JP2004247562A - Circuit structure and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily manage the amount of solder and to improve connection reliability by constructing a circuit structure containing a power circuit and its control circuit by simple and thin structure and stabilizing the shape of a solder fillet for the circuit construction in the circuit structure. <P>SOLUTION: The circuit structure is obtained by sticking a plurality of bus bars constituting a power circuit to the surface of a control circuit board 20 via a sticking layer 80. As for a proper soldering place such as the connecting place of a control circuit board 20 and a specific bus bar 14, a solder fillet regulator 82 in the shape of surrounding the connecting place is formed at the sticking layer 80 in advance so as to stick the bus bar 14 to the control circuit board 20 by the sticking layer 80 and so as to regulate the shape of the solder fillet 26 by the solder fillet regulation part 82. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a circuit structure having both a bus bar constituting a power circuit and a control circuit board for controlling the driving of a semiconductor element provided in the power circuit, and a method of manufacturing the same.
[0002]
[Prior art]
Conventionally, as a means for distributing power from a common vehicle-mounted power supply to each electronic unit, a power distribution circuit is configured by laminating a plurality of busbar boards, and an electric connection box incorporating a fuse or a relay switch is generally known. Have been.
[0003]
Furthermore, in recent years, in order to realize miniaturization and high-speed switching control of such an electric junction box, a type in which a semiconductor switching element such as an FET is interposed between an input terminal and an output terminal instead of the relay has been developed. Has reached.
[0004]
For example, Patent Literature 1 includes a bus bar substrate that forms a current circuit, an FET as a semiconductor switching element incorporated in the current circuit, and a control circuit substrate that controls the operation of the FET. The control circuit board is spaced apart from the control circuit board and arranged in two upper and lower stages, and an FET is provided therebetween. The drain terminal and the source terminal of the FET are connected to the bus bar board, and the gate terminal of the FET is connected to the control circuit board. An electrical junction box adapted for connection is disclosed.
[0005]
[Patent Document 1]
JP-A-10-35375
[0006]
[Problems to be solved by the invention]
The electrical connection box disclosed in the above publication requires at least two boards, a bus bar board and a control circuit board, and furthermore, these boards are spaced apart from each other and are three-dimensionally arranged. Space must be secured for the electronic components. Therefore, the overall configuration is complicated and the size cannot be sufficiently reduced, and it is particularly difficult to reduce the height dimension.
[0007]
As a means for overcoming such inconveniences, a circuit is constructed by superimposing a bus bar and a control circuit board constituting a power circuit and bonding them together, and applying appropriate soldering to the bus bar and the control circuit board. Can be considered. Specifically, electronic components are mounted on the bus bar by soldering, or solder is supplied into through holes provided in the control circuit board to electrically connect the control circuit board and the bus bar. Can be considered.
[0008]
However, in the soldering on the bus bar or in the through hole, there is a problem that the solder fillet easily spreads, so that it is difficult to control the amount of solder and that soldering defects and the like are relatively easy to occur.
[0009]
An object of the present invention is to solve the above problems.
[0010]
[Means for Solving the Problems]
As a means for solving the above problems, the present invention includes a plurality of bus bars constituting a power circuit, and a control circuit board for controlling the operation of the power circuit, and the bus bars are arranged on substantially the same plane. In this state, the control circuit board is bonded to the surface of the control circuit board via an adhesive layer, and the control circuit board and a solder fillet regulating portion having a shape surrounding at least one of the soldering portions of the bus bar are formed on the adhesive layer. Circuit configuration.
[0011]
In this configuration, since the plurality of bus bars constituting the power circuit are adhered to the surface of the control circuit board in a state where they are arranged substantially on the same plane, the overall height (thickness) of the circuit structure is very small. It is small, and basically eliminates the need for a bus bar substrate (a bus bar held by an insulating substrate) or a wiring material for connecting a semiconductor switching element to each substrate, which is required in a conventional electrical junction box (however, The present invention does not prevent such a wiring member from being partially used.) Therefore, the overall configuration is significantly thinner and simpler than an electric junction box in which the bus bar board and the control circuit board are spaced apart from each other and a semiconductor switching element is connected to both boards. You.
[0012]
Further, the control layer and the control circuit board are formed on the adhesive layer for bonding the bus bar and the control circuit board with a solder fillet restricting portion having a shape surrounding at least one of the soldering portions of the bus bar. By supplying the solder to the inside to form the fillet, the solder fillet can be prevented from spreading more than necessary by the solder fillet restricting portion, so that the amount of the solder can be properly controlled or soldered. The connection reliability of the attachment point can be improved.
[0013]
As a specific mode of the soldering portion, for example, a notch having a shape opened to the side is formed at an edge of the control circuit board, and a conductor layer covering an inner surface of the notch is provided on the control circuit board. The conductor layer is adhered and connected to a circuit incorporated in the control circuit board, and a solder fillet regulating portion is formed in the adhesive layer so as to surround the attachment location from outside the control circuit board, A circuit incorporated in the specific bus bar and the control circuit board by forming a solder fillet so as to extend over the inner peripheral surface of the conductor layer and the surface of the specific bus bar inside the solder fillet regulating portion. Are electrically connected to each other.
[0014]
According to this configuration, since the soldering point is open to the side, the soldering at the connection point is smaller than, for example, a structure in which a through hole is provided in the control circuit board and the solder is supplied therein. Is easily visually checked from the outside, so that higher connection reliability can be ensured.
[0015]
In another aspect of the soldering portion, a through hole having a shape through which an electronic component can enter is formed in the control circuit board, and a solder fillet regulating portion having a shape surrounding the through hole is formed in the adhesive layer. It is preferable that a terminal of the electronic component and a specific bus bar are electrically connected by a solder fillet formed inside the solder fillet regulating portion.
[0016]
According to this configuration, the electronic component is mounted on the specific bus bar by a simple operation of supplying the solder inside the solder fillet regulating portion and then mounting the electronic component thereon through the through hole of the control circuit board. Can be implemented on top of
[0017]
Further, the present invention is a method for manufacturing a circuit structure including a plurality of bus bars constituting a power circuit, and a control circuit board for controlling the operation of the power circuit, wherein the bus bar, the control circuit board, And a soldering step of soldering at least one of the control circuit board and the bus bar, wherein the bonding step surrounds a soldering location between the bus bar and the control circuit board. An adhesive layer having a solder fillet regulating portion having a shape is formed, and in the soldering step, a solder fillet that contacts at least one of the control circuit board and the bus bar is formed inside the fillet regulating portion. .
[0018]
As a specific mode, for example, a notch having a shape opened to the side is formed in advance on an edge of the control circuit board before the bonding step, and a conductor layer covering an inner surface of the notch is formed on the control circuit board. Performing a conductor layer attaching step of attaching the conductor layer to a substrate and keeping the conductor layer connected to a circuit incorporated in the control circuit board; Forming an adhesive layer having a solder fillet regulating portion having a shape surrounding the outside of the solder layer, and in the soldering step, a solder covering the inner peripheral surface of the conductor layer and the surface of the specific bus bar inside the solder fillet regulating portion. It is preferable that the conductor layer and the specific bus bar are electrically connected by forming a fillet portion.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
A preferred embodiment of the present invention will be described with reference to the drawings. Here, a method of manufacturing a circuit component constituting a power distribution circuit for distributing electric power supplied from a common power source mounted on a vehicle or the like to a plurality of electric loads will be described. However, the present invention is not limited to this, and can be widely applied to a case where an operation such as turning on / off of energization in a power circuit is performed by a control circuit incorporated in a control circuit board.
[0020]
1) Busbar formation process
First, in manufacturing the circuit component, a bus bar component plate 10 as shown in FIG. 1 is formed.
[0021]
The illustrated busbar configuration plate 10 has a rectangular outer frame 16, and a plurality of input terminal busbars 11 forming input terminals and a plurality of output terminal busbars forming output terminals in an inner region thereof. A large number of busbars including a plurality of busbars 12 and a plurality of signal input terminal busbars 14 are arranged in a predetermined pattern, and a suitable busbar is connected to the outer frame 16 by a narrow connecting portion 18. Are interconnected by the narrow connecting portion 18.
[0022]
In the illustrated example, the end portions 11a of the input terminal bus bars 11 and the outer end portions 14a of the signal input terminal bus bars 14 are all arranged on the left side of the bus bar configuration plate 10, and the end portions 12a of the output terminal bus bars 12 are all formed on the bus bar configuration plate. The busbar ends 11a, 12a, and 14a are free ends that are not connected to the outer frame 16, although they are arranged so as to be arranged on the right side of 10.
[0023]
The bus bar component plate 10 can be easily formed by, for example, punching a single metal plate by press working.
[0024]
2) Bonding process
A control circuit board 20 is adhered to one surface (the upper surface in FIG. 1) of the bus bar constituting plate 10 to obtain the state shown in FIG.
[0025]
The control circuit board 20 includes a control circuit for controlling the switching operation of the FET 30 provided in the power circuit constituted by the bus bar as described later. (The conductor to be formed is printed wiring). In the illustrated example, a sheet-like control circuit board 20 having a very small thickness (for example, 0.3 mm) is used in order to further promote the reduction in the overall thickness and the improvement in waterproofness. Has a plurality of through holes 22. The through holes 22 are for mounting the FET 30 on a bus bar, and will be described later in detail.
[0026]
The outer shape of the control circuit board 20 is made smaller than the outer shape of the bus bar component plate 10, and in particular, the left-right width of the board is made sufficiently smaller than the bus bar component plate 10. Specifically, the control circuit board 20 is adhered to the central portion of the bus bar component plate 10 as shown in the figure, so that the end portion 11a of the input terminal bus bar 11 and the signal input terminal The end 14a of the output bus bar 14 protrudes, the end 12a of the output terminal bus bar 12 protrudes to the right outside, and all the connecting portions 18 are exposed outside the control circuit board 20 (FIG. 2).
[0027]
In order to bond the control circuit board 20 to the bus bar component plate 10, for example, an insulating adhesive is applied to the back surface of the control circuit board 20 or the upper surface of the bus bar component plate, and the control circuit board 20 An insulating layer is formed between the bus bar. Here, when the control circuit board 20 includes a through-hole and a “notch” described later, the insulating adhesive is prevented from adhering to these portions.
[0028]
Here, the adhesive can be applied by printing, whereby the efficiency and automation of the manufacturing process can be promoted, and the “solder fillet regulating portion” according to the present invention can be easily formed on the adhesive layer. can do.
[0029]
3) Mounting process
Utilizing the through-holes 22 provided in the control circuit board 20, FETs 30 are mounted as semiconductor switching elements on both the control circuit board 20 and the bus bar configuration plate 10.
[0030]
As shown in FIG. 4, the FET 30 used here includes a substantially rectangular parallelepiped main body 32 and at least three terminals (a drain terminal, a source terminal 34, and a gate terminal 36, not shown). Among the terminals, the drain terminal is provided on the back surface of the main body 32, and the source terminal 34 and the gate terminal 36 protrude from the side surface of the main body 32 and extend downward.
[0031]
Corresponding to the FET 30, each of the through holes 22 of the control circuit board 20 has a rectangular portion 22a through which the main body 32 of the FET 30 can be inserted, and a source terminal of the FET 30 extending from the rectangular portion 22a in a predetermined direction. 34 includes an extended portion 22b having a shape that can be inserted. Then, the FET body 32 is mounted on the bus bar 11 by bringing the drain terminal on the back surface of the FET body 32 into direct contact with the upper surface of the input terminal bus bar 11 on the bus bar constituting plate 10 through the rectangular portion 22a. The source terminal 34 of the FET 30 is connected to the output terminal bus bar 12 through the 22b, and the gate terminal 36 of the FET 30 is connected to an appropriate conductor pattern on the control circuit board 20.
[0032]
This mounting step can be easily performed by, for example, applying a molten solder to each through hole 22 by printing or the like, and placing the FET 30 thereon.
[0033]
In performing this mounting process, it is more preferable to previously provide a step t substantially equal to the thickness of the control circuit board 20 between the source terminal 34 and the gate terminal 36 as shown in FIG. . In this case, regardless of the thickness of the control circuit board 20, the terminals 34, 36 are not deformed unreasonably and the terminals 34, 36 are connected to the output terminal bus bar 12 and the control circuit board 20 without any change. And the stress of each terminal after the mounting is greatly reduced.
[0034]
3 ') Soldering process
Among the bus bars included in the bus bar configuration plate 10, there are bus bars to be directly connected to the control circuit of the control circuit board 20 (that is, to be connected without passing through the FET 30). Soldering is performed over the bus bar and the control circuit board 20 for the electrical connection. The soldering step will be described later in detail.
[0035]
4) Bending process
The busbar ends (including at least the ends 11a, 12a, 14a of the busbars 11, 12, 14 in the figure) protruding from the control circuit board 20 to the left and right outer sides are bent upward as shown in FIG. A terminal to be connected to is formed. By performing such a bending step, an external wiring member can be connected to each terminal from one direction, and the connection work can be simplified.
[0036]
5) Housing mounting process
As shown in FIG. 7, a housing 40 made of an insulating material such as a synthetic resin is provided around a plurality of signal input terminals (the end portions 14a of the signal input terminal bus bars 14 in the figure are arranged in a horizontal line). Secure to form a connector. On the side surface of the housing 40, a projection 42 for engaging with a case 50 described later is formed.
[0037]
6) Separation process
The bus bars in the bus bar constituting plate 10 are separated from each other by a press or the like to complete a power circuit. Specifically, the connecting portion 18 exposed outside the control circuit board 20 may be cut and removed. The removal of the connecting portion 18 inevitably removes the outer frame 16 from the circuit structure. In the state after the separation step, the overall height dimension (thickness dimension) is very small, and the occupied area is suppressed to be substantially equal to the area of the control circuit board 20. Although this circuit structure can be used alone, it is possible to further enhance the waterproofness and heat dissipation by further adding a case 50 and a heat dissipation member 60 described later. A suitable circuit body can be obtained.
[0038]
This separation step may be performed before the above steps 3) to 5). However, when the bus bar ends 11a, 12a, and 14a constituting the terminals are connected to the outer frame 16 or another bus bar, it is necessary to perform a disconnecting step first.
[0039]
7) Case mounting process
A case 50 (FIG. 9) made of an insulating material such as a synthetic resin is further placed on the circuit structure obtained in the separation step 6) from above. The case 50 has a shape that opens downward and covers the entire control circuit board 20 from above, and an opening that opens the FET 30 upward is provided in the center of the case 50. The opening faces upward from the periphery of the opening. A waterproof wall 52 is provided upright. That is, the waterproof wall 52 surrounds a region including the FET 30.
[0040]
A cylindrical housing 54 and a housing mounting portion 56 that open vertically are formed integrally with the case 50 at both left and right edges (the left and right outer portions of the waterproof wall 52) of the case 50. The housing 54 is formed at a plurality of places, individually surrounds the end portion 11a (input terminal) of the input terminal bus bar 11 and the end portion 12a (output terminal) of the output terminal bus bar 12, and forms a connector together with these terminals. Constitute. The housing mounting portion 56 is formed at a position corresponding to the housing 40 (housing surrounding the signal input terminal). The housing 40 is inserted into the housing mounting portion 56 from below, and the protrusion 42 on the side wall of the housing 40 is formed. The bus bar and the control circuit board 20 are locked to the case 50 by engaging with the upper end of the housing mounting portion 56.
[0041]
In addition, a plurality of fin covers 58 arranged side by side protrude downward from both front and rear ends of the case 50.
[0042]
8) Heat dissipation member connection process
The upper surface 64 of the heat radiating member 60 as shown in FIG. 10 is adhered to the lower surface of each bus bar to unite them.
[0043]
The heat dissipating member 60 is entirely formed of a material having excellent thermal conductivity such as an aluminum-based metal, has a flat upper surface 64, and has a plurality of fins 62 arranged on the left and right protruding downward from the lower surface. The position of each fin 62 corresponds to the position of the fin cover 58 in the case 50, and both ends of each fin 62 in the longitudinal direction are covered by the fin cover 58 by mounting the heat radiating member 60.
[0044]
The bonding between the heat radiating member 60 and the bus bar is preferably performed, for example, in the following procedure.
[0045]
{Circle around (1)} An insulating adhesive made of an epoxy resin is applied to the upper surface 64 of the heat radiating member 60 and dried to form a thin insulating layer.
[0046]
{Circle over (2)} The same material as the material constituting the insulating layer, or an adhesive softer and higher in thermal conductivity than the material (for example, a grease-like material such as a silicone adhesive) ) Is applied, or the adhesive is applied to the bus bar side, and the bus bar is adhered by the adhesive.
[0047]
9) Potting process
A potting agent for promoting heat dissipation is injected into the inside of the waterproof wall 52. Thereafter, a cover 70 as shown in FIG. 11 is placed on the upper end of the waterproof wall 52 and the two are joined (for example, by vibration welding) to seal and waterproof the inside of the waterproof wall 52.
[0048]
In the circuit structure manufactured as described above, a power supply is connected to the input terminal (end 11a of the bus bar 11 for input terminal) and an electric load is connected to the output terminal (end 12a of the bus bar 12 for output terminal). By doing so, a power distribution circuit for distributing power from the power source to an appropriate electric load is constructed, and the operation of the FET 30 provided in the middle of the power distribution circuit is controlled by a control circuit incorporated in the control circuit board 20. Thus, the on / off control of energization of the power distribution circuit is executed.
[0049]
Next, a structure and a method for directly connecting the bus bar and the control circuit board 20 (electrically connecting without the FET 30) will be described with reference to FIGS. explain.
[0050]
In the figure, a semicircular cutout 20a is formed at the edge of the control circuit board 20, and a substantially semicylindrical land (conductor layer) 24 is attached so as to cover the surface of the cutout 20a. The lands 24 are electrically connected to conductor patterns (patterns constituting a control circuit) printed on the control circuit board 20. Then, an adhesive layer 80 is formed on the signal input terminal bus bar 14 in a shape surrounding the land 24, and the edge of the control circuit board 20 and the signal input terminal bus bar 14 are bonded by the adhesive layer 80. At the same time, soldering is performed so as to straddle the semi-cylindrical inner peripheral surface of the land 24 and the surface of the input terminal bus bar 14, that is, by forming the solder fillet 26, the land 24 and the input terminal The electrical connection with the bus bar 14 is made.
[0051]
Further, as a feature of this structure, the adhesive layer 80 protrudes from the edge of the control circuit board 20, and the protruding portion connects the notch 20a from the outside of the control circuit board 20 (FIG. 14A). The solder fillet portion 82 has a shape (from the right side) to surround (in the illustrated example, a U-shape in plan view). The solder fillet 26 can be formed in a region inside the solder fillet 82.
[0052]
This connection can be performed, for example, in the following procedure.
[0053]
{Circle around (1)} Before the bonding step, a notch 20a having a shape opened to the side is formed in advance on the edge of the control circuit board 20, and a land 24 covering the inner surface of the notch 20a is attached to the control circuit board 20. Keep it. The lands 24 are connected to conductor patterns printed on the control circuit board 20.
[0054]
{Circle around (2)} An adhesive layer 80 surrounding the land 24 and having the solder fillet restricting portion 82 is formed on the signal input terminal bus bar 14, and the adhesive layer 80 is used to form the bus bar 14 and the control circuit board. 20 (adhesion step). By this bonding, the state where the signal input terminal bus bar 14 and the rear end surface of the land 24 are close to each other is fixed.
[0055]
(3) In the state of (2), the solder is supplied to the inside of the solder fillet portion 82 to form the solder fillet 26 extending over the inner peripheral surface of the land 24 and the surface of the input signal terminal bus bar 14. Since the shape of the solder fillet 26 is regulated by the solder fillet regulating portion 82 surrounding the land 24 (the cutout portion 20a), the solder fillet 26 spreads more than necessary by using the adhesive layer 80 in a simple configuration. As a result, it is possible to appropriately control the amount of the solder or to improve the connection reliability of the soldered portion.
[0056]
Further, in the structure shown in the figure, since the finally formed solder fillet 26 is in a state of being opened to the side, the soldering state in the soldering state is smaller than when solder is supplied into a through hole provided in a substrate, for example. It is easier to check the quality from the outside, and more stable quality and high connection reliability can be secured.
[0057]
However, the present invention is not necessarily intended to exclude a circuit component including a soldered portion using a through hole. For example, a cylindrical land (conductor layer) 24 as shown in FIG. 13 is made to penetrate through the substrate body of the control circuit board 20, and an adhesive 80 is applied so as to surround the land. After bonding to the surface of a specific bus bar (in the figure, the signal input terminal bus bar 14 constituting the signal input terminal), solder is supplied into the through-hole 24a inside the land 24 to supply the solder to the inside of the land 24. It may include one that straddles the peripheral surface and the surface of the signal input terminal bus bar 14.
[0058]
Alternatively, as shown in the part A of FIG. 5, a structure in which an appropriate protrusion is projected from the bus bar and the protrusion is soldered to the control circuit board 20 side is used together with the structure shown in FIG. 14 and the like. Is also good.
[0059]
The soldering location to which the present invention is applied is not limited to the connection location between the control circuit board and the bus bar as shown in the figure. For example, a location where the electronic component is mounted on the bus bar through a through hole provided in the control circuit board 20. Can be applied in the same way. One example is shown in FIGS.
[0060]
In the figure, a through-hole 22 is formed in the control circuit board 20 so that a diode 90 as an electronic component can enter. The diode 90 is mounted over two bus bars 19A and 19B of the bus bars adhered to the control circuit board 20 via the adhesive layer 80. Is formed so as to straddle both bus bars 19A and 19B.
[0061]
The diode 90 has terminals 91 and 92 to be connected to the bus bar 19A side and a terminal 94 to be connected to the bus bar 19B side. On the other hand, the adhesive layer 80 is formed with a solder fillet regulating portion 82 having a shape surrounding the through hole 22 from the outside.
[0062]
According to this structure, the supply of the molten solder to the inside of the solder fillet regulating portion 82 and then setting the diode 90 on both bus bars 19A and 19B through the through-hole 22 can be performed by a simple operation. Solder fillets 26 having good shapes can be formed between the terminals 91 and 92 and the bus bar 19A, and between the terminal 94 and the bus bar 19B.
[0063]
【The invention's effect】
As described above, the present invention includes a plurality of busbars constituting a power circuit, and a control circuit board for controlling the operation of the power circuit, wherein the control circuit is arranged in a state where the busbars are arranged on substantially the same plane. It is bonded to the surface of the substrate via an adhesive layer, and the control layer and the solder fillet regulating portion surrounding at least one of the bus bars are formed on the adhesive layer. Therefore, it is possible to construct a circuit structure including a power circuit and its control circuit with a simple and thin structure, and to stabilize the shape of a solder fillet for constructing the circuit, thereby facilitating the management of the amount of solder. This has the effect of improving the connection reliability and connection reliability.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a bus bar component plate and a control circuit board used in a method of manufacturing a circuit component according to an embodiment of the present invention.
FIG. 2 is a perspective view showing a state in which the bus bar constituent plate and a control circuit board are bonded to each other.
FIG. 3 is a perspective view showing a state in which an FET is mounted on the bus bar constituent plate and the control circuit board.
FIG. 4 is an enlarged cross-sectional perspective view showing a mounting state of the FET.
FIG. 5 is a perspective view showing a direct connection portion between the bus bar configuration plate and a control circuit board.
FIG. 6 is a perspective view showing a state where an end of a predetermined bus bar in the bus bar constituting plate is bent upward.
FIG. 7 is a perspective view showing a state where a housing is provided around an end of a bent signal input terminal bus bar to form a connector.
FIG. 8 is a perspective view showing a state in which an outer frame is removed from the bus bar constituting plate and bus bars are separated from each other.
FIG. 9 is a perspective view showing a state where a case is mounted on the control circuit board and the bus bar.
FIG. 10 is a perspective view showing a circuit component on which the case is mounted and a heat dissipating member mounted on the circuit component.
FIG. 11 is a perspective view showing a circuit structure on which the heat radiating member is mounted and a cover mounted on a waterproof wall of a case thereof.
FIG. 12 is a perspective view showing a step of injecting a potting agent from a potting inlet of a mounted cover.
13A is a bottom view of the control circuit board showing an example in which a through-hole structure is applied to electrically connect a signal input terminal bus bar to the control circuit board, and FIG. 13B is a cross-sectional front view thereof. It is.
14A is a plan view showing a soldering structure according to the present invention, and FIG. 14B is a sectional front view thereof.
15 is a top perspective view of the soldering structure of FIG. 14;
FIG. 16 is a sectional front view showing another example of the soldering structure according to the present invention.
[Explanation of symbols]
14 Bus bar for signal input terminal
20 Control circuit board
20a Notch
22 Through hole
24 lands (conductor layer)
26 Solder fillet
80 Adhesive layer
82 Solder fillet control section
90 Diode (electronic component)
91, 92, 94 Diode terminals

Claims (5)

A plurality of busbars constituting a power circuit, and a control circuit board for controlling the operation of the power circuit, and an adhesive layer on the surface of the control circuit board in a state where the busbars are arranged on substantially the same plane. A circuit structure, wherein the adhesive layer is adhered, and a solder fillet restricting portion is formed on the adhesive layer so as to surround at least one of the control circuit board and the bus bar. 2. The circuit structure according to claim 1, wherein a notch having a shape opened to the side is formed at an edge of the control circuit board, and a conductor layer covering an inner surface of the notch is attached to the control circuit board. The conductor layer is connected to a circuit incorporated in the control circuit board, and a solder fillet restricting portion is formed in the adhesive layer so as to surround a position where the conductor layer is attached from outside the control circuit board. The specific bus bar and the circuit incorporated in the control circuit board are formed by forming a solder fillet so as to span the inner peripheral surface of the conductor layer and the surface of the specific bus bar inside the solder fillet regulating portion. Is electrically connected. 2. The circuit structure according to claim 1, wherein a through hole having a shape through which an electronic component can enter is formed in the control circuit board, and a solder fillet regulating portion having a shape surrounding the through hole is formed in the adhesive layer. A circuit structure, wherein a terminal of the electronic component and a specific bus bar are electrically connected by a solder fillet formed inside a fillet regulating portion. A method of manufacturing a circuit structure including a plurality of bus bars constituting a power circuit and a control circuit board for controlling the operation of the power circuit, comprising: a bonding step of bonding the bus bar and the control circuit board And a soldering step of soldering at least one of the control circuit board and the bus bar. A circuit structure, wherein a solder fillet that contacts at least one of the control circuit board and the bus bar is formed inside the fillet regulating portion in the soldering step. Manufacturing method. 5. The method for manufacturing a circuit component according to claim 4, wherein a notch having a shape opened to the side is formed in advance on an edge of the control circuit board before the bonding step, and the inner surface of the notch is covered with a conductor layer. Performing a conductor layer attaching step of attaching the conductor layer to a control circuit board and keeping the conductor layer connected to a circuit incorporated in the control circuit board. Forming an adhesive layer having a solder fillet regulating portion having a shape surrounding the control circuit board, and in the soldering step, an inner peripheral surface of the conductor layer and a surface of the specific bus bar inside the solder fillet regulating portion. Forming a solder fillet portion extending over the conductive layer to electrically connect the conductor layer to the specific bus bar.

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