JP4373896B2 - Multilayer ceramic element - Google Patents

Description

  The present invention relates to a multilayer ceramic element such as a multilayer piezoelectric element or a multilayer capacitor.

As a conventional multilayer ceramic element, there is an actuator described in Patent Document 1, for example. In this actuator, a via electrode (conductive member in the through hole) that electrically connects the electrodes such as the surface electrode and the internal electrode is filled in the entire region in the through hole formed in the piezoelectric substrate.
JP 2004-207340 A

  By the way, the actuator described above is manufactured as follows. That is, after laminating a plurality of green sheets on which internal electrodes and via electrodes and via electrodes are formed, a green laminate is produced by pressing in the laminating direction. And after degreasing and baking the laminated body green, a polarization process is performed and an actuator is completed.

  However, since the shrinkage ratio of the via electrode during firing is generally larger than that of the green sheet, in the actuator in which the via electrode is filled in the entire region of the through hole, the via electrode shrinks greatly during firing. As a result, the through hole may be significantly deformed. Such deformation of the through hole causes problems such as deformation of the completed actuator itself and disconnection of the connection between the internal electrode and the via electrode.

  Therefore, the present invention has been made in view of such circumstances, and an object thereof is to provide a multilayer ceramic element that can suppress deformation of a through hole during firing.

In order to achieve the above object, a multilayer ceramic element according to the present invention is a multilayer ceramic element in which a plurality of ceramic layers are laminated, and an internal electrode formed between adjacent ceramic layers, and a ceramic A first conductive member disposed in a first through hole formed in the layer and connected to each of the internal electrodes located on both sides of the ceramic layer; and a second through hole formed in the ceramic layer. A second conductive member disposed and connected to each of the internal electrodes located on both sides of the ceramic layer, and the first and second through holes are formed in a tapered shape extending toward the end on one opening side, The inner surfaces of the first and second through holes have curved surfaces that are continuous from the surface of the ceramic layer on one opening side, and the first and second conductive members are internal on the one opening side. Is formed pole integrally with, the other opening side of the region in the first through hole is filled with a first conductive member, the conductive member unfilled area in the first through hole, the first A portion of at least one of the ceramic layers adjacent to the ceramic layer in which the through hole is formed is filled , and the region on the other opening side in the second through hole is filled with the second conductive member, A gap is formed in the conductive member non-filling region in the through hole.

In this multilayer ceramic element, the first conductive member is filled in a region on the other opening side in the first through hole, and similarly, the second opening region in the second through hole is filled in the second opening side region. The conductive member is filled. Therefore, the shrinkage of the first and second conductive members during firing is smaller than that in which the entire region in the through hole is filled with the conductive member. In addition, in the conductive member non-filling region in the first through hole (region in which the first conductive member is not filled in the first through hole), the ceramic layer in which the first through hole is formed and A portion of at least one adjacent ceramic layer is filled . Therefore, even if the first conductive member contracts to some extent during firing, deformation of the first through hole is limited by a portion of the ceramic layer filled in the conductive member non-filled region in the first through hole. In addition, a gap is formed in a conductive member non-filling region in the second through hole (a region in which the second conductive member is not filled in the second through hole). Therefore, even if the second conductive member contracts to some extent during firing, gas such as air expands in the gap and pressure is applied to the inner surface of the second through hole, and deformation of the second through hole is limited. . Therefore, according to this multilayer ceramic element, it is possible to suppress deformation of the through hole during firing.

In addition, the inner surface of the first through hole has a curved surface continuing from the surface of the ceramic layer at the opening side of the hand, the first conductive member, are integrally formed with the inner electrode at one opening side The As a result, the first conductive member contracts during firing compared to the case where the inner surface of the through hole is formed discontinuously with the surface of the ceramic layer, or the case where the conductive member is formed separately from the internal electrode. Thus, it is possible to suppress the first conductive member from retreating from the opening side where the inner surface of the first through hole is formed as a curved surface. Accordingly, it is possible to prevent the connection between the internal electrode and the conductive member in the first through hole from being broken during firing.

Further, the inner surface of the second through-hole has a curved surface continuing from the surface of the ceramic layer at the opening side of the hand, the second conductive member, are integrally formed with the inner electrode at one opening side The For the same reason as the first through hole and the first conductive member described above, it is possible to prevent the connection between the internal electrode and the conductive member in the second through hole from being broken during firing.

  According to the multilayer ceramic element of the present invention, it is possible to suppress deformation of the through hole during firing.

  Hereinafter, a multilayer piezoelectric element as a preferred embodiment of a multilayer ceramic element according to the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same or an equivalent part, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 1, a multilayer piezoelectric element (multilayer ceramic element) 1 includes a piezoelectric layer (ceramic layer) 3 on which individual electrodes (internal electrodes) 2 are formed, and a common electrode (internal electrode) 4. The formed piezoelectric layers (ceramic layers) 5 are alternately stacked, and further, the piezoelectric layer 7 on which the terminal electrodes 17 and 18 are formed is stacked on the uppermost layer.

  Each of the piezoelectric layers 3, 5, and 7 is made of a piezoelectric ceramic material mainly composed of lead zirconate titanate, and is formed in a rectangular thin plate shape of, for example, “10 mm × 30 mm, thickness 30 μm”. The individual electrode 2 and the common electrode 4 are made of a conductive material composed of Ag and Pd, and are patterned by screen printing. The same applies to each electrode described below except for the terminal electrodes 17 and 18.

  As shown in FIG. 2, a plurality of rectangular individual electrodes are formed on the upper surface of the second, fourth, sixth, and eighth piezoelectric layers 3 from the uppermost piezoelectric layer 7. 2 are arranged in a matrix. Each individual electrode 2 is arranged such that its longitudinal direction is orthogonal to the longitudinal direction of the piezoelectric layer 3, and the individual electrodes 2, 2 adjacent to each other are electrically isolated by taking a predetermined interval. And the influence by mutual vibration is prevented.

  Here, assuming that the longitudinal direction of the piezoelectric layer 3 is the column direction and the direction orthogonal to the longitudinal direction is the row direction, the individual electrodes 2 are arranged, for example, in 4 rows and 75 columns (in the drawing, for the sake of clarity). 4 rows and 20 columns). As described above, since the plurality of individual electrodes 2 are arranged in a matrix shape, an efficient arrangement with respect to the piezoelectric layer 3 is possible, so that the area of the active portion contributing to vibration in the piezoelectric layer 3 is maintained. However, the stacked piezoelectric element 1 can be miniaturized or the individual electrodes 2 can be highly integrated.

  The individual electrodes 2 in the first and second rows are formed on the piezoelectric layer 3 immediately below the connection end 2a, with the end facing the first and second rows being the connection end 2a. The through-hole 13 is connected to the conductive member 14 (see FIG. 7). Similarly, in the individual electrodes 2 in the third and fourth rows, the end facing the third and fourth rows is the connection end 2a, and the piezoelectric layer 3 just below the connection end 2a. It is connected to the conductive member 14 in the through hole 13 formed in.

  Furthermore, a relay electrode (internal electrode) 6 for electrically connecting the common electrodes 4 of the piezoelectric layer 5 positioned above and below is formed on the edge of the upper surface of the piezoelectric layer 3. The relay electrode 6 is connected to a conductive member 14 in a through hole 13 formed in the piezoelectric layer 3 immediately below the relay electrode 6.

  The individual electrodes 2 are arranged in a matrix on the upper surface of the lowermost piezoelectric layer 3 as in the second, fourth, sixth, and eighth piezoelectric layers 3 described above. . However, as shown in FIG. 3, the lowermost piezoelectric layer 3 has the second layer, the fourth layer, the sixth layer, and the eighth layer in that the relay electrode 6 and the through hole 13 are not formed. Different from the piezoelectric layer 3.

  Further, on the upper surface of the third, fifth, and seventh piezoelectric layers 5 counted from the uppermost piezoelectric layer 7, as shown in FIG. In other words, the relay electrode (internal electrode) 16 is opposed to each connection end 2a of the piezoelectric layer 3 in the thickness direction of the multilayer piezoelectric element 1, that is, in the thickness direction of the piezoelectric layers 3 and 5. Is formed. Each relay electrode 16 is connected to a conductive member 14 in a through hole 13 formed in the piezoelectric layer 5 immediately below.

  Further, a common electrode 4 is formed on the upper surface of the piezoelectric layer 5. The common electrode 4 surrounds the set of the relay electrodes 16 in the first row and the second row and the set of the relay electrodes 16 in the third row and the fourth row with a predetermined interval, and in the stacking direction. As seen from FIG. 1, the individual electrodes 2 overlap the portions excluding the connection end 2a. As a result, the entire portion of the piezoelectric layers 3 and 5 facing the portion excluding the connection end 2a of each individual electrode 2 can be effectively used as an active portion that contributes to vibration. The common electrode 4 is formed at a predetermined interval from the outer peripheral portion of the piezoelectric layer 5 and is a through-hole formed in the piezoelectric layer 5 so as to face the relay electrode 6 of the piezoelectric layer 3 in the stacking direction. 13 is connected to the conductive member 14 in the inside.

  The relay electrode 16 and the common electrode 4 are also formed on the upper surface of the ninth piezoelectric layer 5 in the same manner as the third, fifth and seventh piezoelectric layers 5 described above. However, as shown in FIG. 5, the ninth piezoelectric layer 5 has a third layer, a fifth layer, and a fifth layer that are not formed with through holes 13 facing the relay electrodes 6 of the piezoelectric layer 3 in the stacking direction. It differs from the piezoelectric layer 5 of the 7th layer.

  Further, as shown in FIG. 6, terminal electrodes 17 are formed on the upper surface of the uppermost piezoelectric layer 7 so as to face the connection ends 2 a of the individual electrodes 2 of the piezoelectric layer 3 in the stacking direction. A terminal electrode 18 is formed so as to face the relay electrode 6 of the piezoelectric layer 3 in the stacking direction. Each terminal electrode 17, 18 is connected to the conductive member 14 in the through hole 13 formed in the piezoelectric layer 7 immediately below.

  These terminal electrodes 17 and 18 are soldered with lead wires such as an FPC (flexible printed circuit board) in order to connect to the drive power source. Therefore, in order to make it easy to put solder when soldering the lead wires, in the terminal electrodes 17 and 18, in order to improve solder wettability on a base electrode layer made of a conductive material composed of Ag and Pd. A surface electrode layer made of a conductive material made of Ag is formed.

  By stacking the piezoelectric layers 3, 5, and 7 with the electrode pattern formed as described above, the five individual electrodes 2 are interposed with the relay electrodes 16 in the stacking direction with respect to the uppermost terminal electrodes 17. As shown in FIG. 7, the aligned electrodes 2, 16, and 17 are electrically connected by the conductive member 14 in the through hole 13. On the other hand, with respect to the uppermost terminal electrode 18, four common electrodes 4 are aligned with the relay electrode 6 interposed in the stacking direction, and the aligned electrodes 4, 6, 18 are conductive members in the through holes 13. 14 to be electrically connected.

  The adjacent through holes 13 and 13 in the stacking direction are formed in the piezoelectric layers 3, 5 and 7 so that the center axes of the through holes 13 and 13 are shifted from each other, and the electrical connection by the conductive member 14 in the through hole 13 is ensured. It has become.

  When a voltage is applied between the predetermined terminal electrode 17 and the terminal electrode 18 by such electrical connection in the multilayer piezoelectric element 1, the individual electrode 2 and the common electrode 4 aligned under the predetermined terminal electrode 17 A voltage is applied during the period. As a result, in the piezoelectric layers 3 and 5, as shown in FIG. 7, an electric field E is generated in a portion sandwiched between the individual electrode 2 and the common electrode 4, and the portion is displaced as the active portion A. . Therefore, by selecting the terminal electrode 17 to which the voltage is applied, among the active parts A corresponding to the individual electrodes 2 arranged in a matrix, the active parts A aligned under the selected terminal electrode 17 are arranged in the stacking direction. Can be displaced. Such a laminated piezoelectric element 1 is applied to a drive source of various devices that require minute displacement, such as valve control of a micropump.

Here, the through hole 13 and the conductive member 14 described above will be described in more detail. In the following description, when such "through-hole 13 ', the through-holes (first through holes) 13 ₁ and the through-hole (second through hole) 13 is intended to include both _2," the conductive member 14 ”Includes both the conductive member ( _first conductive member) 141 and the conductive member (second conductive member) 14 ₂ .

  As shown in FIG. 8, the through hole 13 is formed in a tapered shape that widens toward the upper side. The inner surface 13 a of the through hole 13 formed in the piezoelectric layer 3 has a curved surface R that is continuous from the upper surface 3 a of the piezoelectric layer 3 on the opening side above the through hole 13. Further, the inner surface 13 a of the through hole 13 formed in the piezoelectric layer 5 has a curved surface R that is continuous from the upper surface 5 a of the piezoelectric layer 5 on the opening side above the through hole 13. These curved surfaces R are formed by rounding the edge of the upper opening of the through hole 13.

The conductive member 14 _1, meets the lower region of the through hole 13 ₁ (predetermined region), and to cover the inner surface 13a of the upper region of the through hole 13 ₁ into a film, the through-hole 13 ₁ Are integrally formed. Similarly, the conductive member 14 _2, as satisfying the lower region of the through hole 13 in ₂ (a predetermined region), and covers the inner surface 13a of the upper region of the through hole 13 in ₂ in a film shape, a through hole It is integrally formed in 13 _2.

  The conductive member 14 formed in the through hole 13 of the piezoelectric layer 3 is formed integrally with the individual electrode 2 on the upper opening side of the through hole 13, and the lower opening of the through hole 13. It is connected to the relay electrode 16 on the side. In addition, the conductive member 14 formed in the through hole 13 of the piezoelectric layer 5 is formed integrally with the relay electrode 16 on the upper opening side of the through hole 13, and below the through hole 13. Is connected to the individual electrode 2 on the opening side.

The conductive members unfilled region (region conductive member 14 ₁ has not been filled in the through-hole 13 ₁₎ S of the piezoelectric layer 3 through holes 13 ₁ formed, the through-hole 13 ₁ is formed A part of the upper piezoelectric layer 5 adjacent to the piezoelectric layer 3 is arranged so as to bite. Further, the conductive member unfilled region S of the piezoelectric layer 5 through hole 13 ₁ formed, a portion of the piezoelectric layer 3 of the upper adjacent to the piezoelectric layer 5 of the through hole 13 ₁ is formed It is arranged to bite.

Are voids formed in the (conductive member 14 ₂ is unfilled region in the through-hole 13 in ₂₎ S piezoelectric layer conductive members unfilled region of the through hole 13 in ₂ formed 3. Similarly, the air gap is formed in the conductive member unfilled region S of the piezoelectric layer 5 through hole 13 in ₂ formed.

Note that the through holes 13 ₁ to the upper side of the piezoelectric layers 3, 5 are disposed conductive members unfilled region S adjacent a through hole 13 ₂ voids formed in the conductive member unfilled region S, stacked The piezoelectric elements 1 are randomly formed.

  Next, a method for manufacturing the multilayer piezoelectric element 1 will be described.

  First, an element binder paste is prepared by mixing an organic binder, an organic solvent, or the like with a piezoelectric ceramic material mainly composed of lead zirconate titanate, and each element layer 3, 5, 7 is formed using the element paste. The green sheet is formed by the doctor blade method.

  Then, a predetermined position of the green sheet is irradiated with laser light, and a through hole 13 having a tapered shape (for example, an upper opening diameter of about 40 μm and a lower opening diameter of about 35 μm) is formed at the predetermined position. At this time, the curved surface R can be formed on the opening side above the through hole 13 (laser beam emission side) by controlling the mask shape for laser processing, laser irradiation conditions, and the like.

  Subsequently, a conductive paste prepared by mixing an organic binder, an organic solvent, or the like with a conductive material having a ratio of Ag: Pd = 7: 3 is used to form a through hole 13 from the upper side of the green sheet. Filling screen printing is performed to form the conductive member 14 in the through hole 13 and to form a conductive layer around the through hole 13 on the upper surface of the green sheet. Thus, the conductive member 14 is integrally formed in the through hole 13 so as to fill the lower region in the through hole 13 and cover the inner surface 13a of the upper region in the through hole 13 in a film shape. The Rukoto.

  By controlling the filling amount of the conductive paste into the through hole 13, the amount of the conductive material remaining in the through hole 13 after firing can be changed. Further, since the through hole 13 is formed in a tapered shape that widens toward the upper side, the conductive member 14 can be reliably formed in the through hole 13.

  Further, screen printing is performed on the upper surface of the green sheet using the conductive paste described above, and the base electrode layers of the terminal electrodes 17 and 18 and the internal electrodes 2, 4, 6, and 16 are formed on the surface of the green sheet. At this time, since the conductive layer is formed around the through hole 13, the internal electrodes 2, 4, 6, 16 and the conductive member 14 can be reliably integrated.

Subsequently, the green sheets on which the electrode patterns are formed are stacked in the order described above. Then, while heating to a temperature of about 60 ° C., pressing is performed in the laminating direction at a pressure of 100 MPa so that the layers are pressure-bonded to produce a laminate green. Thus, the conductive member unfilled region S of the through hole 13 _1, are arranged so as to a portion of the upper green sheet adjacent to the green sheet the through-hole 13 ₁ is formed bites, the through hole 13 in the ₂ A gap is formed in the non-filling region S of the conductive member.

  Thereafter, the laminate green is cut to a predetermined size. Then, the binder green thus cut is debindered at a temperature of 400 ° C. for 10 hours, and further fired at a temperature of 1100 ° C. for 2 hours. Thereby, components such as an organic binder and an organic solvent are removed, and the green sheet becomes piezoelectric layers 3, 5 and 7 made of a piezoelectric ceramic material mainly composed of lead zirconate titanate. 6, 16 and the conductive member 14 are electrodes made of a conductive material composed of Ag and Pd.

  Subsequently, a surface electrode layer made of a conductive material containing Ag as a main component is baked on the base electrode layer formed on the sintered sheet to be the piezoelectric layer 7 to form the terminal electrodes 17 and 18. In addition, you may use Au, Cu, etc. as a material of a surface electrode layer. Moreover, you may employ | adopt sputtering, an electroless plating method, etc. as a formation method of a surface electrode layer. Finally, a polarization process is performed to complete the multilayer piezoelectric element 1.

As described above, in the multilayer piezoelectric element 1, the conductive member 14 ₁ is filled in the lower region of the through hole 13 _1, Similarly, the conductive regions under the through hole 13 in the _second member 14 ₂ is filled. Therefore, the shrinkage of the conductive members 14 ₁ and 14 ₂ at the time of firing is smaller than that in which the entire region in the through hole is filled with the conductive member. Moreover, the conductive members unfilled region S of the piezoelectric layer 3 through holes 13 ₁ formed, a portion of the piezoelectric layer 5 of the upper adjacent to the piezoelectric material layers 3 that the through-hole 13 ₁ is formed disposed manner bite, also, the piezoelectric layer 5 through hole 13 ₁ formed in the conductive member unfilled region S, of the upper adjacent to the piezoelectric layer 5 of the through hole 13 ₁ is formed A part of the piezoelectric layer 3 is arranged so as to bite. Therefore, also the conductive member 14 ₁ is somewhat shrunk during firing, deformation of the through hole 13 ₁ is limited by a portion of the piezoelectric layers 3 disposed on the conductive member unfilled region S of the through hole 13 ₁ . Furthermore, voids are formed in the conductive member unfilled region S of the through hole 13 in _2. Therefore, even when the conductive member 14 ₂ is somewhat shrinks during sintering, joined to uniform pressure through a conductive member 14 ₂ in the through-hole 13 ₂ of the inner surface 13a and a gas such as air is expanded in the air gap, through holes 13 _{The second} deformation is limited. Therefore, according to the multilayer piezoelectric element 1, it is possible to suppress deformation of the through hole 13 during firing.

  In this way, deformation of the through-hole 13 at the time of firing is suppressed, so that deformation of the completed multilayer piezoelectric element 1 itself, conductive members in the internal electrodes 2, 4, 6, 16 and the through-hole 13 are suppressed. This makes it possible to prevent problems such as disconnection of the connection with 14.

Even the degree of suppression of deformation during firing and different through holes 13 ₁ to each other and the through-hole 13 ₂ is formed randomly in the multilayer piezoelectric element 1, the finished multi-layer piezoelectric element 1 itself variant of Contributes to prevention.

Further, by pressure through a conductive member 14 ₂ in the through-hole 13 ₂ of the inner surface 13a gas is expanded, such as air, it is applied uniformly in the gap, the conductive member 14 ₂ in the through holes 13 in the _two-sided contraction (Generally, the conductive member 14 tends to shrink so as to be biased downward due to the influence of gravity) is suppressed. Therefore, this also contributes to the prevention of disconnection of the connection between the conductive member 14 and _second internal electrode 2,4,6,16 and the through hole 13 in _2.

  Further, in the multilayer piezoelectric element 1, the inner surface 13 a of the through hole 13 formed in the piezoelectric layer 3 has a curved surface R that is continuous from the surface 3 a of the piezoelectric layer 3 on the opening side above the through hole 13. The conductive member 14 formed in the through hole 13 is integrally formed with the individual electrode 2 on the upper opening side of the through hole 13. Further, the inner surface 13 a of the through hole 13 formed in the piezoelectric layer 5 has a curved surface R that is continuous from the surface 5 a of the piezoelectric layer 5 on the opening side above the through hole 13. The conductive member 14 formed inside is formed integrally with the relay electrode 16 on the opening side above the through hole 13.

  As a result, the conductive member 14 contracts during firing as compared to the case where the inner surface of the through hole is discontinuously formed with the surface of the piezoelectric layer and the case where the conductive member is formed separately from the internal electrode. (As described above, generally, the conductive member 14 tends to shrink so as to be biased downward due to the influence of gravity), the conductive member 14 is formed from the opening side where the inner surface 13a of the through hole 13 is formed as the curved surface R. Retreating can be suppressed. Therefore, it is possible to prevent the connection between the internal electrodes 2, 4, 6, 16 and the conductive member 14 in the through hole 13 from being broken during firing.

  As described above, the connection between the internal electrodes 2, 4, 6, 16 and the conductive member 14 in the through hole 13 during the firing is ensured, so that the internal electrodes 2, 4, 6, 16 are thinner. Can be formed. Therefore, it is possible to suppress inhibition of displacement of the multilayer piezoelectric element 1 and to reduce the thickness of the multilayer piezoelectric element 1.

  The present invention is not limited to the embodiment described above.

For example, in the above embodiment, the conductive member 14 ₁ is filled in the lower region of the through hole 13 _1, the conductive member unfilled region S of the piezoelectric layer through-hole 13 ₁ formed in the 3, the through were arranged as part of the piezoelectric layer 5 of the upper bite adjacent to the piezoelectric material layers 3 that hole 13 ₁ is formed, but not limited thereto. In other words, a predetermined region in the through hole is filled with a conductive member, and a portion of at least one piezoelectric layer adjacent to the piezoelectric layer in which the through hole is formed is disposed in a non-conductive region in the through hole. It only has to be done. The same applies to the through hole 13 ₁ formed in the piezoelectric layer 5 and the conductive member 14 ₁ formed in the through hole 13 ₁ .

In the above embodiment, the conductive member 14 ₂ is filled in the lower region of the through hole 13 in _2, but the gap is formed in the conductive member unfilled region S of the through hole 13 in the _2, limited to Is not to be done. That is, it is only necessary that a predetermined region in the through hole is filled with the conductive member and a gap is formed in the conductive member non-filling region in the through hole.

  In the above embodiment, the inner surface 13 a of the through hole 13 formed in the piezoelectric layer 3 has a curved surface R that is continuous from the surface 3 a of the piezoelectric layer 3 on the opening side above the through hole 13. The conductive member 14 formed in the through hole 13 is integrally formed with the individual electrode 2 on the upper opening side of the through hole 13, but is not limited thereto. That is, the inner surface of the through hole has a curved surface that is continuous from the surface of the piezoelectric layer on at least one opening side of the through hole, and the conductive member formed in the through hole is the inner surface of the through hole. May be formed integrally with the internal electrode on the opening side formed as a curved surface. The same applies to the through hole 13 formed in the piezoelectric layer 5 and the conductive member 14 formed in the through hole 13.

  The present invention is not limited to a multilayer piezoelectric element, and can be applied to various multilayer ceramic elements in which a plurality of ceramic layers and internal electrodes are laminated.

1 is an exploded perspective view of a multilayer piezoelectric element as an embodiment of a multilayer ceramic element according to the present invention. FIG. 2 is a plan view of second, fourth, sixth, and eighth piezoelectric layers of the multilayer piezoelectric element shown in FIG. 1. FIG. 2 is a plan view of the lowermost piezoelectric layer of the multilayer piezoelectric element shown in FIG. 1. FIG. 2 is a plan view of third, fifth, and seventh piezoelectric layers of the multilayer piezoelectric element shown in FIG. 1. FIG. 2 is a plan view of a ninth piezoelectric layer of the multilayer piezoelectric element shown in FIG. 1. FIG. 2 is a plan view of the uppermost piezoelectric layer of the multilayer piezoelectric element shown in FIG. 1. It is a fragmentary sectional view of the lamination type piezoelectric element along a VII-VII line shown in FIG. FIG. 8 is an enlarged partial cross-sectional view of the multilayer piezoelectric element shown in FIG. 7.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Multilayer piezoelectric element (laminated ceramic element), 2 ... Individual electrode (internal electrode), 3, 5 ... Piezoelectric layer (ceramic layer), 3a, 5a ... Upper surface (surface), 4 ... Common electrode (internal electrode) ), 6, 16 ... relay electrode (internal electrode), 13 ₁ ... through hole (first through hole), 13 ₂ ... through hole (second through hole), 13a ... inner surface, 14 ₁ ... conductive member (first 1 conductive member), 14 ₂ ... Conductive member (second conductive member), R... Curved surface, S.

Claims (1)

A multilayer ceramic element formed by laminating a plurality of ceramic layers,
Internal electrodes formed between adjacent ceramic layers;
A first conductive member disposed in a first through hole formed in the ceramic layer and connected to each of the internal electrodes located on both sides of the ceramic layer;
A second conductive member disposed in a second through hole formed in the ceramic layer and connected to each of the internal electrodes located on both sides of the ceramic layer;
The first and second through holes are formed in a taper shape spreading toward the end on one opening side,
The inner surfaces of the first and second through holes have curved surfaces that are continuous from the surface of the ceramic layer on the one opening side,
The first and second conductive members are formed integrally with the internal electrode on the one opening side,
The region on the other opening side in the first through hole is filled with the first conductive member, and the first through hole is formed in the region not filled with the conductive member in the first through hole. A portion of at least one of the ceramic layers adjacent to the formed ceramic layer is filled ;
A region on the other opening side in the second through hole is filled with the second conductive member, and a gap is formed in a region not filled with the conductive member in the second through hole. A multilayer ceramic element.

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