JP4529065B2 - シリコン単結晶ウェーハの製造方法 - Google Patents
シリコン単結晶ウェーハの製造方法 Download PDFInfo
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- JP4529065B2 JP4529065B2 JP2003294647A JP2003294647A JP4529065B2 JP 4529065 B2 JP4529065 B2 JP 4529065B2 JP 2003294647 A JP2003294647 A JP 2003294647A JP 2003294647 A JP2003294647 A JP 2003294647A JP 4529065 B2 JP4529065 B2 JP 4529065B2
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- Prior art keywords
- single crystal
- oxide film
- silicon single
- silicon
- heavy metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000013078 crystal Substances 0.000 title claims description 58
- 229910052710 silicon Inorganic materials 0.000 title claims description 58
- 239000010703 silicon Substances 0.000 title claims description 58
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 54
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000012535 impurity Substances 0.000 claims description 35
- 229910001385 heavy metal Inorganic materials 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 27
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 27
- 238000005247 gettering Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 22
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 11
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 11
- 239000010936 titanium Substances 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 31
- 238000011109 contamination Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 9
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 150000003376 silicon Chemical class 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000001773 deep-level transient spectroscopy Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010406 interfacial reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- Crystals, And After-Treatments Of Crystals (AREA)
Description
「シリコンの科学」UCS半導体基盤技術研究会編集、リアライズ社発行、p.585−621 "Gettering of metallic impurities in photovoltaic silicon"A.McHugo,H.Hieslmair,E.R.Weber;Appl.Phys.A 64 (1997)127−137
(実施例1)
(比較例1)
Claims (2)
- シリコン単結晶基板の裏面に、重金属不純物の溶解度がシリコン酸化膜より大きい中間層としてチタン酸化膜またはチタン膜をスパッタリング法により形成し、該中間層の表面にCVD法によりゲッタリング層としてのシリコン酸化膜を形成することを特徴とするシリコン単結晶ウェーハの製造方法。
- 前記重金属がFeであることを特徴とする請求項1に記載されたシリコン単結晶ウェーハの製造方法。
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JP2003294647A JP4529065B2 (ja) | 2003-08-18 | 2003-08-18 | シリコン単結晶ウェーハの製造方法 |
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JP2003294647A JP4529065B2 (ja) | 2003-08-18 | 2003-08-18 | シリコン単結晶ウェーハの製造方法 |
Publications (2)
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JP2005064341A JP2005064341A (ja) | 2005-03-10 |
JP4529065B2 true JP4529065B2 (ja) | 2010-08-25 |
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JP2003294647A Expired - Fee Related JP4529065B2 (ja) | 2003-08-18 | 2003-08-18 | シリコン単結晶ウェーハの製造方法 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5240437B2 (ja) * | 2008-04-24 | 2013-07-17 | 信越半導体株式会社 | 多層シリコン半導体ウェーハの作製方法 |
JP5500784B2 (ja) * | 2008-05-12 | 2014-05-21 | 信越半導体株式会社 | 多層シリコン半導体ウェーハ及びその作製方法 |
JP2020113580A (ja) * | 2019-01-08 | 2020-07-27 | 株式会社ディスコ | ゲッタリング層形成方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09120965A (ja) * | 1995-10-25 | 1997-05-06 | Toshiba Corp | 半導体装置の製造方法 |
JPH10223713A (ja) * | 1997-02-05 | 1998-08-21 | Mitsubishi Material Silicon Kk | 熱処理評価用ウェ−ハおよびこれを用いた熱処理評価方法 |
JP2002313795A (ja) * | 2001-04-18 | 2002-10-25 | Shin Etsu Handotai Co Ltd | 高融点金属膜付シリコン単結晶ウェーハ及びその製造方法並びにシリコン単結晶中の不純物ゲッタリング方法 |
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2003
- 2003-08-18 JP JP2003294647A patent/JP4529065B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09120965A (ja) * | 1995-10-25 | 1997-05-06 | Toshiba Corp | 半導体装置の製造方法 |
JPH10223713A (ja) * | 1997-02-05 | 1998-08-21 | Mitsubishi Material Silicon Kk | 熱処理評価用ウェ−ハおよびこれを用いた熱処理評価方法 |
JP2002313795A (ja) * | 2001-04-18 | 2002-10-25 | Shin Etsu Handotai Co Ltd | 高融点金属膜付シリコン単結晶ウェーハ及びその製造方法並びにシリコン単結晶中の不純物ゲッタリング方法 |
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