JP2002235421A - Building material and hot melt bonding construction method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hot melt bonding construction method of a building material that can efficiently bond the building material such as a tile to an object face using a hot melt resin tape. SOLUTION: The tile 3 is bonded to the front face of a panel 1 through the hot melt resin tape 2 using a high-frequency induction heating device. An adhesive 5 is stuck to a plurality of parts of the back face of the hot melt resin tape 2, and the tape 2 is previously stuck to the panel 1 by the adhesive 5 to temporarily fix the tape 2. The tile 3 is put to the panel 1, and the tile 3 is supported with one hand, while a grip 4b of the high-frequency induction heating device 4 is gripped with the other hand H to press an induction coil part 4a of the high-frequency induction heating device 4 to the front face of the tile 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hot-melt bonding method for building materials (preferably inorganic building materials) such as tiles, and more particularly to a hot-melt bonding method for building materials improved to improve construction efficiency.

[0002]

2. Description of the Related Art When a building material such as a tile is stuck to a target surface such as a panel, a hot melt resin tape is interposed between the building material and the target surface, and the resin tape is heated and melted by a high frequency induction heating device. There is a method of bonding building materials to the target surface.

[0003]

When a building material such as a tile is stuck by the above-mentioned conventional hot melt bonding method, a high frequency induction heating apparatus is provided with one hand while holding a resin tape and a building material with the other hand. The operation was troublesome.

The conventional hot melt resin tape is
Each time it is used, it is cut into a suitable length and used.
The work was complicated, and sometimes the tape was cut longer than necessary.

An object of the present invention is to solve such problems and to provide a hot-melt bonding method for building materials that can efficiently bond building materials such as tiles to a target surface using a hot-melt resin tape. I do.

[0006]

The hot melt bonding method of a building material according to the present invention is a hot melt bonding method of bonding a building material to a target surface with a hot melt resin tape. Temporarily attaching the building material to the target surface via the hot melt resin tape, and then heating and melting the tape with a high frequency induction heating device to adhere the building material to the target surface. It is.

According to the hot-melt bonding method for building materials, since the hot-melt resin tape is temporarily fixed to the building material or the target surface, it is necessary to support only the building material with one hand and operate the high-frequency induction heating apparatus with the other hand. As a result, work efficiency is significantly improved.

As one method of temporarily fixing the hot melt resin tape, a method of mechanically temporarily fixing with a thumbtack or a tucker is exemplified. In this case, after fixing one half of the hot-melt resin tape to the target surface with a thumbtack or a tucker, the other half of the tape is turned over to cover the half-thumbtack or the tucker, and then a building material is applied to the tape. Is preferred.

It is preferable that the thumbtack is induction-heated by a high-frequency induction heating device.

As another method of temporarily fixing, a method using an adhesive is exemplified. For example, a pressure-sensitive adhesive layer is provided on a part of the hot-melt resin tape, and the hot-melt resin tape is temporarily fixed to the back surface of the building material or the target surface by the pressure-sensitive adhesive layer.

In this case, an adhesive layer is provided on the hot melt resin tape in advance, and the adhesive layer is covered with a release sheet, and when used for temporary fixing, the adhesive sheet is peeled off and the tape is used as a building material or an object. It is convenient to temporarily attach to the surface.

In the present invention, it is preferable that the resin tape has a predetermined size in advance. This prevents waste of the tape.

In the construction material of the present invention (claim 6), the hot melt resin tape is partially welded in advance to the back surface of the construction material. This building material is suitable for use in the above method.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view showing a hot-melt bonding method for building materials according to an embodiment, FIG. 2 is a perspective view of the back surface of a hot-melt resin tape, and FIG. 3 is III in FIG.
It is sectional drawing which follows the III line.

As shown in FIG. 1, a tile 3 is bonded to a front surface of a panel 1 as a target surface via a hot melt resin tape 2 using a high frequency induction heating device 4.

Adhesives 5 are adhered to the back surface of the hot melt resin tape 2 at a plurality of places, and the adhesives 5 are used to temporarily adhere the tape 2 to the panel 1 in advance and temporarily fix it.

After that, the tile 3 is brought into contact with the panel 1, the tile 3 is supported by one hand (not shown), and the grip 4 b of the high-frequency induction heating device 4 is gripped by the other hand H. The induction coil unit 4 a of the device 4 is pressed against the front surface of the tile 3.

The hot melt resin tape 2 has a thermoplastic resin layer 2b provided on both sides of a metal foil 2a of aluminum or the like, and an induction current flows through the metal foil 2a by the high-frequency magnetic field lines from the induction coil portion 4a. The metal foil 2a generates heat due to Joule heat. This heat causes the thermoplastic resin layer 2b to melt. When the high-frequency induction heating device 4 is separated from the tile 3 or the energization of the coil portion 4a is stopped, the resin layer 2b cools and hardens, and the tile 3 is bonded to the panel 1.

The number and location of the pressure-sensitive adhesives 5, or the size of one pressure-sensitive adhesive, are not limited to those shown in the drawings. The adhesive 5 may be covered with a release paper, and the release paper may be peeled off at the time of use.

FIG. 4 is a perspective view of the back surface of the tape 2 used in the hot melt bonding method for building materials according to another embodiment. An adhesive 6 is attached in a belt shape along the upper side of the tape 2. As shown in FIG. 5, a plurality of the tapes 2 are arranged in a line, and the adhesive 6 of each tape 2 is adhered to a common release paper 7. When using tape 2,
The tape 2 is peeled off from the release paper 7 one by one, attached to the panel 1, and the building material is adhered by a high frequency induction heating device.

FIG. 6 (a) is a perspective view showing a different embodiment of the present invention, and FIG. 6 (b) is a longitudinal sectional view of the same.

In this embodiment, the tape 2 is temporarily fastened to the panel 1 by the thumbtack 8 and the building material is bonded by a high-frequency induction heating device. After the lower half of the tape 2 is fastened to the panel 1 with the thumbtack 8, the tape 2 is folded back so that the upper half covers the head of the thumbtack 8 as shown in FIG. Thereafter, the building material is bonded to the panel 1 by a high-frequency induction heating device. In this case, since the thumbtack 8 is induction-heated by the high-frequency induction heating device, the tape 2 may be made of only the thermoplastic resin layer 2b without the metal layer 2a. In addition, a sheet-shaped tape larger than that shown in FIG. 6 may be used, and the sheet-shaped tape may be temporarily fastened with a plurality of pushpins.

Instead of the thumbtack, the tape may be temporarily fastened to the panel by a tucker.

When it is necessary to peel off the building material after the building material is adhered to a target surface such as a panel by the method of the present invention, a high-frequency induction heating device is applied to or brought close to the front surface of the building material, and the tape 2 is heated and melted. Can be peeled off.

In the present invention, as shown in FIGS. 7 and 8, hot melt resin tapes 11 and 13 (having the structure shown in FIG. 3) are partially welded to the back surface of the tile 10 in advance in a tile manufacturing factory or the like. It may be allowed to adhere by making it adhere. In FIG. 7, the hot melt resin tape 11 is provided at the four corners on the back surface of the tile 10, and in FIG. 8, the belt-like hot melt resin tape 13 is provided along the upper side of the tile 10. The shape, arrangement position and number of tapes are not limited to these. It is preferable that the hot melt resin tapes 11 and 13 are partially melted and adhered to the tile 10 by approaching or applying a high-temperature body such as a soldering iron. Numerals 12 and 14 in FIGS. 7 and 8 indicate portions that have adhered to the tile 10 due to this melting. It is preferable that a high-temperature body such as a soldering iron is coated with a fluororesin so that the high-temperature body does not stick to the hot-melt resin tape even when it comes into contact with the hot-melt resin tape.

This hot melt resin tape 11 or 13
The attached tile 10 can be applied to the construction target surface and bonded using a high-frequency induction heating device.

In the present invention, the construction target surface may be a wall surface, a floor surface, or a plate material for display. Further, the present invention can be applied to a case where a tile is provided on a substrate in a tile panel manufacturing process.

[0028]

As described above, according to the present invention, the bonding work efficiency of building materials is remarkably improved. Further, by previously setting the tape to a predetermined size, waste of the tape can be prevented.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a hot-melt bonding method for building materials according to an embodiment.

FIG. 2 is a perspective view of the back surface of the hot melt resin tape.

FIG. 3 is a sectional view taken along line III-III in FIG. 2;

FIG. 4 is a perspective view of a tape used in another embodiment.

FIG. 5 is a perspective view of an assembly of the tapes of FIG. 4;

FIG. 6 is a perspective view and a cross-sectional view of a tape used in different embodiments.

FIG. 7A is a rear view of the tile according to the embodiment,
FIG. 2B is a cross-sectional view taken along line BB of FIG.

FIG. 8A is a rear view of the tile according to the embodiment,
FIG. 2B is a cross-sectional view taken along line BB of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Panel 2, 11, 13 Hot melt resin tape 3, 10 Tile 4 High frequency induction heating device 4a Coil part 4b Grip part 5, 6 Adhesive 7 Release paper 8 Thumbtack

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) E04F 21/18 E04F 21/18 HF term (Reference) 2E110 AA42 AB04 BA12 DA12 DC17 DC21 DC36 GA03Z 4J004 AB01 AB03 BA08 CA08 CC02 DB02 EA05 FA08 4J040 DN071 EL051 JB01 JB09 NA12 PA23 PA31

Claims (6)

[Claims] 1. A hot-melt bonding method for bonding a building material to a target surface with a hot-melt resin tape, wherein the hot-melt resin tape is temporarily fixed to a back surface of the building material or the target surface, and the hot-melt resin tape is interposed therebetween. A hot-melt bonding method for a building material, wherein the tape is heated and melted by a high-frequency induction heating device to adhere the building material to the target surface after the building material is applied to the target surface. 2. The hot melt bonding method for building materials according to claim 1, wherein the hot melt resin tape is temporarily fixed to the target surface with a thumbtack or a tucker. 3. The method according to claim 2, wherein one half of the hot melt resin tape is fixed to a target surface with a thumbtack or a tucker, and then the other half of the tape is turned over to cover the one half of the thumbtack or the tucker. A hot melt bonding method for building materials, wherein a building material is applied to the tape. 4. The hot melt bonding method for a building material according to claim 1, wherein a part of the hot melt resin tape is temporarily fixed to a back surface of the building material or a building material via an adhesive layer. 5. The hot melt resin tape according to claim 4, wherein the adhesive layer is provided on a part of the hot melt resin tape, and the adhesive layer is covered with a release sheet. Alternatively, a hot-melt bonding method for a building material, wherein the release sheet is peeled when the tacking is temporarily performed on a target surface. 6. A building material in which a hot-melt resin tape is partially adhered to the back surface by welding.