JP4556049B2 - Ion generator - Google Patents

Description

  The present invention relates to an ion generating apparatus that includes a discharge electrode plate for generating ions on an outer surface of a casing, and a circuit board that supplies power to the discharge electrode plate inside the casing.

  A conventional ion generator of this type is configured so that a circuit board is accommodated in a housing and electric power from the outside is supplied to the circuit board. The supplied energization member is boosted to a high frequency high voltage power by a boost circuit on the circuit board. The boosted high-voltage power is supplied to a discharge electrode plate for discharge. Therefore, it is necessary to electrically connect the circuit board and the discharge electrode plate.

Conventionally, the lead wire soldered first to the circuit board is soldered to the back surface of the discharge electrode plate before attaching the discharge electrode plate to the housing, and then the lead wire is sandwiched between the circuit board and the discharge electrode plate. Store in the body, and then attach the discharge electrode plate to the housing. Further, after the discharge electrode plate is attached, urethane resin is poured into the housing to seal the circuit board and lead wires with resin.
JP 2003-45611 A (FIGS. 1 and 8)

  The conventional ion generator has a problem that the housing cannot be miniaturized because a space for storing the lead wires is required between the circuit board and the discharge electrode plate. If the lead wire is shortened, the soldering operation becomes difficult, and therefore a lead wire having a certain length must be used. In addition, since urethane resin is poured while the lead wire is sandwiched between the circuit board and the discharge electrode plate, it is necessary to secure a space for the urethane resin to flow around the lead wire. There is.

  Then, this invention makes it a subject to provide the ion generator which can reduce the magnitude | size of a housing | casing in view of said problem.

In order to solve the above problems, an ion generator according to the present invention has a circuit board provided with a booster circuit inside a casing, and is a plate-like discharge electrode that boosts electric power supplied from the outside and emits ions. an ion generator provided with a plate on the outer surface, a conductive member for supplying power to the circuit board from outside, and a conductive member for connecting from the circuit board to the discharge electrode plate, the walls of the resin casing In the case of molding inside, the current-carrying member is molded into the wall of the housing in a state where a plurality of current-carrying members are integrally molded, and is formed after molding, and is divided into each current-carrying member by a through-hole penetrating the wall surface. The through hole is formed at a position covered by the discharge electrode plate .

  In the above configuration, since the current-carrying member is molded in the wall of the casing, there is no need to use a lead wire to connect the circuit board and the discharge electrode plate. It does not have to be provided.

In addition, since the energization member to be molded is a single member, positioning of the energization member in the mold during molding is facilitated. In addition, although a through-hole is provided after molding and the energizing member is divided into a plurality of energizing members, by covering the through-hole with the discharge electrode plate, the appearance is not impaired and the sealing performance of the housing is not impaired.

  By the way, the terminal part connected to the discharge electrode plate, which is a part of the energizing member, and the discharge electrode plate are connected by a conductive adhesive, and a resin pool into which excess conductive adhesive flows around the terminal part is formed. May be. When the conductive adhesive is used as described above, there is a risk that the conductive adhesive spreads widely along the back surface of the discharge electrode plate. When the conductive adhesive spreads as described above, adjacent conductive adhesives may be short-circuited, but by providing the resin reservoir, it is possible to prevent the conductive adhesive from spreading.

  As is clear from the above description, the present invention does not use a lead wire, so there is no need to provide a space for housing the lead wire in the housing, and therefore the housing can be made smaller than the conventional one. .

  Referring to FIG. 1, reference numeral 1 denotes an ion generator according to the present invention. A rectangular discharge electrode plate mounting portion 10 is formed on the upper surface of the ion generator 1. Four terminal portions 21a and 21b are exposed in the discharge electrode plate mounting portion 10, and the discharge electrode plate 3 is connected to the discharge electrode in a state where the conductive adhesive 4 is placed on the upper surfaces of the terminal portions 21a and 21b. Set in the plate mounting portion 10. Then, the terminal part (not shown) formed in the back surface of the discharge electrode plate 3 and each terminal part 21a, 21b are electrically connected through the conductive adhesive 4.

  Reference numeral 31 denotes a resistor. The resistor 31 is also connected to the back surface of the discharge electrode plate 3 via the conductive adhesive 4, generates heat when energized from the terminal portion 21 b, and heats the discharge electrode plate 3 to discharge the discharge electrode plate 3. The surface of the is always configured to dry.

  A resin reservoir 12 was formed around each terminal portion 21a, 21b. As described above, the conductive adhesive 4 is placed on the terminal portions 21a and 21b. However, a sufficient amount of conductive material is necessary to securely connect the terminal portions 21a and 21b and the terminal portions of the discharge electrode plate 3. It is necessary to place the adhesive 4 on the terminal portions 21a and 21b. However, if the amount of the conductive adhesive 4 is as large as possible, the conductive adhesive 4 may spread along the back surface of the discharge electrode plate 3 when the discharge electrode plate 3 is set. However, since the resin reservoir 12 is formed, the surplus conductive adhesive 4 does not expand and does not enter the resin reservoir 12 and expand.

  Moreover, in order to adhere | attach the discharge electrode plate 3 in the discharge electrode plate mounting part 10 reliably, the epoxy-type adhesive agent 13 is apply | coated, but as shown in FIG. 2, the epoxy-type adhesive agent 13 is each terminal part 21a, 21b. Even if the conductive adhesive 4 spreads, the spread of the conductive adhesive 4 is blocked by the epoxy adhesive 13 so that the conductive adhesive 4 is not short-circuited. . In addition, 11 is a through-hole mentioned later.

  Referring to FIGS. 3 and 4, current-carrying member 2 in which terminal portions 21 a and 21 b are formed is molded in the wall of a resin casing of ion generator 1. Two pairs of terminal portions 22 and 24 connected to the outside are exposed, and the terminal portions 24 located on the left and right outer sides are connected to the terminal portion 21b, and power is supplied from the terminal portion 24 to the resistor 31. . On the other hand, the inner terminal portion 22 is connected to the terminal portion 23. The terminal portion 23 is connected to the circuit board 5, so that power is supplied from the terminal portion 22 to the circuit board 5.

  The booster circuit on the circuit board 5 converts the supplied power into high-frequency high-voltage power and outputs the high-voltage power via the terminal unit 25. The terminal portion 25 is connected to the terminal portion 21a. Therefore, high-frequency high-voltage power output from the circuit board 5 is supplied from the terminal portion 25 to the discharge electrode plate 3 via the terminal portion 21a. From which ions are generated. Reference numeral 51 denotes a transformer, which is housed side by side on the circuit board 5 instead of on the circuit board 5. Thereby, the height of the ion generator 1 can be made lower than the case where a transformer is provided on the circuit board.

  Referring to FIG. 5, when the casing is injection-molded, the energizing member 2 is set in advance in the mold, and the energizing member 2 is molded in the wall of the casing. However, in this embodiment, as shown in FIG. 5 (a), one energizing member formed integrally is molded and the casing is injection-molded. By forming three through holes 11 penetrating through the wall portions, the energizing members were individually divided. The form after the division is as shown in FIG. The left and right holding pieces 26 are for positioning and holding the current-carrying member 2 in the mold, and do not play an electrical role after being divided by the through holes 11. The connecting piece 27 is also formed to integrate the current-carrying member 2 and does not function electrically after the division.

  Since the through holes 11 are all located in the discharge electrode plate mounting portion 10 as described above, the through holes 11 are covered with the discharge electrode plate 3. Thus, after forming the through-hole 11, the discharge electrode plate 3 is adhere | attached, and also the urethane resin 13 is poured into a housing | casing after that and the inside of a housing | casing is potted. The urethane resin that has flowed into the housing also flows into the through-hole 11 and fills the through-hole 11 with the urethane resin. Therefore, even if the through-hole 11 is formed, the sealing is not impaired.

  In addition, this invention is not limited to an above-described form, You may add a various change in the range which does not deviate from the summary of this invention.

The figure which shows the structure of one embodiment of this invention The figure which shows the detail of a discharge electrode plate mounting part Sectional view showing the inside of the ion generator The perspective view which shows the mold state of an electricity supply member The figure which shows before and after the division | segmentation of an electricity supply member

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ion generator 2 Current supply member 3 Discharge electrode plate 4 Conductive adhesive 5 Circuit board 11 Through-hole 51 Transformer

Claims (2)

Includes a circuit board having a booster circuit inside the housing, an ion generating device having a plate-like discharge electrode plate boosts the power supplied from the outside to release the ions on the outer surface, an external energizing member for supplying power to the circuit board, and a conductive member for connecting from the circuit board to the discharge electrode plate, in which is molded into the wall of the resin housing, the conductive member is a plurality of conducting members Is molded into the wall of the housing in a state of being integrally molded, formed after molding, and divided into each energizing member by a through-hole penetrating the wall surface, and the through-hole is formed by the discharge electrode plate. An ion generator characterized by being formed at a position to be covered . The terminal part connected to the discharge electrode plate, which is a part of the current-carrying member, and the discharge electrode plate are connected by a conductive adhesive, and a resin reservoir in which excess conductive adhesive flows around the terminal part is formed. The ion generator according to claim 1 .

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