upper surfaces of the substrate holder and the mask holder so as to extend outward.

  As described above, the substrate holder of the present invention has an effect that the substrate holder and the mask holder can be easily separated and the substrate and the mask can be accurately and reproducibly arranged.

  Referring to FIGS. 1 to 4, reference numeral 1 denotes a substrate holder of the present invention that is used when a film is formed by a film forming apparatus (not shown) such as a sputtering apparatus or a vapor deposition apparatus. The substrate holder 1 is configured by assembling a substrate holder 2 and a mask holder 3 in the vertical direction. As shown in FIGS. 2A and 2B, the substrate holder 2 is made of a metal such as aluminum and is formed in a dish shape having a cylindrical outer peripheral wall. An opening 21 is formed at the center of the bottom plate of the substrate holder 2, and an annular extending member 22 is formed at the lowermost end of the opening 21 so as to extend inward, thereby constituting a substrate storage portion. To do.

  In this case, the shape of the opening 21 is substantially matched with the shape of the substrate S (in the present embodiment, the shape of the opening 21 is square corresponding to the square substrate), and the upper side of the opening 21. The substrate S supported by the extending member 22 is set at a predetermined position of the substrate holder 2 (that is, the substrate S is positioned) simply by dropping the substrate S from the opening 21 into the opening 21. An annular flange 23 is formed at the upper end of the substrate holder 2 so as to extend outward. For example, the substrate S is set by the transport device 4 having a known structure having a fork-shaped tip 41. The substrate holder 2 can be transported (see FIG. 1).

  As shown in FIGS. 3A and 3B, the lower mask holder 3 is made of a metal such as aluminum and is formed in a cylindrical shape. A through-hole 31 extending in the vertical direction is opened at the center of the mask holder 3. The through hole 31 is formed substantially parallel to the outer peripheral surface of the mask holder 3 from the upper surface to the substantially central portion, and is inclined so as to expand toward the lower surface.

  By the way, in order to form a film only at an appropriate location on the substrate S, it is necessary to position the substrate S and the mask M with high accuracy. For this reason, the outer peripheral wall of the substrate holder 2 is stepped so that the diameter of the lower end of the outer peripheral wall of the substrate holder 2 is reduced (see FIG. 2), and the small diameter of the substrate holder 2 is formed on the upper surface of the mask holder 3. A first recess 32 into which the outer peripheral wall 24 is fitted is formed, and the lower part of the substrate holder 2 and the upper part of the mask holder 3 are fitted and assembled.

  Further, a second recess 33 is formed on the upper surface of the mask holder 3 so as to be located inside the first recess 32 and constitute a mask storage portion, and the second recess 33 located outside the peripheral edge of the upper end of the through hole 31. The mask M is held by the flat surface 34 of the second recess 33. In this case, the shape of the second recess 33 is substantially matched to the shape of the mask M, and the mask M supported by the flat surface 34 can be removed from the mask holder simply by dropping the mask M from the upper side of the second recess 33. 3 (ie, the substrate is positioned). When the mask M is set, it is desirable to set the dimension in the depth direction so that the upper surface of the mask M is flush with the flat surface 34.

  At the upper end of the mask holder 3, as in the case of the substrate holder 2, an annular flange portion 35 is formed to extend outward, and the mask holder 3 alone in which the mask M is set by the transfer device 4 is formed. Alternatively, the substrate holder 2 with the substrate S set on the mask holder 3 can be transported in an assembled state. Then, for example, in a state where the substrate holder 2 on which the substrate 3 is set and the mask holder 3 on which the mask M is held are assembled, the conveying means 4 is placed at a position facing the evaporation source E provided in the film forming apparatus. Then, the film is formed on the substrate S through the mask M in an arbitrary pattern. On the other hand, the mask holder 3 is arranged in advance at a position facing the evaporation source E provided in the film forming apparatus, and the substrate holder 2 on which the substrate 3 is set is conveyed by the conveying means 4, and the mask M is set. The mask holder 3 may be assembled.

  By the way, during film formation using the film formation apparatus, depending on the film formation process, plasma is generated in the chamber of the film formation apparatus or the substrate is heated to a predetermined temperature by a heating means provided in the film formation apparatus. In some cases, film formation is performed. In this case, even if the substrate holder 1 itself is heated, it is necessary to prevent galling at the fitted portion due to the difference in thermal expansion between the substrate holder 2 and the mask holder 3.

  In the present embodiment, a part of the small-diameter outer peripheral wall 24 protruding to the lower side of the substrate holder 2 is formed as a tapered surface 25 inclined toward the inside in the front end direction, and is made to correspond to the tapered surface 25. The tapered surface 36 is formed on the side wall of the first recess 32 into which the outer peripheral wall 24 is fitted. In addition, a single pin 26 protruding toward the mask holder 3 is provided on the bottom surface of the substrate holder 2, and a pin hole 37 into which the pin 26 is fitted is formed on the top surface of the mask holder 3.

  In this case, the circumferential lengths of the taper surfaces 25 and 36 are set so as to be bilaterally symmetric at an angle α in the range of 60 degrees to 120 degrees with reference to the center line passing through the center of the pin 26 and the substrate holder 2. is doing. In this case, positioning becomes difficult at an angle smaller than 60 degrees, and galling due to heat may occur at an angle exceeding 120 degrees.

  As a result, when the substrate holder 2 and the mask holder 3 are assembled, a part of the portion to be fitted has a structure in which the tapered surfaces 25 and 36 are overlapped, so that the circumferential direction of each tapered surface 25 and 36 is based on the pin 26. In other words, the substrate M and the mask holder 3 are positioned, and the substrate S and the mask M are positioned on the substrate holder 2 and the mask holder 3, respectively. The placement is accurate and reproducible.

  In addition, since the tapered surfaces 25 and 36 are overlapped and the portion where the pin 26 and the pin hole 37 are fitted is one place, the substrate holder 1 itself is heated during film formation, and the substrate holder 2 and the mask holder 3, even if a difference in thermal expansion occurs, the difference in thermal expansion is absorbed by the overlapped tapered surfaces 25 and 36, thereby causing galling in the mated portion. In addition, the presence of the tapered surfaces 25 and 36 close to the pin 26 prevents the pin 26 from being galled into the pin hole 37. For this reason, the substrate holder 2 can be easily separated from the mask holder 3 simply by lifting the substrate holder 2 by the transport means 4 after film formation.

  Next, assembly of the substrate holder 1 of the present invention will be described. The substrate S is dropped from above the opening 21 of the substrate holder 2 into the opening 21 which is a substrate storage portion, and the substrate S is supported by the extending member 22 to set the substrate S. Further, the mask M is dropped from the upper side of the second recess 33 which is a mask storage portion of the mask holder 3, and the mask M is set by supporting the mask M on the flat surface 34.

  Next, the substrate holder 2 and the mask holder 3 are assembled in the vertical direction. In this case, the substrate holder 2 is lowered from above the mask holder 3 while aligning the vertical positions of the pins 26 provided on the substrate holder 2 and the pin holes 37 provided on the mask holder 3. When the substrate holder 2 is lowered, the pin 26 is inserted into the pin hole 37. In this case, when the pin 26 is inserted into the pin hole 37, the circumferential positions of the tapered surfaces 26 and 36 coincide.

  When the substrate holder 2 is further lowered, the tapers 25 and 36 are overlapped with each other, and the lower surface of the outer peripheral wall 24 of the substrate holder 2 and the flat surface of the first recess 32 of the mask holder 3 come into contact with each other. The lower part and the upper part of the mask holder 3 are fitted. Then, in a state where the substrate holder 2 on which the substrate S is set and the mask holder 3 on which the mask M is set are assembled, the substrate holder 2 is transferred to a position facing the evaporation source E provided in the film forming apparatus, A film is formed on the substrate S in an arbitrary pattern through the mask M. In this case, when installing on the stage provided in the film-forming apparatus by the conveying means 4, for example, a positioning pin is provided on the stage, and a pin hole into which the positioning pin is inserted is provided on the bottom surface of the mask holder 3. It is good.

  In the present embodiment, the portion where the substrate holder 2 and the mask holder 3 are fitted to each other excluding the taper surfaces 25 and 36 is cylindrical, but is not limited thereto. The portions that fit together may be, for example, a polyhedral shape such as a triangular shape or a quadrangular shape. In this case, if one of the vertices is positioned on a center line passing through the center of the pin 26 and the substrate holder 2 or the mask holder 3, and the two sides forming the vertices are tapered surfaces, the same effect as described above can be obtained. can get.

  Further, in the present embodiment, the description has been given of the case in which the substrate holder 2 is fitted and assembled on the mask holder 3, but this is not a limitation. For example, the mask holder 3 is fitted on the substrate 2 holder. And may be assembled.

The exploded perspective view explaining the substrate holder of the present invention. (A) And (b) is a figure explaining a substrate holder. (A) And (b) is a figure explaining a mask holder. Sectional drawing shown in the state which assembled | attached the board | substrate holder shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate holder 2 Substrate holder 25 Tapered surface 26 Pin 3 Mask holder 36 Tapered surface 37 Pin hole

Claims (6)

A substrate holder for holding the substrate and an opening facing the substrate, and a mask holder having a mask mounted on the opening, are fitted into the substrate holder and the mask holder, and are connected to the substrate through the mask. In a substrate holder capable of forming a film in a pattern, one of the substrate holder and the mask holder is provided with one pin protruding toward the other and a pin hole into which the pin is inserted is located on the other side. A substrate holder, wherein a part of the peripheral wall surface of the substrate holder and the mask holder that are formed and the substrate holder and the mask holder are fitted to each other is a tapered surface corresponding to each other. Each peripheral wall surface of the substrate holder and the mask holder excluding the taper surface is formed into a cylindrical shape, and the circumferential length of the taper surface is set at a predetermined angle with respect to a center line passing through the center of the pin and the substrate holder or the mask holder. 2. The substrate holder according to claim 1, wherein the substrate holder is set so as to be symmetrical in the range. Each peripheral wall surface of the substrate holder and the mask holder is a polyhedron, one of the vertices is positioned on a center line passing through the center of the pin and the substrate holder or the mask holder, and the two sides forming the vertex are the tapered surfaces. The substrate holder according to claim 1. 4. The substrate holder according to claim 1, wherein the substrate holder is formed with a substrate storage portion substantially matching the shape of the substrate, and the substrate holder is positioned when the substrate is dropped into the substrate storage portion. Board holder. The mask holder is formed in the mask holder so as to substantially match the shape of the mask, and is positioned when the mask is dropped into the mask holder. Board holder. 6. The substrate holder according to claim 1, wherein flange portions are provided on the upper surfaces of the substrate holder and the mask holder so as to extend outward.

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