JP4505386B2 - Manufacturing method of multilayer electronic component - Google Patents

Description

  The present invention relates to a stacked electron in which an insulator layer and a conductor pattern are stacked, a conductor pattern between the insulator layers is connected, a coil is formed in the stack, and a magnetic body is formed on a winding portion of the coil in the stack. The present invention relates to a part manufacturing method.

As shown in FIG. 5, the conventional multilayer electronic component of this type includes an internal magnetic body 51A, a nonmagnetic body 52 surrounding the internal magnetic body 51A, and an external magnetic body 51B that completely covers the periphery thereof. In some non-magnetic materials, a coil that wraps around the inner magnetic material is formed by connecting half-turn coil conductor patterns 53 between layers (see, for example, Patent Document 1).
Japanese Patent Publication No. 3-58164

  Although such a multilayer electronic component can improve the DC superposition characteristics, since the coil conductor patterns are stacked by the print lamination method every 1/2 turn, the shape is enlarged to obtain a predetermined inductance value, It has not been possible to cope with the recent miniaturization of elements. Further, in order to cope with such downsizing, it is necessary to improve the printing accuracy of the magnetic layer, the nonmagnetic layer, and the coil conductor pattern, and it is necessary to flatten the printing surface. In conventional multilayer electronic components, the magnetic layer, nonmagnetic layer, and coil conductor pattern are stacked by the printing lamination method. Therefore, the thickness of the magnetic layer and nonmagnetic layer can be used to flatten the printed surface. It was necessary to increase the thickness, and the size could not be reduced.

  The present invention provides a method for manufacturing a multilayer electronic component capable of obtaining low resistance and high direct current superposition characteristics even if it is miniaturized.

  The present invention relates to a stacked electron in which an insulator layer and a conductor pattern are stacked, a conductor pattern between the insulator layers is connected, a coil is formed in the stack, and a magnetic body is formed on a winding portion of the coil in the stack. In the component manufacturing method, after a coil conductor pattern having a turn of 1/2 turn or more and less than 1 turn is printed on the insulator layer, a nonmagnetic paste is printed between both ends of the coil conductor pattern to form a nonmagnetic part. Forming a loop-shaped pattern with the coil conductor pattern and the non-magnetic body portion on the insulator layer, and pressurizing the loop-shaped pattern; the coil conductor pattern on the insulator layer and the non-magnetic body portion A magnetic paste is printed on a portion other than the loop-shaped pattern formed by forming a first magnetic body portion so that the surface of the first magnetic body portion is flush with the loop-shaped pattern surface. Add the first magnetic part to Forming a non-magnetic body portion on the conductor pattern for the coil other than the one end portion of the coil conductor pattern, and then printing the conductor paste on the end portion of the coil conductor pattern to form a conductor. Forming a second magnetic body portion by printing a magnetic paste on the first magnetic body portion, pressurizing a loop-shaped pattern formed by the non-magnetic body portion and the conductor, The step of pressurizing the second magnetic body portion is repeated so that the surface of the magnetic body portion 2 is positioned in the same plane as the surface of the loop pattern, thereby forming a coil pattern in the laminate with the coil conductor pattern and the conductor.

  In the method for manufacturing a multilayer electronic component according to the present invention, after a coil conductor pattern having a turn of 1/2 turn or more and less than 1 turn is printed on an insulator layer, a nonmagnetic paste is printed between both ends of the coil conductor pattern. Forming a non-magnetic body portion, forming a loop-shaped pattern with the coil conductor pattern and the non-magnetic body portion on the insulator layer, and pressurizing the loop-shaped pattern; a coil conductor on the insulator layer; A magnetic paste is printed on a portion other than the loop-shaped pattern formed by the pattern and the non-magnetic body portion to form a first magnetic body portion, and the surface of the first magnetic body portion is a loop-shaped pattern surface. A step of pressing the first magnetic body part so as to be positioned on the same plane, after forming a non-magnetic body part by printing a non-magnetic body paste on a portion other than one end of the coil conductor pattern, Lead to end of coil conductor pattern A step of printing a paste to form a conductor and pressurizing a loop-shaped pattern formed by the non-magnetic body portion and the conductor, and a second magnetic body by printing a magnetic paste on the first magnetic body portion And repeating the process of pressurizing the second magnetic body portion so that the surface of the second magnetic body portion is flush with the loop-shaped pattern surface. Since the coil pattern is formed, a high inductance value can be obtained with a small number of layers, and the printed surface of the coil conductor pattern and the non-magnetic material portion can be flattened. Superimposition characteristics can be obtained.

In the method for manufacturing a multilayer electronic component according to the present invention, first, a coil conductor pattern of 1/2 turn or more and less than 1 turn is printed on an insulator layer, and between the both ends of the coil conductor pattern on the insulator layer. A nonmagnetic paste is printed to form a nonmagnetic portion, and a loop-shaped pattern is formed by the coil conductor pattern and the nonmagnetic portion. This loop pattern is pressed by a press. Next, a magnetic paste is printed on the inner periphery and outer periphery of the loop-shaped pattern on the insulator layer to form a first magnetic body portion. The first magnetic body portion is pressed by a press so that the surface thereof is flush with the loop pattern surface. Subsequently, a non-magnetic paste is printed on a portion other than one end portion of the coil conductor pattern to form a non-magnetic portion, and the conductor paste is printed on the end portion of the coil conductor pattern. A loop-like pattern is formed by the non-magnetic part and the conductor. This loop pattern is pressed by a press. Further, a magnetic paste is printed on the first magnetic body portion to form a second magnetic body portion, and the press machine is arranged so that the surface of the second magnetic body portion is flush with the loop-shaped pattern surface. To pressurize the second magnetic body. In this way, a coil pattern is formed by the coil conductor pattern and the conductor in the laminate, and a non-magnetic part is formed on the coil pattern.
Therefore, the multilayer electronic component manufacturing method of the present invention can eliminate the irregularities on the upper surface of the loop pattern by pressurizing the loop pattern, and prints the magnetic paste on the inner and outer circumferences of the loop pattern. It is possible to suppress the occurrence of bleeding and pinholes in the non-magnetic material portion printed on the coil conductor pattern. In addition, by printing a magnetic paste on the inner and outer circumferences of the loop pattern to form a magnetic part, and pressurizing the magnetic part, unevenness of the printed surface can be suppressed, and the accuracy of the pattern printed on the upper surface can be reduced. Get better. Furthermore, since the magnetic body portion is formed by printing the magnetic paste on the portion other than the loop-shaped pattern formed by the coil conductor pattern and the non-magnetic portion, the side surface of the coil conductor pattern and the magnetic body are formed. Since the coil conductor pattern and the magnetic body portion are formed on the same plane with the portions in contact with each other, there is no need to consider the thickness of the coil conductor pattern as in the prior art. Thickness can be reduced to reduce resistance. Furthermore, after forming a non-magnetic part on the coil conductor pattern, a magnetic part is formed on the inner and outer periphery of the loop-shaped pattern formed of the non-magnetic part and the conductor, and the magnetic part is pressed. Therefore, the flatness of the surface of the nonmagnetic body portion can be maintained without increasing the thickness of the nonmagnetic body portion more than necessary.

Hereinafter, a method for manufacturing a multilayer electronic component of the present invention will be described with reference to FIGS.
FIG. 1 is an exploded perspective view of a multilayer electronic component according to an embodiment of the multilayer electronic component manufacturing method of the present invention, and FIG. 2 is a diagram of the multilayer electronic component according to the embodiment of the multilayer electronic component manufacturing method of the present invention. FIG. 3 is a sectional view of FIG.
As shown in FIGS. 1 to 3, the multilayer electronic component according to the method for manufacturing a multilayer electronic component of the present invention has, on the magnetic layer 11A, magnetic body portions 11B to 11H, non-magnetic body portions 12A to 12G, The coil conductors 13A to 13C and the conductor V having a turn of 1/2 turn or more and less than 1 turn are stacked, the magnetic layer 11I is formed on the laminate, and a coil is formed of the coil conductor and the conductor in the laminate. .
The magnetic layers 11A and 11I and the magnetic portions 11B to 11H are formed of ferrite. Further, the nonmagnetic parts 12A to 12G are made of glass ceramic or dielectric ceramic. Furthermore, the coil conductor patterns 13A to 13C and the conductor V are made of a metal material such as silver, silver, gold, gold, copper, or copper. The coil conductor patterns 13A to 13C are shown for 3/4 turns in each layer in FIG. 1, and the coil conductor pattern in each layer is formed by a conductor V formed in a layer different from the coil conductor pattern. Are connected to form a coil pattern in the laminate.
The nonmagnetic parts 12B, 12D, and 12F are formed between both ends of the coil conductor patterns 13A to 13C, and form a loop pattern with the coil conductor pattern.
Further, the nonmagnetic parts 12C and 12E are formed so as to be positioned between the coil conductor patterns, and form a loop pattern with the conductor V for connecting the coil conductor patterns.
One end of the conductor pattern 13 </ b> A constituting one end of the coil pattern is drawn out to the end face of the multilayer body and connected to the external terminal 24. Further, the other end of the conductor pattern 13 </ b> C constituting the other end of the coil pattern is drawn out to the end face of the multilayer body and connected to the external terminal 25.

Such a multilayer electronic component is manufactured as follows. First, as shown in FIG. 4A, a coil conductor pattern 13A is formed on an insulator layer. The coil conductor pattern 13A is formed by printing a conductor paste made of silver paste on the insulator layer. One end of the coil conductor pattern 13A is drawn to the end face of the insulator layer. In FIG. 4A, the insulator layer is composed of a magnetic part 11B and a nonmagnetic part 12A formed on the magnetic layer 11A. At this time, the coil conductor pattern 13A is formed on the nonmagnetic portion 12A.
Next, as shown in FIG. 4B, a nonmagnetic body portion 12B is formed on the insulator layer by printing a nonmagnetic paste between both ends of the coil conductor pattern 13A. At this time, the nonmagnetic part 12B is formed on the nonmagnetic part 12A. As a result, a loop-shaped pattern is formed by the coil conductor pattern 13A and the non-magnetic portion 12B. The surface of the coil conductor pattern 13A and the non-magnetic body portion 12B constituting the loop pattern has irregularities as shown in FIG. 4C, but by applying pressure by the press machine 40, the coil conductor pattern The surfaces of 13A and the nonmagnetic part 12B are flattened.
Further, as shown in FIG. 4D, the magnetic body portion 11C is formed by printing a magnetic paste on a portion other than the coil conductor pattern 13A and the nonmagnetic body portion 12B on the insulator layer. Although the surface of the magnetic part 11C has irregularities as shown in FIG. 4E, it is positioned on the same plane as the surface of the loop-shaped pattern and flattened by being pressed by a press.
Subsequently, as shown in FIG. 4F, a non-magnetic paste is printed on a portion other than the other end of the coil conductor pattern on the loop-shaped pattern composed of the coil conductor pattern and the non-magnetic portion. Thus, the nonmagnetic part 12C is formed. Further, the other end of the coil conductor pattern is exposed on the bottom surface of the portion H where the non-magnetic portion 12C is not formed.
Further, as shown in FIG. 4G, a conductor V is formed by filling a conductor paste on the other end of the coil conductor pattern. A loop-shaped pattern is formed by the conductor V and the non-magnetic body portion 12C. The surface of the conductor V and the nonmagnetic body portion 12C constituting the loop pattern is uneven, but the surface of the conductor V and the nonmagnetic body portion 12C is flattened by pressurizing with a press. Subsequently, the magnetic layer 11D is formed by printing a magnetic paste on the magnetic portion 11C. The magnetic layer 11D is pressed using a press so that the surface thereof is positioned on the same plane as the surface of the loop-shaped pattern formed by the conductor V and the nonmagnetic portion 12C.
In this manner, the formation of a loop pattern composed of a coil conductor pattern and a nonmagnetic portion on the insulator layer, pressurization to the loop pattern, and the first portion other than the loop pattern on the insulator layer. Forming a magnetic body part, pressurizing the first magnetic body part, forming a loop-shaped pattern comprising a conductor and a non-magnetic body part on the loop-shaped pattern, applying pressure to the loop-shaped pattern, the first magnetic body The second magnetic body portion is formed on the portion and the pressurization to the second magnetic body portion is repeated a predetermined number of times, so that a coil pattern is formed in the laminate with the coil conductor pattern and the conductor.

It is a disassembled perspective view of the multilayer electronic component which concerns on the Example of the manufacturing method of the multilayer electronic component of this invention. It is a perspective view of the multilayer electronic component which concerns on the Example of the manufacturing method of the multilayer electronic component of this invention. FIG. 3 is a cross-sectional view of FIG. 2. It is explanatory drawing of the Example of the manufacturing method of the multilayer electronic component of this invention. It is sectional drawing of the conventional multilayer electronic component.

Explanation of symbols

11A, 11I Magnetic body layers 11B-11H Magnetic body portions 12A-12G Nonmagnetic body portions 13A-13C Conductor patterns for coils

Claims (1)

A multilayer electronic component in which an insulator layer and a conductor pattern are laminated, a conductor pattern between the insulator layers is connected, a coil is formed in the laminate, and a magnetic body is formed on a winding portion of the coil in the laminate. In the manufacturing method,
After printing a conductor pattern for less than one turn to 1/2 turn coil on the insulating layer, the non-magnetic portion by printing a non-magnetic paste between both ends of the coil conductor pattern on said dielectric layer Forming a loop-shaped pattern on the insulator layer with the coil conductor pattern and the non-magnetic body portion, and pressurizing the loop-shaped pattern, a first loop-shaped pattern forming step,
A magnetic paste is printed on a portion other than the first loop-shaped pattern formed by the coil conductor pattern and the non-magnetic portion on the insulator layer to form a first magnetic portion, A first magnetic body portion forming step of pressurizing the first magnetic body portion so that the surface of one magnetic body portion is flush with the loop-shaped pattern surface;
After forming one print a non-magnetic paste on a portion other than the end portion non-magnetic portion of the conductive pattern for coil in said first loop on the pattern, the end portion of the conductor pattern for the coil forming a conductor by printing a conductive paste to form a loop-shaped pattern in the non-magnetic body and a conductor, the second loop-shaped pattern forming step of pressing the loop-shaped pattern and,
A magnetic paste is printed on the first magnetic body portion to form a second magnetic body portion, and the second magnetic body portion surface is positioned on the same plane as the loop-shaped pattern surface. Repeating the second magnetic part forming step of pressurizing the second magnetic part ,
The coil conductor patterns constituting the first loop-shaped pattern which are stacked in the laminate is, the coil pattern in the laminate are connected through a conductor forming the loop-shaped pattern of the second is formed A method of manufacturing a multilayer electronic component characterized by the above.

Images