JP2011223136A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress a degradation of a high-frequency characteristic of a coil in an electronic component incorporating a coil including a meandering linear conductive body.SOLUTION: A laminate 12a is configured by laminating insulating material layers 16a to 16d. An external electrode is provided in a side face of the laminate 12a. A ground potential is applied to the external electrode. A coil L is made of a meandering-shaped linear conductive body 18 that is provided on the insulating material layer 16c. Ground conductive bodies 20 and 22 are electrically connected to the external electrode, and provided in regions A1 to A3 surrounded on three sides by the linear conductive body 18 when the linear conductive body 18 meanders in a plane view from a z-axis direction.

Description

  The present invention relates to an electronic component, and more particularly to an electronic component having a built-in coil.

  As a conventional electronic component, for example, a chip-type LC filter described in Patent Document 1 is known. In the chip-type LC filter described in Patent Document 1, two coils and one capacitor constitute a T-type low-pass filter. The two coils are constituted by meandering conductors that meander. By using such a meandering conductor, the length of the coil can be increased and the inductance value of the coil can be increased.

  However, the chip-type LC filter described in Patent Document 1 has a problem that high-frequency characteristics deteriorate. More specifically, since the meandering conductor is formed in a zigzag manner, a part of the meandering conductor extends in parallel in a close state. In this case, stray capacitance is generated between adjacent meandering conductors. The stray capacitance has a property that it is difficult for a high-frequency signal having a relatively low frequency to pass therethrough and a high-frequency signal having a relatively high frequency is easily passed through. Therefore, when the frequency of the high frequency signal input to the chip-type LC filter increases, the high frequency signal passes between adjacent meandering conductors via the stray capacitance. As a result, the chip-type LC filter described in Patent Document 1 passes a high-frequency signal having a relatively high frequency even though it is a low-pass filter. That is, in the chip type LC filter described in Patent Document 1, the high frequency characteristics are deteriorated.

JP-A-6-53048

  Accordingly, an object of the present invention is to suppress deterioration of high-frequency characteristics of a coil in an electronic component incorporating a coil made of a meandering linear conductor.

  An electronic component according to an aspect of the present invention is provided with a stacked body in which a plurality of insulator layers are stacked, a ground external electrode provided on a surface of the stacked body, and the insulator layer. A coil composed of a linear conductor having a meandering shape, and electrically connected to the ground external electrode, and the linear conductor meanders when viewed in plan from the stacking direction. And a ground conductor provided in a region surrounded by the linear conductor.

  ADVANTAGE OF THE INVENTION According to this invention, the deterioration of the high frequency characteristic of a coil can be suppressed in the electronic component incorporating the coil which consists of a meandering linear conductor.

It is an external appearance perspective view of the electronic component which concerns on 1st Embodiment thru | or 3rd Embodiment. It is an exploded view of the laminated body of the electronic component which concerns on 1st Embodiment. FIG. 2 is an equivalent circuit diagram of the electronic component according to the first embodiment. It is an exploded view of the model laminated body produced as a comparative example. It is an equivalent circuit schematic of the electronic component which has a laminated body. It is the graph which showed the result of computer simulation. It is an exploded view of the laminated body of the electronic component which concerns on 2nd Embodiment. It is an equivalent circuit schematic of the electronic component which concerns on 2nd Embodiment. It is an exploded view of the laminated body of the electronic component which concerns on 3rd Embodiment. It is an equivalent circuit schematic of the electronic component which concerns on 3rd Embodiment.

  The electronic component according to the embodiment of the present invention will be described below.

(First embodiment)
FIG. 1 is an external perspective view of electronic components 10a to 10c according to the first to third embodiments. FIG. 2 is an exploded view of the multilayer body 12a of the electronic component 10a according to the first embodiment. FIG. 3 is an equivalent circuit diagram of the electronic component 10a according to the first embodiment. Hereinafter, the stacking direction of the electronic component 10a is defined as the z-axis direction, and the direction in which the long side of the electronic component 10a extends when viewed in plan from the z-axis direction is defined as the x-axis direction. The direction in which the short side of 10a extends is defined as the y-axis direction.

  As shown in FIGS. 1 and 2, the electronic component 10 a includes a laminated body 12 a, external electrodes 14 (14 a to 14 d), a coil L, a capacitor C, and ground conductors 20 and 22.

  As shown in FIG. 1, the laminated body 12a has a rectangular parallelepiped shape. As shown in FIG. 2, the insulator layer 16 (16a to 16d) is moved from the positive direction side to the negative direction side in the z-axis direction. It is configured by stacking them in order. The insulator layer 16 has a rectangular shape and is made of a dielectric ceramic. In FIG. 2, the dotted line between the insulator layers 16c and 16d means that the insulator layers 16b and 16c are alternately stacked between the insulator layers 16c and 16d. is doing.

  The external electrode 14a is a terminal for inputting and outputting a high-frequency signal, and is provided on the side surface (surface) on the negative side in the x-axis direction of the multilayer body 12a as shown in FIG. The external electrode 14b is a terminal for inputting and outputting a high-frequency signal, and is provided on the side surface (surface) on the positive side in the x-axis direction of the multilayer body 12a as shown in FIG. The external electrode 14c is a terminal to which a ground potential is applied, and is provided on the side surface (surface) on the negative side in the y-axis direction of the multilayer body 12a as shown in FIG. The external electrode 14d is a terminal to which a ground potential is applied, and is provided on the side surface (surface) on the positive side in the y-axis direction of the multilayer body 12a as shown in FIG.

  As shown in FIG. 2, the coil L is formed of a linear conductor 18 provided on the insulator layer 16c and having a meandering shape. The linear conductor 18 has a shape from the negative side in the x-axis direction toward the positive direction starting from the short side of the negative side in the x-axis direction of the insulator layer 16c while reciprocating in the y-axis direction. Yes. Thereby, in the laminated body 12a, regions A1 to A3 surrounded by the linear conductor 18 on three sides are formed. Specifically, the region A <b> 1 is surrounded by the linear conductor 18 on the positive direction side and the negative direction side in the x-axis direction and the positive direction side in the y-axis direction. The region A2 is surrounded by the linear conductor 18 on the positive side and negative side in the x-axis direction and on the negative side in the y-axis direction. The region A3 is surrounded by the linear conductor 18 on the positive and negative sides in the x-axis direction and the positive side in the y-axis direction.

  As shown in FIG. 3, the coil L is electrically connected between the external electrodes 14a and 14b. That is, one end of the linear conductor 18 is directly connected to the external electrode 14a as shown in FIG. Further, as shown in FIG. 2, the other end of the linear conductor 18 is electrically connected to the external electrode 14b via a capacitor conductor 24a described later.

  As shown in FIG. 3, the capacitor C is electrically connected between the coil L and the external electrode 14 b and between the external electrodes 14 c and 14 d, and together with the coil L, an L-type low-pass filter (noise filter) ). As shown in FIG. 2, the capacitor C is constituted by rectangular capacitor conductors 24a and 24b.

  As shown in FIG. 2, the capacitor conductor 24b is provided on the insulator layer 16c on which the linear conductor 18 is provided, and is directly connected to the linear conductor 18 and connected to the external electrode 14b. Connected directly.

  As shown in FIG. 2, the capacitor conductor 24a is provided on the insulator layer 16b, and is directly connected to the external electrodes 14c and 14d. The capacitor conductor 24b faces the capacitor conductor 24b with the insulator layer 16b interposed therebetween. As a result, a capacitance is generated between the capacitor conductors 24a and 24b.

  The ground conductors 20 and 22 are respectively provided on the insulator layer 16c on which the linear conductor 18 is provided, and are directly connected to the external electrodes 14c and 14d. That is, a ground potential is applied to the ground conductors 20 and 22. Further, a part of the ground conductor 20 is provided in the regions A1 and A3 when viewed in plan from the z-axis direction. More specifically, the ground conductor 20 has rod-shaped conductors 20a and 20b extending in the y-axis direction. The rod-shaped conductors 20a and 20b enter the regions A1 and A3 from the negative side in the y-axis direction, respectively. As a result, the rod-shaped conductors 20a and 20b are located between the portions of the linear conductors 18 extending in the y-axis direction in parallel with each other in the regions A1 and A3, respectively. The ground conductor 22 has rod-shaped conductors 22a and 22b extending in the y-axis direction. The rod-shaped conductor 22a enters from the positive direction side in the y-axis direction with respect to the region A2. Thereby, the rod-shaped conductor 22a is located between the portions of the linear conductors 18 extending in the y-axis direction in parallel with each other in the region A2. The rod-shaped conductor 22b is located between the linear conductor 18 and the capacitor conductor 24a. As shown in FIG. 3, stray capacitance Cp is generated between the ground conductors 20 and 22 and the linear conductor 18 configured as described above.

(effect)
In the electronic component 10a configured as described above, it is possible to suppress the deterioration of the high frequency characteristics of the coil L as described below. More specifically, in the chip-type LC filter described in Patent Document 1, since the meandering conductor is formed in a zigzag manner, a part of the meandering conductor extends in a parallel state. In this case, stray capacitance is generated between adjacent meandering conductors. The stray capacitance has a property that it is difficult for a high-frequency signal having a relatively low frequency to pass therethrough and a high-frequency signal having a relatively high frequency is easily passed through. Therefore, when the frequency of the high frequency signal input to the chip-type LC filter increases, the high frequency signal passes between adjacent meandering conductors via the stray capacitance. As a result, the chip-type LC filter described in Patent Document 1 passes a high-frequency signal having a relatively high frequency even though it is a low-pass filter. That is, in the chip type LC filter described in Patent Document 1, the high frequency characteristics are deteriorated.

  On the other hand, in the electronic component 10a, the ground conductors 20 and 22 are provided in regions A1 to A3 that are surrounded on three sides by the linear conductor 18 due to the meandering of the linear conductor 18. Thus, stray capacitance Cp is generated between the linear conductor 18 and the ground conductors 20 and 22. However, a ground potential is applied to the ground conductors 20 and 22. Therefore, even if the frequency of the high-frequency signal of the linear conductor 18 increases, the high-frequency signal flows to the ground side through the stray capacitance Cp. Thereby, a high-frequency signal having a high frequency cannot pass through the linear conductor 18 (that is, the coil L). As a result, in the electronic component 10a, deterioration of the high frequency characteristics of the coil L can be suppressed. That is, in the electronic component 10a, a low pass filter having excellent high frequency characteristics can be obtained.

  In addition, ground conductors 20 and 22 to which a ground potential is applied are provided in regions A1 to A3 surrounded by the linear conductor 18. Therefore, between the portions of the linear conductor 18 extending in parallel with each other, the ground conductors 20 and 22 are electrostatically shielded. As a result, in the linear conductor 18, the high-frequency signal is suppressed from flying between portions extending in parallel with each other.

  The inventor of the present application performed a computer simulation described below in order to clarify the effect of the electronic component 10a. FIG. 4 is an exploded view of a model laminate 512 produced as a comparative example. FIG. 5 is an equivalent circuit diagram of an electronic component having the stacked body 512.

  First, a model of the electronic component 10a provided with the laminate 12a having the structure shown in FIG. 2 was produced as a first model. In addition, as a comparative example, a model of an electronic component including the stacked body 512 having the structure illustrated in FIG. The difference between the first model and the second model is the presence or absence of the ground conductors 20 and 22. Thereby, in the equivalent circuit of the electronic component according to the comparative example, the stray capacitance Cp is not generated as shown in FIG. Instead, stray capacitance Cp ′ is generated in parallel with the coil L. The size of the first model and the second model is 3.2 mm × 1.6 mm × 1.3 mm. The relative dielectric constant of the insulator layer 16 was 500, and the thickness of the insulator layer 16 was 50 μm.

  For the first model and the second model as described above, the computer calculated the change in insertion loss when a high-frequency signal was input while changing the frequency. FIG. 6 is a graph showing the results of computer simulation. The vertical axis represents insertion loss, and the horizontal axis represents frequency. As is clear from FIG. 6, the first model has a larger insertion loss at a high frequency (in the vicinity of the resonance frequency) than the second model. This indicates that the high frequency characteristics of the coil L of the first model are superior to the high frequency characteristics of the coil L of the second model. Therefore, it can be seen from the computer simulation that the electronic component 10a can suppress the deterioration of the high frequency characteristics of the coil L.

  In the electronic component 10a, the ground conductors 20 and 22 are provided on the insulator layer 16c on which the linear conductor 18 is provided. Therefore, the stray capacitance Cp is greater when the ground conductors 20 and 22 are provided on the insulator layer 16c than when the ground conductors 20 and 22 are provided on the insulator layer 16 other than the insulator layer 16c. It tends to occur. As a result, a high-frequency signal having a higher frequency more effectively flows through the stray capacitance Cp to the ground side. Therefore, in the electronic component 10a, deterioration of the high frequency characteristics of the coil L can be more effectively suppressed.

(Second Embodiment)
FIG. 7 is an exploded view of the multilayer body 12b of the electronic component 10b according to the second embodiment. FIG. 8 is an equivalent circuit diagram of the electronic component 10b according to the second embodiment. In addition, since the structure of the insulator layers 16a and 16d of the electronic component 10b is the same as the structure of the insulator layers 16a and 16d of the electronic component 10a, only the structure of the insulator layers 16b and 16c is shown in FIG. .

  As shown in FIG. 8, the electronic component 10b forms a T-type low-pass filter. Specifically, as shown in FIGS. 1 and 7, the electronic component 10 b includes a laminate 12 b, external electrodes 14 (14 a to 14 d), coils L 1 and L 2, a capacitor C 1, and ground conductors 120 and 122. .

  Since the configuration of the multilayer body 12b and the configuration of the external electrodes 14a to 14d are the same as the configuration of the multilayer body 12a and the configuration of the external electrodes 14a to 14d in the first embodiment, description thereof will be omitted.

  As shown in FIG. 7, the coil L1 is provided on the insulator layer 16c and is composed of a linear conductor 118a having a meandering shape. The linear conductor 118a has a shape from the negative side in the x-axis direction toward the positive direction starting from the short side of the negative side in the x-axis direction of the insulator layer 16c while reciprocating in the y-axis direction. Yes. Thereby, in the laminated body 12b, a region A4 surrounded by three sides by the linear conductor 118a is formed. Specifically, the region A4 is surrounded by the linear conductor 118a on the positive direction side and the negative direction side in the x-axis direction and the negative direction side in the y-axis direction.

  One end of the linear conductor 118a is directly connected to the external electrode 14a as shown in FIG. As shown in FIG. 7, the other end of the linear conductor 118a is directly connected to a capacitor conductor 124a described later.

  As shown in FIG. 7, the coil L2 is provided on the insulator layer 16c and is constituted by a linear conductor 118b having a meandering shape. The linear conductor 118b reciprocates in the y-axis direction and has a shape from the positive side in the x-axis direction toward the negative direction starting from the short side on the positive side in the x-axis direction of the insulator layer 16c. Yes. Thereby, in the laminated body 12b, a region A5 surrounded by the linear conductor 118b on three sides is formed. Specifically, the region A5 is surrounded by the linear conductor 118b on the positive side and the negative side in the x-axis direction and the positive side in the y-axis direction.

  One end of the linear conductor 118b is directly connected to the external electrode 14b as shown in FIG. As shown in FIG. 7, the other end of the linear conductor 118b is directly connected to a capacitor conductor 124b described later.

  As shown in FIGS. 7 and 8, the capacitor C1 is electrically connected between the coils L1 and L2 and between the external electrodes 14c and 14d. Together with the coils L1 and L2, the capacitor C1 is a T-type low-pass. A filter (noise filter) is configured. As shown in FIG. 7, the capacitor C1 is composed of rectangular capacitor conductors 124a and 124b.

  As shown in FIG. 7, the capacitor conductor 124b is provided on the insulator layer 16c on which the linear conductors 118a and 118b are provided, and is directly connected to the linear conductors 118a and 118b.

  As shown in FIG. 7, the capacitor conductor 124a is provided on the insulator layer 16b and is directly connected to the external electrodes 14c and 14d. The capacitor conductor 124b faces the capacitor conductor 124a with the insulator layer 16b interposed therebetween. As a result, a capacitance is generated between the capacitor conductors 124a and 124b.

  The ground conductors 120 and 122 are provided on the insulator layer 16c provided with the linear conductors 118a and 118b, respectively, and are directly connected to the external electrodes 14c and 14d. That is, a ground potential is applied to the ground conductors 120 and 122. Further, a part of the ground conductor 120 is provided in the region A5 when viewed in plan from the z-axis direction. More specifically, the ground conductor 120 has rod-shaped conductors 120a and 120b extending in the y-axis direction. The rod-shaped conductor 120b enters the area A5 from the negative direction side in the y-axis direction. Thereby, the rod-shaped conductor 120b is located in area | region A5. The rod-shaped conductor 120a is located between the linear conductor 118a and the capacitor conductor 124a.

  A part of the ground conductor 122 is provided in the region A4 when viewed in plan from the z-axis direction. More specifically, the ground conductor 122 has rod-shaped conductors 122a and 122b extending in the y-axis direction. The rod-shaped conductor 122a enters from the positive direction side in the y-axis direction with respect to the region A4. Thereby, the rod-shaped conductor 122a is located in area | region A4. The rod-shaped conductor 122b is located between the linear conductor 118b and the capacitor conductor 124a.

  As shown in FIG. 8, a stray capacitance Cp is generated between the ground conductors 120 and 122 and the linear conductors 118a and 118b configured as described above.

  Also in the electronic component 10b having the above-described configuration, it is possible to suppress the deterioration of the high frequency characteristics of the coil L, similarly to the electronic component 10a. That is, in the electronic component 10b, a low pass filter having excellent high frequency characteristics can be obtained.

(Third embodiment)
FIG. 9 is an exploded view of the multilayer body 12c of the electronic component 10c according to the third embodiment. FIG. 10 is an equivalent circuit diagram of an electronic component 10c according to the third embodiment. In addition, since the structure of the insulator layers 16a and 16d of the electronic component 10c is the same as the structure of the insulator layers 16a and 16d of the electronic component 10c, only the structures of the insulator layers 16b and 16c are shown in FIG. .

  As shown in FIG. 10, the electronic component 10 c constitutes a π-type low-pass filter. Specifically, as shown in FIGS. 1 and 9, the electronic component 10c includes a laminated body 12b, external electrodes 14 (14a to 14d), a coil L3, capacitors C2 and C3, and ground conductors 220 and 222. .

  Since the configuration of the multilayer body 12c and the configuration of the external electrodes 14a to 14d are the same as the configuration of the multilayer body 12a and the configuration of the external electrodes 14a to 14d in the first embodiment, the description thereof is omitted.

  As shown in FIG. 9, the coil L3 is formed of a linear conductor 218 that is provided on the insulator layer 16c and has a meandering shape. The linear conductor 218 has a shape from the negative side in the x-axis direction toward the positive side while reciprocating in the y-axis direction in the vicinity of the center of the insulator layer 16c. Thereby, in the laminated body 12c, a region A6 surrounded by the linear conductor 218 on three sides is formed. Specifically, the region A6 is surrounded by the linear conductor 218 on the positive direction side and the negative direction side in the x-axis direction and the positive direction side in the y-axis direction.

  One end of the linear conductor 218 is directly connected to a capacitor conductor 224a described later, as shown in FIG. As shown in FIG. 9, the other end of the linear conductor 218 is directly connected to a capacitor conductor 224c described later.

  As shown in FIGS. 9 and 10, the capacitor C2 is electrically connected between the external electrode 14a and the coil L3. As shown in FIG. 9, the capacitor C2 is composed of rectangular capacitor conductors 224a and 224b.

  As shown in FIG. 9, the capacitor conductor 224b is provided on the insulator layer 16c on which the linear conductor 218 is provided, and is directly connected to the linear conductor 218 and the external electrode 14a. As shown in FIG. 9, the capacitor conductor 224a is provided on the insulator layer 16b and is directly connected to the external electrodes 14c and 14d. The capacitor conductor 224b faces the capacitor conductor 224a with the insulator layer 16b interposed therebetween. As a result, a capacitance is generated between the capacitor conductors 224a and 224b.

  As shown in FIGS. 9 and 10, the capacitor C3 is electrically connected between the external electrode 14b and the coil L3. As shown in FIG. 9, the capacitor C3 is composed of rectangular capacitor conductors 224c and 224d.

  As shown in FIG. 9, the capacitor conductor 224d is provided on the insulator layer 16c on which the linear conductor 218 is provided, and is directly connected to the linear conductor 218 and the external electrode 14b. As shown in FIG. 9, the capacitor conductor 224c is provided on the insulator layer 16b, and is directly connected to the external electrodes 14c and 14d. The capacitor conductor 224d faces the capacitor conductor 224c with the insulator layer 16b interposed therebetween. As a result, a capacitance is generated between the capacitor conductors 224c and 224d.

  The ground conductors 220 and 222 are provided on the insulator layer 16c on which the linear conductor 218 is provided, and are directly connected to the external electrodes 14c and 14d. That is, a ground potential is applied to the ground conductors 220 and 222. Further, a part of the ground conductor 220 is provided in the region A6 when viewed in plan from the z-axis direction. More specifically, the ground conductor 220 has a rod-shaped conductor 220a extending in the y-axis direction. The rod-shaped conductor 220a enters from the negative direction side in the y-axis direction with respect to the region A6. Thereby, the rod-shaped conductor 220a is located in area | region A6.

  The ground conductor 222 has rod-shaped conductors 222a and 222b extending in the y-axis direction. The rod-shaped conductors 222a and 222b are located between the linear conductor 218 and the capacitor conductors 224a and 224c, respectively.

  As shown in FIG. 10, a stray capacitance Cp is generated between the ground conductors 220 and 222 and the linear conductor 218 configured as described above.

  The linear conductors 20a, 20b, 22a, 22b, 120a, 120b, 122a, 122b, 220a, 222a, 222b have a narrow bar shape, but may have a wide width instead of a bar shape. .

  Also in the electronic component 10c having the above-described configuration, it is possible to suppress deterioration of the high frequency characteristics of the coil L as in the electronic component 10a. That is, in the electronic component 10c, a low pass filter having excellent high frequency characteristics can be obtained.

  As described above, the present invention is useful for electronic components, and is excellent in that deterioration of high-frequency characteristics of a coil can be suppressed particularly in an electronic component incorporating a coil composed of a meandering linear conductor.

A1 to A6 area C, C1 to C3 capacitor Cp stray capacitance L, L1 to L3 coil 10a to 10c electronic component 12a to 12c laminate 14a to 14d external electrode 16a to 16d insulator layer 18, 118a, 118b, 218 linear conductor 20a, 20b, 22a, 22b, 120a, 120b, 122a, 122b, 220a, 222a, 222b Rod-shaped conductor 20, 22, 120, 122, 220, 222 Ground conductors 24a, 24b, 124a, 124b, 224a, 224b, 224c, 224d capacitor conductor

Claims (5)

A laminate formed by laminating a plurality of insulator layers;
An external electrode for ground provided on the surface of the laminate;
A coil formed of a linear conductor having a serpentine shape, which is a linear conductor provided on the insulator layer;
A ground conductor electrically connected to the ground external electrode and provided in a region surrounded by the linear conductor by meandering the linear conductor when viewed in plan from the stacking direction; ,
Having
Electronic parts characterized by The ground conductor is provided on the insulator layer provided with the linear conductor;
The electronic component according to claim 1. The electronic component is
The first signal external electrode and the second signal external electrode provided on the surface of the laminate,
In addition,
The coil is electrically connected between the first signal external electrode and the second signal external electrode;
The electronic component according to claim 1, wherein: The electronic component is
A capacitor electrically connected between the coil and the second signal external electrode and between the ground external electrode;
In addition,
The coil and the capacitor constitute a noise filter;
The electronic component according to claim 3. The capacitor includes a first capacitor conductor connected to the linear conductor, and a second capacitor conductor facing the first capacitor conductor with the insulator layer interposed therebetween;
The electronic component according to claim 4.

Images