JP4483137B2 - Hot melt adhesive sheet structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a hot melt adhesive sheet structure in which whether or not a hot melt adhesive is melted can be confirmed by a metal detection means such as a metal detector.
[0002]
[Prior art]
Conventionally, nails, staples, screws, etc. have been used as means for fixing interior materials such as plasterboards to adherends such as pillars, but in the case of construction methods for fixing interior materials using these members Because the surface of the interior material was damaged, post-treatment such as filling the putty after construction was necessary. Therefore, a bonding material (Japanese Patent Application No. 2000-202645) by the present applicant has been proposed as a method of fixing the interior material to the adherend without damaging it. This bonding material forms a hot melt adhesive layer on both sides of the metal plate, and this bonding material is sandwiched between the adherend (column) and the interior material (gypsum board), and is then removed from the surface of the gypsum board with an induction heater. The gypsum board is fixed to the pillar by heating to melt the hot melt adhesive. In this method using this bonding material, the time for heating with an induction heater (electromagnetic induction device) is set in advance in consideration of the material and thickness of the member fixed to the adherend, and after the set time has elapsed The hot melt adhesive is cooled by turning off the induction heater while pressed, and the gypsum board is fixed to the pillar.
[0003]
[Problems to be solved by the invention]
However, in the above construction method, the melting of the hot melt adhesive is performed on the back side of the board where the visual check cannot be performed. Therefore, even if the induction heater is operated for a set time from the ambient temperature during construction, the temperature of the material, etc. There was a problem that it was not possible to confirm whether the agent was melted reliably.
[0004]
It is an object of the present invention to provide a hot melt adhesive sheet structure that solves the above problems and can determine whether or not the hot melt adhesive is melted by a metal detecting means.
[0005]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the hot melt adhesive sheet structure according to the invention of claim 1 configures a support body by laminating a plurality of metal thin film sheets in parallel and so that adjacent edges do not contact each other, The hot melt adhesive sheet is formed by applying a hot melt adhesive from both sides of the support so that a hot melt adhesive is interposed in the overlapping portion and a plurality of metal thin film sheets are insulated. When the agent is melted, the hot melt adhesive between the polymerized portions is removed, and the adjacent metal thin film sheets are brought into contact with each other.
[0006]
In the hot melt adhesive sheet structure according to the second aspect of the present invention, a plurality of metal thin film sheets are juxtaposed with each other at a predetermined interval, and at least two upper and lower portions are coupled by a conductive coupling member to constitute a support. Then, a hot melt adhesive is applied from both sides of the support to form a hot melt adhesive sheet, and when the hot melt adhesive is melted, the one binding member is melted and torn. The metal thin film sheet is formed of a heat melting metal having a melting point lower than that of the metal thin film sheet.
[0007]
In the hot melt adhesive sheet structure according to the invention of claim 3, a hot melt adhesive sheet is formed by applying a hot melt adhesive from both sides of the metal thin film sheet, and a linear shape is formed at the center of the metal thin film sheet. Alternatively, a strip-shaped cut portion is formed, and uncut portions are provided above and below the cut portion, and when the hot melt adhesive is melted, the uncut portion is melted. To do.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows an example of a hot-melt adhesive sheet to which a hot-melt adhesive sheet structure is applied. This hot-melt adhesive sheet A includes two metal thin-film sheets 1 and 2 juxtaposed and adjacent edges 1a and 2a. The support 3 is configured in a state of being overlapped so as not to come into contact, and the hot melt adhesive 4 is applied from both sides of the support 3, and the gap between the overlapping portions of the edge 1a and the edge 2a is formed. Also, the two metal thin film sheets 1 and 2 are insulated by interposing a hot melt adhesive 4 (see FIG. 2A).
[0009]
The metal thin film sheets 1 and 2 may be any conductive material such as aluminum foil.
[0010]
The support 3 is heated by electromagnetic induction while pressing the hot melt adhesive sheet with an induction heater. When the temperature of the support 3 rises, the hot melt adhesive 4 is melted, and the two metal thin film sheets 1 and 2 are heated. The hot melt adhesive 4 in the overlapped portion a is removed so that the two metal thin film sheets 1 and 2 are in contact with each other (see FIG. 2B).
[0011]
When using this hot melt adhesive sheet to fix an interior material such as gypsum board to an adherend such as a pillar, as shown in FIG. 3, a double-sided tape 5 is previously applied to the surface and the release paper is peeled off. By doing so, it may be temporarily fixed to the adherend. Then, as shown in FIG. 4, the gypsum board 7 is positioned and pressed at a predetermined position of the pillar from the top of the hot melt adhesive sheet A that has been adhered to the pillar 6 that is the adherend with the double-sided tape 5.
[0012]
Next, an adhesive tool (induction heater) 8 is pressed against the surface of the gypsum board 5 to heat the support 1 by electromagnetic induction, and the hot support 1 is used to heat the hot melt adhesive. The gypsum board 5 can be fixed to the column 4 by melting 2 and cooling the melted hot melt adhesive 2.
[0013]
Incidentally, in order to confirm whether or not the hot melt adhesive 2 has melted reliably, the adhesive tool 8 includes an induction heating coil 10 in addition to the induction heating coil 10 inside the housing 9 as shown in FIG. The metal detection means 11 arranged at the center of the coil 10 is used to detect the presence or absence of metal from the change in the frequency of the metal detection means 11 and to determine the change in the metal area. That's fine.
[0014]
The metal detecting means 11 is composed of a known resonance circuit composed of a sensor coil and a capacitor. When the sensor coil approaches the metal, the presence / absence of the metal is contacted by utilizing the change in the resonance frequency due to the change in inductance. It can be detected by using a metal detector or the like. According to this metal detecting means 11, the resonance frequency changes depending on the area of the metal. Therefore, if the two metal thin film sheets 1 and 2 are in a non-contact state, the resonance frequency becomes high, and the two metal thin films If the sheets 1 and 2 are in contact with each other, the area is large and the resonance frequency is low. Therefore, whether or not two metal thin film sheets are in contact with each other is determined by detecting a change in the resonance frequency. It can be determined that the hot melt adhesive 4 has melted by changing the resonance frequency from a high state to a low state.
[0015]
FIGS. 6 (a) and 7 (a) show another example of a hot-melt adhesive sheet. This sheet has two metal thin-film sheets 15 and 16 juxtaposed at a predetermined interval and is vertically Two portions are connected by conductive connecting members 17 and 18, and one connecting member 18 is formed of a hot-melt metal having a melting point lower than the melting point of the metal thin film sheets 15 and 16. The thin film sheets 15 and 16 and the coupling members 17 and 18 constitute a support 19, and the hot melt adhesive 4 is applied to both surfaces of the support 19.
[0016]
In the hot melt adhesive sheet having the above-described configuration, the hot melt adhesive 4 is indirectly melted by pressing the above-described induction heater to heat the support 11 by electromagnetic induction, and the melted hot melt adhesive 4 is cooled. By doing so, the adherend (interior material such as gypsum board) can be fixed to the adherend (column).
[0017]
When the support 19 is heated by an induction heater, when the support 19 rises to a certain temperature, one bonding member 18 made of a heat-melting metal melts to bond the two metal thin film sheets 15 and 16. When one of the members 17 and 18 is fused (see FIGS. 6B and 7B), a pseudo capacitor is formed by the two metal thin film sheets 15 and 16 to form a resonance circuit. Accordingly, the resonance frequency can be detected by the metal detecting means, and it can be determined that the hot melt adhesive has melted.
[0018]
In addition, as long as it has electroconductivity as a heat-meltable metal and it has heat-meltability lower than melting | fusing point of a metal thin film sheet, for example, a solder with a melting start temperature of 182 ° C. may be used.
[0019]
FIG. 8A shows still another example of the hot-melt adhesive sheet. This sheet forms a linear or strip-shaped cut portion 21 at the center of the metal thin film sheet 20, and The support 24 is configured such that left and right uncut portions 22 and 23 are provided, and the width X of one uncut portion (hereinafter referred to as a fuse portion) 22 is smaller than the width Y of the other uncut portion 23. The hot melt adhesive 4 is applied from both sides of the support 24.
[0020]
When the thin film sheet 20 is heated by an induction heater, an eddy current a is generated around the cut portion 21 in the thin film sheet 20 as shown in FIG. Since the density of the eddy current a becomes maximum in the fuse portion 22, the temperature of the fuse portion 22 becomes higher than that of other portions, and eventually blows.
[0021]
When the fuse portion 22 is blown, the flow of eddy current is divided, and as shown in FIG. 8C, the eddy current b flows in a narrower range than before the blow. As a result, the maximum temperature reached by the thin film sheet 20 by induction heating is lowered, and the possibility of ignition can be reduced.
[0022]
In addition, the cut portion may be formed on the thin film sheet before the hot melt adhesive is applied, or after the hot melt adhesive is applied, the cut portion is formed on the hot melt adhesive. May be.
[0023]
Further, as shown in FIG. 9, the uncut portions 22 and 23 of the support 24 have the same upper and lower lengths X and Y in order to make the eddy current uniform, and the eddy current high-density fuse. It is good also considering a part as two places up and down.
[0024]
By making the lengths of the uncut portions 22 and 23 the same, when the two fuse portions are fused at the same time, or depending on various conditions such as the position of the coil, the upper and lower two fuse portions are almost the same Although the temperature is higher than that of the portion, if the temperatures at the two locations are also slightly different, the two fuse portions are blown out from one higher temperature portion.
[0025]
Further, by using the above-described bonding tool, the presence or absence of fusing of the fuse portion can be monitored by the metal detecting means 11 and the melting of the hot melt adhesive 4 can be confirmed.
[0026]
According to the hot-melt adhesive sheet structure described above, the inside of the hot-melt adhesive sheet is an adhesive tool in which an induction heater and a metal detection means as shown in FIG. It is possible to determine whether or not the hot melt adhesive 4 has melted by monitoring the change in the resonance frequency with the metal detecting means 11 while heating the support disposed in the induction heating machine.
[0027]
【The invention's effect】
According to the present invention, whether or not the hot melt adhesive is melted by monitoring the change in frequency with the metal detecting means while heating the metal support disposed inside the hot melt adhesive sheet with an induction heater. Therefore, even if it is in a state where it cannot be visually confirmed, the bonding work with the hot melt adhesive can be reliably performed.
[Brief description of the drawings]
FIG. 1 is a plan view showing an example of a hot-melt adhesive sheet according to the present invention. FIGS. 2 (a) and 2 (b) are views of the hot-melt adhesive sheet for explaining states before and after melting of the hot-melt adhesive. FIG. 3 is a plan view of a hot-melt adhesive sheet showing a state in which a double-sided tape for temporary fixing is attached. FIG. 4 is a perspective view illustrating a use mode of the hot-melt adhesive sheet. Explanatory drawing which shows an example of the adhesion tool provided with the metal detection means which confirms fusion | melting of FIG. 6 (a) and (b) are the top views which show the other example of a hot-melt-adhesive sheet, and the support body after a heating FIGS. 7A and 7B are cross-sectional views of the hot-melt adhesive sheet in the above-described other examples illustrating the states before and after the hot-melt adhesive is melted. FIGS. ) (B) (c) is hot melt adhesive Plan view showing still another example of preparative 9 (a) (b) a plan view showing another example of the hot-melt adhesive sheet [EXPLANATION OF SYMBOLS]
DESCRIPTION OF SYMBOLS 1, 2 Metal thin film sheet 3 Support body 4 Hot melt adhesives 15 and 16 Metal thin film sheet 17 and 18 Connecting member 19 Support body 20 Metal thin film sheet 21 Notch parts 22 and 23 Uncut part

Claims (3)

A plurality of metal thin film sheets are juxtaposed to form a support so that adjacent edges do not come into contact with each other, and a hot melt adhesive is interposed in the overlapping portion to insulate the plurality of metal thin film sheets. The hot melt adhesive is applied from both sides of the support so as to form a hot melt adhesive sheet, and when the hot melt adhesive is melted, the hot melt adhesive between the polymerized portions is discarded and adjacent metal A hot melt adhesive sheet structure characterized in that the thin film sheets are in contact with each other. A plurality of metal thin film sheets are juxtaposed at a predetermined interval, and at least two upper and lower portions are bonded with a conductive bonding member to form a support, and a hot melt adhesive is applied from both sides of the support. A hot melt adhesive sheet having a melting point lower than the melting point of the metal thin film sheet is formed so that when the hot melt adhesive sheet is formed and the hot melt adhesive is melted, the one bond member is melt-ruptured. A hot-melt adhesive sheet structure formed by A hot melt adhesive sheet is formed by applying a hot melt adhesive from both sides of the metal thin film sheet, and a linear or strip-shaped cut portion is formed at the center of the metal thin film sheet, and the cut portion The hot melt adhesive sheet structure is characterized in that uncut portions are provided on the upper and lower sides of the sheet, and the uncut portions are melted when the hot melt adhesive is melted.

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