JP4501396B2 - Manufacturing method and manufacturing apparatus for multilayer electronic component - Google Patents

Description

  The present invention relates to a method for manufacturing a multilayer electronic component and a manufacturing apparatus.

  A multilayer electronic component such as a multilayer ceramic capacitor is manufactured through the following processes. That is, a ceramic green sheet is formed on a carrier film by applying a slurry-like ceramic material on a continuous tape-like carrier film to a uniform thickness by various coating methods such as the doctor blade method and drying it. To do. Next, an internal electrode is printed on the surface of the ceramic green sheet by screen printing or the like, and this is passed through a drying furnace and dried. Thereafter, the carrier film on which the ceramic green sheet is formed is conveyed onto a surface plate, the conveyed ceramic green sheet is cut into a predetermined size by a cutting head, and the cut green sheet piece is peeled off from the carrier film. After a predetermined number of sheets are stacked and pressurized, they are cut into individual capacitor sizes and fired. Thereafter, an electrode of silver paste is applied to the end portion and baked to complete a multilayer ceramic capacitor.

  Here, there is one described in Patent Document 1 as an apparatus for supporting a carrier film having a ceramic green sheet formed on the surface thereof on a surface plate and cutting the ceramic green sheet with a cutting blade of a cutting head. As shown in FIG. 8, this apparatus is roughly constituted by a cutting head 120 having a supply roll 103, transport rolls 104 and 105, a take-up roll 106, a surface plate 110, and a cutting blade 121. The carrier film 100 having the ceramic green sheet 101 formed on the surface is supplied from the supply roll 103 through the transport roll 104 between the surface plate 110 and the cutting head 120, and after a predetermined green sheet piece is cut and peeled, The carrier film 100 is taken up by the take-up roll 106 via the transport roll 105.

When the carrier film 100 is supported on the surface plate 110, the carrier film 100 is usually transported by imaging and detecting at least two alignment marks provided on the ceramic green sheet 101 with a CCD camera or the like. The alignment (positioning) is performed by correcting the deviation in the direction (X direction), the deviation in the direction orthogonal to the transport direction (Y direction), and the rotational deviation.
Japanese Patent Application Laid-Open No. 2001-210569

  However, the conventional alignment corrects the deviation of the carrier film 100 in the conveyance direction (X direction), the deviation in the direction orthogonal to the conveyance direction (Y direction), and the rotation deviation. Correction of the shift in the distance between the alignment marks caused by the carrier film 100 expanding and contracting due to the tension sometimes has not been performed. For this reason, when the ceramic green sheet 101 is cut by the cutting head 120 after alignment, the variation in the distance between the alignment marks accompanying the expansion and contraction of the carrier film 100 remains as an alignment error. As a result, there is a problem that problems such as stacking deviation occur.

  In particular, with the increase in the size of ceramic multilayer blocks (mother blocks) used in mass production of multilayer electronic components in recent years, the variation in the distance between alignment marks during detection has increased. Misalignment at the periphery of can no longer be ignored. Further, as the carrier film 100 is made thinner for the purpose of reducing the material cost, the variation in the distance between the alignment marks is further increased.

  Accordingly, an object of the present invention is to provide a manufacturing method and a manufacturing apparatus for a multilayer electronic component that can suppress misalignment or printing misalignment due to tension applied to a ceramic green sheet or a carrier film.

In order to achieve the above object, a method for manufacturing a multilayer electronic component according to the present invention is a method for manufacturing a multilayer electronic component including a multilayer structure formed by stacking a plurality of ceramic green sheets, and includes at least an alignment mark. by but to stretch the ceramic green sheet or the ceramic green sheet with a carrier film is formed, by changing the sheet conveying direction and the width direction of the tension after the step of adjusting the alignment error, punched ceramic green sheets into a predetermined size At least one of a process, a process of printing on a ceramic green sheet, and a process of stacking and temporarily pressing the ceramic green sheets is performed. The ceramic green sheet or the ceramic green sheet with a carrier film includes a long one and a card-like one.

More specifically, in the step of adjusting the alignment error by changing the tension, at least two alignment marks formed on the ceramic green sheet or the carrier film are detected, and the distance between the alignment marks becomes a desired value. Change the tension until For example, the alignment mark is also used as a sensing mark when a ceramic green sheet is cut into a predetermined size with a cutting head. Alternatively, the alignment mark is also used as a sensing mark when printing on the surface of the ceramic green sheet.

Then, in the step of adjusting the alignment error by changing the tension, the ceramic green sheet or the ceramic green sheet with the carrier film is conveyed onto the surface plate, and the first roll and the second roll arranged on both sides of the surface plate Thus, the tension in the sheet conveying direction is changed. The first roll and the second roll include a suction roll, a nip roll, a supply roll, a winding roll, and the like.

  By the above method, if the distance between the alignment marks at the time of detection is smaller than a desired value, the tension applied to the carrier film or the ceramic green sheet is increased and the carrier film or the ceramic green sheet is stretched. On the contrary, if the distance between the alignment marks at the time of detection is larger than a desired value, the tension applied to the carrier film or the ceramic green sheet is weakened and the carrier film or the ceramic green sheet is contracted. Thereby, the distance between the alignment marks at the time of detection always becomes a desired value.

Further, the multilayer electronic component manufacturing apparatus according to the present invention is a manufacturing apparatus for manufacturing a multilayer electronic component including a multilayer body configured by stacking a plurality of ceramic green sheets,
(A) a platen on which at least a long ceramic green sheet on which an alignment mark is formed or a ceramic green sheet with a long carrier film is placed at a predetermined position;
(B) a first roll and a second roll which are arranged on both sides of the surface plate and convey the long ceramic green sheet or the long ceramic green sheet with a carrier film onto the surface plate;
(C) a width-direction tension changing mechanism that changes the tension in the width direction perpendicular to the sheet conveying direction with respect to the long ceramic green sheet or the long ceramic green sheet with a carrier film;
(D) comprising at least one of punching means for punching a long ceramic green sheet into a predetermined size and printing means for printing on the long ceramic green sheet;
(E) The first roll and the second roll can change the tension in the sheet conveying direction by expanding and contracting a long ceramic green sheet or a long ceramic green sheet with a carrier film. Yes,
(F) adjusting the alignment error by changing the tension in the sheet conveyance direction and the width direction, and then performing at least one of a punching unit and a printing unit;
It is characterized by.

  Further, the multilayer electronic component manufacturing apparatus according to the present invention includes a detection unit that detects at least two alignment marks formed on a long carrier film or a long ceramic green sheet, The tension in the sheet conveyance direction is changed by the roll and the second roll until the distance between the alignment marks reaches a desired value.

  The first roll and the second roll are, for example, suction rolls, and change the tension by adsorbing a long ceramic green sheet or a long ceramic green sheet with a carrier film.

  Alternatively, the first roll and the second roll are nip rolls, and the tension is changed by sandwiching a long ceramic green sheet or a long ceramic green sheet with a carrier film.

  With the above configuration, the tension applied in the sheet conveying direction of the long ceramic green sheet or the long ceramic green sheet with a carrier film can be easily adjusted. A ceramic green sheet with a long carrier film can be easily expanded and contracted.

Furthermore, the multilayer electronic component manufacturing apparatus according to the present invention grips a long ceramic green sheet or a long ceramic green sheet with a carrier film to thereby apply a tension in the width direction perpendicular to the sheet conveying direction. A gripping mechanism for changing is provided.

With the above configuration, the tension in the width direction perpendicular to the sheet conveying direction of the long ceramic green sheet or the long ceramic green sheet with a carrier film can be easily adjusted.

  According to the present invention, since the expansion and contraction variation due to the tension applied to the ceramic green sheet or the carrier film is suppressed, the alignment error (positioning error) can be reduced. As a result, problems such as stacking misalignment and printing misalignment can be reduced.

  Embodiments of a method for manufacturing a multilayer electronic component and a manufacturing apparatus according to the present invention will be described below with reference to the accompanying drawings.

[First embodiment, FIGS. 1 to 3]
In general, a multilayer ceramic capacitor is manufactured by forming a ceramic green sheet on a continuous tape-shaped carrier film and then printing a plurality of internal electrodes on the surface of the ceramic green sheet; A laminating step of cutting and peeling the cut ceramic green sheet pieces from the carrier film to temporarily press-bond a plurality of pieces, a main pressing step of pressing and adhering them to form an unfired ceramic laminated block, and ceramic lamination The block is cut in accordance with the arrangement of the internal electrodes, the individual multilayer ceramic chips are cut out and fired, and the process of forming external electrodes on the fired multilayer ceramic chips is sequentially performed.

  Here, the laminating process may be performed using a punching laminator 1 whose mechanical configuration is shown in FIG. The punching and laminating machine 1 is roughly composed of a supply roll 3, suction rolls 4 and 5, a take-up roll 6, a surface plate 10, a cutting head 20 having a cutting blade, a lamination stage 30, and CCD cameras 40 and 41. Has been.

  A surface plate 10 is disposed between the supply roll 3 and the winding roll 6 along the conveyance path of the carrier film 50, and between the supply roll 3 and the surface plate 10 and between the surface plate 10 and the winding roll 6. Are respectively provided with suction rolls 4 and 5. A large number of suction holes are dispersedly formed on the surface of the surface plate 10. When the carrier film 50 having the ceramic green sheet 51 formed on the upper surface is conveyed to a predetermined position on the surface plate 10, The carrier film 50 is temporarily fixed by suction. The upper surface of the surface plate 10 is basically at a position flush with the conveying surface of the carrier film 50, but may be driven up and down in accordance with cutting and suction. CCD cameras 40 and 41 are arranged above the surface plate 10.

  The cutting head 20 reciprocates between the upper side of the surface plate 10 and the upper side of the stacking stage 30. The cutting head 20 has a cutting blade around it and has a number of suction holes on the bottom surface surrounded by the cutting blade. The cutting blade is movable in the vertical direction along the side surface of the cutting head 20, and protrudes from the bottom surface of the cutting head 20 so as to be equal to or slightly longer than the thickness of the ceramic green sheet 51 when moved downward. . That is, the cutting blade protrudes from the cutting head 20 in such a dimension that the carrier film 50 is not completely cut when the ceramic green sheet 51 is cut.

  The suction rolls 4 and 5 have a large number of suction holes on the roll surface, and a suction box is provided in the roll. By reducing the pressure inside the suction box, the carrier film 50 can be adsorbed on the surfaces of the suction rolls 4 and 5 through the suction holes.

  A ceramic green sheet 51 is formed on the upper surface of a continuous tape-like carrier film 50 having elasticity, such as a polyester film or a polyethylene terephthalate film, by applying a slurry-like ceramic material to a uniform thickness and drying it. On the upper surface of the ceramic green sheet 51, there are a large number of multilayer ceramic capacitor internal electrodes (arranged in a region A surrounded by a one-dot chain line in FIG. 1), two alignment marks 52 outside the region A, Are continuously formed in the longitudinal direction of the ceramic green sheet 51 at a predetermined pitch. The two alignment marks 52 are arranged at the center in the width direction of the ceramic green sheet 51. These alignment marks 52 and the internal electrodes of the capacitor are formed simultaneously by screen printing or the like.

  FIG. 2 shows a system configuration of the punching laminator 1. The memory 53A cuts the ceramic green sheet 51, which is a punched and cut member, peels off the mother ceramic green sheet pieces 51a that have been cut from the carrier film 50, laminates them, and press-fits them so that they are not fired. This is mainly for registering programs and data for forming ceramic multilayer blocks.

  The calculation part (CPU) 53 calculates | requires the alignment amount (positioning amount) of the carrier film 50 by calculating using the program and data which were registered into memory 53A.

  The alignment mark detection unit 54 is connected to the CCD cameras 40 and 41, and detects the position of the alignment mark 52 with the CCD cameras 40 and 41. The detection data is sent to the memory 53A and the calculation unit 53.

  The operator inputs and outputs predetermined data using the data input unit (keyboard or mouse) 57 while viewing the screen displayed on the display unit (CRT) 56.

  The motor control unit 58 is connected to the motors 59 to 63, and drives appropriate motors 59 to 63 according to instructions from the calculation unit 53. The cutting head driving motor 59 moves the cutting head 20 in parallel between the upper surface of the surface plate 10 and the upper side of the stacking stage 30 or rotationally moves it. The suction roll 4 driving motor 60 and the suction roll 5 driving motor 61 rotate the suction rolls 4 and 5 independently of each other. The supply roll drive motor 62 and the take-up roll drive motor 63 rotate the supply roll 3 and the take-up roll 6 in synchronization with each other.

  Next, operation | movement of the punching laminating machine 1 which consists of the above structure is demonstrated. The carrier film 50 having the ceramic green sheet 51 formed on the upper surface is wound around the supply roll 3 and the take-up roll 6 through the suction rolls 4 and 5 with a predetermined tension. The rolls 3 to 6 are rotated in synchronization with each other, and the ceramic green sheet 51 is conveyed onto the surface plate 10, and when reaching a predetermined position, the conveyance is stopped. Two alignment marks 52 having different positions in the conveyance direction of the ceramic green sheet 51 are detected by the two CCD cameras 40 and 41. Since the positions of the CCD cameras 40 and 41 are measured in advance, if the position of the captured alignment mark 52 in the camera field of view is measured by a known image processing such as pattern matching, the positional relationship between the two alignment marks 52 I understand.

  Next, the alignment of the ceramic green sheet 51 and the punching position of the cutting head 20 are corrected by the following algorithm. First, as shown in FIG. 3, the computing unit 53 calculates the coordinates (x, y) of the midpoint P of the two alignment marks 52 from the positional relationship between the two alignment marks 52. In FIG. 3, the X axis is parallel to the conveyance direction of the carrier film 50, and the Y axis is parallel to the width direction of the carrier film 50. The intersection of the X axis and the Y axis is the midpoint of the CCD cameras 40 and 41 in plan view. That is, the camera axis connecting the two CCD cameras 40 and 41 overlaps on the X axis. Further, the angle θ formed by the straight line L passing through the two alignment marks 52 and the camera axis (X axis) is calculated, and the distance D between the two alignment marks 52 is calculated. The calculated coordinates (x, y), angle θ, and distance D of the midpoint P are stored in the memory 53A.

  Next, the calculation unit 53 stores the data of the normal midpoint P coordinates (xs, ys), the angle θs, and the distance Ds previously stored in the memory 53A, and the calculated coordinates (x, y) The angle θ and the distance D are compared, and the respective shift amounts are calculated.

  The deviation of the x coordinate of the midpoint P is corrected by slightly moving the carrier film 50 in the direction parallel to the X axis by rotating all the rolls 3 to 6 clockwise (or counterclockwise) by the deviation amount. To do. The deviation of the y coordinate of the midpoint P is corrected by slightly moving the cutting head 20 by the amount of deviation in the Y-axis direction. Further, the deviation of the angle θ is corrected by slightly rotating the cutting head 20 by the deviation amount with respect to the central axis.

  Further, the deviation of the distance D is corrected by adjusting the tension of the carrier film 50 so that the carrier film 50 is expanded and contracted in the conveying direction by the deviation amount. That is, when the distance D is larger than the normal value, the suction roll 5 is rotated counterclockwise by 1/2 of the shift amount, and the suction roll 4 is rotated clockwise by 1/2 of the shift amount. Thereby, the tension applied to the carrier film 50 positioned between the suction rolls 4 and 5 is weakened, and the carrier film 50 is contracted in the transport direction (X-axis direction), so that the distance D is reduced and corrected.

  On the other hand, when the distance D is smaller than the normal value, the suction roll 5 is rotated by a half of the deviation amount clockwise, and the suction roll 4 is rotated by a half of the deviation amount counterclockwise. . As a result, the tension applied to the carrier film 50 located between the suction rolls 4 and 5 becomes strong, and the carrier film 50 extends in the transport direction (X-axis direction), so that the distance D is increased and corrected.

  In FIG. 3, since the punching position is in the center of the suction rolls 4 and 5, the ratio of the rotation amount of the suction rolls 4 and 5 at the time of correction is 1: 1, but the punching position and the suction rolls 4 and 5 The ratio of the rotation amount of the suction rolls 4 and 5 varies depending on the positional relationship.

  Further, in order to increase the accuracy of correction, the alignment mark 52 may be picked up again by the CCD cameras 40 and 41 to confirm the position. Then, the correction, confirmation, correction, and so on may be repeated until the deviation amount falls within a predetermined reference value. When the alignment adjustment is completed, the carrier film 50 is temporarily sucked and fixed onto the surface plate 10 through the suction holes of the surface plate 10.

  Next, the cutting head 20 is lowered until the bottom surface contacts the surface of the ceramic green sheet 51. Then, when the ceramic green sheet 51 is sucked by applying a suction force from the suction hole of the cutting head 20, the cutting blade is lowered and protruded slightly longer than the thickness of the ceramic green sheet 51 from the bottom surface of the cutting head 20. The ceramic green sheet 51 is cut into a predetermined size (ceramic green sheet piece 51a) by the blade. At this time, the carrier film 50 is not completely cut.

  Next, after stopping the suction of the suction holes of the surface plate 10, the cutting head 20 is raised to reliably peel the ceramic green sheet piece 51 a from the carrier film 50.

  The peeled ceramic green sheet piece 51a is conveyed above the stacking stage 30 while being adsorbed on the bottom surface of the cutting head 20, placed on the stacking stage 30, and temporarily pressed. A ceramic multilayer block is obtained by stacking a predetermined number of ceramic green sheet pieces 51a and performing a main press. Thereafter, the ceramic multilayer block is cut into individual capacitor sizes and fired, and external electrodes such as silver paste are formed at both ends, thereby completing the multilayer ceramic capacitor.

  In the first embodiment, a case where all corrections are performed when the ceramic green sheet 51 is punched is taken as an example. However, the correction of the coordinates (x, y) and the angle θ of the midpoint P can also be performed by finely adjusting the moving distance of the cutting head 20 or the like at the position of the stacking stage 30.

  According to the above method, not only the deviation of the carrier film 50 in the conveyance direction (X-axis direction), the deviation in the direction orthogonal to the conveyance direction (Y-axis direction) and the rotation deviation, but also the distance D between the alignment marks 52. It is possible to correct the deviation. Therefore, the variation in the distance D between the alignment marks 52 caused by the expansion and contraction of the carrier film 50 due to the tension applied when the carrier film 50 is conveyed can be suppressed, and the alignment error can be reduced. As a result, stacking deviation can be suppressed. In particular, when a polyethylene terephthalate film is used as the carrier film 50, the expansion and contraction due to the tension during conveyance is large, and the variation in the position of the internal electrode in the conveyance direction is larger than that in the width direction. For this reason, the method of adjusting the distance D between the alignment marks 52 only in the transport direction has a great effect.

[Second Embodiment, FIGS. 4 and 5]
The laminating process of the second embodiment is performed using the punching laminator 1A shown in FIG. The punching and laminating machine 1A includes four CCD cameras 40 to 43 and four gripping mechanisms 15 and 16 (in FIG. 4, two gripping mechanisms disposed on the back side of the carrier film 50 are omitted). Except for the above, it is substantially the same as the punching laminator 1 of the first embodiment, and the detailed description thereof is omitted.

  The four gripping mechanisms 15 and 16 are disposed at the four corners of the surface plate 10 so as to face each other with the carrier film 50 therebetween. Each of the gripping mechanisms 15 and 16 has a pair of claws, and grips the edge of the carrier film 50 with the pair of claws, so that the carrier film 50 is transported in the transport direction (X-axis direction) and width direction (Y-axis direction) Can be moved to. The alignment marks 52 are formed near the four corners of the internal electrode arrangement region A on the ceramic green sheet 51.

  Next, the alignment operation of the punching laminator 1A will be described. The carrier film 50 having the ceramic green sheet 51 formed on the upper surface is wound around the supply roll 3 and the take-up roll 6 through the suction rolls 4 and 5 with a predetermined tension. The rolls 3 to 6 are rotated in synchronization with each other, and the ceramic green sheet 51 is conveyed onto the surface plate 10, and when reaching a predetermined position, the conveyance is stopped. Four alignment marks 52 on the ceramic green sheet 51 are detected by the four CCD cameras 40 to 43. Since the positions of the CCD cameras 40 to 43 are measured in advance, if the position of the imaged alignment mark 52 in the camera field of view is measured by known image processing such as pattern matching, the positional relationship of the four alignment marks 52 I understand.

  Next, the alignment of the ceramic green sheet 51 and the punching position of the cutting head 20 are corrected by the following algorithm. First, as shown in FIG. 5, the calculation unit 53 determines the coordinates (x1, y1) of the midpoint P1 of the alignment marks 52a and 52c from the positional relationship of the four alignment marks 52 (52a, 52b, 52c, 52d), Then, the coordinates (x2, y2) of the midpoint P2 of the alignment marks 52b and 52d are calculated. Furthermore, the coordinates (x3, y3) of the midpoint P3 between the midpoint P1 and the midpoint P2 are calculated. Next, the angle θ formed by the straight line L passing through the midpoints P1 and P2 and the X axis is calculated, and the distances D1 to D4 between the alignment marks 52a to 52d are calculated. The X axis is parallel to the camera axis connecting the CCD cameras 40 and 41 and the camera axis connecting the CCD cameras 42 and 43.

  Next, the calculation unit 53 stores the data of the normal midpoint P3 (x3s, y3s), the angle θs and the distances D1s to D4s stored in advance in the memory 53A, and the calculated coordinates of the midpoint P3 ( x3, y3), the angle θ, and the distances D1 to D4 are compared to calculate the respective shift amounts.

  The x-coordinate deviation of the midpoint P3 is corrected by slightly moving the carrier film 50 in the direction parallel to the X axis by driving all the rolls 3 to 6 clockwise (or counterclockwise) by the deviation amount. To do. The deviation of the y coordinate of the midpoint P3 is corrected by slightly moving the cutting head 20 by the amount of deviation in the Y-axis direction. Further, the deviation of the angle θ is corrected by slightly rotating the cutting head 20 by the deviation amount with respect to the central axis. Or you may correct | amend the shift | offset | difference of angle (theta) by moving the suction rolls 4 and 5 relatively parallel to an axial direction (Y-axis direction), and shifting.

  Further, the shift of the distances D1 and D2 is corrected by adjusting the tension in the transport direction of the carrier film 50 as described in detail in the first embodiment, and extending or contracting the carrier film 50 by the shift amount in the transport direction.

  On the other hand, the shift of the distances D3 and D4 is corrected by adjusting the tension in the width direction of the carrier film 50 and extending or contracting the carrier film 50 by the shift amount in the width direction. That is, after gripping the edge portion of the carrier film 50 by the respective claw portions of the four gripping mechanisms 15 and 16, the gripping mechanisms 15 and 16 are moved in the X direction and the Y direction according to the shift amount. Thereby, since the tension applied in the width direction of the carrier film 50 is weakened or strengthened, the distances D3 and D4 are corrected. According to the above method, it can adjust easily also about the tension | tensile_strength of the width direction of the carrier film 50, and can suppress a lamination | stacking deviation | shift further.

[Third embodiment, FIG. 6]
The punching laminating machine 1B shown in FIG. 6 is substantially the same as the punching laminating machine 1 of the first embodiment except that it includes a surface plate 10A and peeling rolls 71 and 72. The detailed explanation is omitted.

  The surface plate 10 </ b> A and the peeling rolls 71 and 72 are integrally fixed by a member 73. When the ceramic green sheet piece 51a is peeled from the carrier film 50, the ceramic green sheet 51 is cut by the cutting head 20, and then the surface plate 10A and the peeling rolls 71 and 72 are moved in the direction opposite to the sheet conveying direction. The sheet piece 51a is peeled off.

[Fourth embodiment, FIG. 7]
The punching laminating machine 1C shown in FIG. 7 is substantially the same as the punching laminating machine 1 of the first embodiment except that nip rolls 81 and 82 are provided instead of the suction rolls 4 and 5. Detailed description thereof will be omitted. The nip rolls 81 and 82 are each constituted by a pair of rolls, and the sheet 51 is sandwiched between the pair of rolls and tension is applied to the sheet 51.

[Other embodiments]
In addition, this invention is not limited to the said Example, It can change variously within the range of the summary.

  For example, although the said Example demonstrated the case where it applied to the punching laminating machine, you may apply to a printing machine. The present invention is effective when screen printing or gravure printing has a printing area having a larger area than before. Even if it is not a large area, it is printed twice (because after the internal electrode paste is printed, the ceramic paste for eliminating the step is filled between the internal electrode pastes or disposed around the internal electrode paste. In this case, the tension of the carrier film needs to be adjusted at the time of the second printing, so that case is also effective.

  The number of alignment marks is not limited as long as it is two or more. Furthermore, as long as it is a relatively thick ceramic green sheet that can withstand a predetermined tension, only a ceramic green sheet without a carrier film may be used. The present invention can also be applied to a high-strength ceramic green sheet in which a resin is mixed or a metal film is formed.

  Further, since the tension variation is large if the tension during conveyance is maintained, the tension in the conveyance direction of the carrier film 50 can be increased to some extent by the suction rolls 4 and 5 before the alignment marks 52 are detected by the CCD cameras 40 to 43. For example, a constant tension can be obtained.

  Furthermore, although the alignment mark 52 is provided outside the punching area A, it may be inside the punching area A. Instead of forming the alignment mark 52 independently, the internal electrode of the capacitor may be used as the alignment mark. However, the accuracy increases as the distance between the alignment marks 52 increases. Further, the alignment mark 52 is not necessarily formed on the ceramic green sheet 51 and may be formed on the carrier film 50.

  In addition to the multilayer capacitor, the multilayer electronic component may be a multilayer ceramic electronic component such as a multilayer inductor, a multilayer LC composite component, a multilayer device, or a multilayer substrate.

  The CCD cameras 40 to 43 may be installed integrally with the cutting head 20. Further, the cutting head 20 of the first and second embodiments has a rectangular cutting blade, but the disk-shaped blades (rolls) respectively provided along the four sides of the rectangular cutting head. Blade). Each roll blade moves toward the adjacent roll blade along the side of the cutting head to cut the ceramic green sheet.

  In addition, the second embodiment is provided with a gripping mechanism for adjusting the tension in the width direction of the long ceramic green sheet with a carrier film, but the card-like sheet is gripped by four corners. The tension in the conveying direction and the width direction of the long ceramic green sheet with a carrier film may be adjusted.

1 is a schematic perspective view showing one embodiment of a multilayer electronic component manufacturing apparatus according to the present invention. The system block diagram of the manufacturing apparatus of the multilayer electronic component shown in FIG. FIG. 3 is a plan view for explaining an alignment operation of the multilayer electronic component manufacturing apparatus shown in FIG. 1. The schematic perspective view which shows another Example of the manufacturing apparatus of the multilayer electronic component which concerns on this invention. The top view for demonstrating the alignment operation | movement of the manufacturing apparatus of the multilayer electronic component shown in FIG. The schematic front view which shows another Example of the manufacturing apparatus of the multilayer electronic component which concerns on this invention. The schematic front view which shows another Example of the manufacturing apparatus of the multilayer electronic component which concerns on this invention. The schematic front view which shows the manufacturing apparatus of the conventional multilayer electronic component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1A, 1B, 1C ... Punching laminating machine 3 ... Supply roll 4,5 ... Suction roll 6 ... Winding roll 10, 10A ... Surface plate 15,16 ... Gripping mechanism 20 ... Cutting head 30 ... Lamination stage 40-43 ... CCD camera 50 ... carrier film 51 ... ceramic green sheet 52 (52a, 52b, 52c, 52d) ... alignment mark 53 ... calculation unit 54 ... alignment mark detection unit 81, 82 ... nip roll D1-D4 ... distance between alignment marks

Claims (8)

A method for producing a multilayer electronic component comprising a laminate comprising a plurality of ceramic green sheets stacked,
After the step of adjusting the alignment error by changing the tension in the sheet conveying direction and the width direction by expanding and contracting at least the ceramic green sheet on which the alignment mark is formed or the ceramic green sheet with a carrier film,
Performing at least one of the steps of punching the ceramic green sheet into a predetermined size, printing the ceramic green sheet, and stacking and temporarily pressing the ceramic green sheets;
A method of manufacturing a multilayer electronic component characterized by the above. In the step of adjusting the alignment error by changing the tension, at least two alignment marks formed on the ceramic green sheet or the carrier film are detected until the distance between the alignment marks reaches a desired value. 2. The method of manufacturing a multilayer electronic component according to claim 1, wherein the tension is changed. In the step of adjusting the alignment error by changing the tension, the ceramic green sheet or the ceramic green sheet with the carrier film is conveyed onto a surface plate, and a first roll and a second roll disposed on both sides of the surface plate The method of manufacturing a multilayer electronic component according to claim 1 , wherein the tension in the sheet conveyance direction is changed by the roll. A manufacturing apparatus for manufacturing a multilayer electronic component including a laminate configured by stacking a plurality of ceramic green sheets,
A platen on which at least a long ceramic green sheet on which an alignment mark is formed or a ceramic green sheet with a long carrier film is placed at a predetermined position;
A first roll and a second roll which are arranged on both sides of the surface plate and convey the long ceramic green sheet or the long ceramic green sheet with a carrier film onto the surface plate;
A width direction tension changing mechanism that changes a tension in a width direction perpendicular to a sheet conveying direction with respect to the long ceramic green sheet or the long ceramic green sheet with a carrier film;
At least one of punching means for punching the long ceramic green sheet into a predetermined size and printing means for printing on the long ceramic green sheet,
The first roll and the second roll can change the tension in the sheet conveying direction by expanding and contracting the long ceramic green sheet or the long ceramic green sheet with a carrier film. Yes,
Performing at least one of the punching means and the printing means after adjusting the alignment error by changing the tension in the sheet conveying direction and the width direction ;
An apparatus for manufacturing a multilayer electronic component characterized by the above.   A detector for detecting at least two alignment marks formed on the long carrier film or the long ceramic green sheet, and the first roll and the second roll, The apparatus for manufacturing a multilayer electronic component according to claim 4, wherein the tension in the sheet conveying direction is changed until the distance between them reaches a desired value. The first roll and the second roll are suction rolls, and change the tension in the sheet conveyance direction by adsorbing the long ceramic green sheet or the long ceramic green sheet with a carrier film. 6. The multilayer electronic component manufacturing apparatus according to claim 4, wherein the multilayer electronic component is manufactured. The first roll and the second roll are nip rolls, and change the tension in the sheet conveying direction by sandwiching the long ceramic green sheet or the long ceramic green sheet with a carrier film. 6. The multilayer electronic component manufacturing apparatus according to claim 4, wherein the multilayer electronic component is manufactured. A gripping mechanism is provided, which grips the long ceramic green sheet or the long ceramic green sheet with a carrier film, thereby changing a tension in a width direction perpendicular to the sheet conveying direction. Item 8. The apparatus for manufacturing a multilayer electronic component according to any one of Items 4 to 7.

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