JP3093709B2 - Double-sided flexible wiring board - Google Patents

Double-sided flexible wiring board

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Publication number
JP3093709B2
JP3093709B2 JP140398A JP140398A JP3093709B2 JP 3093709 B2 JP3093709 B2 JP 3093709B2 JP 140398 A JP140398 A JP 140398A JP 140398 A JP140398 A JP 140398A JP 3093709 B2 JP3093709 B2 JP 3093709B2
Authority
JP
Japan
Prior art keywords
copper foil
double
foil layer
layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP140398A
Other languages
Japanese (ja)
Other versions
JPH11204898A (en
Inventor
隆志 多賀
Original Assignee
新潟日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新潟日本電気株式会社 filed Critical 新潟日本電気株式会社
Priority to JP140398A priority Critical patent/JP3093709B2/en
Publication of JPH11204898A publication Critical patent/JPH11204898A/en
Application granted granted Critical
Publication of JP3093709B2 publication Critical patent/JP3093709B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、両面フレキシブル
配線基板(FPC)に関し、特に屈曲動作を行うFPC
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided flexible printed circuit (FPC), and more particularly to an FPC that performs a bending operation.
About.

【0002】[0002]

【従来の技術】近年、ノート型パソコンにおいて、小型
軽量薄型化が進み装置内部のレイアウト構成の要求によ
り、キーコンポーネント同士の接続部やハーネスケーブ
ル接続の代替としてフレキシブル配線基板を使用する様
になって来た。
2. Description of the Related Art In recent years, notebook PCs have become smaller, lighter and thinner, and due to the demand for a layout configuration inside the device, a flexible wiring board has been used as a substitute for a connection between key components and a harness cable connection. Came.

【0003】図8は、キーボード(図示略)が設けられ
るパソコン本体12にLCDパネル10が開閉するよう
に取り付けられたノート型パソコンの斜視図である。L
CDパネル10は、パソコン本体12上の軸13を中心
に回転自在に取り付けられ、FPC11がLCDパネル
10とパソコン本体12とを電気的に接続している。F
PC11は、軸13と同軸に配置され円筒状に巻かれた
部分と、この円筒状部分の一端の延長部分で2分割され
た一方がLCDパネル10に接続され、他方がパソコン
本体12に接続された部分からなり、FPC11のこの
延長部分の円筒状部分に近いところは、弾性によりLC
Dパネル10が閉じられたときは、円筒状部分に巻き込
まれ、LCDパネル10が開けられた時は、円筒状部分
から解き出されるようになっていて、FPC11は、特
に円筒状部分に近い延長部分は、交互に屈曲状態と平面
に伸ばした状態となる屈曲動作を繰り返すこととなる。
FIG. 8 is a perspective view of a notebook personal computer in which an LCD panel 10 is mounted on a personal computer main body 12 provided with a keyboard (not shown) so as to open and close. L
The CD panel 10 is rotatably mounted around a shaft 13 on the personal computer body 12, and the FPC 11 electrically connects the LCD panel 10 and the personal computer body 12. F
The PC 11 has a cylindrical part wound coaxially with the shaft 13, and one part of the cylindrical part that is divided into two parts by an extension of one end is connected to the LCD panel 10, and the other part is connected to the personal computer body 12. The portion near the cylindrical portion of this extension of the FPC 11 is LC
When the D panel 10 is closed, it is entangled in a cylindrical portion, and when the LCD panel 10 is opened, it is unraveled from the cylindrical portion. The FPC 11 is extended particularly close to the cylindrical portion. The portion repeats a bending operation of alternately bending and extending to a plane.

【0004】図6は、従来の両面FPCの断面図で、厚
さaのベースフィルム層23の両面に銅箔層22、24
を設け、銅箔層22、24それぞれの外表面をカバーレ
イフィルム層21、25で覆っている。図7は、図6に
示す両面FPCをカバーレイフィルム層25の側を内側
にして屈曲させた状態を示す断面図である。銅箔層22
と24とは同じ厚さbで、カバーレイフィルム層21と
25とも同じ厚さcであるので、両面FPCの曲げ応力
での中立面29は、ベースフィルム層23の中心で、両
面FPCを図7のように屈曲させると外側の銅箔層22
に引っ張り応力が生じ、この屈曲を繰り返すと銅箔層2
2に金属疲労による断線8が生じることになる。
FIG. 6 is a cross-sectional view of a conventional double-sided FPC, in which copper foil layers 22, 24 are provided on both sides of a base film layer 23 having a thickness a.
Are provided, and the outer surfaces of the copper foil layers 22 and 24 are covered with coverlay film layers 21 and 25, respectively. FIG. 7 is a cross-sectional view showing a state in which the double-sided FPC shown in FIG. 6 is bent with the coverlay film layer 25 side inside. Copper foil layer 22
And 24 have the same thickness b and the cover lay film layers 21 and 25 have the same thickness c, so that the neutral surface 29 due to the bending stress of the double-sided FPC is When bent as shown in FIG. 7, the outer copper foil layer 22 is formed.
Tensile stress is generated in the copper foil layer 2
In FIG. 2, disconnection 8 occurs due to metal fatigue.

【0005】従来、このように屈曲する部分に両面FP
Cを使用する際は、断線を防ぐために、両面の銅箔層お
よびカバーレイフィルム層を薄くし、両面FPCの柔軟
性をできるだけ高めていた。
Conventionally, a double-sided FP has
When C was used, the copper foil layer and the cover lay film layer on both sides were thinned to prevent disconnection, and the flexibility of the double-sided FPC was increased as much as possible.

【0006】また、電解メッキ銅は硬くて金属疲労し易
いので、銅箔層を圧延銅箔に電解メッキを施さず、電解
メッキ銅よりも柔らかく伸縮性のある圧延銅箔のみで構
成したり、特開昭64−45190号公報に記載された
「フレキシブル両面配線板」のように屈曲する部分のみ
はベースフィルムの片面のみに銅箔回路を設けた片面構
造とするFPCを用いるようにしていた。
[0006] Further, since electrolytic plated copper is hard and easily fatigued by metal, the copper foil layer is not subjected to electrolytic plating on the rolled copper foil, and is made of only rolled copper foil which is softer and more elastic than electrolytic plated copper. As for the "flexible double-sided wiring board" described in JP-A-64-45190, an FPC having a single-sided structure in which a copper foil circuit is provided on only one side of a base film is used only for a bent portion.

【0007】[0007]

【発明が解決しようとする課題】第1の問題点は、柔軟
性を高め、銅箔層を圧延銅箔のみで構成しても両面FP
Cでは、屈曲運動を繰返すうちに金属疲労断線を起こし
易いと言う事である。
The first problem is that, even if the copper foil layer is made of only rolled copper foil, the flexibility of the double-sided FP is increased.
In the case of C, it is easy to cause metal fatigue disconnection while repeating the bending motion.

【0008】その理由は、図6に示す様に従来の両面F
PCでは、ベースフィルム層3を中心に外側(FPCの
屈曲の外側、内側を単に外側、内側と言う。以下同じ)
銅箔層22と内側銅箔層24とが同じ厚さbで、外側カ
バーレイフィルム層21と内側カバーレイフィルム層2
5とが同じ厚さcである層構造となっている為、両面F
PCが屈曲されると、引っ張り応力も圧縮応力も受けず
応力がゼロであるベースフィルム23を中心に外側カバ
ーレイフィルム層21に向かうに従い引っ張り応力が大
きくなり、内側カバーレイフィルム層25に向かうに従
い圧縮応力が大きくなる為、外側銅箔層22は、信号パ
ターンである場合は屈曲運動を繰返す程、繰り返し引っ
張り応力の影響を受けて金属疲労断線を起こし易くな
る。
The reason is that, as shown in FIG.
In PC, the outer side of the base film layer 3 is the center (the outer side and the inner side of the bending of the FPC are simply referred to as the outer side and the inner side, the same applies hereinafter).
The copper foil layer 22 and the inner copper foil layer 24 have the same thickness b, and the outer coverlay film layer 21 and the inner coverlay film layer 2
5 has a layer structure having the same thickness c.
When the PC is bent, the tensile stress increases toward the outer coverlay film layer 21 around the base film 23 where no tensile stress or compressive stress is applied and the stress is zero. Since the compressive stress is increased, in the case of a signal pattern, the outer copper foil layer 22 is repeatedly affected by the tensile stress as the bending motion is repeated, so that the metal fatigue wire is easily broken.

【0009】第2の問題点は、両面FPCの屈曲部分を
片面構造にしたものでは、電気的なノイズに弱いという
事である。
A second problem is that a double-sided FPC having a single-sided bent portion is susceptible to electrical noise.

【0010】その理由は、片面構造ではパターン層のみ
となり、層の全面の接地導体を設けることができず、信
号の帰路が十分に確保できなくなり、FPCよりノイズ
が放射されてしまう為である。
[0010] The reason is that the single-sided structure has only the pattern layer, the ground conductor cannot be provided on the entire surface of the layer, the return path of the signal cannot be sufficiently secured, and noise is radiated from the FPC.

【0011】第3の問題点は、両面FPCの屈曲部分を
片面構造としたものでは、製造上、電解メッキは避けら
れないという事である。
A third problem is that electrolytic plating is unavoidable in manufacturing when the double-sided FPC has a single-sided bent portion.

【0012】本発明の目的は、屈曲部配線の断線を防止
できて信頼性が高く、ノイズに強い両面FPC提供する
ことにある。
An object of the present invention is to provide a double-sided FPC which can prevent disconnection of a bent portion wiring, has high reliability and is resistant to noise.

【0013】[0013]

【課題を解決するための手段】本発明の両面FPCは、
曲げに対する応力が生じない中立面(図1の3)を一方
の銅箔層(図1の2、4)である断線防止銅箔層(図1
の2)に位置させたことを特徴とする。
Means for Solving the Problems A double-sided FPC of the present invention comprises:
The neutral surface (3 in FIG. 1) where no stress is caused by bending is applied to one of the copper foil layers (2 and 4 in FIG. 1) to prevent the disconnection of the copper foil layer (FIG. 1).
Characterized in that is located in 2) of.

【0014】本発明の両面FPCは、ベースフィルム層
(図1の3)の一方の面に断線防止銅箔層(図1の2)
を他方の面に銅箔層(図1の4)を張り付け、前記断線
防止銅箔層および前記銅箔層それぞれの外表面にカバー
レイフィルム層(図1の1、5)を張り付けた両面フレ
キシブル配線基板において、前記ベースフィルム層の一
方の面の側のカバーレイフィルム層(図1の1)の厚さ
を前記ベースフィルム層、前記銅箔層および前記ベース
フィルム層の他方の面の側の前記カバーレイフィルム層
(図1の5)の厚さの合計と等しいかこれよりも大きく
したことを特徴とする。
The double-sided FPC of the present invention comprises a copper foil layer (2 in FIG. 1) for preventing disconnection on one side of a base film layer (3 in FIG. 1).
A copper foil layer (4 in FIG. 1) is adhered to the other surface, and a coverlay film layer (1, 5 in FIG. 1) is adhered to the outer surface of each of the disconnection preventing copper foil layer and the copper foil layer. In the wiring board, the thickness of the coverlay film layer (1 in FIG. 1) on one side of the base film layer is adjusted to the thickness of the other side of the base film layer, the copper foil layer, and the base film layer. The thickness of the coverlay film layer (5 in FIG. 1) is equal to or larger than the total thickness.

【0015】[0015]

【0016】[0016]

【0017】[0017]

【0018】上述の両面FPCは、前記ベースフィルム
の前記一方の側を外側にする屈曲を繰り返して受けるよ
うにしてもよいし、前記断線防止銅箔層が広い幅の銅箔
からなるようにしてもよい。
In the above-mentioned double-sided FPC, the base film may be repeatedly bent so that the one side of the base film is on the outside, or the disconnection preventing copper foil layer may be made of a copper foil having a wide width. Is also good.

【0019】本発明の装置は、本体(図8の12)上に
軸支され前記本体を開閉する蓋(図8の10)と前記本
体とを上述の両面FPC(図8の11)で電気的に接続
したことを特徴とし、例えば、本体(図8の12)上に
軸支され前記本体を開閉する表示パネル(図8の10)
とを上述の両面FPC(図8の11)で電気的に接続し
たノート型の情報処理装置が挙げられる。
In the apparatus of the present invention, a lid (10 in FIG. 8) which is pivotally supported on a main body (12 in FIG. 8) and which opens and closes the main body, and the main body are electrically connected by the above-mentioned double-sided FPC (11 in FIG. 8). For example, a display panel (10 in FIG. 8) that is pivotally supported on a main body (12 in FIG. 8) and opens and closes the main body.
And a notebook-type information processing apparatus in which the above-mentioned FPC (11 in FIG. 8) is electrically connected.

【0020】本発明は、両面フレキシブル配線基板を繰
り返して屈曲させる使用方法において、前記断線防止銅
箔層が外側となるように上述の両面FPCを屈曲させる
ことを特徴とする。
According to the present invention, there is provided a use method of repeatedly bending a double-sided flexible wiring board, wherein the double-sided FPC is bent so that the disconnection preventing copper foil layer is on the outside.

【0021】[0021]

【発明の実施の形態】次に、本発明の実施の形態につい
て図面を参照して詳細に説明する。
Next, embodiments of the present invention will be described in detail with reference to the drawings.

【0022】図1は、本発明の第1の実施の形態の両面
FPCの断面図である。この両面FPCは、ベースフィ
ルム層3の両面に外側、内側の銅箔層2、4を設け、さ
らにこれらに重ねて外側、内側のカバーレイフィルム層
1、5を設けている。
FIG. 1 is a sectional view of a double-sided FPC according to the first embodiment of the present invention. In this double-sided FPC, outer and inner copper foil layers 2 and 4 are provided on both sides of a base film layer 3, and outer and inner coverlay film layers 1 and 5 are provided so as to overlap with these.

【0023】ベースフィルム層3の厚さをA、外側銅箔
層2の厚さをB、内側銅箔層4の厚さをC、外側カバー
レイフィルム層1の厚さをD、内側カバーレイフィルム
層5の厚さをEとすると、両面FPCを屈曲運動させた
時、曲げ応力が生じない中立面が外側銅箔層2に来る様
に、層の厚さをA+C+E=Dとすることが理想的であ
るが、業者が製造し取り扱うベースフィルム、銅箔、カ
バーフィルムの規格から、実際にはベースフィルム層
3、銅箔層2、4、カバーレイフィルム層1、5の厚さ
のバリエーション、すなわち種類は決まっている為、A
+C+E=Dとすることは、困難であることがあるた
め、A+C+E=DまたはA+C+E<Dとする。な
お、ここでは簡単にするためにベースフィルム層3、銅
箔層2、4およびカバーレイフィルム層1、5の弾性係
数は、同じとしている。
The thickness of the base film layer 3 is A, the thickness of the outer copper foil layer 2 is B, the thickness of the inner copper foil layer 4 is C, the thickness of the outer cover lay film layer 1 is D, and the inner cover lay is Assuming that the thickness of the film layer 5 is E, the thickness of the layer is A + C + E = D so that a neutral surface where no bending stress is generated comes to the outer copper foil layer 2 when the double-sided FPC is bent. Is ideal, but from the standards of the base film, copper foil, and cover film manufactured and handled by the trader, the thickness of the base film layer 3, the copper foil layers 2, 4, and the cover lay film layers 1, 5 is actually Since the variation, that is, the type is fixed, A
Since it may be difficult to set + C + E = D, A + C + E = D or A + C + E <D. Here, for simplicity, the elastic coefficients of the base film layer 3, the copper foil layers 2, 4 and the cover lay film layers 1, 5 are assumed to be the same.

【0024】図1に示す両面FPCを図2の様に屈曲さ
せると、外側銅箔層2は伸縮運動をしない中立層となる
か、圧縮のみを受けて引っ張りを受けない層となり、屈
曲運動を繰り返しても金属疲労により断線することはな
い。
When the double-sided FPC shown in FIG. 1 is bent as shown in FIG. 2, the outer copper foil layer 2 becomes a neutral layer that does not expand or contract, or a layer that receives only compression and is not pulled, and Even if it is repeated, there is no disconnection due to metal fatigue.

【0025】なお、内側銅箔層4は、応力を生じるが、
圧縮のみを受けることとなるので断線することはない。
Although the inner copper foil layer 4 generates stress,
Since only compression is received, there is no disconnection.

【0026】外側カバーレイフィルム層1を内側カバー
レイフィルム層5よりも厚くしてE<Dとした場合は、
外側銅箔層には必ず伸縮あるいは引っ張りを受けること
がないとは言えないが、図3に示す従来の両面FPCよ
りは、引っ張り応力が小さくなり、外側銅箔層2の断線
を少なくすることができる。
When the outer coverlay film layer 1 is thicker than the inner coverlay film layer 5 and E <D,
Although it cannot be said that the outer copper foil layer is not necessarily subjected to expansion and contraction or tension, the tensile stress becomes smaller than that of the conventional double-sided FPC shown in FIG. it can.

【0027】また、外側銅箔層2を内側銅箔層4よりも
厚くしてC<Bとした場合(内側銅箔層4に通常の厚さ
の銅箔を用い外側銅箔層2に通常のより厚い銅箔を用い
た場合や外側銅箔層2に通常の厚さの銅箔を用い内側銅
箔層4に通常の厚さのよりも薄い銅箔を用いた場合等)
も、同様に外側銅箔層2の断線を少なくすることができ
る。
When the outer copper foil layer 2 is thicker than the inner copper foil layer 4 so that C <B (a copper foil having a normal thickness is used for the inner copper foil layer 4 and Or a copper foil having a normal thickness for the outer copper foil layer 2 and a copper foil thinner than the normal thickness for the inner copper foil layer 4)
Similarly, disconnection of the outer copper foil layer 2 can be reduced.

【0028】図3は、本発明の第2の実施の形態の両面
FPCの断面図である。この実施の形態の両面FPC
は、外側にカバーレイフィルムを2重に貼り付けてる。
FIG. 3 is a sectional view of a double-sided FPC according to a second embodiment of the present invention. Double-sided FPC of this embodiment
Has a double-layered coverlay film on the outside.

【0029】図3を参照して具体的に説明すると、図6
の従来の両面FPCの外側カバーレイフィルム層21に
同じ厚さの外側カバーレイフィルム層31を貼り付け
る。これにより、図4に示すように断線させたくない外
側銅箔層22に引っ張りおよび圧縮応力が生じない中立
面を近づけ、外側銅箔層22に生じる応力が小さくな
り、外側銅箔層22が金属疲労断線を起こしにくくな
る。しかも、この両面FPCは、従来のものに用いてい
たものと同じ標準のカバーレイフィルム、銅箔、ベース
フィルムを用いて層構成することができ、少ない種類の
厚さのカバーレイフィルム等の材料で構成することがで
きる。
Referring specifically to FIG. 3, FIG.
The outer coverlay film layer 31 having the same thickness is attached to the outer coverlay film layer 21 of the conventional double-sided FPC. As a result, as shown in FIG. 4, a neutral surface where no tensile and compressive stress is generated is brought closer to the outer copper foil layer 22 that is not desired to be disconnected, and the stress generated in the outer copper foil layer 22 is reduced. It becomes difficult to cause metal fatigue disconnection. In addition, this double-sided FPC can be formed into layers using the same standard cover lay film, copper foil, and base film as those used in the conventional ones. Can be configured.

【0030】なお、上述の実施例では、銅箔層2を外側
とする片側の屈曲のみを受ける場合について説明した
が、銅箔層4が接地層や電源層等であって、全面が銅箔
である場合や幅の広い銅箔であって多少の応力を受けて
も簡単には断線しなければ、銅箔層2を外側にしたり銅
箔層4を外側にしたりする両側の屈曲を受ける場合で
も、本発明は適用できる。この場合は、銅箔層4は引っ
張り応力を受けるが強度が十分なので断線せず、銅箔層
2は細い信号線であって小さい強度であっても上述のよ
うに大きな引っ張り応力を受けることがないので断線し
ない。
In the above embodiment, the case where the copper foil layer 2 is subjected to only one side bending with the copper foil layer 2 as the outer side has been described. However, the copper foil layer 4 is a ground layer, a power supply layer, etc. If the copper foil is wide and the copper foil layer 2 is turned outward or the copper foil layer 4 is turned outward if it is not easily broken even if it receives some stress, However, the present invention is applicable. In this case, the copper foil layer 4 receives a tensile stress but does not break because of sufficient strength, and the copper foil layer 2 is a thin signal line and may receive a large tensile stress as described above even if the strength is small. There is no disconnection.

【0031】本発明は、図8に示すノート型パソコンの
FPC11に限らず、ノート型ワードプロセッサその他
の様々な装置の内部接続用FPCにも適用できるのは言
うまでもない。
The present invention is not limited to the FPC 11 of the notebook personal computer shown in FIG. 8, but it is needless to say that the present invention can be applied to an FPC for internal connection of a notebook type word processor and other various devices.

【0032】[0032]

【実施例】次に、本発明の第1の実施の形態の一実施例
について、詳細に説明する。
Next, an example of the first embodiment of the present invention will be described in detail.

【0033】図1を参照して説明すると本実施例では、
ベースフィルム層3、外側カバーレイフィルム層1およ
び内側カバーレイフィルム層5の材質をポリイミドと
し、ベースフィルム層3の厚さAを12.5μm、内側
銅箔層4のを厚さCを18μm、内側カバーレイフィル
ム層5の厚さEを12.5μmと薄くし、外側カバーレ
イフィルム層1の厚さDを50μm、外側銅箔層2の厚
さBを35μmと厚くする事で、図7の様に従来の両面
FPCではベースフィルム層3にあった中立面29を外
側銅箔層2内の中立面9へ移動させる。従って、外側銅
箔層2は両面FPCを屈曲運動させた時に中立面および
その近傍の歪みの少ない層となる。
Referring to FIG. 1, in this embodiment,
The base film layer 3, the outer coverlay film layer 1 and the inner coverlay film layer 5 are made of polyimide, the thickness A of the base film layer 3 is 12.5 μm, the thickness of the inner copper foil layer 4 is 18 μm, By reducing the thickness E of the inner coverlay film layer 5 to 12.5 μm, increasing the thickness D of the outer coverlay film layer 1 to 50 μm, and increasing the thickness B of the outer copper foil layer 2 to 35 μm, FIG. As described above, in the conventional double-sided FPC, the neutral surface 29 on the base film layer 3 is moved to the neutral surface 9 in the outer copper foil layer 2. Therefore, the outer copper foil layer 2 is a layer with little distortion at and around the neutral plane when the double-sided FPC is bent.

【0034】本実施例の両面FPCと比較のために図6
に示した従来の両面FPCとを図8の様なノート型パソ
コンのFPC11として用い、LCDパネル10の開閉
運動試験を行った結果、図5に示す様に従来の両面FP
Cは、5000回で断線していたが、本実施例の両面F
PCは、30000回の開閉を行っても金属疲労による
断線は起きなかった。
For comparison with the double-sided FPC of this embodiment, FIG.
Using the conventional double-sided FPC shown in FIG. 5 as the FPC 11 of a notebook-type personal computer as shown in FIG. 8, the opening and closing movement test of the LCD panel 10 was performed. As a result, as shown in FIG.
C was broken 5000 times, but the double-sided F
The PC did not break due to metal fatigue even after opening and closing 30,000 times.

【0035】次に、本発明の第2の実施の形態の実施例
について、詳細に説明する。
Next, an example of the second embodiment of the present invention will be described in detail.

【0036】図3を参照して説明すると本実施例では、
ベースフィルム層23の厚さaを25μm、外側銅箔層
22と内側銅箔層24の厚さbを18μm、外側カバー
レイフィルム層21と内側カバーレイフィルム層25の
厚さcを25μmと標準のFPC層構成と同一寸法とし
て、外側カバーレイフィルム層21の更に外側に厚さ2
5μmの外側カバーレイフィルム層31を貼り付ける。
Referring to FIG. 3, in this embodiment,
The thickness a of the base film layer 23 is 25 μm, the thickness b of the outer copper foil layer 22 and the inner copper foil layer 24 is 18 μm, and the thickness c of the outer coverlay film layer 21 and the inner coverlay film layer 25 is 25 μm. Of the same thickness as that of the FPC layer configuration of FIG.
A 5 μm outer coverlay film layer 31 is attached.

【0037】[0037]

【発明の効果】第1の効果は、屈曲を受ける両面FPC
の一方の銅箔層である断線防止銅箔層の断線が防止でき
ることである。
The first effect is that the double-sided FPC is subjected to bending.
That is, the disconnection of the copper foil layer, which is one of the copper foil layers, can be prevented.

【0038】その理由は、両面FPCの曲げに対する中
立面を断線防止銅箔層に位置させるか近づけて、断線防
止銅箔層に生じる応力を小さくしたからである。従って
断線防止銅箔層ではない他方の銅箔層を屈曲の内側にし
てこの内側の銅箔層に引っ張り応力が生じないようにす
る等により、両面の銅箔層が断線しないようにでき、両
面FPCの寿命を長くすることができる。
The reason for this is that the stress generated in the disconnection preventing copper foil layer is reduced by positioning or nearing the neutral surface of the double-sided FPC to the bending to the disconnection preventing copper foil layer. Therefore, the other copper foil layer, which is not the disconnection prevention copper foil layer, is made inside the bend so that no tensile stress is generated in the inner copper foil layer, so that the copper foil layers on both sides can be prevented from being disconnected. The life of the FPC can be extended.

【0039】第2の効果は、ノイズに強いという事であ
る。
The second effect is that it is resistant to noise.

【0040】その理由は、屈曲する部分にも両面に銅箔
層を設けることができるために、一方の断線防止銅箔層
を信号配線用のパターン層とし、他方の銅箔層を接地層
等にすることにより、全信号の帰路を十分確保できノイ
ズを放射することがない為である。
The reason is that a copper foil layer can be provided on both sides even at a bent portion, so that one disconnection preventing copper foil layer is used as a pattern layer for signal wiring, and the other copper foil layer is used as a ground layer. By doing so, the return path of all the signals can be sufficiently ensured, and no noise is radiated.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の実施の形態の両面FPCの断面
図である。
FIG. 1 is a cross-sectional view of a double-sided FPC according to a first embodiment of the present invention.

【図2】図1に示す両面FPCの屈曲したときの断面図
である。
FIG. 2 is a cross-sectional view of the double-sided FPC shown in FIG. 1 when bent.

【図3】本発明の第2の実施の形態の両面FPCの断面
図である。
FIG. 3 is a sectional view of a double-sided FPC according to a second embodiment of the present invention.

【図4】図3に示す両面FPCの屈曲したときの断面図
である。
4 is a cross-sectional view of the double-sided FPC shown in FIG. 3 when bent.

【図5】本発明の第1の実施の形態の実施例の両面FP
Cをノート型パソコンに用いて行った寿命試験の結果を
示す図である。
FIG. 5 shows a double-sided FP according to an example of the first embodiment of the present invention.
FIG. 9 is a diagram showing the results of a life test performed using C in a notebook computer.

【図6】従来の両面FPCの断面図である。FIG. 6 is a cross-sectional view of a conventional double-sided FPC.

【図7】図6に示す両面FPCの屈曲したときの断面図
である。
7 is a cross-sectional view of the double-sided FPC shown in FIG. 6 when bent.

【図8】本体12とLCDパネル10との電気的な接続
にFPC11を用いたノート型パソコンの斜視図であ
る。
8 is a perspective view of a notebook personal computer using an FPC 11 for electrical connection between a main body 12 and an LCD panel 10. FIG.

【符号の説明】[Explanation of symbols]

1 カバーレイフィルム層 2 銅箔層 3 ベースフィルム層 4 銅箔層 5 カバーレイフィルム層 8 断線 9 中立面 10 LCDパネル 11 FPC 12 本体 21 カバーレイフィルム層 22 銅箔層 23 ベースフィルム層 24 銅箔層 25 カバーレイフィルム層 31 カバーレイフィルム層 DESCRIPTION OF SYMBOLS 1 Cover lay film layer 2 Copper foil layer 3 Base film layer 4 Copper foil layer 5 Cover lay film layer 8 Disconnection 9 Neutral surface 10 LCD panel 11 FPC 12 Main body 21 Cover lay film layer 22 Copper foil layer 23 Base film layer 24 Copper Foil layer 25 Coverlay film layer 31 Coverlay film layer

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H05K 1/02 H05K 3/28 H05K 3/46 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 1/02 H05K 3/28 H05K 3/46

Claims (7)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 曲げに対する応力が生じない中立面を一
方の銅箔層である断線防止銅箔層に位置させたことを
徴とする両面フレキシブル配線基板。
1. A double-sided flexible wiring board, characterized in that a neutral surface where no stress is generated in bending is located on one of the copper foil layers, ie, the disconnection preventing copper foil layer.
【請求項2】 ベースフィルム層の一方の面に断線防止
銅箔層を他方の面に銅箔層を張り付け、前記断線防止銅
箔層および前記銅箔層それぞれの外表面にカバーレイフ
ィルム層を張り付けた両面フレキシブル配線基板におい
て、前記ベースフィルム層の一方の面の側のカバーレイ
フィルム層の厚さを前記ベースフィルム層、前記銅箔層
および前記ベースフィルム層の他方の面の側の前記カバ
ーレイフィルム層の厚さの合計と等しいかこれよりも大
きくしたことを特徴とする両面フレキシブル配線基板。
2. A copper foil layer is adhered to one surface of a base film layer and a copper foil layer is adhered to the other surface, and a coverlay film layer is formed on an outer surface of each of the copper foil layer and the copper foil layer. In the bonded double-sided flexible wiring board, the thickness of the cover lay film layer on one side of the base film layer is adjusted to the thickness of the base film layer, the copper foil layer, and the cover on the other side of the base film layer. A double-sided flexible wiring board characterized in that the thickness is equal to or greater than the total thickness of the lay film layers.
【請求項3】 前記ベースフィルムの前記一方の側を外
側にする屈曲を繰り返して受けることを特徴とする請求
項1〜2のいずれかに記載の両面フレキシブル配線基
板。
3. The one side of the base film is outside.
Claims that repeatedly bends to the side
Item 3. Double-sided flexible wiring base according to any one of Items 1-2.
Board.
【請求項4】 前記断線防止銅箔層は、広い幅の銅箔か
らなることを特徴とする請求項1〜3のいずれかに記載
の両面フレキシブル配線基板。
4. The copper foil layer according to claim 1, wherein said copper foil layer has a wide width.
The method according to any one of claims 1 to 3, wherein
Double-sided flexible wiring board.
【請求項5】 本体上に軸支され前記本体を開閉する蓋
と前記本体とを請求項1〜4のいずれかに記載の両面フ
レキシブル配線基板で電気的に接続したことを特徴とす
る装置。
5. A lid pivotally supported on the main body to open and close the main body.
And the main body and the double-sided flange according to any one of claims 1 to 4.
It is characterized by being electrically connected by a flexible wiring board.
Device.
【請求項6】 本体上に軸支され前記本体を開閉する表
示パネルとを請求項1〜4のいずれかに記載の両面フレ
キシブル配線基板で電気的に接続したことを特徴とする
ノート型の情報処理装置。
6. A table pivotally supported on a main body to open and close the main body.
Display panel with a double-sided frame according to any one of claims 1 to 4.
It is characterized by being electrically connected by a xivable wiring board
Notebook type information processing device.
【請求項7】 両面フレキシブル配線基板を繰り返して
屈曲させる使用方法において、前記断線防止銅箔層が外
側となるように請求項1、2または4のいずれかに記載
の両面フレキシブル配線基板を屈曲させることを特徴と
する両面フレキシブル配線基板の使用方法。
7. A method used to bend repeatedly double-sided flexible wiring board, bending the double-sided flexible wiring board according to claim 1, 2 or 4 such that the disconnection preventing copper foil layer becomes outside A method for using a double-sided flexible wiring board, comprising:
JP140398A 1998-01-07 1998-01-07 Double-sided flexible wiring board Expired - Fee Related JP3093709B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP140398A JP3093709B2 (en) 1998-01-07 1998-01-07 Double-sided flexible wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP140398A JP3093709B2 (en) 1998-01-07 1998-01-07 Double-sided flexible wiring board

Publications (2)

Publication Number Publication Date
JPH11204898A JPH11204898A (en) 1999-07-30
JP3093709B2 true JP3093709B2 (en) 2000-10-03

Family

ID=11500537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP140398A Expired - Fee Related JP3093709B2 (en) 1998-01-07 1998-01-07 Double-sided flexible wiring board

Country Status (1)

Country Link
JP (1) JP3093709B2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20003965U1 (en) 2000-02-24 2000-07-13 Petri Ag Device for transmitting electrical current between two components of a steering device for motor vehicles that can be rotated relative to one another
JP2006310643A (en) * 2005-04-28 2006-11-09 Sumitomo Electric Ind Ltd Flexible printed wiring board
JP4872838B2 (en) * 2007-07-09 2012-02-08 三菱電機株式会社 Portable electronic devices
JP2008079329A (en) * 2007-10-12 2008-04-03 Fujitsu Ltd Foldable mobile telephone
US7812258B2 (en) 2008-04-23 2010-10-12 Hitachi Global Storage Technologies Netherlands, B.V. Flex cable with biased neutral axis
JP2009302342A (en) * 2008-06-13 2009-12-24 Denso Corp Multilayer substrate, and method of designing the same
JP2011029384A (en) * 2009-07-24 2011-02-10 Murata Mfg Co Ltd Flexible multilayered substrate and method of manufacturing the same
JP5689277B2 (en) * 2009-10-22 2015-03-25 新日鉄住金化学株式会社 Flexible circuit board and multilayer circuit board
WO2013005549A1 (en) 2011-07-05 2013-01-10 株式会社村田製作所 Flexible multilayer substrate
WO2014065172A1 (en) * 2012-10-26 2014-05-01 株式会社村田製作所 Flexible substrate
WO2015041190A1 (en) * 2013-09-20 2015-03-26 東洋紡株式会社 Rigid composite laminate plate, method for manufacturing same, laminate, and method for manufacturing device using laminate
CN108012406A (en) * 2017-12-06 2018-05-08 广州兴森快捷电路科技有限公司 Stretchable FPC plates and preparation method thereof
CN109008103A (en) * 2018-06-02 2018-12-18 爱博凌(厦门)科技有限公司 A kind of accessories Luminous rope
CN114025514A (en) * 2021-11-05 2022-02-08 昆山沪利微电有限公司 Optimization method of double-sided Book stacking PCB and PCB

Also Published As

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