JP4507575B2 - Plasma processing method and apparatus - Google Patents

Plasma processing method and apparatus Download PDF

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JP4507575B2
JP4507575B2 JP2003402862A JP2003402862A JP4507575B2 JP 4507575 B2 JP4507575 B2 JP 4507575B2 JP 2003402862 A JP2003402862 A JP 2003402862A JP 2003402862 A JP2003402862 A JP 2003402862A JP 4507575 B2 JP4507575 B2 JP 4507575B2
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plasma
catalyst layer
stage
space
gas
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JP2005166895A (en
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和弘 井上
高文 鉄矢
正行 梶山
正史 松森
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Panasonic Corp
Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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本発明は、処理対象物にプラズマを噴射して表面洗浄、表面改質などの処理を行うプラズマ処理方法及び装置に関するものである。   The present invention relates to a plasma processing method and apparatus for performing processing such as surface cleaning and surface modification by injecting plasma onto a processing object.

従来から、図３に示すように、各種プラスマ発生源（図示せず）で発生したプラズマをプラズマ噴出ノズル２１から大気圧近傍下に噴出させ、ステージ２２上に設置された処理対象物２３にプラズマを噴出し、処理対象物２３の表面洗浄や表面改質などのプラズマ処理を行う方法は知られている。このようなプラズマ処理方法においては、例えば図３に示すように酸素ラジカルＯ* を有する酸素プラズマの場合には、酸素ガスＯ2 だけでなく、オゾンＯ3 が発生して排出されることになり、このオゾンＯ3 が周囲に拡散すると環境に悪影響を与えることになる。 Conventionally, as shown in FIG. 3, plasma generated from various plasma generation sources (not shown) is ejected from a plasma ejection nozzle 21 to near atmospheric pressure, and plasma is applied to a processing object 23 installed on a stage 22. A method for performing plasma processing such as surface cleaning and surface modification of the processing object 23 is known. In such a plasma processing method, for example, as shown in FIG. 3, in the case of oxygen plasma having oxygen radicals O * , not only oxygen gas O 2 but also ozone O 3 is generated and discharged. If this ozone O 3 diffuses to the surroundings, it will adversely affect the environment.

そこで、従来のプラズマ処理装置においては、図４に示すように、発生したオゾンや反応ガスや希ガスを吸引回収するとともに環境に好ましくないオゾンや反応ガスを分解して排気する排気設備２４が設けられている。排気設備２４は、図４の例では、プラズマ噴出ノズル２１の周囲に吸引筒体２５を配設してプラズマ噴出ノズル２１の外周を取り囲む筒状の吸引通路２６を形成し、この吸引通路２６にオゾン分解装置２８を配設した吸引ダクト２７を接続し、吸引ダクト２７の下流側に希ガス回収装置（図示せず）や排気ファン（図示せず）を配設して構成されている。   Therefore, in the conventional plasma processing apparatus, as shown in FIG. 4, there is provided an exhaust facility 24 that sucks and recovers the generated ozone, reaction gas, and rare gas, and decomposes and exhausts ozone and reaction gas that are undesirable for the environment. It has been. In the example of FIG. 4, the exhaust facility 24 is provided with a suction cylinder 25 around the plasma ejection nozzle 21 to form a cylindrical suction passage 26 surrounding the outer periphery of the plasma ejection nozzle 21. A suction duct 27 provided with an ozonolysis device 28 is connected, and a rare gas recovery device (not shown) and an exhaust fan (not shown) are provided downstream of the suction duct 27.

また、大気圧近傍下でプラズマを発生して処理対象物を処理するプラズマ処理部を、プラズマ処理室内に設置し、プラズマ処理室を筐体内に収納し、プラズマ処理部とプラズマ処理室と筐体内の圧力差を調整する手段を設けることで、使用ガスの周囲への拡散を防止するとともに外部空気の混入防止を図ったプラズマ処理装置も知られている（例えば、特許文献１参照。）。
特開２００２−３６３７５８号公報 In addition, a plasma processing unit that generates plasma in the vicinity of atmospheric pressure to process an object to be processed is installed in the plasma processing chamber, the plasma processing chamber is stored in the housing, and the plasma processing unit, the plasma processing chamber, and the housing There is also known a plasma processing apparatus in which a means for adjusting the pressure difference is provided to prevent diffusion of the used gas to the surroundings and prevent external air from being mixed (see, for example, Patent Document 1).
JP 2002-363758 A

ところが、上記従来の何れのプラズマ処理装置においても、オゾンや反応ガスや希ガス等の残留ガスを回収し、分解して排気するために、構成の複雑な排気設備を設置する必要があるため、設備コストが高くなるとともに、設置面積も大きくなってしまい、コンパクトに構成することができないという問題がある。   However, in any of the above conventional plasma processing apparatuses, in order to recover residual gas such as ozone, reaction gas, and rare gas, and to decompose and exhaust it, it is necessary to install a complicated exhaust system. There is a problem that the equipment cost is increased and the installation area is also increased, so that it cannot be configured compactly.

本発明は、上記従来の問題点に鑑み、特別な排気系を必要とせず、低コストでコンパクトな構成にて周囲の環境の安全を確保できるプラズマ処理方法及び装置を提供することを課題とする。   In view of the above-described conventional problems, an object of the present invention is to provide a plasma processing method and apparatus capable of ensuring the safety of the surrounding environment with a low-cost and compact configuration without requiring a special exhaust system. .

本発明のプラズマ処理方法は、発生したプラズマをプラズマ噴出ノズルからステージ上に載置された処理対象物に噴出しプラズマ処理するプラズマ処理方法において、ガス流出口に設けた有害ガスを無害化する触媒層を含むカバーをステージに接触させて、プラズマ噴出ノズルのプラズマ噴出口と処理対象物とを内部に含んだ状態で外部の大気空間に対し区画された空間を形成して、この空間内でプラズマ噴出口から処理対象物に向けてプラズマを噴出して前記プラズマ処理を行い、前記空間内のガスを、触媒層を通してガス流出口から前記外部の大気空間に流出させるものである。 The plasma processing method of the present invention is a catalyst for detoxifying harmful gas provided at a gas outlet in a plasma processing method in which generated plasma is jetted from a plasma jet nozzle onto a processing object placed on a stage. and a cover comprising a layer in contact with the stage, to form a compartmented space state containing a processed object plasma jet port of the plasma jet nozzle inside the external atmospheric space, this space depletion from plasma ejection port toward a processing object by jetting the plasma subjected to the plasma treatment, the gas in the space is from a gas outlet through catalytic layer which is caused to flow out to the outside atmosphere space.

この構成によると、ガス流出口に設けた触媒層を含むカバーをステージに接触させることにより、プラズマ噴出口と処理対象物とを含むように区画し形成した空間内で、プラズマ噴出口から処理対象物に向けてプラズマを噴出することで処理対象物のプラズマ処理を行うことができ、かつプラズマ噴出後に生成した有害な発生ガスや残留ガスは触媒層を通って無害化されてガス流出口から大気空間に流出するので、周囲の環境の安全を確保でき、かつ特別な排気系を必要としないので、低コストでコンパクトな構成とすることができる。 According to this configuration, the cover including the catalyst layer provided at the gas outlet is brought into contact with the stage, so that the treatment from the plasma outlet is performed in a space that is partitioned and formed to include the plasma outlet and the processing target. Plasma treatment of an object to be treated can be performed by ejecting plasma toward the object, and harmful generated gas and residual gas generated after the plasma is ejected are made harmless through the catalyst layer and are discharged from the gas outlet. Since it flows out into the atmospheric space, the safety of the surrounding environment can be ensured, and a special exhaust system is not required, so that a low-cost and compact configuration can be achieved.

また、本発明のプラズマ処理装置は、処理対象物を配置するステージと、ステージ上の処理対象物配置部に向けてプラズマを噴出するプラズマ噴出ノズルと、ガス流出口に設けた有害ガスを通して無害化する触媒層を含むカバーをステージに接触させて、プラズマ噴出ノズルの先端部と処理対象物を内部に含んだ状態で外部の大気空間に対して区画された空間を形成するカバーとを備え、プラズマ噴出ノズルの外周に一端が連結固定された筒状カバー本体と、この筒状カバー本体の他端から突出してステージに接触されることでステージと筒状カバー本体との間をガス流出口とする筒状の触媒層と、でカバーを構成したものである。なお、カバー内壁又は触媒層にヒータを組み込むこともできる。 Further, the plasma processing apparatus of the present invention is rendered harmless through a stage on which a processing object is disposed, a plasma ejection nozzle that ejects plasma toward the processing object placement portion on the stage, and a harmful gas provided at the gas outlet. the cover comprising a catalyst layer in contact with the stage, and a cover forming a compartmented space between the processing object tip of plasma jet nozzle to external air space while containing therein, plasma A cylindrical cover body whose one end is connected and fixed to the outer periphery of the ejection nozzle, and a gas outlet port between the stage and the cylindrical cover body by protruding from the other end of the cylindrical cover body and contacting the stage A cover is constituted by a cylindrical catalyst layer . A heater can be incorporated in the inner wall of the cover or the catalyst layer.

この構成によると、ガス流出口に設けた触媒層を含むカバーで区画形成された空間内でプラズマ噴出ノズルからステージ上の処理対象物にプラズマを噴出することで処理対象物をプラズマ処理することができ、前記空間内でプラズマ噴出後に生成した有害な発生ガスや残留ガスは触媒層を通って無害化されてガス流出口から大気空間に流出するので、周囲の環境の安全を確保でき、かつカバーと触媒層を設けた簡単な構成であるため、コンパクトで低コストな構成とすることができる。また、カバー内壁又は触媒層にヒータを組み込むと、触媒の分解効果を向上することができる。また、プラズマ噴出ノズルの外周に一端が連結固定された筒状カバー本体と、この筒状カバー本体の他端から突出してステージに接触されることでステージと筒状カバー本体との間をガス流出口とする筒状の触媒層と、でカバーを構成すると、突出させた筒状の触媒層にて前記空間の全周にわたってガス流出口が形成されるので、空間内のガスが全周にわたって均一に流れて均一なプラズマ処理を行うことができる。特に、筒状カバー本体及び筒状の触媒層が円筒状にすると、全周にわたってより一層均一にガスが流れるので好ましいが、角筒状でもよい。 According to this configuration, the object to be processed can be plasma-treated by ejecting plasma from the plasma ejection nozzle to the object to be treated on the stage in the space defined by the cover including the catalyst layer provided at the gas outlet. Since harmful generated gas and residual gas generated after plasma ejection in the space are made harmless through the catalyst layer and flow out from the gas outlet to the atmospheric space, the surrounding environment can be secured and the cover can be secured. Therefore, a compact and low-cost configuration can be achieved. Further, when a heater is incorporated in the inner wall of the cover or the catalyst layer, the decomposition effect of the catalyst can be improved. In addition, a cylindrical cover body having one end connected and fixed to the outer periphery of the plasma ejection nozzle, and a gas flow between the stage and the cylindrical cover body by protruding from the other end of the cylindrical cover body and contacting the stage. When the cover is configured with the cylindrical catalyst layer serving as the outlet, the gas outlet is formed over the entire circumference of the space by the protruding cylindrical catalyst layer, so that the gas in the space is uniform over the entire circumference. To perform uniform plasma treatment. In particular, it is preferable that the cylindrical cover body and the cylindrical catalyst layer have a cylindrical shape because the gas flows more uniformly over the entire circumference, but a rectangular cylindrical shape may also be used.

また、カバーの内面に複数種類の触媒から成る触媒層を配設すると、例えばオゾンやＮＯx やその他の各種ガスを確実に無害化して大気空間に流出させることができる。 Further, if a catalyst layer composed of a plurality of types of catalysts is provided on the inner surface of the cover, for example, ozone, NO x, and other various gases can be reliably rendered harmless and flow out to the atmosphere.

また、カバー内面のほぼ全面にわたって触媒層を配設すると、有害ガスの無害化をより確実に行うことがてきる。   In addition, if the catalyst layer is disposed over almost the entire inner surface of the cover, the harmful gas can be made more harmless.

また、カバーの内面のほぼ全面にわたって触媒層を配設するとともに触媒層を筒状カバー本体の他端よりも突出させ、かつ筒状カバー本体の内面と触媒層との間にスペーサを介装してガス流出通路を形成すると、有害ガスをより効率的に触媒層を通して円滑に大気空間に流出させることができて好適である。   In addition, a catalyst layer is disposed over almost the entire inner surface of the cover, the catalyst layer is protruded from the other end of the cylindrical cover body, and a spacer is interposed between the inner surface of the cylindrical cover body and the catalyst layer. If the gas outflow passage is formed, the harmful gas can be more efficiently discharged through the catalyst layer and smoothly into the atmospheric space.

本発明によれば、プラズマ噴出口の周囲と処理対象物との間に区画された空間内にプラズマ噴出後に生成した有害な発生ガスや残留ガスを、前記区画に関与する触媒層を通して無害化してガス流出口から大気空間に流出するので、周囲の環境の安全を確保できるとともに特別な排気系を必要としないため低コストでコンパクトな構成とすることができる。 According to the present invention, harmful generated gas and residual gas generated after plasma ejection in a space partitioned between the periphery of the plasma ejection port and the processing object are rendered harmless through the catalyst layer involved in the partition. Since the gas flows out from the gas outlet to the atmospheric space, safety of the surrounding environment can be ensured and a special exhaust system is not required, so that a low-cost and compact configuration can be achieved.

以下、本発明のプラズマ処理方法及び装置の一実施形態について、図１、図２を参照して説明する。   An embodiment of the plasma processing method and apparatus of the present invention will be described below with reference to FIGS.

図１において、１は各種発生機構によってプラズマを発生するプラズマ発生源で、ガス２を供給することで発生したプラズマをプラズマ噴出ノズル３の先端のプラズマ噴出口４から噴出させる。５はプラズマ処理を行うべき処理対象物で、ステージ６上の所定の処理位置に設置される。なお、ステージ６は処理対象物５を載置した状態で移動可能に構成するとプラズマ処理を処理ライン化できて好適である。   In FIG. 1, reference numeral 1 denotes a plasma generation source that generates plasma by various generation mechanisms, and plasma generated by supplying a gas 2 is ejected from a plasma ejection port 4 at the tip of a plasma ejection nozzle 3. Reference numeral 5 denotes a processing object to be subjected to plasma processing, which is set at a predetermined processing position on the stage 6. Note that it is preferable that the stage 6 be configured to be movable while the processing object 5 is placed, because the plasma processing can be processed into a processing line.

７はプラズマ噴出ノズル３の先端部と処理対象物５を内部に含んだ状態で外部の大気空間に対して区画された空間８を形成するカバーであり、プラズマ噴出ノズル３の先端部の外周に装着固定されている。このカバー７は、プラズマ噴出ノズル３の外周に固定された上端閉鎖の円筒状カバー本体９とその内周面と天井面にそれぞれ装着された円筒状触媒層１０と円板状触媒層１１にて構成されている。これら触媒層１０、１１はガスを透過可能に構成されるとともにこの触媒層１０、１１内に侵入若しくは通過するガスを無害化する触媒を担持している。   Reference numeral 7 denotes a cover that forms a space 8 that is partitioned with respect to an external atmospheric space in a state including the tip of the plasma ejection nozzle 3 and the processing object 5 inside, on the outer periphery of the tip of the plasma ejection nozzle 3. It is fixed. The cover 7 is composed of a cylindrical cover body 9 closed at the upper end fixed to the outer periphery of the plasma ejection nozzle 3, and a cylindrical catalyst layer 10 and a disc-shaped catalyst layer 11 mounted on the inner peripheral surface and the ceiling surface, respectively. It is configured. The catalyst layers 10 and 11 are configured to be permeable to gas and carry a catalyst that renders the gas that enters or passes through the catalyst layers 10 and 11 harmless.

円筒状触媒層１０は、円筒状カバー本体９の下端から適当長さだけ突出されており、この円筒状触媒層１０の下端をステージ６の上面に接触させることで、空間８を区画形成するとともに円筒状カバー本体９とステージ６の間にガス流出口１２を形成し、空間８内のガスが円筒状触媒層１０を通過してガス流出口１２から大気空間に流出するように構成されている。触媒層１０の下端には、ステージ６との間の気密性を確保するために、オゾン、ガス等による腐食に強い材料から成るＯリング（図示せず）を配設しても良い。   The cylindrical catalyst layer 10 protrudes from the lower end of the cylindrical cover body 9 by an appropriate length, and the lower end of the cylindrical catalyst layer 10 is brought into contact with the upper surface of the stage 6 to form a space 8. A gas outlet 12 is formed between the cylindrical cover body 9 and the stage 6 so that the gas in the space 8 passes through the cylindrical catalyst layer 10 and flows out from the gas outlet 12 to the atmospheric space. . An O-ring (not shown) made of a material resistant to corrosion by ozone, gas, or the like may be disposed at the lower end of the catalyst layer 10 in order to ensure airtightness with the stage 6.

触媒層１０、１１は、例えば一方にオゾン分解用の二酸化マンガンを、他方にＮＯx 分解用の脱硝触媒を担持させて構成されている。なお、図示例では、２種類の触媒層１０、１１を設けた例を示しているが、さらに別のガスを無害化する触媒からなる触媒層を設けることができることは言うまでもない。また、これら触媒層１０、１１若しくは円筒状カバー本体９の内面にヒータ（図示せず）を配設して触媒を加熱してその触媒作用を高めるようにしても良い。また、カバー７内には、有害ガスを無害化する触媒層１０、１１だけでなく、ＳＦやＣＦ4 などのフロン系ガスなどの有害ガスを吸着する吸着層（図示せず）を設けることもできる。 The catalyst layers 10 and 11, manganese dioxide for ozonolysis example one, is constituted by the other to be supported a denitration catalyst for NO x decomposition. In the illustrated example, two types of catalyst layers 10 and 11 are provided, but it goes without saying that a catalyst layer made of a catalyst that renders another gas harmless can be provided. Further, a heater (not shown) may be provided on the inner surfaces of the catalyst layers 10 and 11 or the cylindrical cover main body 9 to heat the catalyst and enhance its catalytic action. In addition, in the cover 7, not only the catalyst layers 10 and 11 for detoxifying harmful gases, but also an adsorption layer (not shown) for adsorbing harmful gases such as chlorofluorocarbon gases such as SF and CF 4 can be provided. it can.

また、プラズマ発生源１はプラズマ噴出ノズル３及びカバー７とともにステージ６に対して相対的に上下移動可能に構成され、処理対象物５を処理位置に搬入する時に上昇し、搬入後下降して空間８を閉じ、その状態でプラズマ処理を行うように成されている。   Further, the plasma generation source 1 is configured to be movable up and down relative to the stage 6 together with the plasma ejection nozzle 3 and the cover 7, and rises when the processing object 5 is carried into the processing position, and descends after carrying in the space. 8 is closed and plasma processing is performed in this state.

以上の構成によれば、カバー７にて区画形成された空間８内でプラズマ噴出口４からステージ６上の処理対象物５に向けてプラズマを噴出することで処理対象物５をプラズマ処理することができる。また、空間８内でプラズマ噴出後に生成したオゾンやＮＯx などの有害な発生ガスや残留ガスは触媒層１０、１１に侵入したり、通過したりして担持されている触媒と接触することで無害化され、円筒状カバー本体９とステージ６との間のガス流出口１２から大気空間に流出するので、周囲の環境の安全を確保することができる。 According to the above configuration, the processing object 5 is plasma-treated by ejecting plasma from the plasma outlet 4 toward the processing object 5 on the stage 6 in the space 8 defined by the cover 7. Can do. Further, harmful generated gas such as ozone and NO x generated after plasma ejection in the space 8 and residual gas enter or pass through the catalyst layers 10 and 11 and come into contact with the supported catalyst. Since it is rendered harmless and flows out from the gas outlet 12 between the cylindrical cover body 9 and the stage 6 to the atmospheric space, safety of the surrounding environment can be ensured.

また、円筒状カバー本体９の下端から円筒状触媒層１０を突出させてその下端をステージ６に当接させ、円筒状カバー本体９の下端とステージ６との間に空間８の全周にわたってガス流出口１２を形成しているので、空間８内のガスが全周にわたって均一に流れ、その結果均一なプラズマ処理を行うことがてきる。また、カバー７の内面のほぼ全面にわたって触媒層１０、１１を配設しているので、有害ガスの無害化をより確実に行うことがてきる。   Further, the cylindrical catalyst layer 10 is protruded from the lower end of the cylindrical cover main body 9 and the lower end thereof is brought into contact with the stage 6, and the gas is formed over the entire circumference of the space 8 between the lower end of the cylindrical cover main body 9 and the stage 6. Since the outflow port 12 is formed, the gas in the space 8 flows uniformly over the entire circumference, and as a result, uniform plasma processing can be performed. In addition, since the catalyst layers 10 and 11 are disposed over almost the entire inner surface of the cover 7, it is possible to more reliably detoxify harmful gases.

また、プラズマ噴出ノズル３に円筒状カバー本体９と触媒層１０、１１から成るカバー７を装着した簡単な構成であるため、プラズマ処理装置全体をコンパクトに構成できるとともに、低コストな構成とすることができる。   In addition, since the plasma spray nozzle 3 has a simple configuration in which the cover 7 including the cylindrical cover body 9 and the catalyst layers 10 and 11 is mounted, the entire plasma processing apparatus can be configured compactly and at a low cost. Can do.

上記実施形態の説明では、円筒状カバー本体９の内周面及び天井面に触媒層１０、１１を接触させて装着した例を示したが、図２に示すように、円筒状カバー本体９の内周面と円筒状触媒層１０の間、および天井面と円板状触媒層１１の間に適宜にスペーサ１３を介装し、円筒状カバー本体９の内面と触媒層１０、１１の間にガス流出通路１４を形成しても良い。このように構成すると、触媒層１０、１１の触媒に対するガスの接触効率が向上して触媒作用の効率が向上し、有害ガスをより効率的に無害化して大気空間に流出させることができて好適である。   In the description of the above-described embodiment, an example in which the catalyst layers 10 and 11 are attached in contact with the inner peripheral surface and the ceiling surface of the cylindrical cover main body 9 is shown. However, as shown in FIG. Spacers 13 are appropriately interposed between the inner peripheral surface and the cylindrical catalyst layer 10 and between the ceiling surface and the disk-shaped catalyst layer 11, and between the inner surface of the cylindrical cover body 9 and the catalyst layers 10 and 11. A gas outflow passage 14 may be formed. If comprised in this way, the contact efficiency of the gas with respect to the catalyst of the catalyst layers 10 and 11 will improve, the efficiency of a catalytic action will improve, and it can detoxify harmful gas more efficiently and it can be made to flow out to atmospheric space, and is suitable It is.

また、以上の実施形態の説明では円筒状カバー本体９と円筒状の触媒層１０と円板状触媒層１１を組み合わせたカバー構成を示したが、角筒状のカバー本体と角筒状の触媒層と矩形板状触媒層を組み合わせた構成としても良い。   In the above description of the embodiment, the cover configuration in which the cylindrical cover main body 9, the cylindrical catalyst layer 10, and the disc-shaped catalyst layer 11 are combined has been described. However, the rectangular cylindrical cover main body and the rectangular cylindrical catalyst are shown. It is good also as a structure which combined the layer and the rectangular-plate-shaped catalyst layer.

本発明に係るプラズマ処理方法及び装置は、プラズマ噴出後に生成した有害な発生ガスや残留ガスを触媒層を通して無害化してガス流出口から大気空間に流出するようにしているので、低コストでコンパクトな構成にて周囲の環境の安全を確保でき、そのため処理対象物に向けてプラズマを噴出して処理を行う表面洗浄や表面改質などの各種プラズマ処理に有用である。   The plasma processing method and apparatus according to the present invention renders harmful generated gas and residual gas generated after plasma ejection harmless through the catalyst layer and flows out from the gas outlet to the atmospheric space. The configuration can ensure the safety of the surrounding environment, and is therefore useful for various types of plasma processing such as surface cleaning and surface modification in which processing is performed by ejecting plasma toward the processing object.

本発明の一実施形態のプラズマ処理装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the plasma processing apparatus of one Embodiment of this invention. 同実施形態の変形構成例の部分断面図である。It is a fragmentary sectional view of the modification example of composition of the embodiment. 本発明対象のプラズマ処理装置の基本構成を示す断面図である。It is sectional drawing which shows the basic composition of the plasma processing apparatus of this invention object. 従来例のプラズマ処理装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the plasma processing apparatus of a prior art example.

符号の説明Explanation of symbols

１ プラズマ発生源
３ プラズマ噴出ノズル
４ プラズマ噴出口
６ ステージ
７ カバー
８ 空間
９ 円筒状カバー本体
１０ 円筒状触媒層
１１ 円板状触媒層
１２ ガス流出口
１３ スペーサ
１４ ガス流出通路 DESCRIPTION OF SYMBOLS 1 Plasma generation source 3 Plasma ejection nozzle 4 Plasma ejection outlet 6 Stage 7 Cover 8 Space 9 Cylindrical cover main body 10 Cylindrical catalyst layer 11 Disk-shaped catalyst layer 12 Gas outflow port 13 Spacer 14 Gas outflow passage

Claims (5)

発生したプラズマをプラズマ噴出ノズルからステージ上に載置された処理対象物に噴出しプラズマ処理するプラズマ処理方法において、
ガス流出口に設けた有害ガスを無害化する触媒層を含むカバーをステージに接触させて、プラズマ噴出ノズルのプラズマ噴出口と処理対象物とを内部に含んだ状態で外部の大気空間に対し区画された空間を形成して、この空間内でプラズマ噴出口から処理対象物に向けてプラズマを噴出して前記プラズマ処理を行い、前記空間内のガスを、触媒層を通してガス流出口から前記外部の大気空間に流出させることを特徴とするプラズマ処理方法。 In the plasma processing method of ejecting the generated plasma from the plasma ejection nozzle to the processing object placed on the stage and performing plasma processing,
A cover including a catalyst layer for detoxifying harmful gas provided at the gas outlet is brought into contact with the stage, and the plasma outlet of the plasma outlet nozzle and the object to be processed are contained in the interior, and is partitioned from the external atmospheric space. A space is formed, and plasma is spouted from the plasma outlet toward the object to be processed in this space to perform the plasma treatment, and the gas in the space is passed through the catalyst layer from the gas outlet to the external space. A plasma processing method, wherein the plasma processing method is characterized by causing the gas to flow into an atmospheric space. 処理対象物を配置するステージと、ステージ上の処理対象物配置部に向けてプラズマを噴出するプラズマ噴出ノズルと、ガス流出口に設けた有害ガスを通して無害化する触媒層を含むカバーをステージに接触させて、プラズマ噴出ノズルの先端部と処理対象物を内部に含んだ状態で外部の大気空間に対して区画された空間を形成するカバーとを備え、
プラズマ噴出ノズルの外周に一端が連結固定された筒状カバー本体と、この筒状カバー本体の他端から突出してステージに接触されることでステージと筒状カバー本体との間をガス流出口とする筒状の触媒層と、でカバーを構成したことを特徴とするプラズマ処理装置。 A stage including a stage on which a processing object is arranged, a plasma ejection nozzle that ejects plasma toward the processing object arrangement part on the stage, and a cover including a catalyst layer that is detoxified through harmful gas provided at the gas outlet are in contact with the stage. And a cover that forms a space partitioned with respect to the external air space in a state including the tip of the plasma ejection nozzle and the processing object inside ,
A cylindrical cover body whose one end is connected and fixed to the outer periphery of the plasma ejection nozzle, and a gas outlet between the stage and the cylindrical cover body by protruding from the other end of the cylindrical cover body and contacting the stage. A plasma processing apparatus characterized in that a cover is constituted by a cylindrical catalyst layer . カバーの内面に複数種類の触媒から成る触媒層を配設したことを特徴とする請求項２記載のプラズマ処理装置。 Claim 2 Symbol placement of the plasma processing apparatus characterized by being arranged catalyst layer composed of a plurality of types of catalysts on the inner surface of the cover. カバー内面のほぼ全面にわたって触媒層を配設したことを特徴とする請求項２または３記載のプラズマ処理装置。 Almost plasma processing apparatus according to claim 2 or 3, wherein it has provided a catalyst layer over the entire surface of the cover inner surface. カバーの内面のほぼ全面にわたって触媒層を配設するとともに触媒層を筒状カバー本体の他端よりも突出させ、かつ筒状カバー本体の内面と触媒層との間にスペーサを介装してガス流出通路を形成したことを特徴とする請求項２または３記載のプラズマ処理装置。 The catalyst layer is disposed over almost the entire inner surface of the cover, the catalyst layer protrudes from the other end of the cylindrical cover body, and a spacer is interposed between the inner surface of the cylindrical cover body and the catalyst layer. the plasma processing apparatus according to claim 2 or 3, wherein the forming the outlet passage.
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JPH03217706A (en) * 1990-01-23 1991-09-25 Hakukin Warmers Co Ltd Method of purifying exhaust gas
JPH03221127A (en) * 1990-01-26 1991-09-30 Hakukin Warmers Co Ltd Exhaust gas cleaning method
WO1996031997A1 (en) * 1995-04-07 1996-10-10 Seiko Epson Corporation Surface treatment apparatus
JP2002237480A (en) * 2000-07-28 2002-08-23 Sekisui Chem Co Ltd Method of treating base material with discharge plasma
JP2003051490A (en) * 2001-08-03 2003-02-21 Tokyo Electron Ltd Plasma processing apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03217706A (en) * 1990-01-23 1991-09-25 Hakukin Warmers Co Ltd Method of purifying exhaust gas
JPH03221127A (en) * 1990-01-26 1991-09-30 Hakukin Warmers Co Ltd Exhaust gas cleaning method
WO1996031997A1 (en) * 1995-04-07 1996-10-10 Seiko Epson Corporation Surface treatment apparatus
JP2002237480A (en) * 2000-07-28 2002-08-23 Sekisui Chem Co Ltd Method of treating base material with discharge plasma
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