JP4539859B2 - Flexible circuit board and electronic device using the flexible circuit board - Google Patents

Flexible circuit board and electronic device using the flexible circuit board Download PDF

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JP4539859B2
JP4539859B2 JP2005314766A JP2005314766A JP4539859B2 JP 4539859 B2 JP4539859 B2 JP 4539859B2 JP 2005314766 A JP2005314766 A JP 2005314766A JP 2005314766 A JP2005314766 A JP 2005314766A JP 4539859 B2 JP4539859 B2 JP 4539859B2
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circuit board
flexible circuit
casing
electronic device
bent
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JP2007123610A (en
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仁司 樫尾
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Sharp Corp
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Description

本発明は、2つの筐体がヒンジ部により回転可能に連結された電子機器においてそれら2つの筐体内の回路間を接続するフレキシブル回路基板と、そのフレキシブル回路基板を用いた電子機器に関する。   The present invention relates to a flexible circuit board for connecting circuits in two casings in an electronic apparatus in which two casings are rotatably connected by a hinge portion, and an electronic apparatus using the flexible circuit board.

例えば、折り畳み構造をなす携帯電話機や携帯情報端末に代表される折り畳み型の電子機器では、図12に示すように、第1および第2の筐体101,102がヒンジ部103により回転可能に連結された構造となっている。   For example, in a foldable electronic device typified by a cellular phone or a portable information terminal having a foldable structure, as shown in FIG. It has a structured.

この電子機器において、第1および第2の筐体のそれぞれに設けられた回路201,202同士の電気的接続には、図13(A)に示すような略クランク状のフレキシブル回路基板203が使用されている。   In this electronic apparatus, a substantially crank-shaped flexible circuit board 203 as shown in FIG. 13A is used for electrical connection between the circuits 201 and 202 provided in the first and second casings, respectively. Has been.

この場合のフレキシブル回路基板203は、図13(B)および図13(C)に示すように、その中央部がヒンジ部103内でループ状に1巻きされ、またその両端がそれぞれ第1および第2の筐体101,102内の各回路201,202へ接続される。   In this case, as shown in FIGS. 13B and 13C, the flexible circuit board 203 has a central portion wound in a loop in the hinge portion 103, and both ends thereof are first and first, respectively. 2 are connected to the circuits 201 and 202 in the two casings 101 and 102.

これにより、フレキシブル回路基板203は、電子機器の回転に伴って、ヒンジ部103のループ位置で屈曲し、フレキシブル回路基板203に加わる引っ張りやたるみをヒンジ部103内に吸収することができる。(例えば、特許文献1、特許文献2参照)
特許2821333号公報 特開2005−142425号公報
As a result, the flexible circuit board 203 can be bent at the loop position of the hinge part 103 as the electronic device rotates, and the tension and slack applied to the flexible circuit board 203 can be absorbed into the hinge part 103. (For example, see Patent Document 1 and Patent Document 2)
Japanese Patent No. 2821333 JP 2005-142425 A

しかしながら、前述した従来の構造の電子機器(図12参照)では、フレキシブル回路基板203をヒンジ部103内でループ状に1巻きするため、その電子機器の組み立て工程が複雑であった。   However, in the electronic device having the above-described conventional structure (see FIG. 12), the flexible circuit board 203 is wound once in a loop shape within the hinge portion 103, so that the assembly process of the electronic device is complicated.

また、従来の電子機器の構造(図12参照)によれば、電子機器の開閉に伴うフレキシブル回路基板203の屈曲動作は、電子機器が180度開けられた状態で、フレキシブル回路基板の中央部分がヒンジ部103内でループ状に一回巻かれた状態となり(図14(C)参照)、電子機器が閉じられるにつれて、そのフレキシブル回路基板203の中央部分が更に屈曲し(図14(B)参照)、電子機器が完全に閉じられると、フレキシブル回路基板203の中央部分がループ状に一回半巻かれた状態となる(図14(A)参照)。このため、フレキシブル回路基板203には、電子機器が180度開かれた状態で応力が発生しており、また、その応力は複雑であった。   Further, according to the structure of the conventional electronic device (see FIG. 12), the bending operation of the flexible circuit board 203 accompanying the opening and closing of the electronic device is such that the central portion of the flexible circuit board is in a state where the electronic device is opened 180 degrees. The hinge 103 is wound once in a loop (see FIG. 14C), and as the electronic device is closed, the central portion of the flexible circuit board 203 is further bent (see FIG. 14B). ) When the electronic device is completely closed, the central portion of the flexible circuit board 203 is wound once and a half in a loop shape (see FIG. 14A). For this reason, stress is generated in the flexible circuit board 203 when the electronic device is opened 180 degrees, and the stress is complicated.

また、電子機器が閉じられるにつれて応力は増大し、また、その応力は複雑になった。   In addition, the stress increased as the electronic device was closed, and the stress became complicated.

更に、フレキシブル回路基板のループ部分301をヒンジ部103の内径内に収めなければならない構造となっているため、折り畳み式携帯電話のような小型の電子機器では、そのフレキシブル回路基板203のループ部分301の屈曲半径が小さくならざるを得ず、このためより大きな応力が発生する。   Further, since the loop portion 301 of the flexible circuit board must be accommodated within the inner diameter of the hinge portion 103, the loop portion 301 of the flexible circuit board 203 is used in a small electronic device such as a foldable mobile phone. Therefore, the bending radius must be small, and a larger stress is generated.

このように、図12に示す従来の構造の電子機器においては、電子機器の度重なる回転動作によりフレキシブル回路基板203が繰り返し曲げ伸ばしされて大きな応力が幾度も発生してしまうため、フレキシブル回路基板の配線パターンが損傷し、断線し易いといった問題があった。   As described above, in the electronic device having the conventional structure shown in FIG. 12, the flexible circuit board 203 is repeatedly bent and stretched due to repeated rotations of the electronic equipment, and a large stress is generated several times. There was a problem that the wiring pattern was damaged and was easily disconnected.

そこで従来、例えば図15乃至図17に示すように、フレキシブル回路基板の屈曲部分にあっては、配線パターンを回路基板の片面にのみ形成することにより、上記したような応力による配線パターンの損傷や断線が極力発生しないように図っていた。   Conventionally, for example, as shown in FIGS. 15 to 17, in the bent portion of the flexible circuit board, the wiring pattern is formed only on one surface of the circuit board, so that the damage of the wiring pattern due to the stress as described above can be reduced. We tried to prevent disconnection as much as possible.

すなわち、図15に示す例は、ベースフィルム113の片面に導体層112が積層されたフレキシブル基材に配線パターンを形成し、その上に接着剤を塗布したカバーレイフィルム111を張り合わせて配線パターンを保護した構造の片面フレキシブル回路基板である。   That is, in the example shown in FIG. 15, a wiring pattern is formed on a flexible base material in which a conductor layer 112 is laminated on one side of a base film 113, and a coverlay film 111 coated with an adhesive is laminated thereon to form a wiring pattern. It is a single-sided flexible circuit board with a protected structure.

また、図16に示す例は、ベースフィルム113の両面に導体層112が積層された両面フレキシブル基材に屈曲部分となる領域の配線パターンを一層とした回路を形成し、各配線パターンの上に接着剤を塗布したカバーレイフィルム111を張り合わせて配線パターンを保護した構造の両面フレキシブル回路基板である。   Further, in the example shown in FIG. 16, a circuit in which a wiring pattern in a region to be a bent portion is formed on a double-sided flexible base material in which a conductor layer 112 is laminated on both surfaces of a base film 113 is formed on each wiring pattern. This is a double-sided flexible circuit board having a structure in which a wiring pattern is protected by laminating a cover lay film 111 coated with an adhesive.

さらに、図17に示す例は、ベースフィルム113の両面に導体層112が積層された両面フレキシブル基材に屈曲部分となる領域の配線パターンを一層とした回路を形成し、各配線パターンの上に接着剤を塗布したカバーレイフィルム111を張り合わせたのち、更に、両面にプリプレグ114、導体層112を積層して回路を形成してから、ソルダレジスト115を形成した構造の4層フレキシブル回路基板である。   Further, in the example shown in FIG. 17, a circuit in which a wiring pattern of a region to be a bent portion is formed on a double-sided flexible base material in which a conductor layer 112 is laminated on both sides of a base film 113 is formed on each wiring pattern. A four-layer flexible circuit board having a structure in which a solder resist 115 is formed after a cover lay film 111 coated with an adhesive is laminated and a circuit is formed by further laminating a prepreg 114 and a conductor layer 112 on both sides. .

このように、屈曲部分の配線を1層にして、フレキシブル回路基板の屈曲性能を向上させていた。   As described above, the bending portion of the wiring is formed in one layer to improve the bending performance of the flexible circuit board.

しかしながら、これらの屈曲性能を向上させるための手段はいずれも、フレキシブル回路基板の片面のみにしか配線がなされないため、回路配線が精細になり、経済効率が悪い。また、片面のみにしか配線がなされないため、回路配線の本数に制約があり、機器の機能向上が進む昨今においては、十分な配線本数を満たすことができない。更に、両面フレキシブル回路基板を用いた上記2つの例では、屈曲部分(ループ部分301)の構成材料を除去する必要があり、経済効率が悪い、といった問題があった。   However, since all of these means for improving the bending performance are wired only on one side of the flexible circuit board, the circuit wiring becomes fine and the economic efficiency is poor. In addition, since wiring is performed only on one side, the number of circuit wirings is limited, and in recent years when the function of a device is being improved, a sufficient number of wirings cannot be satisfied. Further, in the above two examples using the double-sided flexible circuit board, there is a problem that it is necessary to remove the constituent material of the bent portion (loop portion 301) and the economic efficiency is poor.

そこで本発明は、上記課題を解決するためになされたものであり、その目的は、ヒンジ部により第1および第2の筐体同士が回転可能に連結され、これら第1および第2の筐体内の回路同士がフレキシブル回路基板により電気的に接続された電子機器において、筐体同士が回転する際に発生する応力を従来のものより大幅に小さくできるフレキシブル回路基板およびそれを用いた耐久性の高い電子機器を提供することにある。   Therefore, the present invention has been made in order to solve the above-described problems, and an object of the present invention is to connect the first and second housings so as to be rotatable by a hinge portion, and the inside of the first and second housings. In an electronic device in which the circuits are electrically connected by a flexible circuit board, a flexible circuit board that can significantly reduce the stress generated when the casings rotate to each other and a highly durable circuit using the same To provide electronic equipment.

上記課題を解決するため、本発明に係るフレキシブル回路基板は、ヒンジ部により回転可能に連結された第1および第2の筐体内の回路同士を接続するフレキシブル回路基板であって、前記ヒンジ部内へ挿入され、前記ヒンジ部の回転軸に沿って延び、前記回転軸に直交する3つ以上の直交部分と前記回転軸に平行な4つ以上の平行部分とを有し、前記第1および第2の筐体が回転する際、前記直交部分で屈曲される屈曲片とこの屈曲片の一端に接続され、前記第1の筐体内へ延在されて第1の筐体内の回路へ接続される第1の接続片と、前記屈曲片の他端に接続され、前記第2の筐体内へ延在されて第2の筐体内の回路へ接続される第2の接続片とからなり、前記第1の筐体と前記第2の筐体とのなす角度が90度の時にフラットな状態となるように前記第1の筐体内の回路及び前記第2の筐体内の回路に接続されることを特徴とする。 In order to solve the above-mentioned problems, a flexible circuit board according to the present invention is a flexible circuit board that connects circuits in first and second casings that are rotatably connected by a hinge part , into the hinge part . is inserted, extends along the rotation axis of the hinge portion, and four or more parallel portions parallel three or more orthogonal portion that is orthogonal to the rotary shaft and the rotary shaft, the first and second when the housing is rotated, the bent piece is bent in the orthogonal part, is connected to one end of the bent piece, it is connected to extend into the first housing to the first housing of the circuit A first connection piece and a second connection piece connected to the other end of the bent piece, extending into the second housing and connected to a circuit in the second housing , A flat state when the angle between the first housing and the second housing is 90 degrees Said being connected to the first enclosure of the circuit and the second housing of the circuit so that said.

このような特徴を有するフレキシブル回路基板は、第1および第2の筐体の回転に伴って、屈曲片における前記ヒンジ部の回転軸と交差する複数の箇所がそれぞれ独立して屈曲する。これによって、フレキシブル回路基板の屈曲はそれらの屈曲箇所(前記ヒンジ部の回転軸と交差する箇所)で同時多発的に行われることとなり、その結果第1および第2の筐体の回転に伴って生じる応力を小さくすることができる。   In the flexible circuit board having such a feature, a plurality of portions that intersect the rotation axis of the hinge portion in the bent piece are independently bent as the first and second casings are rotated. As a result, the flexible circuit board is bent at the bent portions (locations intersecting the rotation axis of the hinge portion) simultaneously, and as a result, the first and second casings are rotated. The generated stress can be reduced.

また、本発明に係るフレキシブル回路基板よれば、前記屈曲片の少なくとも一側部を前記ヒンジ部の外側に突出するように構成すると、屈曲時にフレキシブル回路基板に発生する応力をより一層小さくすることができる。 Further, according the flexible circuit board according to the present invention, constitutes at least one side of the bent piece so as to protrude outwardly of the hinge Then, be further reduced stress generated in the flexible circuit board at the time of bending it can.

前記ヒンジ部の回転軸に交差する部分は、フレキシブル回路基板の屈曲時、一端を中心に他端が回転移動してその両端の間が屈曲される。この両端の間の距離が長くなるように、屈曲片の幅を、屈曲片の少なくとも一側部が前記ヒンジ部の外側に突出する寸法とすることで、前記回転移動の際の回転角度は小さくなる。よって、屈曲半径は大きくなり、発生する応力を減少させることができる。   When the flexible circuit board is bent, the other portion of the hinge portion intersecting the rotation axis is rotated about the one end and bent between the two ends. The width of the bent piece is set such that at least one side portion of the bent piece protrudes outside the hinge portion so that the distance between both ends becomes longer, so that the rotation angle at the time of the rotational movement is small. Become. Therefore, the bending radius increases and the generated stress can be reduced.

また、本発明に係るフレキシブル回路基板は、少なくとも前記屈曲片が弾性部材により補強されたことを特徴とする。   The flexible circuit board according to the present invention is characterized in that at least the bent piece is reinforced by an elastic member.

更に、前記第1及び第2の接続片と屈曲片とが弾性部材により補強されたことを特徴とする。   Further, the first and second connecting pieces and the bent piece are reinforced by an elastic member.

このように、前記フレキシブル回路基板の弾力を補強することにより、屈曲時の弾性変形が不規則になるのを防止できる。   Thus, by reinforcing the elasticity of the flexible circuit board, it is possible to prevent the elastic deformation at the time of bending from becoming irregular.

この際、前記弾力部材に、薄い材料を使用すると、屈曲時に生じる内側と外側の周差による屈曲性への影響を軽減させることができる。   At this time, if a thin material is used for the elastic member, it is possible to reduce the influence on the bendability due to the difference between the inner and outer circumferences that occurs during bending.

更に、本発明に係るフレキシブル回路基板よれば、前記弾性部材の少なくとも一端を自由端とすると、屈曲時に生じる内側と外側の周差による屈曲性への影響を少なくすることができる。   Furthermore, according to the flexible circuit board of the present invention, if at least one end of the elastic member is a free end, the influence on the bendability due to the circumferential difference between the inner side and the outer side that occurs during bending can be reduced.

また、本発明に係るフレキシブル回路基板によれば、前記弾性部材に、導体材料を使用し、更に、前記弾性部材をそのフレキシブル回路基板に接地させると、シールドを形成することができる。   In addition, according to the flexible circuit board of the present invention, when a conductive material is used for the elastic member and the elastic member is grounded to the flexible circuit board, a shield can be formed.

本発明によれば、従来のものとは異なり、フレキシブル回路基板をヒンジ部内でループ状に巻くことがないため、電子機器の組み立て工程が簡素化され、経済効率よく電子機器を生産することができる。   According to the present invention, unlike the conventional one, since the flexible circuit board is not wound in a loop shape within the hinge portion, the assembly process of the electronic device is simplified, and the electronic device can be produced economically. .

また、本発明に係るフレキシブル回路基板は、複数の箇所で独立して屈曲が生じるため、発生する応力が分散される。更にそれらの屈曲の屈曲半径は大きく、発生する応力は従来のフレキシブル回路基板と比べて小さくなる。よって、屈曲に対する耐久性は高い。   Moreover, since the flexible circuit board according to the present invention bends independently at a plurality of locations, the generated stress is dispersed. Furthermore, the bending radius of those bendings is large, and the generated stress is smaller than that of the conventional flexible circuit board. Therefore, durability against bending is high.

更に、本発明に係る電子機器およびフレキシブル回路基板によれば、前述のとおり、生じる応力が小さいため、基板の両面に配線パターンを形成しても、配線パターンの損傷や断線が生じにくく、電子機器の屈曲に対する耐久性を維持することが可能であり、また配線パターンを精細にすることなく、十分な配線本数を確保することでき、経済性および生産性に優れている。   Furthermore, according to the electronic device and the flexible circuit board according to the present invention, as described above, since the generated stress is small, even if the wiring pattern is formed on both sides of the substrate, the wiring pattern is hardly damaged or disconnected, and the electronic device It is possible to maintain durability against bending, and it is possible to secure a sufficient number of wirings without making the wiring pattern fine, which is excellent in economic efficiency and productivity.

以下、本発明の実施形態について図面を参照して説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図1は、本発明に係る電子機器の一実施形態を示す要部概略断面図、図2は、他の実施形態を示す要部概略断面図である。   FIG. 1 is a main part schematic cross-sectional view showing an embodiment of an electronic apparatus according to the present invention, and FIG. 2 is a main part schematic cross-sectional view showing another embodiment.

電子機器は、図1および図2に示すように、ヒンジ部13により、第1の筐体11と第2の筐体12とが回転可能に連結され、更に、第1の筐体11に内蔵されている第1の回路基板21と第2の筐体12に内蔵されている第2の回路基板22とが、フレキシブル回路基板23により接続された構造となっている。また、フレキシブル回路基板23の両先端には、それぞれコネクタ接続部24,25が取り付けられ、それらコネクタ接続部24,25が第1の回路基板21と第2の回路基板22にそれぞれ接続されている。   As shown in FIGS. 1 and 2, in the electronic device, the first housing 11 and the second housing 12 are rotatably connected by the hinge portion 13, and are further incorporated in the first housing 11. The first circuit board 21 and the second circuit board 22 built in the second housing 12 are connected by a flexible circuit board 23. Further, connector connecting portions 24 and 25 are respectively attached to both ends of the flexible circuit board 23, and the connector connecting sections 24 and 25 are connected to the first circuit board 21 and the second circuit board 22, respectively. .

以下、各部について詳述する。   Hereinafter, each part is explained in full detail.

図3(A)は、電子機器に組み込む前の状態のフレキシブル回路基板23を示す正面図、図3(B)は、電子機器に組み込まれた状態のフレキシブル回路基板23を示す正面図、図3(C)は、電子機器に組み込まれた状態のフレキシブル回路基板23を示す側面図である。   3A is a front view showing the flexible circuit board 23 in a state before being incorporated in an electronic device, and FIG. 3B is a front view showing the flexible circuit board 23 in a state in which it is incorporated in an electronic device. (C) is a side view which shows the flexible circuit board 23 of the state integrated in the electronic device.

上記フレキシブル回路基板23は、図3(A)に示されるように、前記ヒンジ部13内へ挿入され、ヒンジ部13の回転軸70に沿ってジグザグ形状に延びる屈曲片53とこの屈曲片の一端に接続され、第1の筐体11内へ延在されて第1の筐体内の回路へ接続される第1の接続片51と、屈曲片53の他端に接続され、第2の筐体12内へ延在されて第2の筐体内の回路へ接続される第2の接続片52とからなる。   As shown in FIG. 3A, the flexible circuit board 23 is inserted into the hinge portion 13 and extends in a zigzag shape along the rotation axis 70 of the hinge portion 13 and one end of the bent piece. A first connection piece 51 that is connected to the first casing 11 and connected to a circuit in the first casing 11, and is connected to the other end of the bent piece 53. 12 and a second connection piece 52 that extends into the circuit 12 and is connected to a circuit in the second housing.

前記ジグザグ形状は、図3(A)に示すようなクランク状に2回以上折り返した形状でも、図4に示すような稲妻状に2回以上折り返した形状でもよい。   The zigzag shape may be a shape that is folded twice or more in a crank shape as shown in FIG. 3A, or a shape that is folded twice or more in a lightning bolt shape as shown in FIG.

図3(A)および図3(B)に示すように、フレキシブル回路基板23の屈曲片53の形状は、ヒンジ部の回転軸に沿ってクランク状に2回折り返してなるジグザグ形状であり、回転軸70に直交する3つの直交部分41,42,43と、2つの折り返し部分31,32を含む回転軸70に平行な4つの平行部分31,32,33,34とを有する。そのフレキシブル回路基板23は、第1および第2の筐体11,12が回転する際、それら直交部分41,42,43各々で屈曲する。   As shown in FIGS. 3A and 3B, the shape of the bent piece 53 of the flexible circuit board 23 is a zigzag shape that is folded twice in a crank shape along the rotation axis of the hinge portion. It has three orthogonal portions 41, 42, 43 orthogonal to the shaft 70, and four parallel portions 31, 32, 33, 34 parallel to the rotating shaft 70 including the two folded portions 31, 32. The flexible circuit board 23 is bent at each of the orthogonal portions 41, 42, 43 when the first and second casings 11, 12 rotate.

なお、本実施例におけるフレキシブル回路基板の屈曲片53の形状は、回転軸70に直行するようにクランク状に2回折り返したジグザグ形状(図3(A)参照)としているが、回転軸70に直交していなくても、回転軸70に交差して、第1および第2の筐体11,12の回転時に屈曲するのであれば、図4に示すように回転軸70に直交していなくてもよい。また、折り返しの回数も2回以上であればよい。   The bent piece 53 of the flexible circuit board in this embodiment has a zigzag shape (see FIG. 3A) that is folded back twice into a crank shape so as to be orthogonal to the rotation shaft 70. Even if it is not orthogonal, if it intersects the rotation axis 70 and bends when the first and second casings 11 and 12 are rotated, it is not orthogonal to the rotation axis 70 as shown in FIG. Also good. Further, the number of times of folding may be two or more.

上記の実施形態では、屈曲片53の幅は、ヒンジ部13の内径寸法よりもやや短い寸法としているが(図2および図3参照)、これに限らず屈曲片53の少なくとも一側部がヒンジ部13の外側に突出する寸法に設定されていてもよい(図1および図6(A)参照)。   In the above-described embodiment, the width of the bent piece 53 is slightly shorter than the inner diameter of the hinge portion 13 (see FIGS. 2 and 3), but not limited to this, at least one side portion of the bent piece 53 is a hinge. The dimension may be set so as to protrude to the outside of the portion 13 (see FIGS. 1 and 6A).

この実施形態に係るフレキシブル回路基板23によれば、第1の筐体11を第2の筐体12に対して半分開いた時にフレキシブル回路基板23が屈曲のないフラットな状態となるように、電子機器へフレキシブル回路基板23を取り付ける(図1参照)と、筐体11,12の回転に伴うフレキシブル回路基板23の屈曲を小さく抑えることができる。   According to the flexible circuit board 23 according to this embodiment, when the first casing 11 is half opened with respect to the second casing 12, the flexible circuit board 23 is in a flat state without bending. When the flexible circuit board 23 is attached to the device (see FIG. 1), bending of the flexible circuit board 23 accompanying the rotation of the casings 11 and 12 can be suppressed to a small value.

従って、最大180度開くことが可能な電子機器においては、第1の筐体11を第2の筐体12に対して90度開いた状態で、フレキシブル回路基板23がフラットな状態となるようにフレキシブル回路基板23を取り付ける(図3(C)参照)と電子機器の回転に伴うフレキシブル回路基板23の屈曲を小さく抑えることができる。   Therefore, in an electronic device that can be opened up to 180 degrees, the flexible circuit board 23 is in a flat state with the first casing 11 opened 90 degrees with respect to the second casing 12. When the flexible circuit board 23 is attached (see FIG. 3C), bending of the flexible circuit board 23 accompanying the rotation of the electronic device can be suppressed to a low level.

ここで上記したフレキシブル回路基板23の屈曲動作について図5を参照して説明する。   Here, the bending operation of the flexible circuit board 23 will be described with reference to FIG.

第1の筐体11を第2の筐体12に対して90度開いた時は、フレキシブル回路基板23は屈曲せず(図5(B)参照)、電子機器に組み込まれる前の形態(図3(A)参照)を維持する。   When the first housing 11 is opened 90 degrees with respect to the second housing 12, the flexible circuit board 23 does not bend (see FIG. 5B), and is a form before being incorporated into an electronic device (see FIG. 5). 3 (A)) is maintained.

次に、第1の筐体11を第2の筐体に対してさらに90度開いて完全に開いた状態、つまり第1の筐体11と第2の筐体との角度を180度とした時、フレキシブル回路基板23は、屈曲片53における3つの直交部分41,42,43で屈曲する(図5(C)参照)。つまりこの状態では、ジグザグ形状の折り返し部分の一方31に直交する2つの直交部分41,42は、その折り返し部分31に対して互いに対称方向に屈曲し、同様に、もう一方のジグザグ形状の折り返し部分32に直交する2つの直交部分42,43は、そのもう一方の折り返し部分32に対して互いに対称方向に屈曲することとなる。 Next, the first housing 11 is further opened 90 degrees with respect to the second housing and is fully opened, that is, the angle between the first housing 11 and the second housing is 180 degrees. At this time, the flexible circuit board 23 bends at the three orthogonal portions 41, 42, and 43 in the bent piece 53 (see FIG. 5C). That is, in this state, the two orthogonal portions 41 and 42 orthogonal to one of the zigzag folded portions 31 bend in a symmetric direction with respect to the folded portion 31, and similarly, the other zigzag folded portion. The two orthogonal portions 42 and 43 orthogonal to 32 are bent in a symmetric direction with respect to the other folded portion 32.

今度は上記とは逆に第1の筐体11と第2の筐体12とを完全に閉じた状態とした時には、フレキシブル回路基板23は、屈曲片53の3つの直交部分41,42,43で、上記した180度開いた時とは逆方向に屈曲する(図5(A)参照)。つまりこの状態では、折り返し部分31の一方に直交する2つの直交部分41,42は、その折り返し部分31に対して対称方向に屈曲し、同様に、もう一方の折り返し部分32に直行する2つの直交部分42,43は、そのもう一方の折り返し部分32に対して対称方向に屈曲する。 In contrast to the above, when the first casing 11 and the second casing 12 are completely closed, the flexible circuit board 23 has three orthogonal portions 41, 42, 43 of the bent piece 53. Thus, it bends in the opposite direction to that when it is opened 180 degrees (see FIG. 5A). That is, in this state, the two orthogonal portions 41, 42 perpendicular to one of the folded portion 31 is bent symmetrically direction with respect to the folded portion 31, likewise, the two orthogonal to the other folded portion 32 perpendicular The portions 42 and 43 are bent in a symmetric direction with respect to the other folded portion 32.

以上のように、第1の筐体11を第2の筐体12に対して90度開いた時、フレキシブル回路基板23は屈曲せず、第1の筐体11と第2の筐体12とを完全に閉じた時のフレキシブル回路基板23の屈曲形状(図5(A)参照)と、両筐体11,12を完全に開いた時(両筐体11,12のなす角度が180度となる時)のフレキシブル回路基板23の屈曲形状(図5(C)参照)は、互いに左右対称の関係となる。   As described above, when the first casing 11 is opened 90 degrees with respect to the second casing 12, the flexible circuit board 23 is not bent, and the first casing 11 and the second casing 12 are not bent. When the flexible circuit board 23 is completely closed (see FIG. 5A) and when both the casings 11 and 12 are fully opened (the angle between the casings 11 and 12 is 180 degrees). The bent shape (see FIG. 5C) of the flexible circuit board 23 is symmetrical to each other.

ここで、フレキシブル回路基板23がフラットで屈曲していない状態(図3(C)参照)を起点に左右同角度に屈曲するように電子機器にこのフレキシブル回路基板23を取り付けると、フレキシブル回路基板23の屈曲は最小限に抑えられ、よってフレキシブル回路基板23に発生する応力も小さく抑えられる。   Here, when the flexible circuit board 23 is attached to an electronic device so that the flexible circuit board 23 is bent at the same left and right angles starting from a state where the flexible circuit board 23 is flat and not bent (see FIG. 3C), the flexible circuit board 23 is attached. Therefore, the stress generated in the flexible circuit board 23 can be kept small.

また、屈曲片53の幅を、その屈曲片の少なくとも一側部がヒンジ部13の外側に突出する寸法にして設定した場合(図1、図6参照)では、屈曲片53の両側部がヒンジ部13の内側に収まる寸法にしたフレキシブル回路基板(図2、図7参照)と比べて、直交部分41,42,43の長さが長く、前述の屈曲動作における屈曲半径が長いため、屈曲はより小さくなり、フレキシブル回路基板23に発生する応力が小さくなる。   Further, when the width of the bent piece 53 is set so that at least one side of the bent piece protrudes outside the hinge portion 13 (see FIGS. 1 and 6), both sides of the bent piece 53 are hinged. Compared with a flexible circuit board (see FIGS. 2 and 7) sized to fit inside the portion 13, the length of the orthogonal portions 41, 42, 43 is long, and the bending radius in the bending operation described above is long. As a result, the stress generated in the flexible circuit board 23 is reduced.

図1及び図6に示すように、フレキシブル回路基板23の両先端には、コネクタ接続部24,25が取り付けられ、これらコネクタ接続部24,25を介して、第1の筐体11と第2の筐体12内の回路基板21,22にフレキシブル回路基板23が接続される。   As shown in FIGS. 1 and 6, connector connecting portions 24 and 25 are attached to both ends of the flexible circuit board 23, and the first casing 11 and the second housing are connected to each other via the connector connecting portions 24 and 25. The flexible circuit board 23 is connected to the circuit boards 21 and 22 in the casing 12.

更に、図8に示すように、フレキシブル回路基板23の第1及び第2の接続片51,52と屈曲片53とを弾性部材26,27にて、このフレキシブル回路基板の両面より補強してもよい。   Further, as shown in FIG. 8, even if the first and second connection pieces 51 and 52 and the bent piece 53 of the flexible circuit board 23 are reinforced by elastic members 26 and 27 from both sides of the flexible circuit board. Good.

このように、フレキシブル回路基板23の弾力を補強することにより、屈曲時の弾性変形を正確に繰り返すことができる。   In this way, by reinforcing the elasticity of the flexible circuit board 23, the elastic deformation at the time of bending can be accurately repeated.

屈曲時に生じる内側と外側の周差による屈曲性への影響を軽減させるために、弾力部材26,27には、200μm以下の薄い材料を使用することが好ましい。   In order to reduce the influence on the bendability due to the difference between the inner and outer circumferences that occurs during bending, it is preferable to use a thin material of 200 μm or less for the elastic members 26 and 27.

また、弾力部材26,27の少なくとも一端が自由端となるように、弾力部材26,27の一端のみをフレキシブル回路基板23にビス固定28(図8参照)して取り付けてもよい。   Further, only one end of each of the elastic members 26 and 27 may be attached to the flexible circuit board 23 by screw fixing 28 (see FIG. 8) so that at least one end of the elastic members 26 and 27 becomes a free end.

これにより、屈曲時に生じる内側と外側の周差による屈曲性への影響を、ビス固定された箇所28に吸収させることができる。   As a result, the influence on the flexibility due to the difference between the inner and outer circumferences generated during bending can be absorbed by the screw-fixed portion 28.

更に、弾性部材26,27に、金属材料等の導体材料を使用し、フレキシブル回路基板23に弾性部材26,27を接地させると、シールドを形成することができる。   Further, when a conductive material such as a metal material is used for the elastic members 26 and 27 and the elastic members 26 and 27 are grounded to the flexible circuit board 23, a shield can be formed.

上記のようになる電子機器では、屈曲時に発生する応力が小さいため、フィルムベースの両面に導体層が積層された両面フレキシブル回路基板23の両面に配線パターンを形成した(図9〜図11参照)場合にも、十分な耐屈曲性能を確保することができる。   In the electronic device as described above, since the stress generated at the time of bending is small, wiring patterns are formed on both sides of the double-sided flexible circuit board 23 in which the conductor layers are laminated on both sides of the film base (see FIGS. 9 to 11). Even in this case, sufficient bending resistance can be ensured.

図9に示すものは、ポリイミドからなる厚さ12.5μmのフィルムベース63の両面に、12μmの厚さの銅箔からなる導体層62を積層した両面フレキシブル基材60を得て、この両面フレキシブル基材60に配線パターンを形成し、各配線パターンの上に接着剤を塗布したカバーレイフィルム61を張り合わせた構造の両面フレキシブル回路基板であって、回転軸70と交差する部分においても基板両面に配線パターンを確保している。   9 shows a double-sided flexible base material 60 in which a conductor layer 62 made of a 12 μm-thick copper foil is laminated on both sides of a 12.5 μm-thick film base 63 made of polyimide. A double-sided flexible circuit board having a structure in which a wiring pattern is formed on a base material 60 and a cover lay film 61 coated with an adhesive is laminated on each wiring pattern. A wiring pattern is secured.

上記図9に示した例では2層の両面フレキシブル回路基板を使用したが、4層フレキシブル回路基板のうち、内側2層に配線パターンを施してもよい。すなわち、図10に示すものは、厚さ12.5μmのポリイミドからなるフィルムベース63の両面に、厚さ12μmの銅箔からなる導体層62を積層した両面フレキシブル基材60を得て、この両面フレキシブル基材60の両面に、25μmの厚さのプリプレグ64を介して厚さ12μmの銅箔からなる導体層62を積層して回路を形成し、更にソルダレジスト65を形成した構造の4層フレキシブル回路基板23を使用し、この両面フレキシブル回路基板23の、回転軸70との直交部分の構成材料を除去せずに、内側の2層に配線したものである。   In the example shown in FIG. 9, a two-layer double-sided flexible circuit board is used, but a wiring pattern may be applied to the inner two layers of the four-layer flexible circuit board. That is, the one shown in FIG. 10 is obtained by obtaining a double-sided flexible base material 60 in which a conductor layer 62 made of 12 μm thick copper foil is laminated on both sides of a film base 63 made of polyimide having a thickness of 12.5 μm. A four-layer flexible structure having a structure in which a conductor layer 62 made of copper foil having a thickness of 12 μm is laminated on both surfaces of a flexible substrate 60 via a prepreg 64 having a thickness of 25 μm, and a solder resist 65 is further formed. The circuit board 23 is used, and the double-sided flexible circuit board 23 is wired in the inner two layers without removing the constituent material of the part orthogonal to the rotating shaft 70.

また、図11に示すものは、厚さ12.5μmのポリイミドからなるフィルムベース63の両面に、厚さ12μm銅箔からなる導体層62を積層した両面フレキシブル基材60を得て、この両面フレキシブル基材60の両面に、厚さ30μmのビルドアップ樹脂66を介して18μmの厚さの銅箔からなる導体層62を積層して回路を形成し、更にソルダレジスト65を形成してビルドアップ層を設けた4層フレキシブル回路基板23を使用し、この両面フレキシブル回路基板23の、回転軸70との直交部分の構成材料を除去せずに、内側の2層に配線したものである。   Further, what is shown in FIG. 11 is to obtain a double-sided flexible base material 60 in which a conductor layer 62 made of 12 μm thick copper foil is laminated on both sides of a film base 63 made of polyimide having a thickness of 12.5 μm. A circuit is formed by laminating a conductive layer 62 made of copper foil having a thickness of 18 μm on both surfaces of the substrate 60 via a build-up resin 66 having a thickness of 30 μm, and a solder resist 65 is further formed to form a build-up layer. A four-layer flexible circuit board 23 provided with a wire is used, and wiring is made on the inner two layers without removing the constituent material of the double-sided flexible circuit board 23 perpendicular to the rotating shaft 70.

本発明に係る電子機器の一実施形態を示す側面図示す要部概略断面図である。It is a principal part schematic sectional drawing which shows the side view which shows one Embodiment of the electronic device which concerns on this invention. 本発明に係る電子機器の他の実施形態を示す要部概略断面図である。It is a principal part schematic sectional drawing which shows other embodiment of the electronic device which concerns on this invention. 本発明に係るフレキシブル回路基板の一実施形態を示し、図3(A)は、電子機器に組み込む前の状態のフレキシブル回路基板を示す正面図、図3(B)は、電子機器に組み込まれた状態のフレキシブル回路基板を示す正面図、図3(C)は、電子機器に組み込まれた状態のフレキシブル回路基板を示す側面図である。1 shows an embodiment of a flexible circuit board according to the present invention, FIG. 3A is a front view showing the flexible circuit board in a state before being incorporated in an electronic device, and FIG. 3B is incorporated in the electronic device. FIG. 3C is a side view showing the flexible circuit board in a state incorporated in an electronic device. 本発明に係るフレキシブル回路基板の他の実施形態を示す正面図である。It is a front view which shows other embodiment of the flexible circuit board based on this invention. 本発明に係るフレキシブル回路基板の屈曲形状を示し、図5(A)は、第1の筐体と第2の筐体を完全に閉じた時のフレキシブル回路基板の屈曲形状を示す側面図、図5(B)は、第1の筐体を第2の筐体に対して90度開いた時のフレキシブル回路基板の形状を示す側面図、図5(C)は、第1の筐体を第2の筐体に対して180度開いた時のフレキシブル回路基板の屈曲形状を示す側面図である。FIG. 5A shows a bent shape of a flexible circuit board according to the present invention, and FIG. 5A is a side view showing the bent shape of the flexible circuit board when the first casing and the second casing are completely closed. FIG. 5B is a side view showing the shape of the flexible circuit board when the first housing is opened 90 degrees with respect to the second housing, and FIG. It is a side view which shows the bending shape of a flexible circuit board when it opens 180 degree | times with respect to 2 housing | casing. 本発明に係るフレキシブル回路基板の他の実施形態を示し、図6(A)は正面図、図6(B)は側面図である。Another embodiment of the flexible circuit board based on this invention is shown, FIG. 6 (A) is a front view, FIG.6 (B) is a side view. 本発明に係るフレキシブル回路基板のさらに他の実施形態を示し、図7(A)は正面図、図7(B)は側面図である。FIG. 7A is a front view and FIG. 7B is a side view of still another embodiment of the flexible circuit board according to the present invention. 本発明に係るフレキシブル回路基板のさらに他の実施形態を示し、図8(A)は分解斜視図、図8(B)は斜視図である。FIG. 8A is an exploded perspective view and FIG. 8B is a perspective view showing still another embodiment of the flexible circuit board according to the present invention. 本発明に係るフレキシブル回路基板の具体例を示す概略断面図である。It is a schematic sectional drawing which shows the specific example of the flexible circuit board based on this invention. 本発明に係るフレキシブル回路基板の他の具体例を示す概略断面図である。It is a schematic sectional drawing which shows the other specific example of the flexible circuit board based on this invention. 本発明に係るフレキシブル回路基板のさらに他の具体例を示す概略断面図である。It is a schematic sectional drawing which shows the other specific example of the flexible circuit board based on this invention. 従来の電子機器のヒンジ部における構造を示す要部概略断面図である。It is a principal part schematic sectional drawing which shows the structure in the hinge part of the conventional electronic device. 従来のフレキシブル回路基板の形状を示し、図13(A)は、電子機器に取り付ける前のフレキシブル回路基板の形状を示す正面図、図13(B)は、電子機器に取り付けた時のフレキシブル回路基板の形状を示す正面図、図13(C)は、電子機器に取り付けた時のフレキシブル回路基板の形状を示す側面図である。FIG. 13A shows a shape of a conventional flexible circuit board, FIG. 13A is a front view showing the shape of the flexible circuit board before being attached to an electronic device, and FIG. 13B is a flexible circuit board when attached to the electronic device. FIG. 13C is a side view showing the shape of the flexible circuit board when attached to the electronic device. 従来の電子機器におけるフレキシブル回路基板の屈曲形状を示し、図14(A)は、第1の筐体と第2の筐体を完全に閉じた時のフレキシブル回路基板の屈曲形状を示す側面図、図14(B)は、第1の筐体を第2の筐体に対して90度開いた時のフレキシブル回路基板の屈曲形状を示す側面図、図14(C)は、第1の筐体を第2の筐体に対して180度開いた時のフレキシブル回路基板の屈曲形状を示す側面図である。FIG. 14A is a side view showing a bent shape of a flexible circuit board when the first casing and the second casing are completely closed; 14B is a side view showing a bent shape of the flexible circuit board when the first housing is opened 90 degrees with respect to the second housing, and FIG. 14C is the first housing. It is a side view which shows the bending shape of a flexible circuit board when this is opened 180 degree | times with respect to the 2nd housing | casing. 従来のフレキシブル回路基板の層構成を示す概略断面図である。It is a schematic sectional drawing which shows the layer structure of the conventional flexible circuit board. 他の従来のフレキシブル回路基板の層構成を示す概略断面図である。It is a schematic sectional drawing which shows the laminated constitution of the other conventional flexible circuit board. さらに他の従来のフレキシブル回路基板の層構成を示す概略断面図である。It is a schematic sectional drawing which shows the laminated constitution of the other conventional flexible circuit board.

符号の説明Explanation of symbols

11 第1の筐体
12 第2の筐体
13 ヒンジ部
21 第1の回路基板
22 第2の回路基板
23 フレキシブル回路基板
24,25 コネクタ接続部
26,27 弾力部材
28 ビス固定
31,32 折り返し部分(平行部分)
33,34 平行部分
41,42,43 直交部分
51 第1の接続片
52 第2の接続片
53 屈曲片
60 両面フレキシブル基材
61 カバーレイフィルム
62 導体層
63 ベースフィルム
64 プリプレグ
65 ソルダレジスト
66 ビルドアップ樹脂
70 回転軸
DESCRIPTION OF SYMBOLS 11 1st housing | casing 12 2nd housing | casing 13 Hinge part 21 1st circuit board 22 2nd circuit board 23 Flexible circuit board 24, 25 Connector connection part 26, 27 Elasticity member 28 Screw fixing 31, 32 Folding part (Parallel part)
33, 34 Parallel portion 41, 42, 43 Orthogonal portion 51 First connection piece 52 Second connection piece 53 Bending piece 60 Double-sided flexible base material 61 Coverlay film 62 Conductor layer 63 Base film 64 Prepreg 65 Solder resist 66 Build-up Resin 70 Rotating shaft

Claims (8)

ヒンジ部により回転可能に連結された第1および第2の筐体内の回路同士を接続するフレキシブル回路基板であって、
前記ヒンジ部内へ挿入され、前記ヒンジ部の回転軸に沿って延び、前記回転軸に直交する3つ以上の直交部分と前記回転軸に平行な4つ以上の平行部分とを有し、前記第1および第2の筐体が回転する際、前記直交部分で屈曲される屈曲片と
この屈曲片の一端に接続され、前記第1の筐体内へ延在されて第1の筐体内の回路へ接続される第1の接続片と、
前記屈曲片の他端に接続され、前記第2の筐体内へ延在されて第2の筐体内の回路へ接続される第2の接続片とからなり、
前記第1の筐体と前記第2の筐体とのなす角度が90度の時にフラットな状態となるように前記第1の筐体内の回路及び前記第2の筐体内の回路に接続される
ことを特徴とするフレキシブル回路基板。
A flexible circuit board for connecting circuits in the first and second casings rotatably connected by a hinge part,
Wherein is inserted into the hinge portion, said extending along the rotation axis of the hinge portion, and four or more parallel portions parallel to the said rotary shaft and three or more orthogonal portion that is orthogonal to the rotation axis, the first A bent piece bent at the orthogonal portion when the first and second casings are rotated ;
A first connecting piece connected to one end of the bent piece, extending into the first casing and connected to a circuit in the first casing;
A second connecting piece connected to the other end of the bent piece, extending into the second casing and connected to a circuit in the second casing ;
The first casing and the second casing are connected to the circuit in the first casing and the circuit in the second casing so as to be in a flat state when the angle between the first casing and the second casing is 90 degrees. A flexible circuit board.
前記屈曲片の少なくとも一側部が前記ヒンジ部の外側に突出するように構成されていることを特徴とする請求項1に記載のフレキシブル回路基板。 The flexible circuit board according to claim 1, wherein at least one side of the bent piece is formed to protrude to the outside of the hinge portion. 少なくとも前記屈曲片が弾性部材により補強されたことを特徴とする請求項1又は2に記載のフレキシブル回路基板。   The flexible circuit board according to claim 1, wherein at least the bent piece is reinforced by an elastic member. 前記第1及び第2の接続片と屈曲片とが弾性部材により補強されたことを特徴とする請求項1又は2に記載のフレキシブル回路基板。   3. The flexible circuit board according to claim 1, wherein the first and second connection pieces and the bent piece are reinforced by an elastic member. 前記弾性部材の少なくとも一端が自由端とされたことを特徴とする請求項4に記載のフレキシブル回路基板。   The flexible circuit board according to claim 4, wherein at least one end of the elastic member is a free end. 前記弾性部材が導体である請求項3乃至5のいずれか一に記載のフレキシブル回路基板。   The flexible circuit board according to claim 3, wherein the elastic member is a conductor. 前記弾性部材が接地されたことを特徴とする請求項6に記載のフレキシブル回路基板。   The flexible circuit board according to claim 6, wherein the elastic member is grounded. ヒンジ部により回転可能に連結された第1および第2の筐体を備え、各筐体内の回路同士が請求項1乃至7のいずれか一のフレキシブル回路基板により接続されてなる電子機器。   An electronic device comprising first and second housings rotatably connected by a hinge portion, wherein circuits in each housing are connected by the flexible circuit board according to any one of claims 1 to 7.
JP2005314766A 2005-10-28 2005-10-28 Flexible circuit board and electronic device using the flexible circuit board Expired - Fee Related JP4539859B2 (en)

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CN103400766B (en) * 2013-08-03 2016-08-17 华进半导体封装先导技术研发中心有限公司 A kind of simple bending device for flexible substrate package

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04263494A (en) * 1991-02-19 1992-09-18 Fujitsu Ltd Cable providing method
JPH1153059A (en) * 1997-07-30 1999-02-26 Canon Inc Electronic equipment
JP2002027066A (en) * 2000-07-06 2002-01-25 Nec Saitama Ltd Folding portable radio equipment
JP2003133764A (en) * 2001-10-25 2003-05-09 Ohashi Technica Inc Biaxial hinge device
JP2003258390A (en) * 2002-03-06 2003-09-12 Sumitomo Electric Printed Circuit Inc Flexible printed circuit board
WO2004034682A1 (en) * 2002-10-09 2004-04-22 Matsushita Electric Industrial Co., Ltd. Communication terminal
JP2004247352A (en) * 2003-02-10 2004-09-02 Sumitomo Electric Printed Circuit Inc Flexible printed board
JP2007103695A (en) * 2005-10-05 2007-04-19 Sumitomo Bakelite Co Ltd Flexible printed board and electronic apparatus

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04263494A (en) * 1991-02-19 1992-09-18 Fujitsu Ltd Cable providing method
JPH1153059A (en) * 1997-07-30 1999-02-26 Canon Inc Electronic equipment
JP2002027066A (en) * 2000-07-06 2002-01-25 Nec Saitama Ltd Folding portable radio equipment
JP2003133764A (en) * 2001-10-25 2003-05-09 Ohashi Technica Inc Biaxial hinge device
JP2003258390A (en) * 2002-03-06 2003-09-12 Sumitomo Electric Printed Circuit Inc Flexible printed circuit board
WO2004034682A1 (en) * 2002-10-09 2004-04-22 Matsushita Electric Industrial Co., Ltd. Communication terminal
JP2004247352A (en) * 2003-02-10 2004-09-02 Sumitomo Electric Printed Circuit Inc Flexible printed board
JP2007103695A (en) * 2005-10-05 2007-04-19 Sumitomo Bakelite Co Ltd Flexible printed board and electronic apparatus

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