JP4459078B2 - Cable assembly, connector and manufacturing method thereof - Google Patents

Description

The present invention relates to a cable assembly and a connector for facilitating connection of a plurality of coaxial cables to a connector, and a method of manufacturing the same.

  Many proposals have been made for terminal processing for connection to a connector terminal of a fine coaxial cable that performs high-speed communication.

  For example, Patent Document 1 discloses a method for processing a terminal end of a coaxial cable body formed by aligning a plurality of coaxial cables. However, in the method of Patent Document 1, it is necessary to fix the tip with a fixing member such as an adhesive tape each time the outer sheath, the shield, and the insulator are removed at one end of the cable bundle cut. The process is complicated, and in addition, there is no disclosure of means for aligning the exposed portion of the core wire of the cable constituting the cable bundle laminate with the substrate.

  Patent Document 2 discloses a method of manufacturing an electric wire processed product including a step of collectively removing a shield of a plurality of cables positioned at an end of the electric wire processed product including a plurality of coaxial cables. However, in the method of Patent Document 2, it is essential that the exposed shield is sandwiched between two sets of ground bars, and the shield is mechanically cut by bending the cable in the vertical direction around the boundary between the ground bars. Therefore, if the shield cannot be cut with high accuracy and the tip of the shield protrudes beyond the tip of the ground bar, the soldering solder that is performed after that will be transmitted to the outside of the ground bar easily. May cause poor contact.

  In addition, in any of the above methods, since there are a plurality of steps of pulling the end of the cable before the final process, it is difficult to strip the cable while keeping the cable pitch accurately constant until the final process. It is not possible to produce a cable assembly with a constant pitch.

For this reason, each of these terminal processing methods and formed cable assemblies have their merits and demerits, but all of them require a considerable number of steps in the manufacturing process and have various problems.
JP 2001-84850 A JP 10-144145 A

The object of the present invention is to solve the above-mentioned problems, and can process the end portions of the cables constituting the fine cable bundle with high accuracy while eliminating waste of processes and preventing the generation of defective products as much as possible. ,
In particular, a cable assembly manufacturing method that enables stripping while keeping the cable pitch exactly constant until the final process, and that can obtain a cable assembly that keeps the cable pitch constant, and manufactured using this method. Soldering between the cable assembly and the ground bar and the substrate that maintains the connection state between the exposed portion of the cable core wire and the substrate and between the exposed portion of the cable shield and the cable assembly in a state where the front ends of the cables of the cable assembly are aligned. It is an object of the present invention to provide a connector manufacturing method that can be performed with high accuracy and a connector manufactured by using this method.

  In the present invention, in order to enable the manufacture of a cable assembly in which a large number of, for example, 10 to 60, small-diameter coaxial cables are maintained at a predetermined pitch until they are connected to the next board, The objective is achieved by sequentially performing each step.

In order to achieve the above object, a method for manufacturing a cable assembly according to the present invention comprises a core wire, an insulator covering the core wire, a shield covering the insulator, and one or more cables provided with a sheath covering the shield. a method of manufacturing a cable assembly manufactured using the cable bundle comprising, from said upper and lower surfaces of the cable bundle while maintaining the parallel arrangement of cables, at least both end portions coated cable bundle laminate comprising at laminate layer of the cable bundle The first step of fixing and juxtaposing the sheath to the coating removal tray, and irradiating both sides of the juxtaposed cable bundle laminate with a short wavelength laser of 10.6 μm or less, the first slits are formed on the laminate layer of the cable bundle laminate and the outer sheath of the cable A second step of inserting a short wavelength laser of 1.064 μm or less into the first slit. Irradiate the third step of putting the second slit in the shield of the cable constituting the cable bundle laminate, and both ends of the cable bundle laminate constituted by the cable having the first and second slits The cable bundle is laminated on the part where the insulation is exposed by a predetermined amount, and the fourth step of exposing the insulation of the cable by a predetermined amount by pulling the shield so that the shield moves by a predetermined amount in the extending direction of the cable bundle. And a fifth step of sequentially irradiating a short wavelength laser of 10.6 μm or less from both sides of the wire and inserting a third slit in the cable insulator to expose a predetermined amount of the core wire of the cable (first invention) ).

In addition, the above method includes (1) leaving an extra outer cover etc. to keep the cable pitch until the final step, and (2) exposing the insulation of the cable exposed in the fourth step. Providing a notch for cutting the core wire in the exposed portion of the cable core exposed in the fifth step, or (3) positioning means for fixing and juxtaposing the cable bundle laminate on the coating removal tray, At least two or more locking portions are provided in the laminate portion where no cable exists, and an engagement portion that engages with the locking portion is disposed on the coating removal tray. (4) As the locking portion, the cable bundle laminate is a laminate portion where no cable exists, and is less between the exposed portions of the cable core wire. Also provided two or more holes or notch, placing the projection to enter the locking portion to the coating removal tray, (5) the notch, after the fourth or fifth step, the exposed portion ( 6 ) A gas for the purpose of preventing surface oxidation or removing dust at the same time as the second, third and / or fifth steps, by irradiating with a laser beam having a wavelength of 1.064 μm or less from the vertical direction. It is more preferable to supply and / or use a CO ₂ laser as the laser in the ( 7 ) second and fifth steps and a YAG laser as the laser in the third step.

  The cable assembly according to the present invention is manufactured by any of the methods described above (second invention).

A method of manufacturing a connector according to the present invention is manufactured using a cable bundle in which one or more cables including a core wire, an insulator that covers the core wire, a shield that covers the insulator, and an outer skin that covers the shield are arranged in parallel. A cable assembly; a board connecting an exposed core part of the cable constituting the cable assembly; and a ground bar connected to the board while maintaining a contact state between the exposed shield part of the cable. the method of manufacturing a connector, the upper and lower surfaces of the cable bundle while maintaining the parallel arrangement of the cable, fixed juxtaposed the cable bundle laminate formed by coating with a laminate layer of at least both ends of the cable bundle to the coating removal tray, the Irradiate both sides of the cable bundle laminate with a short wavelength laser of 10.6 μm or less to A first slit is put in the laminate layer of the bundle laminate and the outer sheath of the cable, and a short wavelength laser of 1.064 μm or less is irradiated into the first slit, and a second slit is put in the shield of the cable constituting the cable bundle laminate. Insulation of the cable by pulling both ends of the cable bundle laminate composed of the cable having the first and second slits so that the outer sheath and shield of the cable are separated and moved by a predetermined amount in the extending direction of the cable bundle. The body is exposed by a predetermined amount, and the portion where the insulator is exposed by a predetermined amount is irradiated with a short wavelength laser of 10.6 μm or less from both sides of the cable bundle laminate, and a third slit is made in the cable insulator. The process of manufacturing the cable assembly by exposing a predetermined amount of the core wire of the cable, and a plurality of substrates After the strip-like substrate arrangement plate arranged in the above is fixedly juxtaposed on the printing tray, the step of applying solder to the predetermined portion of the substrate is performed separately, and then the substrate is heated. On a base member having heating means, a pair of alignment means positioned corresponding to the exposed core portion of the cable constituting the cable assembly, and a ground bar positioned corresponding to the shield exposed portion of the cable constituting the cable assembly Then, the covering removal tray on which the cable assembly is juxtaposed is placed so that the exposed portion of the core of the cable is aligned by the aligning means, and the ground bar is positioned and brought into contact with the exposed portion of the cable shield and the predetermined soldered portion of the board. And the exposed portion of the core wire of the cable constituting the cable assembly on the coating removal tray is on the printing tray. The printing tray is turned over with the substrate mounting plate held so as to be in contact with the predetermined solder application portion of the substrate, and the printing tray is placed on the coating removal tray. And a step of performing soldering between the ground bar and the substrate maintaining a connection state between the core wire exposed portion of the cable constituting the cable assembly and the substrate, and the shield exposed portion of the cable by heating with the heating means. (The third invention).

  In addition, the alignment means is positioned adjacent to the core line alignment member, the core line alignment member having a plurality of core line alignment grooves arranged at predetermined intervals to align the exposed portions of the core line of the cable, and insulated the cable. An insulator alignment member provided with a plurality of insulator alignment grooves arranged at equal intervals to the core line alignment groove for aligning the body exposure portions, and a shield exposed portion of the cable positioned adjacent to the insulator alignment members; It is more preferable to provide a ground bar mounting member having a step-down portion having a height dimension such that is mounted on the ground bar.

  The connector according to the present invention is manufactured by any one of the methods described above (fourth invention).

The manufacturing method of the cable assembly of the present invention can perform the end processing of the cables constituting the fine cable bundle with high accuracy while eliminating waste of processes and preventing the generation of defective products as much as possible. It is possible to peel off the coating while keeping the cable pitch exactly constant until the process, and it is possible to obtain a cable assembly in which the cable pitch is kept constant.
Further, the connector manufacturing method of the present invention uses the cable assembly obtained by the above method, and the cable core wire exposed portion and the board, and the shield exposed portion of the cable with the cable tip aligned. Soldering between the ground bar maintaining the connected state and the substrate can be performed with high accuracy.

In the description of the present invention, an example of the coaxial cable used will be described with reference to FIG. 4 for easy understanding.
FIG. 4 is an enlarged view showing a cross section of the cable 1. The figure shows, for example, the approximate dimensions of AWG42.
The symbol cc in the figure is a seven-stranded core wire (center conductor) having a 0.025 mm outer diameter, and its outer diameter is about 0.075 mm.
The symbol in in the drawing is an insulator having a thickness of 0.045 mm covering the outside of the core wire, and its outer diameter is 0.165 mm.
The symbol sh in the figure is a shield (outer conductor) having a thickness of about 0.03 mm covering the outside of the insulator, and its outer diameter is 0.225 mm.
Reference sign out in the figure is an outer skin made of an insulating material having a thickness of about 0.033 mm covering the outside of the shield, and its outer diameter, that is, the outer diameter of the coaxial cable is about 0.290 mm (hereinafter referred to as “0”). .3 mm ").

  Prior to the description of the cable assembly, the laminate manufacturing for laminating the cable bundle will be described with reference to FIG.

  FIG. 1 is a schematic diagram showing a manufacturing process of a cable bundle laminate used when manufacturing a cable assembly composed of a large number of # 42 cables (outer diameter φ = 0.3 mm). Here, although the case where the cable bundle is composed of 30 cables will be described, it is generally preferable that the cable bundle is composed of 10 to 60 cables. In the present invention, the number of cables constituting the cable bundle is as follows. There is no particular limitation.

  A cable bundle of 30 cables 1 fed from a required number, for example, 30 cable bobbins 10 arranged in parallel (only one cable bobbin is shown in FIG. 1) in a parallel arrangement (parallel arrangement) without a gap. In order to apply a laminate layer 14 such as a laminate tape (adhesive tape) to at least both ends of both ends of the cable bundle 12 in FIG. 1, the processing roller 16 is pressed by the pressing portion 18 so that the air in the tape is released. In the pressed state, the cable bundle 12 is advanced along the direction of the arrow A, and then the outer laminate without the cable of the laminate layer 14 as shown by 30 by the pilot hole punch 20 and the punch receiving die 22. In FIG. 1, a total of four through-holes (for example, a pair of holes) are provided between the exposed portions of the cable cores to be described later. Puncturing the lot holes) 32, then fixed-length cutting cutter 26 at a predetermined length L, a cut, for example, about 50 to 200 mm, to obtain a cable bundle laminate 30 is laminated with the cable bundle.

  In addition, since the said through-hole 32 is formed in order to comprise the latching | locking part for fixing to the coating removal tray mentioned later, the shape of the through-hole 32 is an elliptical shape as shown in FIG. In addition, any shape such as a circle and a rectangle can be adopted. Moreover, what is necessary is just to comprise the said latching | locking part instead of the said through-hole 32, for example, a notch part may be sufficient.

  FIG. 2 is an apparatus having the same configuration as that of FIG. 1 except that the bobbin for feeding the laminate layer is disposed at a position orthogonal to the traveling direction of the cable bundle 12. The apparatus of FIG. 2 is particularly preferable for laminating only both ends of the cable bundle 12 from the viewpoint of equipment. The resulting cable bundle laminate is indicated by 30 '. The details are almost the same as in FIG.

As another means for covering only both ends of the cable bundle with the laminate layer 14, for example, as shown in FIG. 2, while cutting the laminate layer 14 at a predetermined interval in the extending direction of the cable bundle. In addition to the feeding method, the laminate layer 14 is fed in a direction perpendicular to the feeding direction of the laminate layer 14 in FIG. 2 (direction perpendicular to the paper surface in FIG. 2), or as shown in FIG. 2 is fed in the same direction as the feeding direction of the laminate layer 14 in FIG. 2 and bonded to both sides of the cable bundle, and then the laminate portion where the cable bundle does not exist is cut off. And the like.
The laminate layer 14 is usually a resin tape coated with an adhesive, but may be a laminated paper coated with an adhesive on both the upper and lower sides (both sides of the cable bundle), or only one of the laminate layers is a paper tape or metal. A foil tape is also possible.

Next, the process of removing a plurality of cable bundle laminates 30 with high accuracy and efficiency will be sequentially described.
FIG. 3 is an explanatory view showing a situation in which the plurality of cable bundle laminates 30 described above are fixedly juxtaposed on the coating removal tray 40 and sequential steps are performed.

The coating removal tray 40 is preferably made of a material such as an aluminum material or a glass epoxy material, and has a sheet shape with a thickness of 1.0 to 1.6 mm. This is a member used to manufacture a cable assembly by fixing and laminating the laminates 30 and processing the ends thereof. The cable 30 is fitted to the through-holes 32 corresponding to the number of the cable bundle laminates 30. Protrusions such as positioning pins 42 for fixing the position of the laminate 30 are provided. As shown in (1), the cable bundle laminate 30 is fitted and fixedly juxtaposed (mounted) as a first step. Thus, the subsequent end processing of the cable bundle laminate 30 can be accurately processed.
In addition, each number of (1)-(5) in FIG. 3 shows a sequential process. Hereinafter, it demonstrates in order of each process.

In the next second step (2), the both sides of the cable bundle laminate 30 arranged side by side are irradiated with a laser, preferably a short wavelength laser of 10.6 μm or less with a CO ₂ laser, and the laminate layer of the cable bundle laminate and The first slit 50 is made in the outer sheath of the cable. This is because when the laser wavelength is longer than 10.6 μm, the laser beam is separated from the absorption wavelength band of the laminate layer and the cable sheath, and thus there is a problem that a larger laser light intensity is required. Note that the preferred range of the laser wavelength is preferably 0.193 μm (so-called excimer laser wavelength) or more when laser ablation processing (for example, processing by an ultraviolet laser) is applied, but thermal processing by laser is preferable. When applied, the workpiece has a higher wavelength absorptivity and the apparatus is less expensive. In this case, the laser wavelength is preferably in the range of 9.0 to 10.6 μm.
A suitable width of the first slit 50 is in the range of 0.5 to 1 mm. In addition, the schematic diagram shown to the upper side of each process (2)-(4) in FIG. 3 expands and shows the processing state of only the upper edge part of each cable bundle laminate 30, 50 in the figure Indicates the position of the slit.

  In the next third step (3), both sides of the cable bundle laminate 30 are also shorter than the laser wavelength in the second step (2) by a laser, preferably a YAG laser, in the first slit 50. Irradiate a short wavelength laser of 1.064 μm or less, and put the second slit 52 in the shield of the cable. This is because when the laser wavelength is longer than 1.064 μm, the laser beam is separated from the absorption wavelength band of the cable shield, so that there is a problem that a higher laser light intensity is required. The lower limit of the laser wavelength is preferably 0.38 μm (so-called visible light laser wavelength) or more. The preferred width of the second slit 52 is in the range of 30-100 μm.

  In the next fourth step (4), both ends of the cable bundle laminate 30 composed of the cable including the first slit 50 and the second slit 52 are connected to the cable sheath out and the shield sh. Pulling is performed so as to separate and move by a predetermined amount in the direction, preferably in the range of 1 to 3 mm, and the cable insulator in is partially exposed as indicated by 54.

In the fifth step (5), the insulator portion 54 exposed by a predetermined amount is irradiated with a laser, preferably a CO ₂ laser, at a short wavelength of 10.6 μm or less from both sides of the cable bundle laminate 30. As shown at 56, a third slit having a predetermined length, preferably 1 to 5 mm, is inserted to expose the cable core cc. This is because when the laser wavelength is longer than 10.6 μm, the laser beam is separated from the absorption wavelength band of the cable core wire, so that there is a problem that a larger laser light intensity is required. Note that the preferred range of the laser wavelength is preferably 0.193 μm (so-called excimer laser wavelength) or more when laser ablation processing (for example, processing by an ultraviolet laser) is applied, but thermal processing by laser is preferable. When applied, the workpiece has a higher wavelength absorptivity and the apparatus is less expensive. In this case, the laser wavelength is preferably in the range of 9.0 to 10.6 μm. Moreover, the suitable width | variety of the 3rd slit 56 is the range of 3-100 micrometers.

  Thus, the cable assembly 58 can be manufactured by sequentially performing the first to fifth steps.

  Further, as another embodiment, it is preferable to leave an extra outer skin or the like in order to prevent the cable pitch from being lost until the final process (specifically, the soldering process).

  As a means for removing the excess core wire portion, for example, a notch for cutting the core wire is preferably provided, and in addition, the notch is provided in the insulator exposed portion or the core wire exposed portion after the fourth or fifth step. More preferably, it is formed by irradiating a laser beam having a wavelength of 1.064 μm or less from the vertical direction.

  As positioning means for fixing and juxtaposing the cable bundle laminate to the coating removal tray, for example, at least two locking portions are provided in the laminate portion where the cable of the cable bundle lamination does not exist, and the locking removal tray is configured to perform the locking. There is a method in which an engaging part that engages with the part is arranged and positioned by engaging the engaging part and the engaging part.

  Furthermore, after the second and / or fifth step, it is preferable to perform a surface brushing step and remove the thin film in order to improve the wettability of the solder.

  Furthermore, it is preferable to supply a gas for the purpose of preventing surface oxidation or removing dust simultaneously with the second, third and / or fifth steps. This is because prevention of surface oxidation improves the ease of soldering, and removal of dust leads to improved performance (prevention of defects) after soldering.

  Next, a method for manufacturing a connector using the cable assembly 58 manufactured by the above method will be described.

  The connector manufacturing method of the present invention fixes the above-described cable assembly manufacturing process, and a strip-like substrate arrangement plate 62 in which a plurality of substrates 60 are arranged at predetermined intervals on a printing tray 64. After the juxtaposition, the step of applying solder to the predetermined portion of the substrate 60 (solder application step) is performed separately.

6A to 6D are views for explaining the flow of the solder application process.
For example, a plurality of substrate arrangement plates 62 in a strip-like sheet (base material) made of an insulating material such as a glass epoxy material or a polyimide material, a total of 10 in 5 × 2 rows in FIG. For example, a substrate 60 such as a flexible printed circuit board (FPC) is impregnated (arranged) at a predetermined interval, and a plurality of these substrate arrangement plates 62, three in FIG. The case where the board | substrate arrangement | positioning plate 62 is fixed juxtaposed on 64 is shown. As positioning means for fixing and juxtaposing the substrate arrangement plate 62 on the printing tray 64, for example, at least one through-hole at each end of the substrate arrangement plate 62, two in each case in FIG. In some cases, through holes 66 are provided and protrusions 68 such as pins are provided on the printing tray 64 in order to engage with the through holes 66.
The printing tray 64 preferably has a structure that can be fixed to a flat plate such as an adhesive rubber, for example, from the viewpoint of workability.
Then, after the substrate arrangement plate 62 is fixed and juxtaposed on the printing tray 64, as shown in FIGS. 6C and 11, a predetermined portion of the substrate 60, specifically, at least the later-described cable exposure is exposed. Solder is applied to a portion 70 (black portion in FIG. 11) of the substrate connecting the core wire portion and the ground bar.

  After that, as shown in FIG. 7, a heating means 72 for heating the substrate 60, a pair of alignment means 76 positioned corresponding to the exposed portion 74 of the cable core constituting the cable assembly, and a cable assembly are formed. On the base member 82 having the ground bar 80 positioned corresponding to the shield exposed portion 78 of the cable, the sheath removing tray 40 in which the cable assembly is juxtaposed is aligned by the alignment means 76 described later. At the same time, the ground bar 80 is placed so as to be in positioning contact with the shield exposed portion 78 of the cable and the predetermined solder coating portion 70 of the substrate 60.

  As the aligning means 76, for example, as shown in FIGS. 8 and 9, a plurality of core wire alignment grooves 84 arranged at a predetermined interval, preferably within a range of 0.3 mm, for aligning the core wire exposed portions 74 of the cable. The provided core wire aligning member 86 and a plurality of insulator aligning grooves 90 positioned adjacent to the core wire aligning member 86 and disposed at equal intervals with the core wire aligning groove 84 for aligning the exposed insulator portion 88 of the cable. And a ground portion having a stepped portion 94 which is positioned adjacent to the insulator alignment member 92 and has a height dimension such that the shield exposed portion 78 of the cable rests on the ground bar 80. It is preferable to configure with a bar mounting member 96. The alignment means shown in FIGS. 8 and 9 shows the case where the insulator alignment member 92 and the ground bar mounting member 96 are integrally formed, but these may be formed as separate members.

  The alignment means 76 is provided on both sides of the substrate 60, and the core wire exposure formed on both ends of the cable constituting the cable bundle laminate in the core wire alignment groove 84 and the insulator alignment groove 90 of the pair of alignment means 76, respectively. The portion and the exposed portion of the insulator are accommodated under a predetermined tension, and the ground bar 80 is placed on the stepped-down portion 94 so that the shield exposed portion 78 of the cable is in contact with the ground bar 80.

  Next, the substrate arrangement plate 62 is held so that the exposed portion of the core wire of the cable constituting the cable assembly 58 on the coating removal tray 40 is positioned and brought into contact with a predetermined solder application portion of the substrate 60 on the printing tray 64. In this state, the printing tray 64 is turned over, and the printing tray 64 is placed on the coating removal tray 40 positioned on the base member 82. FIG. 10 shows this mounting state in a cross-sectional view. As positioning means when the printing tray 64 is placed on the coating removal tray 40, for example, as shown in FIG. 10A, protrusions 98 such as pins are provided at the four corners of the base member 82. The through holes 100 corresponding to the protrusions 98 may be provided at the four corners of the printing tray 64 and the protrusions 98 may be inserted into the through holes 100 for positioning.

  Then, the printing tray 64 is placed on the coating removal tray 40, and the printing tray 64 is pressed against the coating removal tray 40 with a predetermined pressure by fastening parts such as screws and clamps. By heating a member such as the substrate 60 positioned at a predetermined temperature, preferably a temperature equal to or higher than the melting point of the solder, by the heating means 72 provided on the base member 82, the solder applied to the predetermined portion of the substrate 60 is melted. Then, soldering may be performed between the core bar exposed portion 74 of the cable 1 constituting the cable assembly 58 and the substrate 60 and between the ground bar 80 and the substrate 60 maintaining the connection state between the shield exposed portion 78 of the cable 1. Thus, the connector of the present invention is manufactured.

  11 shows a typical substrate 60, FIGS. 12 (a) to 12 (c) show ground bars, and FIGS. 13 (a) to 13 (c) solder-connect one end of the cable constituting the cable bundle laminate to the substrate. FIG. 14 is a cross-sectional view taken along line AA shown in FIG.

  The above description is merely an example of the embodiment of the present invention, and various modifications can be made within the scope of the claims.

The manufacturing method of the cable assembly of the present invention can perform the end processing of the cables constituting the fine cable bundle with high accuracy while eliminating waste of processes and preventing the generation of defective products as much as possible. It is possible to peel off the coating while keeping the cable pitch exactly constant until the process, and it is possible to obtain a cable assembly in which the cable pitch is kept constant.
Further, the connector manufacturing method of the present invention uses the cable assembly obtained by the above method, and the cable core wire exposed portion and the board, and the shield exposed portion of the cable with the cable tip aligned. Soldering between the ground bar maintaining the connected state and the substrate can be performed with high accuracy.

6 is a schematic diagram showing a process of manufacturing a cable bundle laminate by covering a predetermined number of cable bundles with a laminate layer. FIG. 2 is a schematic view of an apparatus suitable for laminating only the ends of a cable bundle in the modification of FIG. 1. 2 is a schematic view for explaining a coating removal apparatus for further processing a cable bundle laminate to obtain a required cable assembly, and each process thereof; It is sectional drawing which shows the structural example of a cable for understanding of this invention. It is a top view which shows an example of the lamination tape used when laminating only to the both ends of a cable bundle. (A)-(c) is a figure explaining the flow of a solder application | coating process. It is a figure which shows the state which mounted the coating removal tray in which the cable assembly was juxtaposed on the base member, (a) is a top view, (b) is sectional drawing. It is a top view which shows typical alignment means (alignment member). It is a front view of FIG. The state when the printing tray is placed on the coating removal tray is shown, (a) is a sectional view, (b) is an A arrow view, and (c) is a B arrow view. It is a top view of a typical board | substrate. The shape of a typical ground bar is shown, (a) is a plan view, (b) is a front view, and (c) is a right side view. The state when soldering one end of the cable which comprises a cable assembly to a board | substrate is shown, (a) is a top view, (b) is a front view, (c) is a right view. It is AA sectional drawing shown to Fig.13 (a).

Explanation of symbols

1 Cable 10 Cable bobbin 12 Cable bundle 14 Laminate layer (or laminate tape)
16 Processing roller 18 Press part 20 Pilot hole punch 22 Punch receiving die 26 Standard cutting cutter 30, 30 'Cable bundle lamination 32 Pilot hole 34 Window 40 Cover removal tray 42 Positioning pin 50 First slit 52 Second slit 54 Cable insulation (exposed part)
56 Third slit 58 Cable assembly 60 Substrate 62 Substrate mounting plate 64 Tray for printing 66 Through hole 68 Protrusion 70 Solder coating portion of substrate 72 Heating means 74 Exposed portion of cable core wire 76 Alignment means 78 Exposed portion of cable shield 80 Ground bar 82 Base member 84 Core wire alignment groove 86 Core line alignment member 88 Insulator exposed portion of cable 90 Insulator alignment groove 92 Insulator alignment member 94 Step-down portion 96 Ground bar mounting member 98 Protrusion 100 Through hole

Claims (12)

In a method of manufacturing a cable assembly manufactured using a cable bundle in which one or more cables including a core wire, an insulator covering the core wire, a shield covering the insulator, and a sheath covering the shield are arranged in parallel,
A first step of fixing and juxtaposing a cable bundle laminate formed by covering at least both ends of the cable bundle with a laminate layer from the upper and lower surfaces of the cable bundle maintaining the parallel arrangement state of the cables ;
A second step of irradiating a short-wavelength laser of 10.6 μm or less on both sides of the cable bundle laminate placed side by side to form a first slit in the laminate layer of the cable bundle laminate and the outer sheath of the cable;
A third step of irradiating a short wavelength laser of 1.064 μm or less into the first slit and inserting the second slit into the shield of the cable constituting the cable bundle laminate;
Pulling the both ends of the cable bundle laminate composed of the cable having the first and second slits so that the outer sheath and shield of the cable are separated and moved in the extending direction of the cable bundle, the cable insulator A fourth step of exposing a predetermined amount;
The exposed portion of the insulator is irradiated with a short-wavelength laser of 10.6 μm or less from both sides of the cable bundle laminate, and a third slit is formed in the cable insulator to expose the cable core wire by a predetermined amount. And the fifth step
A method for manufacturing a cable assembly, wherein the steps are sequentially performed.   2. The method of manufacturing a cable assembly according to claim 1, wherein an extra outer sheath or the like is left to keep the cable pitch until the final step. 3. The cable according to claim 1, wherein a notch for cutting a core wire is provided in an insulator exposed portion of the cable exposed in the fourth step or a core wire exposed portion of the cable exposed in the fifth step. Manufacturing method of the assembly.   Positioning means for fixing and juxtaposing the cable bundle laminate to the sheath removal tray is provided with at least two locking portions in the laminate portion where no cable of the cable bundle laminate exists, and the sheath removal tray is engaged with the locking portion. The method of manufacturing a cable assembly according to claim 1, 2 or 3, wherein engaging portions are arranged and positioned by engaging the engaging portions with the engaging portions.   The locking portion is a laminate portion where no cable of the cable bundle laminate exists, and at least two or more through holes or notches are provided between the exposed portions of the core wire of the cable, and the covering removal tray is provided with the locking portion. 5. The method of manufacturing a cable assembly according to claim 4, wherein a projection to be inserted is arranged.   4. The cable assembly according to claim 3, wherein the notch is formed by irradiating the exposed portion with laser light having a wavelength of 1.064 [mu] m or less from the vertical direction after the fourth or fifth step. Method. The method for manufacturing a cable assembly according to any one of claims 1 to 6, wherein a gas for preventing surface oxidation or removing dust is supplied simultaneously with the second, third and / or fifth steps. . Using CO ₂ laser as the laser of the second and the fifth step, the manufacturing method of the cable assembly of any of claims 1-7, characterized by using a YAG laser as the laser of the third step.   The cable assembly manufactured by the method of any one of the said Claims 1-8. A cable assembly manufactured using a cable bundle in which one or more cables including a core wire, an insulator covering the core wire, a shield covering the insulator, and an outer skin covering the shield are arranged in parallel, and the cable assembly are configured In a manufacturing method of a connector having a board connecting the exposed core part of the cable to be connected and a ground bar connected to the board while maintaining a contact state between the exposed shield part of the cable,
From the upper and lower surfaces of the cable bundle maintaining the parallel arrangement state of the cables, the cable bundle laminate formed by covering at least both ends of the cable bundle with a laminate layer is fixedly placed on the coating removal tray,
By irradiating the following short-wavelength laser 10.6μm on both sides of the cable bundle laminate, the laminate layer of the cable bundle laminated and placed first slit outer skin of the cable, a short wavelength less 1.064μm in said first slit A second slit is put in the shield of the cable constituting the cable bundle laminate by irradiating the laser, and both ends of the cable bundle laminate constituted by the cable having the first and second slits are connected to the outer sheath of the cable and the shield. Is pulled apart by a predetermined amount in the extending direction of the cable bundle, exposing the cable insulation by a predetermined amount, and then exposing the predetermined amount of insulation to 10.6 μm from both sides of the cable bundle laminate Irradiate the following short wavelength laser, insert a third slit in the cable insulator, and make the cable core wire a predetermined amount A step of manufacturing a cable assembly by causing exposed,
A strip-shaped substrate arrangement plate formed by arranging a plurality of substrates at a predetermined interval is fixedly arranged on a printing tray, and then a step of applying solder to a predetermined portion of the substrate is performed separately. A heating means for heating the substrate, a pair of alignment means positioned corresponding to the exposed portion of the core wire of the cable constituting the cable assembly, and a ground positioned corresponding to the shield exposed portion of the cable constituting the cable assembly On the base member having the bar, the sheath removing tray on which the cable assembly is juxtaposed is aligned with the exposed portion of the core of the cable by the aligning means, and the ground bar is positioned on the exposed portion of the shield of the cable and the predetermined soldered portion of the board. A step of placing so as to contact;
Turn the printing tray upside down while holding the substrate mounting plate so that the exposed part of the core wire of the cable constituting the cable assembly on the coating removal tray is positioned and brought into contact with the predetermined solder application part of the substrate on the printing tray. Placing the printing tray on the coating removal tray;
Solder between the ground bar and the substrate that maintains the connection state between the exposed portion of the cable core wire and the substrate and the shielded portion of the cable by heating with the heating means in this mounted state. A process of attaching,
A method for manufacturing a connector, comprising: The alignment means includes a core wire alignment member provided with a plurality of core wire alignment grooves arranged at predetermined intervals to align the exposed core wire portions of the cable;
An insulator alignment member provided adjacent to the core wire alignment member and provided with a plurality of insulator alignment grooves arranged at equal intervals with the core wire alignment groove to align the exposed portions of the insulator of the cable;
A ground bar mounting member located adjacent to the insulator alignment member and having a stepped portion with a height dimension such that the shield exposed portion of the cable rests on the ground bar;
A method of manufacturing a connector according to claim 10 comprising: The connector manufactured by the method of Claim 10 or 11 .

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