JP4487061B2 - Carrier tape for metallized film capacitor formation with peelable heat seal layer - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a carrier tape suitable for temporarily supporting an electrical (or electronic) component and subjecting the electrical component to various treatments.MetallizedCarrier suitable for use as a masking tape in a mode in which metal spraying is performed on both exposed end surfaces of a capacitor element such as a cylindrical shape or a flat cylindrical shape, which is sealed between a pair of carrier tapes in a film capacitor element manufacturing process. Regarding tape.
[0002]
[Prior art]
For the production of a metallized film capacitor, generally, two metallized films are wound concentrically to form a cylindrical or flat cylindrical capacitor element, and then a large number of these are shown in FIG. Capacitor elements 1 are arranged close to each other so that their axial directions are parallel to each other (perpendicular to the paper surface of FIG. 1), and between a pair of masking tapes 2 such as paper tape and plastic tape each coated with an adhesive. Then, the both side edges of the tape 2 are slightly crimped (for example, about 1 mm) from the end face of the capacitor element with the help of the crimping member 3, and metal spraying (so-called metallikon) is performed on both end faces of the exposed capacitor element 1. . Capacitor element 1 after metal spraying is individualized in the process of removing a pair of masking tape on the adhesive surface after scraping off the excessively adhered metal on the element end face with a metal brush such as a brass wire to stabilize the electrical characteristics. Collected as an element. The recovery process of the capacitor elements after the metal spraying is continuously performed at a high speed of, for example, about 40 m per minute while transferring a long masking tape of, for example, 340 m holding a large number of capacitor elements, for example, 3000. Done.
[0003]
As a masking tape used for manufacturing the metallized film capacitor as described above, a paper tape based on paper and a plastic tape based on polyester film or polypropylene film are used. In some cases, since the interlayer strength is weak, when the masking tape is peeled off after metal spraying, the tape may be broken and the device recovery process may be stopped.
[0004]
In contrast, a plastic tape using a base material such as a polyester film or a polypropylene film can be improved in strength by increasing the thickness as necessary, but the rigidity of the tape increases with the increase in the base material thickness. The gap 4 tends to be generated between the element and the tape 2 in the vicinity of the peripheral surface facing the adjacent element 1 in FIG. 1, and the thermal spray metal tends to enter the gap to generate defective elements. Become. In order to harmonize the prevention of voids due to the increase in rigidity of the plastic tape and the increase in tape strength, an adhesive is applied after laminating a non-woven fabric with a fiber flow in the longitudinal direction of the film on the plastic film substrate. A foaming agent is mixed in a masking tape (Japanese Patent Publication No. 5-44168) imparted with strength and elasticity by coating, or a pressure-sensitive adhesive to be coated on a plastic film substrate, and is adhered by heat such as metal spraying. There has also been proposed a masking tape (Japanese Patent Laid-Open No. 11-214272) in which foaming of the agent layer is caused to prevent generation of a gap between the element and the tape.
[0005]
[Problems to be solved by the invention]
However, these conventional plastic masking tapes do not satisfy all of the following characteristics necessary to withstand the severe metallized film capacitor manufacturing process including the metal spraying and device recovery steps described above.
[0006]
(1) It must be heat resistant to withstand metal spraying.
(2) Adhering to the peripheral surface of the capacitor element during metal spraying and having sufficient masking properties.
(3) In relation to the above (2), sufficient adhesion fit to the element 1 to prevent the generation of the gap 4 between the element and the tape at the position facing the adjacent element as shown in FIG. Be flexible enough to show
(4) It has the strength to withstand metal wire brushing for removing the excessively adhered metal after metal spraying.
(5) In the tape peeling process after metal wire brushing, no abnormal tearing or tearing should occur.
(6) After the tape peeling process, the adhesive residue is left on the peripheral surface of the capacitor element, so that the element characteristics such as change in insulation resistance are not destabilized.
(7) Stablely exhibit the above characteristics (1) to (6) regardless of changes in environmental conditions including seasonal fluctuations.
[0007]
In short, the conventional adhesive-coated plastic masking tape clearly has problems in the above points (6) and (7), and is not always satisfactory in the points (2) to (5). Did not have.
[0008]
In view of the above circumstances, the present invention provides a carrier tape for electrical parts that well harmonizes the characteristics (1) to (7) required when used as a masking tape in metal spraying in a metallized film capacitor manufacturing process. The main purpose is to provide.
[0010]
  The present inventionIs used in a manner in which metal spraying is performed on the exposed end surfaces of a plurality of metallized film capacitor elements arranged and sealed between the heat seal resin layers of a pair of carrier tapes each having a heat seal resin layer. Each of the carrier tapesA polyamide resin core layer is sandwiched between a heat-resistant resin layer having a thickness of 1/2 or less of the thickness of the polyamide resin core layer and a heat sealing resin layer.Have structureCarrier tapeIs to provide.
[0011]
Hereinafter, the present invention will be described in accordance with embodiments while referring to the background.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
The masking tape (carrier tape) of the present invention is used in the embodiment shown in FIG. 2, which is similar to that shown in FIG. 1, which shows the usage of the conventional plastic masking tape.
[0013]
That is, in general, two capacitor metallized films are wound concentrically to form a cylindrical or flat cylindrical capacitor element 1 so that their axial directions are parallel to each other, and a pair of heat sealing resin layers are formed. The masking tape (carrier tape) 20 of the present invention has a pair of masking between adjacent capacitor elements 1 by the heat sealing bar 30 and sandwiched between the heat sealing resin layers and with both side edges of the masking tape 20 protruding slightly. The tape 20 is heat sealed.
[0014]
Thus, unlike the case of using the conventional adhesive-type masking tape 2 (FIG. 1), no direct adhesive force (adhesive force) acts between the capacitor element 1 and the masking tape 20 (for example, part A). The capacitor element 1 and the masking tape 20 are masked by the adhesive force between the masking tapes 20 heat-sealed at the B part, the tensile stress acting on the masking tape 20 tensioned by the adhesive sealing part B, and the flexibility of the masking tape 20. Adhesion between the tapes 20 is ensured.
[0015]
In order to achieve the above-mentioned object, the present inventors have initially made a masking tape (20X) comprising two layers of a polyamide resin layer 20a and a heat sealing resin layer 20b having both flexibility and mechanical strength as shown in FIG. ) Was developed and tested, it is possible to withstand the heat during metal spraying and exhibit good masking performance without the formation of voids in the C part, where voids tend to occur. Among the characteristics (1) to (7) to be performed, almost satisfactory performance was obtained for (1) to (3) and (6) to (7). However, some dissatisfaction remained in the durability in the brushing and peeling process of (4) and (5). That is, the masking tape 20X may be torn in a peeling process subsequent to extremely severe brushing.
[0016]
However, as a result of further research by the present inventor, as shown in FIG. 4 as a cross-sectional view corresponding to FIG. 3 and as a partially cutaway perspective view in FIG. The masking tape 20 of the present invention provided with the heat-resistant resin layer 20c having a thickness of / 2 or less provided extremely satisfactory characteristics including the above (4) and (5) suitability for the brushing and peeling process. .
[0017]
Such a cross-sectional laminated structure before metal spraying of one capacitor element 1 held by the masking tape 20 of the present invention is as shown in FIG.
[0018]
The masking tapes 20X (FIG. 3) and 20 (FIG. 4 or 5) developed by the present inventors are capable of exhibiting the masking force during metal spraying by the pressure-sensitive adhesive layer and the pressure-sensitive adhesive layer as in the conventional plastic masking tape. Rather than being obtained by the elasticity (volume compression elasticity) applied to the agent layer, the adhesive strength is ensured by the sealing strength at part B (Fig. 2), the resulting tension and the flexible tensile elasticity of the masking tape itself. The above-mentioned masking tape is innovative in that it eliminates the disadvantages (6), (7) and the like, and the masking tape 20 having a relatively thin heat-resistant resin layer 20c is particularly required. In all of (1) to (7), satisfactory characteristics are obtained.
[0019]
The reason why the remarkably improved mechanical characteristics are obtained by providing the relatively thin heat-resistant resin layer 20c is not necessarily clear, but at present, it is considered as follows.
[0020]
(A) The heat resistance of the entire masking tape is improved by the heat resistant resin layer 20c, and thermal deterioration during metal spraying is prevented.
(B) The heat-resistant resin is generally higher in rigidity than the polyamide resin, and therefore, the damage to the edge of the polyamide resin core layer under the metal wire brushing step is alleviated by the lamination reinforcing effect of the different resin. Therefore, abnormal tearing is prevented from occurring in the subsequent peeling process.
(C) As shown in the experimental examples described later, although the cause is not clear, by providing the heat resistant resin layer 20c, the heat seal strength by the heat seal resin layer 20b on the opposite side is increased, and the heat seal portion B (FIG. The adhesiveness between the masking tape 20 and the capacitor element 1 secured in the sealing strength of 2) is improved, and the durability is exhibited in the subsequent metal wire brushing and peeling process. In particular, when the heat sealing resin layer 20b (FIG. 6) is maintained as a clear layer after heat sealing, stable sealing strength is exhibited and the sealing strength is uniform as a whole. Not.
[0021]
Hereinafter, the configuration of each layer of the masking tape (carrier tape) 20 of the present invention will be described in more detail.
[0022]
As the polyamide resin constituting the polyamide resin core layer 20a, various types of resins having both good heat resistance and mechanical strength are known. Nylon 6, nylon 66, nylon 69, nylon 9, nylon 11, nylon 12 Nylon 610, Nylon 612 homopolymers or aliphatic polyamides composed of binary or ternary copolymers, aromatic polyamides containing aromatic diamine units such as polymetaxylylene adipamide (MXD6), isophthal An aromatic polyamide containing an aromatic dicarboxylic acid unit such as acid or terephthalic acid, a copolymer of an aliphatic polyamide and an aromatic polyamide, and a mixture of the above polyamides are used. In order to obtain heat resistance that can withstand metal spraying, the polyamide resin preferably has a melting point of 150 ° C. or higher, and particularly preferably has a melting point of 170 to 230 ° C. in order not to lose flexibility as a very high melting point. It is also preferable that the polyamide resin core layer 20a is uniaxially or biaxially stretched as necessary in order to improve mechanical properties.
[0023]
In order to have mechanical strength including necessary tensile strength and tear strength and to ensure flexibility, the polyamide resin core layer 20a preferably has a thickness in the range of 15 to 35 μm.
[0024]
As the heat-resistant resin constituting the heat-resistant resin layer 20c, a film-forming resin having a melting point of 230 ° C. or higher, preferably 260 ° C. or higher is used. Examples thereof include polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate. Polyarylene sulfides such as polyphenylene sulfide, and the like can be used, but the present invention is not limited to this as long as it is a film-forming resin having a high melting point. These heat resistant resins inevitably have high rigidity in relation to the molecular structure giving a high melting point, and protect or cooperate the polyamide resin core layer 20b thermally and mechanically in metal spraying and subsequent processes. The masking tape 20 exhibiting excellent durability is provided. However, in order to maintain the necessary flexibility as a whole, the thickness needs to be ½ or less of the thickness of the polyamide resin core layer 20b, and the thickness is about 6 to 15 μm, particularly about 9 to 12 μm. preferable.
[0025]
Examples of the heat sealing resin constituting the heat sealing resin layer 20b include polyolefins such as polyethylene having low temperature sealing properties, copolymers of olefins and polar monomers such as acrylic acid, methacrylic acid or vinyl acetate, and the like. An ionomer resin (Surlin) or the like into which metal crosslinks are introduced is used, and an appropriate heat sealable resin is selected according to the required seal strength. The thickness of the heat seal resin layer 20b is appropriately selected according to the required seal strength, but is generally preferably in the range of 15 to 35 μm. For example, when it is used as a carrier tape for temporary support for general electric parts, it is preferable that the peel strength is relatively low and the seal strength is relatively low. However, when used as a masking tape for metal spraying, in order to guarantee good masking characteristics with the sealing strength at the seal portion B and to ensure the integrity of the element and the tape in the subsequent peeling process, for example, 15 to It is preferable to stably obtain a relatively strong seal strength such as 35 N / 15 mm width. In this sense, a copolymer resin of an olefin monomer, particularly ethylene and a polar monomer, or an ionomer resin having a metal bridge introduced therein is more preferable. As described above, in the masking tape 20 of the present invention, as a result of providing the heat resistant resin layer 20c, a stable sealing strength is obtained within a range where the heat seal resin layer 20a is well maintained. Tear of the polyamide resin core layer 20b due to variations in seal strength is prevented.
[0026]
As a heat sealing method for obtaining such heat seal strength at a high speed, it is preferable to use an impulse heat sealing method or a high frequency heat sealing method capable of locally heating and rapidly cooling the film. Further, for example, for the capacitor element 1 having a width W of about 10 to 20 mm along the longitudinal direction of the tape 20, it is necessary to take a seal width S (FIG. 2) of about 0.5 to 2 mm. This is preferable in order to achieve both the sealing strength that gives an effect and the ease of peeling.
[0027]
The carrier tape (masking tape) 20 according to the present invention includes a heat-resistant resin layer 20c, a polyamide resin core layer 20a, and a heat-sealing resin layer 20b as described above. It is formed by lamination by lamination or coextrusion. Examples of adhesives include acid-modified polyolefin resin adhesives, polyester resin adhesives, polyurethane resin adhesives, non-stretched nylon films (for example, “Rayfan 1401” (Nylon 6 unstretched film manufactured by Toray Industries, Inc.). )) And the like are preferably used, but the present invention is not limited to these as long as necessary adhesion can be obtained without impairing the flexibility of the entire masking tape. In general, the adhesive layer is preferably formed with a thickness of about 1 to 3 μm.
[0028]
The carrier tape of the present invention may contain an additional layer as required, but when used as a masking tape, the total thickness is 30 to 30 to ensure necessary flexibility and strength. A range of 90 μm is preferable. The masking tape of the present invention can be subjected to post-treatments such as electron beam irradiation and corona treatment as necessary.
[0029]
The width of the masking tape 20 is generally about 5 to 50 mm, the length is basically arbitrary, and can be formed to 500 m or more.
[0030]
As described above, the carrier tape of the present invention is extremely suitable for use as a metal spray masking tape in the manufacture of metallized film capacitors. However, a plurality of electrical (or electronic) components or the like can be used. Temporarily support on tape, and after storage for a certain period of time, if necessary, (a) While transporting the tape, remove each part and incorporate it into the required electrical (electronic) equipment, or (b) transport A carrier tape suitable for being used in such a manner that it is subjected to a process other than metal spraying in the process and then incorporated into an electric (electronic) device while removing each component.
[0031]
As an example of the above aspect (a), as shown in FIG. 7 (plan view), a plurality of electrical components 11 are appropriately provided between a pair of tapes 20A and 20B corresponding to the carrier tape of the present invention but having different widths. In the process of transporting the masking tapes 20A and 20B in the direction of the arrow, the operator peels the tape 20B from the tape 20A at a proper time, takes out the electrical component 11, and Suitable for incorporation into the main unit. Since the carrier tape of the present invention is temporarily supported without directly adhering to the electric component, there is no possibility that the adhesive will adhere to the electric component 11 taken out, and the characteristic of the change due to the change in resistance, etc. The problem of variation cannot occur. The adhesive strength between the tapes 20A and 20B can be appropriately changed according to the required temporary fixing strength, and is narrow enough to expose the electrical component 11 when the required temporary fixing strength is low. It is also possible.
[0032]
Moreover, as an example of said (b), an aspect as shown in FIG. 8 is mentioned as a side view. That is, the capacitor element 1 having the metal sprayed layer 5 on both end surfaces is obtained through the metal spraying process and the tape peeling process as described above, and the lead wire 6 is soldered to the metal sprayed layer 5 of the capacitor element 1. In the process of transporting the tape 20A, 20B in the direction of the arrow after the element 6 is temporarily heat-sealed between the pair of carrier tapes 20A and 20B corresponding to the carrier tape of the present invention at the lead wire 6 portion. If the element is immersed in the molten resin bath 7 and pulled up, the resin molding of the capacitor element can be performed easily and continuously. The capacitor element after resin molding is recovered by peeling the tape 20B from 20A.
[0033]
7 and 8, it is possible to replace one of the tapes 20A and 20B, which probably has a lower strength requirement, with a heat-sealable resin tape other than the carrier tape of the present invention.
[0034]
【Example】
Hereinafter, the present invention will be described more specifically with reference to Examples, Comparative Examples, and Reference Examples.
[0035]
Example 1
Basically, the carrier tape 20 of the present invention having the laminated structure shown in FIG. 4 was produced as follows.
[0036]
That is, 10 parts by weight of a polyester resin (“AD502” manufactured by Toyo Molton Co., Ltd.) and polyisocyanate (Toyo Molton Co., Ltd.) on one side of a 25 μm thick biaxially stretched nylon 6 film (“Emblem ON” manufactured by Unitika; melting point 215 ° C.) A mixture of 1 part by weight of “CAT-10L” manufactured by Molton Co., Ltd. was diluted to about 60 parts by weight of ethyl acetate, then gravure coated and dried to form an adhesive layer having a thickness of about 2 μm. Next, a polyethylene terephthalate film having a thickness of 9 μm (“Embretto” manufactured by Unitika; melting point 264 ° C.) having a thickness of 9 μm was passed through a pinch roller heated to about 85 ° C. and dry-laminated on the adhesive layer.
[0037]
Further, after forming an adhesive layer having a thickness of about 2 μm with the same mixed adhesive on the other surface of the nylon 6 film after dry lamination, an ethylene-methacrylic acid copolymer (EMAA) resin (DuPont) was formed on the adhesive layer. “Nucleel NC-5” (melting point: 92 to 95 ° C.) was extrusion coated to form an adhesive layer having a thickness of 30 μm.
[0038]
Thus, a film having the laminated structure of FIG. 4 in which the polyamide resin core layer 20a is basically held between the polyethylene terephthalate layer 20c and the EMAA heat seal resin layer 20b through the two adhesive layers is obtained, and this film is 24 mm wide. The carrier tape (masking tape) according to the present invention was obtained by slitting the film.
[0039]
This carrier tape has a tensile strength of 132.7 N / 15 mm and an elongation at break of 126.12 as measured with a Tensilon universal tensile tester (“UTM-III-100” manufactured by Toyo Baldwin) under a tensile speed of 50 mm / min. 6%.
[0040]
Separately, two flat polyethylene terephthalate films with a thickness of about 5 μm each formed with an Al vapor deposition pattern were rolled into a cylindrical shape and press-molded to obtain a flat cylinder with a long diameter W (FIG. 2) of 13 mm, a short diameter of 7 mm, and a length of 21 mm. Between the heat sealing resin layers of the two carrier tapes 20 obtained as described above, about 500 of the capacitor elements 1 are parallel to each other in the length direction of the elements 1 and the longitudinal direction of the tape 20 Are arranged at a pitch of about 14 mm so as to be orthogonal to each other (about 1 mm as the spacing S in the seal part B), and an ultrasonic sealing device (“MODEL KET-1” manufactured by BRANSON, output 150 watts) has a seal temperature of about 90 ° C. Sealed continuously for 2 seconds with a seal interval of 0.6 seconds. A pair of tapes 20 that seal and hold the obtained capacitor element 1 are wound up into concentric rolls, and zinc and tin are sequentially subjected to metal spraying on both ends of the exposed capacitor element 1 to form a thermal spray of about 0.2 mm in thickness. A layer was formed.
[0041]
The masking tape pair carrying the capacitor element after metal spraying is rewound from the roll at a speed of about 40 m / min, and each has four brass wire brushes rotating at 150 to 200 rpm with a diameter of about 50 mm. When the end surface and the back end surface (in the arrangement shown in FIG. 2) are brushed, and further passed through the guide roller, they are separated from each other by receiving a tensile force from a pair of downstream nip rollers and receiving a tearing peel force. At the same time, the processed capacitor element was separated from the tape and recovered.
[0042]
In a series of steps in which a 60 m tape carrying 500 elements is continuously processed as described above, no abnormal tearing of the tape occurs, and the edge of the tape in the take-up roll of the processed tape is visually observed. Although some roughness was recognized by contact, most were not cut.
[0043]
There is no adhesion of the adhesive around the recovered capacitor element, and there is no element that shows the wraparound of the deposited metal on the entire peripheral surface including the parts corresponding to the parts A and C in FIG. Neither was recognized, and a uniform zinc / tin sprayed film was formed on both end faces of each element.
[0044]
Comparative Example 1
A masking tape having a polyester nonwoven fabric layer impregnated with a 42 μm thick adhesive on one side of a polyethylene terephthalate film having a thickness of about 38 μm and a total thickness of about 80 μm (corresponding to the example of the above Japanese Patent Publication No. 5-4416) Prepared.
[0045]
This masking tape exhibited a tensile strength of 94.8 N / 15 mm width and a breaking elongation of 118.2% as measured in the same manner as in Example 1.
[0046]
Reference example 1
An adhesive layer having a thickness of about 2 μm and an EMAA resin layer having a thickness of 30 μm were formed on one side of the biaxially stretched nylon 6 film having a thickness of 25 μm used in Example 1, and the adhesive was formed on the opposite side. A masking tape 20X having basically the two-layer structure of FIG. 3 was obtained without forming a layer and a polyethylene terephthalate layer.
[0047]
This masking tape showed a tensile strength of 117 N / 15 mm width and a breaking elongation of 116% by the same measurement as in Example 1.
[0048]
Except for using this masking tape, a series of steps of holding the capacitor element, metal spraying, metal wire brushing after metal spraying and tape peeling were performed in the same manner as in Example 1. No adhesion of the adhesive was observed at all, and no element showing the wraparound of the deposited metal was observed on the entire peripheral surface including the parts corresponding to the parts A and C in FIG. In addition, a uniform zinc sprayed film was formed on both end faces.
[0049]
However, the tape break occurred in the same series of steps as in Example 1 in which a 60 m tape carrying 500 elements was continuously processed. In addition, after processing, the tape take-up roll has a cut of about 1 mm at the edge of the tape or a defect in the edge. In mass production, there is a possibility of process interruption due to abnormal tearing of the tape. It was judged that there was a problem in terms of
[0050]
Seal strength measurement example
Impulses each having a pair of masking tapes obtained in Example 1, Comparative Example 1 and Reference Example 1 are heated so that their adhesive layers are on the inside, and the tip shape is 200 mm in length and 5 mm in width. A heat sealer (“FS-215 type” manufactured by Fuji Impulse Co., Ltd.) was used for heat sealing so that the length direction was perpendicular to the longitudinal direction of the tape. For each tape pair, the applied power is constant at 15 W, and the sealing time is 0.4 seconds (65 ° C. as the ultimate temperature), 0.6 seconds (75 ° C.), 0.8 seconds (90 ° C.), 1 second (105 ), 1.2 seconds (120 ° C.), 1.4 seconds (135 ° C.), and 1.6 seconds (145 ° C.), 7 seal portions were formed at intervals of 10 mm each. Similarly, the seal strength by T-type peeling was measured for each seal location with a Tensilon tensile tester under the condition of a tensile speed of 50 mm / min.
[0051]
The measurement results are shown in the graph of FIG.
[0052]
Since the tape of Comparative Example 1 uses an adhesive layer, the change in seal strength due to the heating time is small, and when heated for more than 1.4 seconds, the seal strength is reduced. The overall seal strength is low, and it is recognized that the masking effect at part A (FIG. 2) depends on the adhesive force to the element 1.
[0053]
The tape of Reference Example 1 stably increases the seal strength up to a heating time of 1.0 seconds, but once heated beyond that, it gives an increased seal strength, but it does not cause interfacial delamination but tears the tape. is doing.
[0054]
On the other hand, the tape of Example 1 gives a sufficiently high seal strength with a relatively short heating time, and shows a generally stable increase in seal strength up to a heating time of 1.4 seconds. However, at 1.6 seconds, the tape is broken. This indicates that according to the tape of Example 1, a wider range of sealing conditions is obtained compared to the tape of Reference Example 1, and the sealing operation shown in FIG. 2 is facilitated. Further, it is recognized that the great seal strength is effective in ensuring the masking effect of the A portion in combination with the flexibility of the tape by the seal in the seal portion B.
[0055]
In the tapes of Reference Example 1 and Example 1, the heat-seal resin layer 20c of FIG. 3 or 4 is deformed at the seal portion of the film-cut sample indicated by the dotted line, and the polyamide resin layer 20a below it is bonded to each other. It is understood that this hinders tape peeling due to stable cohesive failure in the stable interface or heat seal resin layer 20c.
[0056]
【The invention's effect】
As described above, according to the present invention, a carrier tape showing excellent suitability as a metal spray masking tape in a metallized film capacitor manufacturing process is provided. The carrier tape is also effectively used as a carrier tape for various parts suitable for various treatments after temporarily supporting electrical parts and the like.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of a masking process of a capacitor element using a conventional masking tape.
FIG. 2 is an explanatory view of a capacitor element masking step using the carrier tape (masking tape) of the present invention.
3 is a cross-sectional view in the thickness direction of the carrier tape of Reference Example 1. FIG.
FIG. 4 is a sectional view in the thickness direction of an example of the carrier tape of the present invention.
FIG. 5 is a partially cutaway perspective view of the carrier tape.
FIG. 6 is a sectional view in the thickness direction of a carrier tape of the present invention in a state where a capacitor element is sealed and held.
FIG. 7 is a partial plan view showing another use mode of the carrier tape of the present invention.
FIG. 8 is a partial side view showing still another usage mode of the carrier tape of the present invention.
FIG. 9 is a graph showing the results of test for measuring the sealing strength of masking tapes of Examples, Comparative Examples, and Reference Examples.
[Explanation of symbols]
1: Capacitor element
2: Conventional masking tape
3: Crimp member
4: Air gap
5: Thermal spray metal layer
6: Lead wire
7: Dissolving resin bath
20, 20A, 20B: Masking tape of the present invention (carrier tape)
20X: Masking tape of reference example
20a: polyamide resin core layer
20b: heat sealing resin layer
20c: heat resistant resin layer
A, B, C: Reference numerals indicating the portions of the masking tape that hold the capacitor element in a sealed manner
W: Width of flat cylindrical capacitor element
S: Seal width

Claims (2)

Used in a manner in which metal spraying is performed on the exposed end surfaces of a plurality of metallized film capacitor elements arranged and sealed between the heat seal resin layers of a pair of carrier tapes each having a heat seal resin layer. each of the tape, the polyamide resin core layer, carrier having a heat-resistant resin layer having a half or less of the thickness of the thickness of the polyamide resin core layer, the pinching and comprising structure and heat sealing resin layer tape.   The carrier tape according to claim 1, wherein the heat resistant resin is polyester.

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