JP4510532B2 - Mounted body, optical transmission line and photoelectric circuit board - Google Patents

Description

  The present invention relates to a mounting body in which a spherical photoelectric conversion element and a spherical semiconductor element forming an electronic circuit are electrically connected to each other, and an optical transmission line and an photoelectric circuit board using the same.

  In the field of electronic devices such as mobile phones, notebook computers and PDAs that require high-speed communication, higher-speed products are provided in smaller, thinner, and lighter forms. It is hoped that. For this reason, downsizing and the like of products in this field are rapidly progressing. Furthermore, in addition to miniaturization and the like, these products are also required to have higher performance and multiple functions. In order to meet these demands, the miniaturization of semiconductor elements and the development of new structures are promoted, and the mounting technology for electronic components has advanced dramatically. As a result, the density and speed of electronic circuits have increased. The evolution has progressed dramatically.

  However, the communication speed by the electronic device is limited as long as normal electric signal transmission / reception is performed. Therefore, recently, transmission and reception of necessary information as an optical signal using an optical fiber or the like has been performed.

  By the way, in the field of semiconductor elements, spheroidization of semiconductor chips has been proposed, and application development is being promoted in various fields such as a high-density semiconductor field and a medical field. For example, Ball Semiconductor Company of the United States has proposed that a semiconductor circuit be formed on the surface of a sphere having a diameter of about 1 mm and applied to an ultra-small electronic device such as a card-type electronic device (for example, patent literature). 1 and 2). Various proposals have also been made regarding a technique for connecting such spherical semiconductor elements to each other and a technique for directly mounting the spherical semiconductor elements on a wiring board (for example, Patent Documents 3 and 4). reference). Furthermore, a solar cell using a spherical semiconductor element has been proposed (see, for example, Patent Document 5). In any of these cases, an attempt is made to realize an increase in speed and size of an electronic circuit by utilizing the spherical shape of the semiconductor.

U.S. Pat.No. 5,955,776 U.S. Patent No. 6,004,396 JP 2000-216335 A (FIG. 1) JP 2000-349224 A (FIG. 2) JP 2001-185744 A

  In view of the tendency to adopt optical communication in the field of electronic equipment, the present inventors have examined the use of spherical semiconductor elements in optical communication technology. In optical communication, it may be necessary to amplify an optical signal in the middle of a communication line. Therefore, another circuit (amplifier circuit) that extracts an optical signal from a fiber cable, converts it into an electrical signal, and amplifies the optical signal may be provided in the optical communication system. Providing an amplifier circuit may cause speed degradation and cost increase. Also, in the amplification circuit, when joining the light receiving element and the optical fiber, a squareness is required with high accuracy between the optical signal emitted from the optical fiber and the light receiving element, so that it is possible to obtain a desired joining accuracy. Generally difficult.

  In addition, although the technology disclosed in the above-mentioned document makes it possible to exert an excellent effect by taking advantage of the feature that the semiconductor element is spherical, it does not adopt a sufficiently practical mounting structure. The use was limited. In addition, the shape characteristics of spherical semiconductor elements are not fully recognized, and the idea that the semiconductor elements to be mounted on products are sufficient with planar ultra-thin chip semiconductors is the mainstream. Has not yet become widespread.

  The present invention has been made in view of such a situation, and an object thereof is to provide a useful and practical mounting body in an optical communication system by utilizing the characteristics of a spherical semiconductor element.

The present invention is a mounting body for emitting an optical signal corresponding to an incident optical signal,
Including at least two photoelectric conversion elements and at least one spherical semiconductor element forming an electronic circuit;
At least one of the photoelectric conversion elements is an element that converts an optical signal into an electric signal, and at least one is an element that converts an electric signal into an optical signal,
At least one photoelectric conversion element is a spherical photoelectric conversion element having a photoelectric conversion part formed on the surface of a substantially spherical semiconductor material,
A spherical semiconductor element is located between an element that converts an optical signal into an electrical signal and an element that converts an electrical signal into an optical signal,
Provided is a mounting body in which elements are electrically connected to each other.

  Here, the “mounting body” means an assembly in which at least one semiconductor element is electrically connected to another semiconductor element or component and exhibits one function as a whole. The mounting body provided by the present invention has at least a function of making an optical signal incident and emitting an optical signal corresponding to this as a basic function. Further, depending on the function of the spherical semiconductor element, for example, And a function of amplifying an incident optical signal or a function of emitting an optical signal having a specific wavelength among the incident optical signals. In the above, “emitting an optical signal corresponding to an incident optical signal” means that if the optical signal is not incident on the mounting body, no light is emitted from the mounting body, in other words, the emitted light is incident. It depends on the light being made.

  The mount assembly of the present invention includes at least two photoelectric conversion elements. The photoelectric conversion element includes an element that converts an optical signal into an electric signal and an element that converts an electric signal into an optical signal. In the present specification, these are collectively referred to as “photoelectric conversion elements”. The photoelectric conversion element constituting the mounting body of the present invention includes a circuit for sending an electrical signal to or receiving from another element in addition to the structure necessary for photoelectric conversion. In the mount assembly of the present invention, at least one of the two photoelectric conversion elements is an element that converts an optical signal into an electric signal, and at least one is an element that converts an electric signal into an optical signal. These elements are required to realize a function of emitting an optical signal corresponding to an incident optical signal, which is a basic function of the mounting body of the present invention. In this specification, the term “photoelectric conversion element” is used as a generic term for these elements, and an element that converts an optical signal into an electric signal is indicated as an “optical-electric conversion element” for convenience. An element that converts a signal into an optical signal may be referred to as an “electrical-optical conversion element” for convenience.

  In the mounting body of the present invention, at least one spherical semiconductor element forming an electronic circuit is disposed between the photoelectric conversion element and the photoelectric conversion element, and at least one photoelectric conversion element is provided. It is a spherical photoelectric conversion element. Therefore, the mounting body of the present invention has a form in which at least two spherical elements are connected, and thus the mounting body of the present invention can be configured to fit, for example, a curved or bent path. . It should be noted that the term “spherical” used here includes not only a perfect sphere but also an ellipse or the like having the same effect.

  In addition, since the at least one photoelectric conversion element is spherical, the mounting body of the present invention has the following advantages or features. For example, when the photoelectric conversion element is spherical, a plane perpendicular to light from many directions can be provided as compared with a case where the photoelectric conversion element is planar. Therefore, even when the angle between the optical path of the incident light and the photoelectric conversion element deviates from 90 degrees at the contact portion between the optical fiber and the photoelectric conversion element, the tolerance for “deviation” is high. The same applies to the case where the electro-optical conversion element is spherical. Therefore, if one or both of the photoelectric conversion elements on the incident side and the emission side are spherical, the connection between the optical fiber and the mounting body is facilitated. In the mounting body of the present invention, it is preferable that all the photoelectric conversion elements are spherical.

  In addition, when a spherical photoelectric conversion element is configured to receive light emitted from a plurality of optical transmission paths, such as by attaching a plurality of optical elements to a spherical electronic circuit element, Using the orientation, light can be incident on one element from a plurality of directions without limiting the light incident direction. Therefore, if such a photoelectric conversion element is used, a mounting body having an optical switch circuit can be configured. Similarly, when a spherical electro-optical conversion element that emits light in a plurality of directions by using spherical omnidirectionality is configured, a mounting body that emits light in a desired plurality of directions Can be configured.

  In the mount assembly of the present invention, the elements are electrically connected. Here, the term “element” is used to indicate both the photoelectric conversion element and the spherical semiconductor element that constitute the mounting body. Further, “elements are electrically connected” means that they are connected so as to form a desired circuit in accordance with the function of the mounting body. The elements may be electrically connected, for example, by mounting each element on a circuit board and wiring formed on the circuit board. In that case, the circuit board is also an element constituting the mounting body. Alternatively, the elements may be electrically connected by bringing the elements into contact with each other via an electrical connection such as a bump.

As long as it has at least two spherical elements, the mounting body of the present invention may include, for example, a normal planar semiconductor element or photoelectric conversion element. Preferably, the photoelectric conversion element and the semiconductor element constituting the mounting body of the present invention are all spherical. Such an implementation is
n spherical photoelectric conversion elements (n is an integer of 2 or more);
X spherical semiconductor elements forming an electronic circuit (x is an integer of 1 or more),
a (wherein a is an integer of 1 or more and a <n) spherical photoelectric conversion elements are photoelectric conversion elements,
(Na) spherical photoelectric conversion elements are electro-optical conversion elements,
The x spherical semiconductor elements are located between the photoelectric conversion element and the photoelectric conversion element;
It is specified as a mounting body in which elements are electrically connected.

  For example, when n = 2 and x = 1, a mounted body having a configuration in which one spherical semiconductor is located between one light-electric conversion element and one electric-light conversion element is obtained. Such a mounting body may have a form in which all the elements are arranged in a straight line, or a form in which an angle α (α ≠ 180 °) is formed when the centers of the respective elements are connected (ie, , Bent). Further, by setting n = 2 and the number of x being 2 or more, in addition to the above-described forms, various other forms of mounting bodies can be configured, for example, a zigzag-type mounting body is configured. It is also possible to do.

  The number of photoelectric conversion elements may be 3 or more (that is, n ≧ 3). In that case, the number of photoelectric conversion elements may be set to 1 (a = 1), and the number of photoelectric conversion elements may be set to 2 or more ((na) ≧ 2). A mounting body can be obtained in which the optical signal is branched and emitted in two or more directions.

  The mounting body of the present invention may be partially or entirely covered with a transparent resin. By covering at least a part of the mounting body with a transparent resin, the mounting body can be obtained as a structure in which a plurality of elements are integrated with the resin without affecting the incidence and emission of light. Such a mounted body is excellent in handleability, and since the photoelectric conversion element and the spherical semiconductor element are protected by the resin, the field of optical communication and energy supply that requires high reliability and no failure over a long period of time. Used conveniently.

  Passive components may be mounted on the mounting body of the present invention. Specifically, the passive component is a coil, a resistor, or a capacitor. When at least a part of the mounting body is covered with resin, the resin may also cover the passive component. For example, the passive component may be embedded in the resin.

  The present invention also provides an optical transmission line including the mounting body of the present invention. Specifically, the optical transmission line of the present invention is composed of a core layer and a clad layer, and the mounting body of the present invention is arranged in the core layer. Here, “the mounting body is arranged in the core layer” includes not only a form in which the mounting body is located only in the core layer but also a form in which the mounting body is located so as to straddle the core layer and the cladding layer. Meaning. This optical transmission line is, for example, an optical signal traveling in the optical transmission line is amplified in the transmission line by a mounting body arranged in the core layer, or light of a specific wavelength in a path beyond a predetermined position. Allows only signal to travel.

  When the optical transmission line of the present invention has a bent portion, it is desirable to arrange the mounting body of the present invention at the bent portion. In a conventional optical transmission path, for example, when performing a right-angle optical path conversion, as shown in FIG. 7C, it is necessary to cut the optical transmission path by 45 ° with respect to the optical path direction and reflect the optical signal. . On this cut surface, a metal film is formed as necessary in order to improve the reflection efficiency. The cutting of the optical transmission line and the formation of the metal film are disadvantageous in that the process becomes complicated and the transmission loss increases. When the mounting body of the present invention is arranged at the bent portion, as shown in FIG. 7B, when the traveling direction of the optical signal is bent by 90 degrees, the signal to be transmitted is transmitted between the elements as an electrical signal. It is not necessary to cut the transmission path, and transmission loss can be reduced.

  When the optical transmission line of the present invention has a branched portion, it is desirable to arrange the mounting body of the present invention at the branched portion. In that case, the mounting body has two or more electro-optical conversion elements, or has an electro-optical conversion element that can emit an optical signal in a plurality of directions. In a conventional transmission line, when optical path branching is required, as shown in FIG. 8B, it is necessary to increase the radius of curvature at the branch part in order to reduce signal loss. When the mounting body of the present invention is arranged in a branch path, an optical signal can be transmitted as an electrical signal in the branch section, so that a branch can be formed at a steep angle as shown in FIG.

  The present invention also provides an opto-electric circuit board in which an optical transmission line is formed on the electric circuit board. Specifically, the photoelectric circuit board of the present invention is a circuit board having an optical transmission line, the optical transmission line is composed of a core layer and a clad layer, and the mounting body of the present invention is disposed in the core layer. It has the structure which is made. Alternatively, the optoelectric circuit board of the present invention is a circuit board having a plurality of optical transmission paths, and the mounting body of the present invention connects the plurality of optical transmission paths and is emitted from at least one optical transmission path. An optical signal corresponding to light is configured to enter another optical transmission line.

  In the mounting body of the present invention, the light-electric conversion element and / or the electric-light conversion element is a spherical element, so that the part that makes light incident (that is, receives light) and / or the part that emits light is a spherical surface. It is a thing. As a result, when this mounting body is connected to an optical transmission line such as an optical fiber, the demand for perpendicularity can be relaxed compared to a conventional photoelectric conversion element, and the connection to the optical transmission line is easy. Become. In addition, the mounting body of the present invention includes a light-electric conversion element and / or a spherical semiconductor element connected to the electric-light conversion element, and thus has a structure including at least two spherical elements. For example, when the mounting body is arranged such that the spherical semiconductor element is positioned at a bent or branched portion, light incident on the mounting body can be transmitted as an electrical signal at the bent or branched portion, for example. Therefore, when the mounting body of the present invention is disposed on an optical transmission line having a bent or branched portion, it is possible to transmit light with a reduced transmission loss.

(Embodiment 1)
FIG. 1 is a side view showing Embodiment 1 of the present invention. This embodiment is an example of a mounting body having an optical amplification function. The mounted body in this form is used as, for example, an optical amplification repeater for high-speed and high-capacity data communication.

  The mounting body 100 is disposed between two optical fibers 20 and 22 that are optical transmission paths, amplifies an optical signal emitted from one optical fiber 20, and then enters the other optical fiber 22. The mounting body 100 includes two spherical photoelectric conversion elements, one of which is a light-electric conversion element 10a and the other of which is an electric-light conversion element 10b. The mounting body 100 also includes spherical semiconductor elements 12a and 12b that act as amplifiers and are located between the two photoelectric conversion elements 10a and 10b. These four elements are arranged in a straight line, and adjacent elements are electrically connected via an electrical connection portion 14. The entire mounting body 100 is covered with a transparent resin 16. The transparent resin forms a cylindrical body having approximately the same diameter as the optical fibers 20 and 22. Moreover, the mounting body 100 has the external electrode 18 provided in the spherical semiconductor element 12a. The external electrode 18 is provided for connecting the amplifying spherical semiconductor element 12a and an external power source (not shown). In the illustrated form, electric power for operating the spherical semiconductor elements for amplification 12a and 12b is supplied from an external power source.

The photoelectric conversion element, a known method (e.g., method described in Patent Documents 1 and 2) in accordance with, as shown in FIG. 13 (A), ^{n +} layer of spherical, ^{p +} layers and doped regions, and electrodes 1310 and the like It is manufactured by forming. The element illustrated in FIG. 13A is an example of a PIN (p-intrinsic-n) diode. The size of the doping region shown is an example and may be larger. The larger the doping region, the larger the light receiving region, and the light receiving region can be perpendicular to optical signals from more directions. Alternatively, as shown in FIG. 13 (B), an electro-light that emits light in the direction of the arrow by producing a laminated body that constitutes an LED and cutting it into a spherical shape as indicated by a broken line in the figure. A conversion element (LED) can be obtained. Alternatively, as shown in FIG. 13C, a photoelectric conversion element may be manufactured by a method in which an electronic circuit is formed on a spherical body made of a semiconductor material by a known method and an optical element 1300 is mounted thereon. In FIG. 13C, three optical elements are mounted, so that light from the three paths can be received. The number and position of the optical elements are not limited to those illustrated. For example, more optical elements may be mounted according to the direction of light to be received.

  In the photoelectric conversion element 10a, a predetermined electronic circuit is formed so that an electric signal can be transmitted to the spherical semiconductor element 12a. Also in the electro-optical conversion element 10b, a predetermined electronic circuit is formed so that the electric signal sent from the spherical semiconductor element 12b can be received. Therefore, in the photoelectric conversion element 10a of the illustrated form, the photoelectric conversion unit is located on a part or the whole of the spherical surface in the substantially left half, and is preferably formed at a position closest to the optical fiber 20. In the electro-optical conversion element 10 b, the photoelectric conversion unit is formed on a part or all of the substantially right half spherical surface, and is preferably formed at a position closest to the optical fiber 22.

  The spherical semiconductor elements 12a and 12b are also manufactured according to a known method so as to form an electronic circuit having a predetermined function. In the illustrated form, the electronic circuits of the spherical semiconductor elements 12a and 12b are formed to have an amplification function. The number of spherical semiconductor elements is not limited to two, and is preferably determined by the gain necessary for signal amplification.

  In the illustrated mounting body, the electrical connection portion 14 that connects adjacent elements is, for example, solder or a conductive adhesive. In the illustrated mounting body, there are two electrical connection portions 14 located between two elements. There may be more electrical connections 14 than this.

  Electrical connection between the elements may be performed by other methods. For example, as shown in FIG. 14, an ACF (anisotropic conductive film) 1400 is sandwiched between spherical elements and the element is heated and pressurized at an appropriate pressure and temperature. You may connect each other. According to this method, the elements can be simply connected and stably fixed.

  Alternatively, the elements include a step of providing metal bumps on one or both of two adjacent spherical elements, a step of sandwiching an insulating adhesive film made of a thermosetting resin in a semi-cured state between the two elements, a metal It can also be connected by a method including a step of applying heat and pressure so that the bump penetrates the film and the thermosetting resin is cured. This method also enables simple and reliable connection and fixing. The metal bump is made of gold, for example. The thermosetting resin is, for example, an epoxy resin.

  In addition to the electrical connection portion 14, the mounting body 100 is provided with an external electrode 18 for supplying power to the spherical semiconductor element 12 a. Electric power for operating the elements 12a and 12b is supplied from an external power source (not shown) via the external electrode 18. A portion of the external electrode 18 is not covered with the resin 16 and is exposed so as to ensure connection with an external power source. The exposed part of the external electrode 18 is connected to the external electrode by an appropriate lead wire. Alternatively, a pair of connectors may be provided in the exposed portion of the external electrode 18 and power may be supplied by connecting lead wires with the connector.

  The external electrode 18 may be a general metal electrode (for example, a gold electrode). When the external electrode 18 needs to pass light, the electrode 18 is preferably a transparent electrode made of ITO (Indium-Tin-Oxide) or the like.

  In the illustrated form, the four spherical elements are entirely covered with a transparent resin 16. The transparent resin 16 is formed into a cylindrical shape having substantially the same diameter as the optical fibers 20 and 22, thereby facilitating the joining with the optical fibers 20 and 22. Further, both ends of the cylindrical resin portion are high so that a high-precision squareness can be obtained between the optical path of each fiber and the element at the end faces of the spherical photoelectric conversion elements 10a and 10b and the optical fibers 20 and 22. Processed with precision. However, as described above, since the photoelectric conversion elements 10a and 10b are both spherical and tolerate a deviation in squareness to some extent, the requirement for perpendicularity is relaxed compared to the case of using a planar photoelectric conversion element. Therefore, the processing accuracy of the resin is relaxed to some extent. This is an important feature of the present invention.

  The transparent resin 16 is one or more resins selected from, for example, highly transparent acrylic resin, polycarbonate resin, polystyrene resin, styrene-acrylonitrile copolymer (AS resin), epoxy resin, and the like. However, the resin 16 is not limited to these, and a resin that is transparent and has good moldability can be arbitrarily used. The covering with the resin 16 is performed after a predetermined number of photoelectric conversion elements 10a and 10b and semiconductor elements 12a and 12b are arranged in a predetermined shape (in the illustrated form, a straight line) and the elements are connected to each other. The covering with the resin is performed by, for example, a method of pouring molten resin after the elements connected in a straight line are fixed in a cylindrical mold. Or the method of apply | coating resin may be employ | adopted and a mounting body may be coat | covered with resin. In either case, it is necessary to prevent bubbles from remaining in the resin after coating. This is because if there are bubbles, the light transmission efficiency decreases due to irregular reflection. In order to remove bubbles, it is desirable to apply pressure or vacuum defoaming while the resin is molten or not cured. In order to prevent damage to each element, it is desirable to perform molding and application at a temperature as low as possible. Further, the melting point of the resin 16 needs to be lower than the melting point or softening point of an electrical connection part (that is, a conductive adhesive or the like) that connects the elements.

  Thus, according to the present embodiment, a columnar repeater having substantially the same thickness as the optical fibers 20 and 22 can be created. With such a structure, a compact and easy installation structure can be achieved without increasing the size of the optical fiber repeater. Further, since the shortest wiring is realized by bringing the elements into contact with each other, a signal can be transmitted without reducing the transmission speed.

  The illustrated form is an example of the mounting body of the present invention, and various changes may be made thereto. For example, power supply to the spherical semiconductor element may be performed by electromagnetic induction, and in that case, a coiled pattern may be formed in the spherical semiconductor element 12a. In particular, when a large number of optical fibers are bundled and used, there is an advantage that the mounting body is not bulky by using an electric power supply by electromagnetic induction, thereby eliminating the need for external electrodes and lead wires.

  The spherical semiconductor element may have one or more functions selected from a calculation function, a transmission function, and a recording function in addition to the amplification function. In a modification of this embodiment, when it is not necessary to amplify the optical signal, the spherical semiconductor element may provide a simple wiring, for example. Alternatively, the spherical semiconductor element may have a 3R function (waveform shaping (Re-shaping), timing regeneration (Re-timing), and linear amplification (Re-generating)).

  Further, as long as any one of the electric-photoelectric conversion element and the photoelectric conversion element is spherical and includes at least one spherical semiconductor element, a mounting body is formed using a planar photoelectric conversion element or semiconductor element. You can do it. However, when a planar element is used, it is necessary to provide a through hole or wiring in the coupling direction as an electrical connection means so that an electrical signal can be transmitted in the coupling direction of the element.

  In the illustrated mounting body, all the elements are completely embedded in the resin, but the resin does not necessarily need to cover all the elements. For example, the resin may cover only some of the plurality of elements and may not cover some of the elements (that is, some of the elements may be exposed). Alternatively, only a part of each element may be covered with resin, and the other part of each element may be exposed. For example, the resin may cover only the photoelectric conversion part of the photoelectric conversion element, and even in that case, the reliability of the mounting body is improved. The mounting body may have a configuration in which half of each element is embedded in a semi-cylindrical resin molded body, for example. Alternatively, the resin may cover the surface of each element in the form of a thin film. In that case, it is difficult to form the connection part with the optical fiber by processing the end of the resin, so use a suitable connector to ensure the perpendicularity between the optical path of the optical fiber and the photoelectric conversion element. There is a need to.

  The mounting body may further include passive components such as a coil, a capacitor, and a resistor. The passive component forms another circuit in this mounting body and gives an additional function to the mounting body. The passive component may be mounted on the amplifying spherical semiconductor element by an ordinary method, for example. Furthermore, another active element may be mounted. In that case, a known planar semiconductor element may be used as the active element.

  The mounting body in this form can be replaced with one spherical semiconductor element that functions as a semiconductor optical amplifier (SOA). When only one such spherical semiconductor element is used, two optical fibers can be connected at a shorter distance.

(Embodiment 2)
FIG. 2 is a plan view schematically showing Embodiment 2 of the present invention. FIG. 2 shows a form in which the mounting body 200 of the present invention is used at the branch portion of the optical fiber. When signals are transmitted using optical fibers, it is often necessary to branch them. At that time, if the signal is only optically branched, the signal strength is lowered, which may cause inconvenience in signal transmission. In order to avoid or reduce such inconvenience, the mount assembly of the present invention can be used. In the illustrated form, an optical signal transmitted through the optical fiber 20 is divided by the branch joint 24 and transmitted to the right optical fibers 22a and 22b, respectively. The mounting body 200 of the present invention is provided between the branch joint 24 and the optical fibers 22a and 22b as an optical amplification repeater, amplifies the branched optical signal, and transmits light to the optical fibers 22a and 22b, respectively. To play a role. By arranging the mounting body of the present invention in this way, the signal can be stably transmitted even after the optical signal is branched.

  The configuration of the mounting body 200 is substantially the same as that of the mounting body 100 of the first embodiment, but is different in that it does not have an external electrode and is provided with a coil 19 instead. The coil 19 is provided to supply power to the spherical semiconductor element 12a by electromagnetic induction. Therefore, since the mounting body 200 does not need to be connected to a power source, the mounting body 200 is provided in a more compact form. Since other elements and configurations are the same as those of the mounting body 100, detailed description thereof is omitted.

(Embodiment 3)
FIG. 3 is a plan view schematically showing Embodiment 3 of the present invention. FIG. 3 shows another form of branching an optical fiber using the mounting body 300 of the present invention.

  In this embodiment, the optical signal from the optical fiber 20 is branched and transmitted to a plurality (three in FIG. 3) of optical fibers 22a, 22b and 22c to the right. In the mounting body 300 of the present invention, the electro-optical conversion element 10c is configured to emit light in three directions. Also in this mounting body 300, since the electro-optical conversion element 10c is spherical, for example, the optical elements are mounted at three locations as shown in FIG. 13C, or on the side close to the optical fibers 22a, 22b and 22c. By using the entire hemispherical surface as the light emitting section, it is possible to draw out optical signals from a plurality of locations and couple them to an optical fiber. The resin 16 that covers the mounting body 300 is processed into a shape that is perpendicular to the optical paths of the three fibers on the light emitting side. Since other elements and configurations of the mounting body 300 are the same as those of the mounting body 100, detailed description thereof is omitted.

(Embodiment 4)
FIG. 4 is a plan view schematically showing Embodiment 4 of the present invention. FIG. 4 shows a form in which the mounting body 400 of the present invention is used as an optical switch.

  In this embodiment, optical signals transmitted from a plurality (three in FIG. 4) of optical fibers 20a-c are transmitted from a plurality (three in FIG. 4) of optical fibers 22a-c according to the path. Injected toward a predetermined route to be selected. Therefore, the photoelectric conversion element 10d can receive light from a plurality of paths, for example, a method of forming doping regions shown in FIG. 13A at three locations, or as shown in FIG. 13C. The optical device is manufactured by mounting the optical device at three locations. In addition, the electro-optical conversion element 10c is manufactured so that light can be emitted in a plurality of directions, as in the third embodiment. The electronic circuit of the spherical semiconductor element 12c is formed to have a switching function that determines the path of the emitted light according to the path of the incident light. Although the illustrated mounting body 400 is not covered with a resin, a part or all of the mounting body may be covered with a resin as necessary. Since the other elements and configuration of the mounting body 400 are the same as those of the mounting body 100, detailed description thereof is omitted.

(Embodiment 5)
FIG. 5 is a plan view schematically showing Embodiment 5 of the present invention. FIG. 5 shows another form in which the mounting body 500 of the present invention is used as an optical switch.

  In this embodiment, optical signals transmitted from a plurality (four in FIG. 5) of optical fibers 20a-d are transmitted from a plurality (four in FIG. 5) of paths 22a-d according to the path. Injected toward a predetermined route to be selected. Unlike Embodiment 4, photoelectric conversion element 10e-1 connected to each optical fiber is arranged around one large spherical semiconductor element 12d. Such a mounting body is also included in the present invention because it can be said that the spherical semiconductor element is located between the photoelectric conversion element and the photoelectric conversion element.

  In the illustrated mounting body 500, the photoelectric conversion elements 10e, 10f, 10g, and 10h are photoelectric conversion elements, and the photoelectric conversion elements 10i, 10j, 10k, and 10l are electro-optical conversion elements. The electronic circuit of the spherical semiconductor element 12d has a switching function of selecting a predetermined electro-optical conversion element according to the path of the incident optical signal and emitting the optical signal from this. In the mounting body 500, the photoelectric conversion element 10e-1 and the spherical semiconductor element 12d are connected by the electrical connection portion 14 as in the first embodiment. The spherical semiconductor element 12d is provided with an external electrode (not shown) for connection to an external power source. The spherical semiconductor element 12d may be provided with a coil instead of the external electrode. Although the illustrated mounting body 500 is not covered with a resin, a part or all of the mounting body may be covered with a resin as necessary.

(Embodiment 6)
FIG. 6 is a plan view schematically showing Embodiment 6 of the present invention. FIG. 6 shows a form in which the mounting body 600 of the present invention is used as a wavelength switch.

  In this embodiment, optical signals transmitted from a plurality (three in FIG. 6) of optical fibers 20a, 20b and 20c pass through wavelength filters 60a, 60b and 60c attached to the tips of the respective fibers. The photoelectric conversion element 10d converts it into an electrical signal. Thereafter, the electrical signal is amplified by the spherical semiconductor element 12e with an optimum amplification factor according to the wavelength, then converted into an optical signal by the electro-optical conversion element 10b, and emitted from the optical fiber 22. That is, the mounting body of the present invention recognizes the path of the received signal as having a specific wavelength, and functions to amplify and emit with an appropriate amplification factor according to the wavelength. In other words, the mount assembly of the present invention provides path information converted into wavelength information.

  In this embodiment, filters 60a-c that pass a specific wavelength are attached to the tips of the optical fibers 20a-c, respectively. The filter 60a passes only the optical signal with the wavelength λ1, the filter 60b passes only the optical signal with the wavelength λ2, and the filter 60c passes only the optical signal with the wavelength λ3. Therefore, when the photoelectric conversion element 12e receives the optical signal having the wavelength λ1, the spherical semiconductor element 12e recognizes that it receives the optical signal from the optical fiber 20a, and amplifies this signal to generate the electrical-optical signal. The data is transmitted to the conversion element 10b. Light having a wavelength λ1 is emitted from the optical fiber 22, and a receiving device (not shown) receives the light to recognize that the light is emitted from the optical fiber 20a.

  In the mounting body 600, the photoelectric conversion element 10d is configured to receive optical signals from a plurality of paths in the same manner as the photoelectric conversion element 10d shown in FIG. The electro-optical conversion element 10b is the same as the electro-optical conversion element 10b shown in FIG. The elements are connected to each other by the electrical connection portion 14 as in the first embodiment. The spherical semiconductor element 12e is provided with an external electrode (not shown) for connection to an external power source. The spherical semiconductor element 12e may be provided with a coil instead of the external electrode. Although the illustrated mounting body 600 is not covered with a resin, a part or all of the mounting body may be covered with a resin as necessary.

(Embodiment 7)
FIGS. 7A and 7B are a plan view and a side view, respectively, schematically showing an optical transmission line of the present invention as Embodiment 7 of the present invention, and FIG. 7C is a conventional optical transmission. It is a top view which shows a path typically. 7A and 7B show an optical transmission line 70 including a core layer 72 and a clad layer 74, in which the mounting body 700 of the present invention is disposed in the core layer.

  In the illustrated form, the mounting body 700 of the present invention is partially located on the core layer 72 and partially located on the lower cladding layer 74. The position in the core layer of the mounting body is arranged so that most of the optical signal passing through the core layer can be received, and components other than the optical signal emitted from the mounting body 700 are not transmitted across the mounting body 700. As long as it is, it is not particularly limited. In a variation of this form. For example, the mounting body may be positioned only in the core layer so as not to straddle the cladding layer.

  As shown in FIG. 7B, the optical transmission path 70 includes two portions where the optical path is bent at a right angle. As shown in FIG. 7C, in the conventional optical transmission line, the optical transmission line is cut at an angle of 45 ° with respect to the optical path direction at the bent portion, and the optical signal is reflected by the cut surface (mirror surface). Therefore, it is necessary to change the optical path. On the other hand, when the mounting body 700 of the present invention is arranged at the bent portion as shown in the figure, an optical signal traveling in the direction of the arrow x is converted into an electric signal by the photoelectric conversion element 710a, and the arrow y Then, after the electric signal is converted into an optical signal by the electro-optical conversion element 710b, it can be emitted in the direction of the arrow z. That is, when the mounting body of the present invention is used, it is not necessary to change the optical path by utilizing the reflection of light, and the transmission loss accompanying the optical path change can be reduced. Further, the optical transmission line of the present invention does not need to be cut at the bent portion, and has an advantage that a bent optical transmission line can be formed easily.

  The mounting body of the present invention can be configured such that an optical signal from an arbitrary direction is incident and an optical signal is emitted in an arbitrary direction by making the photoelectric conversion element spherical. Therefore, even when the optical transmission path bends at an angle other than a right angle, the mounting loss of the present invention is used to adjust the position of the photoelectric conversion portion according to the angle of the bent portion, thereby reducing the transmission loss and the optical path. It is possible to convert.

  The configuration of the mounting body 700 disposed in the optical transmission line 70 of the present invention is similar to the mounting body 200 described in the second embodiment. The number of spherical semiconductor elements 712 is not limited to one, and may be two or more depending on the length of the optical path and the dimensions of the elements used. The elements are connected by an electrical connection portion 714. The spherical semiconductor element 712 has an amplification function, is formed with a coil 719, and is fed by electromagnetic induction. The spherical semiconductor element 712 may be a simple wiring when it is intended only for optical path conversion. The illustrated mounting body 700 is not covered with a resin and is in direct contact with the core layer. This mounting body is only an example, and the mounting body disposed on the optical transmission line of the present invention may be covered with a resin.

(Embodiment 8)
FIG. 8A is a plan view schematically showing an optical transmission line of the present invention as Embodiment 8 of the present invention, and FIG. 8B is a plan view schematically showing a conventional optical transmission line. It is. The optical transmission line 80 of this form has a core layer and a clad layer like the optical transmission line of Embodiment 7, and the mounting body 800 of the present invention is arranged in the core layer.

  As shown in FIG. 8A, the optical transmission line 80 has a branching portion. As shown in FIG. 8B, in the conventional optical transmission line, it is necessary to increase the radius of curvature in order to reduce the signal loss. Therefore, it is necessary to increase the area of the branch part. On the other hand, when the mounting body 800 of the present invention is arranged so that the spherical semiconductor elements 812a-d are positioned at the branch portion as shown in the drawing, the optical signal is branched and transmitted as an electrical signal at the branch portion. Therefore, the signal loss can be significantly reduced as compared with the case where the optical signal is branched. In addition, since the electrical signal is branched without branching the light, the influence of the shape of the branch portion on the signal loss can be reduced, and thereby the area of the branch portion can be reduced.

  The illustrated mounting body 800 has one light-electric conversion element 810a and two electric-light conversion elements 810b and 810c, and four spherical semiconductor elements 812a-d are arranged between them. . The spherical semiconductor element 812a has a function of amplifying an electric signal from the photoelectric conversion element 810a. The spherical semiconductor element 812d has a function of branching a signal from the spherical semiconductor element 812a to the spherical semiconductor elements 812b and 812c. The spherical semiconductor elements 812b and 812c transmit the branched electric signals to the electro-optical conversion elements 810b and 810c, respectively. The electro-optical conversion elements 810b and 810c each convert an electric signal into an optical signal and emit light in the direction of the arrow. Power supply to the spherical semiconductor elements 812a-d is performed by electromagnetic induction using a coil 819 provided in the spherical semiconductor element 812a. The elements are connected by an electrical connection portion 814. In the illustrated form, the mounting body 800 is not covered with resin. This mounting body is only an example, and the mounting body disposed at the branch portion may be covered with a resin.

  The mounting body shown in the figure branches an optical signal from one direction in two directions. The number of branches can be increased to 3 or more by increasing the number of electro-optical conversion elements and spherical semiconductor elements. Further, it is also possible to selectively branch an optical signal by providing a switching function to a spherical semiconductor element (for example, an element indicated by reference numeral 12d in the illustrated form).

(Embodiment 9)
FIG. 9 is a side view schematically showing the photoelectric circuit board of the present invention as Embodiment 9 of the present invention. In FIG. 9, only the circuit board 950 is shown in a sectional view in order to show the structure of the circuit board 950. The photoelectric circuit board 940 of this form has a configuration in which the optical transmission line 90 is formed on the circuit board 950 and the mounting body 900 of the present invention is disposed in the core layer 92 thereof.

  The configuration of the optical transmission line 90 includes a core layer 92 and a cladding layer 94 as in the optical transmission line described with reference to FIGS. The mounting body 900 is provided for the purpose of amplification of an optical signal in the optical transmission line, and includes a spherical light-electric conversion element 910a, a spherical electric-light conversion element 910b, and a spherical shape positioned therebetween. A semiconductor element 912 is included. In the illustrated embodiment, each element constituting the mounting body 900 is mounted by connecting a terminal 958 to a wiring layer 952 located on the surface of the circuit board, and the elements are electrically connected via the wiring layer 952. ing. This connection method is different from any of the above-described mounting bodies. In the illustrated form, the three elements are arranged so that adjacent elements are in contact with each other, but this contact is not always necessary when the wiring layer 952 is used as an electrical connection portion. Therefore, when this connection method is adopted, there may be a gap between the elements, which may have an advantageous effect on the arrangement of the mounting body and the design of the optical transmission path. For example, it is understood that this connection method is advantageous when it is assumed that there is no space large enough to arrange a mounting body in which a plurality of elements are integrated. In a modification of this embodiment, the elements constituting the mounting body may be connected by contacting via an electrical connection portion as in the first embodiment. In yet another modification, the connection via the wiring layer may be employed together with the connection by contact via the electrical connection.

  The circuit board 950 is a known multilayer board that includes a plurality of wiring layers 952 and a plurality of electrical insulating layers 954 and has a configuration in which the wiring layers are connected by inner vias 956. In a modification of this embodiment, a double-sided board or a single-sided board may be used instead of the multilayer board.

  An example of a method for manufacturing the photoelectric circuit board 940 of Embodiment 9 will be described with reference to FIG. First, a terminal for connecting the wiring layer and each element is formed on the spherical element. For example, as shown in FIG. 10A, the terminal is formed by attaching a metal spherical body 1010 placed on a substrate to the surface of the photoelectric conversion element 910a with an adhesive or solder, and attaching the terminal 958. Form. In FIG. 10A, two terminals are formed at a time. Three or more terminals may be formed at a time, but when two terminals are formed on a wiring on a spherical surface, there is an advantage that an allowable manufacturing tolerance can be increased. Next, as shown in FIG. 10B, a plurality of photoelectric conversion elements 910a are aligned on a substrate 1012 having a recess into which a terminal enters. The aligned elements 910a are transferred onto the surface of a disk-shaped substrate 1014 as shown in FIG. The transfer is performed by, for example, a method in which an adhesive is applied to the surface of the substrate 1014, brought into contact with the aligned elements 910a, and then pulled up. As a result, a group of photoelectric conversion elements 910 is formed on the surface of the substrate 1014 as shown in FIG. The steps shown in FIGS. 10A to 10C are repeated to form terminals on the electro-optical conversion element 910b and the spherical semiconductor element 912, which are transferred to the disk-shaped substrate 1014, and the substrate 1014 A group of three types of elements 910a, 910b, and 912 is formed on the surface.

  FIG. 10E shows a step of forming the lower cladding layer 94 of the optical transmission line on the multilayer substrate 950. The clad layer 94 is formed using, for example, an uncured thermosetting resin or an ultraviolet curable resin. Next, the mounting body 900 is mounted at a desired position. Specifically, as shown in FIG. 10F, the substrate 1014 shown in FIG. 10D is rotated and the multilayer substrate 950 coated with the cladding layer 94 is moved in the horizontal direction as appropriate. The electrical conversion element 910a is aligned with the wiring layer 952, and then the substrate 1014 is lowered to mount the element 910a. The element 910 a is held by the uncured clad layer 94 and bonded to the wiring layer 952 by pressing the substrate 1014 toward the clad layer 94. Therefore, when the substrate 1014 is raised, the element 910 a held on the substrate 1014 with a weak adhesive force is separated from the substrate 1014. Similarly, the spherical semiconductor element 912 and the electro-optical conversion element 910b are mounted on the multilayer substrate 950. Next, the clad layer 94 is cured by irradiation with heat or ultraviolet rays. Then, as shown in FIG. 10G, a core layer 92 is applied. The core layer 92 is formed in a desired pattern by, for example, etching. Then, the upper cladding layer 94 is applied and irradiated with heat or ultraviolet rays, whereby the photoelectric circuit board 940 of Embodiment 9 is obtained.

  The illustrated manufacturing method is merely an example, and the photoelectric circuit board of the present invention may be manufactured using other known techniques for mounting a spherical element. Further, by applying this manufacturing method, the mounting body of the first embodiment can be manufactured. For example, when elements are stacked in order using the substrate illustrated in FIG. 10D, a mounted body in which the terminals 958 are electrically connected can be obtained.

(Embodiment 10)
FIG. 11: is a side view which shows typically another form of the photoelectric circuit board | substrate of this invention as Embodiment 10 of this invention. In the illustrated opto-electric circuit board 1140, the mounting body 1100 of the present invention optically connects two optical transmission lines 1120a and 1120b.

  The optical transmission lines 1120a and 1120b are, for example, optical fibers. In the illustrated form, the optical transmission lines 1120a and 1120b are supported by an appropriate support member 1130 (for example, an adhesive or a resin layer). Circuit board 1150 is a multilayer board having the same configuration as that of circuit board 950 in the ninth embodiment.

  This photoelectric circuit board 1140 is different from the ninth embodiment in that the mounting body 1100 is not disposed inside the optical transmission line. In this circuit board, the mounting body 1100 converts an optical signal emitted from the optical transmission line 1120a into electricity, an optical-electric conversion element 1110a, a spherical semiconductor element 1112 having an amplification function, and an electrical signal into an optical signal. The electro-optical conversion element 1110b is emitted toward the optical transmission line 1120b. As in the ninth embodiment, the mounting body 1100 is mounted on the wiring layer 1152 of the circuit board 1150, and the elements are connected to each other through the wiring layer 1152. Further, in the mounting body 1100, the elements are electrically connected also by contacting with each other through an electrical connection portion 1114.

  It can be said that this form is the form which implement | achieved Embodiment 1-4 demonstrated with reference to FIGS. 1-4 on the circuit board. Therefore, as described in connection with the first to fourth embodiments, the mounting body may be configured to branch light emitted from one optical transmission path into a plurality of optical transmission paths, or an optical switch. It may be configured to function as:

(Embodiment 11)
FIG. 12 is a perspective view schematically showing one form of an optical transmission line having a two-layer structure as an eleventh embodiment of the present invention. In FIG. 12, in an optical transmission line 1220 having a two-layer structure, an optical signal incident on one end of the first optical transmission line 1240 from the direction of arrow x is emitted from the other end in the direction of arrow y. In addition, a state where the light is branched by the mounting body 1200 of the present invention and emitted from the second optical transmission line 1260 is shown. This optical transmission line 1220 is a modification of the eighth embodiment, and differs from the eighth embodiment in that the optical signal is branched three-dimensionally.

  In the optical transmission line 1220, the first optical transmission line 1240 includes a core layer 1242 and a cladding layer 1244, and may further include a cladding layer on the lower side if necessary. The second optical transmission line 1260 also has a core layer 1262 and a cladding layer 1264, and may further have a cladding layer on the upper side if necessary. The layer 1225 is provided to separate the two optical transmission lines except for the portion where the spherical semiconductor element 1210b is located as shown in the figure, and is usually a clad layer.

  A mounting body 1200 of the present invention shown in FIG. 12 has an optical-electric conversion element 1210a, a spherical semiconductor element 1212a, and an electric-electrical element for emitting light incident on one end of the optical transmission line 1240 from the other end. It includes a light conversion element 1210b, and further includes spherical semiconductor elements 1212b, 1212c and 1212d, and an electro-light conversion element 1210c. The photoelectric conversion element 1210a, the spherical semiconductor element 1212a, and the photoelectric conversion element 1210b amplify, for example, an optical signal that passes through the core layer 1242 of the optical transmission line 1220. In this case, the spherical semiconductor element 1212a is amplified. It has a function. The spherical semiconductor element 1212b is electrically connected to the spherical semiconductor elements 1212a and 1212c, serves to connect the optical transmission lines 1240 and 1260, and has a simple wiring or an amplification function circuit. The spherical semiconductor elements 1212c and 1212d and the electro-optical conversion element 1210c are arranged in the core layer 1262 of the optical transmission line 1260. The spherical semiconductor elements 1212c and 1212d have, for example, an amplification function circuit or simple wiring so that a desired optical signal can be extracted from the optical transmission line 1260. By using such a spherical semiconductor element, it is possible to connect a plurality of optical transmission lines in a three-dimensional manner. In the drawing, for easy understanding, an electrical connection portion between elements is omitted.

  For example, the mounting body 1200 can be arranged three-dimensionally as follows. First, the elements 1210a, 1212a, and 1210b are disposed in the core layer 1242. Next, the element 1212 b is connected to the element 1212 a and the periphery is covered with a resin 1227. The resin 1227 may be a resin constituting the core layer, for example. Next, the layer 1225 is formed so that a part of the element 1212b is exposed. Subsequently, after forming the cladding layer 1264 and removing the portion corresponding to the core layer, the elements 1212c, 1212d and 1210c are arranged, and further the core layer 1262 is formed, whereby the optical transmission line 1220 having a structure as shown in the figure is obtained. can get.

  This optical transmission line 1220 may be an optical transmission line of the photoelectric circuit board as in the ninth embodiment. That is, the optical transmission line 1220 may be formed on the surface of the circuit board.

  The mount assembly of the present invention is provided in various forms using the omnidirectionality of the spherical element. Therefore, the mount assembly of the present invention enables two or more optical transmission lines to be optically connected efficiently. In addition, the mount assembly of the present invention is arranged in the optical transmission line, and can convert the optical path with a small transmission loss.

It is a side view which shows the mounting body of Embodiment 1 of this invention. It is a side view which shows the mounting body of Embodiment 2 of this invention. It is a side view which shows the mounting body of Embodiment 3 of this invention. It is a side view which shows the mounting body of Embodiment 4 of this invention. It is a side view which shows the mounting body of Embodiment 5 of this invention. It is a side view which shows the mounting body of Embodiment 6 of this invention. (A) And (B) is the side view and top view which show the optical transmission line of Embodiment 7 of this invention, (C) is a top view which shows the conventional optical transmission line. (A) is a top view which shows the optical transmission line of Embodiment 8 of this invention, (B) is a top view which shows the conventional optical transmission line. It is a side view which shows the photoelectric circuit board of Embodiment 9 of this invention. It is a schematic diagram which shows an example of the manufacturing method of the photoelectric circuit board of Embodiment 9 of this invention. It is a schematic diagram which shows the photoelectric circuit board of Embodiment 10 of this invention. It is a perspective view which shows the optical transmission line of Embodiment 11 of this invention. (A)-(C) are each a schematic diagram which shows the example of the manufacturing method of the spherical photoelectric conversion element which comprises the mounting body of this invention. It is a schematic diagram which shows an example of the method of connecting the elements which comprise the mounting body of this invention.

Explanation of symbols

100, 200, 300, 400, 500, 600 ... mounting body,
10a, 10b, 10c, 10d, 10e, 10f, 10g, 10h, 10i, 10j, 10k, 10l ... photoelectric conversion element,
12a, 12b, 12c, 12d, 12e ... spherical semiconductor element,
14 ... electrical connections,
16 ... resin,
18 ... External electrode,
20, 20a, 20b, 20c, 20d, 22, 22a, 22b, 22c, 22d ... optical fiber,
19 ... coil,
22 ... Branch joint,
60a, 60b, 60c ... wavelength filter,
70: Optical transmission line,
72 ... core layer,
74 ... cladding layer,
700 ... mounted body,
710a, 710b ... photoelectric conversion element,
712 ... spherical semiconductor element,
714 ... electrical connection,
719 ... coil,
80 ... optical transmission line,
800 ... mounted body,
810a, 810b, 810c ... photoelectric conversion element,
812a, 812b, 812c, 812d ... spherical semiconductor element,
814 ... electrical connection,
819 ... Coil,
90 ... optical transmission line,
92 ... core layer,
94 ... cladding layer,
900 ... Mounted body,
910a, 910b ... photoelectric conversion element,
912 ... spherical semiconductor element,
940 ... Optical circuit board,
950 ... Circuit board,
952 ... wiring layer,
954 ... Electrical insulation layer,
956 ... Inner via,
958 ... terminal,
1010 ... metal spherical body,
1012 ... substrate,
1014 ... substrate,
1100 ... Mounted body,
1110a, 1110b ... photoelectric conversion element,
1112 ... spherical semiconductor element,
1114. Electrical connection,
1120a, 1120b ... optical transmission line,
1130 ... support member,
1140 ... optoelectric circuit board,
1150 ... circuit board,
1152 ... wiring layer,
1200 ... mounted body,
1210a, 1210b, 1210c ... photoelectric conversion elements,
1212a, 1212b, 1212c, 1212d ... spherical semiconductor element,
1220: Optical transmission line,
1225 ... layer,
1227 ... resin,
1240 ... first optical transmission line,
1242 ... core layer,
1246 ... cladding layer,
1260 ... second optical transmission line,
1262 ... core layer,
1264 ... clad layer,
1310 ... electrodes,
1300 ... Optical element,
1400: An anisotropic conductive film.

Claims (13)

A mounting body that emits an optical signal corresponding to an incident optical signal,
Including at least two photoelectric conversion elements and at least one spherical semiconductor element forming an electronic circuit;
At least one of the photoelectric conversion elements is an element that converts an optical signal into an electric signal, and at least one is an element that converts an electric signal into an optical signal,
At least one photoelectric conversion element is a spherical photoelectric conversion element having a photoelectric conversion part formed on the surface of a substantially spherical semiconductor material,
A spherical semiconductor element is located between an element that converts an optical signal into an electrical signal and an element that converts an electrical signal into an optical signal,
The elements are electrically connected ,
As the photoelectric conversion element, n spherical photoelectric conversion elements (n is an integer of 2 or more),
The spherical semiconductor element includes x spherical semiconductor elements (x is an integer of 1 or more),
a spherical photoelectric conversion element (a is an integer of 1 or more and a <n) converts an optical signal into an electrical signal,
(Na) spherical photoelectric conversion elements convert an electrical signal into an optical signal,
A mounting body in which n is 3 or more, x is 1 or more, and an optical signal incident from one direction is branched in two or more directions .   The photoelectric conversion element further includes a circuit board, the photoelectric conversion element and the spherical semiconductor element are mounted on the surface of the circuit board, and the photoelectric conversion element and the spherical semiconductor element are electrically connected by wiring of the circuit board. The mounting body according to claim 1.   The mounting body according to claim 1, wherein the elements are electrically connected by contacting each other via an electrical connection portion. The mounting body according to claim 1, wherein the spherical photoelectric conversion element that converts the optical signal into an electrical signal receives an optical signal emitted from a plurality of optical transmission paths. The spherical photoelectric conversion spherical semiconductor elements are electrically connected to the element to form an electronic circuit for amplifying at the optimum amplification factor received optical signal according to the wavelength of received light signals, according to claim 4 The mounting body described in. The mounting body according to claim 1, wherein the spherical photoelectric conversion element that converts the electrical signal into an optical signal emits the optical signal to a plurality of optical transmission paths. The mounting body according to any one of claims 1 to 6 , wherein a part or all of the mounting body is covered with a transparent resin. The mounting body according to claim 7 , wherein the transparent resin includes at least one resin selected from the group consisting of an acrylic resin, a polycarbonate resin, a polystyrene resin, a styrene-acrylonitrile copolymer, and an epoxy resin. The mounting body according to any one of claims 1 to 8 , wherein a passive component is mounted. An optical transmission path comprising a core layer and a clad layer, wherein the mounting body according to any one of claims 1 to 9 is disposed in the core layer. The optical transmission line according to claim 10 , comprising a branched portion, wherein the mounting body is disposed at the branched portion. It includes two or more laminated layers having an optical transmission line composed of a core layer and a clad layer, and the mounting body according to any one of claims 1 to 9 is disposed across the two layers, One of the optical transmission path of the layers in the optical transmission path of the other layers are branches, the optical transmission path of the multi-layer structure. A circuit board having an optical transmission line, wherein the optical transmission line includes a core layer and a cladding layer, and the mounting body according to any one of claims 1 to 9 is disposed in the core layer. Electric circuit board.

Images