JP4452477B2 - 歯科用金属部材の表面処理方法および表面処理された歯科用金属部材と歯科用レジンとの接着方法 - Google Patents
歯科用金属部材の表面処理方法および表面処理された歯科用金属部材と歯科用レジンとの接着方法 Download PDFInfo
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- JP4452477B2 JP4452477B2 JP2003356882A JP2003356882A JP4452477B2 JP 4452477 B2 JP4452477 B2 JP 4452477B2 JP 2003356882 A JP2003356882 A JP 2003356882A JP 2003356882 A JP2003356882 A JP 2003356882A JP 4452477 B2 JP4452477 B2 JP 4452477B2
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- 239000002184 metal Substances 0.000 title claims description 79
- 229910052751 metal Inorganic materials 0.000 title claims description 77
- 239000004851 dental resin Substances 0.000 title claims description 40
- 238000000034 method Methods 0.000 title claims description 38
- 238000004381 surface treatment Methods 0.000 title claims description 18
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 24
- 229910052719 titanium Inorganic materials 0.000 claims description 23
- 239000010936 titanium Substances 0.000 claims description 23
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 22
- 238000011282 treatment Methods 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 14
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 12
- 239000012756 surface treatment agent Substances 0.000 claims description 12
- 150000004715 keto acids Chemical class 0.000 claims description 6
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 claims description 4
- 125000001476 phosphono group Chemical group [H]OP(*)(=O)O[H] 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
- -1 thiophosphate ester Chemical class 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 229910019142 PO4 Inorganic materials 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-L Phosphate ion(2-) Chemical compound OP([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-L 0.000 description 5
- 210000000214 mouth Anatomy 0.000 description 5
- 239000010452 phosphate Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000004506 ultrasonic cleaning Methods 0.000 description 3
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- RYYWUUFWQRZTIU-UHFFFAOYSA-N Thiophosphoric acid Chemical group OP(O)(S)=O RYYWUUFWQRZTIU-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 150000001805 chlorine compounds Chemical class 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000003353 gold alloy Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- MALSZWKEDNTSPV-UHFFFAOYSA-N (3-decoxy-3-oxopropyl)phosphonic acid Chemical compound CCCCCCCCCCOC(=O)CCP(O)(O)=O MALSZWKEDNTSPV-UHFFFAOYSA-N 0.000 description 1
- CMGUBCVSWHDCNQ-UHFFFAOYSA-N (3-hexoxy-3-oxopropyl)phosphonic acid Chemical compound CCCCCCOC(=O)CCP(O)(O)=O CMGUBCVSWHDCNQ-UHFFFAOYSA-N 0.000 description 1
- UVMZTDOIPGMKIE-UHFFFAOYSA-N (3-oxo-3-pentoxypropyl)phosphonic acid Chemical compound C(CCCC)OC(CCP(=O)(O)O)=O UVMZTDOIPGMKIE-UHFFFAOYSA-N 0.000 description 1
- AHGTYQCZJJNKAB-UHFFFAOYSA-N 1-[hydroxy-(4-methoxyphenoxy)phosphoryl]oxypropan-2-yl 2-methylprop-2-enoate Chemical compound COC1=CC=C(OP(O)(=O)OCC(C)OC(=O)C(C)=C)C=C1 AHGTYQCZJJNKAB-UHFFFAOYSA-N 0.000 description 1
- CFKBCVIYTWDYRP-UHFFFAOYSA-N 10-phosphonooxydecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCOP(O)(O)=O CFKBCVIYTWDYRP-UHFFFAOYSA-N 0.000 description 1
- NTMDDSQESSRCTM-UHFFFAOYSA-N 10-phosphonooxydecyl prop-2-enoate Chemical compound OP(O)(=O)OCCCCCCCCCCOC(=O)C=C NTMDDSQESSRCTM-UHFFFAOYSA-N 0.000 description 1
- FDRWJYXABUVEJA-UHFFFAOYSA-N 2-[2-bromoethoxy(hydroxy)phosphoryl]oxyethyl prop-2-enoate Chemical compound OP(=O)(OCCBr)OCCOC(=O)C=C FDRWJYXABUVEJA-UHFFFAOYSA-N 0.000 description 1
- KIWRLBQZUHYWJI-UHFFFAOYSA-N 2-[hydroxy(phenoxy)phosphoryl]oxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOP(=O)(O)OC1=CC=CC=C1 KIWRLBQZUHYWJI-UHFFFAOYSA-N 0.000 description 1
- UDXXYUDJOHIIDZ-UHFFFAOYSA-N 2-phosphonooxyethyl prop-2-enoate Chemical compound OP(O)(=O)OCCOC(=O)C=C UDXXYUDJOHIIDZ-UHFFFAOYSA-N 0.000 description 1
- VCGYBVUSUBUHLE-UHFFFAOYSA-N 20-phosphonooxyicosyl prop-2-enoate Chemical compound OP(O)(=O)OCCCCCCCCCCCCCCCCCCCCOC(=O)C=C VCGYBVUSUBUHLE-UHFFFAOYSA-N 0.000 description 1
- SKKXTPQPJYBUEF-UHFFFAOYSA-N 3-phosphonooxypropyl prop-2-enoate Chemical compound OP(O)(=O)OCCCOC(=O)C=C SKKXTPQPJYBUEF-UHFFFAOYSA-N 0.000 description 1
- ZVVXONRZVSRAKL-UHFFFAOYSA-N 4-phosphonooxybutyl prop-2-enoate Chemical compound OP(O)(=O)OCCCCOC(=O)C=C ZVVXONRZVSRAKL-UHFFFAOYSA-N 0.000 description 1
- XXMPXLWBTGYUHO-UHFFFAOYSA-N 5-phosphonooxypentyl prop-2-enoate Chemical compound OP(O)(=O)OCCCCCOC(=O)C=C XXMPXLWBTGYUHO-UHFFFAOYSA-N 0.000 description 1
- UNLGHUTUQNFLSO-UHFFFAOYSA-N 6-phosphonooxyhexyl prop-2-enoate Chemical compound OP(O)(=O)OCCCCCCOC(=O)C=C UNLGHUTUQNFLSO-UHFFFAOYSA-N 0.000 description 1
- MKNWBTWLMCHXPM-UHFFFAOYSA-N 7-phosphonooxyheptyl prop-2-enoate Chemical compound OP(O)(=O)OCCCCCCCOC(=O)C=C MKNWBTWLMCHXPM-UHFFFAOYSA-N 0.000 description 1
- AIXCHNUSQWJDRQ-UHFFFAOYSA-N 8-phosphonooxyoctyl prop-2-enoate Chemical compound OP(O)(=O)OCCCCCCCCOC(=O)C=C AIXCHNUSQWJDRQ-UHFFFAOYSA-N 0.000 description 1
- OUSRYBRPEYVGHG-UHFFFAOYSA-N 9-phosphonooxynonyl prop-2-enoate Chemical compound OP(O)(=O)OCCCCCCCCCOC(=O)C=C OUSRYBRPEYVGHG-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- JNLUAQUERRIFBT-UHFFFAOYSA-N P(=O)(OCCCCCCCCCC)(O)O.C(C=C)(=O)OC(C=C)=O Chemical compound P(=O)(OCCCCCCCCCC)(O)O.C(C=C)(=O)OC(C=C)=O JNLUAQUERRIFBT-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910000756 V alloy Inorganic materials 0.000 description 1
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 description 1
- WCERXPKXJMFQNQ-UHFFFAOYSA-N [Ti].[Ni].[Cu] Chemical compound [Ti].[Ni].[Cu] WCERXPKXJMFQNQ-UHFFFAOYSA-N 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000000560 biocompatible material Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- UMUXBDSQTCDPJZ-UHFFFAOYSA-N chromium titanium Chemical compound [Ti].[Cr] UMUXBDSQTCDPJZ-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-M dihydrogenphosphate Chemical compound OP(O)([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-M 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- NPUSTSBKXOLJIC-UHFFFAOYSA-N phenyl(2-prop-2-enoyloxyethoxy)phosphinic acid Chemical compound C=CC(=O)OCCOP(=O)(C1=CC=CC=C1)O NPUSTSBKXOLJIC-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000003829 resin cement Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 210000004357 third molar Anatomy 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- GFNGCDBZVSLSFT-UHFFFAOYSA-N titanium vanadium Chemical compound [Ti].[V] GFNGCDBZVSLSFT-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Landscapes
- Dental Preparations (AREA)
Description
高温処理を施すことなく、上記歯科用金属部材の表面を0.3〜20.0Nの塩酸を含有する表面処理剤で処理する、
表面処理方法。
(2)上記(1)記載の表面処理方法により表面処理された歯科用金属部材と、歯科用レジンとを、重合反応し得る不飽和結合を有するオキソ酸またはその誘導体からなる接着用化合物を用いて接着させる、接着方法。
(3)上記接着用化合物が、リン酸基またはホスホノ基を有する上記(2)記載の接着方法。
(4)上記接着用化合物を接着前の歯科用レジンに予め含有させる、上記(2)または(3)記載の接着方法。
(5)チタン金属またはチタン合金と、歯科用レジンとを接着してなる歯科用補綴物を製造するための、上記(2)〜(4)のいずれかに記載の接着方法。
本発明の表面処理方法は、歯科用金属部材と歯科用レジンとを接着させるための前処理としての歯科用金属部材の表面処理方法であり、高温処理を施すことなく、歯科用金属部材の表面を特定濃度の塩酸を含有する表面処理剤で処理することを特徴とする。この「表面処理」とは、歯科用金属部材表面の汚染を除去することを意図するものであるが、さらに、歯科用金属部材の表面に対する歯科用レジンの化学的な結合性を向上せしめることも期待される。
本発明で用いる接着用化合物は、重合反応し得る不飽和結合を有するオキソ酸またはその誘導体である。重合反応し得る不飽和結合としてはアクリロイル基、メタクリロイル基、ビニル基、スチレン基における二重結合等が例示される。オキソ酸は、酸素原子を有する酸であり、リン酸、ピロリン酸、チオリン酸、カルボン酸、スルホン酸等が例示される。オキソ酸の「誘導体」としては、オキソ酸のエステル、酸塩化物、塩(アルカリ金属塩、アミン塩等)等が挙げられる。
歯科用金属部材として純チタンを用いて、0.3N塩酸で表面処理をした場合の接着性および適合性を調べた。
縦10mm、横10mm、高さ3mmの純チタン試験片を耐水研磨紙(#600)で研磨後、エタノールで5分間超音波洗浄を行った。その後0.3N塩酸に5分間浸漬し、蒸留水で2〜3秒洗浄してチタン表面の処理を行った。次にアルミナサンドブラストした直径7mmのステンレス棒(SUS304)にリン酸基含有重合性単量体である10−メタクリロイルオキシデシルジハイドロジェンフォスフェートを含有する歯科用レジン(クラレメディカル株式会社、商品名:パナビアフルオロセメント)を盛り上げて、これをチタン片表面に突合せ接着を行った。
実施例1と同様の接着を行った。ただし、チタン表面の処理の際に0.3N塩酸のかわりに、表1記載のものを用いた。なお、比較例1では、エタノールでの超音波洗浄後、塩酸での処理の前に、800℃の電気炉中で10分間高温酸化処理を施した。また、比較例5では、純チタンではなく金合金(金70重量%、銀10重量%、銅14重量%、白金3重量%、パラジウム3重量%;株式会社ジーシー製、キャスティングゴールドタイプIV)を用いた。
上記各実施例、比較例の試料を、接着から1時間後に37℃水中に浸漬し始めて1日経過後の引張接着強度と、更に5℃の冷水中と55℃の温水中に各1分間ずつ浸漬する熱サイクルを20000回負荷させた後の引張接着強度を、それぞれ、万能試験機(インストロン社製)を用いて測定した。測定結果を表1にまとめる。
ラバーベース印象材で抜去した人歯第3大臼歯に形成した窩洞の印象を取得し、この印象に石膏を注入して模型を作製した。この模型をもとに純チタン製の補綴物を作製し、エタノールで5分間超音波洗浄を行った。その後表2記載の処理液に5分間浸漬し、蒸留水で2〜3秒洗浄してチタン表面の処理を行った。こうして得られた補綴物を窩洞へ適合させた。
なお、比較例6では、エタノールでの超音波洗浄後、塩酸での処理の前に、800℃の電気炉中で10分間高温酸化処理を施した。また、比較例10では、純チタンではなく金合金(比較例5で用いたものと同様)を用いた。
上述の適合に際し、微調整が必要ないものを○、微調整が必要なものを×とした。結果を表2にまとめる。
Claims (5)
- チタン金属またはチタン合金からなる歯科用金属部材と、歯科用レジンとを接着させるための前処理としての前記歯科用金属部材の表面処理方法であって、
高温処理を施すことなく、上記歯科用金属部材の表面を0.3〜20.0Nの塩酸を含有する表面処理剤で処理する、
表面処理方法。 - 請求項1記載の表面処理方法により表面処理された歯科用金属部材と、歯科用レジンとを、重合反応し得る不飽和結合を有するオキソ酸またはその誘導体からなる接着用化合物を用いて接着させる、接着方法。
- 上記接着用化合物が、リン酸基またはホスホノ基を有する請求項2記載の接着方法。
- 上記接着用化合物を接着前の歯科用レジンに予め含有させる、請求項2または3記載の接着方法。
- チタン金属またはチタン合金と、歯科用レジンとを接着してなる歯科用補綴物を製造するための、請求項2〜4のいずれかに記載の接着方法。
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JP2003356882A JP4452477B2 (ja) | 2003-10-16 | 2003-10-16 | 歯科用金属部材の表面処理方法および表面処理された歯科用金属部材と歯科用レジンとの接着方法 |
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JP2005120022A JP2005120022A (ja) | 2005-05-12 |
JP2005120022A5 JP2005120022A5 (ja) | 2006-08-24 |
JP4452477B2 true JP4452477B2 (ja) | 2010-04-21 |
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