JP4555191B2 - Heating head - Google Patents

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JP4555191B2
JP4555191B2 JP2005232186A JP2005232186A JP4555191B2 JP 4555191 B2 JP4555191 B2 JP 4555191B2 JP 2005232186 A JP2005232186 A JP 2005232186A JP 2005232186 A JP2005232186 A JP 2005232186A JP 4555191 B2 JP4555191 B2 JP 4555191B2
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heating resistor
resistor layer
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electrode layer
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秀夫 谷口
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本発明は、帯状の発熱層を有する加熱ヘッドに関し、特に、記録済みの可逆性感熱記録材料の記録を加熱消去したり、紙、プラスティック、金属等からなる用紙、カード、シールなどの被印刷物に、熱転写法、インクジェット法などの印刷法で印刷するに先立って、画像を印刷する場合に、画像を印刷する前に、被印刷物の表面にアンダーコートをしたり、画像を印刷した後に、印刷面の全面にあるいは限定部分面にオーバーコートをする際、加熱転写するのに適した加熱ヘッドに関する。   The present invention relates to a heating head having a belt-like heat generating layer, and in particular, to heat-erased recording of a recorded reversible thermosensitive recording material, or to a printed material such as paper, plastic, metal, paper, card, sticker, etc. When printing an image prior to printing by a printing method such as thermal transfer method or ink jet method, before printing the image, undercoat the surface of the substrate or print the image after printing the image. The present invention relates to a heating head suitable for heating and transferring when overcoating the entire surface or a limited partial surface.

近年、例えば紙、不織布、織布、塩化ビニール、ポリエチレンテレフタレート等の合成樹脂、金属、ガラス等からなるフィルム状、シート状、カード状等の支持体上に加熱により発色と消色を可逆的に繰り返し行える可逆性感熱記録層からなる記録部を設けた可逆性感熱記録材料(リライタブルカード)が広く使用されるようになってきている。   In recent years, for example, reversible coloring and decoloring by heating on a film, sheet, card or other support made of synthetic resin such as paper, non-woven fabric, woven fabric, vinyl chloride, polyethylene terephthalate, metal, glass, etc. A reversible thermosensitive recording material (rewritable card) provided with a recording portion composed of a reversible thermosensitive recording layer that can be repeated has been widely used.

前記可逆性感熱記録層は、(a)特定の温度領域である記録(発色)温度領域(例えば170℃前後)への加熱により発色し、(b)前記温度領域より低い温度領域である消去(消色)温度領域(例えば140℃前後)への加熱により消色し、それ以下の温度領域である不変温度領域では発色状態或いは消色状態が維持されるという特性を有するものであり、例えばロイコ化合物及び顕色剤を含有し、比較的高温において両者が融け合い、分子レベルで混じり合って反応し、急冷によって混じり合ったまま固化されて発色状態が保持され記録を行い、一方高温に加熱した後徐々に冷却することによりロイコ化合物と顕色剤とを別々に結晶化させたり、ロイコ化合物及び顕色剤の融点以下の特定温度領域にある一定時間保持することによりロイコ化合物と顕色剤とを徐々に層分離させて結晶化させたりして消色することにより消去するものや、染料前駆体と熱によりこれを発色、消色させる顕減色剤からなるものなど、透明/発色或いは発色/消色の熱的変化を利用したものが用いられている。   The reversible thermosensitive recording layer (a) develops color by heating to a recording (coloring) temperature region (for example, around 170 ° C.) which is a specific temperature region, and (b) erases a temperature region lower than the temperature region ( Decoloring) It has the property that it is decolored by heating to a temperature range (for example, around 140 ° C.), and the color developing state or decoloring state is maintained in an invariable temperature range, which is a temperature range below that. Contains compound and developer, both melt at relatively high temperature, mix and react at the molecular level, solidify by quenching, solidify and retain color, record, while heated to high temperature Thereafter, the leuco compound and the developer are crystallized separately by gradually cooling, or the leuco compound and the developer are kept in a specific temperature range below the melting point of the leuco compound and the developer for a certain period of time. The compound and the developer are gradually separated into layers and crystallized and erased by erasing, the dye precursor and the developer that develops and erases the color by heat, etc. Those using thermal change of transparency / color development or color development / decoloration are used.

他方、熱転写法やインクジェット法などにより被印刷物に画像を印刷する場合、被印刷物の表面状態が平坦面になっていないと、表面の凹凸によりインクが十分に密着できず、印刷画像が鮮明な画像にならない。また、近年デジタルカメラの普及により写真の印刷やコンピュータグラフィックによる繊細な画像を印刷する場合においても、被印刷面を平滑化しておかないと、高画質な印刷を行うことができない。そこで、これら被印刷面の平滑化を図る簡単な方法として、用紙などの印刷面に予め樹脂被膜を印刷するアンダーコートを施してから印刷する方法が考えられる。さらに、写真などでは、長期間に亘って保存する場合が多いが、従来の熱転写法やインクジェット法などによる印刷では、その色素が昇華したり、分解したり、紫外線などの光による変色が生じやすく、印刷画像の変質を来しやすい。そのため、印刷面の表面に保護膜を形成して保護するオーバーコートを形成することが好ましい。   On the other hand, when printing an image on a substrate by a thermal transfer method or an inkjet method, if the surface of the substrate is not a flat surface, the ink cannot be sufficiently adhered due to surface irregularities, and the printed image is clear. do not become. In recent years, even when printing a photograph or a delicate image by computer graphics with the spread of digital cameras, high-quality printing cannot be performed unless the printing surface is smoothed. Therefore, as a simple method for smoothing the printing surface, a method of printing after applying an undercoat for printing a resin film in advance on a printing surface such as paper can be considered. In addition, photographs are often stored for a long period of time, but in conventional printing by thermal transfer method or ink jet method, the dye tends to sublime, decompose, or discolor due to light such as ultraviolet rays. , Easy to change the print image. Therefore, it is preferable to form an overcoat that protects the surface of the printed surface by forming a protective film.

上記可逆性感熱記録材料の記録を消去したり、或いは高画質の印刷を実現するためのアンダーコートを形成したり、印刷面の保護を行うためのオーバーコートを形成するための加熱ヘッドとして、本出願人は、既に特許文献1に記載の消去(加熱)ヘッドを出願している。この消去ヘッドは、アルミナ基板上の両端部に一対の矩形状の電極層を形成し、当該一対の矩形状の電極層に亘って帯状の発熱抵抗体層を設けたものであって、電極層と発熱抵抗体層の端部とは、重なるように接続されており、この一対の電極を用いて通電することにより帯状の発熱抵抗体層の全体を発熱し、この発熱した帯状の発熱抵抗体層上を、可逆性感熱記録材料等の記録シート等を通過させることによりその全面を加熱できるものである。   As a heating head for erasing the recording of the reversible thermosensitive recording material, forming an undercoat for realizing high-quality printing, or forming an overcoat for protecting the printing surface, The applicant has already filed an erasing (heating) head described in Patent Document 1. This erasing head is formed by forming a pair of rectangular electrode layers at both ends on an alumina substrate, and providing a belt-like heating resistor layer across the pair of rectangular electrode layers. And the end of the heating resistor layer are connected so as to overlap each other, and by energizing using this pair of electrodes, the entire belt-like heating resistor layer generates heat, and the heated belt-like heating resistor By passing a recording sheet such as a reversible thermosensitive recording material over the layer, the entire surface can be heated.

特開2003−320696号公報JP 2003-320696 A

しかしながら、この種の帯状の発熱体を用いた加熱ヘッドでは、帯状の発熱抵抗体層の両端部の一対の電極層が熱伝導率の高い金属からなるために、帯状の発熱抵抗体層で発熱した熱がその両端部の電極層から放熱しやすく、中央部では温度が高く、両端部では温度が低くなり、帯状の発熱体の全体に亘って均一温度に発熱しない。つまり、発熱抵抗体層の電極層に近い部分の熱が、低温の電極層へ熱伝導するために、当該発熱抵抗体層の端部において電極層に近づくにつれ温度が下がっていき、電極層と重なった部分で実質的に発熱しなくなる。その結果、発熱温度が低くなる両端部において、可逆性感熱記録材料の記録の消去に残像が生じて消去にムラが生じたり、良質のアンダーコートやオーバーコートを形成できなかったりするため、帯状の発熱抵抗体層の両端部は加熱領域として使用できず、帯状の発熱抵抗体層の長さを被加熱体の幅よりも長く形成しなければならない。   However, in this type of heating head using a belt-shaped heating element, the pair of electrode layers at both ends of the belt-shaped heating resistor layer is made of a metal having a high thermal conductivity. Therefore, the heat is easily radiated from the electrode layers at both ends, the temperature is high at the central portion, the temperature is low at both ends, and heat is not generated at a uniform temperature throughout the belt-like heating element. That is, since the heat of the portion near the electrode layer of the heating resistor layer is thermally conducted to the low-temperature electrode layer, the temperature decreases as it approaches the electrode layer at the end of the heating resistor layer. Substantially no heat is generated at the overlapped portion. As a result, at both ends where the heat generation temperature becomes low, an afterimage is generated in erasing the recording of the reversible thermosensitive recording material, resulting in unevenness in erasing, or a good quality undercoat or overcoat cannot be formed. Both ends of the heating resistor layer cannot be used as a heating region, and the length of the belt-like heating resistor layer must be longer than the width of the object to be heated.

本発明は、このような状況に鑑みてなされたもので、帯状の発熱抵抗体層における電極層との境界近傍の発熱温度の低下を軽減でき、帯状の発熱抵抗体層の端部までを有効に利用できる加熱ヘッドを提供することを目的とする。   The present invention has been made in view of such a situation, and can reduce a decrease in heat generation temperature in the vicinity of the boundary between the belt-shaped heating resistor layer and the electrode layer, and is effective up to the end of the belt-shaped heating resistor layer. It aims at providing the heating head which can be utilized for.

また、本発明は、帯状の発熱抵抗体層の全体に亘って発熱温度を均一にし得る加熱ヘッドを提供することを目的とする。   Another object of the present invention is to provide a heating head capable of making the heat generation temperature uniform over the entire belt-shaped heat generating resistor layer.

本発明者は、一対の電極層と、当該一対の電極層に跨るように長さ方向の両端部を接続して形成された帯状の発熱抵抗体層とを有する加熱ヘッドにおいて、発熱抵抗体層の電極層との境界近傍が電極層による放熱により中央部よりも発熱温度が下がってしまうことを改善できないものかと鋭意研究を重ねた結果、上記境界近傍の一部分に電流を集中するようにさせたときには、その一部分を高温に発熱させることができて電極層による放熱分を補え、発熱抵抗体層の電極層に近い部分の発熱温度を中央部の発熱温度に近づけることができることを見出した。   The present inventor provides a heating head having a pair of electrode layers and a belt-shaped heating resistor layer formed by connecting both ends in the length direction so as to straddle the pair of electrode layers. As a result of intensive research on whether the heat generation temperature in the vicinity of the boundary with the electrode layer can be improved due to heat dissipation by the electrode layer, the current is concentrated in a part near the boundary. In some cases, it has been found that a part of the heat generating resistor layer can be heated to a high temperature to compensate for the heat radiation by the electrode layer, and the heat generation temperature of the portion of the heating resistor layer close to the electrode layer can be brought close to the heat generation temperature of the central portion.

また、本発明者は、上記加熱ヘッドにおいて、発熱抵抗体層の一部の形状を変えたり、一部異なる材料を用いたりしたときには、発熱抵抗体層の端部における電流密度を中央部の電流密度よりも高くでき、発熱抵抗体層の電極層に近い部分の発熱温度を中央部の発熱温度に近づけることができることをも見出した。すなわち、本発明は、以下の(1)〜(7)の加熱ヘッドに係るものである。   In addition, when the heating head has a partial change in the shape of the heating resistor layer or a different material, the inventor determines the current density at the end of the heating resistor layer as the current at the center. It has also been found that the heating temperature of the portion near the electrode layer of the heating resistor layer can be made higher than the density, and the heating temperature of the central portion can be made closer to the heating temperature. That is, the present invention relates to the following heating heads (1) to (7).

本発明による加熱ヘッドは、絶縁性基板、この絶縁性基板上に形成された一対の電極層及びこの一対の電極層に長さ方向の両端部がそれぞれ電気的に接続されるように形成された帯状の発熱抵抗体層を有する加熱ヘッドにおいて、記帯状の発熱抵抗体層の前記両端部は、前記一対の電極層のそれぞれと重なるように設けられ、かつ、前記発熱抵抗体層の両端部のそれぞれの端縁は、一部が前記一対の電極層のそれぞれと接触し、他の部分は前記一対の電極層のそれぞれと接触しないように前記一対の電極層及び前記帯状の発熱抵抗体層が形成されていることを特徴としている A heating head according to the present invention is formed such that an insulating substrate, a pair of electrode layers formed on the insulating substrate, and both ends in the length direction are electrically connected to the pair of electrode layers , respectively . in the heating head with a strip-like heating resistor layer, said end portions of the front Stories strip of the heating resistor layer is provided so as to overlap with each of the pair of electrode layers, and, both end portions of the heating resistor layer each edge of a part is in contact with each of the pair of electrode layers, so that other portions are not in contact with each of the pair of electrode layers, the pair of electrode layers and the heating resistor of the strip It is characterized in that the layers are formed.

記の加熱ヘッドによれば、発熱抵抗体層の電極層との境界近傍の電流密度に偏りが生じるようにするので、電流密度が高くなる境界近傍部分の発熱温度を他の境界近傍部分よりも高くでき、境界近傍全体としての発熱温度を発熱抵抗体層の中央部の発熱温度に近づけることができる。 According to the above SL heating head, since such deviation occurs in the current density in the vicinity of the boundary between the electrode layer of the heating resistor layer, the heating temperature near the boundary portion where the current density is higher than the other near the boundary portion The heat generation temperature as a whole near the boundary can be made close to the heat generation temperature at the center of the heat generation resistor layer.

前記一対の電極層の前記帯状の発熱抵抗体層側の端縁から、該帯状の発熱抵抗体層と反対側に向けて前記電極層が除去された凹部が形成され、該凹部の底部が前記帯状の発熱抵抗体に被覆されないで露出するように前記帯状の発熱抵抗体層が前記一対の電極層と重ねて設けられてなる構造にすることができる A concave portion is formed by removing the electrode layer from an edge of the pair of electrode layers on the belt-like heating resistor layer side toward the opposite side of the belt-like heating resistor layer, and the bottom of the concave portion is The belt-like heat generating resistor layer can be formed so as to be overlapped with the pair of electrode layers so as to be exposed without being covered with the belt-like heat generating resistor .

前記帯状の発熱抵抗体層の両端部と、前記一対の電極層とのそれぞれにおける接触部における前記一対の電極層の幅が、前記帯状の発熱抵抗体層の端縁の幅より小さくなるように前記帯状の発熱抵抗体層が前記一対の電極層と重ねて設けられる構造にすることもできる The width of the pair of electrode layers at the contact portion between both ends of the belt-shaped heating resistor layer and the pair of electrode layers is smaller than the width of the edge of the belt-shaped heating resistor layer. The belt-shaped heating resistor layer may be provided so as to overlap with the pair of electrode layers .

本発明の加熱ヘッドによれば、帯状の発熱抵抗体層の両端部の電極層と近い部分においても発熱温度を高くできて、帯状の発熱抵抗体層の長さ方向の全体において発熱温度を均一に近づけることができるので、帯状の発熱抵抗体層の使用できる有効加熱領域を広げることができ、その結果として加熱装置の小型化を図ることができる。   According to the heating head of the present invention, the heat generation temperature can be increased even in the portions near the electrode layers at both ends of the belt-shaped heating resistor layer, and the heat generation temperature is made uniform over the entire length of the belt-shaped heating resistor layer. Therefore, the effective heating region in which the belt-like heating resistor layer can be used can be expanded, and as a result, the heating device can be reduced in size.

以下、図面を参照しながら本発明の実施の形態に係る加熱ヘッドについて説明をする。(実施の形態1)
図1に実施の形態1の加熱ヘッド1の(A)表面説明図および(B)裏面説明図を示す。また、図2に図1(A)中の円Aで囲んだ部分の部分拡大概略図を示す。図1(A)に示すように、加熱ヘッド1は、平面形状がほぼ長方形状の絶縁性基板2の表面に、絶縁性基板2の長手方向の両端部に形成された一対の電極層3、3と、この一対の電極層3、3を直線状に跨ぐように形成された帯状の発熱抵抗体層4とを備える。
Hereinafter, a heating head according to an embodiment of the present invention will be described with reference to the drawings. (Embodiment 1)
FIG. 1 shows (A) a front view and (B) a back view of the heating head 1 of the first embodiment. FIG. 2 shows a partially enlarged schematic view of a portion surrounded by a circle A in FIG. As shown in FIG. 1A, the heating head 1 includes a pair of electrode layers 3 formed on both ends of the insulating substrate 2 in the longitudinal direction on the surface of the insulating substrate 2 having a substantially rectangular planar shape. 3 and a belt-like heating resistor layer 4 formed so as to straddle the pair of electrode layers 3 and 3 in a straight line.

絶縁性基板2は、例えば長さ約50mm、幅約7.5mm、厚さ約0.6mmの略矩形状板からなり、その材質としては例えばアルミナ等のセラミックスを用いることができ、この他使用時の発熱温度条件において耐熱性を有し、少なくとも発熱層を設ける面が絶縁性を有するものであればよく、ガラスエポキシ等の樹脂系材料、表面に絶縁膜が設けられたステンレス等からなる金属板、ガラス系材料等を広く使用することができる。なお、本実施の形態では、基板2として、アルミナ基板を用い、その上面には図示しないがガラス層をコートしている。   The insulating substrate 2 is made of a substantially rectangular plate having a length of about 50 mm, a width of about 7.5 mm, and a thickness of about 0.6 mm, for example, and a ceramic such as alumina can be used as the material thereof. As long as it has heat resistance under the heat generation temperature conditions and at least the surface on which the heat generation layer is provided has an insulating property, it is a resin material such as glass epoxy, a metal made of stainless steel or the like with an insulating film provided on the surface A board, a glass-type material, etc. can be used widely. In this embodiment, an alumina substrate is used as the substrate 2, and a glass layer is coated on the upper surface (not shown).

発熱抵抗体層4は、例えばAg+Pdのペースト、これにさらにRuO2を加えたものを印刷塗布、焼成して形成することができる。Ag-Pd合金からなる場合、シート抵抗を100mΩ/Sq〜200mΩ/Sqが得られ、両者の比率により温度係数を変えることができる。また、導体(電極)として使用する場合、Agが多い程抵抗を低くすることができる。大きさは、例えば幅約1mm、厚さ約10μmの直線状で、例えば0.3mm離間して略平行に絶縁基板1の長手方向の長さいっぱいに印刷形成され、その抵抗値を約20Ω、抵抗温度係数を約1500ppm/℃(温度が100℃変化すると抵抗値が15%変化する)としている。発熱抵抗体層4の抵抗温度係数は正に高いほうが好ましく、特に1000〜3500ppm/℃の材料を用いて形成するのが好ましい。抵抗温度係数が正に高いほうが発熱させた場合、より早く温度が飽和状態となり、高温時の温度安定性に優れているからであり、熱暴走等による加熱を防止できるからである。また、抵抗温度係数が正に高いということは、温度変化に対する抵抗値変化が大きいことであるから、発熱させた状態における抵抗値測定により基準抵抗値からのずれにより実際の発熱温度の推測が容易に精度よく行え、印加電圧を調整することにより所望の発熱温度からのずれを修正し易くなるのである。本実施の形態においては発熱抵抗体層4を金属ペーストにより厚膜形成するようにしているが、蒸着により薄膜形成してもよい。 The heating resistor layer 4 can be formed, for example, by applying, baking, and baking a paste of Ag + Pd and further adding RuO 2 thereto. When made of an Ag—Pd alloy, a sheet resistance of 100 mΩ / Sq to 200 mΩ / Sq can be obtained, and the temperature coefficient can be changed depending on the ratio of the two. Moreover, when using as a conductor (electrode), resistance can be made low, so that there is much Ag. The size is, for example, a linear shape having a width of about 1 mm and a thickness of about 10 μm, and is printed and formed, for example, to the full length in the longitudinal direction of the insulating substrate 1 at a distance of 0.3 mm. The resistance value is about 20Ω, The temperature coefficient of resistance is about 1500 ppm / ° C. (when the temperature changes by 100 ° C., the resistance value changes by 15%). The resistance temperature coefficient of the heating resistor layer 4 is preferably positively high, and is particularly preferably formed using a material of 1000 to 3500 ppm / ° C. This is because when the resistance temperature coefficient is positively higher, when the heat is generated, the temperature is saturated more quickly and the temperature stability at high temperature is excellent, and heating due to thermal runaway or the like can be prevented. In addition, the fact that the temperature coefficient of resistance is positively high means that the resistance value change with respect to the temperature change is large, so it is easy to estimate the actual heat generation temperature due to the deviation from the reference resistance value by measuring the resistance value in the heated state. Therefore, the deviation from the desired heat generation temperature can be easily corrected by adjusting the applied voltage. In the present embodiment, the heating resistor layer 4 is formed as a thick film using a metal paste, but a thin film may be formed by vapor deposition.

一対の電極層3、3は、それぞれ発熱抵抗体層4の端部と重なるようにして電気的に接続され、例えば銀・パラジウム合金等の良導電体からなる。なお、発熱抵抗体層4上には、磨耗防止として、例えばガラス等からなる保護層を設けてもよく、本実施の形態では、図示しないがガラス層を設けている。   The pair of electrode layers 3 and 3 are electrically connected so as to overlap the end portions of the heating resistor layer 4 and are made of a good conductor such as silver / palladium alloy. Note that a protective layer made of, for example, glass or the like may be provided on the heating resistor layer 4 to prevent wear. In the present embodiment, a glass layer is provided although not shown.

そして、図1(B)に示すように、一対の電極3、3は、それぞれ基板2の端面を介して裏面端部へと延設されている。このとき、基板2の表面から裏面へと貫通するスルーホールを介して裏面側に延設するようにしてもよい。   Then, as shown in FIG. 1B, the pair of electrodes 3 and 3 are respectively extended to the back surface end portion through the end surface of the substrate 2. At this time, you may make it extend in the back surface side through the through hole penetrated from the surface of the board | substrate 2 to a back surface.

さらに、基板2の裏面中央部には一対の電極5、5印刷形成され、温度検出素子であるチップ状のサーミスタ6が搭載されている。このサーミスタ6は、例えば25℃における抵抗値約10Ω、B定数約3439Kのものを用いることができる。   Further, a pair of electrodes 5 and 5 are printed on the center of the back surface of the substrate 2 and a chip-like thermistor 6 as a temperature detecting element is mounted. As the thermistor 6, for example, a thermistor having a resistance value of about 10Ω at 25 ° C. and a B constant of about 3439K can be used.

次に、実施の形態1の加熱ヘッド1における電極層3と帯状の発熱抵抗体層4との接続構造について説明する。図2に示すように、電極層3は、発熱抵抗体層4の幅よりも大きい幅の平面視矩形状の一辺の中央部が切り欠かれた略コ字状とされている。この切り欠きにより形成される凹部3aは、頂部(上底)3b、3b、これらと直交し互いに平行する側部(側辺)3c、3c及び、頂部3b、3bと平行し、側部3c、3cと直交する底部(底辺)3dとからなる。そして、発熱抵抗体層4の端部がこの凹部3aを覆うように積層されて電極層3と接続されている。その結果、発熱抵抗体層4と電極層3との境界線は、これら頂部3b、側部3c、底部3d、側部3c及び頂部3bにより形成されることになる。   Next, a connection structure between the electrode layer 3 and the belt-like heating resistor layer 4 in the heating head 1 of Embodiment 1 will be described. As shown in FIG. 2, the electrode layer 3 has a substantially U shape in which a central portion of one side of the rectangular shape in plan view having a width larger than the width of the heating resistor layer 4 is cut out. The recess 3a formed by this notch is a top part (upper base) 3b, 3b, a side part (side) 3c, 3c orthogonal to and parallel to each other, and a top part 3b, 3b, a side part 3c, It consists of 3d and the bottom part (bottom side) 3d orthogonal. And the edge part of the heating resistor layer 4 is laminated | stacked so that this recessed part 3a may be covered, and it is connected with the electrode layer 3. FIG. As a result, the boundary line between the heating resistor layer 4 and the electrode layer 3 is formed by the top 3b, the side 3c, the bottom 3d, the side 3c, and the top 3b.

なお、本実施の形態では、発熱抵抗体層4を、その端部が電極層3の凹部3aを覆うように形成したが、本発明において、発熱抵抗体層4の端部を凹部3aの底部3dが露出するように形成してもよい。   In the present embodiment, the heating resistor layer 4 is formed so that the end thereof covers the recess 3a of the electrode layer 3, but in the present invention, the end of the heating resistor layer 4 is the bottom of the recess 3a. You may form so that 3d may be exposed.

このように電極層3を略コ字状の形状とすることにより、電極層3と発熱抵抗体層4との境界線は、一部(頂部3b、3b)でもう一方の電極層3(発熱抵抗体層4)の側へ突出し、他部(底部3d)で窪んだようでき、一対の電極層3、3を用いて発熱抵抗体層4に通電をした場合に、発熱抵抗体層4は電極層3の頂部3b、3b近傍で電流が集中し(電流密度が高く)、頂部3b、3b間(凹部3a内)ではほとんど電流が流れず(電流密度が低く)、頂部3b、3b近傍で高温に発熱させることができるようになる。   By making the electrode layer 3 substantially U-shaped in this way, the boundary line between the electrode layer 3 and the heating resistor layer 4 is partly (tops 3b, 3b) and the other electrode layer 3 (heat generation). The resistor layer 4) protrudes to the side and can be depressed at the other part (bottom 3d), and when the heater resistor layer 4 is energized using the pair of electrode layers 3 and 3, the heater resistor layer 4 Current concentrates in the vicinity of the tops 3b and 3b of the electrode layer 3 (current density is high), almost no current flows between the tops 3b and 3b (inside the recesses 3a) (low current density), and in the vicinity of the tops 3b and 3b. It becomes possible to generate heat at a high temperature.

(実施の形態2)
次に、実施の形態1における電極層3と帯状の発熱抵抗体層4との接続構造を変形した実施の形態2について説明する。本実施の形態において、電極層3は、上記実施の形態1と同様の形状として形成されている。他方、帯状の発熱抵抗体層4’は、端部において幅広部4’aが形成されている。幅広部4’aは、電極層3の上下の頂部3b、3bに沿うように上下両側に拡張された略T字形状とされて形成され、電極層3の凹部3aを覆う。
(Embodiment 2)
Next, a second embodiment in which the connection structure between the electrode layer 3 and the belt-like heating resistor layer 4 in the first embodiment is modified will be described. In the present embodiment, the electrode layer 3 is formed in the same shape as in the first embodiment. On the other hand, the band-shaped heating resistor layer 4 ′ has a wide portion 4′a at the end. The wide portion 4 ′ a is formed in a substantially T shape that is extended on both upper and lower sides along the upper and lower apexes 3 b and 3 b of the electrode layer 3, and covers the concave portion 3 a of the electrode layer 3.

なお、本実施の形態では、発熱抵抗体層4’を、その幅広部4’aが電極層3の凹部3aを覆うように形成したが、本発明において、発熱抵抗体層4’の幅広部4’aを凹部3aの底部3dが露出するように形成してもよい。   In the present embodiment, the heating resistor layer 4 ′ is formed so that the wide portion 4′a covers the concave portion 3a of the electrode layer 3. However, in the present invention, the wide portion of the heating resistor layer 4 ′ is formed. You may form 4'a so that the bottom 3d of the recessed part 3a may be exposed.

このように、発熱抵抗体層4’の端部を幅広とすることにより、発熱抵抗体層4’の幅広部4’aと電極層3の凹部3aとの相対的な形成位置にズレが生じたとしても、発熱抵抗体層4’の端部が覆う電極層3の凹部3aの上下の頂部3b、3bの一方が極端に短くなってしまうことを防止できる。すなわち、発熱抵抗体層3と電極層3とが重なる面積が、電極層3の凹部3aの上下のいずれかにおいて極端に小さくなると、その面積が極端に小さくなった側の頂部3b近傍に電流が集中し過ぎるために、発熱抵抗体層が焼損により断線を起こす危険性があるが、本実施の形態のように幅広部4’aを形成することにより、発熱抵抗体層4’又は電極層3が位置ズレにより形成されたとしても、これを防止でき、程よい電流集中を電極層3と発熱抵抗体層4’との境界線の一部近傍で実現することができる。   As described above, by widening the end portion of the heating resistor layer 4 ′, the relative formation position of the wide portion 4′a of the heating resistor layer 4 ′ and the recess 3a of the electrode layer 3 is shifted. Even so, it is possible to prevent one of the top and bottom apexes 3b and 3b of the recess 3a of the electrode layer 3 covered by the end of the heating resistor layer 4 'from becoming extremely short. That is, if the area where the heating resistor layer 3 and the electrode layer 3 overlap becomes extremely small either above or below the concave portion 3a of the electrode layer 3, current flows near the top 3b on the side where the area becomes extremely small. There is a risk that the heating resistor layer may be disconnected due to burning due to excessive concentration, but by forming the wide portion 4′a as in the present embodiment, the heating resistor layer 4 ′ or the electrode layer 3 is formed. Can be prevented even if it is formed due to misalignment, and moderate current concentration can be realized in the vicinity of a part of the boundary line between the electrode layer 3 and the heating resistor layer 4 ′.

(実施の形態3)
図4に示すように、本実施の形態3では、略L字状の電極層13を採用している。電極層13は、発熱抵抗体層4の幅よりも大きい幅の平面視矩形状の一辺の中央部を切り欠きくことにより略L字状とされるが、この切り欠きにより形成される凹部13aは、頂部(上底)13b、これと直交する側部13c及び、頂部13bと平行し、側部13cと直交する底部3dとからなる。そして、発熱抵抗体層14の端部がこの凹部13aを覆うように積層されて電極層13と接続されている。その結果、発熱抵抗体層14と電極層13との境界線は、これら頂部3b、側部3c及び底部3dにより形成されることになる。
(Embodiment 3)
As shown in FIG. 4, in the third embodiment, a substantially L-shaped electrode layer 13 is employed. The electrode layer 13 is substantially L-shaped by cutting out a central portion of one side of the rectangular shape in plan view having a width larger than the width of the heating resistor layer 4, and a recess 13a formed by the cutout. Consists of a top part (upper bottom) 13b, a side part 13c orthogonal to the top part 13b, and a bottom part 3d parallel to the top part 13b and orthogonal to the side part 13c. And the edge part of the heating resistor layer 14 is laminated | stacked so that this recessed part 13a may be covered, and the electrode layer 13 is connected. As a result, the boundary line between the heating resistor layer 14 and the electrode layer 13 is formed by the top portion 3b, the side portion 3c, and the bottom portion 3d.

このように電極層13を略L字状の形状とすることにより、電極層13と発熱抵抗体層14との境界線は、一部(頂部13b)でもう一方の電極層13(発熱抵抗体層14)の側へ突出し、他部(底部13d)で窪んだようでき、一対の電極層13、13を用いて発熱抵抗体層14に通電をした場合に、発熱抵抗体層14は電極層13の頂部13b近傍で電流が集中し(電流密度が高く)、底部13d(凹部3a内)からはほとんど電流が流れず(電流密度が低く)、頂部13b近傍で高温に発熱させることができるようになる。   Thus, by making the electrode layer 13 into a substantially L shape, the boundary line between the electrode layer 13 and the heating resistor layer 14 is partially (top portion 13b) and the other electrode layer 13 (heating resistor). Layer 14) protrudes to the other side (bottom 13d), and when the heating resistor layer 14 is energized using the pair of electrode layers 13 and 13, the heating resistor layer 14 is an electrode layer. Current concentrates in the vicinity of the top 13b of 13 (current density is high), almost no current flows from the bottom 13d (inside the recess 3a) (low current density), and heat can be generated at a high temperature in the vicinity of the top 13b. become.

(実施の形態4)
図5に実施の形態4の電極層23と帯状の発熱抵抗体層24との接続構造を示す。本実施の形態4では、実施の形態1の電極層3の凹部3aの一方の側部3cを頂部3bに対して斜めに形成した形状の電極層23を採用している。つまり、電極層23は、発熱抵抗体層4の幅よりも大きい幅の平面視矩形状の一辺の中央部を切り欠きくことにより形成される凹部23aが、頂部(上底)23b、23b、これらと直交しその一方の頂部23bと一端で連結される側部23c及び、他方の頂部23bと側部23cの他端とを連結する傾斜側部(傾斜側辺)23dとからなる。そして、発熱抵抗体層24の端部がこの凹部23aを覆うように積層されて電極層23と接続されている。その結果、発熱抵抗体層24と電極層23との境界線は、これら頂部23b、側部23c、傾斜側部23d及び頂部23bにより形成されることになる。
(Embodiment 4)
FIG. 5 shows a connection structure between the electrode layer 23 and the belt-like heating resistor layer 24 according to the fourth embodiment. In the fourth embodiment, an electrode layer 23 having a shape in which one side 3c of the recess 3a of the electrode layer 3 of the first embodiment is formed obliquely with respect to the top 3b is employed. That is, the electrode layer 23 has a concave portion 23a formed by cutting out a central portion of one side of the rectangular shape in plan view having a width larger than the width of the heating resistor layer 4, and the top portions (upper bases) 23b, 23b, It consists of a side part 23c that is orthogonal to these and connected at one end to one top part 23b, and an inclined side part (inclined side edge) 23d that connects the other top part 23b and the other end of the side part 23c. The end portion of the heating resistor layer 24 is laminated so as to cover the concave portion 23 a and is connected to the electrode layer 23. As a result, the boundary line between the heating resistor layer 24 and the electrode layer 23 is formed by the top portion 23b, the side portion 23c, the inclined side portion 23d, and the top portion 23b.

このように電極層23の凹部の一方の側辺を斜めに形成した形状とすることにより、電極層23と発熱抵抗体層24との境界線は、一部(頂部23b)でもう一方の電極層23(発熱抵抗体層24)の側へ突出し、他部(傾斜側部23d)で徐々に遠ざかるようでき、一対の電極層23、23を用いて発熱抵抗体層24に通電をした場合に、発熱抵抗体層24は電極層23の頂部23b近傍で電流が集中し(電流密度が高く)、傾斜側部23d(凹部23a内)において頂部23bから遠ざかるにつれ電流の流れが小さく(電流密度が低く)なっていき、頂部23b近傍で高温に発熱させることができ、ここから遠ざかる境界線近傍においては遠ざかるにつれて徐々に発熱温度が低くなる。   In this way, by forming one side of the concave portion of the electrode layer 23 obliquely, the boundary line between the electrode layer 23 and the heating resistor layer 24 is partially (top 23b) and the other electrode. When protruding to the side of the layer 23 (heating resistor layer 24) and gradually moving away from the other portion (inclined side portion 23d), when the heating resistor layer 24 is energized using the pair of electrode layers 23, 23 In the heating resistor layer 24, current concentrates near the top 23b of the electrode layer 23 (current density is high), and the current flow decreases as the distance from the top 23b increases (current density decreases) in the inclined side portion 23d (in the recess 23a). The heat generation temperature can be increased to a high temperature in the vicinity of the top 23b, and the heat generation temperature gradually decreases with increasing distance in the vicinity of the boundary line away from the top 23b.

なお、本実施の形態では、凹部23aの傾斜側部23dを直線状のテーパーを設けたものとしたが、階段状にテーパーを設けたものとしてもよい。   In the present embodiment, the inclined side portion 23d of the recess 23a is provided with a linear taper, but may be provided with a taper in a stepped manner.

(実施の形態5)
図6に実施の形態5の電極層33と帯状の発熱抵抗体層34との接続構造を示す。本実施の形態5では、実施の形態1の電極層3の凹部3aの両方の側部3c、3cを頂部3bに対して斜めに形成した逆三角形状の凹部33aとした略コ字状の電極層33を採用している。つまり、電極層33は、発熱抵抗体層4の幅よりも大きい幅の平面視矩形状の一辺の中央部を切り欠きくことにより形成される凹部33aが、頂部(上底)33b、33b、これら頂部33b、33bのそれぞれと一端で連結され他端を凹部33aの底部で連結する傾斜側部(傾斜側辺)33c、33cとからなり、凹部33aは、底部に向って徐々に幅狭となる形状とされる。そして、発熱抵抗体層34の端部が幅広部34aとされる。この発熱抵抗体層34の幅広部34aは、電極層33の上下の頂部33b、33bに沿うように上下両側に拡張された略T字形状とされて形成され、電極層33の凹部33aの底部33dを露出させて当該凹部33aを覆うように積層されて電極層33と接続されている。その結果、発熱抵抗体層34と電極層33との境界線は、これら頂部33b、傾斜側部33c、傾斜側部33c及び頂部33bにより形成されることになる。なお、発熱抵抗体34の端部が電極層33の凹部33aを完全に覆うようにして形成してもよい。
(Embodiment 5)
FIG. 6 shows a connection structure between the electrode layer 33 and the belt-like heating resistor layer 34 according to the fifth embodiment. In the fifth embodiment, both sides 3c and 3c of the concave portion 3a of the electrode layer 3 of the first embodiment are formed in an inverted triangular concave portion 33a formed obliquely with respect to the top portion 3b. Layer 33 is employed. That is, the electrode layer 33 has a concave portion 33a formed by cutting out the central portion of one side of the rectangular shape in plan view having a width larger than the width of the heating resistor layer 4, and the top portions (upper bottoms) 33b, 33b, Each of the top portions 33b and 33b is composed of inclined side portions (tilted side sides) 33c and 33c that are connected at one end and the other end is connected to the bottom portion of the concave portion 33a. The concave portion 33a is gradually narrowed toward the bottom portion. The shape becomes. The end portion of the heating resistor layer 34 is a wide portion 34a. The wide portion 34 a of the heating resistor layer 34 is formed in a substantially T shape that extends on both upper and lower sides along the upper and lower top portions 33 b and 33 b of the electrode layer 33, and the bottom portion of the concave portion 33 a of the electrode layer 33. 33d is exposed and laminated so as to cover the recess 33a and connected to the electrode layer 33. As a result, the boundary line between the heating resistor layer 34 and the electrode layer 33 is formed by the top portion 33b, the inclined side portion 33c, the inclined side portion 33c, and the top portion 33b. The end of the heating resistor 34 may be formed so as to completely cover the recess 33a of the electrode layer 33.

このように電極層33の凹部の両方の側辺を斜めにしたテーパー状とした形状とすることにより、電極層33と発熱抵抗体層34との境界線は、一部(頂部33b、33b)でもう一方の電極層33(発熱抵抗体層34)の側へ突出し、他部(傾斜側部33c、33c)で徐々に遠ざかるようでき、一対の電極層33、33を用いて発熱抵抗体層34に通電をした場合に、発熱抵抗体層34は電極層33の頂部33b、33b近傍で電流が集中し(電流密度が高く)、傾斜側部33c、33c(凹部33a内)において頂部33b、33bから遠ざかるにつれ電流の流れが小さく(電流密度が低く)なっていき、頂部33b、33b近傍で高温に発熱させることができ、ここから遠ざかる境界線近傍においては遠ざかるにつれて徐々に発熱温度が低くなる。   In this way, by forming a tapered shape in which both sides of the concave portion of the electrode layer 33 are inclined, a part of the boundary line between the electrode layer 33 and the heating resistor layer 34 (tops 33b and 33b) is formed. And projecting toward the other electrode layer 33 (heating resistor layer 34) and gradually moving away from the other part (inclined side parts 33c, 33c). Using the pair of electrode layers 33, 33, the heating resistor layer When the current is supplied to 34, the heating resistor layer 34 has a current concentrated in the vicinity of the top portions 33b and 33b of the electrode layer 33 (current density is high), and the top portions 33b and 33c (inside the recesses 33a) As the distance from 33b increases, the flow of current decreases (current density decreases), and heat can be generated at a high temperature in the vicinity of the top portions 33b and 33b. The heat generation temperature gradually increases as the distance from the boundary near the boundary increases. It is low.

なお、本実施の形態では、凹部33aの傾斜側部33d、33bを直線状のテーパーを設けたものとしたが、階段状にテーパーを設けたものとしてもよい。   In the present embodiment, the inclined side portions 33d and 33b of the concave portion 33a are provided with a linear taper, but may be provided with a stepped taper.

(実施の形態6)
図7に実施の形態6の電極層43と帯状の発熱抵抗体層44との接続構造を示す。本実施の形態6では、実施の形態1の電極層3の凹部3aの両方の側部3c、3cを曲線状にすることにより、略半円状の凹部43aとした略コ字状の電極層43を採用している。つまり、電極層43は、発熱抵抗体層4の幅よりも大きい幅の平面視矩形状の一辺の中央部を略半円状に切り欠いた凹部43aが形成されており、凹部43aは、頂部(上底)43b、43b、これらを繋ぐ円弧状の曲線からなる底部43cからなり、底に向って徐々に幅狭となる形状とされる。そして、発熱抵抗体層44の端部がこの凹部43aを覆うように積層されて電極層43と接続されている。その結果、発熱抵抗体層44と電極層43との境界線は、これら頂部43b、傾斜側部43c、傾斜側部43c及び頂部43bにより形成されることになる。
(Embodiment 6)
FIG. 7 shows a connection structure between the electrode layer 43 and the belt-shaped heating resistor layer 44 according to the sixth embodiment. In the sixth embodiment, both side portions 3c and 3c of the concave portion 3a of the electrode layer 3 of the first embodiment are curved to form a substantially semicircular concave portion 43a. 43 is adopted. That is, the electrode layer 43 is formed with a concave portion 43a in which a central portion of one side of the rectangular shape in plan view having a width larger than the width of the heating resistor layer 4 is cut out in a substantially semicircular shape. (Upper bottom) 43b, 43b, and a bottom portion 43c made of an arcuate curve connecting them, and gradually narrowing toward the bottom. The end portion of the heating resistor layer 44 is laminated so as to cover the concave portion 43 a and is connected to the electrode layer 43. As a result, the boundary line between the heating resistor layer 44 and the electrode layer 43 is formed by the top portion 43b, the inclined side portion 43c, the inclined side portion 43c, and the top portion 43b.

このように略半円状の凹部43aを設けた略コ字状の電極層43とすることにより、電極層43と発熱抵抗体層44との境界線は、一部(頂部43b、43b)でもう一方の電極層43(発熱抵抗体層44)の側へ突出し、他部(底部43c)で徐々に遠ざかるようでき、一対の電極層43、43を用いて発熱抵抗体層44に通電をした場合に、発熱抵抗体層44は電極層43の頂部43b、43b近傍で電流が集中し(電流密度が高く)、底部43c(凹部43a内)において頂部43b、43bから遠ざかるにつれ電流の流れが小さく(電流密度が低く)なっていき、頂部43b、43b近傍で高温に発熱させることができ、ここから遠ざかる境界線近傍においては遠ざかるにつれて徐々に発熱温度が低くなる。   Thus, by forming the substantially U-shaped electrode layer 43 provided with the substantially semicircular recess 43a, the boundary line between the electrode layer 43 and the heating resistor layer 44 is partially (tops 43b, 43b). It protrudes toward the other electrode layer 43 (heating resistor layer 44) and can gradually move away from the other part (bottom 43c), and the heating resistor layer 44 is energized using the pair of electrode layers 43 and 43. In the case, the current flows in the heating resistor layer 44 in the vicinity of the top portions 43b and 43b of the electrode layer 43 (the current density is high), and the current flow decreases as the distance from the top portions 43b and 43b increases in the bottom portion 43c (in the recess 43a). (The current density becomes low), and heat can be generated to a high temperature in the vicinity of the top portions 43b and 43b, and the heat generation temperature gradually decreases as the distance increases in the vicinity of the boundary line away from the top portions 43b and 43b.

(実施の形態7)
図8に実施の形態7の電極層53と帯状の発熱抵抗体層54との接続構造を示す。本実施の形態7では、実施の形態4の電極層33を均等に2分割したような形状の電極構造を採用している。つまり、電極層53は、平面視矩形状の一角を三角形状として切り欠きくことにより直線状の傾斜部(傾斜辺)53cが形成されることによる凹部53aが設けられている。そして、この傾斜部53cを発熱抵抗体層54の端部の幅方向の下側の部分で覆うようにして電極層53と接続されている。還元すれば、発熱抵抗体層54の端部の下部において電極層53と電気的に接続されている。その結果、発熱抵抗体層54と電極層53との境界線は、頂部53b、この頂部53bの一端から延びる直線状の傾斜側部53c、及びこの傾斜側部53cの一端から延び、頂部53bと直交する側底部53dにより形成されることになる。なお、本実施の形態において発熱抵抗体層54の端部は、電極層53の頂部53bに沿うように下側に拡張された幅広部54aが形成されることにより、略L字形状とされている。
(Embodiment 7)
FIG. 8 shows a connection structure between the electrode layer 53 and the belt-shaped heating resistor layer 54 according to the seventh embodiment. In the seventh embodiment, an electrode structure having a shape in which the electrode layer 33 of the fourth embodiment is equally divided into two parts is employed. That is, the electrode layer 53 is provided with a concave portion 53a formed by forming a linear inclined portion (inclined side) 53c by cutting out one corner of a rectangular shape in plan view as a triangular shape. The inclined portion 53 c is connected to the electrode layer 53 so as to be covered with the lower portion in the width direction of the end portion of the heating resistor layer 54. If it reduces, it will be electrically connected with the electrode layer 53 in the lower part of the edge part of the heating resistor layer 54. As a result, the boundary line between the heating resistor layer 54 and the electrode layer 53 extends from the top portion 53b, the linear inclined side portion 53c extending from one end of the top portion 53b, and one end of the inclined side portion 53c. It is formed by the side bottom portion 53d orthogonal to each other. In the present embodiment, the end portion of the heating resistor layer 54 is substantially L-shaped by forming a wide portion 54 a that extends downward along the top portion 53 b of the electrode layer 53. Yes.

このように矩形状の一角を直線的に切り欠かくことにより凹部53aを設けた電極層53とすることにより、電極層53と発熱抵抗体層44との境界線は、一部(頂部53b)でもう一方の電極層53(発熱抵抗体層54)の側へ突出し、他部(傾斜側部53c)で徐々に遠ざかるようでき、一対の電極層53、53を用いて発熱抵抗体層54に通電をした場合に、発熱抵抗体層54は電極層53の頂部53b近傍で電流が集中し(電流密度が高く)、傾斜側部53c(凹部53a内)において頂部53bから遠ざかるにつれ電流の流れが小さく(電流密度が低く)なっていき、頂部43b、43b近傍で高温に発熱させることができ、ここから遠ざかる境界線近傍においては遠ざかるにつれて徐々に発熱温度が低くなる。   In this way, by forming a rectangular corner in a straight line to form the electrode layer 53 having the recess 53a, the boundary line between the electrode layer 53 and the heating resistor layer 44 is partially (top 53b). Can protrude toward the other electrode layer 53 (heating resistor layer 54) and gradually move away from the other portion (inclined side portion 53c). The pair of electrode layers 53 and 53 are used to form the heating resistor layer 54. When energized, the heating resistor layer 54 concentrates current in the vicinity of the top 53b of the electrode layer 53 (current density is high), and the current flows as it moves away from the top 53b in the inclined side portion 53c (in the recess 53a). It becomes small (the current density becomes low), and heat can be generated at a high temperature in the vicinity of the top portions 43b and 43b, and the heat generation temperature gradually decreases as the distance increases in the vicinity of the boundary line away from this.

なお、本実施の形態7では、矩形状の一角を切り欠いてテーパー部を設けるようにしたが、この切り欠きによる凹部53cを必ずしも設ける必要はなく、発熱抵抗体層54の端部の幅方向における一部分に電極層が接続される構造とすれば、少なからず本発明の効果を得ることができる。   In the seventh embodiment, the tapered portion is provided by cutting out one corner of the rectangular shape. However, it is not always necessary to provide the concave portion 53c by the notch, and the width direction of the end portion of the heating resistor layer 54 is not necessarily provided. If the electrode layer is connected to a part of the electrode layer, the effects of the present invention can be obtained.

(実施の形態8)
図9に実施の形態8の電極層63と帯状の発熱抵抗体層64との接続構造を示す。本実施の形態8では、実施の形態5の電極層33における凹部33aを2つ並べて形成した電極構造を採用している。つまり、電極層53は、平面視矩形状の一辺に2つの三角形状の凹部63a、63aを切り欠きくことにより形成した形状とされ、これら凹部63a、63aを発熱抵抗体層64の端部で覆うことにより、発熱抵抗体層54と電極層53は、その境界線をのこぎりの刃のようなギザギザ形状として電気的に接続されている。
(Embodiment 8)
FIG. 9 shows a connection structure between the electrode layer 63 and the belt-shaped heating resistor layer 64 according to the eighth embodiment. In the eighth embodiment, an electrode structure in which two recesses 33a in the electrode layer 33 of the fifth embodiment are formed side by side is employed. That is, the electrode layer 53 has a shape formed by cutting out two triangular recesses 63a and 63a on one side of a rectangular shape in plan view, and the recesses 63a and 63a are formed at the end of the heating resistor layer 64. By covering, the heating resistor layer 54 and the electrode layer 53 are electrically connected in a jagged shape like a saw blade at the boundary line.

凹部63a、63aは、それぞれ対向する直線状の傾斜側辺(傾斜側部)63d、63dからなり、底に向かい徐々に幅が狭くされている。そして、発熱抵抗体層64の端部の幅方向の中央部に尖った頂部63cが形成され、幅方向の上下両端部に当該幅方向と平行する頂部63b、63bが形成されている。   The concave portions 63a and 63a are respectively formed by opposing linear inclined side sides (inclined side portions) 63d and 63d, and the width is gradually narrowed toward the bottom. A sharp apex 63c is formed at the center of the end portion of the heating resistor layer 64 in the width direction, and apexes 63b and 63b parallel to the width direction are formed at both upper and lower ends in the width direction.

このようにギザギザ形状の境界線とすることにより、発熱抵抗体層54は電極層53の頂部63b、63b、63c近傍で電流が集中し(電流密度が高く)、傾斜側部63d、63d、63d、63d(凹部63a、63a内)において電流の流れが小さく(電流密度が低く)なっていき、頂部63b、63b、63c近傍で高温に発熱させることができ、ここから遠ざかる境界線近傍においては遠ざかるにつれて徐々に発熱温度が低くなる。   By using the jagged border line in this way, the heating resistor layer 54 concentrates current near the tops 63b, 63b, 63c of the electrode layer 53 (high current density), and the inclined side parts 63d, 63d, 63d. 63d (inside the recesses 63a and 63a), the current flow becomes small (the current density is low), and heat can be generated at a high temperature in the vicinity of the tops 63b, 63b and 63c, and in the vicinity of the boundary line away from the tops 63b, 63b and 63c. The exothermic temperature gradually decreases with time.

(実施の形態9)
図10に実施の形態9の帯状の発熱抵抗体層74及びこれと電極層73との接続構造を示す。帯状の発熱抵抗体層74は、その両端部74aの幅L1が中央部74bの幅L2よりも小さくされている。そして、この幅が小さくされた端部74aにおいて電極層73と電気的に接続されている。
(Embodiment 9)
FIG. 10 shows a belt-like heating resistor layer 74 and a connection structure between the belt-like heating resistor layer 74 and the electrode layer 73 according to the ninth embodiment. The band-shaped heating resistor layer 74 has a width L1 at both end portions 74a smaller than a width L2 at the central portion 74b. Then, the end portion 74a whose width is reduced is electrically connected to the electrode layer 73.

なお、電極層73の幅は、発熱抵抗体層74の端部74aの幅L1よりも大きく、端部74aの幅方向の全長にわたって電極層73と接続されている。   The width of the electrode layer 73 is larger than the width L1 of the end portion 74a of the heating resistor layer 74 and is connected to the electrode layer 73 over the entire length in the width direction of the end portion 74a.

このように発熱抵抗体層74の端部74aの幅L1を中央部74bの幅L2よりも小さくしたので、一対の電極層73、73により発熱抵抗体層74に電流を流したときに、発熱抵抗体層74の端部74aを中央部74bより高い電流密度とし得、端部74a、特に電極層73の近傍の発熱温度を中央部74bの発熱温度に近づけることができ、結果として発熱抵抗体層74の発熱温度を全長に亘って均一に近づけることができる。   Since the width L1 of the end portion 74a of the heat generating resistor layer 74 is made smaller than the width L2 of the central portion 74b in this way, heat is generated when a current is passed through the heat generating resistor layer 74 by the pair of electrode layers 73 and 73. The end portion 74a of the resistor layer 74 can have a higher current density than the central portion 74b, and the heat generation temperature in the vicinity of the end portion 74a, particularly in the vicinity of the electrode layer 73, can be brought close to the heat generation temperature of the central portion 74b. The exothermic temperature of the layer 74 can be made uniform over the entire length.

(実施の形態10)
図11に実施の形態9の変形例としての実施の形態9の帯状の発熱抵抗体層84及びこれと電極層83との接続構造を示す。帯状の発熱抵抗体層84は、その両端部84aの幅が中央部84bの幅から徐々に小さくされている。すなわち、端部84aの幅がテーパー状に狭くされていき、電極層83に接続されるようにしている。
(Embodiment 10)
FIG. 11 shows a belt-like heating resistor layer 84 of the ninth embodiment as a modification of the ninth embodiment and a connection structure between this and the electrode layer 83. The band-shaped heating resistor layer 84 has a width at both end portions 84a that is gradually reduced from a width at the central portion 84b. That is, the width of the end portion 84 a is reduced in a tapered shape so as to be connected to the electrode layer 83.

このように発熱抵抗体層84の端部84aの幅を中央部84bの幅よりも小さくするとともに、当該端部84aの幅を電極層83に近づくにつれて直線的に更に小さくなるようにしているので、一対の電極層83、83により発熱抵抗体層84に電流を流したときに、発熱抵抗体層84の端部84aを中央部84bより高い電流密度とし得、端部84a、特に電極層83の近傍の発熱温度を中央部84bの発熱温度になだらかに近づけることができ、結果として発熱抵抗体層84の発熱温度を全長に亘って均一に近づけることができる。   As described above, the width of the end portion 84a of the heating resistor layer 84 is made smaller than the width of the central portion 84b, and the width of the end portion 84a is further linearly decreased as the electrode layer 83 is approached. When a current is passed through the heating resistor layer 84 by the pair of electrode layers 83 and 83, the end portion 84a of the heating resistor layer 84 can have a higher current density than the central portion 84b. The heating temperature in the vicinity of can be made closer to the heating temperature of the central portion 84b, and as a result, the heating temperature of the heating resistor layer 84 can be made to approach uniformly over the entire length.

また、本実施の形態10では、電極層83の形状を上記実施の形態1のものと同様の形状とし、発熱抵抗体層84と電極層83との接続構造も同様としているので、発熱抵抗体層84の端部84aの幅を狭くした効果と、接続構造による効果との相乗的な効果を得ることができる。
(実施の形態11)
次に、本発明の実施の形態11に係る加熱ヘッド101について説明する。図12に加熱ヘッド101の(A)概略表面図、(B)(A)の円Bで囲まれた部分(中央部)の概略断面図、及び(C)(A)の円Cで囲まれた部分(端部)の概略断面図を示す。
In the tenth embodiment, the shape of the electrode layer 83 is the same as that of the first embodiment and the connection structure between the heating resistor layer 84 and the electrode layer 83 is the same. A synergistic effect of the effect of reducing the width of the end portion 84a of the layer 84 and the effect of the connection structure can be obtained.
(Embodiment 11)
Next, the heating head 101 according to the eleventh embodiment of the present invention will be described. 12A is a schematic surface view of the heating head 101, FIG. 12B is a schematic cross-sectional view of a portion (center portion) surrounded by a circle B in FIG. 12A, and FIG. 12C is surrounded by a circle C in FIG. The schematic sectional drawing of the part (end part) which showed is shown.

図12(A)に示すように、加熱ヘッド101は、平面形状がほぼ長方形状の絶縁性基板102の表面に、絶縁性基板102の長手方向の両端部に形成された略矩形状の一対の電極層103、103と、この一対の電極層103、103を直線状に跨ぐように形成された帯状の発熱抵抗体層104とを備える。   As shown in FIG. 12A, the heating head 101 has a pair of substantially rectangular shapes formed on both ends of the insulating substrate 102 in the longitudinal direction on the surface of the insulating substrate 102 having a substantially rectangular planar shape. The electrode layers 103 and 103, and the belt-shaped heating resistor layer 104 formed so as to straddle the pair of electrode layers 103 and 103 in a straight line.

発熱抵抗体層104は、図12(B)に示すように、中央部において下層としての第1抵抗体層104a及び上層としての第2抵抗体層104bの2層構造とされている。一方、端部においては、図12(C)に示すように、第1抵抗体層104aの1層構造とされている。すなわち、本実施の形態10における発熱抵抗体層104は、中央部の厚みを端部(電極層103の近傍)の厚みよりも厚くして形成することにより、電極層103の近傍の断面積を小さくして、通電したときに電流密度が高くなるようにしている。その結果、発熱抵抗体層104における電極層103の近傍の発熱温度を中央部の発熱温度に近づけることができ、発熱抵抗体層104の発熱温度を全長に亘って均一に近づけることができる。   As shown in FIG. 12B, the heating resistor layer 104 has a two-layer structure of a first resistor layer 104a as a lower layer and a second resistor layer 104b as an upper layer at the center. On the other hand, as shown in FIG. 12C, the end portion has a one-layer structure of the first resistor layer 104a. That is, the heating resistor layer 104 according to the tenth embodiment is formed with the thickness of the central portion larger than the thickness of the end portion (near the electrode layer 103), so that the cross-sectional area in the vicinity of the electrode layer 103 is increased. The current density is increased when energized. As a result, the heating temperature of the heating resistor layer 104 in the vicinity of the electrode layer 103 can be brought close to the heating temperature of the central portion, and the heating temperature of the heating resistor layer 104 can be made to approach uniformly over the entire length.

なお、本実施の形態11では、発熱抵抗体層104の端部における厚みを中央部の厚みよりも薄くすることにより電極層103の近傍の発熱温度を高めるようにしているが、これに代えて、発熱抵抗体層の端部を中央部よりもシート抵抗の高い抵抗素材で構成するようにして電極層103の近傍の発熱温度を高めるようにしてもよい。   In the eleventh embodiment, the heat generation temperature in the vicinity of the electrode layer 103 is increased by making the thickness of the end portion of the heating resistor layer 104 smaller than the thickness of the central portion. The heat generation temperature in the vicinity of the electrode layer 103 may be increased by configuring the end portion of the heat generation resistor layer with a resistance material having a sheet resistance higher than that of the central portion.

以上本発明の実施の形態について説明したが、これら本発明の加熱ヘッドは、例えば、ユニット化して供給することができる。例えばアルミニウム等からなる基台5上に加熱ヘッド及びその電極引き出し用の例えばフレキシブル回路基板等からなる配線基板を接着剤により貼り付けて搭載することによりユニットとすることができる。   Although the embodiments of the present invention have been described above, these heating heads of the present invention can be supplied as a unit, for example. For example, a unit can be obtained by mounting a heating head and a wiring board made of, for example, a flexible circuit board for drawing out the electrode on the base 5 made of aluminum or the like with an adhesive.

本発明の加熱ヘッドは、可逆性感熱材料を用いたリライタブルシートやリライタブルカードの記録を消去する消去ヘッドとして特に有用である。   The heating head of the present invention is particularly useful as an erasing head for erasing the recording on a rewritable sheet or rewritable card using a reversible thermosensitive material.

本発明の実施の形態1に係る加熱ヘッドを示す(A)概略表面図及び(B)概略裏面図である。It is (A) schematic front view and (B) schematic back view which show the heating head which concerns on Embodiment 1 of this invention. 図1の加熱ヘッドにおける電極層と発熱抵抗体層との接続構造を説明するための概略部分拡大図である。FIG. 2 is a schematic partial enlarged view for explaining a connection structure between an electrode layer and a heating resistor layer in the heating head of FIG. 1. 本発明の実施の形態2に係る加熱ヘッドにおける電極層と発熱抵抗体層との接続構造を説明するための概略部分拡大図である。It is a general | schematic fragmentary enlarged view for demonstrating the connection structure of the electrode layer and heating resistor layer in the heating head which concerns on Embodiment 2 of this invention. 本発明の実施の形態3に係る加熱ヘッドにおける電極層と発熱抵抗体層との接続構造を説明するための概略部分拡大図である。It is a general | schematic fragmentary enlarged view for demonstrating the connection structure of the electrode layer and heating resistor layer in the heating head which concerns on Embodiment 3 of this invention. 本発明の実施の形態4に係る加熱ヘッドにおける電極層と発熱抵抗体層との接続構造を説明するための概略部分拡大図である。It is a general | schematic fragmentary enlarged view for demonstrating the connection structure of the electrode layer and heating resistor layer in the heating head which concerns on Embodiment 4 of this invention. 本発明の実施の形態5に係る加熱ヘッドにおける電極層と発熱抵抗体層との接続構造を説明するための概略部分拡大図である。It is a general | schematic fragmentary enlarged view for demonstrating the connection structure of the electrode layer and heating resistor layer in the heating head which concerns on Embodiment 5 of this invention. 本発明の実施の形態6に係る加熱ヘッドにおける電極層と発熱抵抗体層との接続構造を説明するための概略部分拡大図である。It is a general | schematic fragmentary enlarged view for demonstrating the connection structure of the electrode layer and heating resistor layer in the heating head which concerns on Embodiment 6 of this invention. 本発明の実施の形態7に係る加熱ヘッドにおける電極層と発熱抵抗体層との接続構造を説明するための概略部分拡大図である。It is a general | schematic fragmentary enlarged view for demonstrating the connection structure of the electrode layer and heating resistor layer in the heating head which concerns on Embodiment 7 of this invention. 本発明の実施の形態8に係る加熱ヘッドにおける電極層と発熱抵抗体層との接続構造を説明するための概略部分拡大図である。It is a general | schematic fragmentary enlarged view for demonstrating the connection structure of the electrode layer and heating resistor layer in the heating head which concerns on Embodiment 8 of this invention. 本発明の実施の形態9に係る加熱ヘッドにおける発熱抵抗体層の端部構造及びこれと電極層との接続構造を説明するための概略部分拡大図である。It is a general | schematic fragmentary enlarged view for demonstrating the edge part structure of the heating resistor layer in the heating head which concerns on Embodiment 9 of this invention, and the connection structure of this and an electrode layer. 本発明の実施の形態10に係る加熱ヘッドにおける発熱抵抗体層の端部構造及びこれと電極層との接続構造を説明するための概略部分拡大図である。It is a general | schematic fragmentary enlarged view for demonstrating the edge part structure of the heating resistor layer in the heating head which concerns on Embodiment 10 of this invention, and the connection structure of this and an electrode layer. 本発明の実施の形態11に係る加熱ヘッドにおける(A)概略表面図、(B)中央部の概略部分断面図及び(C)端部の概略部分断面図である。It is (A) schematic surface drawing in the heating head concerning Embodiment 11 of this invention, (B) schematic partial sectional drawing of a center part, and (C) schematic partial sectional drawing of an edge part.

符号の説明Explanation of symbols

1、101 加熱ヘッド
2、102 絶縁性基板
3、13、23、33、43、53、63、73、83、93、103 電極層
3a、13a、23a、33a、43a、53a、63a、83a 凹部
4、4’、14、24、34、44、54、64、74、84、94、104 発熱抵抗体層
4’a、34a、54a 幅広部
1, 101 Heating head 2, 102 Insulating substrate 3, 13, 23, 33, 43, 53, 63, 73, 83, 93, 103 Electrode layers 3a, 13a, 23a, 33a, 43a, 53a, 63a, 83a Recess 4, 4 ', 14, 24, 34, 44, 54, 64, 74, 84, 94, 104 Heating resistor layer 4'a, 34a, 54a Wide part

Claims (3)

絶縁性基板、この絶縁性基板上に形成された一対の電極層及びこの一対の電極層に長さ方向の両端部がそれぞれ電気的に接続されるように形成された帯状の発熱抵抗体層を有する加熱ヘッドにおいて、
記帯状の発熱抵抗体層の前記両端部は、前記一対の電極層のそれぞれと重なるように設けられ、かつ、前記発熱抵抗体層の両端部のそれぞれの端縁は、一部が前記一対の電極層のそれぞれと接触し、他の部分は前記一対の電極層のそれぞれと接触しないように前記一対の電極層及び前記帯状の発熱抵抗体層が形成されていることを特徴とする加熱ヘッド。
An insulating substrate, a pair of electrode layers formed on the insulating substrate, and a strip-shaped heating resistor layer formed so that both ends in the length direction are electrically connected to the pair of electrode layers , respectively. Having a heating head,
The said end portions of the heating resistor layer before Symbol strip provided so as to overlap with each of the pair of electrode layers, and each of the end edges of both end portions of the heating resistor layer is partly the pair heating the contact with the respective electrode layers, the other portion is characterized in that the so as not to contact the respective pair of electrode layers, the pair of electrode layers and the strip-like heating resistor layer is formed head.
前記一対の電極層の前記帯状の発熱抵抗体層側の端縁から、該帯状の発熱抵抗体層と反対側に向けて前記電極層が除去された凹部が形成され、該凹部の底部が前記帯状の発熱抵抗体に被覆されないで露出するように前記帯状の発熱抵抗体層が前記一対の電極層と重ねて設けられてなる請求項1に記載の加熱ヘッド。 A concave portion is formed by removing the electrode layer from an edge of the pair of electrode layers on the belt-like heating resistor layer side toward the opposite side of the belt-like heating resistor layer, and the bottom of the concave portion is strip the strip heating head of claim 1 heating resistor layer ing provided to overlap with the pair of electrode layers so as to expose not covered in heating resistor. 前記帯状の発熱抵抗体層の両端部と、前記一対の電極層とのそれぞれにおける接触部における前記一対の電極層の幅が、前記帯状の発熱抵抗体層の端縁の幅より小さくなるように前記帯状の発熱抵抗体層が前記一対の電極層と重ねて設けられてなる請求項1又は2に記載の加熱ヘッド。 The width of the pair of electrode layers at the contact portion between both ends of the belt-shaped heating resistor layer and the pair of electrode layers is smaller than the width of the edge of the belt-shaped heating resistor layer. the strip heating head according to claim 1 or 2 heating resistor layer ing provided to overlap with the pair of electrode layers.
JP2005232186A 2005-08-10 2005-08-10 Heating head Expired - Fee Related JP4555191B2 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59107243U (en) * 1983-01-08 1984-07-19 アルプス電気株式会社 Thermal head heating resistor
JPH02186585A (en) * 1988-11-22 1990-07-20 Toshiba Lighting & Technol Corp Heating body
JPH0521136A (en) * 1991-07-12 1993-01-29 Toshiba Lighting & Technol Corp Ceramic heater
JPH0745358A (en) * 1993-07-30 1995-02-14 Toshiba Lighting & Technol Corp Heating body and manufacture of heating body thereof
JPH07266595A (en) * 1994-03-29 1995-10-17 Rohm Co Ltd Thermal head and its manufacture
JP2000246935A (en) * 1999-02-26 2000-09-12 Kyocera Corp Thermal head

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59107243U (en) * 1983-01-08 1984-07-19 アルプス電気株式会社 Thermal head heating resistor
JPH02186585A (en) * 1988-11-22 1990-07-20 Toshiba Lighting & Technol Corp Heating body
JPH0521136A (en) * 1991-07-12 1993-01-29 Toshiba Lighting & Technol Corp Ceramic heater
JPH0745358A (en) * 1993-07-30 1995-02-14 Toshiba Lighting & Technol Corp Heating body and manufacture of heating body thereof
JPH07266595A (en) * 1994-03-29 1995-10-17 Rohm Co Ltd Thermal head and its manufacture
JP2000246935A (en) * 1999-02-26 2000-09-12 Kyocera Corp Thermal head

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