JP4508259B2 - Multilayer capacitor - Google Patents

Description

  The present invention relates to a multilayer capacitor, and more particularly to a multilayer capacitor that can be advantageously applied in a high-frequency circuit.

  The frequency characteristics of a multilayer capacitor are determined by its capacitance component and inductance component, but it is generally difficult to achieve good pass characteristics uniformly over a wide frequency range.

  FIG. 19 shows an example of frequency characteristics of the multilayer capacitor. The multilayer capacitor whose frequency characteristics are shown in FIG. 19 is a commercially available multilayer ceramic capacitor having a planar dimension of 1.0 mm × 0.5 mm and a capacitance of 220 nF.

  As can be seen from FIG. 19, in general multilayer capacitors, the inductance component tends to increase and the pass characteristics (S21 in the S parameter) tend to deteriorate in the vicinity of 10 GHz and beyond.

On the other hand, for example, Japanese Laid-Open Patent Publication No. 2000-243657 (Patent Document 1) proposes a multilayer capacitor having a wide pass characteristic. This multilayer capacitor is advantageously used as a DC component cutting capacitor in the field of high-speed optical communication, and is characterized by having a configuration in which a low-capacity portion and a high-capacity portion are combined.
JP 2000-243657 A

  However, the multilayer capacitor described in Patent Document 1 has a wide bandpass characteristic of up to about 20 GHz, and cannot sufficiently handle a higher frequency range, for example, a high frequency range of about 40 GHz.

  Accordingly, an object of the present invention is to provide a multilayer capacitor capable of improving the pass characteristics from a low frequency range of 10 kHz to a high frequency range of 40 GHz, for example.

The multilayer capacitor according to the present invention constitutes a composite capacitor that provides at least first, second, and third capacitor elements, and includes a plurality of stacked dielectric layers and a plurality of interfaces between the dielectric layers. Formed on the bottom surface of the capacitor body, each having a plurality of first and second internal electrodes, each of which is formed along each of the first and second internal electrodes. The first terminal electrode has a portion formed on the same surface as the first terminal electrode on the bottom surface of the capacitor body, and is formed to extend to an adjacent surface adjacent to the same surface. And a second terminal electrode. Here, the stacking direction of the plurality of dielectric layers is perpendicular to the thickness direction of the capacitor body, and the adjacent surface of the capacitor body is perpendicular to the surfaces of the first and second internal electrodes. Placed in.

The first and second internal electrodes are respectively drawn out from the square-shaped first and second capacitance forming portions and the first and second capacitance forming portions facing each other through a dielectric layer. And first and second lead portions connected to the first and second terminal electrodes, respectively.
The second lead portion is connected to the corner portion of the second capacitance forming portion located in the vicinity of the bottom surface and the adjacent surface from which the second terminal electrode extends, and extends to the bottom surface. It is drawn to the bottom surface and the adjacent surface so as to have a side and a second side extending toward the adjacent surface.
Further, the corner portion of the first capacitance forming portion located in the vicinity of the bottom surface and the adjacent surface where the second terminal electrode extends is closer to the first side than the second side of the second lead portion. Located close to each other.

  The first capacitor element has a first capacitance component given by the opposing first and second capacitance forming portions, and the second capacitor element is given by the opposing first and second terminal electrodes. The third capacitor element has a second capacitance component to be applied, and the third capacitor element is provided by facing the aggregate of the plurality of first and second capacitance forming portions and each of the first and second terminal electrodes. It has 3 capacitive components.

Further, when the first and second terminal electrodes are oriented in a predetermined direction, there is no one that protrudes from the first and second terminal electrodes in the predetermined direction.

  Preferably, the inductance value of the first inductance component formed by the current flowing through the first capacitor element is 500 pH or less, and the inductance of the second inductance component formed by the current flowing through the second capacitor element Greater than both the value and the inductance value of the third inductance component formed by the current flowing through the third capacitor element.

As described above, the multilayer capacitor according to the present invention constitutes a composite capacitor that provides at least the first, second, and third capacitor elements, and includes a multilayer capacitor body, the first and second capacitors. The second terminal electrode has a portion formed on the same surface as the first terminal electrode on the bottom surface of the capacitor body, and is adjacent to the adjacent surface. The stacking direction of the plurality of dielectric layers is perpendicular to the thickness direction of the capacitor body, and the adjacent surface of the capacitor body is perpendicular to the surfaces of the first and second internal electrodes. The first and second internal electrodes are respectively provided with quadrangular first and second capacitance forming portions and first and second lead portions, and the second lead portion. Is the bottom and A first side extending toward the bottom surface and connected to a corner portion of the second capacitance forming portion located adjacent to the adjacent surface extending the two terminal electrodes; and a second side extending toward the adjacent surface A corner portion of the first capacitance forming portion which is drawn out to the bottom surface and the adjacent surface and is located close to the adjacent surface from which the bottom surface and the second terminal electrode extend. In the other aspect of the present invention, the first to third capacitor elements described above are as follows: the second side of the lead portion is positioned closer to the first side. It has a characteristic configuration.

  That is, the first capacitor element includes a first capacitance component given by the opposing first and second capacitance forming portions, and a current between the first and second lead portions in the first and second internal electrodes. And a first inductance component provided by the path.

  The second capacitor element includes a second capacitance component provided by facing the first and second terminal electrodes, and a second inductance provided by a current path between the first and second terminal electrodes in the dielectric layer. With ingredients.

  The third capacitor element includes a third capacitance component provided by facing an aggregate of a plurality of first and second capacitance forming portions and each of the first and second terminal electrodes, and the first and second capacitance elements. And a third inductance component provided by a current path in the peripheral portion of the second capacitance forming portion.

  In the multilayer capacitor according to the present invention, the pass band is constituted by at least one of the first to third capacitance components and the first to third inductance components as described above.

In another aspect of the present invention, when the first and second terminal electrodes are directed in a predetermined direction, there is no one projecting from the first and second terminal electrodes in the predetermined direction.

  In the multilayer capacitor described above, preferably, the first capacitance component and the first inductance component function in the frequency range up to 10 GHz with respect to the pass band, and the first capacitance component in the frequency range of 10 to 15 GHz. The inductance component and the second inductance component function, the second inductance component functions in the frequency range of 15 to 20 GHz, and the second and third inductance components function in the frequency range of 20 to 30 GHz, In the frequency range of 30 GHz or more, the third inductance component functions.

  Preferably, the pass characteristic is −0.5 dB or higher in the frequency range up to 15 GHz, and the pass characteristic is −1.0 dB or higher in the frequency range of 15 GHz or higher.

  According to the present invention, a composite capacitor is provided that provides at least first, second, and third capacitor elements. The first capacitor element functions in a relatively low frequency range, and in a higher frequency range, The capacitor element that functions according to the frequency range can be changed such that the second capacitor element functions and the third capacitor element functions at a higher frequency range. As a result, the combination of the first, second, and third capacitor elements can realize continuous pass characteristics over a wide frequency range.

  For example, in the frequency range up to 0.1 GHz, the insertion loss is reduced by increasing the first capacitance component provided by the first capacitor element, and in the frequency range of 0.1 to 10 GHz, the first capacitance component is increased. The insertion loss is reduced by shortening the current path between the first and second lead portions, which is the first inductance component provided by the capacitor element, and the second capacitor element has a frequency range of 15 to 20 GHz. The insertion loss is reduced by shortening the current path between the first and second terminal electrodes serving as the second inductance component to be applied, and the third inductance provided by the third capacitor element in the frequency range of 30 GHz or higher. Insertion loss can be reduced by shortening the current path around the first and second capacitance forming portions as components.

  Therefore, in the multilayer capacitor according to the present invention, for example, the first capacitance component and the second inductance component function in the frequency range up to 10 GHz, and the first inductance component and the second inductance component in the frequency range of 10 to 15 GHz. 2 functions, the second inductance component functions in the frequency range of 15-20 GHz, the second and third inductance components function in the frequency range of 20-30 GHz, and the frequency of 30 GHz or higher. If the third inductance component functions in the region, good pass characteristics can be obtained over a wide frequency region as described above.

  1 to 3 are for explaining a multilayer capacitor 1 according to an embodiment of the present invention. Here, FIG. 1 is a front view showing the inside of the multilayer capacitor 1 in a transparent manner, and FIG. 2 is a front view showing a specific cross section of the multilayer capacitor 1, and (a) and (b) are mutually connected. Different cross sections are shown. FIG. 3 is an enlarged view of FIG. 1, and is a diagram for explaining a composite capacitor configured in the multilayer capacitor 1.

  Referring mainly to FIGS. 1 and 2, multilayer capacitor 1 is formed along a plurality of laminated dielectric layers 2 made of, for example, a dielectric ceramic, and a plurality of interfaces between dielectric layers 2. A capacitor body 5 having a multilayer structure is provided, which includes a plurality of first and second internal electrodes 3 and 4 that are alternately arranged in the stacking direction.

The multilayer capacitor 1 also includes first and second terminal electrodes 6 and 7 formed on the outer surface of the capacitor body 5. The first terminal electrode 6 is formed on the bottom surface of the capacitor body 5. The second terminal electrode 7 has a portion formed on the same surface as the first terminal electrode 6 on the bottom surface of the capacitor body 5 and is formed to extend to an adjacent surface adjacent to the same surface. Is done. The stacking direction of the plurality of dielectric layers 2 is perpendicular to the thickness direction (T) of the capacitor body. Further, when the first and second terminal electrodes 6 and 7 are directed in a predetermined direction, there is no one projecting from the first and second terminal electrodes 6 and 7 in the predetermined direction.

2A shows the first internal electrode 3, while FIG. 2B shows the second internal electrode 4, FIG. 2A shows the first internal electrode 3. As shown in FIG. A cross section passing through the internal electrode 3 is shown, and FIG. 2B shows a cross section passing through the second internal electrode 4. The surface of the capacitor body 5 on which the second terminal electrode 7 is formed and adjacent to the same surface on which the first terminal electrode 6 is formed is the first and second inner surfaces. It arrange | positions so that it may become perpendicular | vertical with respect to the surface of the electrodes 3 and 4. FIG.

The first and second internal electrodes 3 and 4 are respectively formed in quadrangular first and second capacitance forming portions 8 and 9 that face each other with the dielectric layer 2 therebetween, and first and second capacitance formations. First and second lead portions 10 and 11 are provided from each of the portions 8 and 9 and connected to the first and second terminal electrodes 6 and 7, respectively.
The second lead portion 11 is connected to the corner portion of the second capacitance forming portion 9 located in the vicinity of the bottom surface and the adjacent surface from which the second terminal electrode 7 extends, and extends toward the bottom surface. A bottom surface having a first side (a side extending in the vertical direction in FIGS. 1 to 3) and a second side (a side extending in the horizontal direction in FIGS. 1 to 3) extending toward the adjacent surface. And drawn to the adjacent surface. Further, the corner portion of the first capacitance forming portion 8 located in the vicinity of the bottom surface and the adjacent surface on which the second terminal electrode 7 extends is first than the second side of the second lead portion 11. Located so as to be close to the side. That is, with reference to FIG. 3, the lower right corner of the first internal electrode 3 is disposed near the current path where the inductance component represented by L1 is parasitic.

  The multilayer capacitor 1 having the above configuration constitutes a composite capacitor that provides at least the first, second and third capacitor elements.

  Referring to FIG. 3, the first capacitor element includes a first capacitance component C1 provided by opposing first and second capacitance forming portions 8 and 9, and first and second internal electrodes 3 and 4. A current path between the first and second lead portions 10 and 11, that is, a current path from one lead portion 10 or 11 through a part of the capacity forming portion 8 or 9 to the other lead portion 11 or 10. And a first inductance component L1 as an equivalent series inductance given by.

  The second capacitor element includes a second capacitance component C2 provided by the opposing first and second terminal electrodes 6 and 7, and a current between the first and second terminal electrodes 6 and 7 in the dielectric layer 2. A second inductance component L2 as an equivalent series inductance provided by a path, that is, a current path from one terminal electrode 6 or 7 through a part of the dielectric layer 2 to the other terminal electrode 7 or 6. is doing.

  The third capacitor element has a third capacitance component C3 that is given by the facing of the aggregate of the plurality of first and second capacitance forming portions 8 and 9 and each of the first and second terminal electrodes 6 and 7. And a third inductance component L3 as an equivalent series inductance provided by the current paths around the first and second capacitance forming portions 8 and 9.

  The above-described first to third capacitor elements change depending on the frequency range. That is, the first capacitor element functions in a relatively low frequency range, the second capacitor element functions in a higher frequency range, and the third capacitor element functions in a higher frequency range. The pass band of the multilayer capacitor 1 is constituted by at least one of the first to third capacitance components C1 to C3 and the first to third inductance components L1 to L3.

  As a result, the multilayer capacitor 1 can achieve good pass characteristics over a wide frequency range by combining these first, second and third capacitor elements.

As Example 1, a multilayer capacitor 1 as shown in FIG. 1 was produced based on the following design.

  First, a dielectric ceramic having a relative dielectric constant of 2500 was used as a dielectric constituting the dielectric layer 2, and the thickness of the dielectric layer 2 was set to 3 μm. The total number of laminated layers of the first and second internal electrodes 3 and 4 was 75, and the capacitance provided by the multilayer capacitor 1 was 220 nF.

  Further, the dimensions of each part of the multilayer capacitor 1 will be described with reference to FIG. 1. The longitudinal dimension L of the capacitor body 5 is 1.0 mm, and the thickness direction dimension T is 0.8 mm. The width direction dimension W in the direction orthogonal to the paper surface of FIG. 1 was 0.5 mm.

  Further, the length A of the lead portions 10 and 11 is 0.1 mm, the distance B between the lead portions 10 and 11 is 0.2 mm, the distance C between the terminal electrodes 6 and 7 is 0.1 mm, and the capacitance forming portion The vertical length D of 8 and 9 was 0.6 mm, and the horizontal length E was also 0.8 mm.

  FIG. 4 shows a pass characteristic (insertion loss) S21 up to 35 GHz of the multilayer capacitor 1 manufactured based on the design as described above.

  In the frequency range up to 10 GHz, current flows through the capacity forming portions 8 and 9 having low impedance. Further, the current at this time flows so that the distance between the first and second lead portions 10 and 11 is the shortest. As a result, the first capacitance component C1 provided by the opposing of the first and second capacitance forming portions 8 and 9 and the first inductance provided by the current path between the first and second lead portions 10 and 11 The first capacitor element having the component L1 functions.

  In the multilayer capacitor 1 according to the first embodiment, the first capacitance component C1 is 220 nF, and the first inductance component L1 is 250 pH. The resonance frequency of the first capacitance component C1 and the first inductance component L1 is 21 MHz, and S21 of 5 to 10 GHz in the pass characteristic shown in FIG. 4 is an equivalent series of 250 pH given by the first inductance component L1. It depends on the inductance value.

  Next, in a frequency range exceeding 10 GHz, the impedance is increased by the first inductance component L1 of the first capacitor element, and current flows between the first and second terminal electrodes 6 and 7 having a lower impedance. start. Here, in the frequency range of 15 to 20 GHz, the second capacitive component C2 given by the facing of the first and second terminal electrodes 6 and 7 and the current path between the first and second terminal electrodes 6 and 7 The second capacitor element having the second inductance component L2 given by

  In the multilayer capacitor 1 according to the first embodiment, the second capacitance component C2 is 11 pF, and the second inductance component L2 is 200 pH. Therefore, the resonance frequency of the second capacitance component C2 and the second inductance component L2 is 3.4 GHz, and S21 at 15 to 20 GHz shown in FIG. 4 is equivalent to 200 pH given by the second inductance component L2. It depends on the series inductance value.

  Next, in the frequency range exceeding 20 GHz, the impedance between the first and second terminal electrodes 6 and 7 becomes high, and the current flows at the edges of the first and second capacitance forming portions 8 and 9 and their peripheral portions. Begins to flow into the dielectric.

  In particular, when the frequency exceeds 30 GHz, each of the plurality of first and second capacitance forming portions 8 and 9 behaves like one metal lump, and the current is an aggregate of the capacitance forming portions 8 and 9 due to the skin effect. A third capacitance component C3 that flows to the surface of the first and second capacitance forming portions 8 and 9 and is provided by facing each of the first and second terminal electrodes 6 and 7; A third capacitor element having a third inductance component L3 provided by a current path around the first and second capacitance forming units 8 and 9 functions.

  In the multilayer capacitor 1 according to the first embodiment, the third capacitance component C3 is 40 pF, and the third inductance component L3 is 230 pH. The resonance frequency of the third capacitance component C3 and the third inductance component L3 is 1.6 GHz, and S21 in the frequency range of 30 GHz or more shown in FIG. 4 is equivalent to 230 pH given by the third inductance component L3. It depends on the series inductance value.

  In order to make the insertion loss S21 flat and small in a wide frequency range, the inductance values of the first, second and third inductance components L1, L2 and L3 are made small and these inductance values are made close to each other. There is a need to.

  In the case of the first embodiment, by shortening the current path between the first and second lead portions 10 and 11, the value of the first inductance component L1 is reduced, and the first and second terminals By shortening the current path between the electrodes 6 and 7, the value of the second inductance component L2 is reduced, and further, the distance around the capacitance forming portions 8 and 9 is shortened to shorten the current path in the peripheral portion. As a result, the value of the third inductance component L3 is reduced.

  Example 1 having the structure shown in FIG. 1 and providing the pass characteristics shown in FIG. 4 is based on a standard design within the scope of the present invention. In the following, some other embodiments, that is, embodiments 2 to 8, which have various designs based on the present invention will be described.

  The dimensions of each part of the multilayer capacitors according to Examples 2 to 8 are shown in Table 1. Each value of the capacitance components C1 to C3 and the inductance components L1 to L3 included in each of the first to third capacitor elements is shown in Table 1. Are shown in Table 2.

  In Tables 1 and 2, numerical values for Example 1 are also shown to facilitate comparison with Example 1 described above, and numerical values different from Example 1 are enclosed in a frame. Show.

  FIGS. 5 and 6 are diagrams corresponding to FIGS. 1 and 4, respectively, showing the second embodiment.

  In Example 2, compared with Example 1, as shown in Table 1, the length A of the lead-out portions 10 and 11 is increased to 0.2 mm, and accordingly, the thickness direction dimension T of the capacitor body 5 is increased. The length is as long as 0.9 mm. Other configurations of the second embodiment are the same as those of the first embodiment.

  As a result of the above-described dimension change, the current path for supplying the first inductance component L1 of the first capacitor element becomes longer, and as shown in Table 2, the value of the first inductance component L1 becomes as large as 600 pH. Due to the influence, as shown in FIG. 6, the loss is as large as about -0.6 dB in S21 in the vicinity of 10 GHz.

  Further, in the third capacitor element, the interval between the aggregate of the capacitance forming portions 8 and 9 that give the third capacitance component C3 and each of the terminal electrodes 6 and 7 becomes longer, and the value of the third capacitance component C3 is increased. Is as small as 20 pF.

  7 and 8 are diagrams corresponding to FIGS. 1 and 4, respectively, showing the third embodiment.

  In Example 3, compared with Example 1, as shown in Table 1, the distance B between the drawer portions 10 and 11 is set to 0.5 mm. Other configurations of the third embodiment are the same as those of the first embodiment.

  As a result of the dimensional change described above, the current path between the lead portions 10 and 11 that provides the first inductance component L1 of the first capacitor element becomes longer, and as shown in Table 2, the value of the first inductance component L1 Is as high as 550 pH. Due to this influence, as shown in FIG. 8, the loss in S21 in the vicinity of 12 to 13 GHz is about −0.6 dB, which is large.

  Of the first and second terminal electrodes 6 and 7 facing the aggregate of the capacitance forming portions 8 and 9 that provide the third capacitance component C3 of the third capacitor element, the first terminal electrode 6 Since the area is large, as shown in Table 2, the value of the third capacitance component C3 is as large as 60 pF. Note that the third capacitance component C3 hardly affects the pass characteristics.

  FIG. 9 and FIG. 10 are diagrams corresponding to FIG. 1 and FIG.

  In Example 4, as shown in Table 1, the distance B between the drawer portions 10 and 11 is smaller than Example 3, but larger than Example 1 and set to 0.45 mm. Other configurations of the fourth embodiment are the same as those of the first embodiment.

  Therefore, as shown in Table 2, the first inductance component L1 of the first capacitor element is smaller than that of the third embodiment but larger than that of the first embodiment, and the value thereof is 500 pH. Due to this influence, as shown in FIG. 10, S21 is lowered in the vicinity of 13 GHz, but the value of −0.5 dB or more is maintained. And S21 maintains the value more than -1.0 dB also in the frequency range of 15 GHz or more. From these facts, it can be seen that if the value of the first inductance component L1 is 500 pH or less, the loss can be kept small, which is preferable.

  The third capacitance component C3 of the third capacitor element is larger than that of the first embodiment and shows a value of 55 pF, as in the case of the third embodiment. However, this hardly affects the pass characteristics. .

  FIG. 11 and FIG. 12 are diagrams corresponding to FIG. 1 and FIG.

  In Example 5, as shown in Table 1, the distance B between the lead portions 10 and 11 was increased to 0.5 mm as compared with Example 1, and the distance C between the terminal electrodes 6 and 7 was set to 0. It is as long as 35 mm. Other configurations of the fifth embodiment are the same as those of the first embodiment.

  As a result of the above-described dimensional change, first, the current path between the lead portions 10 and 11 that provides the first inductance component L1 of the first capacitor element becomes long. As shown in Table 2, the first inductance component L1 Is increased to 550 pH. Therefore, as shown in FIG. 12, S21 in the vicinity of 12 to 13 GHz is about −0.6 dB, and the loss is large.

  In addition, since the current path between the first and second terminal electrodes 6 and 7 that provides the second inductance component L2 of the second capacitor element becomes long, as shown in Table 2, the second inductance component L2 Is as large as 400 pH. For this reason, as shown in FIG. 12, the loss is large at about -1.1 dB for S21 in the vicinity of 20 GHz.

  In addition, since the distance between the first terminal electrode 6 and the second terminal electrode 7 that provides the second capacitance component C2 of the second capacitor element is wide, the value of the second capacitance component C2 is 8.5 pF. It is getting smaller.

  FIG. 13 and FIG. 14 are diagrams corresponding to FIG. 1 and FIG.

  In Example 6, compared to Example 1, as shown in Table 1, the vertical length D of the capacitance forming portions 8 and 9 is increased to 0.8 mm, and accordingly, the thickness of the capacitor body 5 is increased. The direction dimension T is as large as 1.0 mm. Other configurations of the sixth embodiment are the same as those of the first embodiment.

  As a result of the above-described dimensional change, the current path around the capacitance forming portions 8 and 9 that provides the third inductance component L3 of the third capacitor element becomes longer. As shown in Table 2, the third inductance component is increased. The value of L3 is as large as 320 pH. Due to this influence, as shown in FIG. 14, the loss is large as S21 near 35 GHz is −1.7 dB or less.

  FIG. 15 and FIG. 16 are diagrams corresponding to FIG. 1 and FIG.

  In Example 7, compared to Example 1, as shown in Table 1, the horizontal length E of the capacitance forming portions 8 and 9 is increased to 1.0 mm, and accordingly, the length of the capacitor body 5 is increased. The vertical dimension L is as large as 1.2 mm. Other configurations of the seventh embodiment are the same as those of the first embodiment.

  As a result of the above-described dimensional change, the current path around the capacitance forming portions 8 and 9 that provides the third inductance component L3 of the third capacitor element becomes longer. As shown in Table 2, the third inductance component is increased. The value of L3 is as large as 270 pH. Due to this influence, as shown in FIG. 16, the loss is as large as about -1.1 dB in S21 in the vicinity of 35 GHz.

  FIG. 17 and FIG. 18 are diagrams corresponding to FIG. 1 and FIG.

In Example 8, the dimensions of each part are the same as in Example 1 as shown in Table 1, but as shown in FIG. 17, the first and second drawer parts 10 and 11 and the first and The number of each of the second terminal electrodes 6 and 7 is two, and the lead portions 10 and 11 and the terminal electrodes 6 and 7 are located at the center of each of the opposing surfaces of the capacitor body 5. ing. In Example 8, the second terminal electrode 7 has a portion formed on the same surface as the first terminal electrode 6 on the outer surface of the capacitor body 5, but adjacent to the same surface. It is outside the scope of the present invention in that it does not extend to the surface.

  The difference from the first embodiment as described above has an effect on the third capacitance component C3 of the third capacitor element as shown in Table 2, but the pass characteristics shown in FIG. This is substantially the same as the case of the first embodiment shown in FIG.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view illustrating an embodiment of the present invention, and is a perspective view illustrating the inside of a multilayer capacitor 1 according to Example 1; It is a front view which shows the specific cross section of the multilayer capacitor 1 shown in FIG. 1, (a) and (b) have shown mutually different cross sections. FIG. 2 is an enlarged view of FIG. 1 and is a diagram for explaining a composite capacitor configured in the multilayer capacitor 1. It is a figure which shows the passage characteristic obtained in Example 1 which produced the multilayer capacitor 1 shown in FIG. 1 according to the specific design. FIG. 6 is a diagram corresponding to FIG. FIG. 5 is a diagram illustrating Example 2 and corresponding to FIG. 4. FIG. 9 is a diagram corresponding to FIG. 1 and showing Example 3. FIG. 5 is a diagram illustrating Example 3 and corresponding to FIG. 4. FIG. 10 is a diagram corresponding to FIG. 1 and showing Example 4. FIG. 5 is a diagram corresponding to FIG. FIG. 10 is a diagram corresponding to FIG. FIG. 6 is a diagram corresponding to FIG. 4 and showing Example 5. FIG. 10 is a diagram corresponding to FIG. 1 and showing Example 6. FIG. 7 is a diagram corresponding to FIG. 4 and showing Example 6. FIG. 10 is a diagram corresponding to FIG. FIG. 9 is a diagram corresponding to FIG. 4 and showing Example 7. FIG. 10 is a diagram corresponding to FIG. FIG. 9 is a diagram corresponding to FIG. 4 and showing Example 8. It is a figure which shows an example of the passage characteristic of the conventional multilayer capacitor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Multilayer capacitor 2 Dielectric layer 3, 4 Internal electrode 5 Capacitor main body 6, 7 Terminal electrode 8, 9 Capacitance formation part 10, 11 Lead-out part C1 1st capacitance component C2 2nd capacitance component C3 3rd capacitance component L1 1st inductance component L2 2nd inductance component L3 3rd inductance component

Claims (5)

Comprising a composite capacitor providing at least first, second and third capacitor elements,
A plurality of laminated dielectric layers, and a plurality of first and second internal electrodes respectively formed along a plurality of interfaces between the dielectric layers and alternately arranged in the lamination direction. A multilayer capacitor body,
A first terminal electrode formed on the bottom surface of the capacitor body;
A second terminal electrode having a portion formed on the same surface as the first terminal electrode on the bottom surface of the capacitor body and extending to an adjacent surface adjacent to the same surface; With
The stacking direction of the plurality of dielectric layers is perpendicular to the thickness direction of the capacitor body,
The adjacent surface of the capacitor body is arranged to be perpendicular to the surfaces of the first and second internal electrodes,
The first and second internal electrodes are respectively formed from square-shaped first and second capacitance forming portions opposed to each other through the dielectric layer, and the first and second capacitance forming portions, respectively. First and second lead portions that are drawn out and connected to the first and second terminal electrodes, respectively,
The second lead portion is connected to a corner portion of the second capacitance forming portion located in the vicinity of the bottom surface and the adjacent surface from which the second terminal electrode extends, and is directed toward the bottom surface. And extending to the bottom surface and the adjacent surface so as to have a first side extending and a second side extending toward the adjacent surface,
A corner portion of the first capacitance forming portion located in the vicinity of the bottom surface and the adjacent surface from which the second terminal electrode extends extends from the second side of the second lead portion. Located close to 1 side,
The first capacitor element has a first capacitance component provided by the opposing first and second capacitance forming portions,
The second capacitor element has a second capacitance component given by the facing of the first and second terminal electrodes,
The third capacitor element has a third capacitance component that is provided by facing the aggregate of a plurality of the first and second capacitance forming portions and each of the first and second terminal electrodes,
When the first and second terminal electrodes are directed in a predetermined direction, there is no one projecting from the first and second terminal electrodes toward the predetermined direction.
Multilayer capacitor. The inductance value of the first inductance component formed by the current flowing through the first capacitor element is 500 pH or less, and the inductance value of the second inductance component formed by the current flowing through the second capacitor element. 2. The multilayer capacitor according to claim 1, wherein the multilayer capacitor is larger than both of an inductance value of a third inductance component formed by a current flowing through the third capacitor element . Comprising a composite capacitor providing at least first, second and third capacitor elements,
A plurality of laminated dielectric layers, and a plurality of first and second internal electrodes respectively formed along a plurality of interfaces between the dielectric layers and alternately arranged in the lamination direction. A multilayer capacitor body,
A first terminal electrode formed on the bottom surface of the capacitor body;
A second terminal electrode having a portion formed on the same surface as the first terminal electrode on the bottom surface of the capacitor body and extending to an adjacent surface adjacent to the same surface; With
The stacking direction of the plurality of dielectric layers is perpendicular to the thickness direction of the capacitor body,
The adjacent surface of the capacitor body is arranged to be perpendicular to the surfaces of the first and second internal electrodes,
The first and second internal electrodes are respectively formed from square-shaped first and second capacitance forming portions opposed to each other through the dielectric layer, and the first and second capacitance forming portions, respectively. First and second lead portions that are drawn out and connected to the first and second terminal electrodes, respectively,
The second lead portion is connected to a corner portion of the second capacitance forming portion located in the vicinity of the bottom surface and the adjacent surface from which the second terminal electrode extends, and is directed toward the bottom surface. And extending to the bottom surface and the adjacent surface so as to have a first side extending and a second side extending toward the adjacent surface,
A corner portion of the first capacitance forming portion located in the vicinity of the bottom surface and the adjacent surface from which the second terminal electrode extends extends from the second side of the second lead portion. Located close to 1 side,
The first capacitor element includes a first capacitance component provided by facing the first and second capacitance forming portions, and between the first and second lead portions in the first and second internal electrodes. A first inductance component provided by a current path of
The second capacitor element is provided by a second capacitance component provided by facing the first and second terminal electrodes and a current path between the first and second terminal electrodes in the dielectric layer. A second inductance component;
The third capacitor element includes a third capacitance component provided by facing an aggregate of a plurality of the first and second capacitance forming portions and each of the first and second terminal electrodes; A third inductance component provided by a current path around the periphery of the first and second capacitance forming units,
A pass band is formed by at least one of the first to third capacitance components and the first to third inductance components,
When the first and second terminal electrodes are directed in a predetermined direction, there is no one projecting from the first and second terminal electrodes toward the predetermined direction.
Multilayer capacitor. The first capacitance component and the first inductance component function in a frequency range up to 10 GHz with respect to the passband, and the first inductance component and the second in a frequency range of 10 to 15 GHz. In the frequency range of 15 to 20 GHz, the second inductance component functions, and in the frequency range of 20 to 30 GHz, the second and third inductance components function and have a frequency of 30 GHz or more. in the frequency domain, the third inductance component functions, the multilayer capacitor according to claim 3. The frequency range of up to 15 GHz, the pass characteristic becomes more -0.5 dB, in the above frequency range 15 GHz, pass characteristics is equal to or greater than -1.0 dB, the multilayer capacitor according to claim 3 or 4.

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