JP4472562B2 - Printed circuit board design method, printed circuit board design system, program, and computer-readable recording medium - Google Patents

Description

  The present invention relates to a printed circuit board design method, a printed circuit board design system, a program, and a computer-readable recording medium, and more specifically, when performing verification work before performing detailed design of a printed circuit board in a CAD system, etc. The present invention relates to a printed circuit board design method, a printed circuit board design system, a program, and a computer-readable recording medium suitable for use in the present invention.

  Conventionally, a plurality of printed circuit boards have been incorporated in electrical equipment products. When designing a plurality of printed circuit boards, generally, each of the plurality of printed circuit boards is independent and independent. It was handled as a design.

  On the other hand, in recent years, there has been an actual situation that the structure of the printed circuit board incorporated in the electrical equipment product and the combination of various printed circuit boards have become complicated due to the high functionality and miniaturization of the electrical equipment product.

  Against the backdrop of the complexity of the printed circuit board structure and the combination of various printed circuit boards built into such electrical equipment products, before designing the printed circuit board in detail, a housing that accommodates multiple printed circuit boards The work of determining the specifications of a printed circuit board in consideration of the relationship between the printed circuit boards to be combined has been performed, and the importance of such work has been increasing day by day.

  By the way, designers of electrical equipment products are currently required to determine the specifications of a printed circuit board in consideration of the case in which a plurality of printed circuit boards are accommodated and the relationship between the combined printed circuit boards. I do it using the ones listed above or rely on my own memory.

  In other words, in the conventional design process, when performing the above-described work, there is no mechanism for excluding multiple registration of information or a mechanism for expressing quantitative information, so there is a lack of multiple registration of information and lack of quantitative information. There has been a problem that it may cause a design error.

  Further, in the conventional design process, when designing with consideration of a plurality of printed boards, the board outline information indicating the outline of the printed board is matched with the information of the casing in which the printed board is accommodated to match the printed board. The specifications were verified and finally the printed circuit board specifications were finalized.

  However, with these conventional methods, it is possible to verify the collision between the printed circuit board and the housing, but it is not possible to perform verification in consideration of connection information and layer information necessary for actual electrical design. Therefore, there is a problem that the design may be adversely affected.

  The prior art that the applicant of the present application knows at the time of filing a patent is as described above and is not an invention related to a known literature, so there is no prior art information to be described.

  The present invention has been made in view of the various problems of the conventional techniques as described above, and the object of the present invention is to cause a design error due to multiple registration of information and lack of quantitative information. In addition to being able to eliminate the fear of causing design problems, it is possible to perform verification in consideration of connection information and layer information necessary for actual electrical design, and to eliminate the possibility of causing adverse effects on the design. A printed circuit board design method, a printed circuit board design system, a program, and a computer-readable recording medium are provided.

  In order to achieve the above-described object, the present invention provides a printed circuit board specification setting, connection information setting, physical interference information setting between printed circuit boards, or a printed circuit board and a housing in which the printed circuit board is accommodated. It is possible to set physical interference information.

  According to the present invention described above, since it becomes possible to quantify and verify the trade-off when examining each other's specifications at the time of housing design and electrical design, it is originally noticed before the detailed design. Design errors that should have been found can be found and corrected efficiently. For this reason, the occurrence of such design mistakes during detailed design or prototyping is reduced, and the design can be performed efficiently.

  Therefore, by using the present invention, it is possible to efficiently perform from board specification examination to board design, which exists as a pre-operation for designing a printed board in detail.

That is, the invention described in claim 1 of the present invention includes a board structure setting means, a first connection information setting means, a second connection information setting means, a board outer shape setting means, and a display means. the printed circuit board design system having, a printed circuit board design method for performing PCB design, the substrate structure setting means, the layer structure of each printed circuit board constituting a plurality of printed circuit boards, board materials, wire A first step of setting a board structure including specifications, and a first connection information setting means for setting connection information by a net between components mounted on the respective printed boards constituting the plurality of printed boards . and second step, the second connection information setting means, and a third step of setting the connection information according to the net of the respective printed circuit boards that constitute the plurality of printed circuit boards, the board outline Factory reset means, a fourth step of setting the external shape of the printed circuit board constituting the plurality of printed circuit boards, is the display means, the first step, the second step, the third step and have a fifth step of displaying visualized with integrating information set in the fourth step, the user of the printed circuit board design based on the information displayed by the fifth step Is something like that.

The invention according to claim 2 of the present invention is the invention according to claim 1 of the present invention, wherein the first step, the second step, the third step, and the fourth step after performing at least one of process of the process, the fifth step can be undertaken on a printed circuit board design performed at any time, the first step, the second step, the third The printed circuit board is designed while adding and correcting the information set in the process and the fourth process .

According to a third aspect of the present invention , in the first aspect of the present invention , the single printed circuit board is used in the first step. A layer structure is set for each of a plurality of regions.

According to a fourth aspect of the present invention, the substrate structure setting means, the first connection information setting means, the second connection information setting means, the substrate outer shape setting means, the input means, A printed circuit board design method for designing a printed circuit board by means of a printed circuit board design system having a display means, wherein the substrate structure setting means includes a layer structure of each printed circuit board constituting a plurality of printed circuit boards, The first step of setting the board structure including the board material and the wiring specification, and the first connection information setting means, the connection information by the net between the components mounted on each printed board constituting the plurality of printed boards A second step of setting the second connection information, and a second step of setting connection information by the net between the printed circuit boards constituting the plurality of printed circuit boards, Serial board outline shape setting means, a fourth step of setting the external shape of the printed circuit board constituting the plurality of printed circuit boards, said input means, about the shape of the housing in which the plurality of printed circuit boards are accommodated The fifth step of inputting information, and the display means displays the information set in the first step, the second step, the third step, the fourth step, and the fifth step. have a a sixth step of displaying visualized with integration, is obtained based on the information displayed by the sixth step in which the user performs the printed circuit board design.

Further, the invention according to claim 5 of the present invention is an invention for designing a printed circuit board, in which a printed circuit board structure including a layer structure of each printed circuit board , a substrate material, and wiring specifications is provided. A board structure setting means for setting, a first connection information setting means for setting connection information by a net between components mounted on each printed circuit board constituting the plurality of printed circuit boards, and the plurality of printed circuit boards. Second connection information setting means for setting connection information by the net between each printed circuit board, substrate outer shape setting means for setting the outer shape of each printed circuit board constituting the plurality of boards , the substrate structure setting means, Integration and visualization of information set in the first connection information setting means, the second connection information setting means, and the board outer shape setting means It has a display means for displaying Te, in which the user based on the information displayed and to perform PCB design by the display means.

According to a sixth aspect of the present invention, in the fifth aspect of the present invention, the substrate structure setting means, the first connection information setting means, and the second connection information setting. After setting by at least one of the setting means and the board outer shape setting means , the information set by the display means is integrated and visualized and displayed to start designing the printed circuit board. The printed circuit board can be designed while adding or correcting the information set by the board structure setting means, the first connection information setting means, the second connection information setting means, and the board outer shape setting means. Is to do.

According to a seventh aspect of the present invention , in the invention according to the fifth or sixth aspect of the present invention, the substrate structure setting means is provided for each of a plurality of regions in a single printed circuit board. The layer structure is set in

In the printed circuit board design system for designing a printed circuit board , the invention according to claim 8 includes the layer structure, the substrate material, and the wiring specification of each printed circuit board constituting the plurality of printed circuit boards. Board structure setting means for setting a board structure including the first connection information setting means for setting connection information by a net between components mounted on each printed board constituting the plurality of printed boards, and the plurality of prints A second connection information setting means for setting connection information between the printed circuit boards constituting the circuit board via a net; a board outer shape setting means for setting the outer shape of each printed circuit board constituting the plurality of boards; input means for the printed circuit board to enter information about the shape of the housing to be accommodated in, the substrate structure setting means, the first connection information setting means, the upper As well as integrate the information inputted by the second connection information setting means and the substrate outer shape setting means and the setting information and said input means in have a display means for showing visualized images, displayed by the display means The user designs the printed circuit board based on the information obtained .

Further, the invention according to claim 9 of the present invention is the computer-aided design method according to any one of claims 1, 2, 3, or 4 of the present invention. This is a program for execution.

The invention according to claim 10 of the present invention is a computer as a printed circuit board design system according to any one of claims 5, 6, 7, or 8 of the present invention. It is a program for making it function.

In addition, the invention described in claim 11 among the present invention is a computer-readable recording medium in which the program described in any one of claims 9 or 10 is recorded.

  Since the present invention is configured as described above, it is possible to eliminate the possibility of causing design errors due to multiple registration of information and lack of quantitative information, and in actual electrical design. It is possible to perform verification in consideration of necessary connection information and layer information, and it is possible to eliminate the possibility of causing adverse effects on the design.

  Hereinafter, an example of an embodiment of a printed circuit board design method, a printed circuit board design system, a program, and a computer-readable recording medium according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a block diagram showing a system configuration of an example of an embodiment of a printed circuit board design system according to the present invention.

  That is, the printed circuit board design system according to the present invention is configured to control the entire operation using a central processing unit (CPU) 10.

  The CPU 10 has a random access via the bus 12 including a read-only memory (ROM) for storing a program for controlling the CPU 10 and various information described later, a storage area used as a working area for the CPU 10, and the like. An internal storage device 14 composed of a memory (RAM), a display device 16 having a screen such as a CRT or a liquid crystal panel for performing various displays based on the control of the CPU 10, and an arbitrary on the screen of the display device 16 A pointing device 18 such as a mouse for designating a position, a character input device 20 such as a keyboard for inputting an arbitrary character, and various information can be stored under the control of the CPU 10, and various stored information is read out. Hard disk that can be transferred to the internal storage device 14 And an external storage device 22 is connected.

  Here, as described above, the external storage device 22 stores various types of information, but as information related to the implementation of the present invention, the outer shape of the substrate that can be used in a known printed circuit board CAD system. Circuit board shape data, design rule data including design rules (topology) for designing a printed circuit board that can be used in a known printed circuit board CAD system, and information on printed circuit boards that can be used in a known printed circuit board CAD system. Stores layout design data as design data.

  In the printed circuit board design system according to the present invention, a user who is a designer who performs board design work inputs input instructions such as the pointing device 18 and the character input device 20 to input a desired instruction. The display on the display device 16 changes according to the operation of the pointing device 18 and the character input device 20 by the user.

  In the above configuration, the contents of processing executed by the printed circuit board design system according to the present invention will be described with reference to FIGS. FIG. 2 is an explanatory diagram schematically showing information input to the board database and information output from the board database. FIG. 3 shows processing of the printed circuit board design system according to the present invention. FIG. 2 is an explanatory diagram schematically showing the relationship between the design and the detailed design of the printed circuit board.

Here, the outline of the process of the printed circuit board design system according to the present invention will be described. In the printed circuit board design system according to the present invention, four settings described in detail below, that is,
(1) Single substrate structure setting,
(2) Setting of connection information via the net between components on the board,
(3) Setting of connection information via a net between single boards
(4) Setting of board outline information
Is possible. Information corresponding to each of the four settings (1), (2), (3), and (4) is input to the substrate database 200 (see FIG. 2), and the above (1), (2), (3) ( The four settings of 4) are reflected in the detailed design of the printed circuit board.

  Hereinafter, each of the four settings (1), (2), (3), and (4) will be sequentially described in detail.

(1) Setting of single substrate structure (see S1 in FIG. 3)
When setting the single substrate structure, the user operates an input device such as the pointing device 18 or the character input device 20 to display the layer structure setting screen 60 (see FIG. 4) on the screen of the display device 16. The layer structure setting screen 60 is a screen for setting the substrate structure for each single printed circuit board among a plurality of printed circuit boards accommodated in the casing of the electrical equipment product. The information defined as the single substrate structure here includes layer structure / substrate material / wiring specification.

  More specifically, the layer structure setting screen 60 displays a board name field 60a for displaying the name of a single printed circuit board that is a target for setting the board structure, a material field 60b for displaying a material, and wiring for displaying wiring specifications. A specification column 60c, an in-board net column 60d for displaying a circuit net in the printed circuit board, a simple 3D display column 60e for simply displaying the layer structure of the printed circuit board in 3D, an OK column 60f, and a cancellation column 60g. Is.

  Then, the user operates an input device such as the pointing device 18 or the character input device 20 to print on the board name field 60a of the layer structure setting screen 60 displayed on the display device 16, for example, as shown in FIG. The board name “Kiban_b” is displayed, the name “FR-4” indicating the material of the printed board having the name “Kiban_b” is displayed in the material field 60b, and the printed board having the name “Kiban_b” is displayed in the wiring specification field 60c. The name “Rule_A” indicating the wiring specification is displayed.

  In addition, the user operates the input device such as the pointing device 18 or the character input device 20 to stack the rectangular parallelepiped corresponding to the layer structure of the printed circuit board in the simplified 3D display field 60e, thereby simplifying the layer structure of the printed circuit board. 3D display is possible, and layers can be set for each area of the printed circuit board. In other words, the number of layers per arbitrary area in one printed circuit board as well as the printed circuit board having the same layer structure of one substrate in which the entire printed circuit board has the same layer structure in a single region. It is also possible to deal with printed circuit boards having different single-layer / multi-region different layer structures.

  For example, when the single printed board having the name “Kiban_b” displayed in the board name column 60a of the layer structure setting screen 60 is specifically the rigid / flexible mixed board 100 shown in FIG. The flexible mixed substrate 100 is a substrate in which hard substrates 101, 102, 103, 104, 105, 106, and 107 are laminated at a plurality of locations based on a flexible substrate 108 that can be bent.

  More specifically, the rigid-flex mixed substrate 100 has a layer structure in which hard substrates 101, 102, 103, and 104 having the same outer shape are laminated together with a part of the flexible substrate 108, and the number of layers is five. The region 100a, the hard substrate 105, 106, 107 having the same outer shape, are laminated together with a part of the flexible substrate 108, and has a layer structure of four layers, the region 100a, the region 100b, And a single-layer region 100c made of a flexible substrate 108. That is, the rigid-flex mixed substrate 100 is a substrate having a different layer structure of five layers, four layers, and one layer for each of the plurality of regions 100a, 100b, and 100c in one printed circuit board. It has a region heterogeneous structure.

  In the case of the rigid / flexible mixed substrate 100 to be designed (see FIG. 5A), the region 100a has a five-layer structure, the region 100b has four layers, and the region 100c has a one-layer structure. When the rectangular parallelepipeds are stacked so as to correspond to the layer structure of the rigid-flex mixed substrate 100, the result is as shown in FIG. At this time, since the outer shape of the flexible substrate 108 serving as the base of the rigid-flex mixed substrate 100 covers the regions 100a, 100b, and 100c (see the outer shape (3) shown in FIG. 5B), the height direction (that is, A rectangular parallelepiped 48-1 corresponding to the region 100a, a rectangular parallelepiped 48-2 corresponding to the region 100b, and a rectangular parallelepiped 48-3 corresponding to the region 100c so as to be adjacent to the same height position in the Z-axis direction in the XYZ orthogonal coordinate system). Is arranged (see the simplified 3D display field 60e shown in FIG. 4).

  Specifically, the region 100a of the rigid / flexible mixed substrate 100 (see FIG. 5A) to be designed is the coordinate value (X, Y) = (2, 2) in the XYZ orthogonal coordinate system of the simple 3D display column 60e. The rectangular parallelepiped 41 is arranged at the coordinate value (X, Y, Z) = (2, 2, 1) at a position corresponding to the first layer of the region 100a formed by the hard substrate 101 so as to be hard. A rectangular parallelepiped 42 is arranged at a coordinate value (2, 2, 2) at a position corresponding to the second layer of the region 100a formed by the substrate 102, and the third layer of the region 100a formed by a part of the flexible substrate 108 is arranged. The rectangular parallelepiped 48-1 is arranged at the corresponding position at the coordinate value (2, 2, 3), and the rectangular parallelepiped 43 is arranged at the position corresponding to the fourth layer of the region 100a formed by the hard substrate 103 (2, 2, 3). 4) placed on the hard substrate 1 A position corresponding to the fifth layer region 100a formed by 4 arranging the rectangular parallelepiped 44 on the coordinate values (2,2,5).

  Further, the rigid substrate 105 is arranged so that the region 100b of the rigid / flexible mixed substrate 100 to be designed is positioned at the coordinate value (X, Y) = (4, 2) in the XYZ orthogonal coordinate system of the simple 3D display field 60e. The rectangular parallelepiped 45 is arranged at the coordinate value (X, Y, Z) = (4, 2, 1) at a position corresponding to the first layer of the region 100b to be formed, and the second of the region 100b formed by the hard substrate 106. The rectangular parallelepiped 46 is arranged at the coordinate value (4, 2, 2) at the position corresponding to the layer, and the rectangular parallelepiped 48-2 is set at the position corresponding to the third layer of the region 100b formed by a part of the flexible substrate 108. The rectangular parallelepiped 47 is arranged at the coordinate value (4, 2, 4) at a position corresponding to the fourth layer of the region 100b formed by the hard substrate 107.

  In addition, the region 100c of the rigid / flexible mixed substrate 100 to be designed is positioned at the coordinate value (X, Y) = (3, 2) in the XYZ orthogonal coordinate system of the simple 3D display field 60e. The rectangular parallelepiped 48-3 is arranged at the coordinate value (3, 2, 3) at a position corresponding to the third layer of the region 100c formed by a part.

  Further, as described above, for each region of a single printed board in the simplified 3D display field 60e of the layer structure setting screen 60, corresponding to the rigid-flex mixed board 100 (see FIG. 5A) to be designed. After setting the layer, the user operates an input device such as the pointing device 18 or the character input device 20 to display an arbitrary layer displayed in a simple 3D display field 60e in a rectangular parallelepiped on the screen of the display device 16. The layer specification setting dialog 62 (see FIG. 6) is displayed.

  This layer specification setting dialog 62 corresponds to the simple 3D display column 60e of the layer structure setting screen 60, and forms a plurality of layers of a single printed circuit board whose name is displayed in the substrate name column 60a. A layer specification column 62a for displaying the name of the board outer shape data of the actual product, the name of the design rule, and the like.

  In the layer specification column 62a, display columns corresponding to the coordinate values in the XYZ orthogonal coordinate system of the simple 3D display column 60e are provided. Accordingly, the substrate outer shape data of the substrate forming the layer represented by the rectangular parallelepiped is displayed in the display column of the layer specification column 62a corresponding to each coordinate value of the rectangular parallelepiped displayed on the simple 3D display column 60e of the layer structure setting screen 60. Display the name and assign the outline of the board.

  Here, when setting the rigid / flexible mixed substrate 100 (see FIG. 5A), the rectangular parallelepiped 48 corresponding to the flexible substrate 108 is displayed in the simple 3D display field 60e of the layer structure setting screen 60 as shown in FIG. -1,48-2,48-3 and rectangular parallelepipeds 41, 42, 43, 44, 45, 46, 47 corresponding to the hard substrates 101, 102, 103, 104, 105, 106, 107, respectively, are simple. It is displayed in the 3D display field 60e.

  At this time, among the layers displayed in the rectangular parallelepiped displayed in the simple 3D display field 60e, the common name is set as the name of the substrate outer shape data for a layer that is to be recognized as a common layer over a plurality of regions.

  Specifically, three rectangular parallelepipeds 48-1, 48-2, and 48-3 continuously arranged adjacent to each other in the same layer corresponding to the flexible substrate 108 are displayed in the simple 3D display field 60e. The substrate 108 is a base of the rigid-flex mixed substrate 100, and its outer shape extends over the regions 100a, 100b, and 100c (see the outer shape (3) shown in FIG. 5B). Accordingly, the display fields 58a-1, 58a-2, 58a-3 of the layer specification field 62a corresponding to the coordinate values of the three rectangular parallelepipeds 48-1, 48-2, 48-3 corresponding to the flexible substrate 108 are displayed in the display fields 58a-1, 58a-2, 58a-3. In both cases, the name “flex1” of the board outer shape data is displayed and a common name is set.

  Thus, among the rectangular parallelepipeds displayed in the simplified 3D display field 60e, common to the layer specification field 62a corresponding to each of a plurality of rectangular parallelepipeds continuously arranged adjacent to the same height position in the Z-axis direction. When the name is set, the CPU 10 determines that the layer represented by the rectangular parallelepiped in which the common name is set is a common layer common to a plurality of areas. Such a determination process is consistent with the fact that the flexible substrate 108 of the rigid-flex mixed substrate 100 that is the actual design object is a common layer that forms the third layers of the regions 100a, 100b, and 100c.

  Since the hard substrates 101, 102, 103, and 104 all have the same outer shape (see the outer shape (1) shown in FIG. 5B), the coordinate values of the rectangular parallelepipeds 41, 42, 43, and 44 are set. The first, second, fourth, and fifth layers of the region 100a represented by the rectangular parallelepipeds 41, 42, 43, and 44 are configured in the display columns 51a, 52a, 53a, and 54a of the corresponding layer specification column 62a. The name “mitsu1” of the board outer shape data of the hard boards 101, 102, 103, 104 to be displayed is displayed.

  Further, since the hard substrates 105, 106, and 107 all have the same outer shape (see the outer shape (2) shown in FIG. 5B), the layer specifications corresponding to the coordinate values of the rectangular parallelepipeds 45, 46, and 47, respectively. In the display columns 55a, 56a, 57a of the column 62a, the substrate outer shapes of the hard substrates 105, 106, 107 constituting the first layer, the second layer, and the fourth layer of the region 100b represented by the rectangular parallelepipeds 45, 46, 47 The data name “mitsu2” is displayed.

  Here, the display field 51a, 52a, 53a, 54a of the layer specification field 62a corresponding to the rectangular parallelepiped 41, 42, 43, 44 is “mitsu1”, the display field of the layer specification field 62a corresponding to the rectangular parallelepiped 45, 46, 47. In 55a, 56a, and 57a, the name of the same board outer shape data is displayed, such as “mitsu2”. However, the plurality of rectangular parallelepipeds 41, 42, 43, 44, 45, 46, 47 in which the names of the same board outer shape data are set are adjacent to the same height position in the Z-axis direction in the simple 3D display field 60e. Since they are not arranged so as to match, the layer represented by the rectangular parallelepiped with the same name set is not determined to be a common layer common to a plurality of regions under the control of the CPU 10.

  In addition, in the layer specification column 62a of the layer specification setting dialog 62, a rectangular parallelepiped is displayed in the display column of the layer specification column 62a corresponding to each coordinate value of the rectangular parallelepiped displayed in the simple 3D display column 60e of the layer structure setting screen 60. The name of the design rule data of the board constituting the layer is displayed and the design rule is assigned. The design rule data has, for example, the name “u-0.20” and the configuration shown in FIG. 7, and detailed settings are made for each rule.

  When designing the rigid-flexible mixed substrate 100 (see FIG. 5A), the layer specifications corresponding to the coordinate values of the rectangular parallelepiped 41, 42, 43, 44, 45, 46, 47 displayed in the simple 3D display field 60e. In the display columns 51b, 52b, 53b, 54b, 55b, 56b, and 57b of the column 62a, the first layer, the second layer, and the second layer of the region 100a represented by the rectangular parallelepipeds 41, 42, 43, 44, 45, 46, and 47 Design rule name “u−0.20” of the hard substrate 101, 102, 103, 104, 105, 106, 107 constituting the first layer, the second layer, and the fourth layer of the fourth layer, the fifth layer, and the region 100b. (See FIG. 7).

  Further, in the display fields 58b-1, 58b-2, 58b-3 of the layer specification field 62a corresponding to the respective coordinate values of the rectangular parallelepipeds 48-1, 48-2, 48-3 displayed in the simple 3D display field 60e. The name “u-0.25” of the design rule of the flexible substrate 108 constituting the third layer of the regions 100a, 100b, and 100c represented by the rectangular parallelepipeds 48-1, 48-2, and 48-3 is displayed.

  In this way, the layer is set for each area of the single printed circuit board in the simple 3D display field 60e of the layer structure setting screen 60 (see FIG. 4), and the layer specification setting dialog 62 is set for each of the layers. In the layer specification column 62a, the outer shape is assigned and the design rule is assigned. In addition to the layout assignment and design rule assignment, if the material is different for each area of a single printed board, such as the rigid-flex mixed board 100 shown in FIG. In the dialog 62, the material may be set for each of the layers in the single printed circuit board.

  Further, after setting on the layer structure setting screen 60 or the layer specification setting dialog 62, the user operates an input device such as the pointing device 18 or the character input device 20 to display a data image on the screen of the display device 16. A display screen 36 (see FIG. 8) is displayed. On this data image display screen 36, the user confirms the outline information and confirms whether the outline setting of the printed circuit board is correct.

  The outer shape of the printed circuit board and the layer structure of the data image display screen 36 shown in FIG. 8 are the same as the outer shape and the layer structure of the rigid-flex mixed board 100 to be designed shown in FIG. Therefore, in such a case, the user can determine that the outer shape of the printed board displayed on the data image display screen 36 and the layer structure thereof are correct. At this time, if the outer shape and the layer structure of the printed circuit board on the data image display screen 36 do not match the outer shape and the layer structure of the printed circuit board to be designed, the layer structure setting screen 60 and the layer specification are again displayed. It is only necessary to correctly redo the layer setting and the board outline assignment in the setting dialog 62.

  As described above, when the name etc. are entered in the respective fields of the board name column 60a, the material column 60b, the wiring specification column 60c, and the simple 3D display column 60d of the layer structure setting screen 60 and the OK column 60f is selected, the layer structure is selected. Information input in each column of the setting screen 60 and the layer specification setting dialog 62, that is, information of a single substrate structure composed of layer structure / substrate material / wiring specification is stored in the substrate database 200 of the external storage device 22. (See arrow Y1 shown in FIG. 2).

(2) Setting of connection information by net between parts on the board (see S2 in FIG. 3)
When setting the connection information between the components on the board via the net, the user operates an input device such as the pointing device 18 or the character input device 20 to display the layer structure setting screen 60 on the screen of the display device 16 (see FIG. 4). Is displayed. As described in the above (1), the layer structure setting screen 60 is a screen for setting each substrate structure for each single printed circuit board, and connecting components in a single printed circuit board. When there is information, this is a screen for setting the connection information.

  More specifically, as shown in FIG. 4, the connection between components in a single printed circuit board that is a setting target whose name is displayed in the board name field 60a in the in-board net field 60d of the layer structure setting screen 60 The name “kiban1” of the net indicating the information is displayed, and the OK column 60f is selected. Then, for example, an external file stored in the external storage device 22 can be read and defined, and netlist information indicating connection information between components in the printed circuit board having the name displayed in the board name field 60a is displayed. It is stored in the substrate database 200 of the external storage device 22 (see arrow Y2 shown in FIG. 2).

  On the other hand, if there is still no connection information by net between components in such a single printed circuit board, as soon as the connection information is created, the in-board net column 60d (see FIG. 4) of the layer structure setting screen 60 is used. Connection information can be defined later. Thereby, board allocation can be examined even in the concept design stage where connection information between components in the printed circuit board is not yet clear.

(3) Setting of connection information via a net between single boards (see S3 in FIG. 3)
When setting connection information between a single substrate and a single substrate, the user operates an input device such as the pointing device 18 or the character input device 20 to display a multiple substrate setting screen 64 (FIG. 9) on the screen of the display device 16. Display). The multiple substrate setting screen 64 is a screen for setting a plurality of printed circuit boards accommodated in the casing of the electrical equipment product.

  More specifically, the multiple board setting screen 64 includes a symbol field 64a in which basic symbols corresponding to each of the multiple printed boards set in the predetermined casing are displayed, and a plurality of prints set in the predetermined casing. This is composed of a diverted symbol column 64b on which symbols having high versatility corresponding to the substrate are displayed, and a simple 3D display canvas column 64c for 3D display of a plurality of prints in the housing.

  The user operates an input device such as the pointing device 18 or the character input device 20, and is displayed in the symbol column 64a in the simple 3D display canvas column 64c so as to correspond to a plurality of printed circuit boards accommodated in the housing. The basic symbols and the symbols displayed in the diverted symbol column 64b are arranged, and the structures of a plurality of printed circuit boards accommodated in the housing are simply displayed in 3D.

  For example, in FIGS. 10A, 10B, 10C, 10D, 10E, and 10F, the structure of a plurality of printed circuit boards that are arranged in a predetermined housing according to the setting on the plurality of circuit board setting screen 64, respectively. Shows an example in which 3D is displayed in the simple 3D display canvas column 64c. More specifically, FIG. 10A shows a case where the printed board 120 (or wire harness) is connected to the components 111 and 133 mounted on the printed boards 110 and 130. FIG. 10B shows that the printed circuit board 120 (or wire harness) is connected to the parts 111 and 133 mounted on the printed circuit boards 110 and 130 by connecting the parts 122a and 122b located at both ends. This is the case when connected. FIG. 10C shows a case where the printed circuit board 120 is connected to the component 111 mounted on the printed circuit board 110. FIG. 10D shows that a printed circuit board 120 (or a wire harness) is connected to a component 111 mounted on the printed circuit board 110 and a component 133 mounted on the opposite surface of the printed circuit board 130. This is the case. FIG. 10E shows a case where the printed circuit board 120 (or a wire harness) is directly connected to the printed circuit boards 110 and 130 with a conductive adhesive. FIG. 10F shows a case where the printed boards 110, 120, and 130 are independent of each other.

  Also, two printed circuit board groups 180-1 and 180-2 are displayed in the simple 3D display canvas field 64c of the multiple circuit board setting screen 64 shown in FIG. Printed circuit boards 144, 146, 148, and 150 are connected to components 141, 143, 145, and 147 mounted on a printed circuit board 142 stacked on 140. A printed board 156 (or a wire harness) is connected to the printed board 154 and the printed board 142 stacked on the printed board 152. In addition, the component 160a located at one end is connected to the component 159 and the component 155 mounted on the printed circuit board 154 and the component 159 mounted on the printed circuit board 158, or the printed circuit board 160 (or Wire harness) is connected.

  On the other hand, in the printed circuit board group 180-2, a printed circuit board 174 (or a wire harness) is connected to the printed circuit board 170 and the printed circuit board 172. A printed circuit board 178 is connected to a component 177 and a printed circuit board 170 mounted on the printed circuit board 176.

  Accordingly, as is apparent from FIG. 9, in each of these printed circuit board groups 180-1 and 180-2, there is a physical connection between the printed circuit boards, but the printed circuit board group 180-1 and the printed circuit board 180. -2 is clear that there is no physical connection between the setting state and the display state in the simplified 3D display canvas field 64c of the multiple substrate setting screen 64.

  In other words, on the multiple board setting screen 64, settings for a plurality of printed boards accommodated in the casing of the electrical equipment product, particularly settings for physical connection of the plurality of printed boards are made.

  Then, following the setting on the multiple substrate setting screen 64, when setting connection information by a net between single substrates, the user operates an input device such as the pointing device 18 or the character input device 20 to display the display device. The connection information setting screen 66 (see FIG. 11) between the single substrates is displayed on the 16 screens. This single board connection information setting screen 66 is a screen for setting connection between printed boards among a plurality of printed boards housed in the casing of the electrical equipment product, in particular, electrical connection between the printed boards. It is.

  In the connection information setting screen 66 for single boards, a new net that crosses between the printed boards defined as the connection information between the printed boards is a component in the single printed board defined in (2) above. It is positioned as the parent net of each other's net.

  More specifically, the connection information setting screen 66 for single substrates is a net name of net list information indicating connection information between components in each of a plurality of printed circuit boards for which connection information between printed circuit boards is set. The corresponding net name columns 66a and 66b for displaying the information, the inter-substrate net name column 66c for displaying the net name of the connection information set between the single substrates, and the structure of the plurality of printed circuit boards are simply 3D. It consists of a simple 3D display field 66d to be displayed.

  Here, in the simple 3D display column 66d, the setting content on the above-described multiple substrate setting screen 64 (see FIG. 9), that is, a display corresponding to the simple 3D display canvas column 64c of the multiple substrate setting screen 64 is made. Yes, the structure of a plurality of printed circuit boards in a state where physical connection has already been set is simply displayed in 3D. Then, the user operates an input device such as the pointing device 18 or the character input device 20 to select an arbitrary printed circuit board in the simple 3D display field 66d, and the selected printed circuit board is used as connection information between printed circuit boards. Set as a setting target.

  In addition, in the corresponding net name fields 66a and 66b, the user associates the net names to be connected to each other with the pointing device 18 and the character input device corresponding to each of the printed boards selected and set in the simple 3D display field 66d. An input device such as 20 is operated and displayed. At this time, corresponding to the printed board selected in the simple 3D display field 66d, the connection information is set in the board database 200 of the external storage device 22 by setting the connection information by the net between the components in the board of (2). Netlist information is read as appropriate.

  For example, in the simplified 3D display field 66d in FIG. 11, five printed circuit boards 191, 192, 193, 194, and 195 having physical connections are displayed, and the printed circuit board 192 having the name “Kiban_b” and “ The printed circuit board 193 having the name “Kiban_c” is selected.

  In the corresponding net name column 66a, the net to be connected to the net of the printed board 193 with the name “Kiban_c” is selected and set from the net list information of the printed board 192 with the name “Kiban_b”, and the name “Net1_a, Net1_b, Net1_c, Net1_d, Net1_e, Net1_f, Net1_g, Net1_h ”are displayed, and the printed net 192 of the name“ Kiban_b ”in the netlist information of the printed circuit board 193 with the name“ Kiban_c ”is displayed in the corresponding net name column 66b. Nets to be connected to the other nets are selected and their names “Net2_a, Net2_b, Net2_c, Net2_d, Net2_e, Net2_f, Net2_g, Net2_h” are displayed.

  In this way, the printed circuit board 192 with the name “Kiban_b” and the printed circuit board 193 with the name “Kiban_c” are selected as the setting targets of the connection information between the printed circuit boards, and should be connected by the nets between the components in the respective printed circuit boards. If the net is set, the name of the net for connecting the single boards to each other in the inter-board net name column 66c (refer to “bus1, bus2, bus3, bus4, bus5, bus6, bus7, bus8” shown in FIG. 11). input. Then, the connection information by the net between the printed circuit boards is stored in the circuit board database 200 of the external storage device 22 (see arrow Y3 shown in FIG. 2).

  As described above, in the connection information setting screen 66 between single substrates shown in FIG. 11, the physical connection state set on the multiple substrate setting screen 64 (see FIG. 9) and the connection information by the net between the substrates. By adding net information with the definition of components, components can be moved and wired between different boards while taking into account electrical information. Can be performed efficiently.

(4) Setting of board outline information (see S4 in FIG. 3)
When setting the outline information of the board, the user operates an input device such as the pointing device 18 or the character input device 20 to display the outline setting screen 68 (see FIG. 12) on the screen of the display device 16. The outer shape setting screen 68 is a screen for setting the outer shape of each of the plurality of printed circuit boards accommodated in the casing of the electrical equipment product.

  More specifically, the outer shape setting screen 68 includes a board name column 68a that displays the name of a single printed circuit board that is a target for setting the outer shape, an outer shape column 68b that displays a name indicating the outer shape information of the board, and an OK column. 68c and a cancel column 68d.

  The user operates an input device such as the pointing device 18 or the character input device 20, and, for example, as shown in FIG. 12, an arbitrary printed board is displayed in the board name field 68a of the outline setting screen 68 displayed on the display device 16. The name “Kiban_b” is displayed.

  When the name of the board outer shape data, which is the board outer shape information stored in a format file that can be input to the system in advance, is displayed in the outer shape column 68b and the OK column 68c is selected, the board outer shape information is displayed. Is acquired as an external file and associated, and information input in each field of the external shape setting screen 68, that is, external information indicating the external shape of the board set corresponding to each of the plurality of printed circuit boards is stored in the external storage. It is stored in the substrate database 200 of the apparatus 22 (see arrow Y4 shown in FIG. 2).

  After the outline of the printed circuit board is captured by setting the outline information of the board (4), the actual board shape can be displayed via the display device 16 as shown in FIG. By defining the substrate outer shape in this way, for example, it becomes possible to perform display in consideration of the bending of the flexible substrate portion, and it is possible to verify substrate allocation in consideration of the detailed shape such as considering other printed circuit boards. If the display example shown in FIG. 13 is compared with the case where, for example, the printed circuit board is displayed in a simple rectangular parallelepiped on the multiple board setting screen 64 in FIG. 9 or the connection information setting screen 66 between single boards in FIG. It is clear that the visual effect is remarkable, and the design work can be performed more efficiently while visually recognizing the exact detailed shape of the printed circuit board.

  Furthermore, when the connection information by the net between the components of the single board by the setting of (2) described above and the connection information by the net between the boards by the setting of (3) described above are input (FIG. 2). As shown in FIG. 14, it is possible to arrange components in consideration of the bending of the flexible substrate portion, move components between the substrates, and study with higher accuracy as shown in FIG.

  Specifically, the printed circuit board 160 of the printed circuit board group 180-1 displayed in the simplified 3D display canvas field 64c of the multiple circuit board setting screen 64 in FIG. 9 will be described as an example. The component 160a is located at one end of the printed circuit board 160. In the simplified 3D display canvas column 64c, the printed circuit board 160 is represented by two rectangular parallelepipeds: a symbol indicating a printed circuit board and a symbol indicating a component (see FIG. 15A).

  Regarding the printed circuit board 160, the connection information by the net between the components of the single board by the setting of (2) described above and the connection information by the net between the boards by the setting of (3) are already input to the board database 200. If so, it is displayed on the display device 16 as shown in FIGS. 15 (b), (d), and (f). On the other hand, if the board outline information set in the above (4) has already been input to the board database 200, it is displayed on the display device 16 as shown in FIGS. 15 (c), 15 (e), and 15 (g). . And, the connection information by the net between the components of the single board by the setting of (2), the connection information by the net between the boards by the setting of (3) and the outline information of the board by the setting of (4) are all If already entered in the database 200, it is displayed as shown in FIG.

As detailed in (1) to (4) above,
・ Single substrate structure,
・ Net connection information between parts in a single board,
・ Net connection information between single boards
・ Single board outline information,
Is set for the substrate database 200 in which the setting information is stored (see arrows Y1, Y2, Y3, and Y4 shown in FIG. 2).

  Information on a single substrate can be output from the substrate database 200 including the plurality of substrate information thus created (see arrow Y5 shown in FIG. 2). After outputting the design information of the single board from the board database 200, it is possible to perform detailed component arrangement and wiring design for each of the plurality of printed boards housed in the casing of the electrical equipment product.

Here, the above four settings, that is,
(1) Single substrate structure setting (see S1 in FIG. 3),
(2) Setting of connection information via a net between components in the board (see S2 in FIG. 3),
(3) Setting of connection information by a net between single boards (see S3 in FIG. 3),
(4) Setting of board outline information (see S4 in FIG. 3),
It goes without saying that the order of performing is not limited to S1->S2->S3-> S4 (see arrows Y11, Y12, Y13 shown in FIG. 3).

  For example, the above four settings may be performed in the order of S4 → S3 → S2 → S1 (see arrows Y14, Y15, Y16 shown in FIG. 3), or S2 and S3 may be performed first. Is also good.

  Further, the order of these four settings and the detailed design of the printed circuit board is not limited to the detailed setting of the printed circuit board after all the above four settings are completed. In other words, according to the arrows Y11, Y12, Y13, and Y17 shown in FIG. 3, the invention is not limited to the order of S1, S2, S3, S4, and S5 (detailed design of the printed circuit board). After setting the structure (see S1 in FIG. 3), a detailed design of the printed circuit board (see S5 in FIG. 3) is performed (see arrow Y18 in FIG. 3), or S5 is performed after S2 (see FIG. 3). S5 may be performed after S3 (see arrow Y20 in FIG. 3), or S5 may be performed after S4 (see arrow Y17 in FIG. 3).

  That is, it is possible to start the detailed design of the printed circuit board at an early stage by inputting information step by step during the design without inputting all the information of the four settings (1) to (4). it can. In other words, it is possible to return to the work procedure. This is due to the nature of the design work of the printed circuit board. It is very effective in eliminating design mistakes found in the process at an early stage. In the printed circuit board design system according to the present invention, when the detailed design of the printed circuit board is performed, the current settings are made and inputted even if all the information of the four settings (1) to (4) is not collected. It is possible to realize a system with a very high degree of freedom by performing detailed design and verification of a printed circuit board using only existing information and adding and modifying design information as needed.

  With the above four settings (1) to (4), information on a normal CAD single board is stored in the board database 200, and a board structure examination and component arrangement considering a plurality of boards, which is impossible with normal CAD, etc. You will be able to do floor planning. That is, it becomes possible to efficiently perform detailed design on a later single substrate.

The embodiment described above may be modified as described in the following (A) to (E).

  (A) In the above-described embodiment, (1) the substrate structure information including the layer structure / substrate material / wiring specification is stored in the substrate database 200 by setting the single substrate structure. Of course, it is not limited, and as information on the substrate structure of a single printed circuit board, for example, the thickness of the layer in the single printed circuit board, the relative dielectric constant, and other attribute information necessary for the design are set. You may be made to do.

  (B) In the above-described embodiment, the printed circuit board design system according to the present invention has the system configuration as shown in FIG. 1, but is not limited to this. For example, a server or the like The printed circuit board design system according to the present invention and other systems may be configured so that information can be input and output via a communication device.

  In addition, the type of information input to the substrate database 200, the storage area for storing various information, the format thereof, and the like can be changed as appropriate.

  (C) In the above-described embodiment, there is further provided input means for inputting case information relating to a case in which a plurality of printed circuit boards are accommodated into the system according to the present invention. It may be configured to be able to be assigned in correspondence with a plurality of printed circuit boards to be set in (4) to (4).

  In this way, it is possible to integrate the data by taking in the electrical CAD information and the housing CAD information for a plurality of printed circuit board models (see FIG. 16). Furthermore, as shown in FIG. 17, information obtained by integrating a plurality of printed circuit boards and a housing can be visualized. Based on such display, the housing considering the other substrates, movement of the substrate, It is possible to examine parts movement and wiring patterns, and check their interference.

  Designs that take into account such cases, that is, designs that take into account the graphics surrounding the board, have almost the same information as the original board image on the canvas of the screen displayed on the display screen. This eliminates the need to imagine them, and enables multi-board simulation, board allocation examination, design considering other boards, and quantification of checks, which have been done in paper and discussion until now. It can contribute to improvement and improvement of printed circuit board design quality.

  (D) In the above embodiment, the printed circuit board is designed as a printed circuit board design system (see FIG. 1). For example, it can be implemented as a program used in the printed circuit board design system according to the present invention, or You may make it implement as a computer-readable storage medium which memorize | stored the said program.

  (E) You may make it combine the above-mentioned embodiment and the modification shown to said (A) thru | or (E) suitably.

  INDUSTRIAL APPLICABILITY The present invention can be used when, for example, a verification work before a detailed design of a printed circuit board is performed when an electrical equipment product manufacturer designs a product.

FIG. 1 is a block diagram showing a system configuration of an example of an embodiment of a printed circuit board design system according to the present invention. FIG. 2 is an explanatory diagram schematically showing information input to the substrate database and information output from the substrate database. FIG. 3 is an explanatory diagram schematically showing the relationship between the process of the printed circuit board design system according to the present invention and the detailed design of the printed circuit board. FIG. 4 is an explanatory diagram showing an example of a layer structure setting screen displayed on the screen of the display device of the printed circuit board design system according to the present invention. FIG. 5A is a schematic configuration diagram showing a rigid-flex mixed board as a design target, and FIG. 5B corresponds to the layer structure of the rigid-flex mixed board shown in FIG. It is explanatory drawing which shows the stacked rectangular parallelepiped. FIG. 6 is an explanatory diagram showing an example of a layer specification setting dialog displayed on the screen of the display device of the printed circuit board design system according to the present invention. FIG. 7 is an explanatory diagram showing an example of the configuration of design rule data. FIG. 8 is an explanatory diagram showing an example of a data image display screen displayed on the screen of the display device of the printed circuit board design system according to the present invention. FIG. 9 is an explanatory diagram showing an example of a multiple board setting screen displayed on the screen of the display device of the printed circuit board design system according to the present invention. 10 (a), (b), (c), (d), (e), and (f) are the settings on the plurality of substrate setting screens shown in FIG. 9, and the structure of a plurality of printed circuit boards disposed in a predetermined casing. Is an explanatory diagram showing an example in which 3D is displayed in a simple 3D display canvas field. FIG. 11 is an explanatory diagram showing an example of a connection information setting screen displayed on the screen of the display device of the printed circuit board design system according to the present invention. FIG. 12 is an explanatory diagram showing an example of an outline setting screen displayed on the screen of the display device of the printed circuit board design system according to the present invention. FIG. 13 is an explanatory diagram showing an example of a plurality of printed circuit boards displayed on the screen of the display device of the printed circuit board design system according to the present invention. FIG. 14 is an explanatory diagram showing an example of a plurality of printed circuit boards displayed on the screen of the display device of the printed circuit board design system according to the present invention. FIGS. 15A, 15B, 15C, 15D, 15E, 15F, 15G, and 15G are explanatory diagrams showing an example of a printed circuit board displayed on the screen of the display device of the printed circuit board design system according to the present invention. It is. FIG. 16 is an explanatory diagram showing a case where information about a housing is used in the printed circuit board design system according to the present invention. FIG. 17 is an explanatory diagram showing another example of a plurality of printed circuit boards displayed on the screen of the display device of the printed circuit board design system according to the present invention.

Explanation of symbols

10 CPU
12 Bus 14 Internal Storage Device 16 Display Device 18 Pointing Device 20 Character Input Device 22 External Storage Device 60 Layer Structure Setting Screen 62 Layer Specification Setting Dialog 64 Multiple Board Setting Screen 66 Single Board Connection Information Setting Screen 68 Outline Setting Screen 100 Rigid-flex mixed substrate 200 substrate database

Claims (11)

Substrate structure setting means;
First connection information setting means;
A second connection information setting means;
Substrate outer shape setting means;
Display means
The printed circuit board design system having, a printed circuit board design method for performing PCB design,
The substrate structure setting means comprises a first step of setting a substrate structure comprising a layer structure of each printed circuit board constituting a plurality of printed circuit boards, board material, the wiring specifications,
The first connection information setting means, and a second step of setting the connection information according to the net between the parts to be mounted on the printed circuit board constituting the plurality of printed circuit boards,
The second connection information setting means, and a third step of setting the connection information according to the net of the respective printed circuit boards that constitute the plurality of printed circuit boards,
A fourth step in which the substrate outer shape setting means sets the outer shape of each printed circuit board constituting the plurality of printed circuit boards ;
Wherein the display means, the first step, the second step, have a fifth step of displaying visualized with integrating said third step and the information set in the fourth step ,
A printed circuit board design method, wherein a user designs a printed circuit board based on the information displayed in the fifth step . The printed circuit board design method according to claim 1,
After performing at least one of the first step, the second step, the third step, and the fourth step , the fifth step is performed to start designing the printed circuit board. It is possible to design a printed circuit board while adding or correcting information set in the first step, the second step, the third step, and the fourth step as needed. A printed circuit board design method. In the printed circuit board design method according to claim 1 or 2,
In the first step, a layer structure is set for each of a plurality of regions in a single printed circuit board. Substrate structure setting means;
First connection information setting means;
A second connection information setting means;
Substrate outer shape setting means;
Input means;
Display means
A printed circuit board design method for designing a printed circuit board by a printed circuit board design system comprising:
A first step in which the board structure setting means sets a board structure including a layer structure, a board material, and a wiring specification of each printed board constituting a plurality of printed boards;
A second step in which the first connection information setting means sets connection information by a net between components mounted on each printed circuit board constituting the plurality of printed circuit boards;
A third step in which the second connection information setting means sets connection information by a net between the printed boards constituting the plurality of printed boards;
A fourth step in which the substrate outer shape setting means sets the outer shape of each printed circuit board constituting the plurality of printed circuit boards;
A fifth step in which the input means inputs information relating to a shape of a housing in which the plurality of printed circuit boards are accommodated ;
The display means integrates and visualizes and displays information set in the first step, the second step, the third step, the fourth step, and the fifth step. have a and of the process,
A printed circuit board design method, wherein a user designs a printed circuit board based on the information displayed in the sixth step . In a printed circuit board design system for designing printed circuit boards,
A board structure setting means for setting a board structure including a layer structure, a board material, and wiring specifications of each printed board constituting a plurality of printed boards;
First connection information setting means for setting connection information by a net between components mounted on each printed circuit board constituting the plurality of printed circuit boards;
A second connection information setting means for setting connection information by a net between the respective printed circuit boards constituting the plurality of printed circuit boards;
Board outer shape setting means for setting the outer shape of each printed circuit board constituting the plurality of boards ;
The substrate structure setting means, the first connection information setting means, have a display means for showing visualized images with integrating information set in the second connection information setting means and the substrate outer shape setting means ,
A printed circuit board design system in which a user designs a printed circuit board based on information displayed by the display means . The printed circuit board design system according to claim 5,
After setting by at least one of the board structure setting means, the first connection information setting means, the second connection information setting means, and the board outer shape setting means , the setting is performed by the display means. Integrated information is visualized and displayed to start designing the printed circuit board. At any time, the board structure setting means, the first connection information setting means, the second connection information setting means, and A printed circuit board design system for designing a printed circuit board while adding or correcting information set by the substrate outer shape setting means . The printed circuit board design system according to any one of claims 5 and 6,
The printed circuit board design system, wherein the substrate structure setting means sets a layer structure for each of a plurality of regions in a single printed circuit board. In a printed circuit board design system for designing printed circuit boards,
A board structure setting means for setting a board structure including a layer structure, a board material, and wiring specifications of each printed board constituting a plurality of printed boards;
First connection information setting means for setting connection information by a net between components mounted on each printed circuit board constituting the plurality of printed circuit boards;
A second connection information setting means for setting connection information by a net between the respective printed circuit boards constituting the plurality of printed circuit boards;
Board outer shape setting means for setting the outer shape of each printed circuit board constituting the plurality of boards;
Input means for inputting information on a shape of a housing in which the plurality of printed circuit boards are accommodated ;
Integration and visualization of information set in the board structure setting means, the first connection information setting means, the second connection information setting means, and the board outer shape setting means, and information input by the input means possess and display means for displaying and,
A printed circuit board design system in which a user designs a printed circuit board based on information displayed by the display means .   A program for causing a computer to execute the printed circuit board design method according to claim 1, claim 2, claim 3, or claim 4.   The program for functioning a computer as a printed circuit board design system of any one of Claim 5, Claim 6, Claim 7 or Claim 8.   The computer-readable recording medium which recorded the program of any one of Claim 9 or Claim 10.