JP4449797B2 - Electronic components - Google Patents

Description

  The present invention relates to an electronic component including a base and terminal electrodes formed on the surface of the base.

  As a conventional electronic component of this type, for example, there is a multilayer piezoelectric element described in Patent Document 1. In this stacked piezoelectric element, piezoelectric layers in which a plurality of individual electrodes are patterned and piezoelectric layers in which common electrodes are patterned are alternately stacked, and each individual electrode aligned in the stacking direction is They are connected by conductive members through through holes formed in the layers.

In such a laminated piezoelectric element, lead wires for connecting to a driving power source are soldered to each terminal electrode formed on the uppermost piezoelectric layer. Then, by applying a voltage between the predetermined individual electrode and the common electrode via the lead wire, an active portion (a portion where distortion occurs due to the piezoelectric effect) corresponding to the predetermined individual electrode in the piezoelectric layer. Is selectively displaced.
JP 2002-254634 A

  By the way, in the electronic parts such as the laminated piezoelectric element as described above, it is desired to further improve the reliability of connection between the terminal electrode and an external terminal such as a lead wire. For this purpose, the amount of solder for soldering the external terminal to the terminal electrode may be increased. However, if the amount of solder is increased, the solder may protrude from the terminal electrode. In the worst case, for example, adjacent terminal electrodes may be joined to each other by the protruding solder and short-circuited.

  Therefore, the present invention has been made in view of such circumstances, and it is possible to reliably solder an external terminal such as a lead wire to the terminal electrode while preventing the solder from protruding from the terminal electrode. The purpose is to provide electronic components.

  In order to achieve the above object, an electronic component according to the present invention is an electronic component comprising a base and a terminal electrode formed on the surface of the base, the terminal electrode having a first height from the surface of the base. And a second region located at a second height higher than the first height from the surface of the substrate.

  In this electronic component, when soldering an external terminal such as a lead wire to the terminal electrode, if the external terminal is soldered to a second region whose height from the surface of the substrate is higher than the first region, the molten solder Will flow toward the first region. For this reason, in order to improve the reliability of the connection between the terminal electrode and the external terminal, even if the amount of solder for soldering the external terminal to the terminal electrode is increased, the solder does not protrude from the terminal electrode. Is done. Accordingly, it is possible to reliably solder an external terminal such as a lead wire to the terminal electrode while preventing the solder from protruding from the terminal electrode.

Further, in the electronic component, the terminal electrode has a first electrode layer formed on the surface of the substrate and a second electrode layer formed on a predetermined portion of the surface of the first electrode layer, The exposed portion of the surface of the first electrode layer is a first region located at a first height from the surface of the substrate, and the surface of the second electrode layer is a first region higher than the first height from the surface of the substrate. The second region is located at the height of 2 and in which external terminals connected by solder are arranged. Thus, by laminating the first electrode layer and the second electrode layer, the first region located at the first height from the surface of the substrate and the first region higher than the first height from the surface of the substrate. The second region located at the height of 2 can be easily provided in the terminal electrode.

  In the electronic component, the first electrode layer is connected to a conductive member in a through hole formed in the base, and the second electrode layer covers the opening of the through hole. It is preferable to be laminated on the electrode layer. Thus, when the second electrode layer covers the opening of the through hole, when the external terminal is soldered to the surface of the second electrode layer, which is the second region, the conductive material in the through hole is transferred to the molten solder. It is possible to prevent the member from melting (so-called solder erosion) and disconnecting the electrical connection in the through hole.

  In the electronic component, the second electrode layer is preferably made of a conductive material containing glass frit. Thereby, the biting property of the second electrode layer with respect to the first electrode layer can be improved. In addition, when the external terminal is soldered to the surface of the second electrode layer, it is possible to more reliably prevent the conductive member in the through hole from being melted into the molten solder.

  In the electronic component, a plurality of terminal electrodes are arranged on the surface of the base body along a predetermined direction, and one terminal electrode of adjacent terminal electrodes is one end side in a direction orthogonal to the predetermined direction. Preferably, the other terminal electrode has a second region on the other end side in a direction orthogonal to the predetermined direction. Thereby, an external terminal is soldered to one end side in a direction orthogonal to a predetermined direction for one terminal electrode of adjacent terminal electrodes, and orthogonal to a predetermined direction for the other terminal electrode. An external terminal can be soldered to the other end side in the direction to be performed. For this reason, it is avoided that the external terminal which should be connected to each terminal electrode adjoins in a predetermined direction. Therefore, the connection of the external terminal to each terminal electrode can be facilitated, and adjacent terminal electrodes can be reliably prevented from being joined and short-circuited by solder.

  In the electronic component, it is preferable that an external terminal is connected to the terminal electrode by solder. In this electronic component, as described above, even if the amount of solder for soldering the external terminal to the terminal electrode is increased in order to improve the reliability of connection between the terminal electrode and the external terminal, Protruding from the top is prevented. Therefore, the solder is prevented from protruding from the terminal electrode, and the external terminal is securely soldered to the terminal electrode.

  According to the present invention, it is possible to reliably solder an external terminal such as a lead wire to the terminal electrode while preventing the solder from protruding from the terminal electrode.

  Hereinafter, a multilayer piezoelectric element as a preferred embodiment of an electronic component according to the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIG. 1, a multilayer piezoelectric element (electronic component) 1 includes piezoelectric layers 3 on which individual electrodes 2 are formed and piezoelectric layers 5 on which common electrodes 4 are formed, and are stacked alternately. The piezoelectric layer 7 on which the terminal electrodes 17 and 18 are formed is formed by laminating the uppermost layer.

  Each of the piezoelectric layers 3, 5, and 7 is made of a material mainly composed of ceramics such as lead zirconate titanate, and is formed in a rectangular thin plate shape of, for example, “10 mm × 30 mm, thickness 30 μm”. The individual electrode 2 and the common electrode 4 are made of a conductive material mainly composed of silver and palladium, and are patterned by screen printing. The same applies to each electrode described below except for the terminal electrodes 17 and 18.

  As shown in FIG. 2, a plurality of rectangular individual electrodes 2 are formed on the upper surface of the second, fourth, sixth, and eighth piezoelectric layers 3a from the uppermost piezoelectric layer 7. Are arranged in a matrix. Each individual electrode 2 is arranged such that its longitudinal direction is orthogonal to the longitudinal direction of the piezoelectric layer 3a, and the individual electrodes 2 and 2 adjacent to each other are electrically isolated by taking a predetermined interval. And the influence by mutual vibration is prevented.

  Here, assuming that the longitudinal direction of the piezoelectric layer 3a is the row direction and the direction orthogonal to the longitudinal direction is the column direction, the individual electrodes 2 are arranged, for example, in 4 rows and 75 columns (in the drawing for the sake of clarity). 4 rows and 20 columns). As described above, since the plurality of individual electrodes 2 are arranged in a matrix shape, an efficient arrangement with respect to the piezoelectric layer 3a is possible, so that the area of the active portion contributing to vibration in the piezoelectric layer 3a is maintained. However, the stacked piezoelectric element 1 can be miniaturized or the individual electrodes 2 can be highly integrated.

  The individual electrodes 2 in the first and second rows are formed on the piezoelectric layer 3a immediately below the connection end 2a, with the end facing the first and second rows as the connection end 2a. The through-hole 13 is connected to a conductive member. Similarly, the individual electrodes 2 in the third row and the fourth row have end portions facing each other between the third and fourth rows as connection end portions 2a, and the piezoelectric layer 3a just below the connection end portion 2a. It is connected to the conductive member in the through hole 13 formed in.

  Further, a relay electrode 6 for electrically connecting the common electrodes 4 of the piezoelectric layer 5 positioned above and below is formed on the edge of the upper surface of the piezoelectric layer 3a. The relay electrode 6 is connected to a conductive member in the through hole 8 formed in the piezoelectric layer 3a immediately below.

  The individual electrodes 2 are arranged in a matrix on the upper surface of the lowermost piezoelectric layer 3b as in the second, fourth, sixth, and eighth piezoelectric layers 3a. . However, as shown in FIG. 3, the lowermost piezoelectric layer 3b is different from the piezoelectric layer 3a in that the relay electrode 6 and the through holes 8 and 13 are not formed.

  Further, as shown in FIG. 4, on the upper surface of the third, fifth, and seventh piezoelectric layers 5a counted from the uppermost piezoelectric layer 7, as shown in FIG. In this case, the relay electrode 16 is formed so as to face each connection end 2a of the piezoelectric layer 3a in the thickness direction of the multilayer piezoelectric element 1, that is, in the thickness direction of the piezoelectric layers 3 and 5. . Each relay electrode 16 is connected to a conductive member in a through hole 13 formed in the piezoelectric layer 5 immediately below.

  Further, a common electrode 4 is formed on the upper surface of the piezoelectric layer 5a. The common electrode 4 surrounds the set of the relay electrodes 16 in the first row and the second row and the set of the relay electrodes 16 in the third row and the fourth row with a predetermined interval, and in the stacking direction. As seen from FIG. 1, the individual electrodes 2 overlap the portions excluding the connection end 2a. As a result, the entire portion of the piezoelectric layers 3 and 5 facing the portion excluding the connection end 2a of each individual electrode 2 can be effectively used as an active portion that contributes to vibration. The common electrode 4 is formed at a predetermined interval from the outer peripheral portion of the piezoelectric layer 5a, and is a through hole formed in the piezoelectric layer 5 so as to face the relay electrode 6 of the piezoelectric layer 3a in the stacking direction. It is connected to the conductive member in 8.

  Note that the relay electrode 16 and the common electrode 4 are also formed on the upper surface of the ninth piezoelectric layer 5b in the same manner as the third, fifth, and seventh piezoelectric layers 5a. However, as shown in FIG. 5, the ninth piezoelectric layer 5b is different from the piezoelectric layer 5a in that the through hole 8 is not formed.

  Further, as shown in FIG. 6, a terminal electrode 17 is formed on the upper surface of the uppermost piezoelectric layer 7 so as to face the connection end portion 2a of each individual electrode 2 of the piezoelectric layer 3a in the stacking direction. A terminal electrode 18 is formed so as to face the relay electrode 6 of the piezoelectric layer 3a in the stacking direction. Each terminal electrode 17 is connected to a conductive member in a through hole 13 formed in the piezoelectric layer 7 immediately below it, and the terminal electrode 18 is electrically connected in a through hole 8 formed in the piezoelectric layer 7 immediately below it. Connected to the member. These terminal electrodes 17 and 18 are soldered with lead wires such as an FPC (flexible printed circuit board) so as to be connected to a driving power source.

  By stacking the piezoelectric layers 3, 5, and 7 with the electrode pattern formed as described above, the five individual electrodes 2 are interposed with the relay electrodes 16 in the stacking direction with respect to the uppermost terminal electrodes 17. As shown in FIG. 7, the aligned electrodes 2, 16, and 17 are electrically connected by the conductive member 14 in the through hole 13. On the other hand, with respect to the uppermost terminal electrode 18, four common electrodes 4 are aligned in the stacking direction with the relay electrode 6 interposed, and the aligned electrodes 4, 6, 18 are conductive members in the through hole 8. 14 to be electrically connected.

  The through-holes 13 and 13 adjacent in the stacking direction are formed in the piezoelectric layers 3, 5 and 7 so that their center axes are shifted from each other, so that electrical connection by the conductive member 14 in the through-hole 13 is achieved. Can be made more reliable. The same applies to the through holes 8 and 8 adjacent in the stacking direction.

  When a voltage is applied between the predetermined terminal electrode 17 and the terminal electrode 18 by such electrical connection in the multilayer piezoelectric element 1, the individual electrode 2 and the common electrode 4 aligned under the predetermined terminal electrode 17 A voltage is applied during the period. As a result, in the piezoelectric layers 3 and 5, as shown in FIG. 7, an electric field E is generated in a portion sandwiched between the individual electrode 2 and the common electrode 4, and the portion is displaced as the active portion A. Therefore, by selecting the terminal electrode 17 to which the voltage is applied, among the active parts A corresponding to the individual electrodes 2 arranged in a matrix, the active parts A aligned under the selected terminal electrode 17 are arranged in the stacking direction. Can be displaced. Such a laminated piezoelectric element 1 is applied to a drive source of various devices that require minute displacement, such as valve control of a micropump.

  Next, the terminal electrode 17 mentioned above is demonstrated in detail with reference to FIG.8 and FIG.9. FIG. 8 is an enlarged partial plan view of the multilayer piezoelectric element 1, and FIG. 9 is an enlarged partial cross-sectional view along the line IX-IX shown in FIG.

  As shown in FIGS. 8 and 9, the terminal electrode 17 includes a rectangular first electrode layer 21 formed on the surface 7 a of the piezoelectric layer (substrate) 7, and a surface 21 a of the first electrode layer 21. And a rectangular second electrode layer 23 formed in a predetermined portion (a portion facing the through hole 13 in the stacking direction). The first electrode layer 21 is made of a conductive material mainly composed of silver and palladium, and is connected to the conductive member 14 in the through hole 13 formed in the piezoelectric layer 7. The second electrode layer 23 is made of a conductive material mainly composed of silver, and is laminated on the first electrode layer 21 so as to cover the opening of the through hole 13.

  Accordingly, the terminal electrode 17 includes a first region R1 located at a first height from the surface 7a of the piezoelectric layer 7, and a second height higher than the first height from the surface 7a of the piezoelectric layer 7. And the second region R2 located in the region. That is, the exposed portion of the surface 21a of the first electrode layer 21 (the portion of the surface 21a other than the predetermined portion where the second electrode layer 23 is formed) is the first region R1, and the second electrode layer The surface 23a of 23 is the second region R2.

  As described above, in the multilayer piezoelectric element 1, as shown in FIG. 9, when the lead wire (external terminal) 24 is soldered to the terminal electrode 17, the height from the surface 7 a of the piezoelectric layer 7 is the first. The lead wire 24 can be arranged in the second region R2 higher than the first region R1. This makes it easier for the solder 25 melted during soldering to flow from the second region R2 toward the first region R1. For this reason, even if the amount of solder for soldering the lead wire 24 to the terminal electrode 17 is increased in order to improve the connection reliability between the terminal electrode 17 and the lead wire 24, the solder 25 is removed from above the terminal electrode 17. Protruding is prevented. Accordingly, it is possible to reliably solder the lead wire 24 to the terminal electrode 17 while preventing the solder 25 from protruding from the terminal electrode 17.

  The first electrode layer 21 is made of a conductive material mainly composed of silver and palladium. However, the first electrode layer 21 is made of another conductive material as long as it contains palladium. It may consist of. This is because when the first electrode layer 21 contains palladium, so-called solder erosion hardly occurs even if the first electrode layer 21 is a thin film. Specifically, the first electrode layer 21 preferably contains 3% by weight or more of palladium, more preferably 5% by weight or more, based on the total weight of the metal elements. . If palladium is not contained in an amount of 3% by weight or more, so-called solder erosion is likely to occur, and the melted solder 25 may not flow accurately over the entire first region R1. As described above, when the second electrode layer 23 is made of a conductive material mainly containing silver, the first electrode layer 21 is made of a conductive material mainly containing silver and palladium. The first electrode layer 21 is preferably made of a conductive material mainly composed of gold and palladium or a conductive material mainly composed of gold, platinum and palladium. It may be.

  Further, the first height of the first region R1 is preferably 3 μm or less, and more preferably 2 μm or less. This is because when the first height exceeds 3 μm, the melted solder 25 easily flows in an unnecessary direction. Furthermore, the difference between the first height of the first region R1 and the second height of the second region R2 is preferably 5 μm to 20 μm, and more preferably 7 μm to 15 μm. This is because when the difference between the first height and the second height is less than 5 μm, the molten solder 25 is difficult to flow from the second region R2 toward the first region R1. This is because if the difference from the height of 2 exceeds 20 μm, it becomes difficult to control the direction in which the molten solder 25 flows. Here, the first height and the second height are heights based on the highest point in the first region R1 and the second region R2 (including the surface roughness).

  In the multilayer piezoelectric element 1, the terminal electrode 17 is configured by stacking the first electrode layer 21 and the second electrode layer 23, so that the first height from the surface 7 a of the piezoelectric layer 7 is increased. The terminal region 17 can be easily provided with the first region R <b> 1 positioned and the second region R <b> 2 positioned at a second height higher than the first height from the surface 7 a of the piezoelectric layer 7.

  Furthermore, in the multilayer piezoelectric element 1, since the second electrode layer 23 covers the opening of the through hole 13 on the first electrode layer 21, the second electrode layer 23, which is the second region R2, of the second electrode layer 23 is covered. When the lead wire 24 is soldered to the surface 23a, it is possible to prevent the conductive member 14 in the through hole 13 from being melted into the melted solder and disconnecting the electrical connection in the through hole 13.

  The conductive material constituting the second electrode layer 23 preferably contains glass frit. This can improve the biting property of the second electrode layer 23 with respect to the first electrode layer 21 and is melted when the lead wire 24 is soldered to the surface 23a of the second electrode layer 23. This is because it is possible to more reliably prevent the conductive member 14 in the through hole 13 from being melted into the solder.

  Further, the width of the second region R2 is preferably substantially the same as the width of the first region R1, but may be as long as it is about 1/4 or more of the width of the first region R1. . Furthermore, the area of the second region R2 is preferably 15% to 60%, more preferably 20% to 50% of the area of the first region R1.

  By the way, since the same structure as the terminal electrode 17 mentioned above is employ | adopted also at the terminal electrode 18, the effect similar to the terminal electrode 17 is show | played also in the terminal electrode 18. FIG.

  Here, assuming that the longitudinal direction of the piezoelectric layer 7 is the row direction and the direction orthogonal to the longitudinal direction is the column direction, as shown in FIG. 6, the terminal electrode 17 is connected to each individual electrode of the piezoelectric layer 3 a in the stacking direction. 2 is arranged on the surface 7a of the piezoelectric layer 7 so as to be, for example, 4 rows and 75 columns (for the sake of clarity, it is set to 4 rows and 20 columns). Each terminal electrode 17 formed in a rectangular shape is arranged such that its longitudinal direction coincides with the column direction.

  The through holes 13 formed immediately below the respective terminal electrodes 17 arranged on the surface 7a of the piezoelectric layer 7 along the row direction are arranged in a staggered manner in the row direction. Then, the second electrode layer 23 is stacked on the first electrode layer 21 so as to cover the opening of the through hole 13. Accordingly, as shown in FIG. 8, in each of the first to fourth rows, one of the terminal electrodes 17 and 17 adjacent in the row direction has one terminal electrode 17 on the one end side in the longitudinal direction. It has area | region R2, and the other terminal electrode 17 has 2nd area | region R2 in the other end side in the longitudinal direction.

  Therefore, the lead wire 24 is soldered to one end side in the longitudinal direction of one of the adjacent terminal electrodes 17 and 17, and the other terminal electrode 17 in the longitudinal direction. The lead wire 24 can be soldered to the other end side. For this reason, it is avoided that the lead wires 24 to be connected to the terminal electrodes 17 are adjacent in the row direction. Therefore, the connection of the lead wire 24 to each terminal electrode 17 can be facilitated, and adjacent terminal electrodes 17 can be reliably prevented from being joined and short-circuited by solder.

  The terminal electrode 17 is formed in a rectangular shape whose longitudinal direction is the direction (that is, the column direction) orthogonal to the arrangement direction (that is, the row direction), and therefore the first region R1 in the column direction. The length can be greater than or equal to the length of the second region R2 in the column direction. As a result, it is possible to secure a wide region (that is, the first region R1) through which the molten solder 25 flows during soldering, and more reliably prevent the solder 25 from protruding from the terminal electrode 17. It becomes possible. Further, even if the interval between the adjacent terminal electrodes 17 and 17 is reduced, the distance between the second regions R2 and R2 to which the lead wires 24 are soldered is increased in each of the adjacent terminal electrodes 17 and 17. Therefore, it becomes possible to more reliably prevent the solder 25 from joining to each other between the adjacent terminal electrodes 17 and 17.

  Next, a manufacturing procedure of the multilayer piezoelectric element 1 described above will be described. First, a base paste is prepared by mixing a piezoelectric ceramic material mainly composed of lead zirconate titanate and the like with an organic binder, an organic solvent, and the like, and each of the piezoelectric layers 3, 5, and 7 is formed using the base paste. Form a green sheet. Moreover, an organic binder, an organic solvent, etc. are mixed with the metal material which consists of silver and palladium of a predetermined ratio, and an electrically conductive paste is produced.

  Subsequently, the through holes 8 and 13 are formed by irradiating a predetermined position on the green sheet to be the piezoelectric layers 3, 5 and 7 with laser light. Then, filling screen printing is performed on the through holes 8 and 13 using a conductive paste to form the conductive member 14. Thereafter, the green sheets to be the piezoelectric layers 3 and 5 are screen-printed using a conductive paste to form the electrodes 2, 4, 6 and 16. Further, the green sheet to be the uppermost piezoelectric layer 7 is screen-printed using a conductive paste to form the first electrode layer 21 as a base electrode.

  Subsequently, the green sheets on which the electrode patterns are formed are laminated in the above-described order, and pressed in the laminating direction to produce a laminate green. After degreasing and firing the laminate green, a silver baking electrode is applied to the sintered sheet to be the piezoelectric layer 7 to form the second electrode layer 23. Thereafter, polarization processing is performed to complete the multilayer piezoelectric element 1.

  The reason why silver is used as the material of the second electrode layer 23 is to make it easier to place the solder 25 when the lead wire 24 is soldered. Further, gold, copper, or the like may be used as the material of the second electrode layer 23. Furthermore, as a method for forming the second electrode layer 23, sputtering, electroless plating, or the like may be employed.

  The present invention is not limited to the embodiment described above. For example, in the embodiment described above, the terminal electrode 17 is configured by laminating the first electrode layer 21 and the second electrode layer 23, but the terminal electrode 17 is formed from the surface 7 a of the piezoelectric layer 7 to the first. If there is a first region R1 located at a height of 2 mm and a second region R2 located at a second height higher than the first height from the surface 7a of the piezoelectric layer 7, one layer You may be comprised from the electrode layer. In this case, the terminal electrode 17 is preferably made of a conductive material containing palladium from the viewpoint of suppressing so-called solder erosion.

  In the above embodiment, the second electrode layer 23 is laminated on the first electrode layer 21 so as to cover the opening of the through hole 13 in order to prevent so-called solder erosion. In order to surely solder the lead wire 24 to the terminal electrode 17 while preventing the electrode 17 from protruding from the electrode 17, the second electrode layer 23 is not necessarily formed on the first electrode layer 21. May not be covered.

  In the above embodiment, the piezoelectric layer 7 is provided as the uppermost layer in order to form the terminal electrode 17 and protect the internal electrodes such as the individual electrodes 2. If there is no problem in terms of function and function, the first region R1 and the second region R2 are formed in the piezoelectric layer 3 on which the internal electrodes such as the individual electrodes 2 are formed without providing the piezoelectric layer 7 as the uppermost layer. You may form the terminal electrode 17 which has.

  Further, the present invention is not limited to the multilayer piezoelectric element 1 and can be applied to various electronic components including a base and terminal electrodes formed on the surface of the base.

1 is an exploded perspective view of a multilayer piezoelectric element as one embodiment of an electronic component according to the present invention. FIG. 2 is a plan view of second, fourth, sixth, and eighth piezoelectric layers of the multilayer piezoelectric element shown in FIG. 1. FIG. 2 is a plan view of the lowermost piezoelectric layer of the multilayer piezoelectric element shown in FIG. 1. FIG. 2 is a plan view of third, fifth, and seventh piezoelectric layers of the multilayer piezoelectric element shown in FIG. 1. FIG. 2 is a plan view of a ninth piezoelectric layer of the multilayer piezoelectric element shown in FIG. 1. FIG. 2 is a plan view of the uppermost piezoelectric layer of the multilayer piezoelectric element shown in FIG. 1. FIG. 2 is an enlarged partial cross-sectional view perpendicular to the longitudinal direction of the multilayer piezoelectric element shown in FIG. 1. FIG. 2 is an enlarged partial plan view of the multilayer piezoelectric element shown in FIG. 1. It is an expanded partial sectional view along the IX-IX line shown in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Laminated piezoelectric element (electronic component), 7 ... Piezoelectric layer (base | substrate), 13 ... Through hole, 14 ... Conductive member, 17 ... Terminal electrode, 21 ... 1st electrode layer, 23 ... 2nd electrode layer , 24 ... lead wire (external terminal), 25 ... solder, R1 ... first region, R2 ... second region.

Claims (5)

An electronic component comprising a base and a terminal electrode formed on the surface of the base,
The terminal electrode has a first electrode layer formed on the surface of the substrate and a second electrode layer formed on a predetermined portion of the surface of the first electrode layer,
The exposed portion of the surface of the first electrode layer becomes a first region located at a first height from the surface of the base, and the surface of the second electrode layer extends from the surface of the base. The second region is located at a second height higher than the height of the external terminal and is connected to the external terminals connected by solder.
A plurality of the terminal electrodes are arranged on the surface of the base body along a predetermined direction,
The second electrode layer is located at an end portion of the first electrode layer in a direction orthogonal to the predetermined direction, and the width of the second electrode layer in the predetermined direction is electronic component characterized that you have become substantially the same as the width of the first electrode layer in the direction. The first electrode layer is connected to a conductive member in a through hole formed in the base body,
The second electrode layer, the electronic component according to claim 1, characterized in that it is laminated on the first electrode layer so as to cover the opening of the through hole. The second electrode layer electronic component according to claim 1 or 2, wherein the electrically conductive material including a glass frit. Of the adjacent terminal electrodes, one terminal electrode has the second region on one end side in a direction perpendicular to the predetermined direction, and the other terminal electrode is the other in the direction orthogonal to the predetermined direction. The electronic component according to any one of claims 1 to 3 , wherein the second region is provided on an end side. Wherein the terminal electrode, the one electronic component of one claim of claims 1-4 in which the external terminal is characterized in that it is connected by solder.

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