JP4487802B2 - Enclosure for electronic equipment - Google Patents

Description

  The present invention relates to an electronic device casing, and more particularly to an electronic device casing suitable for housing an electronic device having a large calorific value.

  In recent years, the demand for large-scale in-vehicle power sources used for hybrid cars and electric cars has been increasing. Since the amount of heat generated by this type of power supply is very large, a high cooling performance is also required for a housing for housing it. As one of such electronic device casings, there has been proposed one that adopts a water-cooling method and saves space by a two-story structure (see Patent Document 1).

  FIG. 8 is an external perspective view showing an example of the configuration of such a conventional electronic device casing.

  As shown in FIG. 8, the electronic device casing 40 is configured by a combination of an upper case 41 and a lower case 46. Although not shown, a power circuit and other electronic devices are included in each case. Is housed. Both the upper case 41 and the lower case 46 are constituted by a case main body 42 made of a metal material such as aluminum and a lid portion 43 thereof. The case main body 42 is configured integrally with a cooling plate 44 that forms the bottom surface of the case and a side wall 45 that forms the side surface of the case. Similarly, the lower case 46 is constituted by a case main body 47 and a lid 48 thereof, and the case main body 47 is constituted by a cooling plate 49 and a side wall 50.

  The side wall 45 of the upper case and the side wall 50 of the lower case are respectively provided on the surfaces of the cooling plates 44 and 49 so as to collectively surround the mounting area of the electronic device and the formation area of the through-type terminal block. Furthermore, a plurality of screw holes 44Y are arranged at a predetermined pitch on the outer peripheral side of the cooling plates 44 and 49 and outside the side walls 45 and 50. The upper case 41 and the lower case 46 are combined by fixing each other with the cooling plates facing each other and screwed and fixed at the position of the screw hole 44Y, and are handled as one casing.

  A serpentine groove is formed on the back surface side of the cooling plate 49 of the lower case 46, and a cooling channel 51 for flowing a cooling liquid is formed by combining the cooling plates. An electronic device is mounted in the upper case 41 and the lower case 46, and a through-type terminal block 52 is provided in a predetermined region on the periphery of the cooling plate excluding the mounting region. As shown in FIG. 9, the through-type terminal block 52 is placed at a predetermined installation position on the cooling plate 44, and then fixed using four screws 54 from the surface side. The through-type terminal block 52 has two external terminals corresponding to a pair of power supply lines, and two bus bars 53 are respectively fixed on the common through-type terminal block 52 using screws 55, and the corresponding external terminals. Electrically connected to the terminal. As a result, the electronic device mounted in the case and the external terminal are electrically connected through the bus bar 53, and further, the upper case 41 and the lower case 46 are electrically connected through the mutual through-type terminal block 52. Connected.

When the cooling plates are combined, the sealing material 56 is provided on the back surface side of the cooling plate around the cooling channel 51 and around the through-type terminal block 52 (the surroundings of the through-type terminal block 52 are not shown). It is applied and waterproofed to prevent leakage. Thereby, the cooling flow path 51 that cannot be completely sealed only by screwing can be reliably sealed, and the periphery of the through-type terminal block 52 can be reliably waterproofed as well. In addition, if the gap between the through-type terminal block 52 is filled with the sealing material 56, a sufficient bonding strength that can withstand the water pressure cannot be secured, so the cooling plates are screwed at a predetermined pitch. This ensures basic adhesive strength that can withstand water pressure.
JP-A-11-121690

  As described above, in the conventional electronic device casing 40, the through-type terminal block 52 is disposed at a predetermined position outside the mounting area of the electronic device, and the electronic device mounting area and the through-type terminal block 52 Side walls 45 and 50 are provided so as to surround the periphery of the formation region, and a plurality of screw holes 44Y are formed on the outside thereof, so that the cooling plates 44 and 49 are fixed with screws.

  However, if the through-type terminal block 52 is laid out outside the mounting area of the electronic device, the through-type terminal block 52 protrudes outward when viewed from the mounting area side of the electronic device. The area of the cooling plates 44 and 49 must be increased in accordance with the amount of protrusion. Further, a region necessary for screwing and fixing the through-type terminal block 52, a region where the side walls 45 and 50 are formed around the through-type terminal block 52, and a screw hole 44Y are formed around the side walls 45 and 50. Since it is also necessary to secure a region to perform, the extra area on the cooling plates 44 and 49 is further increased.

  Accordingly, an object of the present invention is to reduce the amount of protrusion to the outside of the through-type terminal block as viewed from the mounting area side of the electronic device as much as possible, thereby reducing the size of the housing for the electronic device.

  The above object of the present invention is to provide a cooling plate on which an electronic device is mounted on the front surface side, at least two through-type terminal blocks provided on the cooling plate and incorporating external terminals, a mounting area of the electronic device, and the penetration A side wall provided at a peripheral edge of the cooling plate so as to collectively enclose an installation area of the mold terminal block, and a plurality of peripheral edges of the cooling plate arranged outside the side wall at a predetermined pitch It includes at least a screw hole and a wiring member connected to the external terminal, and the side wall surrounds the periphery of the through-type terminal block in the vicinity of the through-type terminal block except for the drawing direction of the wiring member. The through-type terminal block and the surrounding side wall formed therein are achieved by a housing for electronic equipment, which is arranged between the screw hole arrays.

  In this invention, it is preferable that the penetration type terminal block is installed from the back surface side of the said cooling plate, and is screwed and fixed from the back surface side of the said cooling plate.

  In the present invention, with respect to a portion of the side wall that surrounds the periphery of the through-type terminal block, the wall thickness is made thinner than the other portions except for the upper end portion, and the upper end portion is the through-type terminal portion. It is preferable that they are arranged so as to overlap a part of the terminal block.

  In this invention, it is preferable that the cooling means is provided in the back surface side of the said cooling plate.

  In the present invention, it is preferable that the cooling unit is a water-cooling type cooling unit that allows a cooling liquid to flow through a cooling channel formed by a groove formed on the back surface side of the cooling plate.

  In the present invention, it is preferable that a sealing material is provided on the back surface side of the cooling plate, around the cooling means and around the through-type terminal block.

  In the present invention, the external terminal and the wiring member both correspond to a pair of power supply lines, and the through-type terminal block includes a first through-type terminal block having an external terminal on the positive electrode side; It is preferable to comprise the 2nd penetration type terminal block which equips the external terminal by the side of a minus pole.

  The object of the present invention is also constituted by a combination of an upper case and a lower case, electronic devices are accommodated in the respective cases, and a cooling means is provided between the upper case and the lower case. A housing for electronic equipment, wherein the upper case and the lower case are both constituted by a case body and a lid thereof, and the case body comprises a cooling plate that constitutes a bottom surface of the case, and a side surface of the case Side walls, at least two through-type terminal blocks provided on the cooling plate and including external terminals, and a plurality of screws arranged at a predetermined pitch at a peripheral edge of the cooling plate and outside the side walls At least a hole and a wiring member connected to the external terminal, and the side wall includes a mounting area of the electronic device and an installation area of the through-type terminal block It is provided at the peripheral edge of the cooling plate so as to enclose it in a lump, and is formed so as to surround the periphery of the penetration type terminal block excluding the drawing direction of the wiring member in the vicinity of the penetration type terminal block, The through-type terminal block and a part of the side wall around the through-type terminal block are also achieved by an electronic device casing, which is disposed between the screw hole arrays.

  In the present invention, the cooling means is a water-cooling type cooling means that causes a cooling liquid to flow in a cooling flow path formed by a groove formed on the back surface of the cooling plate in one or both of the upper case and the lower case. Preferably there is.

  According to the present invention, the conventional through-type terminal block, which has been inevitably large in volume by accommodating a pair of external terminals, is divided into individual external terminals, thereby miniaturizing the through-type terminal block. Since these are arranged between the screw hole arrangements, the protruding amount of the through-type terminal block and the side wall seen from the mounting area side of the electronic component can be reduced, and the useless area of the cooling plate can be reduced. .

  In addition, since screws are secured from the back side of the cooling plate of the through-type terminal block, the occupied area of the screw can be eliminated on the surface side of the cooling plate, and the occupied area of the through-type terminal block can be reduced. it can. Furthermore, since the screwing position of the penetration type terminal block is provided in the direction along the long side of the cooling plate, the protruding amount of the penetration type terminal block and the side wall can be further reduced.

  Also, the portion of the side wall that surrounds the periphery of the through-type terminal block is made thinner except for the upper end portion that becomes the mating surface with the lid, and the upper end portion is the side wall of the other portion. Since the top wall of the side wall overlaps with the upper part of the through-type terminal block, the amount of protrusion to the outside of the through-type terminal block viewed from the mounting area side of the electronic component can be reduced. This can be further reduced, and the useless area of the cooling plate can be reduced.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is an exploded perspective view showing a structure of an electronic device casing according to a preferred embodiment of the present invention. FIG. 2 is a perspective view showing a completed state of the electronic device casing.

  As shown in FIG. 1, this electronic device casing 10 is configured by a combination of an upper case 11 and a lower case 16, and is not shown, but a power circuit and other electronic devices are included in each case. Is housed. As an example, a DC-DC converter is accommodated in the upper case, and a DC-AC converter is accommodated in the lower case. The upper case 11 is composed of a case main body 12 and a lid portion 13 thereof. The case body 12 includes a cooling plate 14 that forms the bottom surface of the case and a side wall 15 that forms the side surface of the case, and is integrally formed of a metal material such as aluminum. Similarly, the lower case 16 is constituted by a case main body 17 and a lid portion 18 thereof, and the case main body 17 is constituted by a cooling plate 19 and a side wall 20. In the following description, the case main body 12 of the upper case may be simply referred to as “upper case 12”, and the case main body 17 of the lower case may be simply referred to as “lower case 17”.

  The upper case 11 and the lower case 16 are combined by screwing them with the cooling plates 14 and 19 facing each other, and are handled as one housing as shown in FIG. Screw holes are provided in the peripheral portions of the cooling plates 14 and 19 at predetermined intervals, and both are fixed by screwing at those positions. The screw hole may be tapped or formed as a simple through hole. A serpentine groove is formed on the back surface side of the cooling plate 19 of the lower case, and a cooling flow path 21 is formed for allowing the cooling liquid to flow when the cooling plates are overlapped with each other. Water supply / drain ports 22 are provided at both ends of the cooling channel 21, and the coolant injected from one of the water supply / drain ports 22 is discharged from the opposite water supply / drain port 22 through the cooling channel 21.

  FIG. 3A is a plan view showing the configuration of the upper case 12 as viewed from the surface side, and FIG. 3B is a partially enlarged perspective view of the vicinity of the through-type terminal block 24. Since the basic structure of the lower case 16 is the same as that of the upper case 12 except that the cooling flow path 21 described above is provided, only the upper case 12 will be described here. The description of is omitted.

  As described above, the upper case 12 is formed by integrally molding the cooling plate 14 and the side wall 15, but as shown in FIG. 3, a through-type terminal block 24 is provided inside the case. In the present embodiment, two independent through-type terminal blocks 24, 24 are prepared, and these correspond to the two bus bars 25, 25 which are a pair of wiring members. The two bus bars 25 correspond to, for example, a plus pole and a minus pole of a pair of power supply lines. These through-type terminal blocks 24 are arranged near the corners on the cooling plate 14 excluding the mounting area 14X of the electronic device. The side wall 15 of the upper case is provided along the peripheral edge of the cooling plate 14, and surrounds the mounting area 14X of the electronic device and the arrangement area of the through-type terminal block 24 all together.

  As shown in FIG. 3B, each bus bar 25 is screwed and fixed to the through-type terminal block 24 and is electrically connected to an external terminal built in the through-type terminal block 24. That is, the connection between the electronic device in the case and the external terminal is made through the bus bar 25. Since the bus bar 25 corresponds to the plus and minus poles of the power supply line, the external terminals correspond to the plus and minus terminals, respectively. In the vicinity of the through-type terminal block 24, the side wall 15 is enclosed so as to surround the three directions around each through-type terminal block 24 excluding the pull-out direction of the bus bar 25 according to the arrangement of the two through-type terminal blocks 24. Is formed. Therefore, the side wall 15 viewed from the upper surface side has a waveform having two peaks 15L and 15R as shown in the figure.

  A plurality of screw holes 14 </ b> Y are arranged at a predetermined pitch outside the side wall 15 at the peripheral edge of the cooling plate 14. These screw holes 14Y are formed as screw taps or through holes. Among them, the screw holes 14Y in the vicinity of the through-type terminal block 24 are on the screwing line BB along the long side of the cooling plate 14 and outside of the two peaks 15L and 15R of the side wall 15 and these peaks. It is provided in the valley part (intermediate position) between each. In other words, each through-type terminal block 24 is provided between the arrangements of the screw holes 14Y.

  The pitch between the normal screw holes 14Y is set to the reference pitch P1. The reference pitch P <b> 1 is set to a value that can ensure a sufficient bonding strength that can withstand a coolant flowed to the cooling channel 21 with a certain level of water pressure. On the other hand, the pitch of the screw holes 14Y in the vicinity of the through-type terminal block 24 is determined according to the size of the through-type terminal block 24. However, since the through-type terminal block 24 has been downsized as described above, the pitch is larger than the reference pitch P1. A short pitch P2 can be set. As described above, the through-type terminal blocks 24 for connecting the pair of bus bars are separately divided, and the respective through-type terminal blocks 24 are provided between the arrangements of the screw holes 14Y. The protrusion amount to the outside of the penetration type terminal block 24 and the side wall 15 can be reduced while ensuring a sufficient bonding strength.

  4A is a plan view showing the configuration of the upper case 12 viewed from the back side, and FIG. 4B is a partially enlarged perspective view of the vicinity of the through-type terminal block 24. FIG.

  The back surface of the upper case 11 is waterproofed so that no liquid leaks from the cooling channel when the cooling plates of the upper case 11 and the lower case 16 are combined. That is, if the cooling plates are simply screwed together, they are not completely in close contact with each other, and there is a slight gap between them, so that sufficient airtightness cannot be secured. As shown, the seal material 26 is provided around the cooling channel forming region to form the first waterproof area R1, and the seal material 26 is also provided around each of the through-type terminal blocks 24, 24. Thus, a second waterproof area R2 is formed. As a result, the periphery of the cooling flow path 21 that cannot be completely sealed only by screwing can be reliably sealed, and liquid leakage from the cooling flow path can be reliably prevented. In particular, since the penetration type terminal block 24 is individually waterproofed, even if liquid leakage occurs in the first waterproof area R1, the coolant enters the second waterproof area R2. There is almost no. The sealing material 26 is not particularly limited, and a polyester resin or an epoxy resin can be used.

  FIG. 5 is a schematic exploded perspective view of the upper case 12.

  As shown in FIG. 5, the two through-type terminal blocks 24 and 24 are inserted from the back side into the through-type terminal block opening formed in the cooling plate 14 and then screwed with screws 27 from the back side. It is fixed by doing. The pair of bus bars 25, 25 are attached from the front side and are fixed to external terminals in each through-type terminal block by screws 28. If the through-type terminal block 24 is screwed and fixed in this manner from the back surface side, the area on the surface side of the cooling plate is not occupied by the screw, and the side wall 15 can be disposed in the immediate vicinity of the through-type terminal block 24. As a result, the amount of protrusion to the outside of the through-type terminal block 24 and the side wall 15 can be further reduced.

  FIG. 6 is a partial cross-sectional view of the upper case 11 taken along line BB in FIG.

  As shown in FIG. 6, the through-type terminal block 24 has a shape in which a cylindrical member 24a and a screw fixing fixing flange member 24b spread on both sides thereof are integrated (see also FIG. 4). . The through-type terminal block 24 is made of an insulating material such as resin, and a conductive external terminal 29 is accommodated therein. The external terminal 29 on the upper case 11 side is connected to the external terminal 31 on the lower case 16 side via the connecting terminal 30 when the upper case 11 and the lower case 16 are combined. And electrical connection between the electronic device in the lower case 16 is ensured. Screw holes are formed in the left and right flange members 24b, and as shown in FIG. 4, the screws 27 are inserted into the screw holes from the back side, whereby the through-type terminal block 24 is fixed to the cooling plate 14. Is done.

  FIG. 7 is a partial cross-sectional view of the upper case along the line AA in FIG.

  As shown in FIG. 7, the end of the bus bar 25 is placed on the external terminal 29 and is electrically connected to the external terminal 29 by being screwed with a screw 28. In the present embodiment, the wall thickness of the portion of the side wall 15 that surrounds the periphery of the through-type terminal block 24 is higher than usual except for the upper end portion 15S that becomes the mating surface with the lid portion 13. It is thin. On the other hand, the upper end portion has a normal wall thickness like the side walls of the other portions. As described above, the upper end portion 15S of the side wall has an “eave” shape protruding to the through-type terminal block 24 side, and the upper end portion is overlapped with a part above the through-type terminal block 24. The protruding amount of the side wall 15 seen from the region side can be further reduced, and the useless area of the cooling plate 14 can be further reduced. Further, the wall thickness of the upper end portion 15S of the side wall serving as the mating surface with the lid portion 13 is the same as that of the other peripheral side wall 15 and the desired wall thickness is secured. Sex can be maintained. In addition, since intensity | strength will become weak when the side wall 15 is made too thin, it cannot be overemphasized that it should be made into appropriate thickness.

  As described above, according to the present embodiment, a conventional through-type terminal block that has been inevitably increased in volume by accommodating a pair of external terminals composed of a positive electrode and a negative electrode together with each external terminal. By dividing each terminal into a through-type terminal block with an external terminal corresponding to the positive pole and a through-type terminal block with an external terminal corresponding to the negative pole, each through type is prepared separately. Since the terminal block is miniaturized and these are arranged between the screw hole arrangements, the protruding amount of the through-type terminal block and the side wall seen from the mounting area side of the electronic component can be reduced, and the wasted area of the cooling plate Can be reduced.

  Further, according to the present embodiment, since the screwing is performed from the back side of the cooling plate of the penetration type terminal block, the screw occupation area can be eliminated on the surface side of the cooling plate, and consequently the penetration type terminal block. Occupied area can be reduced. Furthermore, since the screwing position of the penetration type terminal block is provided in the direction along the long side of the cooling plate, the protruding amount of the penetration type terminal block and the side wall can be further reduced.

  Further, according to the present embodiment, the portion of the side wall that surrounds the periphery of the through-type terminal block has a wall thickness that is larger than that of the other portions, except for the upper end portion that becomes the mating surface with the lid portion. Since the upper end portion has the same wall thickness as the other side walls, and the upper end portion of the side wall protruding toward the penetrating terminal block overlaps the penetrating terminal block. The amount of protrusion to the outside of the through-type terminal block viewed from the mounting region side can be further reduced, and the useless area of the cooling plate can be reduced.

  The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention, and these are also included in the scope of the present invention. Needless to say.

  For example, in the above embodiment, the case where two through-type terminal blocks are provided has been described. However, the number of through-type terminal blocks is appropriately determined according to the wiring situation. It does not matter. For example, when four external terminals are required, two through-type terminal blocks may be prepared, and the external terminals may be divided into two pieces and may be provided in each through-type terminal block. A mold terminal block may be prepared, and the external terminals may be divided into one piece and installed in each penetration type terminal block. In short, the number of through-type terminal blocks is determined by the number of external terminals and their assigned number, and the number of external terminals provided in one through-type terminal block is determined by how many external terminals are installed. The relationship between the size of the screw and the pitch of the screw holes becomes a problem. There is no problem if the pitch between the left and right screw holes sandwiching one through-type terminal block is less than or equal to the reference pitch P1, and if it exceeds the reference pitch, the number of external terminals is reduced in order to reduce the size of the through-type terminal block. Need to reduce.

  In the present embodiment, the two penetration terminal blocks are arranged along the long side direction of the cooling plate, but may be arranged along the short side direction of the cooling plate. Further, they may be arranged in both the long side direction and the short side direction. Further, although the bus bar is used as the wiring member, a lead wire may be used instead of the bus bar.

  Further, in the above-described embodiment, the two-story electronic device casing in which the upper case and the lower case are overlapped has been described, but the present invention is further applied to a three-story and four-story structure. It is also possible to apply to a single case structure.

  Further, in the above embodiment, as a cooling means for the electronic device casing, a cooling channel is configured by a groove formed on the back surface side of the lower case, and a water cooling method in which a cooling liquid is supplied to the cooling channel is used. Although adopted, the present invention is not limited to this, and other water-cooling methods can be adopted as the cooling means. Further, the groove for the cooling channel may be formed on the upper case side, or may be formed on both the lower case side and the upper case side.

FIG. 1 is an exploded perspective view showing a structure of an electronic device casing according to a preferred embodiment of the present invention. FIG. 2 is a perspective view showing a completed state of the electronic device casing 10. FIG. 3A is a plan view showing the configuration of the upper case 12 as viewed from the surface side, and FIG. 3B is a partially enlarged perspective view of the vicinity of the through-type terminal block 24. 4A is a plan view showing the configuration of the upper case 12 viewed from the back side, and FIG. 4B is a partially enlarged perspective view of the vicinity of the through-type terminal block 24. FIG. FIG. 5 is a schematic exploded perspective view of the upper case 12. FIG. 6 is a partial cross-sectional view of the upper case 11 taken along line BB in FIG. FIG. 7 is a partial cross-sectional view of the upper case 11 taken along the line AA in FIG. FIG. 8 is an external perspective view showing an example of the configuration of such a conventional electronic device casing. FIG. 9 is a schematic exploded perspective view of the upper case 42.

Explanation of symbols

10 Housing for Electronic Equipment 11 Upper Case 12 Case Body of Upper Case (Upper Case)
13 Upper Case Cover 14 Cooling Plate 14X Electronic Device Mounting Area 15 Side Wall 15S Upper Side Part of Side Wall 16 Lower Case 17 Case Body (Lower Case) of Lower Case
18 Lid of lower case 20 Side wall 21 Meandering groove (cooling channel)
22 Cooling water supply / drain port 24 Through-type terminal block 24a Tubular member 24b Fence member 25 Bus bar 26 Sealing material 27 Screw 28 Screw 29 External terminal 30 Connection terminal 31 External terminal P1 Screw hole reference pitch P2 Screw near penetration type terminal block Hole pitch R1 First waterproof area R2 Second waterproof area

Claims (9)

A cooling plate on which electronic devices are mounted on the surface side;
At least two through-type terminal blocks provided on the cooling plate and having external terminals internally;
A side wall provided at a peripheral edge of the cooling plate so as to collectively surround a mounting area of the electronic device and an installation area of the through-type terminal block;
A plurality of screw holes arranged at a predetermined pitch or less outside the side wall at the periphery of the cooling plate;
And at least a wiring member connected to the external terminal,
The side wall is formed in the vicinity of the through-type terminal block so as to surround the periphery of the through-type terminal block excluding the drawing direction of the wiring member,
The housing for electronic equipment, wherein the through-type terminal block and the side wall surrounding the terminal block are arranged between the screw hole arrays.   2. The electronic device housing according to claim 1, wherein the through-type terminal block is installed from the back side of the cooling plate and is fixed by screws from the back side of the cooling plate.   The portion of the side wall that surrounds the periphery of the through-type terminal block is made thinner than the other portions except for the upper end portion, and the upper end portion is a part of the through-type terminal block. The electronic device casing according to claim 1, wherein the electronic device casing is disposed so as to overlap with the electronic device casing.   4. The electronic device casing according to claim 1, wherein cooling means is provided on a back surface side of the cooling plate. 5.   5. The electronic device casing according to claim 4, wherein the cooling unit is a water-cooling type cooling unit that causes a cooling liquid to flow through a cooling channel formed by a groove formed on a back surface side of the cooling plate.   6. The electronic device housing according to claim 4, wherein a sealing material is provided on a back surface side of the cooling plate and around the cooling unit and around the through-type terminal block.   The external terminal and the wiring member both correspond to a pair of power supply lines, and the through-type terminal block includes a first through-type terminal block that houses an external terminal on the positive pole side and an external terminal on the negative pole side. 7. The electronic device casing according to claim 1, comprising a second through-type terminal block in which the housing is installed. An electronic device casing that is configured by a combination of an upper case and a lower case, in which an electronic device is accommodated in each case, and cooling means is provided between the upper case and the lower case. ,
Both the upper case and the lower case are constituted by a case main body and a lid portion thereof,
The case main body includes a cooling plate that constitutes a bottom surface of the case, a side wall that constitutes a side surface of the case, at least two through-type terminal blocks that are provided on the cooling plate and house external terminals, and a peripheral portion of the cooling plate. A plurality of screw holes arranged at a predetermined pitch or less outside the side wall, and at least a wiring member connected to the external terminal,
The side wall is provided at a peripheral portion of the cooling plate so as to collectively surround a mounting area of the electronic device and an installation area of the through-type terminal block, and in the vicinity of the through-type terminal block, the wiring member Formed so as to surround the periphery of the through-type terminal block excluding the pulling direction of
The through-type terminal block and a part of the side wall surrounding the terminal block are arranged between the screw hole arrays.   The cooling means is a water-cooling type cooling means for flowing a cooling liquid into a cooling flow path formed by a groove formed on the back surface of the cooling plate in one or both of the upper case and the lower case. The housing for an electronic device according to claim 8.

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