JP4441215B2 - Method for manufacturing plasma display panel - Google Patents

Description

The present invention relates to a method for manufacturing a plasma display panel .

  In recent years, there has been an increasing demand for miniaturization, high definition, and high density of display devices and conductor circuits, and accordingly, improvement of pattern processing technology is desired. In particular, various methods have been proposed as miniaturization of patterns in conductor circuits as an indispensable requirement for miniaturization and high density.

  A plasma display panel (hereinafter simply referred to as “PDP”) is capable of high-speed display as compared with a liquid crystal panel, and can be easily increased in size, so that it is used as a display unit in many electronic devices. .

  With the expansion of the use of such PDPs, a color PDP having a large number of display cells has attracted attention. The color PDP realizes color display by exciting phosphors that emit red, green, and blue light applied to the inner surface of the discharge cell with ultraviolet rays generated by gas discharge to obtain light emission of three primary colors.

  FIG. 11 is a perspective view showing the structure of a conventional AC surface discharge type color plasma display panel.

  The color plasma display panel 100 includes a display-side first substrate 110 and a second substrate 120 arranged to face the first substrate 110.

  The first substrate 110 covers the first glass substrate 111, the plurality of line-shaped surface discharge electrodes 112 formed in parallel with each other on the first glass substrate 111, and the first glass substrate 111 and the surface discharge electrode 112. The transparent glaze layer 113 formed in this way, and the black matrix 114 formed in the transparent glaze layer 113.

  The surface discharge electrode 112 is made of a transparent conductive film in which metal bus electrodes are stacked.

  A magnesium oxide film is attached to the surface of the transparent glaze layer 113.

  The black matrix 114 is formed in a lattice shape, and each lattice defines one pixel.

  The second substrate 120 is formed to cover the second glass substrate 121, the plurality of data electrodes 122 formed on the second glass substrate 121 and spaced apart from each other, and the second glass substrate 121 and the data electrode 122. The side surfaces of the glaze layer 123 and the partition 124 are covered between the glaze layer 123, the plurality of striped white partitions 124 formed between the data electrodes 122 on the glaze layer 123, and the partitions 124 adjacent to each other. And an inorganic material layer 125 made of white fine particles and a phosphor layer 126 formed so as to cover the inorganic material layer 125.

  The phosphor layer 126 is formed on the side surfaces of the barrier ribs 124 forming the discharge cells and the surface of the glaze layer 123, and red, green and blue phosphors are separately applied in this order.

  A discharge gas is sealed between the first substrate 110 and the second substrate 120.

  Scan pulses are sequentially applied to scan electrodes (not shown), and data pulses are applied to selected data electrodes 122 in synchronization therewith.

  After such scanning is performed on the entire surface of the panel, a sustain discharge is performed on the entire surface of the panel, and color light emission is obtained.

  Such an operation is performed in a plurality of subfields having a predetermined number of times of light emission corresponding to digitized gradation data within a 1/60 second field period, and for example, display on a color television or the like is performed. .

  FIG. 12 is a cross-sectional view of the second substrate 120 showing each process in the method of forming the data electrode 122.

  First, as shown in FIG. 12A, a second glass substrate 121 is prepared.

  Next, as shown in FIG. 12B, a photosensitive silver paste 127 is applied on the surface of the second glass substrate 121.

  Next, as shown in FIG. 12C, a glass mask 128 having a predetermined pattern is placed on the photosensitive silver paste 127, and then the photosensitive silver paste 127 is irradiated with light through the glass mask 128.

  Next, after removing the glass mask 128, the exposed photosensitive silver paste 127 is developed as shown in FIG.

  Thereafter, by immersing in a solution of the photosensitive silver paste 127, as shown in FIG. 12E, only the exposed area of the photosensitive silver paste 127 remains, and the area where the photosensitive silver paste 127 has not been exposed. Is removed. The remaining area of the photosensitive silver paste 127 is baked.

  In this way, the data electrode 122 according to the pattern of the glass mask 128 is formed.

  As described above, in recent years, high definition has been required for PDPs. However, in order to increase the definition of PDPs, it is necessary to increase the definition of data electrodes 122 as a prerequisite. is there. However, it has been difficult to achieve high definition of the data electrode 122 for the following reasons.

  Since the silver particles contained in the photosensitive silver paste currently used have a large particle size, the linearity of the data electrode line obtained by firing the photosensitive silver paste was extremely poor. That is, the edge in the length direction of the data electrode is not a straight line but a curved line having a large number of irregularities.

  In general, it is effective to reduce the thickness of the electrode in order to increase the definition of the electrode. However, if the electrode is made thinner, various problems such as an increase in resistance value or an increase in the disconnection rate occur. .

  One of the methods for improving the linearity of the data electrode line or suppressing the increase in the resistance value of the data electrode is to reduce the particle size of the conductive particles contained in the photosensitive paste.

  However, since the conductive particles easily reflect light, the light irradiated to the photosensitive paste is irregularly reflected in the exposure step (FIG. 12C). For this reason, it becomes difficult for light to reach the lower layer region of the photosensitive paste, resulting in a situation in which the crosslinking reaction in the photosensitive paste cannot sufficiently proceed.

  One method for avoiding such a situation is to improve the photosensitive performance of the photosensitive paste.

  However, when the photosensitive performance is improved, it becomes easier to expose even the area covered by the glass mask by the light irregularly reflected on the surface of the electrode, and as a result, the formed electrode has a width larger than the design value, The linearity of the electrode deteriorates.

  As described above, even if the electrode is made thin, it is difficult to form a high-definition pattern.

  Moreover, in a baking process (FIG.12 (E)), electroconductive particle is easy to sinter and the force which mutually aggregates generate | occur | produces. For this reason, a space remains after the conductive particles move, and this space becomes a pinhole defect. If this phenomenon proceeds extremely, it will cause disconnection of the electrode.

  Various proposals have been made so far to solve the problems in the formation of the electrodes as described above.

  For example, a photosensitive conductive paste containing conductive metal fine particles and a photosensitive organic component, wherein at least one metal fine particle selected from Ru, Cr, Fe, Co, Mn, and Cu and / or A photosensitive conductive paste containing 5 to 20% by weight of an oxide with respect to conductive metal fine particles has been proposed (see, for example, Patent Document 1).

Further, a photosensitive conductive paste comprising conductive metal fine particles and a photosensitive organic component, wherein at least one metal fine particle selected from Ru, Cr, Fe, Co, Mn, and Cu and / or A photosensitive conductive paste containing 0.5 to 5% by weight of an oxide with respect to the photosensitive conductive paste has been proposed (see, for example, Patent Document 2).
JP 2000-48645 A JP-A-10-333322

  However, the photosensitive conductive pastes described in Patent Documents 1 and 2 are all for forming the surface discharge electrode 112 of the first substrate 110, and are intended to improve display color and contrast. It has been proposed.

  For this reason, these photosensitive conductive pastes cannot be used to make the data electrode high definition.

The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a method for manufacturing a plasma display panel capable of increasing the definition of data electrodes in the plasma display panel .

In order to solve the above-mentioned problems, the present invention is arranged so that a first substrate on the display side in which a plurality of surface discharge electrodes are formed on a first glass substrate so as to be parallel to each other, and facing the first substrate. And a second substrate having a plurality of data electrodes formed in a direction intersecting the surface discharge electrode on a second glass substrate, wherein the conductive metal fine particles and the photosensitive organic component are produced. The photosensitive conductive paste comprises a process of forming the data electrode by applying and baking a photosensitive conductive paste comprising: Ru, Cr, Fe, Co, as the conductive metal fine particles as a black pigment. A method of manufacturing a plasma display panel, comprising 0.1% by weight to 1.0% by weight of at least one metal fine particle of Mn and Cu or an oxide thereof. To.

In the present invention, the photosensitive conductive paste may contain at least one of Ag, Au, Pd, Pt, Ni, and Al in addition to the conductive metal fine particles.

  According to the present invention, the following effects can be obtained.

  First, it is possible to improve the unevenness of the edge of the electrode after development (jaggedness in the contour of the electrode) caused by irregular reflection of the exposure light irradiated in the exposure step.

  Secondly, the sintering phenomenon of the conductive metal fine particles can be suppressed, and the shrinkage of the line width due to the shrinkage after firing can be suppressed.

  Third, the film density of the electrode can be made uniform, and pinholes and disconnections can be suppressed.

  Due to such an effect, it is possible to increase the definition of data electrodes in the plasma display panel.

Hereinafter, a method for manufacturing a plasma display panel according to an embodiment of the present invention will be described.

The photosensitive conductive paste according to the embodiment of the present invention includes conductive metal fine particles and a photosensitive organic component.

  As the conductive metal fine particles, one or more of Ru, Cr, Fe, Co, Mn, and Cu can be selected. These conductive metal fine particles function as black pigments.

In the photosensitive conductive paste according to this embodiment, the weight ratio of the conductive metal fine particles is 0.1 wt% to 1.0 wt%, preferably 0.1 wt% to 0.5 wt%. Yes.

  Moreover, the photosensitive electrically conductive paste which concerns on this embodiment contains Ag other than said metal as electroconductive metal microparticles. The Ag particles have a particle size in the range of 0.1 to 10 μm, and the average particle size is 1 to 5 μm.

  Note that the photosensitive conductive paste according to the present embodiment may be configured to contain one or more of Au, Pd, Pt, Ni, and Al instead of or together with Ag. it can.

  In the photosensitive conductive paste according to the present embodiment, the lower limit of the content of the conductive metal fine particles as the black pigment is 0.1% by weight.

  According to the inventor's experiment, the photosensitive conductive paste contains even a small amount of the above-mentioned conductive metal fine particles as a black pigment, thereby improving the deterioration of the linearity of the data electrode line according to its content. In addition, the sintering phenomenon of the conductive metal fine particles could be suppressed.

  As described above, the content of the conductive metal fine particles as the black pigment should be non-zero. Therefore, if the content of the conductive metal fine particles is 0.1% by weight or more, the above-mentioned content is sufficient. Such effects can be realized.

  Moreover, in the photosensitive electrically conductive paste which concerns on this embodiment, the upper limit of content of said electroconductive metal microparticles | fine-particles as a black pigment is 1.0 weight%, Especially preferably, it is 0.5 weight%.

  FIGS. 1 to 3 are graphs showing the sheet resistance value (FIG. 1), the line width firing shrinkage rate (FIG. 2), and the line width variation (FIG. 3) of the photosensitive conductive paste, respectively. 1. Content of conductive metal fine particles is 0% by weight, 0.001% by weight, 0.003% by weight, 0.005% by weight, 0.1% by weight, 0.5% by weight, 1.0% by weight; This is based on the measurement results at a total of 8 sample points at 0% by weight. However, among these sample points, the sample points of the measurement results of 0.001% by weight, 0.003% by weight, and 0.005% by weight overlap and are omitted in the graph.

  The sheet resistance value here is a resistance value per unit area when the film thickness is 5 μm, and the unit is mΩ / □. The line width firing shrinkage refers to the rate at which the line width of the electrode shrinks due to firing (FIG. 8E; later described) after development (FIG. 8D; described later), and the unit is%. The line width variation refers to the ratio of the line width variation in the PDP substrate to the average value of the electrode line width after firing, and the unit is%.

  As shown in FIG. 1, the content of the conductive metal fine particles as the black pigment is 0% by weight, 0.001% by weight, 0.003% by weight, 0.005% by weight, 0.1% by weight, 0%. The sheet resistance values of the photosensitive conductive pastes at 5.7 wt%, 1.0 wt%, and 2.0 wt% are 5.7, 5.7, 5.8, 5.9, 6.0, and 6 respectively. .4, 8.3, 18.0.

  In general, the sheet resistance value of data electrodes and other electrodes in a plasma display panel is desirably 10 or less. Therefore, if the content of the conductive metal fine particles as a black pigment is 1.0% by weight or less, a sufficiently low sheet resistance value can be obtained. Furthermore, the conductive metal fine particles as a black pigment can be obtained. If the content of is less than 0.5% by weight, a lower sheet resistance value can be obtained.

  As shown in FIG. 2, the content of the conductive metal fine particles as the black pigment is 0% by weight, 0.001% by weight, 0.003% by weight, 0.005% by weight, 0.1% by weight, 0%. The line width firing shrinkage ratios of the photosensitive conductive paste at 10.5 wt%, 1.0 wt%, and 2.0 wt% were 16.3, 15.7, 15.5, 14.3, and 12.9, respectively. , 9.8, 8.5, 8.6.

  In general, the lower the line width firing shrinkage rate, the better. Practically, the line width firing shrinkage rate is preferably 15% or less including the maximum value in variation. Therefore, even when the content of the conductive metal fine particles as the black pigment is in the range of 0.1 wt% to 1.0 wt%, a sufficiently preferable line width firing shrinkage ratio can be obtained.

  As shown in FIG. 3, the content of the conductive metal fine particles as the black pigment is 0% by weight, 0.001% by weight, 0.003% by weight, 0.005% by weight, 0.1% by weight, 0%. The line width variations of the photosensitive conductive paste at 9.5 wt%, 1.0 wt%, and 2.0 wt% are 9.2, 9.1, 8.9, 8.6, 7.5, and 6 respectively. .2, 6.0, 5.9.

  In general, the lower the line width variation, the better. However, even if the content of the conductive metal fine particles as a black pigment is in the range of 0.1 wt% to 1.0 wt%, a sufficiently preferable line width is sufficient. Variations can be obtained.

  For reference, micrographs of the structure of the electrode formed using the photosensitive conductive paste according to the present embodiment are shown in FIGS.

  FIG. 4 is a photograph taken with a laser microscope after development of the photosensitive conductive paste when the content of the conductive metal fine particles as a black pigment is 0% by weight.

  FIG. 5 is a photograph taken with a laser microscope after firing of the photosensitive conductive paste when the content of the conductive metal fine particles as the black pigment is 0% by weight.

  FIG. 6 is a photograph taken with a laser microscope after development of the photosensitive conductive paste when the content of the conductive metal fine particles as the black pigment is 1.0% by weight.

  FIG. 7 is a photograph taken with a laser microscope after firing the photosensitive conductive paste when the content of the conductive metal fine particles as the black pigment is 1.0% by weight.

  FIG. 8 is a cross-sectional view showing each process of a method for forming an electrode using the photosensitive conductive paste according to the present embodiment. Hereinafter, a method for forming a data electrode using the photosensitive conductive paste according to the present embodiment (a method for forming an electrode for a plasma display panel) will be described with reference to FIG.

  First, as shown in FIG. 8A, a glass substrate 11 is prepared.

  Next, as shown in FIG. 8B, the photosensitive conductive paste 17 according to this embodiment is applied on the surface of the glass substrate 11.

  Next, as shown in FIG. 8C, a glass mask 18 having a predetermined pattern is disposed on the photosensitive conductive paste 17, and then the photosensitive conductive paste 17 is irradiated with light through the glass mask 18.

  Next, after removing the glass mask 18, as shown in FIG. 8D, the exposed photosensitive conductive paste 17 is developed.

  Thereafter, by immersing in a solution of the photosensitive conductive paste 17, only the exposed region of the photosensitive conductive paste 17 remains, and the photosensitive conductive paste 17 is not exposed as shown in FIG. 8E. Is removed. The remaining region of the photosensitive conductive paste 17 is baked.

  In this way, the data electrode 12 according to the pattern of the glass mask 18 is formed.

  By forming the data electrode 12 using the photosensitive conductive paste according to the present embodiment, the data electrode 12 having a thickness T of 10 μm or less can be formed. Although the data electrode 122 in the conventional color plasma display panel 100 shown in FIG. 12 has a thickness of 10 μm or more, data having a reduced thickness T by using the photosensitive conductive paste according to the present embodiment. The electrode 12 can be formed.

  According to the photosensitive conductive paste according to the present embodiment, the following effects can be obtained.

  First, it is possible to improve unevenness of the edge of the electrode (data electrode 12) after development (jagged edges of the electrode) caused by irregular reflection of the exposure light irradiated in the exposure step.

  In order to detect a thin break in the electrode, it is necessary to increase the sensitivity of the inspection, but conversely, if the sensitivity of the inspection is increased, there is a high possibility that the jaggedness in the outline of the electrode is mistaken as a break.

  For example, in the photomicrograph (FIG. 5) after baking of the photosensitive conductive paste when the content of conductive metal fine particles as a black pigment is 0% by weight, a large number of large holes (diameter: 10 to 30 μm) are present. You can see that On the other hand, the micrograph (FIG. 7) after firing of the photosensitive conductive paste when the content of the conductive metal fine particles as the black pigment is 0.5% by weight or 1.0% by weight There are almost no large holes. In addition, the jaggedness of the electrode contour is improved. For this reason, even if the sensitivity of the inspection is increased, the risk of misidentifying the jaggedness in the outline of the electrode as a disconnection is extremely reduced.

  As described above, by forming the electrode using the photosensitive conductive paste according to the present embodiment, it is possible to improve the jaggedness in the outline of the electrode, and to increase the inspection sensitivity or the resolution.

  Secondly, the sintering phenomenon of the conductive metal fine particles can be suppressed, and the shrinkage of the line width due to the shrinkage after firing can be suppressed.

  As shown in FIG. 2, when the photosensitive conductive paste containing no conductive metal fine particles as a black pigment is baked, the firing shrinkage ratio is 15.5%, but the content of the conductive metal fine particles is In the case of 0.5 wt% or 1.0 wt%, the firing shrinkage is 9.8% and 8.5%, respectively, and the firing shrinkage can be reduced.

  Third, the film density of the electrode can be made uniform, and pinholes and disconnections can be suppressed. As a result, in the image inspection performed by irradiating light from the back, it is possible to prevent erroneous detection of pinholes and disconnections that are not at the defect level as those at the defect level.

  As shown in FIG. 1, when the conductive metal fine particles as the black pigment are contained in the photosensitive conductive paste in an amount of 0.5% by weight or 1.0% by weight, the sheet resistance value slightly increases. Since the electrode 12 does not flow as much current as the surface discharge electrode (bus electrode) 112 in the first substrate 110, there is no great problem for the operation of the plasma display panel.

  In the conventional color plasma display panel 100 shown in FIG. 11, the line width of the data electrode 122 is about 60 μm. In this conventional color plasma display panel 100, thermal expansion with a line width of about 10 to 20 μm occurred when the data electrode 122 was fired. Therefore, the pitch between adjacent data electrodes is set to about twice the line width, that is, about 120 μm.

  On the other hand, by using the photosensitive conductive paste according to the present embodiment, it becomes possible to form a data electrode having a line width of about 40 μm, and thermal expansion of the line width when the data electrode 122 is baked. Therefore, the pitch between adjacent data electrodes can be set to about twice the line width, that is, about 80 μm.

  FIG. 9 is a perspective view showing the plasma display panel according to the present embodiment. Hereinafter, the plasma display panel according to the present embodiment will be described with reference to FIG.

  In the present embodiment, an AC surface discharge type color plasma display panel will be described as a preferred example of the plasma display panel according to the present invention.

  The plasma display panel 50 according to the present embodiment has the same configuration as the plasma display panel 100 except that the data electrode 12 is different from the data electrode 122 in the conventional plasma display panel 100. Therefore, in FIG. 9, among the constituent elements of the plasma display panel 50, the same reference numerals are given to the same constituent elements as those of the conventional plasma display panel 100, and the description thereof is omitted.

  That is, in the plasma display panel 50 shown in FIG. 9, the data electrode 12 passes through each process shown in FIG. 8, and glass as a second glass substrate (corresponding to the second glass substrate 121 in the conventional plasma display panel 100). It is formed on the substrate 11.

  Next, a manufacturing method of the plasma display panel 50 (FIG. 9) will be described.

  First, the first substrate 110 on the display side is configured.

  That is, on the first glass substrate 111, a plurality of line-shaped surface discharge electrodes 112 formed in parallel to each other, and a transparent glaze layer 113 formed so as to cover the first glass substrate 111 and the surface discharge electrodes 112, And a black matrix 114 formed on the transparent glaze layer 113.

  Of these, the surface discharge electrode 112 is made of a transparent conductive film in which metal bus electrodes are laminated.

  Further, a magnesium oxide film is attached to the surface of the transparent glaze layer 113.

  The black matrix 114 is formed in a lattice shape, and each lattice defines one pixel.

  On the other hand, the 2nd board | substrate 120 arrange | positioned facing the 1st board | substrate 110 is comprised.

That is, a plurality of data electrodes 12 formed on the second glass substrate (glass substrate 11) and spaced apart from each other in a direction intersecting the surface discharge electrode 112 of the first substrate 110, and the second glass substrate 11 And the glaze layer 123 formed so as to cover the data electrode 122, the plurality of striped white barrier ribs 124 formed between the data electrodes 122 on the glaze layer 123, and the glaze between the barrier ribs 124 adjacent to each other. An inorganic material layer 125 made of white fine particles formed so as to cover the side surfaces of the layer 123 and the partition wall 124 and a phosphor layer 126 formed so as to cover the inorganic material layer 125 are formed.

  Here, the method of forming the data electrode 12 is as described above with reference to FIG.

  The phosphor layer 126 is formed on the side surfaces of the barrier ribs 124 forming the discharge cells and on the surface of the glaze layer 123, and red, green, and blue phosphors are separately applied in this order.

  Next, the first substrate 110 and the second substrate 120 are aligned with each other and welded to each other.

  Next, after the discharge gas space formed in the space between the first substrate 110 and the second substrate 120 is evacuated to a vacuum, the discharge gas is sealed in the discharge gas space.

  Thus, the plasma display panel 50 in which the discharge gas is sealed in the discharge gas space can be obtained.

  Since the plasma display panel 50 includes the data electrode 12 formed by the method for forming an electrode for a plasma display panel according to the present embodiment, the data electrode 12 can be made high definition, and resolution can be easily achieved. Can be expensive.

  Next, the configuration of the plasma display device 60 including the plasma display panel 50 obtained as described above will be described with reference to the block diagram of FIG.

  As shown in FIG. 10, the plasma display device 60 is designed to have a module structure. Specifically, the analog interface 20 and the plasma display panel module 30 (as will be described later, a plasma display panel 50, And a digital signal processing / control circuit 31 as a driving circuit for driving the plasma display panel 50).

  The analog interface 20 includes a Y / C separation circuit 21 having a chroma decoder, an A / D conversion circuit 22, a synchronization signal control circuit 23 having a PLL circuit, an image format conversion circuit 24, and an inverse γ (gamma) conversion. The circuit 25 is composed of a system control circuit 26 and a PLE control circuit 27.

  Schematically, the analog interface 20 converts the received analog video signal into a digital video signal, and then supplies the digital video signal to the plasma display panel module 30.

  For example, an analog video signal transmitted from a TV tuner is decomposed into RGB luminance signals in the Y / C separation circuit 21 and then converted into digital signals in the A / D conversion circuit 22.

  Thereafter, when the pixel configuration of the plasma display panel module 30 is different from the pixel configuration of the video signal, the image format conversion circuit 24 performs necessary image format conversion.

  The display luminance characteristic with respect to the input signal of the plasma display panel is linearly proportional, but a normal video signal is corrected (γ-converted) in advance in accordance with the CRT characteristic. For this reason, after the A / D conversion of the video signal is performed in the A / D conversion circuit 22, the inverse γ conversion circuit 25 performs the inverse γ conversion on the video signal, and the digital video signal restored to the linear characteristic is obtained. Generate. This digital video signal is output to the plasma display panel module 30 as an RGB video signal.

  Since the analog video signal does not include the sampling clock and data clock signal for A / D conversion, the PLL circuit built in the synchronization signal control circuit 23 is supplied with the horizontal synchronization signal simultaneously with the analog video signal. Is used as a reference to generate a sampling clock and a data clock signal and output them to the plasma display panel module 30.

  The PLE control circuit 27 of the analog interface 20 performs luminance control. Specifically, the display luminance is increased when the average luminance level is a predetermined value or less, and the display luminance is decreased when the average luminance level exceeds a predetermined value.

  The system control circuit 26 outputs various control signals to the plasma display panel module 30.

  The plasma display panel module 30 further includes a digital signal processing / control circuit 31, a panel unit 32, and an in-module power supply circuit 33 incorporating a DC / DC converter.

  The digital signal processing / control circuit 31 includes an input interface signal processing circuit 34, a frame memory 35, a memory control circuit 36, and a driver control circuit 37.

  The input interface signal processing circuit 34 includes various control signals transmitted from the system control circuit 26, RGB video signals transmitted from the inverse γ conversion circuit 25, synchronization signals transmitted from the synchronization signal control circuit 23, and transmission from the PLL circuit. Receive a data clock signal.

  For example, the average luminance level of the video signal input to the input interface signal processing circuit 34 is calculated by an input signal average luminance level calculation circuit (not shown) in the input interface signal processing circuit 34 and output as, for example, 5-bit data. The Further, the PLE control circuit 27 sets PLE control data according to the average luminance level, and inputs it to a luminance level control circuit (not shown) in the input interface signal processing circuit 34.

  The digital signal processing / control circuit 31 transmits these control signals to the panel unit 32 after processing these various signals in the input interface signal processing circuit 34. At the same time, the memory control circuit 36 and the driver control circuit 37 transmit a memory control signal and a driver control signal to the panel unit 32.

  The panel unit 32 includes a pulse voltage applied to the plasma display panel 50 manufactured by the above manufacturing method, the scan driver 38 that drives the scan electrodes, the data driver 39 that drives the data electrodes, and the plasma display panel 50 and the scan driver 38. And a power recovery circuit 41 for recovering surplus power from the high-voltage pulse circuit 40.

  The plasma display panel 50 is configured to have, for example, pixels arranged in 1365 × 768. In the plasma display panel 50, the scanning driver 38 controls the scanning electrodes, and the data driver 39 controls the data electrodes, so that lighting or non-lighting of predetermined pixels among these pixels is controlled, and a desired display is performed. Is done.

  The logic power supply supplies logic power to the digital signal processing / control circuit 31 and the panel unit 32. Further, the in-module power supply circuit 33 is supplied with DC power from the display power supply, converts the voltage of the DC power into a predetermined voltage, and then supplies the voltage to the panel unit 32.

  Next, a method for manufacturing the plasma display device 60 will be described.

  First, the plasma display panel 50, the scan driver 38, the data driver 39, the high voltage pulse circuit 40, and the power recovery circuit 41 are arranged on one substrate to form the panel unit 32.

  Further, a digital signal processing / control circuit (drive circuit) 31 is formed separately from the panel section 32.

  The panel unit 32, the digital signal processing / control circuit 31 and the in-module power supply circuit 33 thus formed are assembled as one module to form the plasma display panel module 30.

  Further, the analog interface 20 is formed separately from the plasma display panel module 30.

  As described above, after the plasma display panel module 30 and the analog interface 20 are separately formed and then electrically connected to each other, the plasma display device 60 shown in FIG. 10 can be obtained.

  As described above, according to the present embodiment, it is possible to improve the unevenness of the edge of the electrode after development (jaggedness in the contour of the electrode) caused by irregular reflection of the exposure light irradiated in the exposure step.

  In addition, the sintering phenomenon of the conductive metal fine particles can be suppressed, and the shrinkage of the line width due to the shrinkage after firing can be suppressed.

  Furthermore, the film density of the electrode (data electrode 12) can be made uniform, and pinholes and disconnections can be suppressed.

  Due to such an effect, the data electrode 12 in the plasma display panel 50 can be made high definition.

It is a graph which shows the sheet resistance value of the photosensitive electrically conductive paste when content of the electroconductive metal fine particle as a black pigment is 0 to 2.0 weight%. It is a graph which shows the line | wire width baking shrinkage | contraction rate of the photosensitive electrically conductive paste when content of the electroconductive metal microparticles | fine-particles as a black pigment is 0 to 2.0 weight%. It is a graph which shows the line | wire width variation of the photosensitive electrically conductive paste when content of the electroconductive metal microparticles | fine-particles as a black pigment is 0 to 2.0 weight%. It is the photograph by the laser microscope after image development of the photosensitive electrically conductive paste in case content of the electroconductive metal microparticles | fine-particles as a black pigment is 0 weight%. It is the photograph by the laser microscope after baking of the photosensitive electrically conductive paste in case content of the electroconductive metal microparticles | fine-particles as a black pigment is 0 weight%. It is the photograph by the laser microscope after image development of the photosensitive electrically conductive paste in case content of the electroconductive metal microparticles | fine-particles as a black pigment is 1.0 weight%. It is the photograph by the laser microscope after baking of the photosensitive electrically conductive paste in case content of the electroconductive metal microparticles | fine-particles as a black pigment is 1.0 weight%. It is sectional drawing which shows each process of the method of forming an electrode using the photosensitive electrically conductive paste which concerns on one Embodiment of this invention. 1 is a perspective view showing a plasma display panel according to an embodiment of the present invention. It is a block diagram which shows the plasma display apparatus which concerns on one Embodiment of this invention. It is a perspective view which shows the conventional plasma display panel. FIG. 12 is a cross-sectional view of a second substrate showing respective steps in a method for forming data electrodes in the conventional color plasma display panel shown in FIG. 11.

Explanation of symbols

11 glass substrate 12 data electrode 17 photosensitive conductive paste 18 glass mask 50 plasma display panel 31 digital signal processing / control circuit (drive circuit)
60 Plasma display device

Claims (2)

A display-side first substrate on which a plurality of surface discharge electrodes are formed so as to be parallel to each other on the first glass substrate, the first substrate being disposed opposite to the first substrate, and the surface on the second glass substrate A method for manufacturing a plasma display panel having a second substrate on which a plurality of data electrodes are formed in a direction crossing a discharge electrode, and applying and baking a photosensitive conductive paste made of conductive metal fine particles and a photosensitive organic component The photosensitive conductive paste comprises at least one kind of metal fine particles of Ru, Cr, Fe, Co, Mn, and Cu as the conductive metal fine particles as a black pigment. Or a method for producing a plasma display panel, comprising 0.1 wt% to 1.0 wt% of the oxide. 2. The method of manufacturing a plasma display panel according to claim 1, wherein the conductive metal fine particles contain at least one of Ag, Au, Pd, Pt, Ni, and Al.