JP4472374B2 - Resin vapor jet nozzle and resin thin film forming apparatus - Google Patents

Description

The present invention relates to the use of a dielectric layer or a thin film circuit board of the insulating layer of the electronic components such as capacitors, in which relates resin steam jet nozzles, and the resin thin film formation equipment.

  As a recent trend, there is a demand for ultra-small size and ultra-thin film in electronic parts such as capacitors and circuit boards. In these productions, a thin film forming technique of a metal thin film or a resin thin film is used. Regarding the formation of a metal thin film, many techniques for uniformly forming a metal thin film with a predetermined film thickness, such as vacuum vapor deposition and sputter vapor deposition, are known. Regarding the formation of a resin thin film, conventionally, thin film formation by painting such as reverse coating or die coating has been used. However, with this method, there is a limit to thinning the film, and it is difficult to form a resin thin film of 1 μm or less. Therefore, in a vacuum, a liquid resin is heated in a vacuum to generate resin vapor, and the resin vapor is deposited on a moving support, and a thin resin film is continuously formed. A resin thin film forming method capable of forming a thin film is known (for example, see Patent Document 1).

  FIG. 7 shows a sectional view of an example of an apparatus for forming a resin thin film by vacuum deposition. The resin thin film is formed in the vacuum chamber 101 maintained in a vacuum state by a vacuum pump 118. Inside the vacuum chamber 101, a roll 105 for supplying a support for forming a resin thin film, a rotating drum 112, a resin vapor ejection nozzle 1102 for blowing resin vapor, and an ultraviolet irradiation device 113 for curing the resin thin film are installed. .

  A belt-like support 106 that forms a resin thin film is wound around an unwinding roll. The belt-like support 106 is unwound from an unwinding roll 105 that rotates in the direction of the rotation direction 104, and travels on the surface of the rotary drum 112 that rotates in the direction of the rotation direction 111 through the guide roll 107. And it is wound up by the winding roll which rotates in the direction of the rotation direction 110 through the guide roll 108. As the belt-like support, for example, a long PET film, a PEN film, or these long films deposited with Al or the like can be used.

  The resin vapor ejection nozzle 1102 is installed in the vicinity of the rotating drum, and forms a resin thin film on the surface of the support 106 by blowing the resin vapor onto the support. An inclined plate 114 made of metal is installed on the back side in the resin thin film forming apparatus for forming the resin thin film. A resin supply pipe 116 for supplying a liquid resin as a material for the resin thin film is installed on the upper portion of the inclined plate. The inclined plate is made of a metal such as copper having good thermal conductivity. A heater 115 is installed on the back surface of the inclined plate. When the liquid resin supplied to the inclined plate 114 from the upper part flows from the upper part to the lower part of the inclined plate, the liquid resin is heated by the heat of the heater to become resin vapor. The supply amount of the liquid resin is adjusted by the flow rate adjustment valve 117 so as to have a predetermined film thickness.

  Resin vapor generated on the inclined plate 114 is drawn toward the vacuum chamber 101 in which the rotary drum 112 is installed, and blown out from the opening 1103 of the resin vapor ejection nozzle 1102 toward the rotary drum 112. . The degree of vacuum in the region where the rotating drum is installed is maintained at about 0.05 Pa, and the pressure in the resin vapor jet nozzle is maintained at about 1 Pa. The support 106 is running on the surface of the rotating drum, and the resin thin film is sprayed from the resin vapor jet nozzle to form the resin thin film on the surface of the support. The peripheral speed of the rotating drum rotates at a peripheral speed of about 40 m / min to 100 m / min, and is adjusted according to the required thickness of the resin thin film. Further, the rotating drum is cooled at a temperature of about −10 ° C. to 10 ° C. so that the resin vapor blown from the resin vapor ejection nozzle efficiently forms a resin thin film on the surface of the support.

  The liquid resin thin film formed on the surface of the support is cured to the required hardness by being irradiated with ultraviolet rays from the ultraviolet irradiation device 113. The cured resin is taken up by a take-up roll 109.

FIG. 8 shows the appearance of the resin vapor ejection nozzle 1102. The shape of the opening 1103 is substantially the same as the inside of the resin vapor ejection nozzle 1102.
JP-A-9-310172

  However, in the conventional resin thin film forming method, it is difficult to spray the resin vapor uniformly in the width direction of the support surface. Therefore, it is difficult to form a resin thin film having a uniform thickness in the width direction of the support. The film thickness distribution of the resin thin film tends to be a convex film thickness distribution in which the central part of the support is thickest and the film thickness becomes thinner toward the end.

  Moreover, even if there is no problem under certain conditions of the distribution of the resin film thickness in the width direction, if the required resin film thickness changes, the pressure in the passage through which the resin vapor passes is inevitably The distribution of the amount of blown resin vapor that blows the resin vapor changes with respect to the width direction of the support. Accordingly, since the distribution of the resin vapor blowing amount in the width direction also changes in accordance with the required pressure of the resin vapor at that time, it is difficult to form a uniform resin thin film. Also, when resin vapor is blown onto a support that moves for a long time, pressure fluctuations in the passage of the resin vapor occur, and the distribution amount of the resin vapor changes in the width direction of the support. Even in this case, since it is difficult to form a uniform resin thin film, it is difficult to form a resin thin film for a long time.

  From the above, in the conventional method for forming a resin thin film, the manufacturing conditions such as the resin film thickness are limited, or the manufacturing cannot be performed for a long time, so that the manufacturing cost is increased and the productivity is decreased.

The present invention is the consideration of the conventional problems, and an object thereof is to provide a resin steam jet nozzle capable of suppressing the pressure fluctuation of the resin steam jet, and the resin thin film formation equipment.

Further, the present invention is a resin steam jet nozzle capable of suppressing the fluctuation of film thickness in a given direction, and another object to provide a resin thin film forming equipment.

In order to solve the above problems, the first aspect of the present invention has an opening for ejecting the supplied resin vapor,
Its inner portion and a plurality of partition plates are formed toward the opening,
In the plurality of partition Riita is parallel department direction, at least a portion of the interval between the adjacent partition plate perimeter, wider than at least a portion of the interval between the adjacent partition plate in the central portion, a resin steam jet nozzle It is.
Further, according to a second aspect of the present invention, the partition plate is provided closer to the opening than the resin supply portion of the internal space,
The resin vapor resin flowing in each of the spaces partitioned by the partition plate is the resin vapor ejection nozzle according to the first aspect of the present invention, which is commonly supplied from the resin supply unit.

The third of the present invention, the distance between the opening side of and what neighboring partition plate of said peripheral portion is wider than the distance between the opening side of and what partition plate adjacent said central portion, of the first or second It is the resin vapor | steam ejection nozzle of this invention .

The fourth of the present invention, the spacing of the resin steam supply side and if the adjacent partition plate of said peripheral portion, said wider than the gap of the resin vapor supply side of and what neighboring partition plate in the central portion, according to claim 1 or 2. A resin vapor jet nozzle according to 2 .
The fifth aspect of the present invention is the resin vapor ejection nozzle according to the fourth aspect of the present invention, wherein a length of the partition plate at the central portion is longer than a length of the partition plate at the peripheral portion.

The present invention of a 6, the interval between the respective partition plates, the flow rate of the resin steam jet is an interval to be substantially uniform, a resin steam jet nozzle of one of the present invention the first to fourth.

The seventh aspect of the present invention is the resin vapor jet nozzle according to any one of the first to sixth aspects of the present invention,
And a driving mechanism for driving the support on which the resin vapor is to be deposited.

According to the present invention, a resin steam jet nozzle capable of suppressing the pressure fluctuation of the resin vapors erupt, and it is possible to provide a resin thin film forming equipment.

Further, it is possible to provide, according to the present invention, a resin steam jet nozzle capable of suppressing the fluctuation of film thickness in a given direction, and a resin thin film forming equipment.

(Embodiment 1)
FIG. 1 shows an example of the configuration of a thin film forming apparatus according to the present invention and an invention related to the present invention . The difference between the resin thin film forming apparatus of the present invention and the conventional resin thin film forming apparatus shown in FIG.

  In the resin thin film forming apparatus shown in FIG. 1, the resin vapor generated by the resin vapor ejection nozzle 102 moves to the opening 103 of the resin vapor ejection nozzle due to the pressure difference in the vacuum chamber 101. When the resin vapor moves in the thin film forming apparatus, the resin vapor exhibits a behavior similar to that of the gas, and therefore, friction occurs with the inner wall of the resin vapor ejection nozzle. Due to this piping resistance (conductance), the flow of the resin vapor becomes a flow having a higher moving speed as the distance from the outer wall increases in the resin vapor ejection nozzle. That is, a convex flow having a large flow velocity at the center is formed. This is a factor that makes the film thickness distribution convex. Therefore, the flow of the resin vapor blown from the resin vapor ejection nozzle may be smoothed.

FIG. 2 is a schematic diagram of a resin vapor ejection nozzle in the first embodiment of the invention related to the present invention. In FIG. 2, 204 indicates the width direction of the support body, and 203 indicates the moving direction of the support body. As shown in FIG. 2, by installing a plurality of partition plates 202 in the resin opening, the flow of the resin vapor is rectified and the flow of the resin vapor blown from the resin opening is made uniform. That is, by installing a plurality of partition plates 203, the distribution of the resin flow in the resin vapor jet nozzle is subdivided, so that the dispersion of the resin flow passing through each subdivided region is reduced. Therefore, since the steam with little variation in the distribution of the resin flow is blown out from the respective subdivided regions, a resin thin film having a uniform film thickness can be formed on the support. Here, when the length of the partition plate 202 is substantially 30% or more with respect to the length of the resin vapor ejection nozzle 201 (dimension in the direction in which the resin vapor proceeds), even when the film thickness is changed. Even when the pressure in the resin vapor jet nozzle fluctuates and the distribution of the resin flow changes, the flow of the resin vapor is smoothed by the rectifying effect by the partition plate 203, so that the resin thin film having a uniform film thickness Can be formed on the support.

Example 1
The length of the resin vapor ejection nozzle 102 according to the first embodiment of the invention related to the present invention was changed to confirm the influence due to the pressure fluctuation of the resin vapor. For example the length of the resin steam jet nozzle 102 and 5000 mm, the dimensions of the opening 103 when the 300 mm × 300 mm, a partition plate 2 02 when changing the ratio of the total length of the resin steam jet nozzle 102 of the length of the Evaluation of film uniformity (with respect to a width of 200 mm in the width direction of the resin thin film) is shown in (Table 1).

  As can be seen from (Table 1), by setting the length of each partition plate to 30% or more of the total length, the film thickness can be formed relatively uniform even if the pressure fluctuates. all right.

(Embodiment 2)
3A to 3C are cross-sectional views of the resin vapor ejection nozzle 102 according to the second embodiment of the present invention as viewed from the vertical direction of the support, where 204 is the width direction of the support and the direction perpendicular to the paper surface is as shown in FIGS. It is a moving direction of a support body. As shown in FIGS. 3A to 3C, the thickness of the support in the width direction can be made uniform by adjusting the interval between the partition plates. That is, the interval between the partition plates 202 in the peripheral portion is made wider than the interval between the partition plates 202 in the central portion . At this time, as shown in FIG. 3 (a), the entire interval of the partition plate 202 may be adjusted as described above, or as shown in FIG. You may adjust the space | interval of the partition plate 202 in the opening part 103 side of the partition plate 202 by changing an angle. Further, as shown in FIG. 3C, the interval on the resin vapor supply side of the partition plate 202 may be adjusted. As described above, by adjusting the interval between the partition plates 202, the resin vapor is less likely to flow between the partition plates 202 in the central portion because the conductance is relatively low, and between the partition plates 202 in the peripheral portion, Since the conductance is relatively high, resin vapor easily flows. As a result, a uniform resin thin film can be formed in the width direction of the support.

  That is, by changing the interval between the partition plates 202, the smoothing of the resin flow distribution can be further adjusted in the width direction, so that the uniformity of the resin flow blown out from the resin opening is further improved. In order to smooth the convex flow with a large resin vapor at the center, it is preferable that the interval between the partition plates at the center is narrowed and widened toward the end. The interval between the partition plates is preferably increased by 30% from the center toward the end.

  FIG. 3D is a cross-sectional view showing a case where the length of the partition plate 202 is adjusted instead of adjusting the interval between the partition plates 202. As shown in the figure, by increasing the length of the partition plate 202 at the center and shortening the length of the partition plate 202 at the periphery, the conductance at the center is relatively lowered, and the conductance at the periphery is increased. Can be relatively high. As a result, the flow of the resin vapor passing through the central portion is deteriorated, and the flow of the resin vapor passing through the peripheral portion is improved. A uniform resin thin film can be formed in the width direction of the support.

  That is, the distribution of the flow of the resin vapor flowing through the region subdivided by the partition plates is changed by changing the pipe resistance between the partition plates. That is, by increasing the length of the partition plate at the central portion and shortening it toward the end portion, the resin flow ejected from each region divided by the partition plate is made uniform. Therefore, a resin thin film having a uniform film thickness can be formed on the support surface. It is preferable to extend the length of the partition plate by 30 to 45% from the center to the end.

  FIG. 3E shows a combination of the case of FIG. 3C and the case shown in FIG. 3D, and the same effect can be obtained.

  In this embodiment, when a resin thin film is formed, the thickness of the resin formed on the surface of the support 106 is measured, and based on this measurement result, a system for controlling the interval and length of the partition plates is installed. Further preferred.

  Further, when forming the resin thin film, it is preferable to heat the partition plate with a heating element such as a heater so that the resin does not adhere to the partition plate described above.

(Example 2)
In the resin vapor ejection nozzle 201 shown in Example 1, the uniformity in the width direction was further improved by adopting the shape of the partition plate shown in FIGS. 3 (a), 3 (b), and 3 (e). The results are shown in (Table 2).

(Embodiment 3)
The embodiment of the invention related to the present invention is different from the second embodiment in the form of the opening of the resin vapor jet nozzle. FIG. 4 is a schematic view of a resin vapor ejection nozzle in the second embodiment. In FIG. 4, 204 shows the width direction of a support body, 203 shows the moving direction of a support body.

  As shown in FIG. 4, a plurality of bars 205 to which a plurality of fins 214 are attached are installed in openings through which resin vapor blows. Therefore, the resin flow is disturbed by the fins 214 when the resin vapor is blown out from the opening of the resin vapor by moving through the resin vapor injection nozzle. When the resin flow is disturbed by the fins, the distribution of the resin flow is averaged, and a uniform resin thin film can be formed on the support surface. Even if the amount of resin vapor changes, the resin vapor flow is disturbed by the fins with the resin openings, so that a uniform resin film thickness can be formed under any conditions. it can.

  As for the shape of the fins, any shape such as a cylinder, a prism, or a thin plate that has an effect of disturbing the airflow may be used. Also, the number of bars to which the fins are attached may be set so as to disturb the air flow of the resin flow. In addition, it is better to change the installation interval of the bars in the width direction, that is, in the central part where the resin flow is fast, the installation interval of the bars is shortened and the installation interval is increased as it goes to the end. In addition, the number of fins in the center may be increased to increase the amount of disturbance of the resin vapor flow in the center, or several bars with fins in the center may be installed at the end. You can reduce the number of bars as you go.

  The same effect can be obtained by attaching a bar with a plurality of fans instead of the fin-attached bar. Therefore, you may install the bar which attached the fan similarly to the bar which attached the fin.

  In addition, these bars are preferably heated by attaching a heater so that resin vapor does not adhere.

  In the present embodiment, there may be a structure or obstacle that disturbs the flow of the resin vapor in the opening 103 of the resin vapor ejection nozzle 201. In that case, even if only the central part of the flow of the resin vapor is disturbed, the flow of the resin vapor is made uniform to some extent, so that the same effect as described above can be obtained. Alternatively, the flow is not limited to the central portion, and even in a configuration where the flow in the peripheral portion is disturbed, the same effect can be obtained to some extent. Furthermore, even if the flow of the resin vapor is disturbed in at least a part of the opening 103, the same effect can be obtained to some extent. For example, it is also conceivable that a wire mesh is installed in the opening 103.

  Moreover, the obstacle which disturbs the flow of the above-mentioned resin vapor | steam may be formed not in the opening part 103 of the resin vapor | steam ejection nozzle 201 but in the inside. In that case, the same effect can be obtained.

(Embodiment 4)
The embodiment of the invention related to the present invention is different from that of the second embodiment in the opening 103 of the resin vapor jet nozzle. FIG. 5 is a schematic view of a resin vapor ejection nozzle in the fourth embodiment. In FIG. 5, 204 indicates the width direction of the support body, and 203 indicates the moving direction of the support body.

  As shown in FIG. 5, in the resin vapor opening that blows out the resin vapor from the resin generating portion of the resin vapor injection nozzle, the passage cross-sectional area through which the resin vapor passes is narrowed toward the opening. It is preferable to narrow the cross-sectional area 206 at the opening by 45 to 30% with respect to the resin introduction portion. Since the cross-sectional area of the path through which the resin vapor passes is reduced, the pressure due to the resin vapor increases, and accordingly, the distribution of the resin flow is smoothed. Therefore, since the distribution of the resin vapor blown out from the resin opening to the support is uniform, a resin thin film having a uniform thickness is formed on the support.

  The passage cross-sectional area is not gradually narrowed in the opening 103, but may be suddenly narrowed. That is, the same effect can be obtained if the opening area in the opening 103 is smaller than the passage cross-sectional area.

Example 4
The results obtained by using the resin vapor ejection nozzle 201 of the present embodiment are shown in (Table 3).

From Table 3, it was found that a uniform film can be formed as the pressure of the resin vapor increases, that is, as the opening area of the opening 103 is reduced as compared with the cross-sectional area of the passage.

(Embodiment 5)
FIG. 6 shows the appearance of the resin vapor injection nozzle 201 according to the fifth embodiment of the invention related to the present invention. In the resin vapor injection nozzle 201 of the present embodiment, the honeycomb structure 207 is installed in the opening 103 at the opening 103 as shown in FIG. By passing the resin vapor through the honeycomb structure 207, the resin flow is subdivided into fine holes, and the internal pressure of the resin vapor is increased due to the piping resistance together with the rectifying effect described in the first embodiment. An effect equivalent to that of narrowing the portion is caused, and a resin having a substantially uniform flow velocity is ejected from each of the holes of the honeycomb to form a resin thin film having a uniform film thickness on the support. In the honeycomb structure, for example, a honeycomb having a size of 3 mm square to 10 mm square and a length of 10 mm to 50 mm is preferable. However, the shape of the opening is not a honeycomb, but may be a lattice shape or other polygonal shapes. However, it is preferably finely divided into 1000 or more. If the apertures are subdivided to this extent, the flow rate of the resin vapor passing through the inside of each aperture can be made substantially uniform.

  In the above description of the embodiment, the resin vapor ejection nozzle 201 may have a structure in which a plurality of the previously described Embodiments 1 to 5 are arbitrarily selected and combined. By properly combining the features of each embodiment, the thickness of the resin thin film formed on the support can be made even more uniform. For example, by combining the resin vapor ejection nozzle 201 of the first embodiment with any of the second to fifth embodiments, the influence of the pressure fluctuation of the resin vapor can be suppressed and the width of the support 106 can be reduced. The thickness of the resin thin film can be made more uniform.

Also includes a resin steam jetting nozzle 201 of the first to fifth embodiments of the invention relating to the present invention and the present invention described so far, also include resin thin film forming apparatus in the scope of the invention relating to the present invention and the present invention.

Further, a method of forming a resin thin film using a vapor resin thin film forming apparatus is also included in the scope of the present invention and the invention related to the present invention .

According to the present invention, a resin steam jet nozzles, and according to the resin thin film formation equipment, it is possible to suppress the pressure fluctuation of the resin vapors erupt, or, according to the present invention, variation in thickness in a predetermined direction It can be used for electronic parts such as capacitors, circuit board manufacturing apparatuses, and the like.

The figure which shows the structure of the resin thin film forming apparatus of this invention and invention related to this invention External view of resin vapor injection nozzle in Embodiment 1 of the invention related to the present invention (A) Sectional view when the interval between the partition plates in the second embodiment of the present invention is changed (b) Sectional view when the interval between the partition plates in the second embodiment of the present invention is changed (c) Sectional view when the length of the partition plate in the second embodiment is changed (d) Sectional view when the length of the partition plate in the second embodiment of the invention related to the present invention is changed (e) Sectional drawing at the time of changing the length and space | interval of the partition plate in Embodiment 2 External view of resin vapor injection nozzle in Embodiment 3 of the invention related to the present invention External view of resin vapor injection nozzle in embodiment 4 of invention related to this invention External view when a honeycomb is installed in the opening according to the fifth embodiment of the invention related to the present invention The figure which shows the structure of the resin thin film formation apparatus of a prior art Perspective view of prior art resin vapor jet nozzle

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Vacuum chamber 102 Resin vapor | steam ejection nozzle 103 Resin vapor | steam blowing opening part 104 Rotating direction 105 Unwinding roll 106 Strip-shaped resin thin film support 107 Unwinding side guide roll 108 Winding side guide roll 109 Winding roll 110 Rotating direction 111 Rotating drum Rotating direction 112 Rotating drum 113 UV irradiation device 114 Inclined plate 115 Inclined plate heater 116 Liquid resin supply pipe 117 Liquid resin supply valve 118 Vacuum pump 201 Resin vapor jet nozzle 202 Partition plate 203 Support body moving direction 204 Support body width direction 205 Bar with fin 206 Resin opening 207 Honeycomb structure 208 Resin opening 209 Gap length between resin blowing opening and support 210 Partition 211 Resin vapor supply pipe 212 Shower plate 13 through hole 214 fin

Claims (7)

Having an opening for ejecting the supplied resin vapor;
Its inner portion and a plurality of partition plates are formed toward the opening,
In the plurality of partition Riita is parallel department direction, at least a portion of the interval between the adjacent partition plate perimeter, wider than at least a portion of the interval between the adjacent partition plate in the central portion, a resin steam jet nozzle .   The partition plate is provided closer to the opening than the resin supply portion of the internal space,
  The resin vapor jet nozzle according to claim 1, wherein the resin vapor resin flowing in each of the spaces partitioned by the partition plate is commonly supplied from the resin supply unit. Wherein the distance between the opening side of and what neighboring partition plate periphery, the wider than the distance between the opening side of and what neighboring partition plate in the central portion, a resin steam jetting nozzle according to claim 1 or 2 . Spacing resin steam supply side and if the adjacent partition plate of said peripheral portion is wider than the spacing of the resin vapor supply side of and what partition plate adjacent said central portion, a resin steam injection according to claim 1 or 2 nozzle.   The resin vapor jet nozzle according to claim 4, wherein a length of the partition plate in the central portion is longer than a length of the partition plate in the peripheral portion. The interval between the partition plates is a resin vapor ejection nozzle according to any one of claims 1 to 4 , wherein the flow velocity of the resin vapor to be ejected is substantially uniform. Resin vapor ejection nozzle according to any one of claims 1 to 6 ,
And a drive mechanism for driving the support on which the resin vapor is to be deposited.

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